CN109997153A - 产品的制造方法、外装部件以及天线图案选择装置 - Google Patents

产品的制造方法、外装部件以及天线图案选择装置 Download PDF

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Publication number
CN109997153A
CN109997153A CN201780071288.3A CN201780071288A CN109997153A CN 109997153 A CN109997153 A CN 109997153A CN 201780071288 A CN201780071288 A CN 201780071288A CN 109997153 A CN109997153 A CN 109997153A
Authority
CN
China
Prior art keywords
antenna
resin
chip
face
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780071288.3A
Other languages
English (en)
Chinese (zh)
Inventor
川井若浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Publication of CN109997153A publication Critical patent/CN109997153A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
CN201780071288.3A 2017-02-22 2017-11-16 产品的制造方法、外装部件以及天线图案选择装置 Pending CN109997153A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017030838A JP6658607B2 (ja) 2017-02-22 2017-02-22 製品の製造方法、外装部品およびアンテナパターン選択装置
JP2017-030838 2017-02-22
PCT/JP2017/041271 WO2018154880A1 (ja) 2017-02-22 2017-11-16 製品の製造方法、外装部品およびアンテナパターン選択装置

Publications (1)

Publication Number Publication Date
CN109997153A true CN109997153A (zh) 2019-07-09

Family

ID=63254193

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780071288.3A Pending CN109997153A (zh) 2017-02-22 2017-11-16 产品的制造方法、外装部件以及天线图案选择装置

Country Status (6)

Country Link
US (1) US11322828B2 (enExample)
EP (1) EP3588384B1 (enExample)
JP (1) JP6658607B2 (enExample)
CN (1) CN109997153A (enExample)
TW (1) TW201832413A (enExample)
WO (1) WO2018154880A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023139864A1 (ja) * 2022-01-24 2023-07-27 サトーホールディングス株式会社 成形体及び成形体の製造方法
US12400100B2 (en) * 2022-11-17 2025-08-26 Hid Global Corp. On-metal RFID tag

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002298116A (ja) * 2001-03-30 2002-10-11 Mitsubishi Materials Corp Ｒｆｉｄ用タグ
EP1369816A1 (en) * 2002-06-07 2003-12-10 Sony Corporation Tuning capacitors for IC module in wireless IC card
JP2006039902A (ja) * 2004-07-27 2006-02-09 Ntn Corp Ｕｈｆ帯無線ｉｃタグ
JP2006074266A (ja) * 2004-08-31 2006-03-16 Fujitsu Ltd Ｒｆｉｄタグ、ｒｆｉｄタグ用アンテナ、ｒｆｉｄタグ用アンテナシートおよびｒｆｉｄタグの製造方法
CN101460962A (zh) * 2006-06-02 2009-06-17 株式会社日立制作所 Ic标签用插件的制造方法
US20090217515A1 (en) * 2004-12-03 2009-09-03 Hallys Corporation Electronic component production method and electronic component production equipment
CN101587845A (zh) * 2008-05-21 2009-11-25 资茂科技股份有限公司 电子卷标的封装方法、封装结构及无尘室人员的管控方法
US20140138446A1 (en) * 2012-11-20 2014-05-22 Xerox Corporation Apparatuses and methods for printed radio frequency identification (rfid) tags
US20160189024A1 (en) * 2014-12-29 2016-06-30 Infineon Technologies Ag Chip card

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3661482B2 (ja) 1999-04-06 2005-06-15 ソニーケミカル株式会社 半導体装置
JP3916405B2 (ja) 2001-03-06 2007-05-16 松下電器産業株式会社 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品
JP2005301443A (ja) 2004-04-07 2005-10-27 Bridgestone Corp Ｒｆｉｄタグ及びｒｆｉｄタグの回路定数調整方法
JP4075919B2 (ja) 2005-09-29 2008-04-16 オムロン株式会社 アンテナユニットおよび非接触ｉｃタグ
JP2008210344A (ja) 2007-02-28 2008-09-11 Omron Corp Ｉｃタグ及びその製造方法
WO2013070747A1 (en) * 2011-11-07 2013-05-16 Tego Inc. Rfid drive management facility
US11239179B2 (en) * 2018-11-28 2022-02-01 Shiann-Tsong Tsai Semiconductor package and fabrication method thereof

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002298116A (ja) * 2001-03-30 2002-10-11 Mitsubishi Materials Corp Ｒｆｉｄ用タグ
EP1369816A1 (en) * 2002-06-07 2003-12-10 Sony Corporation Tuning capacitors for IC module in wireless IC card
JP2006039902A (ja) * 2004-07-27 2006-02-09 Ntn Corp Ｕｈｆ帯無線ｉｃタグ
JP2006074266A (ja) * 2004-08-31 2006-03-16 Fujitsu Ltd Ｒｆｉｄタグ、ｒｆｉｄタグ用アンテナ、ｒｆｉｄタグ用アンテナシートおよびｒｆｉｄタグの製造方法
US20090217515A1 (en) * 2004-12-03 2009-09-03 Hallys Corporation Electronic component production method and electronic component production equipment
CN101460962A (zh) * 2006-06-02 2009-06-17 株式会社日立制作所 Ic标签用插件的制造方法
CN101587845A (zh) * 2008-05-21 2009-11-25 资茂科技股份有限公司 电子卷标的封装方法、封装结构及无尘室人员的管控方法
US20140138446A1 (en) * 2012-11-20 2014-05-22 Xerox Corporation Apparatuses and methods for printed radio frequency identification (rfid) tags
US20160189024A1 (en) * 2014-12-29 2016-06-30 Infineon Technologies Ag Chip card

Also Published As

Publication number Publication date
US11322828B2 (en) 2022-05-03
EP3588384A1 (en) 2020-01-01
EP3588384A4 (en) 2020-08-12
TW201832413A (zh) 2018-09-01
US20190386390A1 (en) 2019-12-19
JP6658607B2 (ja) 2020-03-04
JP2018136746A (ja) 2018-08-30
EP3588384B1 (en) 2021-12-29
WO2018154880A1 (ja) 2018-08-30

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