TW201829955A - Lighting appliance characterized in that the circuit substrate surrounds the periphery of the installation portion of the appliance and the light source substrate surrounds the periphery of the circuit substrate, thereby capable of thinning the light appliance - Google Patents

Abstract

The lighting appliance (100) includes the appliance main body (106), the lighting module (10) disposed at the appliance main body (106). The lighting module (10) has the substrate (11), more than one circuit component (80) disposed at the main surface (11a) of the substrate (11), and a plurality of lighting elements (20) disposed at the main surface (11a) of the substrate (11) and surrounding said more than one circuit component (80) in a manner of annular arrangement. The appliance main body (106) has the installation surface portion (132) of forming a surface. Wherein, the surface contacts with the opposite sides of the main surface(11a) of the substarye (11), i.e., the fourth region (13d) of the back sides of the lighting elements (20) of the back surface (11b) and the third region (13c) of the back side of the more than one circuit component(80).

Description

Lighting appliances

The present invention relates to a lighting device including a light-emitting module having a plurality of light-emitting elements and one or more circuit components arranged on a substrate.

Conventionally, there is known a ceiling light, that is, a lighting fixture arranged on a ceiling. For example, the conventional ceiling lamp described in Patent Document 1 includes an appliance body, an appliance installation portion for installing the appliance body on a building material, a light source substrate and a circuit board supported by the appliance body. A plurality of light emitting diodes (LEDs) are mounted on the light source substrate. A lighting circuit configured to illuminate each of the plurality of LEDs is mounted on the circuit board.

The circuit board is arranged on the appliance body in a ring shape so as to surround the periphery of the appliance mounting portion. The light source substrate is arranged in a ring manner on the appliance body so as to surround the periphery of the circuit substrate. [Prior technical literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-146666

[Problems to be Solved by the Invention] When assembling the above-mentioned conventional ceiling lamp, first, after the positioning operation of positioning the light source substrate and the circuit substrate on the appliance body, respectively, the wiring operation of connecting the light source substrate and the circuit substrate with leads is required. Therefore, it is not easy to improve the assembling efficiency of a ceiling lamp, for example.

Therefore, it is also considered to realize the light source substrate and the circuit substrate with one substrate. At this time, because there are elements such as circuit parts, lead wires of circuit parts, or solder on the back surface of the substrate, such accommodation space is required. The existence of this storage space may be the main reason for increasing the thickness of the lighting fixture.

The present invention has been made in consideration of the above-mentioned conventional problems, and an object thereof is to provide a luminaire including a light-emitting module including a plurality of light-emitting elements and one or more circuit components arranged on a substrate, and capable of being thinned. [Means for solving problems]

One aspect of the present invention includes an appliance body and a light emitting module mounted on the appliance body; the light emitting module has a substrate, one or more circuit parts arranged on a main surface of the substrate, and The main surface is arranged in a ring manner to surround a plurality of light-emitting elements of the one or more circuit parts; the appliance body has a mounting surface forming a surface, and the surface contacts the opposite side of the main surface of the substrate, that is, the back surface The plurality of light-emitting element areas on the back side and the one or more circuit components on the back side. [Effect of the invention]

According to the present invention, it is possible to provide a lighting device including a light-emitting module including a plurality of light-emitting elements and circuit components arranged on a substrate, and the thickness can be reduced.

[Forms for Implementing the Invention] Hereinafter, embodiments and modifications will be described with reference to the drawings. It should be noted that the embodiments and modifications described below are each a specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements shown in the following embodiments and modifications are examples, and do not limit the gist of the present invention. Therefore, regarding the constituent elements of the following embodiments and modifications, which are not described in the independent request item showing the highest concept of the present invention, arbitrary constituent elements will be described.

In addition, each figure is a schematic diagram, and a figure is not necessarily shown strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially the same structure, and the repeated description may be abbreviate | omitted.

(Embodiment) Hereinafter, a lighting fixture 100 according to an embodiment will be described.

[Overall Structure of Lighting Apparatus] First, referring to FIGS. 1 and 2, the overall structure of a lighting apparatus 100 according to an embodiment will be described. FIG. 1 is an exploded perspective view of a lighting fixture 100 according to the embodiment. FIG. 2 is a plan view showing an outline of the structure of the light emitting module 10 according to the embodiment.

As shown in FIG. 1, the luminaire 100 according to this embodiment is a ceiling lamp installed on, for example, the ceiling 4. In addition, the upper direction (positive direction of the Z axis) in FIG. 1 corresponds to the direction of the floor surface (not shown) facing the ceiling 4. That is, the lighting fixture 100 shown in FIG. 1 is displayed in a posture opposite to the vertical position in normal use.

The lighting fixture 100 according to this embodiment includes a fixture body 106 and a light emitting module 10 mounted on the fixture body 106. The light emitting module 10 includes a substrate 11, a plurality of light emitting elements 20 arranged on a main surface 11 a of the substrate 11, and one or more circuit components 80. In this embodiment, a plurality of circuit parts 80 are arranged on the main surface 11 a of the substrate 11, and the power circuit 90 is constituted by the plurality of circuit parts 80. In this embodiment, the lighting fixture 100 further includes a circuit cover 150, a light source cover 160, a lighting cover 140, and a fixture mounting portion 8.

[Apparatus body] As shown in FIG. 1, the instrument body 106 is formed in a disc shape, and is a member made of sheet metal such as an aluminum plate or a steel plate. For example, a surface on the side where the light emitting module 10 or the like is arranged on the apparatus body 106 is coated with a white paint having a high light reflectance or a reflective metal material is vapor-deposited.

As shown in FIG. 1, a circular opening portion is formed in the central portion of the instrument body 106, and a substantially cylindrical support portion 126 is formed to extend from the peripheral edge of the opening portion to the light emitting module 10 side. The support portion 126 is a member formed of, for example, a resin, and has a structure capable of being fitted into the appliance mounting portion 8.

An attachment surface portion 132 is formed around the support portion 126 in the appliance body 106, and a peripheral portion 131 is formed around the attachment surface portion 132. The light-emitting module 10 is fixed to the appliance body 106 with screws (not shown) in a state where the flat rear surface 11b of the substrate 11 is in surface contact with the flat mounting surface 132. The structural relationship between the light emitting module 10 and the appliance body 106 will be described later with reference to FIGS. 3 and 4.

[Apparatus installation part] The appliance installation part 8 is installed in the support part 126 by being inserted into the support part 126 of the appliance body 106. The appliance mounting portion 8 is detachably mounted on a ceiling-side mounting member 9 provided on the ceiling 4. In this manner, the appliance main body 106 is detachably attached to the ceiling 4 by attaching and detaching the appliance installation portion 8 to the ceiling-side attaching member 9. In addition, a buffer member (not shown) for suppressing the shaking of the appliance body 106 is disposed between the appliance body 106 and the ceiling 4.

[Light-Emitting Module] As shown in FIGS. 1 and 2, the light-emitting module 10 includes a substrate 11, a plurality of light-emitting elements 20 disposed on the substrate 11, and one or more (a plural number in this embodiment) Circuit parts 80.

The outer shape of the substrate 11 in a plan view (when the substrate 11 is viewed from the thickness direction of the substrate 11) is a rectangular shape with corners cut off, and a circular opening 12 is formed in a central portion. That is, the substrate 11 has a ring shape. The substrate 11 is a printed substrate provided with a conductor pattern (metal wiring) only on the main surface 11a of the base material. Such a substrate 11 may be a glass composite substrate such as a CEM3 (Composite epoxy material-3) substrate, a resin substrate, a ceramic substrate, or a phenolic paper substrate.

Each of the plurality of light emitting elements 20 in this embodiment is, for example, an LED element in which an LED chip is packaged. That is, the mounting structure of the light emitting module 10 is an SMD (Surface Mount Device) structure in which LED elements packaged with LED chips are mounted on a substrate 11. In addition, the plurality of light emitting elements 20 included in the light emitting module 10 may include, for example, a plurality of light emitting elements 20 having different color temperatures.

For example, the plurality of light-emitting elements 20 included in the light-emitting module 10 may also be configured as a group of light-emitting elements 20 having a high color temperature (the first group) and a group of light-emitting elements 20 having a low color temperature (the second group). At this time, by adjusting the brightness of the light emitting elements 20 in the first group and the light emitting elements 20 in the second group, that is, dimming control, the color of the light emitted by the light emitting module 10 can also be adjusted, that is, dimming.色 控制。 Color control.

In this embodiment, as shown in FIG. 2, a plurality of light emitting elements 20 are arranged in a region outside the first region 13 a of the main surface 11 a of the substrate 11, that is, the second region 13 b. These plural light emitting elements 20 are connected to a conductor pattern (metal wiring) provided on the main surface 11a by solder. That is, the plurality of light emitting elements 20 are mounted on the second region 13 b of the main surface 11 a of the substrate 11 by a surface mount technology.

As shown in FIG. 2, the plurality of light emitting elements 20 are arranged in a ring shape so as to surround the first region 13 a of the substrate 11. In addition, the electrical connection state of the plurality of light emitting elements 20 is not particularly limited. For example, a group (light-emitting element group) of a plurality of n (n is an integer of 2 or more) light-emitting elements 20 connected in series may be formed, and the plurality of light-emitting element groups may be connected in parallel. In addition, all the light-emitting elements 20 arranged on the substrate 11 may be connected in series. Furthermore, in this embodiment, the light emitting section 25 of the light emitting module 10 is constituted by a plurality of light emitting elements 20. That is, the light emitting section 25 is arranged in the second region 13 b of the main surface 11 a of the substrate 11.

The area of the central portion (the peripheral portion of the opening portion 12) of the substrate 11 in plan view, that is, the first area 13 a is an area where one or more circuit components 80 are arranged. The one or more circuit components 80 are components constituting at least a part of the circuit used for the operation (lighting, extinction, change of dimming rate, etc.) of the light emitting section 25. In the present embodiment, a plurality of circuit parts 80 are arranged in the first area 13a, and the plurality of circuit parts 80 constitute a power supply circuit 90 for supplying light-emitting power to the light-emitting section 25.

The power supply circuit 90 converts AC power supplied through, for example, a cable (not shown) extended from the appliance body 106 into DC power suitable for the light emission of the light emitting section 25 and supplies the power to the light emitting section 25. Thereby, the light emitting section 25 can emit light.

The plurality of circuit parts 80 constituting the power supply circuit 90 are, for example, capacitive elements such as electrolytic capacitors or ceramic capacitors, resistance elements, coil elements, anti-current coils (anti-current transformers), noise filters, and diode or integrated circuit elements. And other semiconductor components.

In this embodiment, only one of the two surfaces in the thickness direction of the substrate 11 (the main surface 11 a in FIGS. 1 and 2) is provided with a patterned metal wiring (not shown). In this embodiment, the plurality of circuit components 80 are, for example, surface-mount wafer-type components, and are soldered to a metal wiring (not shown) provided on the main surface 11 a of the substrate 11. That is, the power supply circuit 90 does not include a lead-insertion-type lead part (radial lead part or axial lead part). Therefore, the power supply circuit 90 is disposed on the main surface 11 a of the substrate 11 without causing the convex portion formed by the leading end of the lead and the solder to be formed on the rear surface 11 b of the substrate 11.

In addition, the lead component may be mounted on the main surface 11 a of the substrate 11 by molding a lead component of a lead component such as an electrolytic capacitor or a connector. At this time, by bonding the main body of the lead part to the main surface 11a, the lead part can be more stably fixed to the main surface 11a. That is, one or more circuit parts 80 among the plurality of circuit parts 80 in this embodiment may be lead parts.

The plurality of light-emitting elements 20 are surface-mounted LED elements as described above. Therefore, after the plurality of light emitting elements 20 and the circuit components 80 are mounted on the substrate 11, the back surface 11b of the substrate 11 is still in a flat state without unevenness.

The light emitting module 10 having such a structure can be manufactured using, for example, a soldering method called a reflow method.

Specifically, a plurality of mounting positions (the positions where the light-emitting element 20 and the circuit component 80 should be disposed) are applied to a plurality of mounting positions of the main surface 11a of the substrate 11, and a plurality of light-emitting elements are applied. The element 20 and the plurality of circuit parts 80 are arranged in contact with each solder. Thereafter, each light-emitting element 20 and each circuit component 80 are connected to a metal wiring provided on the main surface 11 a through a process (heating process) or the like in which heat is applied. In this way, the plurality of light emitting elements 20 and the plurality of circuit parts 80 are soldered to the substrate 11 by reflow soldering.

In addition, the boundary between the first region 13a and the second region 13b shown by the chain lines in FIG. 2 need not be visually displayed on the substrate 11, and the shape need not be a shape that follows the outer shape of the substrate 11. For example, an imaginary line that is externally connected to the power supply circuit 90 composed of a plurality of circuit parts 80 in plan view may define the boundary between the first region 13a and the second region 13b.

[Circuit Cover] As shown in FIG. 1, the circuit cover 150 is a member configured to cover a plurality of circuit parts 80 disposed on the substrate 11. That is, the circuit cover 150 is a member that covers the power supply circuit 90 disposed in the first region 13 a of the substrate 11. The circuit cover 150 is formed of a metal such as iron or aluminum in this embodiment, and is non-combustible.

In addition, a portion forming the outer side surface of the circuit cover 150 has a function of reflecting a surface that reflects light emitted from the light emitting portion 25.

In addition, a resin insulating sheet may be disposed on the inner surface of the circuit cover 150, for example. Thereby, the inner surface of the circuit cover 150 can be brought close to the circuit components 80 inside the circuit cover 150, and as a result, the circuit cover 150 can be miniaturized. The circuit cover 150 may not be formed of a metal, but may be formed of, for example, a flame-retardant resin. This makes it possible to reduce the size and weight of the circuit cover 150, for example.

In the present embodiment, the circuit cover 150 is mounted on the appliance body 106 together with the light source cover 160 and the light emitting module 10 by, for example, a plurality of screws (not shown).

[Light Source Cover] As shown in FIG. 1, the light source cover 160 is a member that covers a plurality of light emitting elements 20 of the light emitting module 10, and is formed of a resin or the like having translucency (for example, transparency). The light source cover 160 is formed in a ring shape, and is fixed to the main surface 11 a of the light emitting module 10 in a state of surrounding the circuit cover 150 and covering a plurality of light emitting elements 20 arranged in a ring shape.

The light source cover 160 includes a plurality of lens portions 161. The plurality of lens portions 161 are provided in one-to-one correspondence with the plurality of light emitting elements 20. The lens portion 161 can increase, for example, a light distribution angle of light from the corresponding light emitting element 20. That is, the lens portion 161 has a function of diverging light. As described above, by disposing the lens portion 161 corresponding to each of the light emitting elements 20, for example, the diffusion of light from each of the plurality of light emitting elements 20 can be precisely controlled.

The light source cover 160 may not include the lens portion 161. The light source cover 160 may be formed in a shape and a size that cover the plurality of light emitting elements 20 collectively, for example.

[Illumination cover] The illumination cover 140 is a member covering the side of the fixture body 106 on which the light emitting module 10 and the like are mounted, and is formed of a light-transmitting resin. The lighting cover 140 is formed of, for example, a milky white resin, and can diffuse the light from each light emitting element 20 and emit the light to the outside. The lighting cover 140 is detachably attached to, for example, the appliance body 106.

[Structure Relation between Light-Emitting Module and Apparatus Body] Next, the structure-relationship between the light-emitting module 10 and the apparatus body 106 in this embodiment will be described with reference to FIGS. 3 and 4.

FIG. 3 is a perspective view showing the structural relationship between the substrate 11 and the instrument body 106 according to the embodiment. In addition, in FIG. 3, in order to easily understand the structural relationship, the substrate 11 and the instrument body 106 are shown in a state where the substrate 11 is separated from the instrument body 106 and the substrate 11 is inclined so that the back surface 11 b of the substrate 11 can be seen. In addition, in FIG. 3, the inner region 132 a and the outer region 132 b of the face 132 are installed for easy identification, and the inner region 132 a and the outer region 132 b are respectively shown as regions with dots.

FIG. 4 is a cross-sectional view showing a schematic configuration of the lighting fixture 100 according to the embodiment. In addition, FIG. 4 shows a cross section of the luminaire 100 passing through the YZ plane of the IV-IV line shown in FIG. 3.

As described above, the light-emitting module 10 of this embodiment has the light-emitting element 20 and the circuit component 80 mounted on the main surface 11 a of the substrate 11 by surface mounting technology. In other words, since the circuit components and the leads of the circuit components are not arranged on the back surface 11b of the substrate 11, the back surface 11b is formed with a substantially uneven surface.

Thereby, as shown in FIG. 3 and FIG. 4, the light-emitting module 10 can be fixed to the apparatus body 106 (for example, screwing) in a state where the entire surface (or approximately the entire surface) of the back surface 11 b of the substrate 11 is in contact with the mounting surface 132. .

Specifically, as shown in FIG. 3, the back surface 11b of the substrate 11 includes a third region 13c, which is a region on the back side of the plurality of circuit components 80, and a fourth region 13d, which is a region on the back side of the plurality of light emitting elements 20. In this embodiment, a region on the back side of the first region 13a (see FIG. 2) in which a plurality of circuit components 80 (power supply circuit 90) are arranged on the main surface 11a of the substrate 11 corresponds to the third region 13c. The rear surface side of the second region 13 b (see FIG. 2) in which the plurality of light emitting elements 20 are arranged on the main surface 11 a of the substrate 11 corresponds to the fourth region 13 d.

When the thus constructed substrate 11 is mounted on the mounting surface portion 132 of the appliance body 106, the third region 13c of the back surface 11b of the substrate 11 contacts the inner region 132a of the mounting surface 132, and the fourth region 13d of the back surface 11b of the substrate 11 contacts An outer region 132b of the face portion 132 is provided.

As described above, the lighting fixture 100 according to this embodiment includes the fixture body 106 and the light emitting module 10 mounted on the fixture body 106. The light-emitting module 10 includes a substrate 11, one or more circuit components 80 arranged on the main surface 11 a of the substrate 11, and a plurality of circuit components 80 arranged in a ring shape on the main surface 11 a of the substrate 11 so as to surround the one or more circuit components 80. Of the light emitting element 20. The apparatus body 106 has a mounting surface 132 forming a surface that contacts the opposite side of the main surface 11a of the substrate 11, that is, the area on the back side (the fourth area 13d) of the plurality of light emitting elements 20 on the back surface 11b, and the one or more of them. A region on the back side of the circuit component 80 (third region 13c).

According to this structure, the plurality of light-emitting elements 20 on the main surface 11 a of the substrate 11 and the area on the back side of one or more (the plural in this embodiment) circuit parts 80 are supported on the installation surface 132 of the instrument body 106. In this embodiment, the substrate 11 (light emitting module 10) is mounted on the mounting surface portion 132 in a state where the flat back surface 11b of the substrate 11 and the mounting surface portion 132 that is as flat as the back surface 11b are in contact. That is, the fixture body 106 does not require a storage space for accommodating circuit components existing on, for example, the back surface of the substrate, and thus the lighting fixture 100 can be made thin (in this embodiment, the width in the Z-axis direction is shortened).

In addition, according to the above structure, for example, in FIG. 4, the distance from the bottom surface of the instrument body 106 (the surface on the most negative side in the Z-axis direction) to the mounting surface portion 132 can be made short, thereby enabling the light emitting module 10 to be separated from The lighting cover 140 is far away. Thereby, for example, the amount of light reaching the peripheral edge portion of the lighting cover 140 from the light emitting module 10 can be increased. That is, when the lighting cover 140 is viewed from the top, the light can reach the peripheral edge portion of the lighting cover 140. As a result, a larger range can be illuminated by light emitted from, for example, the lighting fixture 100.

In addition, as described above, since the installation surface 132 of the instrument body 106 does not require a storage space for accommodating circuit parts and the like existing on the back surface of the substrate, a relatively large flat installation surface 132 can be provided in the instrument body 106. Therefore, for example, in the present embodiment, the mounting surface 132 forming the circular region can be arranged in the original shape without cutting off the remaining portion (unnecessary portion) of the substrate 11. Specifically, for example, the substrate 11 can be directly removed from the substrate 11 without cutting off parts such as positional restrictions for mounting the circuit components 80 (for example, a disposable substrate forming a reference hole for positioning a component mounting machine). (Light-emitting module 10) is mounted on the mounting surface 132. That is, a process of cutting away unnecessary portions of the substrate 11 is not required. This is advantageous from the viewpoint of, for example, improving the manufacturing efficiency of the lighting fixture 100 or suppressing the manufacturing cost.

Here, when the thickness of the lighting fixture 100 is sought to be reduced, the heat generated in the light-emitting module 10 is not easily released to the outside due to reasons such as a reduction in the distance between various components included in the lighting fixture 100 (higher density of components). In this regard, according to the lighting fixture 100 of this embodiment, as described below, heat can be dissipated with high efficiency of the heat generated by the light emitting module 10 (the heat generated by the light emitting section 25 and the power supply circuit 90, respectively).

Specifically, in the present embodiment, the substrate 11 is mounted in a state in which the mounting surface portion 132 is in contact with the rear side of the heat source element (the plurality of light emitting elements 20 and the plurality of circuit components 80) arranged on the main surface 11 a of the substrate 11. Installed in the appliance body 106. Therefore, the heat generated in the light emitting module 10 can be released to the outside through the appliance body 106 with good efficiency. As a result, deterioration of, for example, the plurality of light emitting elements 20 or the plurality of circuit parts 80 can be suppressed.

More specifically, in this embodiment, the substrate of the substrate 11 is made of an insulating substrate such as a resin substrate, and no metal wiring is formed on the back surface 11b. Therefore, the back surface 11b of the substrate 11 can be brought into direct contact with the metal appliance body 106 without an insulating member such as an insulating sheet interposed therebetween. This helps to improve the heat dissipation efficiency of the light emitting module 10.

Here, when an accommodation space is provided on the appliance body to accommodate circuit parts and the like on the back surface of the substrate, for example, a stepped portion for forming the accommodation space is provided on the appliance body at a position opposite to a part of the back surface of the substrate. Since this step portion is a portion that does not contact the substrate, it is disadvantageous from the viewpoint of heat dissipation efficiency. In this regard, in the present embodiment, the substrate 11 is fixed to the appliance body 106 in a state where the entire surface of the back surface 11 b of the substrate 11 is substantially in contact with the installation surface 132 of the appliance body 106. Therefore, the heat generated by the light emitting module 10 can be efficiently dissipated using the appliance body 106.

In the present embodiment, as described above, when manufacturing the light-emitting module 10, the plurality of light-emitting elements 20 and the plurality of circuit parts 80 are both heated and soldered to the substrate by being disposed on the main surface 11a of the substrate 11. 11 的 主 面 11a. In brief, a plurality of light-emitting elements 20 and a plurality of circuit parts 80 can be soldered to the substrate 11 in a single heating process. Therefore, as the circuit part 80, for example, a less heat-resistant electronic part (for example, a special part for reflow soldering that does not guarantee a flow method) or the like can be used.

In this embodiment, one or more circuit components 80 included in the light-emitting module 10 are electrically connected to a plurality of light-emitting elements 20, and the one or more circuit components 80 are configured to supply light-emitting power to the plurality of light-emitting devices. The power supply circuit 90 of the element 20.

Here, the power supply circuit 90 generally includes a filter element, a MOSFET (metal-oxide-semiconductor field-effect transistor), a coil element, a resistance element, a regulator, or various control ICs, which easily emit high heat. Circuit parts 80. Therefore, it is also important to dissipate the heat radiated from the circuit parts 80 with good efficiency. In this regard, in the present embodiment, a region on the back side of the power supply circuit 90 of the substrate 11, that is, the third region 13 c (see FIG. 3) contacts the inner region 132 a included in the mounting surface portion 132 of the appliance body 106. Thereby, the heat radiated from each circuit part 80 constituting the power supply circuit 90 can be released to the outside through the appliance body 106 with good efficiency.

In addition, the structures of the light emitting module 10 and the fixture body 106 included in the lighting fixture 100 are not limited to those described in the above embodiment. Therefore, the following description will focus on the differences from the above-mentioned embodiments, and describe modifications of the light-emitting module 10 and the appliance body 106.

(Modification 1) FIG. 5 is a plan view showing a schematic configuration of a light emitting module 10a according to Modification 1 of the embodiment. In addition, in FIG. 5, the gap 16 penetrating the substrate 11 is indicated by dots for easy identification with other requirements.

In the light emitting module 10 a shown in FIG. 5, a plurality of slits 16 are provided on the substrate 11. Specifically, a gap 16 is formed at a position between a plurality of light-emitting elements 20 of the substrate 11 and one or more (a plurality of circuit components 80 in this modification).

Thereby, for example, the heat generated in the plurality of light emitting elements 20 is not easily transmitted to the plurality of circuit components 80 through the substrate 11. That is, it is possible to reduce the influence of the heat of the plurality of light-emitting elements 20 that are likely to emit higher heat than the plurality of circuit parts 80 on the plurality of circuit parts 80. As a result, for example, deterioration caused by the heat of each of the plurality of circuit components 80 can be suppressed. At this time, since the fourth region 13d (see FIG. 3) on the back side of the plurality of light-emitting elements 20 of the substrate 11 contacts the mounting surface 132 of the device body 106, the heat generated in the plurality of light-emitting elements 20 can pass through the device. The body 106 is released to the outside with good efficiency.

More specifically, as shown in FIG. 3, a peripheral edge portion 131 is provided around the attachment surface portion 132 of the appliance body 106. Therefore, the heat transmitted from the fourth region 13 d of the back surface 11 b of the substrate 11 to the region 132 b outside the mounting surface portion 132 is further transmitted to the peripheral portion 131. Accordingly, the heat generated in the plurality of light emitting elements 20 can be efficiently released to the outside.

In addition, instead of the slit 16, a groove [a groove that does not penetrate the substrate 11 in the thickness direction (Z-axis direction)] is provided by arranging a position between the plurality of light-emitting elements 20 of the substrate 11 and one or more circuit components 80. Various effects.

In this modification, the slits 16 can be said to be elongated in the arrangement direction of the plurality of light emitting elements 20 and are arranged along the arrangement direction. More specifically, the four slits 16 are arranged along the arrangement direction of the plurality of light emitting elements 20.

The shape, number, and arrangement positions of the slits 16 on the substrate 11 are not limited to those shown in FIG. 5. For example, the curved slits 16 or grooves along the arrangement of the plurality of light-emitting elements 20 may be formed in the substrate 11 in a plan view.

(Modification 2) FIG. 6 is a perspective view showing a schematic configuration of an appliance body 106a according to Modification 2 of the embodiment. In addition, in FIG. 6, the substrate 11 and the instrument body 106 a are shown in a state where the substrate 11 is separated from the instrument body 106 a and the substrate 11 is tilted so that the back surface 11 b of the substrate 11 can be seen. In addition, in FIG. 6, the inner region 132 a and the outer region 132 b of the face 132 are installed for easy identification, and the inner region 132 a and the outer region 132 b are respectively shown as regions with dots.

FIG. 7 is a cross-sectional view of a groove portion 134 provided in the instrument body 106a according to the second modification of the embodiment. Specifically, FIG. 7 shows a VII-VII cross section of FIG. 6.

The appliance body 106 a shown in FIG. 6 has a groove portion 134 formed in the attachment surface portion 132. Specifically, the mounting surface portion 132 includes an outer region 132 b corresponding to a plurality of light emitting elements 20 in a plan view, and an inner region 132 a corresponding to one or more circuit components 80. The mounting surface portion 132 has a groove portion 134 formed between the outer region 132 b and the inner region 132 a so as to project toward the opposite side of the substrate 11.

According to this structure, the rigidity of the flat mounting surface portion 132 can be increased in order to make surface contact with, for example, the back surface 11 b of the substrate 11. As a result, the rigidity of the device body 106a which is thinner can be improved. Accordingly, it is possible to suppress the occurrence of deflection of the appliance body 106a during manufacture or transportation of the lighting fixture 100, for example.

Further, according to the above configuration, it is possible to divide between the inner region 132a that mainly receives heat from one or more (the plural in this modification) circuit parts 80 and the outer region 132b that mainly receives heat from the plurality of light emitting elements 20. The heat conduction path is extended. This makes it possible to reduce the influence of the heat of the plurality of light-emitting elements 20 on the plurality of circuit components 80 in the same manner as in the first modification. As a result, for example, deterioration caused by the heat of each of the plurality of circuit components 80 can be suppressed. Also, at this time, as described in the above-mentioned modification 1, the heat radiation effect due to the existence of the peripheral edge portion 131 around the mounting surface portion 132 can also be exhibited.

(Other Embodiments) As mentioned above, the present invention has been described based on the embodiments and modifications thereof, but the present invention is not limited to the above embodiments and modifications.

For example, the back surface 11b of the substrate 11 and the installation surface 132 of the appliance body 106 need not be flat, respectively. For example, when the mounting surface 132 of the appliance body 106 is bent, the back surface 11b of the substrate 11 may also be bent to follow the mounting surface 132. That is, the mounting surface portion 132 only needs to form the surfaces of the fourth region 13 d and the third region 13 c that contact the back surface 11 b of the substrate 11. As a result, as compared with the case where, for example, a step is provided on the mounting surface portion 132 to accommodate circuit components, the appliance body 106 is easily thinned. Moreover, the heat radiation effect by the said apparatus main body 106 can also be exhibited.

In addition, for example, as the substrate 11 of the light-emitting module 10, in addition to the glass composite substrate and the resin substrate exemplified in the above embodiment, a metal base substrate made of, for example, a metal material coated with a resin may be used. At this time, for example, the heat of the plurality of light emitting elements 20 and the plurality of circuit parts 80 mounted on the main surface 11 a of the substrate 11 by surface mounting technology is conducted to the appliance body 106 with good efficiency through the substrate 11.

The outer shape of the substrate 11 is not limited to the outer shape shown in FIG. 2. For example, the light emitting module 10 may have a circular substrate 11 with an opening in the center.

The outer shape of the device body 106 is not limited to the outer shape shown in FIG. 3 and the like. For example, the instrument body 106 may have a polygonal outer shape such as a rectangular shape in plan view, or may be an outer shape composed of straight lines and curves.

In addition, one or more circuit components 80 arranged on the substrate 11 may constitute a circuit (electronic circuit) different from the type of the power supply circuit 90. For example, a control circuit for performing dimming control or color adjustment control on the plurality of light emitting elements 20 according to a signal transmitted from the outside of the lighting fixture 100 may be constituted by the one or more circuit components 80. The power supply circuit 90 may include the control circuit described above.

The light-emitting element 20 is an SMD-type LED element, but is not limited thereto. For example, the light emitting module 10 may have a COB (Chip On Board) structure in which the LED chip is directly mounted on the substrate 11. At this time, the plurality of LED wafers mounted on the substrate 11 are sealed together or individually sealed by a sealing member containing a wavelength conversion material, thereby obtaining illumination light having a predetermined color temperature.

Moreover, in the said embodiment and modification, the light-emitting element 20 is the LED element which encapsulated the LED chip as an example. However, as the light emitting element 20, a semiconductor light emitting element such as a semiconductor laser, or other types of solid light emitting element such as an organic EL (Electro Luminescence) or an EL element such as an inorganic EL may be used.

In addition, the above-mentioned embodiment and its modifications are obtained by carrying out various modifications conceived by the industry, and the constituent elements and functions of each embodiment and its modifications are arbitrarily combined without departing from the scope of the invention Realized forms are also included in the present invention.

4‧‧‧ ceiling

8‧‧‧ Appliance Installation Department

9‧‧‧Ceiling side installation components

10‧‧‧light emitting module

10a‧‧‧light emitting module

11‧‧‧ substrate

11a‧‧‧Main face

11b‧‧‧Back

12‧‧‧ opening

13a‧‧‧Region 1

13b‧‧‧Zone 2

13c‧‧‧The third area (the area on the back side of one or more circuit components on the back of the substrate)

13d‧‧‧4th area (area on the back side of a plurality of light emitting elements on the back of the substrate)

16‧‧‧ Gap

20‧‧‧Light-emitting element

25‧‧‧Lighting Department

80‧‧‧circuit parts

90‧‧‧ Power Circuit

100‧‧‧lighting appliances

106‧‧‧Apparatus body

106a‧‧‧appliance body

126‧‧‧ support

131‧‧‧periphery

132‧‧‧Facial

132a‧‧‧ inside area

132b‧‧‧ outside area

134‧‧‧Gully

140‧‧‧lighting cover

150‧‧‧Circuit cover

160‧‧‧light source cover

161‧‧‧Lens section

IV-IV‧‧‧line

Line VII-VII‧‧‧

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Fig. 1 is an exploded perspective view of a lighting fixture according to an embodiment. FIG. 2 is a plan view showing the outline of the structure of the light emitting module according to the embodiment. FIG. 3 is a perspective view showing a structural relationship between a substrate and an apparatus body according to the embodiment. FIG. 4 is a cross-sectional view showing a schematic configuration of a lighting fixture according to the embodiment. FIG. 5 is a plan view showing a schematic configuration of a light emitting module according to a first modification of the embodiment. FIG. 6 is a perspective view showing an outline of a structure of an appliance body according to a second modification of the embodiment. Fig. 7 is a cross-sectional view of a groove portion provided in an appliance body according to a second modification of the embodiment.

Claims (10)

A lighting device includes: a device body; and a light-emitting module mounted on the device body; the light-emitting module has: a substrate; one or more circuit parts arranged on a main surface of the substrate; a plurality of light-emitting elements, It is arranged on the main surface of the substrate in a circular manner so as to surround the one or more circuit parts. The appliance body has a mounting surface that forms a surface opposite to the "main surface of the substrate." The surface is the surface on which the plurality of light-emitting element areas on the back side and the areas on the back side of the one or more circuit components are in contact. For example, in the lighting device of the first patent application scope, a gap or groove is formed at a position "between the plurality of light emitting elements and the one or more circuit parts" of the substrate. For example, in the lighting device according to the scope of the patent application, the slit or the groove is elongated in the arrangement direction of the plurality of light emitting elements, and is arranged along the arrangement direction. For example, the lighting fixture according to any one of claims 1 to 3, wherein the mounting surface includes an outer region corresponding to the plurality of light emitting elements and an inner region corresponding to the one or more circuit parts in a plan view. A region has a groove portion formed between the outer region and the inner region so as to project toward the opposite side of the substrate. For example, the lighting fixture according to any one of claims 1 to 3, wherein the fixture body further includes a peripheral portion disposed around the installation face. For example, the lighting fixture of any one of items 1 to 3 of the patent application scope further includes: a circuit cover configured to cover the one or more circuit parts arranged on the substrate; on the inner surface of the circuit cover Equipped with insulation sheet. For example, the lighting fixture according to any one of claims 1 to 3, wherein at least one of the one or more circuit parts is a lead part having a lead, and the lead part is in a state where the lead is bent It is disposed on the main surface of the substrate. For example, if the lighting device of any one of items 1 to 3 of the scope of the patent application, the plurality of light emitting elements are surface-mounted LED elements, and the one or more circuit parts are surface-mounted wafer types, respectively. Components. For example, if the lighting device according to any one of claims 1 to 3 of the scope of patent application, the one or more circuit parts are electrically connected to the plurality of light emitting elements, and the one or more circuit parts are used to emit light. Power is supplied to a power supply circuit of the plurality of light emitting elements. For example, the lighting apparatus of any one of the scope of claims 1 to 3, wherein the control circuit is constituted by the one or more circuit parts, and the control circuit adjusts the plurality of light emitting elements according to a signal sent from the outside. Light control or toning control.