JP2011204655A - Lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting fixture having improved brightness by using a plurality of light emitting modules, and having improved assembling work efficiency by reducing the number of components.SOLUTION: The plurality of light emitting modules 13 are arranged on a plurality of light emitting module arrangement parts 25 of a luminaire body 12, respectively, and a reflector 14 is screwed to the luminaire body 12 via the light emitting modules 13. A plurality of board pressing parts 47 of the reflector 14 abut on substrates 34 of the light emitting modules 13, respectively, to hold the light emitting modules 13 between each substrate pressing part 47 and each light emitting module arrangement part 25 of the luminaire body 12.

Description

  The present invention relates to a lighting device using a semiconductor light emitting element as a light source.

  2. Description of the Related Art Conventionally, for example, some lighting devices such as downlights use a light emitting module in which an LED, which is a semiconductor light emitting element, is mounted on a substrate as a light source.

  In this lighting device, one light emitting module is arranged on the lower surface of the fixture body, the substrate of the light emitting module is fastened to the fixture body with a plurality of screws, and heat generated when the LED is lit is efficiently transferred from the substrate to the fixture body. It is designed to conduct heat well (for example, see Patent Document 1).

JP 2008-300207 A (page 7, Fig. 1-6)

  In the conventional lighting device, since only one light emitting module is used, the amount of light emitted from the lighting device is limited, and illumination cannot be performed more brightly.

  Therefore, in order to increase the amount of light emitted from the lighting device and improve the brightness, it is conceivable to use a plurality of light emitting modules, but it is necessary to attach each light emitting module to the instrument body with a plurality of screws, There is a problem that the number of parts increases and the assembly workability becomes complicated.

  The present invention has been made in view of such a point, and an object thereof is to provide an illumination device that can improve brightness by using a plurality of light emitting modules, reduce the number of components, and improve assembly workability. To do.

  The lighting device according to claim 1 is a fixture main body in which a plurality of light emitting module placement portions are formed on one side; a semiconductor light emitting element is mounted on one side of the substrate, and the other side of the substrate is each light emitting module placement portion of the fixture main body. A plurality of light emitting modules disposed on the surface of the light emitting module; a plurality of light emitting modules that are attached to one surface side of the device main body and reflect light from the semiconductor light emitting element of each light emitting module; And a reflector having a plurality of substrate pressing portions held between the light emitting module arrangement portions of the main body.

  In the present invention and the following inventions, definitions and technical meanings of terms are as follows unless otherwise specified.

  The instrument body is preferably formed of, for example, a metal such as an aluminum die cast or ceramics excellent in thermal conductivity and heat dissipation. Each light emitting module placement portion may be provided with a recess or a protrusion that is positioned by placing each light emitting module.

  The semiconductor light emitting element of the light emitting module includes, for example, an LED element or an EL element. The substrate of the light emitting module may be provided with an outer shape so as to be positioned by being placed in the light emitting module placement portion of the instrument body, or may be provided with a positioning notch.

The light emitting module may be, for example, a COB (Chip On Board) module in which a plurality of LED elements are mounted on a substrate, or an SMD (Surface Mount Device) package with a connection terminal on which one LED chip is mounted. It may be a module.

  The reflector can be held by sandwiching the substrate of the light emitting module with the instrument body by, for example, fastening and fixing the reflector to the instrument body with a screw or the like. The substrate pressing portion may be provided also as a portion that forms the reflecting surface, or may be provided at a location different from the portion that forms the reflecting surface.

  The lighting device according to claim 2 is the lighting device according to claim 1, wherein each of the light emitting modules has a plurality of semiconductor light emitting elements mounted on one surface of the substrate, and a surrounding portion surrounds the plurality of semiconductor light emitting elements. A phosphor layer that covers the plurality of semiconductor light emitting elements is formed inside the enclosure, and the reflecting surfaces of the reflector are provided up to a position facing the peripheral surface of the enclosure of each light emitting module. It is what.

  The light emitting module is a COB module, for example, an LED element that emits blue light is used as a semiconductor light emitting element, and a phosphor resin that contains a phosphor that is excited by blue light and emits mainly yellow light, etc. By using this sealing resin, white light in which blue light and yellow light are mixed is emitted from the surface of the phosphor layer.

  The lighting device according to claim 3 is the lighting device according to claim 2, wherein each substrate pressing portion of the reflector is in contact with the substrate around the surrounding portion of each light emitting module.

  The substrate pressing portion may be in contact with the substrate all around the periphery of the light emitting module, or may be in contact with the substrate at least part of the entire periphery.

  The illumination device according to claim 4 is the illumination device according to claim 3, wherein each light emitting module has an electronic component disposed on one surface of the substrate, and each substrate holding portion of the reflector has each light emitting module. A notch is formed to avoid interference with an electronic component arranged on one surface of the substrate.

  The electronic component includes, for example, a connector for connecting the light emitting module and the lighting circuit, and other electrical components.

  The illumination device according to claim 5 is the illumination device according to any one of claims 1 to 4, wherein a step is formed in the adjacent light emitting module placement portions of the fixture body, and the illumination device is placed in each adjacent light emission module placement portion. The substrates of each light emitting module are arranged so as to overlap each other when viewed from the one surface side of the instrument body, and the adjacent reflecting surfaces of the reflectors and the adjacent substrate holding parts correspond to the steps of the light emitting module arrangement part of the instrument body. A step is formed.

  For example, the steps of the light emitting module placement portions may be alternately different in height in adjacent directions, or may be sequentially lowered or increased.

  According to the illuminating device of claim 1, the plurality of light emitting module placement portions are provided in the fixture body, the plurality of light emitting modules are arranged, and the reflector is provided with the plurality of reflecting surfaces that reflect the light from each light emitting module. The amount of light emitted from the lighting device can be increased to improve the brightness, and the plurality of substrate pressing portions provided on the reflector are in contact with one surface of the substrate of each light emitting module, and each light emitting module placement portion of the fixture body Therefore, it is not necessary to attach each light emitting module to the instrument body with a plurality of screws, the number of parts can be reduced, and assembly workability can be improved.

  According to the lighting device according to claim 2, in addition to the effect of the lighting device according to claim 1, each reflecting surface of the reflector is provided up to a position facing the peripheral surface of the surrounding portion of each light emitting module. The light leakage to the periphery of the light emitting module can be suppressed, and the light extraction efficiency for extracting the light from the light emitting module with the reflector can be improved.

  According to the illuminating device of claim 3, in addition to the effect of the illuminating device of claim 2, each substrate pressing portion of the reflector comes into contact with the substrate around the surrounding portion of each light emitting module. The portion of the substrate on which the semiconductor light emitting element on the inner side is mounted can be securely adhered to the instrument body, and the thermal conductivity from the substrate to the instrument body can be improved.

  According to the illuminating device of the fourth aspect, in addition to the effect of the illuminating device according to the third aspect, since the notch portions are provided in the substrate pressing portions of the reflector, they are arranged on one surface of the substrate of each light emitting module. The substrate can be held between the instrument body while avoiding interference with the electronic component.

  According to the illuminating device of claim 5, in addition to the effect of the illuminating device according to any one of claims 1 to 4, a step is formed in adjacent light emitting module placement portions of the fixture body, and each of the adjacent light emitting devices Since the substrate of each light emitting module can be arranged so as to overlap each other when viewed from one side of the instrument main body with respect to the module arrangement part, it is possible to improve the brightness by arranging more light emitting modules within a limited range of the instrument main body. In addition, it is possible to secure an insulation distance between adjacent light emitting modules by providing a step, and by forming a step on each adjacent reflecting surface and each adjacent substrate holding portion of the reflector, It is possible to cope with the steps of the light emitting module arrangement part.

It is sectional drawing of the illuminating device which shows one embodiment of this invention. It is the side view which notched a part of illumination device same as the above. It is a bottom view of the state which has arrange | positioned the light emitting module in the instrument main body of the illuminating device same as the above. It is a bottom view of the state which attached the reflector to the fixture main body of the illuminating device same as the above. It is a top view of an illuminating device same as the above. It is the bottom view which notched a part of illumination device same as the above.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  As shown in FIGS. 1 to 6, the illumination device 11 is a downlight and is installed in an embedded hole provided in a ceiling member such as a ceiling panel.

  As shown in FIG. 1 and FIG. 2, the lighting device 11 includes an instrument main body 12, a plurality of light emitting modules 13 disposed on a lower surface that is one surface side of the instrument main body 12, and disposed below the light emitting modules 13. A reflector 14 attached to the instrument body 12, a translucent cover 15 attached to the lower side of the reflector 14, a reflector 14 and a reflector attached to the instrument body 12 covering the periphery of the translucent cover 15 A frame 16 and a plurality of attachment springs 17 attached to the outer surface of the instrument body 12 are provided. Furthermore, a power supply unit that is disposed on the ceiling member and supplies lighting power to the light emitting module 13 is provided.

  As shown in FIGS. 1 to 3, the instrument main body 12 serves as a heat radiating member that radiates heat generated by the light emitting module 13, so that it has excellent thermal conductivity and heat radiating properties, such as metal such as aluminum die casting, ceramics, etc. It is made of a material, has a circular substrate portion 21, and a cylindrical tube portion 22 is formed so as to open from the periphery of the substrate portion 21 downward, and a light emitting module is formed inside the tube portion 22. A housing portion 23 for housing 13 and the reflector 14 is formed, and an irradiation opening 24 is formed on the lower surface of the housing portion 23, that is, the lower surface of the instrument body.

  In the peripheral portion of the lower surface of the substrate portion 21, a plurality of light emitting modules 13 and six light emitting module arranging portions 25 are formed side by side in the circumferential direction. Among these light emitting module placement portions 25, every other three light emitting module placement portions 25a on the back side and every other three light emitting module placement portions 25b on the opening side are stepped in the height direction. Is provided. That is, the light emitting module placement portion 25a on the back side is provided above the light emitting module placement portion 25b on the opening side, that is, the back side as viewed from the irradiation opening 24, and the light emitting module placement portion 25b on the opening side is disposed on the back side. It is provided below the portion 25a, that is, on the front side when viewed from the irradiation opening 24. The light emitting module placement portion 25a on the back side is formed by a recess portion 26 formed on the lower surface of the substrate portion 21. The recess dimension of the recess 26 is the same as the thickness dimension of the substrate of the light emitting module 13.

  A pair of projections 27 serving as positioning portions for positioning the light emitting module 13 are projected on the outer diameter side of each light emitting module placement section 25, and a pair of light emitting modules (not shown) for fixing the light emitting module 13 with screws 28 on the inner diameter side. A mounting screw hole is formed. The light emitting module mounting screw holes are provided in common in the adjacent light emitting module arrangement portions 25, and therefore, the number of screws 28 is six, which is the same as the number of the light emitting modules 13.

  A wiring hole 29 penetrating the substrate portion 21 is formed in the center of the substrate portion 21, and a plurality of heat radiation fins 30 are formed radially above the substrate portion 21.

  A plurality of attachment spring mounting portions 31 to which the attachment springs 17 are attached are provided around the cylindrical portion 22.

  Each light emitting module 13 has a common substrate 34 having a substantially rectangular shape made of a material such as a metal such as aluminum or ceramics having excellent thermal conductivity, and a surface that is one surface of the substrate 34. In addition, a plurality of LED elements 35 as semiconductor light emitting elements are arranged and mounted in a matrix, and the plurality of LED elements 35 are connected to each other so as to be fed by a wiring pattern formed on the substrate 34 or wire bonding. A bank-shaped surrounding portion 36 is formed so as to surround the plurality of LED elements 35, and a phosphor layer 37 is formed inside the surrounding portion 36 so as to seal the plurality of LED elements 35. That is, the light emitting module 13 is constituted by a COB (Chip On Board) module. For example, the LED element 35 emits blue light, and the phosphor layer 37 is excited by the blue light emitted by the LED element 35 and a silicone resin containing a phosphor that mainly emits yellow light is placed inside the enclosure 36. Filled and formed. Accordingly, white light in which blue light and yellow light are mixed is emitted from the surface of the phosphor layer 37.

  A connector 38 as an electronic component electrically connected to the plurality of LED elements 35 is mounted on the surface of the substrate 34. Connected to the connector 38 of each light emitting module 13 is a plurality of connectors attached to the end of the cable from the power supply unit drawn into the fixture body 12 through the wiring hole 29, and the lighting power source is supplied from the power supply unit to each light emitting module. It can be supplied.

  At the four corners of the substrate 34, substantially semicircular groove portions 39 are formed.

  In order to arrange the light emitting modules 13 on the fixture body 12, first, the three light emitting modules 13 are arranged in the light emitting module arrangement portion 25a on the back side, and then the remaining three light emitting modules 13 are arranged on the opening side. It arrange | positions at the arrangement | positioning part 25b. By arranging each light emitting module 13 in each light emitting module arrangement part 25a, 25b, each groove part 39 of the substrate 34 of each light emitting module 13 located on the outer diameter side of the instrument body 12 is changed to each light emitting module arrangement part 25a, 25b. The substrate 34 of the light emitting module 13 adjacent to the end of the substrate 34 of the light emitting module 13 positioned on the inner diameter side of the instrument main body 12 as viewed from the irradiation opening 24 of the instrument main body 12 while being fitted and positioned in each protrusion 27. The groove portion 39 of the substrate 34 of the light emitting module 13 that overlaps the end portion of the light emitting module 13 is disposed substantially concentrically with respect to the light emitting module mounting screw hole provided in the instrument body 12. The light emitting module mounting screw hole provided in the fixture body 12 is screwed through the groove 39 of the substrate 34 of the light emitting module 13 where the screw 28 overlaps, and the two substrates 34 of the light emitting module 13 that overlap with the screw 28 are connected to the fixture body 12. It is arranged in a state where it is fastened together and temporarily fixed.

  As shown in FIGS. 1 to 4, the reflector 14 is made of an insulating synthetic resin, and is disposed on the instrument main body 12 from the disk-shaped surface portion 42 and the upper surface peripheral portion of the surface portion 42. Corresponding to the position of each light emitting module 13, a plurality of reflecting cylinder portions 43 are provided in a projecting manner. These reflection cylinder parts 43 are formed in a substantially conical cylinder shape so as to expand and incline toward the lower irradiation opening 24, and the inner surface thereof reflects light from the LED element 35 in the lower irradiation direction. A surface 44 is formed. The inner diameter dimension of the tip part on the upper end side of the reflecting surface 44 is larger than the outer diameter dimension of the surrounding part 36 of the light emitting module 13, and the reflecting surface 44 is disposed around the surrounding part 36 of the light emitting module 13. That is, the tip of the upper end side of the reflecting surface 44 is located above the surface of the phosphor layer 37, which is the light emitting surface of the light emitting module 13, and the reflecting surface 44 is provided up to a position facing the peripheral surface of the surrounding portion 36. Yes. Note that at least the lower surface of the surface portion 42 and the reflection surface 44 are subjected to a reflection surface treatment for increasing the reflection efficiency such as a mirror surface or a white surface.

  A plurality of bosses 45 project from the upper surface of the surface portion 42, and screws 46 inserted from above the board portion 21 of the instrument main body 12 are screwed into the bosses 45 so that the reflector 14 is attracted to the instrument main body 12. Tighten as shown. As a result, the top end portion of each reflecting cylinder portion 43 abuts against the substrate 34 of each light emitting module 13 and presses against each light emitting module placement portion 25 of the instrument body 12. That is, the top end portion of each reflecting cylinder portion 43 is formed as a plurality of substrate holding portions 47, and each light emitting module 13 is connected between each substrate holding portion 47 and each light emitting module placement portion 25 of the instrument body 12. It is comprised so that it may be inserted | pinched and hold | maintained.

  The substrate pressing portion 47 is in contact with the substrate 34 around the surrounding portion 36 of the light emitting module 13. Since the connector 38 is mounted on the substrate 34 around the enclosing portion 36 of the light emitting module 13, the substrate pressing portion 47 is formed with a notch 48 for avoiding interference with the connector 38.

  The translucent cover 15 is made of acrylic resin or glass having light transmissivity and light diffusibility, and is formed in a disk shape having a size covering the entire surface side of the reflector 14, and has a mounting structure (not shown). The reflector 14 is detachably attached.

  Further, the reflection frame 16 is made of, for example, metal or synthetic resin, is formed in a cylindrical shape, and is attached in contact with the reflection surface portion 51 disposed along the inner wall surface of the housing portion 23 of the instrument body 12 and the lower surface of the ceiling member. An edge portion 52 that holds the ceiling member between the spring 17 and covers the embedding hole is provided. The upper end side of the reflecting surface portion 51 is attached to the instrument main body 12 with a screw 53.

  Further, for example, a plate spring is used as the attachment spring 17, one end is attached to the attachment spring mounting portion 31 of the instrument body 12, and the other end is protruded laterally from the instrument body 12. Then, the instrument body 12 is elastically deformed so that each attachment spring 17 is along the side surface of the instrument body 12 and is inserted into the embedded hole of the ceiling member from below, by the repulsive force against the elastic deformation of each attachment spring 17 Each mounting spring 17 expands to the side and comes into contact with the upper surface of the ceiling member, pulls up the instrument main body 12, and is sandwiched between the edge 52 of the reflection frame 16 that comes into contact with the lower surface of the ceiling member Hold on.

  And in the illuminating device 11 comprised in this way, by supplying lighting power to each light emitting module 13 from a power supply unit, the LED element 35 of each light emitting module 13 lights, and the light emission surface of the surface of the fluorescent substance layer 37 Emits light. This emitted light is partly directed directly to the translucent cover 15, partly reflected by the reflecting surface 44 and directed to the translucent cover 15, passing through the translucent cover 15 and from the irradiation opening 24. Irradiated downward.

  The heat generated by the lighting of the LED element 35 of each light emitting module 13 is conducted to the substrate 34, and is conducted from the substrate 34 to the instrument body 12, and from the outer surface of the instrument body 12 including the heat dissipation fins 30 to the air. Heat is dissipated.

According to this illuminating device 11, a plurality of light emitting module placement portions 25 are provided in the fixture main body 12, a plurality of light emitting modules 13 are arranged, and a plurality of reflecting surfaces 44 for reflecting light from each light emitting module 13 to the reflector. Therefore, the amount of light emitted from the lighting device 11 can be increased and the brightness can be improved.

  Further, since each substrate pressing portion 47 provided on the reflector 14 can be held in contact with the substrate 34 of each light emitting module 13 and sandwiched between each light emitting module placement portion 25 of the instrument body 12, each light emission There is no need to attach the module 13 to the instrument main body 12 with a plurality of screws, the number of parts can be reduced, and the assembly workability can be improved. That is, it is only necessary to use the same number of screws 28 used for temporary fixing as the light emitting module 13, and the screws 28 are not essential, and the reflector 14 and the instrument body 12 can be used without using the screws 28. Can be securely held by being sandwiched between them.

  Further, since each reflecting surface 44 of the reflector 14 is provided up to a position facing the peripheral surface of the surrounding portion 36 of each light emitting module 13, light leakage to the periphery of the light emitting module 13 can be suppressed, and the light emitting module 13 It is possible to improve the light extraction efficiency for extracting light from the reflector 14.

  Further, since each substrate pressing portion 47 of the reflector 14 contacts the substrate 34 around the surrounding portion 36 of each light emitting module 13, the portion of the substrate 34 on which the LED element 35 inside the surrounding portion 36 is mounted is used as an instrument. It is possible to ensure close contact with the main body 12 and improve the thermal conductivity from the substrate 34 to the instrument main body 12.

  In addition, since each substrate holding portion 47 of the reflector 14 is provided with a notch portion 48, it is possible to avoid interference with the connector 38 disposed on the substrate 34 of each light emitting module 13 between the reflector 14 and the instrument body 12. The substrate 34 can be sandwiched between and securely held.

  Further, a step is formed in the adjacent light emitting module placement portions 25 of the fixture body 12, and the substrate 34 of each light emitting module 13 is viewed from the irradiation opening 24 side of the fixture body 12 with respect to each of the adjacent light emitting module placement portions 25. As a result, it is possible to improve the brightness by arranging more light emitting modules 13 within the limited range of the instrument body 12, and ensure the insulation distance between adjacent light emitting modules 13 by providing a step. can do. That is, by providing a step, it is possible to improve the brightness by arranging more light emitting modules 13 within a limited range of the instrument body 12 while securing an insulation distance between the adjacent light emitting modules 13.

  In addition, since the overlapping portions of the substrates 34 of the adjacent light emitting modules 13 can be fastened together with the screws 28 and temporarily fixed to the instrument body 12, the number of necessary screws 28 can be reduced.

  Further, by forming a step on each adjacent reflecting surface 44 and each adjacent substrate pressing portion 47 of the reflector 14, it is possible to cope with the step of the light emitting module arrangement portion 25 of the instrument body 12.

11 Lighting equipment
12 Instrument body
13 Light emitting module
14 Reflector
25 Light emitting module placement
34 Board
35 LED elements as semiconductor light-emitting elements
36 Box
37 Phosphor layer
38 Connectors as electronic components
44 Reflective surface
47 Substrate holder
48 Notch

Claims (5)

An instrument body having a plurality of light emitting module arrangement portions formed on one side;
A plurality of light emitting modules in which a semiconductor light emitting element is mounted on one surface of the substrate and the other surface of the substrate is disposed in each light emitting module disposition portion of the instrument body;
A plurality of reflective surfaces that are attached to one surface of the fixture body and reflect light from the semiconductor light emitting element of each light emitting module, and between the light emitting module placement portions of the fixture main body in contact with one surface of each light emitting module substrate A reflector having a plurality of substrate holders held on the substrate;
An illumination device comprising: Each light emitting module has a plurality of semiconductor light emitting elements mounted on one surface of a substrate, and a surrounding part is formed so as to surround the periphery of the plurality of semiconductor light emitting elements, and a plurality of semiconductor light emitting elements are provided inside the surrounding part. An overlying phosphor layer is formed,
The lighting device according to claim 1, wherein each reflecting surface of the reflector is provided up to a position facing the peripheral surface of the surrounding portion of each light emitting module. The lighting device according to claim 2, wherein each substrate pressing portion of the reflector is in contact with the substrate around a surrounding portion of each light emitting module. Each light emitting module has electronic components arranged on one surface of the substrate,
The lighting device according to claim 3, wherein each substrate pressing portion of the reflector is formed with a notch portion that avoids interference with an electronic component disposed on one surface of the substrate of each light emitting module. Steps are formed in the adjacent light emitting module placement portions of the instrument body, and the light emitting module substrates placed in the adjacent light emitting module placement portions are arranged so as to overlap each other when viewed from one side of the instrument body,
The level | step difference corresponding to the level | step difference of the light emission module arrangement | positioning part of an instrument main body is formed in each reflective surface and adjacent board | substrate holding | suppressing part which are adjacent to a reflector, The Claim 1 thru | or 4 characterized by the above-mentioned. Lighting device.

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