JP2016162732A - Luminaire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a luminaire capable of enhancing heat radiation properties of both a light-emitting module and a circuit component.SOLUTION: A luminaire 10 includes: a light-emitting module 17; a substrate 16 which has an opening in which an optical axis of the light-emitting module 17 passes, and on which a circuit component 16b for supplying power to the light-emitting module 17 is mounted; and a base 13 which is arranged opposing to the substrate 16. The base 13 has a first surface 13g to which the light-emitting module 17 is directly connected, and a second surface 13h to which the substrate 16 is connected via a heat radiation member 16d and an insulation sheet 20 and which has height different from that of the first surface 13g, on the substrate 16 side.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an illumination device used for a downlight or the like.

  Solid-state light-emitting elements such as LEDs are expected as light sources for various products because of their small size, high efficiency, and long life. Among them, in recent years, research and development of lighting devices using LEDs have been promoted.

  For example, an LED unit (LED lamp) having a flat thin structure has been proposed as an illumination device used for downlights and spotlights (see, for example, Patent Documents 1 and 2).

JP 2012-22994 A JP 2012-109156 A

  By the way, in an illuminating device including a light emitting module (hereinafter also referred to as a light emitting device) and a substrate on which circuit components for supplying power to the light emitting module are mounted, not only the heat dissipation of the light emitting device but also the circuit components. It is necessary to improve the heat dissipation.

  The present invention provides an illuminating device that can improve heat dissipation of both the light emitting device and the circuit component.

  An illumination device according to one embodiment of the present invention includes a light-emitting device, a substrate having an opening through which an optical axis of the light-emitting device passes, and a circuit component for supplying power to the light-emitting device. A base disposed opposite to the base, wherein the base has a first surface to which the light emitting device is thermally connected to the substrate, and the substrate is thermally connected to the first surface. One surface and a second surface having different heights.

  According to the present invention, the heat dissipation of both the light emitting device and the circuit component can be improved.

FIG. 1 is an external perspective view of the lighting apparatus according to Embodiment 1. FIG. 2 is a partially exploded perspective view of the lighting apparatus according to Embodiment 1. FIG. FIG. 3 is a cross-sectional view of the lighting device according to Embodiment 1 cut along a YZ plane. FIG. 4 is a cross-sectional view of the lighting device according to Modification 1 cut along a YZ plane. FIG. 5 is a cross-sectional view of the lighting device according to Modification 2 cut along a YZ plane. FIG. 6 is a perspective view of a downlight according to the second embodiment. FIG. 7 is a perspective view of the spotlight according to the second embodiment.

  Hereinafter, embodiments will be specifically described with reference to the drawings. It should be noted that each of the embodiments described below shows a comprehensive or specific example. The numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements, steps, order of steps, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, and the overlapping description may be abbreviate | omitted or simplified.

(Embodiment 1)
[Constitution]
Hereinafter, the configuration of the lighting apparatus according to Embodiment 1 will be described with reference to FIGS. FIG. 1 is an external perspective view of the lighting apparatus according to Embodiment 1. FIG. 2 is a partially exploded perspective view of the lighting apparatus according to Embodiment 1. FIG. FIG. 3 is a cross-sectional view of the lighting device shown in FIG. 1 cut along a YZ plane.

  The illuminating device 10 shown by FIGS. 1-3 is an illuminating device used as a downlight or a spotlight, for example. The lighting device 10 includes a translucent panel 11, a housing 12, a base 13, a reflecting member 14, a sealing member 15, a substrate 16, a light emitting module 17, a cable sealing member 18a, and an inspection device. A seal member 18b, a seal member 19, an insulating sheet 20, and a screw 21 (not shown in FIG. 2) are provided.

  1 and 2, the central axis (hereinafter also simply referred to as axis J) of the illumination device 10 is also illustrated. The axis J is an axis that coincides with the optical axis of the light emitting module 17. In FIG. 3, the circuit component 16b mounted on the substrate 16 and the power cable 16c are not shown.

  In FIGS. 1 and 2, the Z-axis direction is, for example, the vertical direction, and the Z-axis + side may be described as the upper side or the light emission side. Further, the Z-axis-side may be described as the lower side or the installation surface side. The X-axis direction and the Y-axis direction are directions orthogonal to each other on a plane (horizontal plane) perpendicular to the Z-axis. Hereinafter, each component of the illumination device 10 will be described.

<Translucent panel>
The translucent panel 11 is an optical member made of a translucent material to extract light emitted from the light emitting module 17 to the outside. Specifically, the translucent panel 11 is a cap-shaped (lid-shaped) optical member, and a planar view shape (a shape viewed from the direction of the axis J) is a circle partially cut away from the outer peripheral side. Shape (substantially circular shape).

  The translucent panel 11 may have specific optical characteristics such as functioning as a Fresnel lens. Further, the translucent panel 11 may be provided with dimples for suppressing unevenness of light emitted from the translucent panel 11. In this case, the dimples are provided, for example, on the light emission side surface (light emission surface) of the translucent panel 11.

  Three screw insertion holes 11 b are provided in the peripheral portion of the translucent panel 11. A screw 21 is inserted through the screw insertion hole 11b. Further, three groove portions 11 d are provided on the side surface (side portion) of the translucent panel 11. The groove part 11d forms a groove extending in the Z-axis direction together with a groove part 12f described later. The formed groove is a groove for connecting the lighting device 10 to a heat sink (apparatus body) separate from the lighting device 10 by a connection screw (not shown).

  The translucent panel 11 is arrange | positioned at the light-projection side of the housing | casing 12 so that the output port of the reflection member 14 may be block | closed. Moreover, the translucent panel 11 is arrange | positioned in the direction in which the light emitting module 17 emits light, and the translucent panel 11 and the light emission part 17b oppose. The translucent panel 11 is formed of a resin material such as acrylic (PMMA) or polycarbonate (PC).

  The translucent panel 11 may have a transparent structure without light diffusibility, or may have a diffusion structure with light diffusibility. For example, a translucent panel having a light diffusing function by forming a milky white light diffusing film by applying a resin or white pigment containing a light diffusing material such as silica or calcium carbonate to the inner surface of the translucent panel 11 11 can be configured. Further, by forming minute irregularities on the translucent panel 11, the translucent panel 11 having a light diffusion function can be configured.

<Case>
The housing 12 is a cylindrical (more specifically, substantially cylindrical) member that surrounds the light emitting module 17, the substrate 16, and the base 13 from the side. The housing 12 has a first opening formed on the light emitting side and a second opening formed on the side opposite to the light emitting side. The exit portion of the reflecting member 14 is disposed in the first opening, and the entrance portion of the reflecting member 14 is disposed in the second opening.

  Three fixing portions 12 a (bosses) having screw insertion holes 12 b are provided on the inner surface of the housing 12. A screw 21 is inserted through the screw insertion hole 12b. In addition, on the outer surface of the housing 12, three groove portions 12f that form grooves together with the above-described groove portion 11d are provided.

  Three positioning notches 12h into which the fixing portion 13a of the base 13 is fitted are provided at the lower (Z-axis-side) end of the side portion of the housing 12. The notch 12 h is a positioning structure of the base 13 with respect to the housing 12 provided in the housing 12. The end is also provided with a notch 12i for passing a power cable 16c that electrically connects the substrate 16 and the external power supply.

  The housing 12 is formed of an insulating resin material such as PBT (polybutylene terephthalate). Note that the housing 12 may be made of metal.

  Note that the outer shape of each of the reflection member 14, the seal member 15, and the substrate 16 described below in plan view is a shape that is cut out according to the fixing portion 12a and the groove portion 12f.

<Base>
The base 13 is a member that supports the light emitting module 17 and also functions as a heat sink (heat conducting member) for the light emitting module 17 and the substrate 16. Specifically, the base 13 includes a bottom portion 13f and an annular convex portion 13d.

  The bottom portion 13f is a substantially circular plate-like portion positioned below the base 13 and covers the second opening of the housing 12 from below.

  Three fixing portions 13a having screw holes 13b are provided on the peripheral portion of the bottom portion 13f. The screw hole 13 b is threaded on the inner peripheral surface corresponding to the screw 21. The fixing portion 13a is a convex portion protruding upward (Z axis + side) from the bottom portion 13f, and is fitted into the notch 12h.

  Further, three connection holes 13c through which connection screws are inserted are provided in the peripheral portion of the bottom portion 13f. In addition, a notch 13e for passing a power cable 16c for electrically connecting the substrate 16 and an external power source is provided at the end of the bottom 13f.

  The annular convex portion 13d is a portion of the base 13 that protrudes annularly upward from the bottom portion 13f. The lower surface of the substrate 16 is connected to the second surface 13h, which is the upper surface of the annular convex portion 13d, via the heat radiation member 16d and the insulating sheet 20. The second surface 13h is a flat surface, but may be a curved surface.

  A concave portion 13k, which is a space surrounded by the annular convex portion 13d, is provided in the upper center portion of the base 13. The recess 13k is a space in which the light emitting module 17 is accommodated. The lower surface of the light emitting module 17 (substrate 17a) is directly connected to the first surface 13g which is the bottom surface of the recess 13k (the surface of the base 13 that forms the bottom of the recess 13k). The first surface 13g is a flat surface, but may be a curved surface.

  Specifically, the base 13 as described above is made of a metal material such as aluminum, but may be made of a resin material having a high thermal conductivity.

<Reflection member>
The reflection member 14 is a member having a reflection function, and includes an incident port that is an opening through which light from the light emitting module 17 is incident and an output port that is an opening through which light incident from the incident port is emitted. The reflection member 14 has a truncated cone shape that is configured so that the inner diameter gradually increases from the incident port toward the output port. Specifically, the reflecting member 14 has a trumpet shape (funnel shape).

  The entrance portion of the reflecting member 14 surrounds the light emitting portion 17 b of the light emitting module 17. The inner surface of the reflecting member 14 is a reflecting surface that reflects light emitted from the light emitting module 17. The reflecting surface is configured to reflect light incident from the incident port and output from the output port. That is, the light emitted from the light emitting module 17 by the reflecting member 14 is guided to the translucent panel 11.

  The reflecting member 14 can be made of, for example, a hard white resin material having insulating properties. In addition, in order to improve the appearance of the reflecting surface or to control the light distribution of the lighting device 10, the inner surface of the reflecting member 14 is formed by a metal vapor deposition film (metal reflecting film) made of a metal material such as silver or aluminum. It may be coated. Moreover, the reflecting member 14 may be formed using a metal material having a higher reflectance than a resin material such as aluminum.

<Board>
The substrate 16 is a substantially annular (doughnut-shaped) substrate on which circuit components 16b for supplying power to the light emitting module 17 are mounted. The substrate 16 has an opening through which the optical axis (axis J) of the light emitting module 17 passes. A part of the substrate 16 is cut out from the outer peripheral side. The substrate 16 is disposed inside the housing 12 and outside the reflecting member 14. The substrate 16 may be configured in a substantially C shape.

  The substrate 16 is a so-called printed substrate on which metal wiring is patterned. As the substrate 16, a ceramic substrate, a resin substrate, a metal base substrate, or the like is used.

  A circuit component 16b for supplying power to the light emitting module 17 (light emitting unit 17b) is provided on the upper surface of the substrate 16, and a drive circuit is configured by the circuit component 16b. The drive circuit converts electric power supplied from the outside through the power cable 16 c into electric power suitable for light emission of the light emitting module 17 and outputs it. Note that the power supplied from the outside to the drive circuit may be DC power or AC power. In Embodiment 1, AC power is supplied to the drive circuit, and the drive circuit includes a power supply circuit that converts AC power supplied from an external power source into DC power.

  The circuit component 16b constituting the drive circuit includes, for example, a capacitive element such as an electrolytic capacitor or a ceramic capacitor, a resistance element, a coil element, a choke coil (choke transformer), a noise filter, and a semiconductor element such as a diode or an integrated circuit element. It is.

  A plurality of heat radiation members 16d are provided on the lower surface of the substrate 16 in addition to a part of the circuit components 16b constituting the drive circuit. The heat radiating member 16d is a sheet having a rectangular shape in plan view, and is a member for releasing heat generated in the substrate 16 (drive circuit) to the base 13. Specifically, the heat radiating member 16d is a resin sheet having a high thermal conductivity, such as a silicon sheet or an acrylic sheet. The heat dissipating member 16d may be heat dissipating grease or a potting material.

<Light emitting module>
The light emitting module 17 is an example of a light emitting device, and emits light of a predetermined color (wavelength) such as white. The light emitting module 17 is screwed to the base 13 and emits light by electric power supplied from a drive circuit mounted on the substrate 16. The light emitted from the light emitting module 17 passes through the translucent panel 11 and is emitted to the outside of the illumination device 10. The drive circuit (substrate 16) and the light emitting module 17 are electrically connected by a cable (not shown) provided with a connector at the end.

  The light emitting module 17 includes a substrate 17a, a light emitting unit 17b, and an attachment member 17c. The light emitting module 17 has a COB (Chip On Board) structure in which LEDs (light emitting elements) are directly mounted on the upper surface of the substrate 17a. Although not shown, a predetermined shape of metal wiring for electrically connecting the LEDs and terminals for receiving power for causing the LEDs to emit light are provided on the substrate 17a.

  As the substrate 17a, a ceramic substrate, a resin substrate, or a metal base substrate can be used. Although the planar view shape of the board | substrate 17a is a rectangle, polygons, such as a hexagon and an octagon, or circular may be sufficient. The lower surface of the substrate 17 a is directly connected to the first surface 13 g of the base 13.

  The light emitting unit 17b is provided on the upper surface of the substrate 17a by sealing a plurality of LEDs with a sealing member. The attachment member 17 c is a resin connection member for attaching the light emitting module 17 to the base 13. The mounting member 17 c also has a function of connecting the light emitting module 17 and the end of the reflecting member 14 on the incident port side.

<Seal member>
The lighting device 10 includes the following various sealing members in order to improve waterproofness or dustproofness.

  The seal member 15 is a deformed ring-shaped resin member having elasticity. The seal member 15 is sandwiched between the translucent panel 11 and the housing 12. Specifically, the sealing member 15 is configured such that the screw 21 is tightened to fix the translucent panel 11 and the housing 12, thereby allowing the end surface of the translucent panel 11 and the first opening side of the housing 12 to be fixed. It is sandwiched between the end faces of That is, the sealing member 15 seals between the end surface of the translucent panel 11 and the end surface on the first opening side of the housing 12.

  The cable sealing member 18a is an elastic resin member. The cable sealing member 18a is inserted with a power cable 16c for the substrate 16 (driving circuit) to receive power from an external power source, and seals the inside of the case. Specifically, the power cable 16 c is inserted into the cable seal member 18 a through the gap formed by the notches 12 i and 13 e and connected to the substrate 16.

  The inspection seal member 18b is a resin member that closes a hole for injecting air in order to inspect the airtightness of the lighting device 10 after the inspection.

  The seal member 19 is a so-called O-ring, and is an annular resin member having elasticity. The seal member 19 is sandwiched between the base 13 and the housing 12 and seals between the base 13 and the housing 12. More specifically, the seal member 19 is sandwiched between the outer surface of the annular protrusion 13d and the inner surface of the housing 12 using the annular protrusion 13d.

  As described above, the seal member 15, the cable seal member 18a, the inspection seal member 18b, and the seal member 19 are specifically formed of rubber, elastomer, or the like.

<Insulation sheet>
The insulating sheet 20 is a member that is provided between the substrate 16 and the base 13 and ensures the insulation of the substrate 16. As described above, in the first embodiment, some circuit components 16b are also provided on the lower surface of the substrate 16, and the base 13 facing the lower surface of the substrate 16 is formed of metal. For this reason, in the lighting device 10, the insulating sheet 20 is provided between the substrate 16 and the base 13. The insulating sheet 20 is, for example, an insulating resin sheet. Note that the insulating sheet 20 may not be provided if the insulation between the substrate 16 and the base 13 can be secured.

[Feature structure]
The illumination device 10 is characterized by the structure of the base 13. Such a characteristic structure will be described with reference to FIGS.

  As described above, the lighting device 10 includes the light emitting module 17, the substrate 16 having the opening through which the optical axis of the light emitting module 17 passes and the circuit component 16 b for supplying power to the light emitting module 17 mounted thereon, 16 and a base 13 disposed to face the same.

  Here, in the illuminating device 10, a heat dissipating structure that releases heat generated in the substrate 16 (circuit component 16 b) and heat generated in the light emitting module 17 to the outside through the base 13 is employed. That is, each of the substrate 16 and the light emitting module 17 is thermally connected to the base 13.

  Specifically, the base 13 includes a first surface 13g to which the lower surface of the light emitting module 17 is connected, and a second surface 13h to which the lower surface of the substrate 16 is connected via the heat dissipation member 16d and the insulating sheet 20. On the substrate 16 side. According to such a heat dissipation structure, since the substrate 16 and the light emitting module 17 are thermally connected to the base 13 having high thermal conductivity, heat dissipation of both the light emitting module 17 and the circuit component 16b (substrate 16). Efficient heat dissipation is realized. Further, by connecting the base 13 to a heat sink (apparatus body) having a larger heat capacity, the heat of the circuit component 16b and the light emitting module 17 can be radiated to the heat sink.

  By the way, in such a heat dissipation structure, restrictions on component arrangement increase, and the lighting device 10 may be increased in size. This will be specifically described below.

  In the illumination device 10, the width of the light emitting module 17 in the X-axis direction is longer than the width of the opening of the substrate 16 in the X-axis direction. In other words, a part of the light emitting module 17 overlaps the substrate 16 when viewed from the direction of the optical axis (axis J). Therefore, if the height from the lower surface 13i (illustrated in FIG. 3) of the base 13 to the first surface 13g is the same as the height from the lower surface 13i to the second surface 13h, the substrate 16 and the light emission. The module 17 interferes. As a countermeasure, when the opening of the substrate 16 is widened, the outer shape of the substrate 16 is increased to secure the mounting area of the circuit component 16b, and the lighting device 10 is increased in size.

  In view of the above points, in the lighting device 10, the height of the first surface 13g is different from the height of the second surface 13h. Specifically, the second surface 13h is located closer to the substrate 16 than the first surface 13g. Therefore, in the lighting device 10, the substrate 16 and the light emitting module 17 can be three-dimensionally crossed, and the degree of freedom of component arrangement is ensured. And size reduction of the illuminating device 10 is realizable by carrying out the three-dimensional intersection of the board | substrate 16 and the light emitting module 17. FIG.

  As described above, in the lighting device 10, the heat dissipation is improved and the degree of freedom of component placement is ensured.

  Note that the light emitting module 17 may be connected to the first surface 13g directly or via another member. For example, a heat conductive sheet or heat radiation grease is provided between the light emitting module 17 and the first surface 13g. A heat radiating member such as may be interposed. Similarly, the substrate 16 may be directly connected to the second surface 13h.

[Modification 1]
In the lighting device 10, the second surface 13h is located closer to the substrate 16 than the first surface 13g, but the first surface 13g is located closer to the substrate 16 than the second surface 13h. May be.

  Hereinafter, the illuminating device 10 which concerns on the modification 1 is demonstrated. FIG. 4 is a cross-sectional view of the lighting device according to Modification 1 cut along a YZ plane. In FIG. 4, components that are substantially the same as those of the lighting device 10 described above are denoted by the same reference numerals, and description of such components is omitted in the following description of Modification 1.

  A base 113a provided in the illumination device 10a illustrated in FIG. 4 includes a base main body 113f and a convex portion 113d protruding from the center portion of the base main body 113f to the substrate 16 side. The light emitting module 17 is directly connected to the first surface 113g which is the upper surface of the convex portion 113d.

  The upper surface of the base body 113f is a second surface 113h, and the substrate 16 is connected via the heat dissipation member 16d and the insulating sheet 20. The second surface 113h is an annular surface surrounding the convex portion 113d in plan view.

  Thus, the first surface 113g may be located closer to the substrate 16 than the second surface 113h. Even in such a configuration, since the substrate 16 and the light emitting module 17 can be three-dimensionally crossed, the degree of freedom of component arrangement can be ensured and the heat dissipation can be enhanced.

  Note that the configuration in which the second surface 13h is located closer to the substrate 16 than the first surface 13g as in the lighting device 10 described above is the distance (optical path) from the light emitting module 17 to the translucent panel 11. Long) is easy to ensure, and optically good characteristics can be obtained.

  On the other hand, in the configuration in which the first surface 113g is located closer to the substrate 16 than the second surface 113h as in the lighting device 10a, a component having a small bottom area and a tall height is disposed on the substrate 16. Thus, there is an advantage that the area of the substrate 16 can be reduced and the outer diameter of the lighting device 10a can be reduced.

  Further, in the lighting device 10a, the convex portion 113d may have a size that can support at least the stacking portion of the substrate 17a and the mounting portion (screw portion or the like) of the mounting member 17c. For example, the area of the convex 113d in plan view can be made smaller than the area of the light emitting module 17. Thereby, since the opening of the board | substrate 16 can be made small, the effective area of the board | substrate 16 can be enlarged and the outer diameter of the illuminating device 10a can be made further smaller.

[Modification 2]
The base 13 of the lighting device 10 may be provided with a groove for dividing the heat dissipation path from the light emitting module 17 to the base 13 and the heat dissipation path from the substrate 16 to the base 13. FIG. 5 is a cross-sectional view of the lighting device according to Modification 2 cut along a YZ plane. In FIG. 5, components that are substantially the same as those of the lighting device 10 described above are denoted by the same reference numerals, and description of such components is omitted in the following description of Modification 2.

  The base 113b provided in the illumination device 10b shown in FIG. 5 is provided with a groove 13j on the first surface 13g so as to surround the light emitting module 17. That is, the shape of the groove 13 j when viewed from the direction of the optical axis (axis J) is an annular shape along the outer shape of the light emitting module 17. By providing such a groove 13j, the heat dissipation path from the light emitting module 17 to the base 13 and the heat dissipation path from the substrate 16 to the base 13 can be divided.

  Such a configuration is useful in the case where the heat radiation of the other is deteriorated by heat generated in one of the substrate 16 and the light emitting module 17.

(Embodiment 2)
In the second embodiment, a specific configuration in the case where the lighting device (the lighting devices 10, 10a, and 10b) according to the first embodiment is used as a downlight will be described. FIG. 6 is a perspective view of a downlight according to the second embodiment.

  As shown in FIG. 6, the downlight 100 is an embedded illumination device that illuminates light downward (such as a hallway or a wall) by being embedded in a ceiling of a house or the like, for example. In the fixture main body 110 of the downlight 100, the illumination device according to the first embodiment is accommodated. At this time, the Z axis + side in the first embodiment is the main emission direction of the light of the downlight 100. Note that the connection hole 13c and the connection screw described in the first embodiment are used to attach the lighting device to the fixture body 110.

  The appliance body 110 is a mounting base to which the base of the lighting device is attached by the connection screw, and is a heat sink that dissipates heat generated by the lighting device. The instrument main body 110 is made of, for example, aluminum die casting. A plurality of heat radiating fins are provided on the upper portion (ceiling side portion) of the instrument main body 110.

  The terminal block 160 is attached to a mounting plate 170 separate from the instrument body 110. The attachment plate 170 is a rectangular plate member made of a metal material, and the terminal block 160 is attached to the lower surface. The attachment plate 170 is connected to the top plate 180 attached to the upper part of the instrument main body 110.

  Thus, although the illuminating device which concerns on Embodiment 1 can be used as a downlight, you may be used as another illuminating device. For example, the lighting device according to Embodiment 1 may be used as a spotlight. FIG. 7 is a perspective view of the spotlight according to the second embodiment.

  As shown in FIG. 7, the spotlight 200 includes a cover 210, a lamp 220, and an arm 230.

  The lighting device according to Embodiment 1 is housed inside the lamp 220, and light emitted from the lighting device passes through the cover 210 and is emitted to the outside of the spotlight 200. The lamp 220 and the arm 230 are fixed by a fixing member such as a screw.

  Thus, the illumination device according to Embodiment 1 can be used as a spotlight. Note that the illumination device according to Embodiment 1 can also be used as an illumination device other than the downlight and the spotlight. Since the lighting device according to Embodiment 1 includes a seal member, the lighting device is particularly useful as an outdoor lighting device such as lighting attached to a low pole or underground lighting.

(Other embodiments)
Although the lighting device according to the embodiment has been described above, the present invention is not limited to such an embodiment.

  Moreover, in the said embodiment, although the light emitting module was a light emitting module of the COB structure, it may be a SMD (Surface Mount Device) type.

  In the above embodiment, the light emitting module uses an LED as a light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, or a solid light emitting element such as an organic EL (Electro Luminescence) or an inorganic EL may be used. Good.

  As mentioned above, although the illuminating device which concerns on one or several aspects was demonstrated based on embodiment, this invention is not limited to this embodiment. Unless it deviates from the gist of the present invention, various modifications conceived by those skilled in the art have been made in this embodiment, and forms constructed by combining components in different embodiments are also within the scope of one or more aspects. May be included.

10, 10a, 10b Illuminating device 12 Housing 13, 113a, 113b Base 13g, 113g First surface 13h, 113h Second surface 13j Groove 19 Seal member 16 Substrate 16b Circuit component 16d Heat radiation member 17 Light emitting module (light emitting device) )

Claims (9)

A light emitting device;
A substrate having an opening through which the optical axis of the light emitting device passes, and on which circuit components for supplying power to the light emitting device are mounted;
A base disposed opposite to the substrate,
The base is on the substrate side,
A first surface to which the light emitting device is thermally connected;
A lighting device comprising: the first surface to which the substrate is thermally connected; and a second surface having a different height. The lighting device according to claim 1, wherein the second surface is located closer to the substrate than the first surface. The lighting device according to claim 1, wherein the first surface is located closer to the substrate than the second surface. The first surface is connected to the light emitting device directly or via another member,
The lighting device according to claim 1, wherein the substrate is connected to the second surface directly or through another member. The light emitting device is directly connected to the first surface;
The lighting device according to claim 1, wherein the substrate is connected to the second surface via a heat dissipation member. further,
A cylindrical housing surrounding the light emitting device, the substrate, and the base from the side;
A seal member sandwiched between the base and the housing;
The illuminating device of any one of Claims 1-5. The illumination device according to any one of claims 1 to 6, wherein a part of the light emitting device overlaps the substrate when viewed from the direction of the optical axis. The lighting device according to claim 1, wherein the second surface surrounds the first surface when viewed from the direction of the optical axis. The lighting device according to claim 8, wherein a groove is provided on the first surface so as to surround the light emitting device.

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