JP2009140718A - Lighting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting apparatus improved in performance of radiating heat from an LED and suppressing mutual heat interference between the LED and a circuit component. <P>SOLUTION: The lighting apparatus 1 includes a device substrate 2, the LED 11, the circuit component 25, a radiating member 31 and an air vent (ventilating means) 32. The substrate 2 is formed by laminating an insulating layer 4 on one surface of a metal base layer 3, has a plurality of through-holes 5 formed through the substrate 2 and is partitioned into an element mounting area 2a and a circuit component mounting area 2b by the through-holes. The LED 11 is mounted in the area 2a and the circuit component 25 is mounted in the area 2b. The radiating member 25 of the size almost equal to that of the device substrate 2 is attached to the substrate 2 in contact with at least a back surface of the area 2a to conduct heat from the metal base layer 3 directly to the area. The plurality of air vents 32 are formed in communication with the substrate through-holes 5. Heat conduction between the radiating member 31 and the circuit component mounting area 2b is suppressed through the air vents 32 to suppress mutual heat interference between the LED 11 and the circuit component 25 via the radiating member 31. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a lighting device that includes a plurality of semiconductor light emitting elements such as LEDs (light emitting diodes) as a light source, and is embedded in or directly attached to a mounted portion such as a ceiling.

Conventionally, a resin-based printed circuit board is divided into a first region in which an LED is mounted and a second region in which a heating element among elements constituting the LED control circuit is mounted. By forming a slit-shaped through hole at the boundary with the two regions, the heat generated in the second region is restricted from being conducted to the first region, making the LED less susceptible to heat from the control circuit, and a printed circuit board. An LED mounting printed circuit board that realizes double-sided mounting and an LED lighting device using the same are known (for example, see Patent Document 1).
JP 2006-147333 A (paragraphs 0002-0024, FIGS. 1-2)

  In the technique described in Patent Document 1, the area of the first region where the LED is mounted is made larger than the area of the second region where the heating element such as a resistor is mounted, and a heat dissipation pattern is formed in the region including the LED. Thus, heat dissipation is promoted from the surface of the first region. However, in such a configuration in which heat is radiated directly from the printed circuit board to the atmosphere, it is difficult to respond to a request for further increase in luminance of the lighting device by suppressing the temperature rise of the LED.

  It is known that a heat radiating member may be combined with a printed circuit board to effectively release the heat generated by the LED. However, since the technique of Patent Document 1 realizes double-sided mounting, the heat radiating member cannot be directly mounted on the printed circuit board, and it is necessary to take some measures.

  In addition, a heat dissipation member can be directly mounted on a surface opposite to the mounting surface of a printed circuit board that is mounted on one side at the expense of double-sided mounting. However, even in this case, sufficient heat dissipation cannot be expected because heat conduction from the resin-based printed board to the heat dissipation member is not good. In addition, the larger the heat dissipation member, the better the heat dissipation performance. However, when the heat dissipation member is large enough to cover the first region and the second region, mutual heat interference between the LED and the heat generating element occurs via the heat dissipation member. Since it becomes easier, consideration is required to prevent this from happening.

  The objective of this invention is providing the illuminating device which can suppress the mutual heat interference of a semiconductor light-emitting device and a circuit component while improving the thermal radiation performance of a semiconductor light-emitting device.

  According to a first aspect of the present invention, an insulating layer is laminated on one surface of a metal base layer, and a plurality of substrate through-holes penetrating both layers are provided, and an element mounting region and a circuit component mounting region are formed by the substrate through-holes. A semiconductor substrate mounted on the element mounting region; a circuit component mounted on the circuit component mounting region; and a size approximately equal to or larger than the device substrate. A heat dissipating member mounted on the device substrate in contact with at least the back surface of the element mounting region; and a ventilation provided to communicate with the substrate through-holes to suppress heat conduction between the heat dissipating member and the circuit component mounting region. And means.

  In the invention of claim 1, an LED, an organic EL element or the like can be used as the semiconductor light emitting element. According to the first aspect of the present invention, the back surface of the metal base layer, that is, the other surface of the device substrate on which circuit components are not mounted, is thinner than the metal base layer and radiates heat from the metal base layer, for example, in order to prevent rust of the metal base layer. A thin back insulating layer may be provided so as not to substantially hinder heat conduction to the member.

  According to the first aspect of the present invention, although the device substrate is mainly formed of the metal base layer, thermal conduction between the device mounting region and the circuit component mounting region of the device substrate is suppressed by the plurality of substrate through holes. Thus, mutual thermal interference between the semiconductor light emitting element and the circuit component via the device substrate can be suppressed. In addition, although the heat dissipating member is approximately equal to or larger than the device substrate, mutual heat interference between the semiconductor light emitting element and the circuit component through the device substrate, which is easy to conduct heat, is suppressed by the ventilation means. The In addition, since the heat dissipation member is in contact with at least the element mounting region and directly receives the heat of the metal base layer, the heat dissipation performance of the semiconductor light emitting element is improved as the heat generated by the semiconductor light emitting element is released to the outside from the heat dissipation member it can. And since the said ventilation | gas_flowing means becomes a channel | path through which the airflow produced with the temperature of a heat radiating member passes, the heat dissipation performance from a heat radiating member can further be improved.

  According to a second aspect of the present invention, in the first aspect, the heat radiating member is also in contact with the back surface of the circuit component mounting region, and the ventilation unit is individually opposed to the substrate through-holes to the heat radiating member. A plurality of communication holes are provided.

  In the invention of claim 2, since the heat dissipation member is not only in contact with the element mounting region, but also in contact with the circuit component mounting region, the component that generates heat in the circuit components mounted in the circuit component mounting region The heat generated by can be directly transmitted to the heat radiating member and released to the outside.

  The invention of claim 3 is the air gap according to claim 1, wherein the ventilation means is formed between the heat radiating member and the back surface of the device substrate and is open to the peripheral surface side of the heat radiating member, It is characterized by facing all the substrate through holes.

  In this invention of Claim 3, since the length of the path | route through which the airflow produced with the heat | fever of a heat radiating member passes can be ensured more than the thickness of a heat radiating member, heat dissipation performance can be improved more.

  According to a fourth aspect of the present invention, in the first to third aspects of the present invention, an input side wiring pattern portion and an output side wiring pattern extending over the element mounting region and the circuit component mounting region among the wiring patterns provided on the insulating layer. The portions are separately passed through gaps formed between the plurality of substrate through holes.

  In the invention of claim 4, the input side wiring pattern portion and the output side wiring pattern portion are not passed through one of the gaps formed between the substrate through holes. Therefore, electrical insulation between the input-side wiring pattern portion and the output-side wiring pattern portion can be ensured without taking special insulation measures.

  According to a fifth aspect of the present invention, in the first to fourth aspects of the present invention, the plurality of substrate through holes are arranged in a ring shape, the inner side being the element mounting region and the outer side being the circuit component mounting region, An annular partition member surrounding the semiconductor light emitting element group is mounted in an element mounting region, and a convex portion passing through a gap formed between the substrate through holes is integrally projected on the partition member, and A translucent sealing member that seals the semiconductor light emitting element is stored inside the partition member.

  In this invention of Claim 5, between the board | substrate through-holes of an apparatus board | substrate can be reinforced with the convex part integral with the partition member which stores a sealing member. Accordingly, it is possible to improve the handleability of the device substrate on which the partition member is mounted while compensating for the decrease in strength of the device substrate due to the plurality of substrate through holes. In order to further improve the handleability, it is preferable that the convex portion reaches the peripheral edge of the apparatus substrate and is preferably formed higher than the partition member. good.

  According to a sixth aspect of the present invention, in the first to fifth aspects of the present invention, a connector device is disposed in the circuit component mounting region, and the connector device covers the opening opened in the circuit component mounting region. A receiving connector fixed above, and a plug-in connector that is passed through the opening and accommodated in the receiving connector and connected to the receiving connector, the receiving connector facing the opening A pair of terminal fittings having a receiving side contact and connected to the wiring pattern on the insulating layer, wherein the insertion side connector is detachably inserted and connected to the receiving side contact. It is characterized by having.

  In the invention of claim 6, the insertion side connector is inserted into the opening of the apparatus substrate, and the insertion side contact is connected to the reception side contact of the reception side connector, whereby the reception side connector and the insertion side connector are coupled. The power supply to the wiring pattern can be realized from the back side of the device substrate. At the same time, in the coupled state, at least a part of the insertion-side connector is accommodated in the receiving-side connector, and a portion protruding from the receiving-side connector is passed through the opening of the apparatus substrate. The thickness of the connector device can be reduced by at least the thickness corresponding to the thickness of the device substrate.

  According to the illumination device of the first aspect, the heat dissipation performance of the semiconductor light emitting element can be improved, and the mutual thermal interference between the semiconductor light emitting element and the circuit component can be suppressed.

  According to the lighting device of the second aspect, in the invention of the first aspect, the heat generated by the component that generates heat among the circuit components mounted in the circuit component mounting region is directly transmitted to the heat radiating member to be externally provided. Can be released.

  According to the lighting device of the third aspect, in the invention of the first aspect, the passage length of the airflow flowing along the heat radiating member is ensured more than the thickness of the heat radiating member, so that the heat radiating performance can be further improved.

  According to the illumination device of claim 4, in the inventions of claims 1 to 3, electrical insulation between the input side wiring pattern portion and the output side wiring pattern portion can be further secured without taking any special measures against insulation.

  According to the lighting device of claim 5, in the invention of claims 1 to 4, the handling of the device substrate on which the partition member is mounted can be improved by supplementing the strength reduction of the device substrate due to the plurality of substrate through holes. .

  According to a lighting device of a sixth aspect, in the invention of the first to fifth aspects, the power supply from the back side of the device substrate to the wiring pattern can be realized by coupling the receiving side connector and the insertion side connector, and the coupling The thickness of the connector device in the state can be reduced.

  A first embodiment of the present invention will be described with reference to FIGS.

  Reference numeral 1 in the drawing denotes a lighting device, for example, an embedded downlight that is installed in an indoor ceiling (attached portion) (not shown). The downlight 1 includes a device substrate 2, a plurality of semiconductor light emitting elements such as LEDs 11, a partition member 15, a sealing member 21, a plurality of circuit components 25, a heat radiating member 31, a ventilation means, and a connector device 41. It is equipped with.

  The device substrate 2 has a predetermined shape, for example, a disc shape, is formed by laminating an insulating layer 4 on one surface of the metal base layer 3, and has a plurality of substrate through holes 5.

  The metal base layer 3 is made of copper and its alloy, aluminum and its alloy, or the like. The insulating layer 4 is made of an electrically insulating material, preferably a white synthetic resin, such as a white glass epoxy resin. Making the insulating layer 4 white can reflect the light emitted from the LED 11 in the light extraction direction of the downlight 1 (upward in FIG. 1B in this embodiment), Thereby, it is preferable in increasing the light extraction efficiency. The insulating layer 4 is thinner than the metal base layer 3. Therefore, the device substrate 2 is formed mainly with the metal base layer 3.

  As shown in FIG. 1A, a wiring pattern 6 made of a metal foil is provided on the insulating layer 4. In FIG. 1A, only a part of the wiring pattern 6 is shown as a representative, but this wiring pattern is an element connection pattern (not shown), an input side wiring pattern portion 12, an output side wiring, which will be described later. A part connection pattern (not shown) reaching the pattern part 13 and the circuit part 25 is included.

  The plurality of substrate through holes 5 are formed so as to penetrate the metal base layer 3 and the insulating layer 4 as shown in FIG. 1B, and the device substrate 2 is connected to the element mounting region 2a and the circuit component mounting region 2b. It is divided into and. Specifically, in this embodiment, as shown in FIG. 1A, six substrate through holes 5 are arranged in a ring shape. Accordingly, the inner region surrounded by the rows of the substrate through holes 5 is used as an element mounting region 2a, and the outer region of the row of the substrate through holes 5 is used as a circuit component mounting region 2b. Therefore, each substrate through-hole 5 has an arc shape and is provided at regular intervals, for example.

  For example, a chip-like LED that emits blue light is used for each LED 11. These LEDs 11 are bonded to a portion of the insulating layer 4 located in the element mounting region 2a using a die bond material (not shown). Each LED 11 is connected to an element connection pattern (not shown) or the like provided in the element mounting region 2a, and is electrically connected so that, for example, they are lit all at once. Therefore, the input side wiring pattern part 12 and the output side wiring pattern part 13 which make the path | route of the electrical input and output with respect to LED11 group are each one as shown, for example in FIG. 1 (A). In addition, when several LED11 is connected in series and these series circuits are connected in parallel and the series circuit to light can be selected, an output side pattern part is provided according to the number of series circuits. .

  As shown in FIG. 1A, the input-side wiring pattern portion 12 is passed through one gap G1 among the gaps formed between the adjacent substrate through holes 5, and is mounted on the element mounting area 2a and the circuit component mounting. The region 2b is provided. Similarly, the output side wiring pattern portion 13 is passed through a gap G2 different from the gap G1 in the gap formed between the adjacent substrate through holes 5, and the element mounting area 2a and the circuit component mounting area 2b. And is provided over. In the case where a plurality of series circuits are provided as described above, the other output side wiring pattern portion 13 is also passed through different gaps.

  The input side wiring pattern portion 12 and the output side wiring pattern portion 13 thus wired are not passed through the same gap in the gap formed between the substrate through holes 5. Therefore, electrical insulation between the input-side wiring pattern portion 12 and the output-side wiring pattern portion 13 can be ensured without taking any special insulation measures between the input-side wiring pattern portion 12 and the output-side wiring pattern portion 13.

  The partition member 15 is preferably an integrally molded product of white synthetic resin, and has a ring shape as shown in FIG. The diameter of the partition member 15 is smaller than the diameter of the annular row formed by the substrate through-holes 5 and is bonded to the insulating layer 4 with an adhesive (not shown) in the element mounting region 2a. The partition member 15 crosses the input side wiring pattern portion 12 and the output side wiring pattern portion 13. Therefore, the partition member 15 is attached to the device substrate 2 so as to surround the LED 11 group.

  As shown in FIG. 1B, the sealing member 21 is stored inside the partition member 15 and seals each LED 11, element connection pattern, input side wiring pattern portion 12 and part of the output side wiring pattern portion 13. It is provided to stop. The sealing member 21 is made of, for example, a resin-based translucent material, and preferably a transparent silicone resin can be used.

  In the sealing member 21, phosphors (not shown) are preferably dispersed evenly. As the phosphor, a phosphor that is excited by blue light incident from the LED 11 and mainly emits yellow light is used. The yellow light obtained by wavelength conversion by the phosphor and the blue light emitted from the LED 11 are mixed and irradiated, so that illumination with white light can be performed.

  The circuit component 25 forms a lighting circuit for the LED 11 together with the wiring pattern 6 and the like, and is mounted on the insulating layer 4 in the circuit component mounting region 2b. In FIGS. 1A and 1B, only circuit components made up of chip components are shown as representatives. The circuit component 25 is connected to the wiring pattern 6 (this connection is omitted in FIG. 1 for convenience of explanation).

  The heat radiating member 31 is made of aluminum or an alloy thereof thicker than the device substrate 2, and has the same size as the device substrate 2, for example. The size of the heat radiating member 31 can be made larger than that of the device substrate 2 and smaller than the device substrate 2 within a range that does not hinder the formation of the air holes 32 described later or the air gaps described in other embodiments. You can also. Therefore, the heat dissipating member 31 may be formed with a size approximately equal to or larger than that of the device substrate.

  The heat radiating member 31 is mounted on the back surface of the device substrate 2. Specifically, the heat radiating member 31 is fixed by a plurality of screws 33 shown in FIG. 1A in a state where the entire surface thereof is in direct surface contact with the back surface of the metal base layer 3. In the present embodiment, the heat radiating member 31 is mounted not only on the back surface of the element mounting area 2a but also on the back surface of the circuit component mounting area 2b adjacent to the element mounting area 2a. On the other surface (back surface) side of the heat radiating member 31, a plurality of heat radiating fins 31a for increasing the heat radiating area are integrally formed.

  As shown in FIG. 1B, for example, a plurality of ventilation holes 32 are provided in the heat dissipating member 31 so as to penetrate the heat dissipation member 31 in the thickness direction. These vent holes 32 are formed at positions facing the respective substrate through holes 5, and are individually communicated with the respective substrate through holes 5. Therefore, the end of each ventilation hole 32 opposite to the substrate through hole 5 is open to the outer surface of the heat dissipation member 31.

  As shown in FIG. 1A, the connector device 41 is arranged in a circuit component mounting area 2b that is a different area from the element mounting area 2a. As shown in FIGS. 2 and 3, the connector device 41 includes a receiving connector 42 and an insertion connector 46 detachably connected thereto.

  The receiving connector 42 is formed by attaching a pair of terminal fittings 44 to an electrically insulating receiving connector main body 43. As shown in FIGS. 3A and 3B, the receiving connector main body 43 has a relief groove 43a on the inner surface thereof.

  One end of each terminal fitting 44 forms a pattern connecting portion 44a, and the other end of the terminal fitting 44 forms a receiving side contact 44b. The pair of terminal fittings 44 are attached to the receiving connector main body 43 such that the pattern connecting portions 44a protrude from the receiving connector main body 43 to the side and the receiving contacts 44b face each other. As shown in FIG. 3A, the escape groove 43a is provided to face the gap between the receiving contacts 44b facing each other.

  The receiving connector 42 is fixed on the insulating layer 4 in the circuit component mounting region 2b by soldering the pattern connecting portion 44a to the wiring pattern 6. The receiving connector 42 thus fixed to the device substrate 2 covers the opening 2c opened in the circuit component mounting region 2b. In this attached state, the receiving contacts 44b are positioned so as to be perpendicular to the opening 2c, and their tips are opposed to the opening 2c.

  The insertion-side connector 46 is formed by attaching a pair of insertion-side contacts 48 to an electrically insulating insertion-side connector body 47. As shown in FIGS. 3A and 3B, the insertion-side connector main body 47 includes an insulating projection 47a that is located between the pair of insertion-side contacts 48 and electrically insulates them, and both sides of the insulation projection 47a. Has a groove 47b. The groove 47b is formed to have a size capable of accommodating a portion bent at a right angle from the receiving side contact 44b of the terminal fitting 44.

  The insertion side contact 48 is a female type contact that receives the male type reception side contact 44b. The insertion side connector main body 47 is positioned on both sides of the insulating projection 47a with its receiving end face exposed at the bottom surface of the groove 47b. Installed on. Insulating-coated lead wires 49 are connected to the pair of insertion side contacts 48, respectively, and these lead wires 49 are drawn out of the insertion side connector body 47. The lead wire 49 is connected to a power supply circuit (not shown).

  By inserting the insertion side connector 46 through the opening 2c and into the receiving side connector 42, the insertion side connector 46 and the receiving side connector 42 are coupled, and the connector device 41 is as shown in FIG. 3B. Assembled. In this coupled state, the pair of receiving contacts 44b are respectively inserted into the opposed plug-in contacts 48, and the mechanical and electrical connection is maintained. At the same time, a portion bent at a right angle from the receiving side contact 44b of the terminal fitting 44 is accommodated in the groove 47b.

  Due to these couplings by inserting the insertion side connector 46 into the receiving side connector 42, power supply to the wiring pattern 6 is realized from the side opposite to the light irradiation direction of the downlight 1, that is, from the back side of the apparatus substrate 2. it can. In this case, there is no need to bend the lead wire 49. In order to prevent the lead wire 49 of the connector device 41 from hindering the close contact of the heat radiating member 31 with the back surface of the device substrate 2, a wiring groove (not shown) through which the lead wire 49 is passed is provided. Is provided.

  At the same time, in the coupled state, as shown in FIG. 3B, at least a part of the insertion-side connector 46 is accommodated in the receiving-side connector 42, and a portion protruding from the receiving-side connector 42 is an opening of the apparatus substrate 2. 2c. As a result, the thickness of the connector device 41 in the coupled state is reduced by at least the thickness corresponding to the thickness of the device substrate 2. Moreover, the thickness of the connector device 41 can be reduced by an amount corresponding to the plate thickness of the terminal fitting 44 by accommodating the portion bent at a right angle from the receiving side contact 44b of the terminal fitting 44 in the groove 47b. Therefore, the connector device 41 can be made compact in the thickness direction.

  In addition, in the coupled state, the distal end portion of the insulating convex portion 47 a of the insertion side connector 46 is inserted into the escape groove 43 a of the receiving side connector 42, and the insulating convex portion 47 a is interposed between the receiving side contacts 44 b of the pair of terminal fittings 44. Is interposed. As a result, a long creepage distance between the receiving contacts 44b is ensured and electrical insulation of these can be ensured, so that the distance between the receiving contacts 44b can be shortened. Therefore, the connector device 41 can be made compact in the direction in which the pair of terminal fittings 44 are arranged, that is, in the longitudinal direction.

  The power supply to each LED 11 is performed along with the energization of the wiring pattern 6 through the connector device 41, whereby each LED 11 is turned on. By this lighting, the downlight 1 emits white light in the direction of the arrow in FIG.

  When the downlight 1 is turned on, each LED 11 generates heat, and heat generating components such as resistors in the circuit component 25 also generate heat. However, due to heat radiation described below, the temperature rise of each LED 11 is suppressed, and each LED 11 Predetermined light emission performance can be maintained.

  Since the device substrate 2 on which the LED 11 and the circuit component 25 that generate heat are mounted is formed mainly of the metal base layer 3, the heat of the LED 11 and the circuit component 25 is far from the device substrate 2 as compared with the resin substrate. Easy to communicate. The heat of the metal base layer 3 is directly transmitted to the heat dissipation member 31 connected to the metal base layer 3. In this case, the heat of each LED 11 is directly transmitted to the central portion of the heat dissipation member 31 that is in contact with the element mounting region 2 a, and the heat of the circuit component 25 that generates heat is in contact with the circuit component mounting region 2 b of the heat dissipation member 31. Directly communicated to the periphery. The heat of the heat radiating member 31 is released from the heat radiating member 31 having a surface area far larger than the surface area of the device substrate 2 to the surrounding external space.

  In this way, the heat generated by each LED 11 and the like is quickly released from the heat radiating member 31, so that the temperature increase of each LED 11 and the like can be suppressed.

  By the way, although the device substrate 2 is formed mainly of the metal base layer 3, mutual thermal interference between each LED 11 and the circuit component 25 through the device substrate 2 can be suppressed. That is, since the plurality of substrate through holes 5 are provided between the element mounting region 2a and the circuit component mounting region 2b of the device substrate 2 so as to form a boundary between them, the substrate through holes 5 extend over both mounting regions. Heat transfer is suppressed. Thereby, the temperature rise of the circuit component 25 due to the heat of the LED 11 is suppressed.

  Similarly, although the heat dissipation member 31 is the same size as the device substrate 2, mutual thermal interference between each LED 11 and the circuit component 25 through the heat dissipation member 31 can be suppressed. That is, the air vent 32 is provided between the central portion of the heat dissipation member 31 that receives the heat of each LED 11 and the peripheral portion of the heat dissipation member 31 that receives the heat of the circuit component 25 that generates heat. Therefore, the heat transfer across the peripheral portion of the heat radiating member and the central portion of the heat radiating member 31 heated by the LED 11 is suppressed by these vent holes 32. Thereby, the temperature rise of the circuit component 25 due to the heat of the LED 11 is suppressed.

  As described above, the LED 11 and the circuit component 25 are prevented from thermally interfering with each other via the device substrate 2 and the heat dissipation member 31, and the heat of each LED 11 is transmitted through the element mounting region 2 a at the center of the heat dissipation member 31. Therefore, the heat radiation performance of the LED 11 can be improved. At the same time, the heat of the circuit component that generates heat at the peripheral portion of the heat radiating member 31 can be directly received by the peripheral portion of the heat radiating member 31 via the circuit component mounting region 2b and released to the outside.

  In addition, as the temperature of the device substrate 2 and the heat radiating member 31 increases, the substrate through hole 5 and the air vent 32 communicating with each other in the vertical direction become a passage through which an air flow generated by heat of the heat radiating member 31 and the like passes. Therefore, the heat dissipation performance from the heat dissipation member 31 can be further improved.

  A second embodiment of the present invention will be described with reference to FIGS. Since the second embodiment is the same as the first embodiment except for the items described below, the same configurations as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof is omitted.

  In 2nd Embodiment, it replaces with a ventilation hole as ventilation means, and employ | adopts the space | gap 32G. Specifically, the gap 32G includes an annular tapered surface 31b provided on the peripheral portion of the heat radiating member 31 having a size substantially equal to or larger than that of the device substrate 2 so as to face all the substrate through holes 5 and a metal facing the annular tapered surface 31b. It is formed between the periphery of the base layer 3 and the back surface. The gap 32G is open to the peripheral side of the heat radiating member 31 and communicates with all the substrate through holes 5. Therefore, the heat radiating member 31 of the second embodiment is provided in non-contact with the back surface of the circuit component mounting region 2b, and is mounted on the device substrate 2 in surface contact only with the back surface of the element mounting region 2a. The gap 32G is also used as a wiring groove through which the lead wire 49 of the connector device 41 passes.

  Except for the configuration described above, the second embodiment is the same as the first embodiment. Therefore, this 2nd Embodiment can solve the subject of the present invention by obtaining the same operation as the 1st Embodiment.

  In particular, in the second embodiment, the ventilation means is formed by the gap 32G in which the heat radiating member 31 and the back surface of the circuit component mounting region 2b are not in contact with each other, so that heat of the heat radiating member 31 is conducted to the circuit component mounting region 2b. Disappears. Therefore, the mutual thermal interference between the LED 11 and the circuit component 25 through the heat dissipation member 31 can be more reliably suppressed.

  In addition, the air flow generated by the temperature of the heat radiating member 31 flows along the tapered surface 31b and the peripheral surface of the heat radiating member 31 continuous thereto by the tapered surface 31b provided in the heat radiating member 31 to form the gap 32G. . As a result, the length of the passage through which the airflow passes is ensured to be equal to or greater than the thickness of the heat radiating member 31, and the heat radiating area of the heat radiating member 31 is increased. Therefore, the heat radiating performance of the LED 11 by the heat radiating member 31 can be improved.

  A third embodiment of the present invention will be described with reference to FIGS. Since 3rd Embodiment is the same as 2nd Embodiment except the matter demonstrated below, about the same structure as 2nd Embodiment, the same code | symbol as 2nd Embodiment is attached | subjected and the description is abbreviate | omitted.

  In the third embodiment, a plurality of rows of substrate through holes of the device substrate 2 communicating with the gap 32G as the ventilation means are provided. Specifically, a plurality of substrate through holes 5a provided so as to be arranged in a ring shape, and a plurality of substrates provided so as to be arranged in a ring shape with a larger diameter than the ring diameter formed by these substrate through holes 5a The device substrate 2 has a through hole 5b.

  The substrate through holes 5a having an inner annular row and the substrate through holes 5b having an outer annular row are provided alternately as a preferred example. That is, as shown in FIG. 5A, the substrate through-holes 5a are provided so as to face the gaps between the substrate through-holes 5b, and the substrate through-holes 5b are each of the gaps between the substrate through-holes 5a. It is provided so as to oppose. Further, the wiring pattern 6 reaching the input side wiring pattern portion 12, the output side wiring pattern portion 13, and the substrate through hole 5a passes through the gap between the end portions of the substrate through hole 5b as shown in FIG. Wired.

  Except for the configuration described above, the second embodiment is the same as the second embodiment. Therefore, this 3rd Embodiment can solve the subject of the present invention by obtaining the same operation as a 2nd embodiment.

  In addition, in the third embodiment, since each substrate through hole 5a and each substrate through hole 5b are provided so as to be staggered, a heat transfer path extending between the element mounting region 2a and the circuit component mounting region 2b. Is formed in a long and maze shape. Thereby, the heat transfer between the element mounting region 2a and the circuit component mounting region 2b can be further suppressed. At the same time, the amount of airflow flowing through the substrate through-hole 5a and each substrate through-hole 5b and the gap 32G increases, so that the heat dissipation performance of the heat dissipation member 31 can be further improved.

  When the plurality of rows of substrate through-holes described in the third embodiment are applied to the first embodiment, the ventilation holes 32 serving as ventilation means communicating with each of the plurality of rows of substrate through-holes are provided as heat dissipation members. A plurality of rows can also be provided in 31.

  A fourth embodiment of the present invention will be described with reference to FIGS. Since the fourth embodiment is the same as the second embodiment except for the items described below, the same components as those of the second embodiment are denoted by the same reference numerals as those of the second embodiment, and description thereof is omitted.

  In 4th Embodiment, the some convex part 16 is integrally provided in the outer peripheral surface of the partition member 15 which stores the sealing member 21. As shown in FIG. As shown in FIG. 6A, these convex portions 16 are passed through gaps between the substrate through holes 5 of the device substrate 2 communicating with the gap 32G as a ventilation means. Further, as a preferable example, each convex portion 16 has a length reaching the periphery of the device substrate 2 and is formed higher than the partition member 15 as shown in FIG. Each convex portion 16 is bonded to the insulating layer 4 of the device substrate 2. In this case, a part of the convex portions 16 are overlapped and bonded to the input side wiring pattern portion 12 or the output side wiring pattern portion 13.

  In the fourth embodiment, the connector device 41 covering the opening (not shown in FIG. 6) of the device substrate 2 is disposed so as to face the gap between the substrate through holes 5 as shown in FIG. ing. Thereby, it is possible to prevent the load when the insertion side connector (not shown in FIG. 6) is coupled to the receiving side connector 42 of the connector device 41 from being concentrated on the single substrate through hole 5.

  Except for the configuration described above, the second embodiment is the same as the second embodiment. Therefore, this fourth embodiment can solve the problems of the present invention by obtaining the same operation as the second embodiment.

  In addition, in the fourth embodiment, the portion between the substrate through holes 5 of the device substrate 2, that is, the element mounting region 2 a and the circuit component mounting region 2 b are formed by the convex portion 16 integrated with the partition member 15 that stores the sealing member 21. Can be reinforced to compensate for a reduction in strength of the device substrate 2 due to the plurality of substrate through-holes 5. Therefore, the handleability of the device substrate 2 to which the partition member 15 is attached can be improved during manufacturing.

  A fifth embodiment of the present invention will be described with reference to FIG. Since 5th Embodiment is the same as 1st Embodiment except the matter demonstrated below, about the same structure as 1st Embodiment, the same code | symbol as 1st Embodiment is attached | subjected and the description is abbreviate | omitted.

  In the fifth embodiment, the central part of the device substrate 2 surrounded by the substrate through holes 5 provided in an annular row is used as the circuit component mounting region 2b, and the circuit component 25 is mounted thereon, and the device substrate. A plurality of LEDs 11 are mounted on the peripheral portion of 2 as an element mounting region 2a. Further, a large-diameter partition member 15a and a small-diameter partition member 15b are bonded and stopped on the element mounting region 2a, and a sealing member 21 that seals the LED 11 and the like is stored therebetween.

  Further, the heat radiating member 31 has a tapered hole 31c at the center thereof on the back surface of the apparatus substrate 2. The tapered hole 31c is formed to have a gradually smaller diameter toward the outer surface of the heat radiating member 31 where the heat dissipating fins 31a are provided, and is open to the outer surface. The peripheral portion of the heat radiating member 31 is in surface contact with the back surface of the element mounting region 2a, and is attached to the back surface of the device substrate 2 by screws (not shown) screwed into the heat radiating member 31 through the element mounting region 2a. Yes.

  The taper hole 31c faces the back surface of the circuit component mounting region 2b and all the substrate through holes 5. As a result, a gap 32G is formed between the heat radiating member 31 and the back surface of the device substrate 2 as a ventilation means for making the heat radiating member 31 non-contact with the circuit component mounting region 2b. 5 and the air passage through the gap 32G.

  Except for the configuration described above, the configuration is the same as that of the first embodiment, including the configuration not shown in FIG. Therefore, the fifth embodiment can solve the problems of the present invention by obtaining the same operation as the first embodiment.

(A) is a front view which shows the illuminating device which concerns on 1st Embodiment of this invention. (B) is sectional drawing which follows the F1B-F1B line | wire in FIG. 1 (A). The perspective view which shows the connector apparatus with which the illuminating device of FIG. (A) is sectional drawing which shows the connector apparatus of FIG. 2 in a separated state. (B) is sectional drawing which shows the connector apparatus of FIG. 2 in a connection state. (A) is a front view which shows the illuminating device which concerns on 2nd Embodiment of this invention. (B) is sectional drawing which follows the F4B-F4B line | wire in FIG. 4 (A). (A) is a front view which shows the illuminating device which concerns on 3rd Embodiment of this invention. (B) is sectional drawing which follows the F5B-F5B line | wire in FIG. 5 (A). (A) is a front view which shows the illuminating device which concerns on 4th Embodiment of this invention. (B) is sectional drawing which follows the F6B-F6B line | wire in FIG. 6 (A). Sectional drawing which shows the illuminating device which concerns on 5th Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Downlight (illuminating device), 2 ... Device substrate, 2a ... Element mounting area, 2b ... Circuit component mounting area, 2c ... Opening, 3 ... Metal base layer, 4 ... Insulating layer, 5, 5a, 5b ... Substrate penetration Hole: 6 ... Wiring pattern, 11 ... LED (Peninsular light emitting element), 12 ... Input side wiring pattern, 13 ... Output side wiring pattern, 15, 15a, 15b ... Partition member, 16 ... Projection, G1, G2 ... Gap , 21 ... sealing member, 25 ... circuit member, 31 ... heat dissipation member, 32 ... vent (venting means), 32G ... gap (venting means), 41 ... connector device, 42 ... receiving connector, 44 ... terminal fitting, 44b: Receiving side contact, 46 ... Insertion side connector, 48 ... Insertion side connector

Claims (6)

An apparatus in which an insulating layer is laminated on one surface of a metal base layer, and has a plurality of substrate through holes penetrating both layers, and an element mounting region and a circuit component mounting region are partitioned by the substrate through holes A substrate;
A semiconductor light emitting device mounted in the device mounting region;
Circuit components mounted in the circuit component mounting region;
A heat dissipating member that is formed in a size substantially equal to or larger than that of the device substrate and is attached to the device substrate in contact with at least the back surface of the element mounting region;
A ventilation means provided in communication with each of the substrate through-holes to suppress heat conduction between the heat dissipation member and the circuit component mounting region;
An illumination device comprising:   The heat radiating member is in contact with the back surface of the circuit component mounting region, and the ventilation means is a plurality of communication holes provided in the heat radiating member so as to individually face the substrate through holes. The lighting device according to claim 1.   The ventilation means is a gap formed between the heat radiating member and the back surface of the device substrate and open to the peripheral surface side of the heat radiating member, and is opposed to all the substrate through holes. The lighting device according to claim 1.   Among the wiring patterns provided on the insulating layer, a gap in which an input side wiring pattern portion and an output side wiring pattern portion extending between the element mounting region and the circuit component mounting region are formed between the plurality of substrate through holes. The illumination device according to any one of claims 1 to 3, wherein the illumination device is passed separately.   A plurality of the substrate through-holes are arranged in a ring shape, and the inner side is used as the element mounting region and the outer side is used as the circuit component mounting region, and the semiconductor light emitting element group is surrounded by the element mounting region. And a projecting portion that passes through a gap formed between the substrate through-holes is integrally projected on the partition member, and the light-transmitting property seals the semiconductor light emitting element inside the partition member 5. The lighting device according to claim 1, wherein the sealing member is stored.   A connector device is disposed in the circuit component mounting region, and the connector device covers the opening opened in the circuit component mounting region and is fixed on the insulating layer, and is passed through the opening. An insertion-side connector accommodated in the receiving-side connector and connected to the receiving-side connector, the receiving-side connector having a receiving-side contact facing the opening and connected to the wiring pattern on the insulating layer 6. The device according to claim 1, further comprising: a pair of terminal fittings, wherein the insertion-side connector has a pair of insertion-side contacts that are detachably inserted and connected to the receiving-side contacts. The illumination device according to any one of the above.

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