TW201815712A - Bismuth-based glass, method for manufacturing bismuth-based glass, and sealing material - Google Patents
Bismuth-based glass, method for manufacturing bismuth-based glass, and sealing material Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/14—Silica-free oxide glass compositions containing boron
- C03C3/15—Silica-free oxide glass compositions containing boron containing rare earths
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/14—Silica-free oxide glass compositions containing boron
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
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Abstract
Description
本發明是有關於一種鉍系玻璃、鉍系玻璃的製造方法及密封材料,尤其是有關於一種對於利用雷射光的密封處理(以下,雷射密封)而言較佳的鉍系玻璃、鉍系玻璃的製造方法及密封材料。The present invention relates to a method for producing a bismuth-based glass, a bismuth-based glass, and a sealing material, and more particularly to a bismuth-based glass or lanthanum system which is preferable for a sealing treatment using laser light (hereinafter, a laser sealing). Glass manufacturing method and sealing material.
近年來,作為平板顯示器面板,有機電致發光(electroluminescence,EL)顯示器受到矚目。先前,作為有機EL顯示器的接著材料,使用具有低溫硬化性的有機樹脂系接著劑。然而,有機樹脂系接著劑無法完全阻斷氣體或水分的浸入,因此耐水性低的主動元件或有機發光層容易劣化,從而產生有機EL顯示器的顯示特性隨時間經過而劣化的不良情況。In recent years, as a flat panel display panel, an organic electroluminescence (EL) display has attracted attention. Conventionally, as an adhesive material of an organic EL display, an organic resin-based adhesive having low-temperature curability is used. However, since the organic resin-based adhesive does not completely block the intrusion of gas or moisture, the active device or the organic light-emitting layer having low water resistance is likely to be deteriorated, and the display characteristics of the organic EL display deteriorate with time.
另一方面,包含玻璃粉末的密封材料與有機樹脂系接著劑相比,難以透過氣體或水分,因此可確保有機EL顯示器內部的氣密性。On the other hand, the sealing material containing the glass powder is more difficult to permeate the gas or the moisture than the organic resin-based adhesive, and therefore the airtightness inside the organic EL display can be ensured.
然而,玻璃粉末的軟化溫度高於有機樹脂系接著劑,因此於密封時有使主動元件或有機發光層熱劣化之虞。根據此種情況,雷射密封受到矚目。根據雷射密封,能夠局部地僅對應進行密封的部分進行加熱,可不使主動元件或有機發光層熱劣化地密封無鹼玻璃基板等被密封物。However, since the softening temperature of the glass powder is higher than that of the organic resin-based adhesive, there is a possibility that the active element or the organic light-emitting layer is thermally deteriorated at the time of sealing. According to this situation, the laser seal is attracting attention. According to the laser seal, it is possible to locally heat only the portion to be sealed, and it is possible to seal the sealed object such as the alkali-free glass substrate without thermally degrading the active device or the organic light-emitting layer.
另外,近年來,對實現氣密封裝的特性維持或長壽命化進行了研究。例如,關於封裝有發光二極體(light-emitting diode,LED)元件的氣密封裝,就導熱性的觀點而言,使用氮化鋁、具有熱通孔(thermal via)的低溫煅燒基板(低溫共燒陶瓷(Low Temperature Co-fired Ceramic,LTCC))作為基體,該情況下,亦較佳為對基體與蓋(lid)進行雷射密封。尤其是關於封裝有於紫外波長區域中發光的LED元件的氣密封裝,藉由雷射密封容易維持紫外波長區域中的發光特性。進而,藉由雷射密封亦可防止LED元件的熱劣化。Further, in recent years, research has been conducted to realize the maintenance of characteristics or the long life of hermetic seals. For example, regarding a hermetic package in which a light-emitting diode (LED) element is packaged, from the viewpoint of thermal conductivity, aluminum nitride, a low-temperature calcined substrate having a thermal via (low temperature) is used. A low temperature Co-fired Ceramic (LTCC) is used as the substrate. In this case, it is also preferred to perform laser sealing on the substrate and the lid. In particular, with respect to a hermetic package in which an LED element that emits light in an ultraviolet wavelength region is packaged, it is easy to maintain the light-emitting characteristics in the ultraviolet wavelength region by laser sealing. Further, thermal deterioration of the LED element can be prevented by the laser sealing.
進而,關於封裝有微機電系統(Micro Electric Mechanical System,MEMS)元件的氣密封裝,為了防止MEMS元件的特性劣化,亦較佳為雷射密封。 [現有技術文獻] [專利文獻]Further, in a hermetic package in which a microelectromechanical system (MEMS) device is packaged, a laser seal is preferably used in order to prevent deterioration of characteristics of the MEMS element. [Prior Art Document] [Patent Literature]
[專利文獻1]美國專利第6416375號說明書 [專利文獻2]日本專利特開2006-315902號公報[Patent Document 1] US Patent No. 6416375 (Patent Document 2) Japanese Patent Laid-Open No. 2006-315902
[發明所欲解決之課題] 雷射密封中使用的密封材料通常包含玻璃粉末、耐火性填料粉末及雷射吸收材。玻璃粉末為於雷射密封時軟化流動並與被密封物反應而用於確保密封強度的成分。耐火性填料粉末為以骨材的方式產生作用而用於降低熱膨脹係數的材料,並非於雷射密封時軟化流動者。雷射吸收材為用於在雷射密封時吸收雷射光並轉換為熱能量的材料,並非於雷射密封時軟化流動者。[Problems to be Solved by the Invention] The sealing material used in the laser sealing usually contains glass powder, refractory filler powder, and a laser absorbing material. The glass powder is a component which softens the flow during laser sealing and reacts with the sealed object to secure the sealing strength. The refractory filler powder is a material that acts to reduce the coefficient of thermal expansion by acting as an aggregate, and does not soften the flow during laser sealing. The laser absorbing material is a material for absorbing laser light and converting it into thermal energy during laser sealing, and does not soften the flow during laser sealing.
作為玻璃粉末,先前使用硼酸鉛系玻璃,但就環境的觀點而言,近年來使用無鉛玻璃。尤其是,鉍系玻璃為低熔點且軟化流動性優異,因此作為無鉛玻璃而被看好。然而,鉍系玻璃的主成分Bi2 O3 幾乎不具有雷射吸收能力,因此雷射吸收能力容易變得不充分。因此,為了彌補鉍系玻璃的雷射吸收能力,必須增加雷射吸收材的含量。然而,若雷射吸收材的含量變多,則於雷射密封時,雷射吸收材融入鉍系玻璃中,藉此鉍系玻璃失透(devitrification)而無法確保所需的軟化流動性。而且,為了確保軟化流動性,若使耐火性填料粉末減少,則密封材料的熱膨脹係數不恰當地變高,於雷射密封時,被密封物或密封材料層中產生裂紋,從而容易產生氣密不良。As the glass powder, lead borate glass has been used in the past, but from the viewpoint of the environment, lead-free glass has been used in recent years. In particular, the bismuth-based glass has a low melting point and is excellent in softening fluidity, and therefore is favored as a lead-free glass. However, the main component Bi 2 O 3 of the lanthanide glass hardly has a laser absorbing ability, and thus the laser absorbing ability is likely to be insufficient. Therefore, in order to compensate for the laser absorption ability of the lanthanide glass, it is necessary to increase the content of the laser absorbing material. However, when the content of the laser absorbing material is increased, the laser absorbing material is incorporated into the lanthanum glass at the time of laser sealing, whereby deuteration of the lanthanide glass does not ensure the desired softening fluidity. Further, in order to secure the softening fluidity, if the refractory filler powder is reduced, the thermal expansion coefficient of the sealing material is undesirably increased, and cracks are generated in the sealing material or the sealing material layer during the laser sealing, and airtightness is likely to occur. bad.
因此,本發明是鑒於所述情況而成,其技術課題為發明一種可以高水準兼顧軟化流動性與雷射吸收能力的鉍系玻璃及使用其的密封材料。 [解決課題之手段]Therefore, the present invention has been made in view of the above circumstances, and a technical object thereof is to provide a bismuth-based glass which can achieve both softening fluidity and laser absorbing ability at a high level, and a sealing material using the same. [Means for solving the problem]
本發明者等人進行了努力研究,結果發現藉由嚴密地控制鉍系玻璃中的非著色成分與著色成分的比例,可解決所述技術課題,從而提出了本發明。即,本發明的鉍系玻璃的特徵在於:以下述氧化物換算的莫耳%計而含有25%~45%的Bi2 O3 、20%~35%的B2 O3 、90%~100%(其中,並不包含90%在內)的Bi2 O3 +B2 O3 +BaO+ZnO+CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO作為玻璃組成,莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)為2.0~3.5。此處,「Bi2 O3 +B2 O3 +BaO+ZnO+CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO」是指Bi2 O3 、B2 O3 、BaO、ZnO、CuO、MnO、Fe2 O3 、TiO2 、V2 O5 、Cr2 O3 、Co3 O4 及NiO的合計含量。「(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)」是指Bi2 O3 、B2 O3 、BaO及ZnO的合計含量除以CuO、MnO、Fe2 O3 、TiO2 、V2 O5 、Cr2 O3 、Co3 O4 及NiO的合計含量所得的值。As a result of intensive studies, the inventors of the present invention have found that the technical problem can be solved by strictly controlling the ratio of the non-colored component to the colored component in the lanthanide glass, and the present invention has been proposed. In other words, the bismuth-based glass of the present invention contains 25% to 45% of Bi 2 O 3 and 20% to 35% of B 2 O 3 and 90% to 100% by mol% of the following oxides. % (wherein, not including 90%) of Bi 2 O 3 + B 2 O 3 + BaO + ZnO + CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O 4 +NiO as a glass composition, Mo Er ratio (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 +Co 3 O 4 +NiO) is 2.0 to 3.5. Here, "Bi 2 O 3 + B 2 O 3 + BaO + ZnO + CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O 4 + NiO" means Bi The total content of 2 O 3 , B 2 O 3 , BaO, ZnO, CuO, MnO, Fe 2 O 3 , TiO 2 , V 2 O 5 , Cr 2 O 3 , Co 3 O 4 and NiO. "(Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O 4 + NiO)" means The total content of Bi 2 O 3 , B 2 O 3 , BaO and ZnO is divided by the total content of CuO, MnO, Fe 2 O 3 , TiO 2 , V 2 O 5 , Cr 2 O 3 , Co 3 O 4 and NiO. Value.
本發明的鉍系玻璃嚴密地控制非著色成分與著色成分的比例。具體而言,本發明的鉍系玻璃將莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)控制為2.0~3.5。若莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)過小,則對熱不穩定,且於雷射密封時玻璃容易失透。另一方面,若莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)過大,則雷射吸收能力容易降低。結果,若不於密封材料中過剩地添加雷射吸收材或不使雷射輸出上升,則難以進行雷射密封。另外,熱膨脹係數不恰當地變高,於雷射密封時,被密封物或密封材料層中產生裂紋,從而容易產生氣密不良。The bismuth-based glass of the present invention closely controls the ratio of the non-colored component to the colored component. Specifically, the lanthanide glass of the present invention has a molar ratio (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 +Co 3 O 4 +NiO) is controlled to be 2.0 to 3.5. Mohr ratio (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O 4 + NiO) If it is too small, it is unstable to heat, and the glass is easily devitrified when it is sealed by a laser. On the other hand, if Mohr ratio (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O When 4 + NiO) is too large, the laser absorption capacity is easily lowered. As a result, if the laser absorbing material is not excessively added to the sealing material or the laser output is not increased, it is difficult to perform laser sealing. Further, the coefficient of thermal expansion is undesirably high, and cracks are generated in the sealant or the sealant layer at the time of laser sealing, and airtightness is likely to occur.
第二,本發明的鉍系玻璃較佳為ZnO的含量為1莫耳%~20莫耳%。Second, the bismuth-based glass of the present invention preferably has a ZnO content of from 1 mol% to 20 mol%.
第三,本發明的鉍系玻璃較佳為MnO的含量為3莫耳%~25莫耳%。Third, the lanthanide glass of the present invention preferably has a MnO content of from 3 mol% to 25 mol%.
第四,本發明的鉍系玻璃較佳為實質上並不含有PbO。此處,所謂「實質上並不含有PbO」,是指玻璃組成中的PbO的含量小於0.1質量%的情況。Fourth, the lanthanide glass of the present invention preferably does not substantially contain PbO. Here, "substantially does not contain PbO" means that the content of PbO in the glass composition is less than 0.1% by mass.
第五,本發明的鉍系玻璃的製造方法為所述鉍系玻璃的製造方法,其較佳為將包含硝酸鹽原料、硫酸鹽原料、二氧化物原料、過氧化物原料的任一種的玻璃母料熔融成形而製作鉍系玻璃。Fifth, the method for producing the bismuth-based glass of the present invention is a method for producing the bismuth-based glass, and preferably a glass containing any one of a nitrate raw material, a sulfate raw material, a dioxide raw material, and a peroxide raw material. The masterbatch is melt-molded to produce a bismuth-based glass.
第六,本發明的鉍系玻璃的製造方法較佳為所述二氧化物原料為二氧化錳原料。Sixth, in the method for producing a bismuth-based glass of the present invention, it is preferred that the dioxide raw material is a manganese dioxide raw material.
第七,本發明的鉍系玻璃的製造方法較佳為所述過氧化物原料為過錳酸鹽原料。Seventh, in the method for producing a bismuth-based glass of the present invention, it is preferred that the peroxide raw material is a permanganate raw material.
第八,本發明的密封材料較佳為於包括包含鉍系玻璃的玻璃粉末與耐火性填料粉末的密封材料中,玻璃粉末的含量為50體積%~95體積%,耐火性填料粉末的含量為1體積%~40體積%,且鉍系玻璃為所述鉍系玻璃。Eighth, the sealing material of the present invention is preferably contained in a sealing material comprising a glass powder containing lanthanum glass and a refractory filler powder, the content of the glass powder being 50% by volume to 95% by volume, and the content of the refractory filler powder being 1% by volume to 40% by volume, and the lanthanide glass is the lanthanum glass.
第九,本發明的密封材料較佳為所述耐火性填料粉末為選自堇青石(cordierite)、矽鋅礦(willemite)、氧化鋁、磷酸鋯系化合物、鋯石(zircon)、氧化鋯、氧化錫、石英玻璃、β-鋰霞石(β-eucryptite)、鋰輝石(spodumene)中的一種或兩種以上。Ninth, the sealing material of the present invention is preferably that the refractory filler powder is selected from cordierite, willemite, alumina, zirconium phosphate compound, zircon, zirconium oxide, One or more of tin oxide, quartz glass, β-eucryptite, and spodumene.
第十,本發明的密封材料較佳為雷射吸收材的含量為5體積%以下。Tenth, the sealing material of the present invention preferably has a content of the laser absorbing material of 5% by volume or less.
第十一,本發明的密封材料較佳為於雷射密封中使用。如此,於密封時可防止元件的熱劣化。再者,雷射密封中使用的雷射光的光源並無特別限定,例如就處理容易的方面而言,較佳為半導體雷射、釔鋁石榴石(yttrium aluminum garnet,YAG)雷射、CO2 雷射、準分子雷射、紅外雷射等。另外,為了使所述密封材料確實地吸收雷射光,雷射光的發光中心波長較佳為500 nm~1600 nm,特佳為750 nm~1300 nm。Eleventh, the sealing material of the present invention is preferably used in a laser seal. Thus, thermal deterioration of the element can be prevented at the time of sealing. Further, the light source of the laser light used in the laser sealing is not particularly limited. For example, in terms of ease of handling, a semiconductor laser, a yttrium aluminum garnet (YAG) laser, and a CO 2 are preferable. Laser, excimer laser, infrared laser, etc. Further, in order for the sealing material to reliably absorb the laser light, the center wavelength of the laser light is preferably from 500 nm to 1600 nm, particularly preferably from 750 nm to 1300 nm.
如上所述,本發明的鉍系玻璃以下述氧化物換算的莫耳%計而含有25%~45%的Bi2 O3 、20%~35%的B2 O3 、90%~100%(其中,並不包含90%在內)的Bi2 O3 +B2 O3 +BaO+ZnO+CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO作為玻璃組成,莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)為2.0~3.5。將如所述般限定鉍系玻璃的玻璃組成範圍的理由示於以下。再者,於玻璃組成的說明中,%的表達是指莫耳%。As described above, the bismuth-based glass of the present invention contains 25% to 45% of Bi 2 O 3 , 20% to 35% of B 2 O 3 , and 90% to 100% by mol% of the following oxides. Among them, not including 90%, Bi 2 O 3 + B 2 O 3 + BaO + ZnO + CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O 4 + NiO as a glass composition, Mo Er ratio (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O 4 + NiO) is 2.0 to 3.5. The reason why the glass composition range of the lanthanide glass is defined as described above is shown below. Further, in the description of the glass composition, the expression of % means Mo%.
Bi2 O3 +B2 O3 +BaO+ZnO+CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO的含量大於90%,較佳為93%以上、95%以上、97%以上,特佳為98%以上。若Bi2 O3 +B2 O3 +BaO+ZnO+CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO的含量過少,則難以兼顧軟化流動性與雷射吸收能力。結果,若不於密封材料中過剩地添加雷射吸收材或不使雷射輸出上升,則難以進行雷射密封。The content of Bi 2 O 3 + B 2 O 3 + BaO + ZnO + CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O 4 + NiO is more than 90%, preferably It is 93% or more, 95% or more, 97% or more, and particularly preferably 98% or more. If the content of Bi 2 O 3 + B 2 O 3 + BaO + ZnO + CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O 4 + NiO is too small, it is difficult to balance Soften fluidity and laser absorption capacity. As a result, if the laser absorbing material is not excessively added to the sealing material or the laser output is not increased, it is difficult to perform laser sealing.
CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO的含量較佳為22%~33%,進而佳為25%~30%。若CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO的含量過少,則雷射吸收能力容易降低。結果,若不於密封材料中過剩地添加雷射吸收材或不使雷射輸出提高,則難以進行雷射密封。另一方面,若CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO的含量過多,則對熱不穩定,從而於雷射密封時玻璃容易失透。The content of CuO+MnO+Fe 2 O 3 +TiO 2 +V 2 O 5 +Cr 2 O 3 +Co 3 O 4 +NiO is preferably 22% to 33%, more preferably 25% to 30%. When the content of CuO+MnO+Fe 2 O 3 +TiO 2 +V 2 O 5 +Cr 2 O 3 +Co 3 O 4 +NiO is too small, the laser absorption ability is liable to lower. As a result, if the laser absorbing material is not excessively added to the sealing material or the laser output is not increased, it is difficult to perform laser sealing. On the other hand, if the content of CuO+MnO+Fe 2 O 3 +TiO 2 +V 2 O 5 +Cr 2 O 3 +Co 3 O 4 +NiO is too large, it is unstable to heat, so that the glass is sealed at the time of laser sealing. Easy to devitrify.
莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)為2.0~3.5,較佳為2.1~3.2,進而佳為2.2~3.1,特佳為2.4~3.0。若莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)過小,則對熱不穩定,從而於雷射密封時玻璃容易失透。另一方面,若莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)過大,則雷射吸收能力容易降低。結果,若不於密封材料中過剩地添加雷射吸收材或不使雷射輸出提高,則難以進行雷射密封。另外,熱膨脹係數不恰當地變高,於雷射密封時,被密封物或密封材料層中產生裂紋,從而容易產生氣密不良。Mo Er ratio (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O 4 + NiO) 2.0 to 3.5, preferably 2.1 to 3.2, more preferably 2.2 to 3.1, particularly preferably 2.4 to 3.0. Mohr ratio (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O 4 + NiO) If it is too small, it is unstable to heat, so that the glass is easily devitrified when it is sealed by a laser. On the other hand, if Mohr ratio (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O When 4 + NiO) is too large, the laser absorption capacity is easily lowered. As a result, if the laser absorbing material is not excessively added to the sealing material or the laser output is not increased, it is difficult to perform laser sealing. Further, the coefficient of thermal expansion is undesirably high, and cracks are generated in the sealant or the sealant layer at the time of laser sealing, and airtightness is likely to occur.
Bi2 O3 為鉍系玻璃的主要成分,為提高軟化流動性的成分。Bi2 O3 的含量為25%~45%,較佳為30%~42%,進而佳為35%~40%。若Bi2 O3 的含量過少,則軟化點變得過高,即便照射雷射光,玻璃亦難以軟化流動。另一方面,若Bi2 O3 的含量過多,則熱膨脹係數不恰當地變高,於雷射密封時,被密封物或密封材料層中產生裂紋,從而容易產生氣密不良。另外,對熱不穩定,從而於雷射密封時玻璃容易失透。Bi 2 O 3 is a main component of the bismuth-based glass and is a component that improves softening fluidity. The content of Bi 2 O 3 is 25% to 45%, preferably 30% to 42%, and more preferably 35% to 40%. When the content of Bi 2 O 3 is too small, the softening point becomes too high, and even if laser light is irradiated, it is difficult for the glass to soften and flow. On the other hand, when the content of Bi 2 O 3 is too large, the coefficient of thermal expansion is undesirably high, and cracks are generated in the sealant or the sealant layer during laser sealing, and airtightness is likely to occur. In addition, it is unstable to heat, so that the glass is easily devitrified during laser sealing.
B2 O3 為形成玻璃網路(glass network)的成分。B2 O3 的含量為20%~35%,較佳為22%~32%,進而佳為24%~30%。若B2 O3 的含量過少,則玻璃對熱不穩定,從而於雷射密封時玻璃容易失透。另一方面,若B2 O3 的含量的過多,則軟化點變得過高,即便照射雷射光,玻璃亦難以軟化流動。B 2 O 3 is a component that forms a glass network. The content of B 2 O 3 is from 20% to 35%, preferably from 22% to 32%, and more preferably from 24% to 30%. If the content of B 2 O 3 is too small, the glass is unstable to heat, so that the glass is easily devitrified during laser sealing. On the other hand, when the content of B 2 O 3 is too large, the softening point becomes too high, and even if laser light is irradiated, it is difficult for the glass to soften and flow.
BaO為使軟化點降低的成分,且為提高熱穩定性的成分。然而,若BaO的含量過多,則難以使熱膨脹係數降低。結果,於密封材料層中容易產生裂紋等。因此,BaO的含量較佳為0%~15%、0%~8%、0%~5%,特佳為0.1%~小於2%。BaO is a component which lowers a softening point, and is a component which improves thermal stability. However, if the content of BaO is too large, it is difficult to lower the coefficient of thermal expansion. As a result, cracks and the like are likely to occur in the sealing material layer. Therefore, the content of BaO is preferably 0% to 15%, 0% to 8%, 0% to 5%, particularly preferably 0.1% to less than 2%.
ZnO為使熱膨脹係數降低的成分。ZnO的含量較佳為0%~25%,更佳為1%~20%,進而佳為5%~15%。若ZnO的含量過少,則熱膨脹係數容易變高。另一方面,若ZnO的含量過多,則於Bi2 O3 的含量為35%以上的情況下,玻璃對熱不穩定,從而於雷射密封時玻璃容易失透。ZnO is a component that lowers the coefficient of thermal expansion. The content of ZnO is preferably from 0% to 25%, more preferably from 1% to 20%, still more preferably from 5% to 15%. When the content of ZnO is too small, the coefficient of thermal expansion tends to be high. On the other hand, when the content of ZnO is too large, when the content of Bi 2 O 3 is 35% or more, the glass is unstable to heat, and the glass is easily devitrified during laser sealing.
CuO與MnO為大幅地提高雷射吸收能力的成分。CuO與MnO的合計含量較佳為15%~35%,更佳為20%~40%,進而佳為25%~30%。若CuO與MnO的合計含量過少,則雷射吸收能力容易降低。另一方面,若CuO與MnO的合計含量過多,則軟化點變得過高,即便照射雷射光,玻璃亦難以軟化流動。另外,玻璃對熱不穩定,從而於雷射密封時玻璃容易失透。再者,CuO的含量較佳為5%~30%,更佳為8%~30%,進而佳為13%~25%。MnO的含量較佳為0%~20%,更佳為3%~25%,進而佳為5%~15%。CuO and MnO are components which greatly improve the laser absorption ability. The total content of CuO and MnO is preferably from 15% to 35%, more preferably from 20% to 40%, still more preferably from 25% to 30%. When the total content of CuO and MnO is too small, the laser absorption ability is liable to lower. On the other hand, when the total content of CuO and MnO is too large, the softening point becomes too high, and even if the laser beam is irradiated, it is difficult for the glass to soften and flow. In addition, the glass is unstable to heat, so that the glass is easily devitrified during laser sealing. Further, the content of CuO is preferably from 5% to 30%, more preferably from 8% to 30%, still more preferably from 13% to 25%. The content of MnO is preferably from 0% to 20%, more preferably from 3% to 25%, still more preferably from 5% to 15%.
MnO2 等MnO的導入原料於熔融時具有氧化作用。而且,於鉍系玻璃中,併用CuO與MnO並將莫耳比CuO/MnO控制為0.5~6.2,則於熔融時玻璃中存在的Cu2 O藉由MnO的導入原料而氧化,氧化數為2以上的氧化銅增加,藉此可大幅地提高近紅外波長區域中的雷射吸收能力。莫耳比CuO/MnO較佳為0.5~6.2,更佳為0.7~6.0,進而佳為1.0~3.5。若莫耳比CuO/MnO過小,則玻璃對熱不穩定,從而於雷射密封時玻璃容易失透。另一方面,若莫耳比CuO/MnO過大,則於熔融時Cu2 O並未充分氧化,難以獲得所需的雷射吸收能力。The introduction material of MnO such as MnO 2 has an oxidation effect upon melting. Further, in the bismuth-based glass, CuO and MnO are used in combination, and the molar ratio CuO/MnO is controlled to 0.5 to 6.2, and Cu 2 O present in the glass during oxidation is oxidized by introduction of MnO, and the oxidation number is 2 The above copper oxide is increased, whereby the laser absorption ability in the near-infrared wavelength region can be greatly improved. The molar ratio CuO/MnO is preferably from 0.5 to 6.2, more preferably from 0.7 to 6.0, still more preferably from 1.0 to 3.5. If the molar ratio is too small for CuO/MnO, the glass is unstable to heat, so that the glass is easily devitrified during laser sealing. On the other hand, if the molar ratio CuO/MnO is too large, Cu 2 O is not sufficiently oxidized at the time of melting, and it is difficult to obtain a desired laser absorbing ability.
Fe2 O3 為提高雷射吸收能力的成分,進而於Bi2 O3 的含量為35%以上的情況下,為抑制雷射密封時的失透的成分。Fe2 O3 的含量較佳為0%~5%、0.1%~3%,特佳為0.2%~2%。若Fe2 O3 的含量過多,則有損玻璃組成中的成分平衡,玻璃反而容易失透。Fe 2 O 3 is a component which improves the laser absorption ability, and when the content of Bi 2 O 3 is 35% or more, it is a component which suppresses devitrification at the time of laser sealing. The content of Fe 2 O 3 is preferably 0% to 5%, 0.1% to 3%, particularly preferably 0.2% to 2%. If the content of Fe 2 O 3 is too large, the balance of the components in the glass composition is impaired, and the glass is easily devitrified.
TiO2 、V2 O5 、Cr2 O3 、Co2 O3 及NiO為提高雷射吸收能力的成分。各成分的含量較佳為0%~7%、0.1%~4%,特佳為0.5%~小於2%。若各成分的含量過多,則於雷射密封時玻璃容易失透。TiO 2 , V 2 O 5 , Cr 2 O 3 , Co 2 O 3 and NiO are components for improving the laser absorption ability. The content of each component is preferably from 0% to 7%, from 0.1% to 4%, particularly preferably from 0.5% to less than 2%. If the content of each component is too large, the glass is easily devitrified during laser sealing.
除了所述成分以外,例如亦可添加以下成分。In addition to the above components, for example, the following components may be added.
Al2 O3 為提高耐水性的成分。其含量較佳為0%~5%、0%~3%,特佳為0.1%~2%。若Al2 O3 的含量過多,則軟化點變得過高,即便照射雷射光,玻璃亦難以軟化流動。Al 2 O 3 is a component that improves water resistance. The content thereof is preferably from 0% to 5%, from 0% to 3%, particularly preferably from 0.1% to 2%. When the content of Al 2 O 3 is too large, the softening point becomes too high, and even if laser light is irradiated, it is difficult for the glass to soften and flow.
MgO、CaO及SrO為提高熱穩定性的成分。然而,若MgO、CaO及SrO的含量過多,則難以於確保軟化流動性的同時降低熱膨脹係數。因此,MgO、CaO及SrO的合計含量及個別含量較佳為0%~7%、0%~5%、0%~3%、0%~小於2%、0%~1%,特佳為0%~小於1%。MgO, CaO, and SrO are components that improve thermal stability. However, when the content of MgO, CaO, and SrO is too large, it is difficult to ensure the softening fluidity and the thermal expansion coefficient. Therefore, the total content and individual content of MgO, CaO, and SrO are preferably 0% to 7%, 0% to 5%, 0% to 3%, 0% to less than 2%, and 0% to 1%, particularly preferably 0% to less than 1%.
SiO2 為提高耐水性的成分。其含量較佳為0%~8%、0%~5%,特佳為0%~小於1%。若SiO2 的含量過多,則軟化點變得過高,即便照射雷射光,玻璃亦難以軟化流動。SiO 2 is a component that improves water resistance. The content thereof is preferably from 0% to 8%, from 0% to 5%, particularly preferably from 0% to less than 1%. When the content of SiO 2 is too large, the softening point becomes too high, and even if laser light is irradiated, it is difficult for the glass to soften and flow.
Li2 O、Na2 O、K2 O及Cs2 O為降低軟化點的成分,但於熔融時有促進失透的作用。因此,該些成分的含量較佳為以合計含量計而為2%以下,特佳為小於1%。Li 2 O, Na 2 O, K 2 O, and Cs 2 O are components which lower the softening point, but have a function of promoting devitrification upon melting. Therefore, the content of these components is preferably 2% or less, and particularly preferably less than 1%, based on the total content.
P2 O5 為抑制熔融時的失透的成分,但若其添加量過多,則於熔融時玻璃容易產生相分離。因此,P2 O5 的含量較佳為0%~5%,特佳為0%~小於1%。P 2 O 5 is a component which suppresses devitrification at the time of melting. However, when the amount of addition is too large, phase separation of the glass is likely to occur at the time of melting. Therefore, the content of P 2 O 5 is preferably from 0% to 5%, particularly preferably from 0% to less than 1%.
La2 O3 、Y2 O3 及Gd2 O3 為抑制熔融時的相分離的成分,但若La2 O3 、Y2 O3 及Gd2 O3 的含量過多,則軟化點變得過高,即便照射雷射光,玻璃亦難以軟化。因此,La2 O3 、Y2 O3 及Gd2 O3 的含量分別較佳為0%~5%,特佳為0%~小於1%。La 2 O 3 , Y 2 O 3 and Gd 2 O 3 are components which suppress phase separation at the time of melting. However, when the content of La 2 O 3 , Y 2 O 3 and Gd 2 O 3 is too large, the softening point becomes excessive. High, even if it is irradiated with laser light, it is difficult to soften the glass. Therefore, the content of La 2 O 3 , Y 2 O 3 and Gd 2 O 3 is preferably 0% to 5%, particularly preferably 0% to less than 1%.
MoO3 及CeO2 為提高雷射吸收能力的成分。各成分的含量較佳為0%~7%、0%~4%,特佳為0%~小於1%。若各成分的含量過多,則於雷射密封時玻璃容易失透。MoO 3 and CeO 2 are components that improve the absorption capacity of the laser. The content of each component is preferably from 0% to 7%, from 0% to 4%, particularly preferably from 0% to less than 1%. If the content of each component is too large, the glass is easily devitrified during laser sealing.
就環境的觀點而言,較佳為實質上並不含有PbO。From the viewpoint of the environment, it is preferred that the PbO is not substantially contained.
本發明的密封材料較佳為於包括包含鉍系玻璃的玻璃粉末與耐火性填料粉末的密封材料中,玻璃粉末的含量為50體積%~95體積%,耐火性填料粉末的含量為1體積%~40體積%,且鉍系玻璃為所述鉍系玻璃。The sealing material of the present invention is preferably contained in a sealing material comprising a glass powder containing lanthanum glass and a refractory filler powder, the content of the glass powder being 50% by volume to 95% by volume, and the content of the refractory filler powder being 1% by volume. ~40% by volume, and the lanthanide glass is the lanthanide glass.
於本發明的密封材料中,玻璃粉末的含量較佳為50體積%~95體積%、60體積%~80體積%,特佳為65體積%~75體積%。若玻璃粉末的含量少,則密封材料的軟化流動性容易降低。另一方面,若玻璃粉末的含量多,則耐火性填料粉末的含量相對地變少,從而有密封材料的熱膨脹係數不恰當地變高之虞。In the sealing material of the present invention, the content of the glass powder is preferably from 50% by volume to 95% by volume, from 60% by volume to 80% by volume, particularly preferably from 65% by volume to 75% by volume. When the content of the glass powder is small, the softening fluidity of the sealing material is liable to lower. On the other hand, when the content of the glass powder is large, the content of the refractory filler powder is relatively small, and the thermal expansion coefficient of the sealing material is undesirably increased.
玻璃粉末的最大粒徑Dmax 較佳為10 μm以下,特佳為5 μm以下。若玻璃粉末的最大粒徑Dmax 過大,則雷射密封所需要的時間變長,並且難以使被密封物間的間隙均勻化,從而雷射密封的精度容易降低。此處,所謂「最大粒徑Dmax 」是指利用雷射繞射裝置測定的值,表示於利用雷射繞射法測定時的體積基準的累積粒度分佈曲線中,該累計量自小粒子開始累積而為99%的粒徑。The maximum particle diameter D max of the glass powder is preferably 10 μm or less, and particularly preferably 5 μm or less. When the maximum particle diameter D max of the glass powder is too large, the time required for the laser sealing becomes long, and it is difficult to make the gap between the objects to be sealed uniform, and the precision of the laser sealing is easily lowered. Here, the "maximum particle diameter D max " is a value measured by a laser diffraction device, and is expressed in a volume-based cumulative particle size distribution curve measured by a laser diffraction method, and the cumulative amount starts from a small particle. Accumulated to be 99% of the particle size.
玻璃粉末的軟化點較佳為480℃以下、450℃以下,特佳為350℃~430℃。若玻璃粉末的軟化點過高,則於雷射密封時玻璃難以軟化,因此若無法使雷射光的輸出上升,則無法提高密封強度。此處,「軟化點」是指利用宏觀型示差熱分析(macro-type differential thermal analyzer)進行測定時的第四反曲點的溫度。The softening point of the glass powder is preferably 480 ° C or lower and 450 ° C or lower, and particularly preferably 350 ° C to 430 ° C. When the softening point of the glass powder is too high, the glass hardly softens during laser sealing. Therefore, if the output of the laser light cannot be increased, the sealing strength cannot be improved. Here, the "softening point" refers to the temperature of the fourth inflection point when measured by a macro-type differential thermal analyzer.
玻璃粉末例如可藉由如下方式製作:準備調配各種原料而成的玻璃母料(glass batch),將其加入至鉑熔融中並以900℃~1200℃熔融1小時~3小時後,將熔融玻璃流出至水冷雙輥間並成形為膜狀,利用球磨機將所獲得的玻璃膜粉碎並進行空氣分級等分級。The glass powder can be produced, for example, by preparing a glass batch prepared by mixing various raw materials, adding it to the platinum melt, and melting at 900 ° C to 1200 ° C for 1 hour to 3 hours, and then melting the glass. The mixture was poured out between water-cooled twin rolls and formed into a film shape, and the obtained glass film was pulverized by a ball mill and classified by air classification or the like.
於鉍系玻璃的製作中使用的原料的一部分中,較佳為使用硝酸鹽原料、硫酸鹽原料、二氧化物原料、過氧化物原料的一種或兩種以上。尤其是,作為Bi2 O3 的導入原料,較佳為使用硝酸鹽原料,作為二氧化物原料,較佳為使用二氧化錳原料,作為過氧化物原料,較佳為使用過錳酸鹽原料。於著色成分中,若氧化數高,則有雷射吸收能力提高的成分(尤其是CuO)。而且,若使用此種原料,則可提高熔融玻璃中的著色成分的氧化數。In a part of the raw materials used for the production of the bismuth-based glass, one or two or more kinds of a nitrate raw material, a sulfate raw material, a dioxide raw material, and a peroxide raw material are preferably used. In particular, as the raw material for the introduction of Bi 2 O 3 , a nitrate raw material is preferably used, and as the raw material of the dioxide, a manganese dioxide raw material is preferably used, and as the peroxide raw material, a permanganate raw material is preferably used. . Among the coloring components, when the oxidation number is high, there is a component (especially CuO) having an improved laser absorption ability. Further, when such a raw material is used, the oxidation number of the colored component in the molten glass can be increased.
於本發明的密封材料中,耐火性填料粉末的含量較佳為1體積%~40體積%、10體積%~45體積%、20體積%~40體積%,特佳為22體積%~35體積%。若耐火性填料粉末的含量少,則有密封材料的熱膨脹係數不恰當地變高之虞。另一方面,若耐火性填料粉末的含量多,則玻璃粉末的含量相對地變少,從而密封材料的軟化流動性容易降低。In the sealing material of the present invention, the content of the refractory filler powder is preferably from 1% by volume to 40% by volume, from 10% by volume to 45% by volume, from 20% by volume to 40% by volume, particularly preferably from 22% by volume to 35% by volume. %. When the content of the refractory filler powder is small, the thermal expansion coefficient of the sealing material is undesirably high. On the other hand, when the content of the refractory filler powder is large, the content of the glass powder is relatively small, and the softening fluidity of the sealing material is liable to lower.
作為耐火性填料粉末,可使用各種材料,其中較佳為選自堇青石、矽鋅礦、氧化鋁、磷酸鋯系化合物、鋯石、氧化鋯、氧化錫、石英玻璃、β-鋰霞石、鋰輝石中的一種或兩種以上。該些耐火性填料粉末除了熱膨脹係數低以外,機械強度高,而且與本發明的鉍系玻璃的相容性良好。另外,β-鋰霞石降低密封材料的熱膨脹係數的效果高,因此特佳。As the refractory filler powder, various materials can be used, among which, it is preferably selected from the group consisting of cordierite, strontium zinc ore, alumina, zirconium phosphate-based compound, zircon, zirconia, tin oxide, quartz glass, and β-eucryptite. One or more of spodumene. These refractory filler powders have high mechanical strength in addition to a low coefficient of thermal expansion, and have good compatibility with the bismuth-based glass of the present invention. Further, since β-eucryptite has a high effect of lowering the thermal expansion coefficient of the sealing material, it is particularly preferable.
耐火性填料粉末的最大粒徑Dmax 較佳為15 μm以下、小於10 μm、小於5 μm,特佳為0.5 μm~小於3 μm。若耐火性填料粉末的最大粒徑Dmax 過大,則難以使被密封物間的間隙均勻化,並且難以使被密封物間的間隙狹小化,從而難以實現有機EL顯示器或氣密封裝的薄型化。再者,於被密封物間的間隙大的情況下,若被密封物與密封材料層的熱膨脹係數差大,則被密封物與密封材料層中容易產生裂紋等。The maximum particle diameter D max of the refractory filler powder is preferably 15 μm or less, less than 10 μm, less than 5 μm, and particularly preferably 0.5 μm to less than 3 μm. When the maximum particle diameter D max of the refractory filler powder is too large, it is difficult to make the gap between the objects to be sealed uniform, and it is difficult to narrow the gap between the objects to be sealed, and it is difficult to reduce the thickness of the organic EL display or the hermetic package. . Further, when the gap between the objects to be sealed is large, if the difference in thermal expansion coefficient between the sealed object and the sealing material layer is large, cracks and the like are likely to occur in the sealed object and the sealing material layer.
於本發明的密封材料中,雷射吸收材的含量較佳為0體積%~5體積%、0體積%~3體積%、0體積%~1體積%,特佳為0體積%~0.1體積%。若雷射吸收材的含量過多,則於雷射密封時,雷射吸收材融入玻璃中,藉此玻璃失透,從而密封材料的軟化流動性容易降低。另外,耐火性填料粉末的含量相對地變少,從而有熱膨脹係數不恰當地上升之虞。In the sealing material of the present invention, the content of the laser absorbing material is preferably from 0% by volume to 5% by volume, from 0% by volume to 3% by volume, from 0% by volume to 1% by volume, particularly preferably from 0% by volume to 0.1% by volume. %. If the content of the laser absorbing material is too large, the laser absorbing material is incorporated into the glass during laser sealing, whereby the glass is devitrified, and the softening fluidity of the sealing material is liable to lower. Further, the content of the refractory filler powder is relatively small, and the thermal expansion coefficient is not properly increased.
於本發明的密封材料中,波長808 nm的單色光中的光吸收率較佳為75%以上,進而佳為80%以上。若該光吸收率低,則於雷射密封時密封材料層無法恰當地吸收光,若無法使雷射光的輸出上升,則無法提高密封強度。再者,若使雷射光的輸出上升,則於雷射密封時有元件熱劣化之虞。此處,「波長808 nm的單色光中的光吸收率」相當於如下值:對煅燒為膜厚5 μm的密封材料層利用分光光度計分別測定λ=808 nm的單色光的反射率與透過率並自100%減去該些的合計值而得的值。In the sealing material of the present invention, the light absorption rate in the monochromatic light having a wavelength of 808 nm is preferably 75% or more, and more preferably 80% or more. When the light absorptivity is low, the sealing material layer cannot absorb light properly at the time of laser sealing, and if the output of the laser light cannot be increased, the sealing strength cannot be improved. Further, when the output of the laser light is increased, there is a possibility that the element is thermally deteriorated during the laser sealing. Here, the "light absorptivity in monochromatic light having a wavelength of 808 nm" corresponds to a value obtained by measuring the reflectance of monochromatic light of λ = 808 nm by a spectrophotometer for a sealing material layer having a thickness of 5 μm. And the transmittance and the value obtained by subtracting the total value of these from 100%.
於本發明的密封材料中,熱膨脹係數較佳為75×10-7 /℃以下,特佳為50×10-7 /℃以上且71×10-7 /℃以下。如此,於被密封物為低膨脹的情況下,被密封物或密封材料層中殘留的應力變小,因此難以於被密封物或密封材料層中產生裂紋。此處,「熱膨脹係數」是指利用推桿式熱膨脹係數測定(熱機械分析(thermomechanical analysis,TMA))裝置測定的值,測定溫度範圍設為30℃~300℃。In the sealing material of the present invention, the coefficient of thermal expansion is preferably 75 × 10 -7 / ° C or less, particularly preferably 50 × 10 -7 / ° C or more and 71 × 10 -7 / ° C or less. As described above, when the object to be sealed is low in expansion, the stress remaining in the sealed object or the sealing material layer is small, so that it is difficult to cause cracks in the sealed object or the sealing material layer. Here, the "thermal expansion coefficient" means a value measured by a pusher type thermal expansion coefficient measurement (thermomechanical analysis (TMA)), and the measurement temperature range is 30 to 300 °C.
於本發明的密封材料中,軟化點較佳為510℃以下、480℃以下,特佳為350℃~450℃。若密封材料的軟化點過高,則於雷射密封時密封材料層難以軟化流動,因此若無法使雷射光的輸出上升,則無法提高密封強度。In the sealing material of the present invention, the softening point is preferably 510 ° C or lower, 480 ° C or lower, and particularly preferably 350 ° C to 450 ° C. When the softening point of the sealing material is too high, it is difficult for the sealing material layer to soften and flow during the laser sealing. Therefore, if the output of the laser light cannot be increased, the sealing strength cannot be improved.
本發明的密封材料可以粉末的狀態供於使用,但若與媒液(vehicle)均勻地混煉而加工為密封材料糊,則容易處理。媒液主要由溶媒與樹脂構成。樹脂是出於調整密封材料糊的黏性的目的而添加。另外,根據需要亦可添加界面活性劑、增黏劑等。密封材料糊是使用分配器或網版印刷機等塗佈機而塗佈於被密封物上後供於脫黏合劑(binder)步驟。The sealing material of the present invention can be used in the form of a powder. However, if it is uniformly kneaded with a vehicle and processed into a sealing material paste, it is easy to handle. The vehicle is mainly composed of a solvent and a resin. The resin is added for the purpose of adjusting the viscosity of the sealing material paste. Further, a surfactant, a tackifier, or the like may be added as needed. The sealing material paste is applied to a sealed object by a coater such as a dispenser or a screen printing machine, and then supplied to a binder.
作為樹脂,可使用丙烯酸酯(丙烯酸樹脂)、乙基纖維素、聚乙二醇衍生物、硝基纖維素、聚甲基苯乙烯、聚伸乙基碳酸酯、甲基丙烯酸酯等。尤其是,丙烯酸酯、硝基纖維素的熱分解性良好,因此較佳。As the resin, acrylate (acrylic resin), ethyl cellulose, polyethylene glycol derivative, nitrocellulose, polymethylstyrene, polyethylene carbonate, methacrylate or the like can be used. In particular, acrylate and nitrocellulose are preferred because they have good thermal decomposition properties.
作為溶媒,可使用N,N'-二甲基甲醯胺(Dimethylformamide,DMF)、α-萜品醇、高級醇、γ-丁內酯(γ-Butyrolactone,γ-BL)、四氫萘(tetralin)、丁基卡必醇乙酸酯、乙酸乙酯、乙酸異戊酯、二乙二醇單乙醚、二乙二醇單乙醚乙酸酯、苄基醇、甲苯、3-甲氧基-3-甲基丁醇、三乙二醇單甲醚、三乙二醇二甲醚、二丙二醇單甲醚、二丙二醇單丁醚、三丙二醇單甲醚、三丙二醇單丁醚、碳酸伸丙酯、二甲基亞碸(Dimethyl sulfoxide,DMSO)、N-甲基-2-吡咯啶酮等。 [實施例]As the solvent, N,N'-dimethylformamide (DMF), α-terpineol, higher alcohol, γ-butyrolactone (γ-BL), tetrahydronaphthalene ( Tetralin), butyl carbitol acetate, ethyl acetate, isoamyl acetate, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, benzyl alcohol, toluene, 3-methoxy- 3-methylbutanol, triethylene glycol monomethyl ether, triethylene glycol dimethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monobutyl ether, carbonic acid Ester, Dimethyl sulfoxide (DMSO), N-methyl-2-pyrrolidone, and the like. [Examples]
基於實施例,對本發明進行詳細說明。再者,以下的實施例僅為例示。本發明並不受以下實施例的任何限定。The present invention will be described in detail based on the embodiments. Furthermore, the following examples are merely illustrative. The invention is not limited by the following examples.
表1、表2表示本發明的實施例(試樣No.1~No.6)與比較例(試樣No.7~No.10)。Tables 1 and 2 show examples (samples No. 1 to No. 6) and comparative examples (sample No. 7 to No. 10) of the present invention.
[表1]
如以下般來製作表中記載的玻璃粉末。首先,以成為表中的玻璃組成的方式,準備調配各種原料而成的玻璃母料,將其加入至鉑坩堝中並以1000℃熔融1小時。於熔融時,使用鉑棒進行攪拌,進行熔融玻璃的均質化。再者,關於試樣No.3~No.5,藉由硝酸鹽原料導入Bi2 O3 的含量的1成。其次,將所獲得的熔融玻璃的一部分流出至水冷雙輥間並成形為膜狀,將剩餘的熔融玻璃流出至碳製模框中並成形為棒狀。最後,利用球磨機將所獲得的玻璃膜粉碎後,以平均粒徑D50 成為1.0 μm且最大粒徑Dmax 成為4.0 μm的方式利用空氣分級機進行分級。另外,關於棒狀的玻璃,於投入至保持為比徐冷點高約20℃的溫度的電爐內後,以3分鐘/分鐘的降溫速度徐冷至常溫。The glass powder described in the table was produced as follows. First, a glass master batch prepared by mixing various raw materials was prepared so as to have a glass composition in the table, which was added to a platinum crucible and melted at 1000 ° C for 1 hour. At the time of melting, stirring was performed using a platinum rod, and homogenization of the molten glass was performed. Furthermore, regarding the sample No.3 ~ No.5, introduced by raw material nitrate Bi 2 O 3 content is 1 percent. Next, a part of the obtained molten glass was discharged between water-cooled twin rolls and formed into a film shape, and the remaining molten glass was discharged into a carbon mold frame and formed into a rod shape. Finally, the obtained glass film was pulverized by a ball mill, and classified by an air classifier so that the average particle diameter D 50 became 1.0 μm and the maximum particle diameter D max was 4.0 μm. In addition, the rod-shaped glass was placed in an electric furnace maintained at a temperature higher than the cold spot by about 20 ° C, and then cooled to a normal temperature at a cooling rate of 3 minutes/min.
耐火物填料粉末使用β-鋰霞石。耐火物填料粉末利用空氣分級而調整為平均粒徑D50 為1.0 μm且最大粒徑Dmax 為3.0 μm。The refractory filler powder uses β-eucryptite. The refractory filler powder was adjusted to have an average particle diameter D 50 of 1.0 μm and a maximum particle diameter D max of 3.0 μm by air classification.
以表中所示的混合比例混合玻璃粉末與耐火性填料粉末,製作試樣No.1~No.10。對試樣No.1~No.10評價熱膨脹係數、光吸收率、軟化流動性、密封強度及氣密性。再者,表中的「A成分」表示Bi2 O3 、B2 O3 、BaO及ZnO的合計含量,「B成分」表示CuO、MnO、Fe2 O3 、TiO2 、V2 O5 、Cr2 O3 、Co3 O4 及NiO的合計含量,「N/A」表示不能評價。The glass powder and the refractory filler powder were mixed at the mixing ratio shown in the table to prepare samples No. 1 to No. 10. The sample Nos. 1 to 10 were evaluated for thermal expansion coefficient, light absorptivity, softening fluidity, sealing strength, and airtightness. In addition, the "component A" in the table indicates the total content of Bi 2 O 3 , B 2 O 3 , BaO, and ZnO, and the "component B" indicates CuO, MnO, Fe 2 O 3 , TiO 2 , V 2 O 5 , The total content of Cr 2 O 3 , Co 3 O 4 and NiO, "N/A" indicates that it cannot be evaluated.
熱膨脹係數是藉由TMA裝置於30℃~300℃的溫度範圍內測定的值。再者,作為TMA的測定試樣,使用於將各試樣緻密地燒結後加工為規定形狀而成者。The coefficient of thermal expansion is a value measured by a TMA apparatus in a temperature range of 30 ° C to 300 ° C. In addition, as a measurement sample of TMA, it is used for the case where each sample is densely sintered and processed into a predetermined shape.
如以下般測定光吸收率。首先,利用三根輥磨機對各試樣與媒液(含有乙基纖維素樹脂的三丙二醇單丁醚)均勻地進行混煉,於糊化後,於無鹼玻璃基板(日本電硝子股份有限公司製造的OA-10、40 mm×40 mm×0.5 mm厚)上塗佈為30 mm×30 mm的正方形,利用乾燥烘箱以120℃進行10分鐘乾燥。其次,自室溫以10℃/分鐘升溫,以510℃進行10分鐘煅燒,之後以10℃/分鐘降溫至室溫並固定於玻璃基板上。繼而,關於所獲得的膜厚5 μm的煅燒膜,利用分光光度計分別測定波長λ=808 nm的單色光的反射率與透過率,並將自100%減去該些的合計值而得的值作為光吸收率。The light absorption rate was measured as follows. First, each sample and the vehicle liquid (tripropylene glycol monobutyl ether containing ethyl cellulose resin) were uniformly kneaded by three roll mills, and after gelatinization, on an alkali-free glass substrate (Nippon Electric Glass Co., Ltd. limited) The company's OA-10, 40 mm × 40 mm × 0.5 mm thick) was coated on a 30 mm × 30 mm square and dried in a drying oven at 120 ° C for 10 minutes. Next, the temperature was raised from room temperature at 10 ° C /min, and calcination was carried out at 510 ° C for 10 minutes, and then cooled to room temperature at 10 ° C / min and fixed on a glass substrate. Then, with respect to the obtained calcined film having a film thickness of 5 μm, the reflectance and transmittance of the monochromatic light having a wavelength of λ = 808 nm were measured by a spectrophotometer, and the total value of these was subtracted from 100%. The value is taken as the light absorption rate.
軟化流動性是以如下方式而評價者:關於各試樣,藉由模具將相當於0.6 cm3 大小的質量的粉末乾式壓製為外徑20 mm的鈕狀,並將其載置於25 mm×25 mm×0.6 mm厚的氧化鋁基板上,於空氣中以10℃/分鐘的速度升溫後,於510℃下保持10分鐘後以10℃/分鐘降溫至室溫,對所獲得的鈕的直徑進行測定。具體而言,將流動徑為16.0 mm以上的情況評價為「○」,將小於16.0 mm的情況評價為「×」。The softening fluidity was evaluated by the following method: for each sample, a powder having a mass equivalent to 0.6 cm 3 was dry-pressed into a button shape having an outer diameter of 20 mm by a mold, and placed on a 25 mm × On a 25 mm × 0.6 mm thick alumina substrate, the temperature was raised at 10 ° C / min in air, and then kept at 510 ° C for 10 minutes, then cooled to room temperature at 10 ° C / min, and the diameter of the obtained button was obtained. The measurement was carried out. Specifically, the case where the flow diameter is 16.0 mm or more is evaluated as "○", and the case where the flow diameter is less than 16.0 mm is evaluated as "X".
如以下般評價密封強度。最初,利用三根輥磨機對各試樣與媒液(含有乙基纖維素樹脂的三丙二醇單丁醚)均勻地進行混煉,於糊化後,於無鹼玻璃基板(日本電硝子股份有限公司製造的OA-10、□40 mm×0.5 mm厚、熱膨脹係數38×10-7 /℃)上,沿無鹼玻璃基板的端緣塗佈為邊框狀(5 μm厚、0.6 mm寬),利用乾燥烘箱以120℃進行10分鐘乾燥。其次,自室溫以10℃/分鐘升溫,以510℃進行10分鐘煅燒,之後以10℃/分鐘降溫至室溫,進行糊中的樹脂成分的灰化(脫黏合劑處理)及密封材料的固著,從而於無鹼玻璃基板上形成密封材料層。其次,於具有密封材料層的無鹼玻璃基板上,準確地重疊並未形成密封材料層的其他無鹼玻璃基板(□40 mm×0.5 mm厚)後,自具有密封材料層的無鹼玻璃基板側沿密封材料層照射波長808 nm的雷射光,藉此使密封材料層軟化流動,從而將無鹼玻璃基板彼此氣密密封。再者,根據密封材料層的平均厚度來調整雷射光的照射條件(輸出、照射速度)。最後,使所獲得的密封結構體自上方1 m落下至混凝土上後,對密封強度進行評價,將無鹼玻璃與密封材料層的界面未發生剝離者評價為「○」,將無鹼玻璃與密封材料層的界面局部發生剝離者評價為「△」,將無鹼玻璃與密封材料層的界面完全發生剝離者評價為「×」。The seal strength was evaluated as follows. Initially, each sample and the vehicle liquid (tripropylene glycol monobutyl ether containing ethyl cellulose resin) were uniformly kneaded by three roll mills, and after gelatinization, on an alkali-free glass substrate (Nippon Electric Glass Co., Ltd. limited) The company's OA-10, □40 mm × 0.5 mm thick, thermal expansion coefficient 38 × 10 -7 / ° C), coated along the edge of the alkali-free glass substrate as a frame (5 μm thick, 0.6 mm wide), Drying was carried out at 120 ° C for 10 minutes using a drying oven. Next, the temperature was raised from room temperature at 10 ° C /min, and calcination was carried out at 510 ° C for 10 minutes, and then the temperature was lowered to room temperature at 10 ° C / min to carry out ashing of the resin component in the paste (debonding treatment) and solidification of the sealing material. Thereby, a sealing material layer is formed on the alkali-free glass substrate. Next, after the other alkali-free glass substrate (□40 mm×0.5 mm thick) which does not form the sealing material layer is accurately overlapped on the alkali-free glass substrate having the sealing material layer, the alkali-free glass substrate having the sealing material layer The side edge sealing material layer irradiates laser light having a wavelength of 808 nm, thereby softening and flowing the sealing material layer, thereby hermetically sealing the alkali-free glass substrates to each other. Further, the irradiation conditions (output, irradiation speed) of the laser light are adjusted in accordance with the average thickness of the sealing material layer. Finally, after the obtained sealing structure was dropped from the upper side to the concrete, the sealing strength was evaluated, and the interface between the alkali-free glass and the sealing material layer was not peeled off and evaluated as "○", and the alkali-free glass and The peeling of the interface of the sealing material layer was evaluated as "△", and the peeling of the interface between the alkali-free glass and the sealing material layer was evaluated as "X".
如以下般評價氣密性。將利用所述方法獲得的密封結構體於保持為121℃、濕度100%、2氣壓的恆溫恆濕槽內保持24小時。其後,利用光學顯微鏡對密封結構體進行觀察,對氣密性進行評價,將密封材料層並未變質且密封結構體內並未確認到水分的侵入者評價為「○」,將密封結構體內並未確認到水分的侵入但密封材料層變質者評價為「△」,將密封結構體內確認到水分的侵入者評價為「×」。The airtightness was evaluated as follows. The sealed structure obtained by the above method was kept in a constant temperature and humidity chamber maintained at 121 ° C, humidity of 100%, and 2 atmospheres for 24 hours. Then, the sealing structure was observed with an optical microscope, and the airtightness was evaluated. The indentation of the sealing material layer was not deteriorated, and the intrusion of the water in the sealed structure was evaluated as "○", and the sealing structure was not confirmed. The intrusion of moisture, but the deterioration of the sealing material layer was evaluated as "△", and the intruder who confirmed the moisture in the sealed structure was evaluated as "x".
根據表1得知,試樣No.1~No.6的玻璃粉末的玻璃組成被控制為規定範圍,因此熱膨脹係數、光吸收率、軟化流動性、密封強度及氣密性的評價良好。另一方面,試樣No.7的莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)小,因此於煅燒時及雷射密封時產生失透,因該失透而軟化流動性的評價不良,並且不能進行密封強度、氣密性的評價。試樣No.8的莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)大,因此光吸收率低,密封強度與氣密性的評價並不良好。試樣No.9的Bi2 O3 +B2 O3 +BaO+ZnO+CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO的含量少,因此光吸收率低,流動性、接著強度、氣密性的評價不良。試樣No.10的莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)大,因此光吸收率低,密封強度與氣密性的評價並不良好。再者,試樣No.8的莫耳比(Bi2 O3 +B2 O3 +BaO+ZnO)/(CuO+MnO+Fe2 O3 +TiO2 +V2 O5 +Cr2 O3 +Co3 O4 +NiO)過大,因此熱膨脹係數稍高。According to Table 1, the glass compositions of the sample Nos. 1 to 6 were controlled to have a predetermined range. Therefore, the evaluation of the thermal expansion coefficient, the light absorptivity, the softening fluidity, the sealing strength, and the airtightness was good. On the other hand, the molar ratio of sample No. 7 (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O Since 3 + Co 3 O 4 + NiO) is small, devitrification occurs during calcination and laser sealing, and the evaluation of softening fluidity due to the devitrification is poor, and the evaluation of sealing strength and airtightness cannot be performed. Mohr ratio of sample No. 8 (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 Since O 4 + NiO) is large, the light absorptivity is low, and the evaluation of sealing strength and airtightness is not good. Sample No. 9 of Bi 2 O 3 + B 2 O 3 + BaO + ZnO + CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 O 4 + NiO When the amount is small, the light absorptivity is low, and the evaluation of fluidity, adhesion strength, and airtightness is poor. Mohr ratio of sample No. 10 (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 + Co 3 Since O 4 + NiO) is large, the light absorptivity is low, and the evaluation of sealing strength and airtightness is not good. Further, the molar ratio of sample No. 8 (Bi 2 O 3 + B 2 O 3 + BaO + ZnO) / (CuO + MnO + Fe 2 O 3 + TiO 2 + V 2 O 5 + Cr 2 O 3 +Co 3 O 4 +NiO) is too large, so the coefficient of thermal expansion is slightly higher.
作為參考,關於試樣No.3,將耐火性填料粉末的7.5體積%量置換為雷射吸收材(Fe2 O3 -Cr2 O3 -MnO系複合氧化物、平均粒徑D50 為1.0 μm、最大粒徑Dmax 為3.0 μm),結果熱膨脹係數上升至77×10-7 /℃。 [產業上的可利用性]For reference, in sample No. 3, the amount of 7.5 vol% of the refractory filler powder was replaced with a laser absorbing material (Fe 2 O 3 -Cr 2 O 3 -MnO composite oxide, and the average particle diameter D 50 was 1.0). Μm, the maximum particle diameter D max was 3.0 μm), and the coefficient of thermal expansion rose to 77 × 10 -7 / ° C. [Industrial availability]
本發明的鉍系玻璃及使用其的密封材料對於有機EL顯示器、有機EL照明裝置等有機EL器件的雷射密封而言較佳,除此以外,對於色素增感型太陽電池、銅銦鎵硒(Copper Indium Gallium Selenide,CIGS)系薄膜化合物太陽電池等太陽電池的雷射密封、MEMS封裝、LED封裝等氣密封裝的雷射密封等而言亦較佳。The bismuth-based glass of the present invention and a sealing material using the same are preferable for laser sealing of an organic EL device such as an organic EL display or an organic EL illuminating device, and in addition to the dye-sensitized solar cell and copper indium gallium selenide. (Copper Indium Gallium Selenide, CIGS) is also preferred for laser sealing of solar cells such as thin film compound solar cells, laser sealing of gas seals such as MEMS packages and LED packages.
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