TW201807142A - 包括胺引發的多元醇的雙組分無溶劑黏著劑組合物 - Google Patents

包括胺引發的多元醇的雙組分無溶劑黏著劑組合物 Download PDF

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TW201807142A
TW201807142A TW106113161A TW106113161A TW201807142A TW 201807142 A TW201807142 A TW 201807142A TW 106113161 A TW106113161 A TW 106113161A TW 106113161 A TW106113161 A TW 106113161A TW 201807142 A TW201807142 A TW 201807142A
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polyol
adhesive composition
component
amine
isocyanate
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TWI793073B (zh
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杰 吳
芮 謝
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陶氏全球科技有限責任公司
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Abstract

揭示一種雙組分無溶劑黏著劑組合物，所述黏著劑組合物包括異氰酸酯組分及多元醇組分，異氰酸酯組分包括至少一種異氰酸酯，多元醇組分包括至少一種胺引發的多元醇，其官能度為3至8且羥基數目為20至1,000。此外，揭示一種用於形成層製品之方法，所述方法包括形成包括胺引發的多元醇的無溶劑黏著劑組合物，在膜表面上塗覆一層所述黏著劑組合物，使所述層與另一膜之表面接觸以形成層製品，且固化所述黏著劑組合物。再者，揭示一種由所述方法形成之層製品。

Description

包括胺引發的多元醇的雙組分無溶劑黏著劑組合物
本發明係關於無溶劑黏著劑組合物。更特定言之，本發明係關於用於製造層製品的在塗覆前預混合的雙組分無溶劑聚胺基甲酸酯黏著劑組合物，所述組合物具有改良的轉化效率、黏合強度、耐化學性與耐熱性以及一級芳族胺及異氰酸酯分解。本發明進一步關於形成包括所揭示之黏著劑組合物之層壓結構的方法。
黏著劑組合物適用於各種目的。舉例而言，黏著劑組合物用於將諸如聚乙烯、聚丙烯、聚酯、聚醯胺、金屬、紙或塞璐芬(cellophane)之基材黏合在一起，形成複合膜，亦即層製品。黏著劑在不同的最終用途應用中之用途大體上已知。舉例而言，黏著劑可用於製造用於包裝行業，尤其用於食品包裝之膜/膜及膜/箔層製品。用於層壓應用之黏著劑或「層壓黏著劑」通常可分為三個類別：溶劑類、水類及無溶劑。黏著劑之效能可視類別及塗覆黏著劑之應用而改變。
可以施用高達100%固體、不含有機溶劑或水性載劑的無溶劑層壓黏著劑。因為在塗覆後不需要自黏著劑乾 燥有機溶劑或水，所以此等黏著劑可以在高線速下操作。溶劑類及水類層壓黏著劑受到在塗覆黏著劑後可有效乾燥且自層壓結構中移除溶劑或水之速率的限制。出於環境、健康及安全原因，層壓黏著劑較佳為水性或無溶劑的。
在無溶劑層壓黏著劑之類別內，存在多個種類。一個特定種類包含在塗覆前預混合的雙組分聚胺基甲酸酯類層壓黏著劑，在本文中稱為「預混合雙組分黏著劑」。通常，雙組分聚胺基甲酸酯類層壓黏著劑包含：第一組分，其包括含異氰酸酯的預聚物及/或聚異氰酸酯；及第二組分，其包括多元醇。預聚物藉由使過量異氰酸酯與每分子含有兩個或更多個羥基之聚醚及/或聚酯反應而獲得。第二組分為經每分子兩個或更多個羥基官能化之聚醚及/或聚酯。以預定比率組合或「預混合」兩種組分，且隨後將其塗覆於基材上，隨後將所述基材層壓至另一基材。
與含傳統溶劑之黏著劑相比，雙組分無溶劑聚胺基甲酸酯類層壓黏著劑包含較弱的初始黏合，且在可處理層製品之前產生緩慢黏合。此外，此等黏著劑往往會呈現較差的耐化學性，尤其在酸性條件中。再者，習知雙組分無溶劑聚胺基甲酸酯類層壓黏著劑呈現緩慢的一級芳族胺及異氰酸酯分解，且因此呈現較低的轉化效率。此外，在聚胺基甲酸酯化學反應中廣泛使用催化劑來加速異氰酸酯與羥基封端之化合物的反應。典型催化劑包含胺催化劑、金屬催化劑、封端胺及金屬催化劑、以及微膠囊化胺及金屬催化劑。此等催化劑可為極有效的，但其並不理想地適合食品接觸應用。此係因為小分子胺及金屬催化劑可能轉移至食品中，從食品安全角度來看，此 可為一個問題。此外，小分子胺催化劑往往具有可改變食品味道之強烈氣味，使得其於直接或間接食品接觸應用而言均不合需要。
因此，具有改良的黏合強度且較快形成黏合、具有改良的耐化學性及耐熱性、以及較快的一級芳族胺及異氰酸酯分解的雙組分無溶劑聚胺基甲酸酯類層壓黏著劑組合物為合乎需要的。再者，不需要使用催化劑來加速異氰酸酯與多元醇之反應的雙組分無溶劑聚胺基甲酸酯類層壓黏著劑組合物為合乎需要的。
揭示雙組分無溶劑聚胺基甲酸酯黏著劑組合物。在一些實施例中，無溶劑黏著劑組合物包括異氰酸酯組分，所述異氰酸酯組分包括至少一種異氰酸酯。無溶劑黏著劑組合物進一步包括多元醇組分，所述多元醇組分包括至少一種胺引發的多元醇。至少一種異氰酸酯可選自由以下各者組成之群：芳族異氰酸酯、脂族異氰酸酯、環脂族異氰酸酯及其組合。至少一種胺引發的多元醇可為環氧烷與胺之反應產物。胺引發的多元醇可進一步包括3至8之官能度及20至1,000之羥基數目。多元醇組分可進一步包括非胺引發的多元醇。
亦揭示一種用於形成層製品之方法。在一些實施例中，所述方法包括藉由預混合兩個組分形成雙組分無溶劑黏著劑組合物，在第一基材之表面上塗覆一層黏著劑組合物，使所述層與第二基材之表面接觸以形成層製品，且固化黏著劑組合物。亦揭示一種由此方法形成之層製品。
參考附圖，其中：圖1為示出了比較實例1及說明性實例1及2之黏度與時間的曲線圖；圖2為示出了比較實例1及說明性實例1及3之黏度與時間的曲線圖；及圖3為示出了比較實例2及說明性實例4及5之黏度與時間的曲線圖。
根據本發明之雙組分無溶劑黏著劑組合物包括異氰酸酯組分及多元醇組分。
異氰酸酯組分
異氰酸酯組分包括至少一種異氰酸酯。至少一種異氰酸酯可選自由以下各者組成之群：異氰酸酯預聚物、異氰酸酯單體、聚異氰酸酯(例如，二聚體、三聚體等)及其兩者或更多者之組合。如本文所用，「聚異氰酸酯」為任何含有兩個或更多個異氰酸酯基之化合物。異氰酸酯預聚物為包括至少一種異氰酸酯及至少一種多元醇之反應物的反應產物。如本文所用，「異氰酸酯預聚物」可為聚異氰酸酯本身。
至少一種異氰酸酯可選自由以下各者組成之群：芳族異氰酸酯、脂族異氰酸酯、環脂族異氰酸酯及其兩者或更多者之組合。「芳族聚異氰酸酯」為含有一或多個芳環之聚異氰酸酯。「脂族聚異氰酸酯」不含芳環。「環脂族聚異氰酸酯」為脂族聚異氰酸酯之子集，其中化學鏈為環結構。
適於根據本發明使用之芳族異氰酸酯的實例包含(但不限於)二異氰酸亞甲基二苯酯(「MDI」)之異構體， 諸如4,4-MDI、2,2-MDI及2,4-MDI；甲苯-二異氰酸酯(「TDI」)之異構體，諸如2,4-TDI、2,6-TDI；萘-二異氰酸酯(「NDI」)之異構體，諸如1,5-NDI；降莰烷二異氰酸酯(「NBDI」)之異構體；四甲基二甲苯二異氰酸酯(「TMXDI」)之異構體；及其兩者或更多者之組合。較佳為MDI之異構體，尤其是4,4-MDI及2,4-MDI之混合物(亦即，液體MDI)或4,4-MDI(亦即，固體MDI)。
適於根據本發明使用之脂族及環脂族異氰酸酯的實例包含(但不限於)二異氰酸己二酯(「HDI」)之異構體、異佛爾酮二異氰酸酯(「IPDI」)之異構體、二甲苯二異氰酸酯(「XDI」)之異構體及其組合。
諸如異氰酸酯組分之具有異氰酸酯基的化合物可由參數「NCO%」表徵，所述參數為按化合物之重量計異氰酸酯基之量(按重量計)。參數NCO%藉由ASTM D 2572-97(2010)之方法量測。所揭示之異氰酸酯組分之NCO%為至少1wt%、或至少5wt%、或至少10wt%。較佳地，異氰酸酯組分之NCO%不超過30wt%、或25wt%、或20wt%。
較佳地，如藉由ASTM D2196之方法所量測，異氰酸酯組分在25℃下之黏度為300mPa-s至12,000mPa-s。
多元醇組分
無溶劑黏著劑組合物進一步包括多元醇組分，所述多元醇組分包括至少一種胺引發的多元醇。在一些實施例中，多元醇組分亦可包括另一類型之多元醇，即非胺引發的多元醇。各多元醇類型可包含一種類別之多元醇。或者，各多元醇類型可包含不同類別之多元醇的混合物。在一些實施例中， 一個多元醇類型可為一種類別之多元醇，而另一多元醇類型可為不同類別之多元醇的混合物。
至少一種胺引發的多元醇改良了黏著劑組合物系統之反應性。特定而言，至少一種胺引發的多元醇為羥基封端之分子，且因此成為由異氰酸酯與多元醇組分反應形成之聚胺基甲酸酯聚合物網的一部分。因此，消除了小分子(例如，催化劑)遷移的問題。
至少一種胺引發的多元醇之官能度為3至8、或4至7、或5至6。如本文所用，「官能度」係指每分子異氰酸酯反應性位點之數目。此外，至少一種胺引發的多元醇之羥基數目為20至1,000、或200至900、或750至850。如本文所用，「羥基數目」為可用於反應之反應性羥基之量的量度。此數目在濕式分析法中測定且報導為等效於一公克樣品中存在之羥基的氫氧化鉀之毫克數。測定羥基數目之最常用的方法描述於ASTM D 4274 D中。再者，至少一種胺引發的多元醇之分子量不超過12,000g/mol、或不超過8,000g/mol、或不超過5,000g/mol。
適於根據本發明使用之胺引發的多元醇係藉由用一或多種環氧烷使一或多種胺引發劑烷氧基化而製得。適合胺引發劑包含(但不限於)甲苯二胺、甲胺、乙二胺、二伸乙三胺、苯胺、胺基乙基乙醇胺、雙-3-胺基丙基甲胺、丙二胺、四-或六亞甲胺、三乙醇胺、苯二胺及其兩者或更多者之組合。適合環氧烷包含(但不限於)環氧乙烷、環氧丙烷、1,2-環氧丁烷及其兩者或更多者之組合。
按預混合黏著劑組合物之重量(亦即，異氰酸酯 組分及多元醇組分之總重量)計，預混合黏著劑組合物中之至少一種胺引發的多元醇之量按重量計為至少0.5wt%、或至少0.7wt%、或至少6wt%。按黏著劑組合物之重量計，預混合黏著劑組合物中之至少一種胺引發的多元醇之量按重量計不超過25wt%、或不超過15wt%、或不超過10wt%。
黏著劑組合物中之至少一種胺引發的多元醇之量視所用至少一種異氰酸酯的反應性而定。一般而言，相比於脂族異氰酸酯類系統，芳族異氰酸酯類黏著劑所需之胺引發的多元醇相對較少。
預期所揭示之無溶劑黏著劑組合物之異氰酸酯組分及多元醇組分可分開製造，且若需要，則儲存至需要使用預混合黏著劑組合物為止。較佳地，異氰酸酯組分及多元醇組分在25℃下各自均為液體。在一些實施例中，當需要使用黏著劑組合物時，使異氰酸酯組分與多元醇組分彼此接觸且混合在一起。預期當此兩種組分接觸時，固化反應開始，其中異氰酸酯基與羥基反應形成胺基甲酸酯鍵聯。藉由使兩種組分接觸形成之黏著劑組合物可稱作「可固化混合物」。
較佳地，使可固化混合物固化所需之時間與達成足夠黏合強度所需之時間一樣短。此係因為較短的固化時間提高了層製品形成製程之效率。傳統上，脂族異氰酸酯並非較佳的，因為其反應性比芳族異氰酸酯小，導致固化時間較長。然而，所揭示之黏著劑組合物達成了相對較短的固化時間，即使在異氰酸酯組分包括脂族異氰酸酯時仍然如此。
在一些實施例中，黏著劑組合物中可視情況包含一或多種非胺引發的多元醇。非胺引發的多元醇之實例包含 (但不限於)聚酯多元醇、聚醚多元醇、聚碳酸酯多元醇、聚丙烯酸酯多元醇、聚己內酯多元醇、聚烯烴多元醇、天然油多元醇及其兩者或更多者之組合。較佳地，如藉由ASTM D2196之方法所量測，非胺引發的多元醇在25℃下之黏度為10mPa-s至40,000mPa-s。
按黏著劑組合物之重量計，預混合黏著劑組合物中之至少一種非胺引發的多元醇之量為至少10wt%、或至少20wt%、或至少30wt%。按黏著劑組合物之重量計，預混合黏著劑組合物中之至少一種非胺引發的多元醇之量不超過60wt%、或不超過50wt%、或不超過40wt%。
較佳地，異氰酸酯組分與多元醇組分之化學計量比為1：1或更高，諸如1.2：1或更高，或諸如1.4：1或更高。較佳地，異氰酸酯組分與多元醇組分之化學計量比為3：1或更低，諸如2.5：1或更低，或諸如2：1或更低。一般而言，工業應用(例如，管道)之異氰酸酯組分與多元醇組分的比率可相對高於消費型商品應用(例如，食品包裝)的比率，在所述消費型商品應用中，存在異氰酸酯自黏著劑轉移至食品中的安全問題。
在一些實施例中，可在黏著劑組合物中視情況包含一或多種添加劑。所述添加劑之實例包含(但不限於)增黏劑、塑化劑、流變改質劑、助黏劑、抗氧化劑、填充劑、著色劑、界面活性劑、催化劑、溶劑及其兩者或更多者之組合。
在一些實施例中，可視情況在黏著劑組合物中包含一或多種催化劑。
亦揭示一種使用黏著劑組合物形成層製品之方 法。較佳地，黏著劑組合物，諸如包括以上所論述的混合的異氰酸酯及多元醇組分的黏著劑組合物，在25℃下呈液態。即使組合物在25℃下為固體，仍可接受視需要加熱組合物以使其呈液態。在諸如膜之第一基材的表面上塗覆一層組合物。「膜」為在一個維度中為0.5mm或更小且在其他兩個維度中均為1cm或更大的任何結構。聚合物膜為由聚合物或聚合物之混合物製成的膜。聚合物膜之組成通常為80重量%或更大重量百分比的一或多種聚合物。較佳地，可固化黏著劑混合物層之厚度為1至5μm。
使第二基材之表面與可固化混合物層接觸以形成未固化的層製品。舉例而言，可以藉由使未固化的層製品通過軋輥對其施壓，所述軋輥可以經過加熱或可以不經過加熱。可對未固化的層製品進行加熱以加速固化反應。然而，對於芳族異氰酸酯類黏著劑而言，未固化的層製品可以在環境溫度下在二至三天內達到完全固化；或者在脂族異氰酸酯類黏著劑之情況下，在一至兩週內達到完全固化。
適合基材包含膜，諸如紙、織物及不織布纖維、金屬箔、聚合物及經金屬塗佈之聚合物。膜視情況具有上面印刷有油墨之表面；所述油墨可與黏著劑組合物接觸。
本發明之實例
現將藉由示出說明性實例及比較實例(統稱為「實例」)來進一步詳細解釋本發明。然而，本發明之範疇當然不限於所述實例。
在以下表1中詳述用於說明性實例(「IE」)及比較實例(「CE」)之原材料。
包括芳族異氰酸酯之實例根據表2中所列之配方，使用表1中所列之原材料製備。
包括脂族異氰酸酯之實例根據表3中所列之配方，使用表1中所列之原材料製備。
實例1(「IE1」)
將包括約66.7wt%組分A、32.6wt%組分C及0.7wt%組分D之聚胺基甲酸酯黏著劑組合物以1.0：1.4 (OH/NCO)之化學計量比混合。在40℃下，藉由布氏(Brookfield)DV-II黏度計量測如此調配之黏著劑的黏度積聚。此黏著劑用於黏合聚對苯二甲酸伸乙酯(「PET」)/箔結構、箔/聚乙烯(「PE」)結構及PET/PE結構。在22℃及50%相對濕度下固化所製造之層製品。將層製品樣品切割成25.4mm寬的條帶，且在Thwing-Albert剝離測試儀上以10吋/分鐘評估其T-剝離黏合強度。若基材中之一者伸長或撕裂，則記錄最大力或斷裂時的力。若兩個基材分離，則記錄測試期間力的平均值。黏合強度值為至少三個樣品條帶之平均值。在固化14天後，對PET/PE層製品進行蒸煮袋測試，包含DI水及1：1：1醬料模擬物(亦即，等份的醋、玉米油及番茄醬)。用於蒸煮袋測試之小袋的內部大小為4吋×6吋，且填充有100ml水或1：1：1醬料。隨後，將其於沸水中置放30分鐘。當完成時，自與沸水接觸之區域切割出至少三個25.4mm寬的條帶且在Thwing-Albert剝離測試儀上，使用與上文所論述的相同方法量測其黏合強度。
實例2(「IE2」)
將包括約66.4wt%組分A、32.9wt%組分C及0.7wt%組分E之聚胺基甲酸酯黏著劑組合物以1.0：1.4(OH/NCO)之化學計量比混合。在40℃下，藉由布氏DV-II黏度計量測如此調配之黏著劑的黏度積聚。此黏著劑用於黏合PET/PE結構。在22℃及50%相對濕度下固化所產生之層製品且隨後在Thwing-Albert剝離測試儀上以10吋/分鐘評估其黏合強度。在固化14天後，對PET/PE層製品進行蒸煮袋測試，包含DI水及1：1：1醬料模擬物(亦即，等份的醋、玉 米油及番茄醬)。
實例3(「IE3」)
將包括約68.1wt%組分A、30.3wt%組分C及1.6wt%組分D之聚胺基甲酸酯黏著劑組合物以1.0：1.4(OH/NCO)之化學計量比混合。在40℃下，藉由布氏DV-II黏度計量測如此調配之黏著劑的黏度積聚。此黏著劑用於黏合PET/箔結構及箔/PE結構。在22℃及50%相對濕度下固化所產生之層製品且隨後在Thwing-Albert剝離測試儀上以10吋/分鐘評估其黏合強度。
比較實例1(「CE1」)
將包括約65.8wt%組分A及34.2wt%組分C之聚胺基甲酸酯黏著劑組合物以1.0：1.4(OH/NCO)之化學計量比混合。在40℃下，藉由布氏DV-II黏度計量測如此調配之黏著劑的黏度積聚。此黏著劑用於黏合PET/箔結構、箔/PE及PET/PE結構。在22℃及50%相對濕度下固化所產生之層製品且在Thwing-Albert剝離測試儀上以10吋/分鐘評估其黏合強度。在固化14天後，對PET/PE層製品進行蒸煮袋測試，包含DI水及1：1：1醬料模擬物(亦即，等份的醋、玉米油及番茄醬)。用於此測試之小袋的內部大小為4吋×6吋，且填充有100ml水或1：1：1醬料。隨後，將其於沸水中置放30分鐘。當完成時，自與沸水接觸之區域切割出至少三個25.4mm寬的條帶且在Thwing-Albert剝離測試儀上，使用與上文所論述的相同方法量測其黏合強度。
實例4(「IE4」)
將包括約37.1wt% MOR-FREETM 225、56.8wt% MOR-FREETM C-33及6.1wt%組分D之聚胺基甲酸酯黏著劑組合物以1.0：1.2(OH/NCO)之化學計量比混合。在40℃下，在AR-2000流變儀上量測如此調配之黏著劑的黏度積聚。此黏著劑用於黏合PET/PE結構及箔/鑄造聚丙烯(「CPP」)結構。在40℃及22%相對濕度下固化所產生之層製品且在Thwing-Albert剝離測試儀上以10吋/分鐘評估其黏合強度。
實例5(「IE5」)
將包括約30.3wt%組分F、60.5wt%組分B及9.2wt%組分D之聚胺基甲酸酯黏著劑組合物以1.0：1.2(OH/NCO)之化學計量比混合。在40℃下，在AR-2000流變儀上量測如此調配之黏著劑的黏度積聚。此黏著劑用於黏合PET/PE結構及箔/CPP結構。在40℃及22%相對濕度下固化所產生之層製品且在Thwing-Albert剝離測試儀上以10吋/分鐘評估其黏合強度。
比較實例2(「CE2」)
將包括約50wt%組分F及50wt%組分B之聚胺基甲酸酯黏著劑組合物以1.0：1.2(OH/NCO)之化學計量比混合。在40℃下，在AR-2000流變儀上量測如此調配之黏著劑的黏度積聚。此黏著劑用於黏合PET/PE結構及箔/CPP結構。在40℃及22%相對濕度下固化所產生之層製品且在Thwing-Albert剝離測試儀上以10吋/分鐘評估其黏合強度。
圖1、圖2及圖3顯示，藉由併入所揭示之胺引發的多元醇，聚胺基甲酸酯層壓黏著劑之固化速率相對加快了。舉例而言，且如圖1中所展示，CE1之黏度在38分鐘時達到4,000cp，然而添加有少量組分D及RA640的IE1及IE2 分別在29分鐘及30分鐘時達成4,000cp。另舉例而言，且如圖2中所展示，所調配之黏著劑的黏度積累隨著組分D增加而加快。CE2為脂族異氰酸酯類系統，展現相對較低的固化速率且其黏度在一小時內變化不大，如圖3中所示。另一方面，IE4及IE5展現出較快固化的性質。
表4至表6說明，在黏著劑組合物中併入胺引發的多元醇大大加快了層製品之黏合強度發展，尤其對於脂族異氰酸酯類系統而言。表4中之資料係關於PET/PE及箔/CPP層製品。表5中之資料係關於具有脂族異氰酸酯類黏著劑之PET/箔層製品。表6係關於具有芳族異氰酸酯類黏著劑之箔/PE層製品。表5中所詳述的PET/箔結構之失效模式明顯由 黏著劑開裂改為膜撕裂，且IE1及IE3之第7天黏合強度亦高於CE1。
如表7中所示，相比於CE1，在IE1及IE2中併入胺引發的多元醇並不會犧牲效能。實際上，甚至改良了IE1及IE2之耐化學性。

Claims (18)

  1. 一種預混合雙組分無溶劑黏著劑組合物，包括：異氰酸酯組分，其包括至少一種異氰酸酯；及多元醇組分，其包括至少一種胺引發的多元醇，其官能度為3至8且羥基數目為20至1,000。
  2. 如申請專利範圍第1項所述的雙組分無溶劑黏著劑組合物，其中所述至少一種異氰酸酯選自由以下各者組成之群：單體異氰酸酯、聚合異氰酸酯、異氰酸酯預聚物及其兩者或更多者之組合。
  3. 如申請專利範圍第1項所述的雙組分無溶劑黏著劑組合物，其中所述至少一種異氰酸酯選自由以下各者組成之群：二異氰酸己二酯(「HDI」)及其異構體、異佛爾酮二異氰酸酯(「IPDI」)及其異構體、降莰烷二異氰酸酯(「NBDI」)及其異構體、四甲基二甲苯二異氰酸酯(「TMXDI」)及其異構體、二甲苯二異氰酸酯(「XDI」)及其異構體、甲苯二異氰酸酯(「TDI」)及其異構體、二苯基甲烷二異氰酸酯(「MDI」)及其異構體、其異氰酸酯預聚物及其兩者或更多者之組合。
  4. 如申請專利範圍第1項所述的雙組分無溶劑黏著劑組合物，其中所述胺引發的多元醇為C1-C6環氧烷與胺之反應產物。
  5. 如申請專利範圍第4項所述的雙組分無溶劑黏著劑組合物，其中所述胺選自由以下各者組成之群：甲苯二胺、甲胺、乙二胺、二伸乙三胺、苯胺、胺基乙基乙醇胺、雙-3-胺基丙基甲胺、丙二胺、四-或六亞甲胺、三乙醇胺、苯二 胺及其兩者或更多者之組合。
  6. 如申請專利範圍第1項所述的雙組分無溶劑黏著劑組合物，其中按所述黏著劑組合物之總重量計，所述胺引發的多元醇佔所述黏著劑組合物之0.5至12wt%。
  7. 如申請專利範圍第1項所述的雙組分無溶劑黏著劑組合物，所述多元醇組分進一步包括至少一種選自由以下各者組成之群的非胺引發的多元醇：聚酯多元醇、聚醚多醇、聚碳酸酯多元醇、聚丙烯酸酯多元醇、聚己內酯多元醇、聚烯烴多元醇、天然油多元醇及其兩者或更多者之組合。
  8. 如申請專利範圍第1項所述的雙組分無溶劑黏著劑組合物，其進一步包括選自由以下各者組成之群的添加劑：增黏劑、塑化劑、流變改質劑、助黏劑、抗氧化劑、填充劑、著色劑、界面活性劑、催化劑、溶劑及其兩者或更多者之組合。
  9. 如申請專利範圍第1項所述的雙組分無溶劑黏著劑組合物，其中所述異氰酸酯組分與所述多元醇組分之化學計量比為3：1至1：1。
  10. 一種用於形成層製品之方法，包括：藉由混合包括以下之反應物而形成無溶劑黏著劑組合物：異氰酸酯組分，其包括至少一種異氰酸酯；及多元醇組分，其包括至少一種胺引發的多元醇，其官能度為3至8且羥基數目為20至1,000；在第一基材之表面上塗覆一層所述黏著劑組合物；使所述層與第二基材之表面接觸以形成層製品；及固化所述黏著劑組合物。
  11. 如申請專利範圍第10項所述的用於形成層製品之方法，其中所述胺引發的多元醇為C1-C6環氧烷與胺之反應產物。
  12. 如申請專利範圍第11項所述的用於形成層製品之方法，其中所述環氧烷選自由以下各者組成之群：環氧乙烷、環氧丙烷、1,2-環氧丁烷及其兩者或更多者之組合。
  13. 如申請專利範圍第11項所述的用於形成層製品之方法，其中所述胺選自由以下各者組成之群：甲苯二胺、甲胺、乙二胺、二伸乙三胺、苯胺、胺基乙基乙醇胺、雙-3-胺基丙基甲胺、丙二胺、四-或六亞甲胺、三乙醇胺、苯二胺及其兩者或更多者之組合。
  14. 如申請專利範圍第10項所述的用於形成層製品之方法，其中按所述多元醇組分之總重量計，所述胺引發的多元醇佔所述多元醇組分之0.5至12wt%。
  15. 如申請專利範圍第10項所述的用於形成層製品之方法，所述多元醇組分進一步包括至少一種選自由以下各者組成之群的非胺引發的多元醇：聚酯多元醇、聚醚多元醇、聚碳酸酯多元醇、聚丙烯酸酯多元醇、聚己內酯多元醇、聚烯烴多元醇、天然油多元醇及其兩者或更多者之組合。
  16. 如申請專利範圍第10項所述的用於形成層製品之方法，進一步包括向所述黏著劑組合物中添加添加劑，所述添加劑選自由以下各者組成之群：增黏劑、塑化劑、流變改質劑、助黏劑、抗氧化劑、填充劑、著色劑、界面活性劑、催化劑、溶劑及其兩者或更多者之組合。
  17. 如申請專利範圍第10項所述的用於形成層製品之方法， 其中所述第一基材及第二基材各自選自由以下各者組成之群：木材、金屬、塑膠、複合材料、紙、織物及其兩者或更多者之組合。
  18. 一種層製品，其由如申請專利範圍第10項所述的方法形成。
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