TW201805118A - Chemical-mechanical polishing trimmer capable of adjusting protruded height of polishing bit by adjusting protruded height of polishing bit to provide height compensation and maintain trimmer performance - Google Patents

Abstract

A chemical-mechanical polishing trimmer capable of adjusting protruded height of polishing bit comprises a base, a plurality of polishing units, a plurality of cushioning units, and a plurality of adjusting units. The base has an upper surface, and a plurality of receiving grooves penetrating through the upper surface. The polishing unit is received in the receiving groove and comprises a polishing bit. The polishing bit includes a tip protruded from an opening and an expanding portion extended from the tip to a carrying column. The cushioning unit is received in the receiving groove and includes an elastic stopping member disposed at the opening. The elastic stopping member has a hollow portion, wherein the inner diameter of the hollow portion is between the tip and the expanding portion. The adjusting unit is received in the receiving groove and includes a screw, which is screwed with the threaded wall and may carry the carrying column to adjust the height of the tip protruded from the opening.

Description

Chemical mechanical polishing dresser capable of adjusting protruding height of abrasive particles

The invention relates to a chemical mechanical polishing dresser, in particular to a chemical mechanical polishing dresser capable of adjusting the protruding height of abrasive particles.

During the semiconductor wafer manufacturing process, a chemical mechanical polish (CMP) process is widely used to polish the wafer to flatten the surface of the wafer. A common chemical mechanical polishing process is to use a polishing pad (or polishing pad) with a plurality of polishing particles to polish a wafer surface, and the polishing particles are adjusted in height to improve the precision of the polishing pad.

For example, the Republic of China Invention Patent Publication No. 562719 proposes a dressing disc capable of individually adjusting an abrasive grain, and welding each independent abrasive grain to the top end surface of a metal rod with a welding material. If a groove is preset on the top surface of the rod, the abrasive grain can also be fixed in a specific direction according to its crystal shape and then welded firmly. Because the abrasive particles are welded to the metal rod, the metal disc does not need to be heated, so its machining accuracy can be maintained. At this time, the distribution of the abrasive particles can be controlled by inserting the welded metal rods into the pin holes of the specific positions of the metal discs, respectively.

See also the Republic of China Invention Patent Publication No. 201532734, which proposes a high-performance chemical mechanical polishing dresser, which includes a substrate, a bonding layer, and a plurality of polishing particles. The bonding layer is directly fixed on the substrate, or each abrasive particle is disposed on a metal fixing seat, and the substrate has a plurality of grooves or a plurality of through holes, so that the metal fixing seat is accommodated in The grooves or the through holes, and the metal fixing seat is fixed on the substrate by the bonding layer, wherein the abrasive particles are processed by a surface processing so that the abrasive particles have a specific cutting edge angle , Crystal structure, tip height, and tip directivity, or the abrasive particles are unprocessed abrasive particles.

In addition, the Republic of China Invention Patent Application No. 104117686 filed by the applicant of this case proposes a chemical mechanical polishing dresser, which includes a substrate and a plurality of polishing units. The substrate has a horizontal top surface, and the polishing units are disposed on the substrate. The horizontal top surface includes a polishing unit substrate, a polishing layer, and a bonding layer. The polishing unit substrate has an upper surface and a lower surface opposite to each other. The polishing layer is formed on the upper surface and has a plurality of polishing tips. The layer is formed between the lower surface and the substrate and forms an inclined surface on a surface facing the lower surface. The grinding units further include a pad, the pad is provided on the horizontal top surface of the substrate and is placed on one side of the lower surface, and the bonding layer is formed on the lower surface and the pad. The inclined surface is formed between the horizontal top surface and a surface facing the lower surface.

See also the Republic of China Invention Patent Publication No. I228066, which proposes a dresser for polishing cloth, which is a dresser for polishing cloth with a dressing surface formed on the surface of a rotatable metal table, which is characterized in that: A plurality of grindstone particle groups are arranged side by side in the circumferential direction. The metal table is provided with the above-mentioned trimmed surface that can adjust a reference surface formed by the front ends of a plurality of grindstone particles among all or a part of the grindstone particle groups. Height adjustment mechanism. The above-mentioned adjusting mechanism is composed of a base on which a grindstone particle group is fixed on the surface, and can be slid up and down to be embedded in a recessed portion opened on the surface of the metal table, and is arranged on the back of the base, and is screwed on from the above The bottom surface of the recessed portion of the metal table penetrates the adjustment screw for the screw hole on the back side of the metal table, and the height position of the reference surface of the grindstone particle group fixed to the base table is adjusted by the adjustment screw.

In the above prior art, the Republic of China Invention Patent Publication No. 562719 first welded each independent abrasive grain to the top end surface of a metal rod with a welding material, and then inserted the metal rod into the metal disc. Inside the hole, and buckle the metal plate on the plate to adjust the height of the apex of the abrasive grains. After the height of the apex is adjusted, the metal rod is fixed to the metal plate through the bonding material and then fixed. The subsequent abrasive particles cannot be adjusted again in height; the Republic of China Publication No. 201532734 fixes the abrasive particles or the metal fixing seat carrying the abrasive particles directly on the substrate through the bonding layer. Similar to the previous prior art, the height cannot be adjusted after being fixed; however, the Republic of China Patent Application No. 104117686 adjusts the height of the grinding tip through the pad first, and then adjusts the horizontal top of the substrate after adjustment. The bonding layer is formed between the surface and the lower surface of the polishing unit substrate, and is used to firmly fix the polishing unit to the substrate. In this case, the height cannot be adjusted after the fixing. Line adjustment of the question.

In addition, although the Republic of China Invention Patent Bulletin No. I228066 discloses that the height difference of the grindstone particle group can be adjusted by rotating the adjustment screw, the adjustment mechanism is partially exposed outside the metal table, so it is easy to make the grinding during the grinding process. The stone particles or the adjustment mechanism fall off the metal table, causing a problem of poor trimming stability. The adjustment mechanism is directly installed on the metal table, and there is no buffer mechanism to buffer the impact caused by the grinding. It is easy to cause damage to the metal table, the adjustment mechanism or the grindstone particle group during the grinding process. In addition, when the grindstone particle group is to be replaced, it needs to be replaced together with the adjustment mechanism, so that the cost of consumables is relatively increased.

To sum up, the traditional chemical mechanical polishing dresser still needs to be improved in the technology of adjusting the protruding height of the abrasive particles.

The main purpose of the present invention is to solve the problem that the conventional chemical mechanical polishing dresser needs to be improved in terms of adjusting the protruding height of the abrasive particles.

To achieve the above object, the present invention provides a chemical mechanical polishing dresser capable of adjusting the protruding height of abrasive particles, which includes a base, a plurality of grinding units, a plurality of buffer units, and a plurality of adjusting units. The base has an upper surface and A plurality of accommodating grooves penetrating through the upper surface, the accommodating grooves respectively having an opening adjacent to the upper surface and a threaded wall away from the upper surface; the grinding unit is accommodated in the accommodating groove, including a bearing post And an abrasive particle disposed on the bearing column, the abrasive particle having a tip protruding from the opening and an enlarged portion extending from the tip toward the bearing column, the buffer unit being accommodated in the accommodation slot, including a setting An elastic stopper at the opening, the elastic stopper has a hollow, the hollow inner diameter is between the tip and the enlarged portion, and the adjustment unit is accommodated in the accommodation slot, including one and the thread The wall screw incorporates a screw member carrying the bearing post to adjust the tip protruding to a protruding height away from the opening.

In one embodiment, the elastic stopper is a rubber O-ring.

In an embodiment, the buffer unit further includes an elastic buffer member disposed between the bearing post and the adjustment unit.

In one embodiment, the elastic buffer is a silicon pad.

In an embodiment, the base further includes a plurality of stop walls protruding from the opening of the receiving groove and having a second inner diameter smaller than a first inner diameter of the receiving groove. path.

In one embodiment, the material of the base is selected from the group consisting of stainless steel, metal materials, plastic materials and ceramic materials.

In one embodiment, the material of the supporting post is selected from the group consisting of stainless steel, metal material, plastic material and ceramic material.

In an embodiment, the grinding unit further includes a bonding layer formed between the bearing column and the grinding particles and fixing the grinding particles on the bearing column.

In one embodiment, the composition of the bonding layer is selected from the group consisting of a ceramic material, a brazing material, a plating material, a metal material, and a polymer material.

In one embodiment, the protruding height is between 10 μm and 500 μm.

In one embodiment, the end of the adjusting unit remote from the bearing post has a latching slot, and the shape of the latching slot is selected from a group consisting of a hexagonal shape, a straight shape, and a cross shape.

In one embodiment, the bearing post is disposed in the receiving groove, and the abrasive particles are partially blocked by the elastic stopper and protrude outside the receiving groove.

In one embodiment, the protruding height is less than a height of the abrasive particles.

To sum up, the effect of the present invention compared to the conventional technique is that the present invention uses the adjusting unit to adjust the protruding height of the tip of the abrasive particle protruding from the opening. During use, when the part is Or the specific abrasive particle group wears to a certain degree, the protruding height can be adjusted by the adjustment unit to provide height compensation and maintain the performance of the dresser; secondly, even after production is completed, during use, or according to different According to application requirements, the protruding height can be adjusted elastically, and because the elastic stopper is provided, the grinding unit and the adjustment unit are blocked by the elastic stopper. During the trimming process, the grinding unit and the The adjustment unit will not fall off easily, which will improve the stability during trimming. In addition, the buffer unit is provided in the accommodating groove. When the abrasive particles contact the workpiece to be trimmed, a cushioning effect can be provided to reduce the damage rate. In addition, since the grinding unit and the adjustment unit are provided in an independent manner, when a particular grinding unit is worn or damaged, it is only necessary to replace the grinding unit separately, thereby greatly reducing costs.

The detailed description and technical contents of the present invention are described below with reference to the drawings:

Please refer to "Figure 1" to "Figure 3" for a top view of the chemical mechanical polishing dresser in an embodiment of the present invention, a cross-sectional view in the AA direction of "Figure 1", and a structural decomposition of an embodiment of the present invention. The present invention is a chemical mechanical polishing dresser capable of adjusting the protruding height of abrasive particles. The chemical mechanical polishing dresser includes a base 10, a plurality of grinding units 20, a plurality of buffer units 30, and a plurality of adjusting units 40. The base 10 has a top Surface 101, a plurality of receiving grooves 102, and a plurality of blocking walls 103. The receiving grooves 102 penetrate through the upper surface 101 and have a first inner diameter, respectively including an opening 1021 adjacent to the upper surface 101 and a distance The threaded wall 1022 of the upper surface 101 and the blocking wall 103 are protruded at the opening 1021 of the receiving groove 102 and have a second inner diameter smaller than the first inner diameter. In one embodiment of the present invention, The material of the base 10 is stainless steel, metal material, plastic material, ceramic material, or a combination thereof.

The grinding unit 20 is received in the accommodating groove 102, and includes a bearing post 21 and an abrasive particle 22 disposed on the bearing post 21. The grinding particle 22 has a tip 221 protruding from the opening 1021 and an opening 221. The enlarged portion 222 of the tip 221 extending toward the bearing post 21. The abrasive particles 22 may be artificial diamond, natural diamond, polycrystalline diamond, or cubic boron nitride. In an embodiment of the present invention, the material of the supporting post 21 may be stainless steel, metal material, plastic material, ceramic material, or a combination thereof. In this embodiment, the grinding unit 20 further includes a bonding layer 23 formed between the bearing column 21 and the grinding particles 22 and fixing the grinding particle 22 on the bearing column 21. The material of the binding layer 23 It can be ceramic material, brazing material, electroplating material, metal material or polymer material. Among them, the brazing material can be metal or alloy of iron, cobalt, nickel, chromium, manganese, silicon, aluminum, boron, and carbon. In an embodiment, the brazing material may be an alloy of Nicrobraz LM, and its composition is 7 wt.% Cr, 3.1 wt.% B, 4.5 wt.% Si, 3.0 wt.% Fe, 0.06 wt% C, the rest is Ni; the polymer material may be epoxy resin, polyester resin, polyacrylic resin or phenolic resin. In the present invention, the base 10 and the supporting column 21 are preferably made of stainless steel, but the present invention is not limited thereto, and users can change according to requirements.

The buffer unit 30 is accommodated in the accommodation groove 102 and includes an elastic stopper 31 provided in the opening 1021. The elastic stopper 31 has a hollow, and the hollow inner diameter is between the tip 221 and the expansion. Department 222. In this embodiment, the abrasive particles 22 of the grinding unit 20 pass through the hollow of the elastic stopper 31, so that the elastic stopper 31 is pressed by the stopper wall 103 and fixed to the bearing post 21. And the stop wall 103. Regarding the manner of setting the elastic stopper 31, the present invention is not limited to the foregoing. For example, in another embodiment, a groove may be provided at a position of the receiving groove 102 near the opening 1021, so that An outer ring portion of the elastic stopper 31 is fixed in the groove. In another embodiment, the outer ring portion of the elastic stopper 31 can be adhered to the receiving groove 102 through an adhesive. Close to the opening 1021. In addition, in the present embodiment, the buffer unit 30 further includes an elastic buffer member 32 disposed between the bearing post 21 and the adjustment unit 40. The elastic stopper 31 may be a rubber O-ring (O -ring), the elastic cushioning member 32 may be a silicon pad.

The adjusting unit 40 is accommodated in the bottom of the accommodating slot 102 and includes a screw member 41. The screw member 41 and the threaded wall 1022 are screwed together to carry the bearing column 21 to adjust the tip 221 to protrude away from the upper surface 101. A protruding height, wherein the protruding height is between 10 μm and 500 μm, and the protruding height is smaller than a height of the abrasive particles 22. In this embodiment, one end of the screw member 41 away from the bearing post 21 has a slot, and the shape of the slot can be hexagonal, straight or cross-shaped, so that the user can insert the slot with a tool. And turn the screw member 41.

Please refer to FIG. 4 and FIG. 5 for a schematic diagram of the abrasive particles having the first protruding height in an embodiment of the present invention and the abrasive particles having the second protruding height in an embodiment of the present invention. After the assembly is completed, the screw member 41 can be moved in the direction of the opening 1021 to push the bearing column 21 upward, so that the tip 221 of the abrasive particle 22 passes through the elastic stopper 31. The abrasive particles 22 will be partially blocked by the elastic stopper 31 and partially protrude by a first protruding height h1 outside the accommodation groove 102, as shown in FIG. 4; when the protruding height is to be adjusted, the screw member 41 further moves in the direction of the opening 1021, so that the thickness of the elastic stopper 31 and the elastic buffer 32 is compressed, and the tip 221 protrudes from the upper surface 101 by a second protruding height h2, as shown in FIG. 5 As shown. For practical applications, a load control can be used to determine the protruding height of the tip 221 of each of the abrasive particles 22 on the upper surface 101, such as controlling the locking pounds of the adjusting unit 40.

Please refer to "Figure 6" and "Figure 7" for a schematic view of the abrasive particles after abrasion in one embodiment of the present invention and a schematic diagram of the abrasive particle height after compensation for abrasion in an embodiment of the present invention during the grinding process. The abrasive particles 22 will have abrasion. Based on the embodiment of FIG. 4, part of the first protruding height h1 of the tip 221 of the abrasive particles 22 on the upper surface 101 is abraded to A third protruding height h3. The third protruding height h3 is smaller than the first protruding height h1, as shown in FIG. 6. At this time, the dressing efficiency will be affected by the protruding height difference of the abrasive particles 22. By controlling the screw 41 to adjust the protruding height of the tip 221, the tip 221 of the abrasive particles 22 with more abrasion is adjusted. The third protruding height h3 is adjusted to the first protruding height h1 again, as shown in FIG. 7.

In summary, since the adjusting unit can adjust the protruding height of the tip of the abrasive particles protruding from the opening, during the use, when part or a specific group of the abrasive particles is worn to a certain degree, the adjustment can be performed by the adjustment. The unit adjusts the protruding height to provide height compensation and maintain the function of the dresser; and even after the production is completed, during use, or according to different application requirements, the protruding height can be flexibly adjusted, and because of the flexibility provided The stopper, the grinding unit and the adjustment unit are blocked by the elastic stopper. During the trimming process, the grinding unit and the adjustment unit will not easily fall off, which will improve the stability during trimming. The buffer unit is in the accommodating groove. When the abrasive particles contact the workpiece to be trimmed, a buffering effect can be provided to reduce the damage rate. The buffer unit keeps the grinding unit firmly in the accommodating groove to prevent the grinding. When the unit is grinding, a rotation effect is generated to fall off. On the other hand, the buffer unit further provides a buffer when the adjustment unit advances the grinding unit. Fruit, so that the polishing unit has a trimming effect. In addition, since the grinding unit and the adjustment unit are provided in an independent manner, when the specific grinding unit is worn or damaged, as long as the grinding unit is replaced, the cost of consumables can be greatly reduced.

The present invention has been described in detail above, but the above is only a preferred embodiment of the present invention, and the scope of implementation of the present invention cannot be limited. That is, all equivalent changes and modifications made in accordance with the scope of the application of the present invention should still fall within the scope of the patent of the present invention.

10‧‧‧ base
101‧‧‧ top surface
102‧‧‧Receiving slot
103‧‧‧stop wall
1021‧‧‧ opening
1022‧‧‧Threaded wall
20‧‧‧grinding unit
21‧‧‧bearing column
22‧‧‧ abrasive particles
221‧‧‧ Tip
222‧‧‧Expansion Department
23‧‧‧Combination layer
30‧‧‧ buffer unit
31‧‧‧ elastic stop
32‧‧‧ Elastic buffer
40‧‧‧ adjustment unit
41‧‧‧Screw
h1‧‧‧ the first protruding height
h2‧‧‧Second protruding height
h3‧‧‧ Third protruding height

[Figure 1] A schematic plan view of the chemical mechanical polishing dresser in an embodiment of the present invention. [Figure 2] is a schematic cross-sectional view in the direction A-A of [Figure 1]. [Figure 3] is a structural exploded view of an embodiment of the present invention. [Fig. 4] is a schematic diagram of the abrasive particles having the first protruding height in an embodiment of the present invention. [Figure 5] is a schematic diagram of the abrasive particles having the second protruding height in an embodiment of the present invention. [Fig. 6] is a schematic diagram of the abrasive particles after abrasion in an embodiment of the present invention. [Fig. 7] is a schematic diagram of the height of the abrasive particles after compensating for wear in an embodiment of the present invention.

10‧‧‧ base

101‧‧‧ top surface

102‧‧‧Receiving slot

103‧‧‧stop wall

1021‧‧‧ opening

1022‧‧‧Threaded wall

20‧‧‧grinding unit

21‧‧‧bearing column

22‧‧‧ abrasive particles

221‧‧‧ Tip

222‧‧‧Expansion Department

23‧‧‧Combination layer

30‧‧‧ buffer unit

31‧‧‧ elastic stop

32‧‧‧ Elastic buffer

40‧‧‧ adjustment unit

41‧‧‧Screw

Claims (13)

A chemical mechanical polishing dresser capable of adjusting the protruding height of abrasive particles, comprising: a base, the base having an upper surface and a plurality of receiving grooves penetrating through the upper surface, the receiving grooves each having an adjacent surface adjacent to the upper surface; A surface opening and a threaded wall away from the upper surface; a plurality of grinding units are housed in the accommodating groove, and the grinding units each include a bearing post and an abrasive particle disposed on the bearing post, the grinding particles having A tip protruding from the opening and an enlarged portion extending from the tip toward the load-bearing post; a plurality of buffer units are accommodated in the accommodating groove, and the buffer unit includes an elastic stopper provided on the opening, and the elasticity The stopper has a hollow, and the hollow inner diameter is between the tip and the enlarged portion; and a plurality of adjusting units are accommodated in the accommodating grooves. The adjusting unit includes a screw thread and the threaded wall to carry the screw. The post is carried to adjust a screw member protruding from the tip to a protruding height away from the opening. The chemical-mechanical abrasive dresser according to item 1 of the patent application scope, wherein the elastic stopper is a rubber O-ring. The chemical mechanical polishing dresser according to item 1 of the scope of the patent application, wherein the buffer unit further includes an elastic buffer member disposed between the bearing column and the adjustment unit. The chemical-mechanical abrasive dresser according to item 3 of the patent application scope, wherein the elastic buffer is a silicon pad. According to the chemical mechanical polishing and dressing device described in item 1 of the scope of patent application, wherein the base further includes a plurality of blocking walls, the blocking walls are convexly disposed at the opening of the receiving groove and have a size smaller than the receiving space. A second inner diameter of a first inner diameter of the groove. According to the chemical mechanical polishing and dressing device described in item 1 of the scope of patent application, the material of the base is selected from the group consisting of stainless steel, metal materials, plastic materials and ceramic materials. According to the chemical mechanical polishing and dressing device described in item 1 of the scope of the patent application, the material of the bearing column is selected from the group consisting of stainless steel, metal material, plastic material and ceramic material. The chemical mechanical polishing dresser according to item 1 of the patent application scope, wherein the polishing unit further includes a bonding layer formed between the bearing column and the grinding particles and fixing the grinding particles on the bearing column. According to the chemical mechanical polishing and dressing device described in item 8 of the scope of patent application, the composition of the bonding layer is selected from the group consisting of ceramic materials, brazing materials, electroplating materials, metal materials, and polymer materials. The chemical mechanical polishing dresser according to item 1 of the patent application range, wherein the protruding height is between 10 μm and 500 μm. The chemical mechanical polishing dresser according to item 1 of the scope of patent application, wherein the end of the adjusting unit far from the bearing column has a card slot, and the shape of the card slot is selected from hexagonal, straight and cross shapes. Group. The chemical mechanical polishing dresser according to item 1 of the scope of the patent application, wherein the bearing column is disposed in the receiving groove, and the abrasive particles are partially protruded outside the receiving groove by being blocked by the elastic stopper. The chemical mechanical polishing dresser according to item 1 of the patent application scope, wherein the protruding height is less than a height of the abrasive particles.