TW201802217A - 具有改良反應性概況的高效層壓黏著劑調配物 - Google Patents
具有改良反應性概況的高效層壓黏著劑調配物 Download PDFInfo
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Abstract
本發明揭示一種黏著劑調配物,包括a)聚胺基甲酸酯組合物;及b)潛伏催化劑,其為i)含脒化合物、含胍化合物或含胺化合物;ii)二氧化碳;及iii)水、醇、胺或硫醇之反應產物。
Description
本發明係關於一種黏著劑調配物及使用其製造層壓物之方法。具體而言,其係關於具有潛伏催化劑之無溶劑聚胺基甲酸酯黏著劑調配物。
無溶劑聚胺基甲酸酯黏著劑為一類適用之層壓黏著劑。其為含有聚異氰酸酯及多元醇以及可能其他成分之液體組合物。其用於包裝行業,尤其用於製造食品包裝。
然而,此等黏著劑傾向於具有短適用期(20至40分鐘)且其固化時間可較長(為了初級芳胺(PAA)分解低於2ppb及完全機械強度,多達10天)。無溶劑聚胺基甲酸酯層壓黏著劑之理想反應概況應為具有在層壓製程期間適用期長但在層壓之後反應性高之組合。
一種解決方案為使用潛伏或延遲催化劑以延長適用期。基於有機金屬之催化劑已用作聚胺基甲酸酯組合物之潛伏催化劑。然而,此等催化劑中之大多數基於錫。眾所周知且公認的是,基於錫之催化劑不建議用於食品包裝應用。此外,此等催化劑之活化條件(諸如時間或溫度)並不
適用於層壓製程。因此,所期望的是可在層壓製程中活化且不基於有機金屬之用於聚胺基甲酸酯層壓黏著劑之潛伏催化劑。
在本發明之一個廣義實施例中,揭示一種黏著劑調配物,包括a)聚胺基甲酸酯組合物;及b)潛伏催化劑,其為i)含脒化合物、含胍化合物或含胺化合物;ii)二氧化碳;及iii)水、醇、胺或硫醇之反應產物。
在一替代性實施例中,揭示先前實施例之黏著劑調配物,其中所述聚胺基申酸酯組合物包括以所述聚胺基甲酸酯組合物之總乾重計10至40重量百分比中異氰酸酯及60至90重量百分比之多元醇。
在一替代性實施例中,揭示先前實施例中之任一者之黏著劑調配物,其中所述催化劑係選自由1,8-二氮雜雙環十一-7-烯、1,1,3,3-四甲基胍(TMG)及第三丁基-1,1,3,3,四甲基胍組成之群。
在一替代性實施例中,揭示先前實施例中之任一者之黏著劑調配物,其中所述催化劑以按所述調配物之總乾重計0.0001至10重量百分比範圍內之量存在。
在一替代性實施例中,揭示先前實施例中之任一者之黏著劑調配物,其中所述聚胺基甲酸酯組合物含有溶劑。
在一替代性實施例中,揭示先前實施例中之任一者之黏著劑調配物,其中所述聚胺基甲酸酯組合物不含溶劑。
在一替代性實施例中,揭示一種製造先前實施例中之任一者之黏著劑調配物的方法,所述方法包括a)在所述
聚胺基甲酸酯組合物形成之後向所述聚胺基甲酸酯組合物添加所述潛伏催化劑;及b)活化所述潛伏催化劑。
在一替代性實施例中,揭示先前實施例之方法,其中所述潛伏催化劑在步驟b)中使用加熱、機械力或照射活化。
亦揭示一種由先前實施例中之任一者之黏著劑調配物製備的層壓黏著劑及由此類層壓黏著劑製備之可撓性包裝。
圖1為展示四種樣品之黏度相對於時間的圖式。
本發明之黏著劑調配物包括雙組分聚胺基甲酸酯黏著劑及包括脒或胍之催化劑。
黏著劑調配物可基於溶劑或無溶劑。若黏著劑調配物無溶劑,則其不含有機溶劑。在此等實施例中,黏著劑調配物包括以黏著劑調配物之總乾重計小於4重量百分比、在各種實施例中小於2重量百分比及在各種其他實施例中小於1重量百分比之有機溶劑。
黏著劑調配物可為需要鹼催化劑之任何調配物。實例包含(但不限於)聚氨基甲酸酯及環氧化物。
在各種實施例中,黏著劑調配物為包括異氰酸酯及多元醇作為聚合單元之聚胺基甲酸酯。可使用之多元醇的實例為聚醚多元醇及聚酯多元醇。
異氰酸酯之分子量Mw一般小於500g/mol、在各種其他實施例中小於300g/mol及在各種其他實施例中小於275g/mol。
異氰酸酯可為單體芳族二異氰酸酯。單體芳族二異氰酸酯之實例包含(但不限於)亞甲基二苯基二異氰酸酯(MDI)、甲苯二異氰酸酯(TDI)及其組合。可一般使用具有任何常用異構體分佈的TDI。最常用的TDI具有80% 2,4-異構體及20% 2,6-異構體的異構體分佈。亦可使用具有其他異構體分佈的TDI。當MDI用於製備聚胺基甲酸酯預聚物時,其一般為純4,4'-MDI或MDI異構體之任何組合。當使用4,4'-MDI與其他MDI異構體之組合時,4,4'-MDI之較佳濃度為所有MDI異構體之25%至75%。
以聚胺基甲酸酯預聚物之總乾重計,聚胺基甲酸酯預聚物中所存在之單體芳族二異氰酸酯一般在0至40重量百分比之範圍內。在0與40之間的任何及所有範圍均包含在本文中且揭示於本文中;例如,聚胺基甲酸酯預聚物中所存在之二異氰酸酯可在12至38重量百分比或15至35重量百分比之範圍內。
聚醚多元醇及聚酯多元醇之重量平均分子量Mw各為400至4000g/mol、在各種其他實施例中750至3500g/mol且更佳在各種其他實施例中800至3000g/mol。聚醚多元醇及聚酯多元醇之官能度可各為1.8至10、在各種其他實施例中1.9至3及在各種其他實施例中2至2.5。
可使用之聚醚多元醇的實例包含(但不限於)氧化乙烯、氧化丙烯、四氫呋喃及氧化丁烯之加成聚合產物及
接枝產物,多元醇之縮合產物及其任何組合。聚醚多元醇之特定實例包含(但不限於)聚丙二醇(PPG)、聚乙二醇(PEG)、聚丁二醇、聚四亞甲基醚二醇(PTMEG)及其任何組合。
在各種實施例中,以聚胺基甲酸酯預聚物之總乾重計,聚胺基甲酸酯預聚物中所存在之聚醚多元醇一般在0至99重量百分比之範圍內。在0與99之間的任何及所有範圍均包含在本文中且揭示於本文中;例如,聚胺基甲酸酯預聚物中所存在之聚醚多元醇可在25至80重量百分比或30至75重量百分比之範圍內。
聚酯多元醇為二醇與二羧酸及其衍生物之縮合產物或其衍生物。
二醇之特定實例包含(但不限於)乙二醇、丁二醇、二乙二醇、三乙二醇、聚烷二醇(如聚乙二醇)、1,2-丙二醇、1,3-丙二醇、2-甲基-1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、1,6-己二醇、新戊二醇、3-甲基-1,5-戊二醇及其任何組合。為了達成多元醇官能度大於2,亦可使用三醇及/或四醇。此類三醇之特定實例包含三羥甲基丙烷及丙三醇。此類四醇之特定實例包含赤藻糖醇及季戊四醇。
二羧酸係選自芳族酸、脂族酸及其組合。芳族酸之適合實例為鄰苯二甲酸、間苯二甲酸及對苯二甲酸;而脂族酸之適合實例為己二酸、壬二酸、癸二酸、戊二酸、四氯鄰苯二甲酸、順丁烯二酸、反丁烯二酸、伊康酸、丙二酸、辛二酸、2-甲基丁二酸、3,3-二乙基戊二酸及2,2-二甲基丁二酸。同樣可使用此等酸之酸酐。出於本發明之目的,酸酐因此藉由術語「酸」之表示涵蓋。較佳地,脂族酸及芳族酸為
飽和的,且分別為己二酸及間苯二甲酸。諸如苯甲酸及己烷甲酸之單羧酸應減至最少或排除。
聚酯多元醇亦可藉由內酯與二醇、三醇及/或四醇之加成聚合來製備。內酯之特定實例包含己內酯、丁內酯及戊內酯。二醇之特定實例為乙二醇、丁二醇、二乙二醇、三乙二醇、聚烷二醇(諸如聚乙二醇)、1,2-丙二醇、1,3-丙二醇、2-甲基-1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、1,6-己二醇、新戊二醇、3-甲基-1,5-戊二醇及其任何組合。三醇之特定實例包含三羥甲基丙烷及丙三醇。四醇之特定實例包含赤藻糖醇及季戊四醇。
在各種實施例中,以聚胺基甲酸酯預聚物之總乾重計,聚胺基甲酸酯預聚物中所存在之聚酯多元醇可在0至99重量百分比之範圍內。在0與99重量百分比之間的任何及所有範圍均包含在本文中且揭示於本文中;例如,預聚物可含有18至28重量百分比聚酯多元醇或20至25重量百分比聚酯多元醇。
聚胺基甲酸酯預聚物之製備可以一般熟習此項技術者已知的任何方式進行且包含縮合聚合。有機溶劑不用於聚胺基甲酸酯預聚物之製備。
潛伏催化劑在攪拌下添加至聚胺基甲酸酯分散液中以形成穩定混合物。
潛伏催化劑為藉由基於脒或胍之化合物與二氧化碳及水、醇、胺或硫醇反應形成之複合物。可使用任何醇,但在各種實施例中,使用1-乙醇、丙-2-醇、1-辛醇或乙二醇。
基於脒之化合物具有如下式I中所描繪之通式結
構。
其中R1、R2、R3及R4獨立地選自由以下組成之群:氫、甲基、乙基、丙基、異丙基、丁基、異丁基及環狀結構。
基於胍之化合物具有如下式II中所描繪之通式結構。
其中R1、R2、R3、R4及R5獨立地選自由以下組成之群:氫、甲基、乙基、丙基、異丙基、丁基、異丁基及環狀結構。
基於脒之化合物的適合實例包含(但不限於)(1,8-二氮雜雙環十一-7-烯)(DBU)。
基於胍之化合物之適合實例包含(但不限於)1,1,3,3-四甲基胍(TMG)及第三丁基-1,1,3,3,四甲基胍。
可使用基於胺之化合物代替基於脒或胍之化合物。基於胺之化合物之實例包含(但不限於)乙二胺、二乙三胺及胺基丙基三乙氧基矽烷。
以調配物之總重量計,潛伏催化劑一般以在0.0001至10重量百分比範圍內之量使用。在0.0001與10重量百分比之間的任何及所有範圍均包含在本文中且揭示於本
文中;例如,潛伏催化劑可以在0.1至5重量百分比或0.5至3重量百分比範圍內之量存在。
在各種實施例中,調配物亦可含有增黏劑、填充劑、黏著促進劑、染料及/或溶劑。然而,調配物不可含有酸性化合物。
黏著劑調配物施用於至少一種基板之表面上。基板一般選自由以下組成之群:聚合物膜、金屬化聚合物膜、箔、聚合物背襯金屬箔、紙張及其組合,包括金屬箔、聚酯膜及耐綸(nylon)膜。第二基板可接著層壓於第一基板。
當塗佈於第一基板或第二基板上時,黏著劑調配物之催化劑可經活化。可如何活化催化劑之實例包含(但不限於)加熱(諸如微波或紅外加熱)、機械力或照射。若使用加熱,則催化劑一般在30至200℃但在各種其他實施例中50至100℃範圍內之溫度下活化。
層壓物可為包括額外基板及額外黏著劑調配物之較厚層壓物的一部分。額外基板可與本發明之層壓物中所包括的膜相同或不同。額外黏著劑調配物可與本發明之黏著劑調配物相同或不同,且可為任何層壓物行業中常用之黏著劑調配物。
實例
製備基於TMG之封閉的催化劑
將1,1,3,3-四甲基胍(TMG)及水之等莫耳混合物溶解於乙腈(1體積混合物/1體積乙腈)中且引入試管中。使藉由磷酸滴落在碳酸鈣上之反應產生的二氧化碳在試管中鼓泡。在室溫下進行封閉反應1至2小時。在反應結束時,
過濾不溶於乙腈中之基於TMG的烷基碳酸鹽且用過量乙腈洗滌。使鹽在濾紙中在通風櫥下乾燥隔夜且未經進一步純化即加以分析。活化溫度範圍經測定為80至130℃。在90℃下的活化時間經測定為30分鐘。
使用通用效能系統(MOR-FREE 698A+C79)運行藉由黏度量測值確定的黏度曲線。MOR-FREE 698A為基於純4,4'-MDI及異構體MDI之預聚物。C79為蓖麻油與聚醚三醇之摻合物。
以下系統之反應性曲線在40℃下運行1小時:
●參考物:MOR-FREE 698A+C79 100/50
●非活性催化劑(CAT1):MOR-FREE 698A+C79(100/50混合)+0.05wt%基於TMG之非活性催化劑(上文所製備)且攪拌1分鐘
●活性催化劑(經活化之CAT1):MOR-FREE 698A+C79與0.05wt%經活化之基於TMG中催化劑100/50混合,攪拌1分鐘
●TMG參考物:MOR-FREE 698A+C79(100/50混合)+0.03wt% TMG,攪拌大致1分鐘
藉由在90℃下加熱C79與催化劑之混合物1小時來進行基於TMG之催化劑的活化。接著添加MOR-FREE 698A且量測最終摻合物之黏度。
參照圖1,CAT1可在40℃下無活性1小時。在活化之後,CAT1呈現與TMG類似之催化活性。
Claims (10)
- 一種黏著劑調配物,包括a)聚胺基甲酸酯組合物;及b)潛伏催化劑,其為以下各物之反應產物:i)含脒化合物、含胍化合物或含胺化合物;ii)二氧化碳;及iii)水、醇、胺或硫醇。
- 如申請專利範圍第1項所述的黏著劑調配物,其中所述聚胺基甲酸酯組合物以所述聚胺基甲酸酯組合物之總乾重計包括10至40重量百分比之異氰酸酯及60至90重量百分比之多元醇。
- 如申請專利範圍第1項或第2項中任一項所述的黏著劑調配物,其中所述催化劑係選自由1,8-二氮雜雙環十一-7-烯、1,1,3,3-四甲基胍(TMG)及第三丁基-1,1,3,3,四甲基胍組成之群。
- 如前述申請專利範圍中任一項所述的黏著劑調配物,其中所述催化劑以按所述調配物之總乾重計0.0001至10重量百分比範圍內之量存在。
- 如前述申請專利範圍中任一項所述的黏著劑調配物,其中所述聚胺基甲酸酯組合物含有溶劑。
- 如前述申請專利範圍中任一項所述的黏著劑調配物,其中所述聚胺基甲酸酯組合物不含溶劑。
- 一種製造如前述申請專利範圍中任一項所述的黏著劑調配物的方法,所述方法包括a)在所述聚胺基甲酸酯組合物形成之後,添加所述潛伏 催化劑至所述聚胺基甲酸酯組合物;及b)活化所述潛伏催化劑。
- 如申請專利範圍第7項所述的方法,其中所述潛伏催化劑在步驟b)中使用加熱、機械力或照射活化。
- 一種層壓黏著劑,其由如申請專利範圍第1項至第6項中任一項所述的黏著劑調配物製備。
- 一種可撓性包裝,其由如申請專利範圍第9項所述的層壓黏著劑製備。
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