TW201741774A - Method for light exposing workpiece, exposure apparatus, and placement mechanism of exposure apparatus - Google Patents

Method for light exposing workpiece, exposure apparatus, and placement mechanism of exposure apparatus Download PDF

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Publication number
TW201741774A
TW201741774A TW105116869A TW105116869A TW201741774A TW 201741774 A TW201741774 A TW 201741774A TW 105116869 A TW105116869 A TW 105116869A TW 105116869 A TW105116869 A TW 105116869A TW 201741774 A TW201741774 A TW 201741774A
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Taiwan
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frame
exposure
workpiece
frames
working chamber
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TW105116869A
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Chinese (zh)
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TWI596449B (en
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張永裕
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志聖工業股份有限公司
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Priority to TW105116869A priority Critical patent/TWI596449B/en
Priority to CN201610460244.7A priority patent/CN107450275B/en
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Publication of TW201741774A publication Critical patent/TW201741774A/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

An exposure apparatus includes an operation chamber, a displacement area arranged outside the operation chamber, an aligning device and an exposure device both disposed in the operation chamber, two first frames respectively arranged in the operation chamber and the displacement area, and two second frames respectively arranged in the operation chamber and the displacement area. The positions of the two first frames are interchangeable, and the positions of the two second frames are interchangeable. Each one of the first frame and the second frame in the operation chamber is aligned with the exposure device by the aligning device. Thus, the exposure apparatus of the instant disclosure is provided with better operation efficiency. In addition, the instant disclosure also provides a method for light exposing a workpiece and a placement mechanism of an exposure apparatus.

Description

工件曝光方法、曝光設備及其置件機構 Workpiece exposure method, exposure apparatus and its setting mechanism

本發明涉及一種半導體製造設備,還涉及一種工件曝光方法、曝光設備及其置件機構。 The present invention relates to a semiconductor manufacturing apparatus, and to a workpiece exposure method, an exposure apparatus, and a mounting mechanism thereof.

現有的曝光設備是將對位裝置與曝光裝置安置於不同的區域,例如是將曝光裝置設置於工作腔室內,而將對位裝置設置於工作腔室外。因此,現有的曝光設備是先通過所述對位裝置進行台框及工件的對位作業,而後才將台框及工件移動至工作腔室內,以通過所述曝光裝置進行曝光。然而,現有曝光設備的構造及運作方式已無形中降低作業效率。 In the prior art, the alignment device is disposed in a different area from the exposure device, for example, the exposure device is disposed in the working chamber, and the alignment device is disposed outside the working chamber. Therefore, in the conventional exposure apparatus, the alignment operation of the frame and the workpiece is performed by the alignment device, and then the frame and the workpiece are moved into the working chamber to be exposed by the exposure device. However, the construction and operation of existing exposure devices have virtually reduced operational efficiency.

於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。 Accordingly, the inventors believe that the above-mentioned defects can be improved, and that the invention has been studied with great interest and with the use of scientific principles, and finally proposes a present invention which is rational in design and effective in improving the above-mentioned defects.

本發明實施例在於提供一種工件曝光方法、曝光設備及其置件機構,能有效地改善現有曝光設備所可能產生的問題。 Embodiments of the present invention provide a workpiece exposure method, an exposure apparatus, and a mounting mechanism thereof, which can effectively improve problems that may occur in existing exposure apparatuses.

本發明實施例公開一種工件曝光方法,包括:置放待曝光的一第一工件於一第一台框上;移動所述第一台框,接著以一位置對準裝置進行所述第一台框與一曝光裝置間的對位作業,其後,所述曝光裝置對所述第一台框上的待曝光的所述第一工件進行曝光作業;在所述第一台框及待曝光的所述第一工件進行所述對位 作業與所述曝光作業的至少其中一個作業過程中,置放待曝光的一第二工件於一第二台框;以及移動所述第二台框,接著以所述位置對準裝置進行所述第二台框與所述曝光裝置間的對位作業,其後,所述曝光裝置對所述第二台框上的待曝光的所述第二工件進行曝光作業;在所述第二台框及待曝光的所述第二工件進行所述對位作業與所述曝光作業的至少其中一個作業過程中,置放待曝光的另一第一工件於另一第一台框上,接著移動交換所述第一台框及所述另一第一台框的位置。 The embodiment of the invention discloses a workpiece exposure method, comprising: placing a first workpiece to be exposed on a first frame; moving the first frame, and then performing the first frame with a position aligning device An alignment operation between the frame and an exposure device, wherein the exposure device performs an exposure operation on the first workpiece to be exposed on the first frame; in the first frame and the object to be exposed The first workpiece performs the alignment During at least one of the operation and the exposure operation, placing a second workpiece to be exposed in a second frame; and moving the second frame, and then performing the positioning with the position aligning device An alignment operation between the second frame and the exposure device, after which the exposure device performs an exposure operation on the second workpiece to be exposed on the second frame; in the second frame And performing, during the at least one operation of the alignment work and the exposure operation, the second workpiece to be exposed, placing another first workpiece to be exposed on another first frame, and then moving the exchange The position of the first frame and the other first frame.

本發明實施例也公開一種曝光設備,包括:一工作腔室及位於所述工作腔室外側的一置件區域;一位置對準裝置,設置於所述工作腔室內;一曝光裝置,設置於所述工作腔室內;兩個第一台框,分別設置於所述工作腔室與所述置件區域,並且任一個所述第一台框能可移動地與另一個所述第一台框進行位置交換;以及兩個第二台框,分別設置於所述工作腔室與所述置件區域,並且任一個所述第二台框能可移動地與另一個所述第二台框進行位置交換;其中,位於所述工作腔室內的所述第一台框及所述第二台框能通過所述位置對準裝置,而進行與所述曝光裝置間的對位作業。 The embodiment of the invention also discloses an exposure apparatus, comprising: a working chamber and a component area on the outdoor side of the working chamber; a position aligning device disposed in the working chamber; and an exposure device disposed on the Inside the working chamber; two first frames are respectively disposed in the working chamber and the set region, and any one of the first frames is movably coupled to the other of the first frames Position exchange; and two second frames respectively disposed in the working chamber and the set region, and any one of the second frames is movably movable with another of the second frames Position exchange; wherein the first frame and the second frame located in the working chamber can perform alignment work with the exposure device through the position aligning device.

本發明實施例另公開一種曝光設備的置件機構,包括:一工作腔室及位於所述工作腔室外側的一置件區域;兩個第一台框,分別設置於所述工作腔室與所述置件區域,並且任一個所述第一台框能可移動地與另一個所述第一台框進行位置交換;以及兩個第二台框,分別設置於所述工作腔室與所述置件區域,並且任一個所述第二台框能可移動地與另一個所述第二台框進行位置交換。 The embodiment of the invention further discloses a device for mounting an exposure device, comprising: a working chamber and a component area on an outdoor side of the working chamber; two first frame frames respectively disposed in the working chamber and a placement area, and any one of the first frames is movably exchangeable with another one of the first frames; and two second frames are respectively disposed in the working chamber and The component area is described, and any of the second frames can be movably exchanged with another of the second frames.

綜上所述,本發明實施例所公開的曝光設備及其置件機構,通過在工作腔室內的多個台框能分別與工作腔室外(即置件區域)的多個台框相互交換位置,以避免操作人員閒置的情況發生,進 而提升生產效能。再者,所述曝光設備更是將位置對準裝置以及曝光裝置皆設置於工作腔室內,以使位於工作腔室內的不同台框能夠在同時間分別進行對位作業與曝光作業,以利於進一步提升生產效能。又,本發明實施例所公開的工件曝光方法,能使置件作業、取件作業、對位作業、及曝光作業較為妥善地相疊而達到較佳的生產效能。 In summary, the exposure apparatus and the mounting mechanism thereof disclosed in the embodiments of the present invention can exchange positions with a plurality of frames outside the working chamber (ie, the mounting area) through a plurality of frames in the working chamber. To avoid the situation where the operator is idle, And improve production efficiency. Furthermore, the exposure device furtherly positions the alignment device and the exposure device in the working chamber, so that different frames located in the working chamber can perform the alignment work and the exposure operation at the same time, thereby facilitating further operations. Improve production efficiency. Moreover, the workpiece exposure method disclosed in the embodiments of the present invention can better combine the workpiece operation, the pickup operation, the alignment operation, and the exposure operation to achieve better production performance.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。 For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings limits.

100‧‧‧曝光設備 100‧‧‧Exposure equipment

10‧‧‧置件機構 10‧‧‧Placement agency

1‧‧‧工作腔室 1‧‧‧Working room

2‧‧‧置件區域 2‧‧‧Place area

3、3’‧‧‧第一台框 3, 3’‧‧‧ first frame

4、4’‧‧‧第二台框 4, 4’‧‧‧ second frame

5‧‧‧位置對準裝置 5‧‧‧ Position Alignment Device

51‧‧‧對位模組 51‧‧‧ alignment module

6‧‧‧曝光裝置 6‧‧‧Exposure device

61‧‧‧曝光光源 61‧‧‧Exposure source

62‧‧‧底片框架 62‧‧‧ film frame

63‧‧‧底片 63‧‧‧ negatives

7‧‧‧視覺裝置 7‧‧‧Visual device

8、8’‧‧‧第三台框 8, 8'‧‧‧ third frame

S‧‧‧直線方向 S‧‧‧Line direction

H‧‧‧水平方向 H‧‧‧ horizontal direction

W1‧‧‧第一工件 W1‧‧‧ first workpiece

W1’‧‧‧另一第一工件 W1’‧‧‧ another first artifact

W1”‧‧‧又一第一工件 W1”‧‧‧ another first workpiece

W2‧‧‧第二工件 W2‧‧‧ second workpiece

W2’‧‧‧另一第二工件 W2’‧‧‧ another second workpiece

圖1為本發明曝光設備的側視示意圖。 Figure 1 is a side elevational view of the exposure apparatus of the present invention.

圖2為本發明曝光設備的立體示意圖。 2 is a perspective view of the exposure apparatus of the present invention.

圖3為本發明曝光設備的俯視示意圖。 Figure 3 is a top plan view of the exposure apparatus of the present invention.

圖4為本發明曝光設備的第一台框與第二台框的移動示意圖。 4 is a schematic view showing the movement of the first frame and the second frame of the exposure apparatus of the present invention.

圖5為本發明曝光設備的第一台框與第二台框的另一移動示意圖。 FIG. 5 is another schematic diagram of movement of the first frame and the second frame of the exposure apparatus of the present invention.

圖6為本發明曝光設備的變化態樣立體示意圖。 Fig. 6 is a perspective view showing a variation of the exposure apparatus of the present invention.

圖7為本發明工件曝光方法的步驟S110示意圖。 Figure 7 is a schematic view showing the step S110 of the workpiece exposure method of the present invention.

圖8為本發明工件曝光方法的步驟S130示意圖。 Figure 8 is a schematic view showing the step S130 of the workpiece exposure method of the present invention.

圖9為本發明工件曝光方法的步驟S150示意圖。 Figure 9 is a schematic view showing the step S150 of the workpiece exposure method of the present invention.

圖10為本發明工件曝光方法的步驟S170示意圖。 Figure 10 is a schematic view showing the step S170 of the workpiece exposure method of the present invention.

圖11為本發明工件曝光方法的步驟S190示意圖。 Figure 11 is a schematic view showing the step S190 of the workpiece exposure method of the present invention.

請參閱圖1至圖11,為本發明的實施例,需先說明的是,本實施例對應附圖所提及的相關數量與外型,僅用來具體地說明本發明的實施方式,以便於了解本發明的內容,而非用來侷限本發明的保護範圍。 Please refer to FIG. 1 to FIG. 11 for an embodiment of the present invention. It should be noted that the related embodiments of the present invention are only used to specifically describe the embodiments of the present invention, so that It is to be understood that the scope of the invention is not intended to limit the scope of the invention.

請參閱圖1至圖3所示,本實施例公開一種曝光設備100,尤 指適用於同時對多個工件(如:電路板)進行對位作業與曝光作業的曝光設備100,但不受限於此。所述曝光設備100包括一工作腔室1、位於所述工作腔室1外側的一置件區域2、分別設置於所述工作腔室1與置件區域2的兩個第一台框3、3’、分別設置於所述工作腔室1與置件區域2的兩個第二台框4、4’、設置於所述工作腔室1內的一位置對準裝置5與一曝光裝置6、以及設置於所述工作腔室1內並位在所述曝光裝置6與位置對準裝置5上方的一視覺裝置7。 Referring to FIG. 1 to FIG. 3 , the embodiment discloses an exposure apparatus 100, in particular It refers to an exposure apparatus 100 suitable for performing alignment work and exposure work on a plurality of workpieces (eg, a circuit board) at the same time, but is not limited thereto. The exposure apparatus 100 includes a working chamber 1 , a placement area 2 on the outside of the working chamber 1 , and two first frames 3 respectively disposed in the working chamber 1 and the mounting area 2 . 3', two second frames 4, 4' respectively disposed in the working chamber 1 and the mounting region 2, a position aligning device 5 disposed in the working chamber 1, and an exposure device 6 And a visual device 7 disposed in the working chamber 1 and positioned above the exposure device 6 and the alignment device 5.

需先說明的是,所述曝光設備100的各部件實際應用不受限於本實施例,例如:所述工作腔室1、置件區域2、兩個第一台框3、3’、及兩個第二台框4、4’可合稱為一置件機構10(如圖4和圖5),並且適於應用在不同於圖式的其他曝光設備。以下將分別介紹本實施例曝光設備100所包括的各部件構造,而後再適時說明各部件彼此間的連接關係,最後再解釋所述曝光設備100的作動流程。 It should be noted that the actual application of the components of the exposure apparatus 100 is not limited to the embodiment, for example, the working chamber 1, the mounting area 2, the two first frames 3, 3', and The two second frames 4, 4' may be collectively referred to as a placement mechanism 10 (as in Figures 4 and 5) and are adapted for use in other exposure devices than the drawings. Hereinafter, the configuration of each component included in the exposure apparatus 100 of the present embodiment will be separately described, and then the connection relationship between the components will be described in time, and finally the operation flow of the exposure apparatus 100 will be explained.

所述工作腔室1於本實施例中相當於被曝光設備100的機殼(圖中未示出)所包覆的內部封閉區域,也就是說,操作人員較少會觸及的曝光設備100區域。所述置件區域2於本實施例中相當於曝光設備100的外部開放區域,用以供操作人員置放待曝光的工件以及取走已曝光的工件。 In the present embodiment, the working chamber 1 corresponds to an inner closed area covered by a casing (not shown) of the exposure apparatus 100, that is, an area of the exposure apparatus 100 that the operator has less access to. . In the present embodiment, the placement area 2 corresponds to an external open area of the exposure apparatus 100 for the operator to place the workpiece to be exposed and to remove the exposed workpiece.

每個所述第一台框3、3’用以承載一工件(如:電路板)並能通過吸附方式固定工件,而任一個第一台框3可移動地與另一個第一台框3’進行位置交換。再者,每個所述第二台框4、4’用以承載一工件(如:電路板)並能通過吸附方式固定工件,而任一個第二台框4可移動地與另一個第二台框4’進行位置交換。 Each of the first frames 3, 3' is for carrying a workpiece (such as a circuit board) and can fix the workpiece by suction, and any one of the first frames 3 is movably coupled to the other first frame 3 'Location exchange. Furthermore, each of the second frames 4, 4' is for carrying a workpiece (such as a circuit board) and can fix the workpiece by suction, and any one of the second frames 4 is movably coupled with another second The frame 4' performs position exchange.

其中,兩個所述第一台框3、3’的位置交換路徑於本實施例中 是平行於兩個所述第二台框4、4’的位置交換路徑(如圖4),但不排除兩個所述第一台框3、3’的位置交換路徑是交錯於兩個所述第二台框4、4’的位置交換路徑(如圖5)。再者,兩個所述第一台框3、3’的位置交換能與兩個所述第二台框4、4’的位置交換為非同時進行且具有一時間差,上述時間差於本實施例中為不大於10秒,或者可以說是所述時間差不大於位置對準裝置5對應於任一第一台框3、3’或任一第二台框4、4’的對位作業時間。 The position exchange path of the two first frames 3, 3' is in this embodiment. Is a position exchange path parallel to the two second frames 4, 4' (as shown in Figure 4), but does not exclude that the position exchange paths of the two first frames 3, 3' are staggered in two The position exchange path of the second frame 4, 4' is as shown in Fig. 5. Furthermore, the position exchange between the two first frames 3, 3' and the positions of the two second frames 4, 4' are exchanged non-simultaneously and have a time difference, the time difference being the same as in the embodiment. The middle is no more than 10 seconds, or it can be said that the time difference is not greater than the alignment work time of the position alignment device 5 corresponding to any of the first frames 3, 3' or any of the second frames 4, 4'.

須說明的是,所述第一台框3、3’與第二台框4、4’於本實施例中皆為相同的構造並且於本質上皆屬於「台框」,而上述「第一」與「第二」是為了說明上便於區別兩者。再者,所述第一台框3、3’的作動與第二台框4、4’的作動能通過設置有相對應的機構而實施,而上述「相對應的機構」在此不加以贅述。 It should be noted that the first frame 3, 3' and the second frame 4, 4' are all of the same structure in this embodiment and are essentially "frames", and the above "The second" is for the sake of illustration to facilitate the distinction between the two. Furthermore, the actuation of the first frame 3, 3' and the actuation of the second frame 4, 4' can be performed by providing a corresponding mechanism, and the above "corresponding mechanism" will not be described herein. .

所述位置對準裝置5於本實施例中包含有獨立運作的兩個對位模組51。兩個所述對位模組51分別設置於位在所述工作腔室1內的第一台框3’與第二台框4’的下方,並且兩個所述對位模組51用以分別且獨立地調整位在工作腔室1內的所述第一台框3’與第二台框4’的位置。 The position aligning device 5 includes two aligning modules 51 that operate independently in this embodiment. The two alignment modules 51 are respectively disposed under the first frame 3 ′ and the second frame 4 ′ in the working chamber 1 , and the two alignment modules 51 are used for The positions of the first frame 3' and the second frame 4' located in the working chamber 1 are individually and independently adjusted.

進一步地說,兩個所述對位模組51用以分別且非同時地調整位在工作腔室1內的第一台框3’與第二台框4’的位置。因此,位於所述工作腔室1內的第一台框3’及第二台框4’能通過位置對準裝置5,而進行與所述曝光裝置6間的對位。進一步地說,當兩個所述對位模組51的其中一個對位模組51用以調整位在工作腔室1內的第一台框3’與所第二台框4’的其中一個的位置時,所述曝光裝置6用以對位在所述工作腔室1內的第一台框3’與第二台框4’的其中另一個進行曝光作業。 Further, the two alignment modules 51 are used to adjust the positions of the first frame 3' and the second frame 4' located in the working chamber 1 respectively and non-simultaneously. Therefore, the first frame 3' and the second frame 4' located in the working chamber 1 can be aligned with the exposure device 6 by the alignment device 5. Further, when one of the two alignment modules 51 of the alignment module 51 is used to adjust one of the first frame 3' and the second frame 4' located in the working chamber 1 In the position of the exposure device 6, the exposure device 6 is used to perform an exposure operation on the other of the first frame 3' and the second frame 4' in the working chamber 1.

其中,每個對位模組51為具備縱向、橫向、豎向、及旋轉的驅動機構,藉以能對所對應的第一台框3’或第二台框4’進行各個 方位的調整。有關每個對位模組51的具體構造於本實施例中不加以限制。再者,所述視覺裝置7能用以擷取影像來輔助每個對位模組51進行對位作業。 Each of the alignment modules 51 is provided with a longitudinal, lateral, vertical, and rotational driving mechanism, so that each of the corresponding first frame 3' or second frame 4' can be Orientation adjustment. The specific configuration of each of the alignment modules 51 is not limited in this embodiment. Moreover, the visual device 7 can be used to capture images to assist each of the alignment modules 51 in performing alignment operations.

所述曝光裝置6包含有兩個底片框架62、分別安裝於兩個所述底片框架62的兩個底片63、及單個曝光光源61。其中,上述兩個底片框架62分別設置於位在工作腔室1內的第一台框3’與第二台框4’的上方,並且每個所述底片框架62能大致沿一水平方向H自工作腔室1抽離。進一步地說,所述兩個對位模組51是用以分別將位在工作腔室1內的第一台框3’與第二台框4’相對於上述兩個底片框架62內的底片63進行對位作業。而上述對位作業是指:在第一台框3’或第二台框4’上承載有工件的情況下,所述對位模組51用以將第一台框3’或第二台框4’上的工件對位於相對應的底片63。 The exposure device 6 includes two film frames 62, two negative films 63 respectively mounted to the two negative film frames 62, and a single exposure light source 61. Wherein, the two film frames 62 are respectively disposed above the first frame 3' and the second frame 4' located in the working chamber 1, and each of the film frames 62 can substantially along a horizontal direction H Pull away from the working chamber 1. Further, the two alignment modules 51 are used to respectively respectively position the first frame 3' and the second frame 4' located in the working chamber 1 with the negatives in the two negative frames 62. 63 performs the alignment work. The above-mentioned alignment operation refers to: when the workpiece is carried on the first frame 3' or the second frame 4', the alignment module 51 is used to set the first frame 3' or the second frame. The pair of workpieces on the frame 4' are located on the corresponding backsheet 63.

所述曝光光源61於本實施例中呈長型,並且曝光光源61的長度不小於任一第一台框3、3’或任一第二台框4、4’的長度,而曝光光源61的寬度則小於任一第一台框3、3’或任一第二台框4、4’的寬度。所述曝光光源61能相對於位在工作腔室1內的第一台框3’與第二台框4’移動,以使位在工作腔室1內的第一台框3’與第二台框4’位於所述曝光光源61的移動範圍下方。進一步地說,所述曝光光源61於本實施例中大致沿一直線方向S(如:平行曝光光源61的寬度)移動,並且位於工作腔室1內的第一台框3’與第二台框4’的排列方向平行於上述直線方向S。 The exposure light source 61 is elongated in this embodiment, and the length of the exposure light source 61 is not less than the length of any of the first frames 3, 3' or any of the second frames 4, 4', and the exposure light source 61 The width is smaller than the width of any of the first frames 3, 3' or any of the second frames 4, 4'. The exposure light source 61 can be moved relative to the first frame 3' and the second frame 4' located in the working chamber 1 to make the first frame 3' and the second position in the working chamber 1 The stage 4' is located below the range of movement of the exposure light source 61. Further, the exposure light source 61 is moved substantially in the straight line direction S (eg, the width of the parallel exposure light source 61) in the present embodiment, and is located in the first frame 3' and the second frame in the working chamber 1. The arrangement direction of 4' is parallel to the above-described linear direction S.

藉此,所述曝光光源61能在移動的過程中,依序對位在工作腔室1內的第一台框3’與第二台框4’進行曝光作業。上述曝光作業是指:所述曝光光源61通過底片63而使相對應的第一台框3、3’或第二台框4、4’上的工件進行曝光。也就是說,所述曝光光源61在移動的過程中,先對第一台框3、3’上的待曝光的第一工件 W1進行曝光作業,而後對第二台框4、4’上的待曝光的第二工件W2進行所述曝光作業。 Thereby, the exposure light source 61 can sequentially perform the exposure operation of the first frame 3' and the second frame 4' in the working chamber 1 during the movement. The exposure operation described above means that the exposure light source 61 exposes the workpieces on the corresponding first frame 3, 3' or the second frame 4, 4' through the film 63. That is, the exposure light source 61 first moves the first workpiece to be exposed on the first frame 3, 3' during the moving process. The exposure operation is performed by W1, and then the exposure operation is performed on the second workpiece W2 to be exposed on the second frame 4, 4'.

須說明的是,本實施例的曝光光源61的曝光作業順序是第一台框3’、第二台框4’、第一台框3、第二台框4(此將於後續說明)。但在另一未繪示的實施例中,不排除曝光光源61的曝光作業順序是第一台框3’、第二台框4’、第二台框4、第一台框3,藉以使曝光光源61的所有移動過程皆能進行曝光作業,達到善加利用曝光光源61的效果。 It should be noted that the exposure operation sequence of the exposure light source 61 of the present embodiment is the first frame 3', the second frame 4', the first frame 3, and the second frame 4 (this will be described later). However, in another embodiment not shown, the exposure operation sequence of the exposure light source 61 is not excluded: the first frame 3', the second frame 4', the second frame 4, and the first frame 3, thereby All the moving processes of the exposure light source 61 can perform an exposure operation, and the effect of using the exposure light source 61 can be achieved.

此外,本實施例雖是以四個台框(即兩個第一台框3、3’與兩個第二台框4、4’)作說明,但本發明不排除增加2N個台框,N為正整數。例如圖6所示,所述曝光設備100可增設兩個第三台框8、8’及相對應的構造(如:對位模組51、底片63、及底片框架62),上述兩個第三台框8、8’的構造與作用即相當於上述兩個第一台框3、3’或上述兩個第二台框4、4’。再者,位在工作腔室1的第三台框8’較佳是設置在位於所述曝光光源61的移動範圍下方,所以曝光光源61能夠在移動的過程中,依序對位在工作腔室1內的第一台框3’、第二台框4’、及第三台框8’進行曝光作業,因而無需擴增曝光光源61。 In addition, although the present embodiment is described by four frame frames (ie, two first frame frames 3, 3' and two second frame frames 4, 4'), the present invention does not exclude the addition of 2N frame frames. N is a positive integer. For example, as shown in FIG. 6, the exposure apparatus 100 can add two third frames 8, 8' and corresponding structures (such as the alignment module 51, the negative film 63, and the negative frame 62), the above two The structure and function of the three frames 8, 8' correspond to the two first frames 3, 3' or the two second frames 4, 4'. Furthermore, the third frame 8' located in the working chamber 1 is preferably disposed below the moving range of the exposure light source 61, so that the exposure light source 61 can be sequentially aligned in the working cavity during the moving process. The first frame 3', the second frame 4', and the third frame 8' in the chamber 1 perform an exposure operation, so that it is not necessary to amplify the exposure light source 61.

以上為本實施例曝光設備100各元件的構造及相對應關係之說明,下述接著介紹通過上述曝光設備100而實施的一種工件曝光方法,包括步驟S110~S190(如圖7至圖11)。也就是說,本實施例的曝光設備100提供設有下述第一台框3、另一第一台框3’、第二台框4、另一第二台框4’、位置對準裝置5、及曝光裝置6,並且本實施例的曝光設備100能被用來執行所述第一台框3、另一第一台框3’、第二台框4、及另一第二台框4’的移動、位置對準裝置5的對位作業、及曝光裝置6的曝光作業。 The above is a description of the configuration and corresponding relationship of the components of the exposure apparatus 100 of the present embodiment. Next, a workpiece exposure method implemented by the exposure apparatus 100 described above will be described, including steps S110 to S190 (FIG. 7 to FIG. 11). That is, the exposure apparatus 100 of the present embodiment provides the first frame 3, the other first frame 3', the second frame 4, the other second frame 4', and the position alignment device. 5. An exposure device 6, and the exposure apparatus 100 of the present embodiment can be used to execute the first frame 3, another first frame 3', second frame 4, and another second frame The movement of 4', the alignment operation of the position aligning device 5, and the exposure operation of the exposure device 6.

但須先說明的是,本實施例所載的工件曝光方法雖是以包括 步驟S110~S190作說明,但所述工件曝光方法是能夠在上述步驟S110~S190的基礎上循環地運作與實施,而非指工件曝光方法僅包括步驟S110~S190。再者,本實施例的工件曝光方法並不侷限僅以上述曝光設備100實施,並且下述工件曝光方法的各步驟能經由合理地調整而被實施。 However, it should be noted that the workpiece exposure method described in this embodiment is included. Steps S110 to S190 are described. However, the workpiece exposure method is capable of cyclic operation and implementation based on the above steps S110 to S190, and does not mean that the workpiece exposure method includes only steps S110 to S190. Furthermore, the workpiece exposure method of the present embodiment is not limited to being implemented only by the above-described exposure apparatus 100, and each step of the following workpiece exposure method can be implemented by rational adjustment.

另,本實施例於下述說明中,依據現今的實務經驗總結出,人工置放工件於台框的時間約為7~8秒,對位作業的時間約為9~10秒,曝光作業的時間約為5~6秒,藉以透過本實施例的工件曝光方法使上述時間較為妥善地相疊而達到較佳的生產效能,但不以上述時間為限。此外,本實施例雖是以人工取放工件作一說明,但本發明於實際應用時,不排除以非人工方式(如:機械手臂)取放工件。 In addition, in the following description, according to the current practical experience, the time for manually placing the workpiece in the frame is about 7-8 seconds, and the time for the alignment operation is about 9-10 seconds. The time is about 5-6 seconds, so that the above-mentioned time is better overlapped by the workpiece exposure method of the embodiment to achieve better production performance, but not limited to the above time. In addition, although the present embodiment is described by manually picking up and placing a workpiece, the present invention does not exclude the use of a non-manual method (such as a robot arm) for picking up and placing a workpiece.

步驟S110:如圖7所示,置放待曝光的一第一工件W1(如:電路板)於一第一台框3上。進一步地說,透過人工將第一工件W1以粗步對位方式置放在位於所述置件區域2內的第一台框3上。 Step S110: As shown in FIG. 7, a first workpiece W1 (such as a circuit board) to be exposed is placed on a first frame 3. Further, the first workpiece W1 is manually placed on the first frame 3 located in the placement area 2 in a coarse step alignment manner.

步驟S130:如圖8所示,移動所述第一台框3,接著以一位置對準裝置5進行第一台框3與曝光裝置6間的對位作業。進一步地說,位於置件區域2的第一台框3與位於工作腔室1的第一台框3’交換位置,以使第一台框3及第一工件W1位於工作腔室1內。其後,相對應的對位模組51將第一台框3及其上的第一工件W1與曝光裝置6的相對應底片63進行對位。再者,在上述第一台框3進行對位作業的過程中,置放待曝光的第二工件W2(如:電路板)於第二台框4。也就是說,透過人工將第二工件W2以粗步對位方式置放在位於置件區域2的第二台框4上。 Step S130: As shown in FIG. 8, the first frame 3 is moved, and then the alignment operation between the first frame 3 and the exposure device 6 is performed by a position aligning device 5. Further, the first frame 3 located in the set region 2 is exchanged with the first frame 3' located in the working chamber 1 such that the first frame 3 and the first workpiece W1 are located in the working chamber 1. Thereafter, the corresponding alignment module 51 aligns the first frame 3 and the first workpiece W1 thereon with the corresponding film 63 of the exposure device 6. Furthermore, in the process of performing the alignment operation on the first frame 3, the second workpiece W2 (eg, a circuit board) to be exposed is placed in the second frame 4. That is, the second workpiece W2 is manually placed on the second frame 4 located in the placement area 2 by the coarse step alignment.

因此,在上述第一台框3進行對位作業的時間,可以同時段 進行第二工件W2的置件作業,藉以避免操作人員閒置的情況發生,進而提升生產效能。 Therefore, in the above-mentioned first frame 3, the time of the alignment work can be simultaneously performed. The placing operation of the second workpiece W2 is performed to avoid the occurrence of idleness of the operator, thereby improving production efficiency.

步驟S150:如圖9所示,移動所述第二台框4,接著以所述位置對準裝置5進行上述第二台框4與曝光裝置6間的對位作業,並且所述曝光裝置6也對第一台框3上的待曝光的第一工件W1進行曝光作業。也就是說,在上述待曝光的第一工件W1進行所述曝光作業的過程中,移動所述第二台框4至工作腔室1,以使所述位置對準裝置5進行所述第二台框4與曝光裝置6間的對位作業。 Step S150: moving the second frame 4 as shown in FIG. 9, and then performing the alignment operation between the second frame 4 and the exposure device 6 by the position aligning device 5, and the exposure device 6 An exposure operation is also performed on the first workpiece W1 to be exposed on the first frame 3. That is, during the exposure operation of the first workpiece W1 to be exposed, the second frame 4 is moved to the working chamber 1 to cause the position aligning device 5 to perform the second The alignment operation between the frame 4 and the exposure device 6.

更詳細地說,位於置件區域2的第二台框4與位於工作腔室1的第二台框4’交換位置,以使第二台框4及第二工件W2位於工作腔室1內。其後,相對應的對位模組51將第二台框4及其上的第二工件W2與曝光裝置6的相對應底片63進行對位。於此同時,所述第一台框3的對位作業已經完成,並接著以所述曝光裝置6對第一台框3上的待曝光的第一工件W1進行曝光作業。再者,在上述第二台框4進行對位作業及第一台框3進行曝光作業的過程中,置放待曝光的另一第一工件W1’(如:電路板)於另一第一台框3’,即透過人工將另一第一工件W1’以粗步對位方式置放在位於置件區域2的另一第一台框3’上。 In more detail, the second frame 4 located in the set area 2 is exchanged with the second frame 4' located in the working chamber 1 such that the second frame 4 and the second workpiece W2 are located in the working chamber 1. . Thereafter, the corresponding alignment module 51 aligns the second frame 4 and the second workpiece W2 thereon with the corresponding film 63 of the exposure device 6. At the same time, the alignment operation of the first frame 3 has been completed, and then the exposure operation is performed by the exposure device 6 on the first workpiece W1 to be exposed on the first frame 3. Furthermore, during the alignment operation of the second frame 4 and the exposure operation of the first frame 3, another first workpiece W1' (eg, a circuit board) to be exposed is placed on the other first The frame 3' is placed on the other first frame 3' of the placement area 2 by manually placing another first workpiece W1' in a coarse step alignment manner.

因此,上述第一台框3的曝光作業、第二台框4的對位作業、及另一第一台框3’的置件作業相當於同時段進行,藉以避免曝光設備與操作人員閒置的情況發生,進而提升生產效能。 Therefore, the exposure operation of the first frame 3, the alignment operation of the second frame 4, and the placement operation of the other first frame 3' are performed in the same period to avoid the exposure device and the operator being idle. The situation occurs, which in turn increases production efficiency.

步驟S170:如圖10所示,在所述第一台框3的曝光作業完成後,移動交換所述另一第一台框3’與第一台框3的位置,接著以所述位置對準裝置5進行另一第一台框3’與曝光裝置6間的對位作業,並且所述曝光裝置6也對第二台框4上的待曝光的第二工 件W2進行曝光作業。也就是說,在待曝光的第二工件W2進行所述曝光作業的過程中,移動所述另一第一台框3’至工作腔室1,以使所述位置對準裝置5進行所述另一第一台框3’與曝光裝置6間的對位作業。 Step S170: as shown in FIG. 10, after the exposure job of the first frame 3 is completed, the position of the other first frame 3' and the first frame 3 is exchanged, and then the position is The alignment device 5 performs an alignment operation between the other first frame 3' and the exposure device 6, and the exposure device 6 also applies to the second work on the second frame 4 to be exposed. The piece W2 performs an exposure job. That is, during the exposure operation of the second workpiece W2 to be exposed, the other first frame 3' is moved to the working chamber 1 to cause the position aligning device 5 to perform the The alignment operation between the other first frame 3' and the exposure device 6.

更詳細地說,位於置件區域2的另一第一台框3’與位於工作腔室1的第一台框3交換位置,以使另一第一台框3’及另一第一工件W1’位於工作腔室1內,並且操作人員能將已曝光的第一工件W1取走。其後,相對應的對位模組51將另一第一台框3’及其上的另一第一工件W1’與曝光裝置6的相對應底片63進行對位。於此同時,所述第二台框4的對位作業已經完成,並接著以所述曝光裝置6對第二台框4上的待曝光的第二工件W2進行曝光作業。再者,在上述另一第一台框3’進行對位作業及第二台框4進行曝光作業的過程中,置放待曝光的另一第二工件W2’(如:電路板)於另一第二台框4’,即透過人工將另一第二工件W2’以粗步對位方式置放在位於置件區域2的另一第二台框4’上。 In more detail, the other first frame 3' located in the set area 2 is exchanged with the first frame 3 located in the working chamber 1 to make the other first frame 3' and the other first workpiece W1' is located in the working chamber 1 and the operator can remove the exposed first workpiece W1. Thereafter, the corresponding registration module 51 aligns the other first frame 3' and the other first workpiece W1' thereon with the corresponding film 63 of the exposure device 6. At the same time, the alignment operation of the second frame 4 has been completed, and then the exposure operation is performed by the exposure device 6 on the second workpiece W2 to be exposed on the second frame 4. Furthermore, during the other first frame 3' performing the alignment operation and the second frame 4 performing the exposure operation, another second workpiece W2' (eg, a circuit board) to be exposed is placed in another A second frame 4' is placed on the other second frame 4' of the placement area 2 by manually placing another second workpiece W2' in a coarse step alignment manner.

因此,上述第二台框4的曝光作業、另一第一台框3’的對位作業、另一第二台框4’的置件作業、及第一台框3的取件作業相當於同時段進行,藉以避免曝光設備與操作人員閒置的情況發生,進而提升生產效能。 Therefore, the exposure operation of the second frame 4, the alignment operation of the other first frame 3', the placement of the other second frame 4', and the pickup operation of the first frame 3 are equivalent to At the same time, it is carried out to avoid the situation that the exposure equipment and the operator are idle, thereby improving the production efficiency.

步驟S190:如圖11所示,在第二台框4的曝光作業完成後,移動交換所述另一第二台框4’與第二台框4的位置,接著以所述位置對準裝置5進行另一第二台框4’與曝光裝置6間的對位作業,並且所述曝光裝置6也對所述另一第一台框3’上的待曝光的另一第一工件W1’進行曝光作業。也就是說,在待曝光的另一第一工件W1’進行所述曝光作業的過程中,移動所述另一第二台框4’至工作腔室1,以使所述位置對準裝置5進行所述另一第二台框4’與曝光裝置6間的對位作業。 Step S190: as shown in FIG. 11, after the exposure operation of the second frame 4 is completed, the position of the other second frame 4' and the second frame 4 is exchanged, and then the position aligning device is used. 5 performing an alignment operation between the other second frame 4' and the exposure device 6, and the exposure device 6 also faces another first workpiece W1' to be exposed on the other first frame 3' Perform an exposure job. That is, during the exposure operation of the other first workpiece W1' to be exposed, the other second frame 4' is moved to the working chamber 1 so that the position aligning device 5 The alignment operation between the other second frame 4' and the exposure device 6 is performed.

更詳細地說,位於置件區域2的另一第二台框4’與位於工作腔室1的第二台框4交換位置,以使另一第二台框4’及另一第二工件W2’位於工作腔室1內,並且操作人員能將已曝光的第二工件W2取走。其後,相對應的對位模組51將另一第二台框4’及其上的另一第二工件W2’與曝光裝置6的相對應底片63進行對位。於此同時,所述另一第一台框3’的對位作業已經完成,並接著以所述曝光裝置6對另一第一台框3’上的待曝光的另一第一工件W1’進行曝光作業。再者,在上述另一第二台框4’進行對位作業及另一第一台框3’進行曝光作業的過程中,置放待曝光的又一第二工件W2”(如:電路板)於第一台框3。 In more detail, the other second frame 4' located in the set area 2 is exchanged with the second frame 4 located in the working chamber 1 to make the other second frame 4' and the other second workpiece W2' is located in the working chamber 1 and the operator can remove the exposed second workpiece W2. Thereafter, the corresponding registration module 51 aligns the other second frame 4' and the other second workpiece W2' thereon with the corresponding film 63 of the exposure device 6. At the same time, the alignment work of the other first frame 3' has been completed, and then the other first workpiece W1' to be exposed on the other first frame 3' is next to the exposure device 6. Perform an exposure job. Furthermore, in the process of performing the alignment operation of the other second frame 4' and the exposure operation of the other first frame 3', another second workpiece W2 to be exposed is placed (eg, a circuit board). ) in the first frame 3.

因此,上述另一第一台框3’的曝光作業、另一第二台框4’的對位作業、第一台框3的置件作業、及第二台框4的取件作業相當於同時段進行,藉以避免曝光設備100與操作人員閒置的情況發生,進而提升生產效能。 Therefore, the exposure operation of the other first frame 3', the alignment operation of the other second frame 4', the placement operation of the first frame 3, and the pickup operation of the second frame 4 are equivalent to At the same time, it is carried out to avoid the occurrence of the exposure device 100 and the idleness of the operator, thereby improving the production efficiency.

換個角度來說,以上步驟說明為本實施例的具體流程,而依據上述步驟,可合理地推知本發明工件曝光方法是架構於下述基礎條件:在第一台框3及待曝光的第一工件W1進行對位作業與所述曝光作業的至少其中一個作業過程中,置放待曝光的第二工件W2於第二台框4;在所述第二台框4及待曝光的第二工件W2進行所述對位作業與所述曝光作業的至少其中一個作業過程中,置放待曝光的另一第一工件W1’於另一第一台框3’上,接著移動交換所述第一台框3及另一第一台框3’的位置;在所述另一第一台框3’及待曝光的所述另一第一工件W1’進行對位作業與曝光作業的至少其中一個作業過程中,置放待曝光的另一第二工件W2’於另一第二台框4’,接著移動交換所述第二台框4及另一第二台框4’的位置。因此,本發明的工件曝光方法不排除依據上述基礎條件,對步驟S110~S190作合理的變化。 In other words, the above steps are described as the specific flow of the embodiment, and according to the above steps, it can be reasonably inferred that the workpiece exposure method of the present invention is based on the following basic conditions: in the first frame 3 and the first to be exposed During at least one of the alignment operation of the workpiece W1 and the exposure operation, the second workpiece W2 to be exposed is placed in the second frame 4; the second frame 4 and the second workpiece to be exposed are W2 performing at least one of the alignment operation and the exposure operation, placing another first workpiece W1' to be exposed on the other first frame 3', and then moving the first a position of the frame 3 and the other first frame 3'; at least one of the alignment work and the exposure operation is performed on the other first frame 3' and the other first workpiece W1' to be exposed During the operation, another second workpiece W2' to be exposed is placed in the other second frame 4', and then the position of the second frame 4 and the other second frame 4' is moved and exchanged. Therefore, the workpiece exposure method of the present invention does not exclude a reasonable change of steps S110 to S190 in accordance with the above basic conditions.

[本發明實施例的技術功效] [Technical effect of the embodiment of the present invention]

綜上所述,本發明實施例所公開的曝光設備及其置件機構,通過在工作腔室內的多個台框能分別與工作腔室外(即置件區域)的多個台框相互交換位置,以避免操作人員閒置的情況發生,進而提升生產效能。再者,所述曝光設備更是將位置對準裝置以及曝光裝置皆設置於工作腔室內,以使位於工作腔室內的不同台框能夠在同時間分別進行對位作業與曝光作業,以利於進一步提升生產效能。另,所述曝光裝置僅設有單個曝光光源,並通過上述曝光光源在移動的過程中進行曝光作業,以達到妥善利用曝光光源的效果,進而降低曝光光源的製造成本及耗能。再者,每個底片框架能大致沿水平方向自工作腔室抽離,以利於操作人員進行底片的更換。 In summary, the exposure apparatus and the mounting mechanism thereof disclosed in the embodiments of the present invention can exchange positions with a plurality of frames outside the working chamber (ie, the mounting area) through a plurality of frames in the working chamber. In order to avoid the operator's idle situation, thereby improving production efficiency. Furthermore, the exposure device furtherly positions the alignment device and the exposure device in the working chamber, so that different frames located in the working chamber can perform the alignment work and the exposure operation at the same time, thereby facilitating further operations. Improve production efficiency. In addition, the exposure device is provided with only a single exposure light source, and performs an exposure operation during the movement by the exposure light source to achieve the effect of properly utilizing the exposure light source, thereby reducing the manufacturing cost and energy consumption of the exposure light source. Furthermore, each of the film frames can be pulled away from the working chamber substantially in a horizontal direction to facilitate operator replacement of the film.

又,本發明實施例所公開的工件曝光方法,能使置件作業、取件作業、對位作業、及曝光作業較為妥善地相疊而達到較佳的生產效能。 Moreover, the workpiece exposure method disclosed in the embodiments of the present invention can better combine the workpiece operation, the pickup operation, the alignment operation, and the exposure operation to achieve better production performance.

以上所述僅為本發明的優選可行實施例,並非用來侷限本發明的保護範圍,凡依本發明申請專利範圍所做的同等變化與修飾,皆應屬本發明的涵蓋範圍。 The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and all equivalent changes and modifications made by the scope of the present invention should be included in the scope of the present invention.

100‧‧‧曝光設備 100‧‧‧Exposure equipment

1‧‧‧工作腔室 1‧‧‧Working room

2‧‧‧置件區域 2‧‧‧Place area

4、4’‧‧‧第二台框 4, 4’‧‧‧ second frame

5‧‧‧位置對準裝置 5‧‧‧ Position Alignment Device

51‧‧‧對位模組 51‧‧‧ alignment module

6‧‧‧曝光裝置 6‧‧‧Exposure device

61‧‧‧曝光光源 61‧‧‧Exposure source

62‧‧‧底片框架 62‧‧‧ film frame

63‧‧‧底片 63‧‧‧ negatives

7‧‧‧視覺裝置 7‧‧‧Visual device

H‧‧‧水平方向 H‧‧‧ horizontal direction

Claims (20)

一種工件曝光方法,包括:置放待曝光的一第一工件於一第一台框上;移動所述第一台框,接著以一位置對準裝置進行所述第一台框與一曝光裝置間的對位作業,其後,所述曝光裝置對所述第一台框上的待曝光的所述第一工件進行曝光作業;在所述第一台框及待曝光的所述第一工件進行所述對位作業與所述曝光作業的至少其中一個作業過程中,置放待曝光的一第二工件於一第二台框;以及移動所述第二台框,接著以所述位置對準裝置進行所述第二台框與所述曝光裝置間的對位作業,其後,所述曝光裝置對所述第二台框上的待曝光的所述第二工件進行曝光作業;在所述第二台框及待曝光的所述第二工件進行所述對位作業與所述曝光作業的至少其中一個作業過程中,置放待曝光的另一第一工件於另一第一台框上,接著移動交換所述第一台框及所述另一第一台框的位置。 A workpiece exposure method includes: placing a first workpiece to be exposed on a first frame; moving the first frame, and then performing the first frame and an exposure device with a position aligning device Alignment operation, after which the exposure device performs an exposure operation on the first workpiece to be exposed on the first frame; in the first frame and the first workpiece to be exposed During at least one of the aligning operation and the exposing operation, placing a second workpiece to be exposed in a second frame; and moving the second frame, and then in the position The alignment device performs an alignment operation between the second frame and the exposure device, and thereafter, the exposure device performs an exposure operation on the second workpiece to be exposed on the second frame; During the second frame and the second workpiece to be exposed, during at least one of the alignment operation and the exposure operation, placing another first workpiece to be exposed in another first frame Up, then moving the first frame and the other Position of a frame. 如請求項1所述的工件曝光方法,其中,在所述第一台框進行所述對位作業的過程中,置放待曝光的所述第二工件於所述第二台框;在待曝光的所述第一工件進行所述曝光作業的過程中,移動所述第二台框,以使所述位置對準裝置進行所述第二台框與所述曝光裝置間的對位作業。 The workpiece exposure method according to claim 1, wherein, in the process of performing the alignment operation in the first frame, the second workpiece to be exposed is placed in the second frame; During the exposure process of the first workpiece, the second frame is moved to cause the position aligning device to perform an alignment operation between the second frame and the exposure device. 如請求項2所述的工件曝光方法,其中,在所述第二台框進行所述對位作業的過程中,置放待曝光的所述另一第一工件於所述另一第一台框上;在待曝光的所述第二工件進行所述曝光作業的過程中,移動交換所述第一台框及所述另一第一台框的位置,以使所述位置對準裝置進行所述另一第一台框與所述曝光裝置間的對位作業。 The workpiece exposure method of claim 2, wherein the another first workpiece to be exposed is placed on the other first stage during the second frame performing the alignment operation Blocking the position of the first frame and the other first frame during the exposure operation of the second workpiece to be exposed, so that the position aligning device performs The alignment operation between the other first frame and the exposure device. 如請求項3所述的工件曝光方法,其中,所述曝光裝置包含有 單個曝光光源,所述曝光光源大致沿一直線方向移動,並且所述曝光光源在移動的過程中,先對待曝光的所述第一工件進行所述曝光作業,而後對待曝光的所述第二工件進行所述曝光作業。 The workpiece exposure method of claim 3, wherein the exposure device comprises a single exposure light source, the exposure light source moves substantially in a straight line direction, and during the moving of the exposure light source, the first workpiece to be exposed is subjected to the exposure operation, and then the second workpiece to be exposed is subjected to The exposure job. 如請求項1所述的工件曝光方法,其中,所述位置對準裝置所進行的各個所述對位作業以及所述曝光裝置所進行的各個所述曝光作業是在同一工作腔室內實施。 The workpiece exposure method according to claim 1, wherein each of the alignment operations performed by the alignment device and each of the exposure operations performed by the exposure device are performed in the same working chamber. 如請求項1至5中任一請求項所述的工件曝光方法,其中,在移動交換所述第一台框及所述另一第一台框的位置之後,以所述位置對準裝置進行所述另一第一台框與所述曝光裝置間的對位作業,其後,所述曝光裝置對所述另一第一台框上的待曝光的所述另一第一工件進行曝光作業;在所述另一第一台框及待曝光的所述另一第一工件進行所述對位作業與所述曝光作業的至少其中一個作業過程中,置放待曝光的另一第二工件於另一第二台框,接著移動交換所述第二台框及所述另一第二台框的位置。 The workpiece exposure method of any one of claims 1 to 5, wherein after the position of the first frame and the other first frame is moved and exchanged, the position aligning device performs An alignment operation between the other first frame and the exposure device, and thereafter, the exposure device performs an exposure operation on the other first workpiece to be exposed on the other first frame Placing another second workpiece to be exposed during at least one of the alignment operation and the exposure operation of the another first frame and the other first workpiece to be exposed In another second frame, the position of the second frame and the other second frame is then moved and exchanged. 如請求項6所述的工件曝光方法,其進一步包括:提供設有所述第一台框、所述另一第一台框、所述第二台框、所述另一第二台框、所述位置對準裝置、及所述曝光裝置的一曝光設備,並且所述曝光設備能被用來執行所述第一台框、所述另一第一台框、所述第二台框、及所述另一第二台框的移動、所述位置對準裝置的對位作業、及所述曝光裝置的曝光作業。 The workpiece exposure method of claim 6, further comprising: providing the first frame, the another first frame, the second frame, the other second frame, The position aligning device, and an exposure device of the exposure device, and the exposure device can be used to execute the first frame, the other first frame, the second frame, And movement of the other second frame, alignment operation of the alignment device, and exposure operation of the exposure device. 一種曝光設備,包括:一工作腔室及位於所述工作腔室外側的一置件區域;一位置對準裝置,設置於所述工作腔室內;一曝光裝置,設置於所述工作腔室內;兩個第一台框,分別設置於所述工作腔室與所述置件區域,並且任一個所述第一台框能可移動地與另一個所述第一台框 進行位置交換;以及兩個第二台框,分別設置於所述工作腔室與所述置件區域,並且任一個所述第二台框能可移動地與另一個所述第二台框進行位置交換;其中,位於所述工作腔室內的所述第一台框及所述第二台框能通過所述位置對準裝置,而進行與所述曝光裝置間的對位作業。 An exposure apparatus comprising: a working chamber and a component area on an outdoor side of the working chamber; a position aligning device disposed in the working chamber; and an exposure device disposed in the working chamber; Two first frames are respectively disposed in the working chamber and the set region, and any one of the first frames is movably coupled to the other of the first frames Position exchange; and two second frames respectively disposed in the working chamber and the set region, and any one of the second frames is movably movable with another of the second frames Position exchange; wherein the first frame and the second frame located in the working chamber can perform alignment work with the exposure device through the position aligning device. 如請求項8所述的曝光設備,其中,所述曝光裝置包含有單個曝光光源,所述曝光光源能相對於位在所述工作腔室內的所述第一台框與所述第二台框移動,以使位在所述工作腔室內的所述第一台框與所述第二台框位於所述曝光光源的移動範圍下方。 The exposure apparatus of claim 8, wherein the exposure device comprises a single exposure light source, the exposure light source being responsive to the first frame and the second frame positioned in the working chamber Moving so that the first frame and the second frame positioned in the working chamber are located below the moving range of the exposure light source. 如請求項9所述的曝光設備,其中,所述曝光光源大致沿一直線方向移動,並且位於所述工作腔室內的所述第一台框與所述第二台框的排列方向平行於所述直線方向,而所述曝光光源能在移動的過程中,依序對所述第一台框與所述第二台框進行曝光作業。 The exposure apparatus of claim 9, wherein the exposure light source moves substantially in a straight line direction, and an arrangement direction of the first frame and the second frame located in the working chamber is parallel to the In a linear direction, the exposure light source can sequentially perform an exposure operation on the first frame and the second frame during the moving process. 如請求項8所述的曝光設備,其中,所述曝光裝置包含有兩個底片框架及分別安裝於兩個所述底片框架的兩個底片,並且兩個所述底片框架分別設置於位在所述工作腔室內的所述第一台框與所述第二台框的上方,每個所述底片框架能大致沿一水平方向自所述工作腔室抽離。 The exposure apparatus of claim 8, wherein the exposure device comprises two negative film frames and two negative films respectively mounted to the two negative film frames, and the two negative film frames are respectively disposed at the position Above the first frame and the second frame in the working chamber, each of the film frames can be withdrawn from the working chamber substantially in a horizontal direction. 如請求項8所述的曝光設備,其中,所述位置對準裝置包含有獨立運作的兩個對位模組,兩個所述對位模組分別設置於位在所述工作腔室內的所述第一台框與所述第二台框的下方,並且兩個所述對位模組用以分別且獨立地調整位在所述工作腔室內的所述第一台框與所述第二台框的位置。 The exposure apparatus of claim 8, wherein the position aligning device comprises two aligning modules that are independently operated, and the two aligning modules are respectively disposed in the working chamber. Between the first frame and the second frame, and the two alignment modules are configured to separately and independently adjust the first frame and the second position in the working chamber The position of the frame. 如請求項12所述的曝光設備,其中,兩個所述對位模組用以 分別且非同時地調整位在所述工作腔室內的所述第一台框與所述第二台框的位置。 The exposure apparatus of claim 12, wherein the two of the alignment modules are used Positioning the first frame and the second frame in the working chamber separately and non-simultaneously. 如請求項13所述的曝光設備,其中,當兩個所述對位模組的其中一個對位模組用以調整位在所述工作腔室內的所述第一台框與所述第二台框的其中一個的位置時,所述曝光裝置用以對位在所述工作腔室內的所述第一台框與所述第二台框的其中另一個進行曝光作業。 The exposure apparatus of claim 13, wherein one of the two alignment modules of the alignment module is configured to adjust the first frame and the second position in the working chamber When the position of one of the frames is at least one position, the exposure device is configured to perform an exposure operation on the other of the first frame and the second frame in the working chamber. 如請求項8所述的曝光設備,其中,兩個所述第一台框的位置交換能與兩個所述第二台框的位置交換為非同時進行且具有一時間差,所述時間差不大於所述位置對準裝置對應於所述第一台框或所述第二台框的對位作業時間。 The exposure apparatus of claim 8, wherein the position exchange of the two first frames is interchangeable with the positions of the two second frames and is non-simultaneous and has a time difference, the time difference being not greater than The position aligning device corresponds to an alignment work time of the first frame or the second frame. 如請求項15所述的曝光設備,其中,兩個所述第一台框的位置交換路徑平行於或交錯於兩個所述第二台框的位置交換路徑。 The exposure apparatus of claim 15, wherein the position exchange paths of the two first frames are parallel or interleaved with the position exchange paths of the two second frames. 如請求項8所述的曝光設備,其進一步包括一視覺裝置,所述視覺裝置設置於所述工作腔室內並位在所述曝光裝置與所述位置對準裝置的上方。 The exposure apparatus of claim 8, further comprising a visual device disposed within the working chamber and positioned above the exposure device and the position aligning device. 一種曝光設備的置件機構,包括:一工作腔室及位於所述工作腔室外側的一置件區域;兩個第一台框,分別設置於所述工作腔室與所述置件區域,並且任一個所述第一台框能可移動地與另一個所述第一台框進行位置交換;以及兩個第二台框,分別設置於所述工作腔室與所述置件區域,並且任一個所述第二台框能可移動地與另一個所述第二台框進行位置交換。 A mounting mechanism for an exposure apparatus includes: a working chamber and a component area on an outdoor side of the working chamber; and two first frame frames respectively disposed in the working chamber and the component area, And any one of the first frames is movably exchangeable with another one of the first frames; and two second frames are respectively disposed in the working chamber and the mounting area, and Any one of the second frames can be movably exchanged with another of the second frames. 如請求項18所述的曝光設備的置件機構,其中,兩個所述第一台框的位置交換能與兩個所述第二台框的位置交換為非同時進行且具有不大於10秒的一時間差。 The device of claim 18, wherein the position exchange of the two first frames is interchangeable with the positions of the two second frames and is not more than 10 seconds. A time difference. 如請求項19所述的曝光設備的置件機構,其中,兩個所述第一台框的位置交換路徑平行於或交錯於兩個所述第二台框的位置交換路徑。 The arrangement mechanism of the exposure apparatus according to claim 19, wherein the position exchange paths of the two first frames are parallel or interleaved with the position exchange paths of the two second frames.
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