TWI445587B - Lightning scribing device - Google Patents

Description

Laser marking device

The present invention relates to a laser scribing apparatus for irradiating a brittle material substrate such as a glass substrate, a sapphire substrate, or a semiconductor substrate with a laser beam to form a scribe groove.

In general, in the process of dividing a brittle material substrate, the surface of the brittle material substrate is irradiated with laser light while moving along the line of the scribe line, thereby forming a scribe line. The groove, and the above method has been disclosed, for example, in Patent Document 1.

In a laser scribing device, a brittle material substrate is placed on a table on an XY stage that is movable in mutually orthogonal X and Y directions, and the table is illuminated in the X direction and Y while irradiating the laser light. The direction is moved to form a scribe groove on the brittle material substrate. The plate for the X-Y platform that supports the processing of large substrates uses a stone platen with small temperature changes and excellent physical and mechanical strength. The stone platen is of the same type used in the field of precision machining. It is formed of granite as a thick plate and the level of the upper and lower surfaces is precisely machined.

Fig. 4 is a schematic front view showing a conventional laser scribing apparatus in which a stone platen is assembled.

On the upper surface of the lower frame 31 composed of a metal frame material, a metal upper frame 34 having a stone platen 33 as a base is fixed by a height-adjustable connecting portion 32. An X-Y platform 39 including an X platform 36 and a Y platform 38 is disposed on the upper surface of the stone platen 33, and the X platform 36 is configured to be along the X The rails 35 extending in the direction (the front-rear direction of FIG. 4) are moved, and the Y-platform 38 is disposed to be movable along the rails 37 extending in the Y direction (the left-right direction of FIG. 4) on the X-platform. A table 41 is provided on the Y stage 38 via a rotating mechanism 40 that rotates about a vertical axis (vertical axis), and a brittle material substrate W to be processed is placed on the table 41.

A laser light source 42 or an observation portion (not shown) for confirming the position is attached to the uppermost portion of the upper frame 34. Inside the laser light source 42, a laser oscillation source and an optical element such as a mirror or a condenser lens that guides the light from the laser oscillation source to the laser beam irradiation unit 43 are provided. The brittle material substrate W is placed on the table 41, the laser beam is irradiated from the laser beam irradiation unit 43 to the brittle material substrate W, and the table 41 is moved in the X direction and the Y direction by the XY stage 39. Thereby, the scribe groove in the X direction and the Y direction can be processed on the brittle material substrate W.

[Background literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-089143

In the above-described laser scribing device, the stone pressure plate 33 is disposed above the lower frame 31, and the upper frame 34 is assembled on the upper surface of the stone pressure plate 33. The lower frame 31 is provided so as to set the height L _{1 of the} stone platen mounting surface to about 800 to 850 mm, thereby making the height of the upper surface of the stone platen to a height that is convenient for the person to operate. The upper frame 34 is assembled by the projector for mounting the laser light source 42 or the laser beam irradiation unit 43 upward, and irradiates the brittle material substrate W placed on the table 41 from above with a laser beam.

The upper frame 34 and the lower frame 31 are used for different purposes, respectively, so the upper frame 34 and the lower frame 31 are independently designed for each device, and the upper frame 34 and the lower frame 31 and the stone platen 33 form the skeleton of the device.

Therefore, it is necessary to change the size of the upper frame 34 assembled thereto or to change the lower frame of the support stone plate 33 corresponding to the stone platen 33 used, so that the upper frame 34 and the lower portion are separately designed for each device. Frame 31.

Furthermore, if the size and shape of the upper frame 34 are different, it is necessary to design the mounting position accordingly for the laser optical system.

Further, if the type or thickness of the brittle material substrate to be processed is different, it is necessary to change the type of the laser light source to be processed, the output size, and the optical system of the laser beam irradiation unit. Therefore, it is necessary to use the laser system according to the laser system. The method of mounting the upper frame 34 is designed using different models.

Further, the transfer robot may automatically perform the step of transporting the brittle material substrate W onto the stage 41 or carrying out the processed brittle material substrate W. In some cases, the steps may be performed manually, and may be manually performed during the trial production stage. When the substrate is transported and automatically carried out during the production phase, the transport method needs to be changed. In this case, it is also necessary to design the transport robot with the upper frame 34, the lower frame 31, and the stone platen 33.

Thus, it is necessary to cooperate with the main body portion of the laser scribing device including the upper frame 34, the lower frame 31, the stone platen 33, and the X-Y platform 39 (referred to as a processing order) The size and shape of the element are selected to be the laser optical system, the transport mechanism at the time of automation, and the installation method is individually designed, and the frame must be specially designed each time.

In view of the above, an object of the present invention is to realize a device configuration that can easily cope with a main body portion (processing unit) of a laser scribing device, a laser type, and a variation of a transport mechanism.

The laser scribing apparatus of the present invention completed to solve the above problems includes a processing unit and a laser unit, the processing unit being surrounded by a processing unit frame, the processing unit frame being constituted by a frame material forming a rectangular parallelepiped appearance; The unit is surrounded by a laser unit frame that is configured to form a rectangular parallelepiped shape having a shape of a bottom surface having the same shape as the upper surface of the processing unit frame; the processing unit includes: a stone pressure plate supported by a working space surrounded by the processing unit frame; a moving platform mounted on the upper surface of the stone platen; and a table movably supported by the moving platform and mounting the substrate; and the laser unit includes The laser light source and the laser beam irradiation unit supported by the laser unit frame, the laser unit frame and the processing unit frame are detachably unitized.

Furthermore, the laser scribing apparatus of the present invention further includes a transport unit that is surrounded by a transport unit frame that is configured to have a rectangular parallelepiped appearance by a frame material, and is surrounded by the transport unit frame. a space for transporting a substrate to the table; the transfer unit frame and the processing unit frame are mountable The way of unloading is unitized.

In the present invention, the laser unit (or the laser unit and the transport unit) is assembled to be coupled and separated to the processing unit via the frame, so that the thickness of the substrate of the brittle material to be processed and the type of the material can be selectively combined. A laser unit having another laser light source having an appropriate output or a transport unit having a different transport mode and a different transport direction can be used as a processing unit, and can be effectively used by various modifications.

Moreover, in the prior art, the stone platen was supported at the "high waist" by the lower frame, and the upper frame separated from the lower frame was assembled on the stone platen to support the laser unit. However, in the present invention, the frame is utilized. The processing unit frame formed by the material forming the rectangular shape supports the stone platen, thereby reducing the height of the stone platen. As a result, the height from the setting surface to the stone platen can be lowered.

Generally, the vibration in the horizontal direction is generated by the inertial force at the time of the rapid stop of the table driven by the moving platform (XY platform), and the vibration in the horizontal direction is transmitted to the frame via the stone platen on which the moving platform is placed. The farther the height of the stone platen is from the setting surface (the higher the center of gravity), the longer the vibration period is, and the closer to the setting surface, the shorter the period. In general, the longer the vibration period, the more time it takes to decay, so the decay time can be shortened by shortening the frequency of the vibration.

Therefore, in the present invention, the height from the installation surface to the placement surface of the stone platen can be shortened, whereby vibration can be generated even if the table is rapidly stopped, but it can be attenuated in a short time due to short-cycle vibration. For the next job Before the stage starts moving, the previous vibration will completely stop, so that the scribing process with less influence on the vibration can be realized.

Thereby, the scribe groove can be processed with high precision, and the moving platform whose inertial force is increased can also be operated at a high speed, thereby improving the performance of the device.

Hereinafter, the laser scribing apparatus of the present invention will be described in detail with reference to Figs. 1 to 3 . As shown in FIG. 2, the laser scribing apparatus includes a processing unit A that can be connected to and separated from each other, a laser unit B, and a transport unit C that is mounted when the substrate is automatically transported.

The processing unit A is surrounded by the frame 1 in a rectangular parallelepiped appearance, and the upper surface is square. The laser unit B is also surrounded by the frame 22 in the form of a rectangular parallelepiped, and the bottom surface thereof is formed in a square shape having the same shape as the upper surface of the processing unit A. The laser unit B is fixed to the upper surface of the processing unit A.

Further, the transport unit C is surrounded by the frame 23 so as to form a rectangular parallelepiped in appearance, and is fixed to the side surface of the processing unit A.

First, the processing unit A will be described. Fig. 1 is a perspective view showing a frame portion of the machining unit A. The frame 1 of the processing unit A is composed of four column frames 1a that are vertically erected at the four corners, and the lower horizontal frame 1b and the upper horizontal frame 1c are horizontally connected between the column frames 1a, and the middle portion is provided as needed for reinforcement. The horizontal frame 1d is formed in a cubic shape (may also be a rectangular parallelepiped). The frame members 1a, 1b, 1c, and 1d are formed of an angle tube of the same metal material, for example, iron or stainless steel having a thickness of about 9 mm.

In the present embodiment, the lower horizontal frame 1b is composed of a total of five frame members, in which four are horizontally connected between the lowermost portions of the adjacent column frames 1a. In addition to the root frame material, there is another lower cross-sectional transverse frame 1e (see FIG. 2) that is horizontally connected to the center of one of the lower horizontal frames 1b and 1b. A regulator 18 for adjusting the height of the installation surface R is attached to the lower end surface of the column frame 1a, and a caster 19 for movement is attached to the lower horizontal frame 1b.

Further, at a position close to the installation surface R, the stone pressure plate 3 is horizontally supported by the lower horizontal frame 1b (and the lower cross-sectional horizontal frame 1e) via the bottom support plate 2 (one part of the processing unit).

The upper horizontal frame 1c is formed in a square shape by four frame members that horizontally connect the uppermost portions of the adjacent column frames 1a, and the upper support plate 20 (one part of the laser unit) is placed thereon. Get fixed. The laser light source 16 described below is placed on the upper support plate 20, and is further supported by the laser beam irradiation unit 17 from the opening 21 formed in the upper support plate 20 toward the lower side.

Further, the middle horizontal frame 1d is formed in a square shape by four frame members that horizontally connect the central portions of the column frame 1a to each other.

The stone platen 3 is formed into a thick plate shape by granite having a small temperature change and excellent physical and mechanical strength, and the level of the upper and lower surfaces is precisely processed.

The bottom support plate 2 is larger than the surface (projection surface) occupied by the stone pressure plate 3, and can completely mount the bottom surface of the stone pressure plate 3, and the frame 1 and the stone pressure plate 3 are attached to the frame 1 without being in direct contact. Inside the inner space. Further, as shown in FIG. 2, one side of the stone platen 3 is attached to the bottom support plate 2 via the angled mounting piece 4 and the bolt 5, and the opposite side of the stone platen 3 is attached. The side edge portion is not fixed by the pressing piece 6 and is free to expand, so that The upper surface is gently brought into contact with the pressing piece 6. Thereby, when the ambient temperature changes, the bottom support plate 2 is not restrained by the stone pressure plate 3 to allow thermal expansion, so that the bottom support is not caused by the influence of the difference in thermal expansion coefficient of the stone platen 3. The deformation of the plate 2 does not cause the frame 1 to be affected by the difference in thermal expansion coefficient from the stone platen 3.

As far as the operability is concerned, the stone platen mounting height L ₂ from the setting surface R to the lower surface of the stone platen _{3 has been} set to about 800 mm, but due to the movement of the table below The generated vibration frequency depends on the height from the installation surface R. Therefore, it is preferable to set the stone platen mounting height L ₂ to 50 mm to 400 mm, and more preferably to 50 mm to 200 mm or less. The vibration frequency generated is sufficiently increased to allow the vibration to be attenuated in a short time.

As shown in FIG. 2 and FIG. 3, an XY stage 13 including an X platform 9 and a Y platform 12 is disposed on the upper surface of the stone platen 3, and the X stage 9 is disposed to be along the X direction by the drive shaft 8. The rail 7 extending upward is moved, and the Y stage 12 is disposed so as to be movable on the X platform 9 by the drive shaft 11 along the rail 10 extending in the Y direction orthogonal to the plane in the X direction. A table 15 is provided on the Y stage 12 via a rotating mechanism 14 that rotates about a longitudinal axis, and a brittle material substrate W to be processed is placed on the table 15.

Next, the laser unit B will be explained. The upper support plate 20 (a part of the laser unit) is detachably attached to the upper horizontal frame 1c of the machining unit A via a screw or the like. The upper support plate 20 forms the bottom surface of the laser unit B and has the same shape (same area) as the square formed by the upper horizontal frame 1c. The upper support plate 20 is fixed to the frame 22 of the laser unit B, thereby forming a rectangular shape. body. The frame 22 uses the same metal frame as the frame 1. As described above, the laser light source 16 and the laser light irradiation portion 17 are mounted on the upper support plate 20. Although not shown in the drawings, the laser light source 16 includes a laser oscillation source and an optical system element such as a mirror or a condenser lens for guiding the laser light from the laser oscillation source to the laser beam irradiation unit 17. Further, the upper support plate 20 is also provided with an optical system observation portion (camera) for detecting a point at which the laser light is irradiated to correct the deviation. Further, when the scribing process is performed by thermal stress by heating by laser irradiation and cooling immediately after heating, a refrigerant injection mechanism is also attached to the upper support plate 20. The laser beam irradiation unit 17 can perform laser irradiation into the processing unit frame 1 from the opening 21 formed in the upper support plate 20.

Next, the transport unit C will be described. The transport unit C is surrounded by a transport unit frame 23 of the same metal material as the frame 1, and the inner space includes a transport robot 24 that transports the brittle material substrate W between the processing unit A, and an unprocessed substrate for stacking or The cassette 25 of the substrate is processed.

In the above configuration, when the scribe groove is processed on the brittle material substrate W, the transfer robot 24 takes out the brittle material substrate W from the cassette 25, and mounts the brittle material substrate W on the table 15 of the processing unit A. The laser light is irradiated onto the brittle material substrate W from the laser beam irradiation unit 17, and the table 15 is moved in the X direction and the Y direction by the XY stage 13, whereby the X direction is processed on the brittle material substrate W and A scribe groove in the Y direction.

In the processing unit A, since the stone pressure plate 3 is disposed on the bottom support plate 2 inside the frame 1 and close to the setting surface R, the vibration frequency generated by the XY stage 13 corresponds to the stone pressure plate 3 and the setting. The interval L _{2 of the} face R is shortened and reduced, so that the amplification of the vibration caused by the repetitive motion of the XY stage 13 can be suppressed. Thereby, the scribe groove can be processed with higher precision, and the high speed operation of the XY stage 13 can also be realized, thereby improving the device performance. Furthermore, by reducing the center of gravity of the device and improving the stability of the device, vibration generation can be suppressed, and a highly precise scribe groove can be processed.

Further, in the present invention, the processing unit A, the laser unit B, and the transport unit C are independent, and the laser unit B or another transport unit C may be selectively combined with the processing unit A, and the above-described laser unit B is provided with another laser light source having an output suitable for each of the thickness of the brittle material substrate W to be processed and the type of material, and the other transport unit C is provided with a transport mechanism having a different transport mode and transport direction. Therefore, it can be effectively used through various changes.

The representative embodiments of the present invention have been described above, but the present invention is not necessarily limited to the configuration of the above embodiment. For example, the caster 19 and the adjuster 18 provided on the bottom surface of the machining unit frame 1 may be removed from the machining unit A, and the frame 1 may be directly disposed on the installation surface R.

Moreover, the mobile platform can also be an X platform that moves in only one direction instead of the X-Y platform.

Further, the swarf-treated brittle material substrate W is transported by the transport unit C, but the transport unit C may be omitted and the manual transport may be omitted.

Further, in the present invention, appropriate modifications and changes can be made without departing from the scope of the invention.

[Industrial availability]

The present invention can be applied to a scribing apparatus for forming a scribe groove on a brittle material substrate such as a glass substrate, a sapphire substrate, or a semiconductor substrate.

1‧‧‧Processing unit framework

1a‧‧‧ column frame

1b‧‧‧lower horizontal frame

1c‧‧‧ upper horizontal frame

1d‧‧‧Central frame

1e‧‧‧lower transverse frame

2‧‧‧Bottom support plate

3‧‧‧stone plate

4‧‧‧Installation

5‧‧‧ bolt

6‧‧‧Pressing tablets

7‧‧‧ Track

8‧‧‧Drive shaft

9‧‧‧X platform

10‧‧‧ Track

11‧‧‧Drive shaft

12‧‧‧Y platform

13‧‧‧X-Y platform (mobile platform)

14‧‧‧Rotating mechanism

15‧‧‧Workbench

16‧‧‧Laser light source

17‧‧‧Laser Light Irradiation Department

18‧‧‧Regulator

19‧‧‧ casters

20‧‧‧Upper support plate

22‧‧‧Laser unit frame

23‧‧‧Transport unit frame

24‧‧‧Transfer robot

25‧‧‧Carmen

31‧‧‧ Lower frame

32‧‧‧Connecting Department

33‧‧‧stone plate

34‧‧‧ upper frame

35‧‧‧ Track

36‧‧‧X platform

37‧‧‧ Track

38‧‧‧Y platform

39‧‧‧X-Y platform

40‧‧‧Rotating mechanism

41‧‧‧Workbench

42‧‧‧Laser light source

43‧‧‧Laser Light Irradiation Department

A‧‧‧Processing unit

B‧‧‧Laser unit

C‧‧‧Transport unit

L ₁ ‧‧‧ Height of stone plate loading surface

L ₂ ‧‧‧stone plate loading height

R‧‧‧Setting surface

W‧‧‧Battery material substrate

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a frame portion of a processing unit of a laser scribing apparatus of the present invention.

Figure 2 is a partial cross-sectional front elevational view of the laser scribing apparatus of the present invention.

Fig. 3 is a schematic plan view showing an X-Y platform portion of the scribing device.

Figure 4 is a front view of a prior scribing device.

1‧‧‧Processing unit framework

1a‧‧‧ column frame

1b‧‧‧lower horizontal frame

1c‧‧‧ upper horizontal frame

1d‧‧‧Central frame

1e‧‧‧lower transverse frame

2‧‧‧Bottom support plate

3‧‧‧stone plate

4‧‧‧Installation

5‧‧‧ bolt

6‧‧‧Pressing tablets

7‧‧‧ Track

8‧‧‧Drive shaft

9‧‧‧X platform

10‧‧‧ Track

11‧‧‧Drive shaft

12‧‧‧Y platform

13‧‧‧X-Y platform (mobile platform)

14‧‧‧Rotating mechanism

15‧‧‧Workbench

16‧‧‧Laser light source

17‧‧‧Laser Light Irradiation Department

18‧‧‧Regulator

19‧‧‧ casters

20‧‧‧Upper support plate

22‧‧‧Laser unit frame

23‧‧‧Transport unit frame

24‧‧‧Transfer robot

25‧‧‧Carmen

A‧‧‧Processing unit

B‧‧‧Laser unit

C‧‧‧Transport unit

L ₂ ‧‧‧stone plate loading height

R‧‧‧Setting surface

W‧‧‧Battery material substrate

Claims (2)

A laser scribing device, comprising: a processing unit and a laser unit; wherein the processing unit is surrounded by a processing unit frame, wherein the processing unit frame is formed by a frame material forming a rectangular parallelepiped appearance; Surrounded by a unit frame, the laser unit frame is configured to form a rectangular parallelepiped shape having a shape of a bottom surface having the same shape as the upper surface of the processing unit frame; the processing unit includes: a stone pressure plate supported by the processing unit frame a surrounding platform; a moving platform mounted on the upper surface of the stone platen; and a table movably supported by the moving platform and mounting the substrate; the laser unit including the laser unit frame In the laser light source and the laser light irradiation unit, the laser unit frame and the processing unit frame are detachably unitized. The laser scribing device according to claim 1, further comprising a transport unit, wherein the transport unit is surrounded by a transport unit frame, wherein the transport unit frame is formed by a frame material forming a rectangular parallelepiped shape; and surrounded by the transport unit frame The inner space includes a transport mechanism for transporting the substrate to the table, and the transport unit frame and the processing unit frame are detachably unitized.