TW201739681A - Adsorption pad and method of operation using the same capable of protecting workpieces, and stably detach workpieces - Google Patents
Adsorption pad and method of operation using the same capable of protecting workpieces, and stably detach workpieces Download PDFInfo
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- TW201739681A TW201739681A TW106106933A TW106106933A TW201739681A TW 201739681 A TW201739681 A TW 201739681A TW 106106933 A TW106106933 A TW 106106933A TW 106106933 A TW106106933 A TW 106106933A TW 201739681 A TW201739681 A TW 201739681A
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- 238000001179 sorption measurement Methods 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims description 9
- 230000035515 penetration Effects 0.000 claims description 34
- 230000006378 damage Effects 0.000 description 12
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B47/00—Suction cups for attaching purposes; Equivalent means using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
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- General Engineering & Computer Science (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Workpieces (AREA)
Abstract
Description
本發明係關於適用在吸附用墊的有效技術。 The present invention relates to an effective technique applicable to a pad for adsorption.
在韓國公開專利第10-2006-0082213號公報(以下稱「專利文獻1」)中記載有一種機械式真空墊，其具備頂出銷、及用以頂彈頂出銷之彈簧。該真空墊中，在自由狀態下，用彈簧從本體部施以頂彈的軸會從墊部突出。 Japanese Laid-Open Patent Publication No. 10-2006-0082213 (hereinafter referred to as "Patent Document 1") discloses a mechanical vacuum pad including an ejector pin and a spring for ejector pin. In the vacuum pad, in a free state, a shaft that is spring-loaded from the body portion by a spring protrudes from the pad portion.
[專利文獻1]韓國公開專利第10-2006-0082213號公報 [Patent Document 1] Korean Laid-Open Patent Publication No. 10-2006-0082213
當吸附用墊(也稱為真空墊)的內部空間呈真空狀態時，係藉由向該內部空間供給空氣(以下稱為「真空破壞空氣」)來破壞真空。為了藉真空抽吸從吸附工件中的吸附用墊確實進行工件的脫離，可考量藉由例如壓力、流量的排出力、排出時間等來增強真空破壞空氣。 再者，也可考慮透過在和工件接觸的墊部施以防止黏附加工(例如，粗糙化、塗層)以降低墊部的黏附力，以減弱真空破壞空氣。 When the internal space of the adsorption pad (also referred to as a vacuum pad) is in a vacuum state, the vacuum is broken by supplying air to the internal space (hereinafter referred to as "vacuum breaking air"). In order to reliably detach the workpiece from the adsorption pad in the adsorption workpiece by vacuum suction, it is possible to enhance the vacuum destruction air by, for example, the discharge force of the pressure, the flow rate, the discharge time, and the like. Furthermore, it is also conceivable to reduce the adhesion of the pad by applying a sticking force (for example, roughening, coating) on the pad portion in contact with the workpiece to weaken the vacuum to destroy the air.
然而，在增強真空破壞空氣的情況下，脫離後的工件會有被吹走的疑慮。另一方面，在減弱真空破壞空氣的情況下，會有例如在局部保持黏附的狀態將工件攜回等工件脫離不穩定的顧慮。特別是工件為小型化、輕量化的半導體晶片時，脫離動作容易不穩定。因此，雖可考量將真空破壞空氣的壓力及流量及排出時間施以微調整，但為了要進行微調整，會使步驟數增加，又得需要微調整用之控制機器。 However, in the case where the vacuum is destroyed by the vacuum, the workpiece after the detachment may be blown away. On the other hand, in the case where the vacuum is destroyed by the vacuum, there is a concern that the workpiece is brought back to the unstable state, for example, in a state where the adhesion is locally maintained. In particular, when the workpiece is a semiconductor wafer that is small and lightweight, the detachment operation is likely to be unstable. Therefore, although the pressure, flow rate, and discharge time of the vacuum-destroyed air can be considered to be finely adjusted, in order to perform fine adjustment, the number of steps is increased, and a control device for fine adjustment is required.
再者，如專利文獻1所載的真空墊中，令墊部接觸工件時會發生問題。具體而言，在工件接觸墊部之前，會因工件本身而將突出中的軸上推，而必需將軸向本體部拉入，此時會有工件受到損傷的疑慮。 Further, in the vacuum pad as disclosed in Patent Document 1, a problem occurs when the pad portion comes into contact with the workpiece. Specifically, before the workpiece contacts the pad portion, the protruding shaft is pushed up by the workpiece itself, and the axial body portion must be pulled in, and the workpiece may be damaged.
本發明之目的在提供可保護所吸附的工件，以穩定進行脫離的吸附用墊。本發明的前述及其他目的以及新穎特徵應可從本說明書的陳述及附圖中充分獲得了解。 SUMMARY OF THE INVENTION An object of the present invention is to provide an adsorption pad which can protect a sample to be adsorbed and to stably perform detachment. The above and other objects and novel features of the present invention are fully understood from the description and appended claims.
本案所揭示的發明中，代表性構成的概要內容可簡單說明如下。 In the invention disclosed in the present invention, the outline of the representative configuration can be briefly described as follows.
本發明之解決手段的吸附用墊，其特徵為具備：本體部，具有內部空間；墊部，與前述內部空間連通；軸部，具有前端部，並以前述前端部朝向前述墊部 的方式設於前述內部空間，且前述前端部可向前述墊部的內外進行往復移動；及軸彈性部，將前述前端部拉入前述墊部內，並保持前述軸部。 The adsorption pad according to the solution of the present invention includes a main body portion having an internal space, a pad portion communicating with the internal space, and a shaft portion having a front end portion facing the mat portion with the front end portion The method is provided in the internal space, and the front end portion is reciprocally movable to the inside and the outside of the pad portion, and the shaft elastic portion pulls the front end portion into the pad portion to hold the shaft portion.
此處，更佳為，前述軸部的行程量係大於前述軸部的前述前端部向前述墊部外突出的最大突出量。若依此構成，在將真空破壞空氣從墊部排出的狀態後，即使有工件黏附在墊部，也可用軸部穩定進行工件的脫離。 Here, it is more preferable that the stroke amount of the shaft portion is larger than a maximum amount of protrusion of the front end portion of the shaft portion to the outside of the mat portion. According to this configuration, even after the vacuum-destroyed air is discharged from the pad portion, even if a workpiece adheres to the pad portion, the shaft portion can be stably detached from the workpiece.
再者，更佳為，再具備：空氣進出部，和前述內部空間連通；及活塞部，在前述內部空間內，設於前述軸部與前述空氣進出部之間。若依此構成，可使軸部抗拒軸彈性部的彈力而向墊部側推壓。 Furthermore, it is preferable that the air inlet and outlet portion communicates with the internal space, and the piston portion is provided between the shaft portion and the air inlet and outlet portion in the internal space. According to this configuration, the shaft portion can be pressed against the pad portion side against the elastic force of the shaft elastic portion.
再者，更佳為，前述本體部再具有和前述墊部連通，且可供前述軸部的前端部插入的導引貫通部；前述軸部在前述前端部的相反側復具有直徑大於前述導引貫通部的突緣部。若依此構成，在工件脫離後，可藉突緣部封塞導引貫通部(空氣流路)，俾停止空氣自墊部排出。 Furthermore, it is preferable that the main body portion further has a guiding through portion that is in communication with the pad portion and that is insertable into a front end portion of the shaft portion; and the shaft portion has a larger diameter than the guide portion on a side opposite to the front end portion. Lead the flange portion of the penetration portion. According to this configuration, after the workpiece is detached, the penetration portion (air flow path) can be closed by the flange portion, and the air can be stopped from being discharged from the pad portion.
本發明之解決手段的吸附用墊的動作方法中，該吸附用墊具備：本體部，具有內部空間；墊部，與前述內部空間連通；及軸部，以前端部朝向前述墊部的方式設於前述內部空間；其特徵為該吸附用墊的動作方法包含：(a)在保持著將前述前端部拉入前述墊部內的狀態下，從前述內部空間進行空氣抽吸，使工件吸附在前述墊部的步驟；及(b)在前述(a)步驟後，向前述內部空 間進行空氣的供給，且在使空氣從前述墊部排出後，令前述軸部從前述墊部突出的步驟。 In the method of operating the adsorption pad according to the solution of the present invention, the adsorption pad includes a main body portion having an internal space, a pad portion communicating with the internal space, and a shaft portion having a front end portion facing the pad portion. In the internal space, the method for operating the adsorption pad includes: (a) performing air suction from the internal space while holding the distal end portion into the pad portion, and absorbing the workpiece in the foregoing a step of the pad portion; and (b) after the step (a) above, to the aforementioned internal space The supply of air is performed, and after the air is discharged from the pad portion, the shaft portion is protruded from the pad portion.
此處，更佳為，前述(b)步驟中，在使前述前端部從前述墊部突出後，停止從前述墊部排出空氣。若依此構成，可防止脫離後的工件被吹走。 Here, it is more preferable that in the step (b), the front end portion is protruded from the mat portion, and then the air is discharged from the mat portion. According to this configuration, it is possible to prevent the workpiece after being detached from being blown away.
本案揭示的發明中，藉代表性構成所獲得的功效可簡單說明如次。若依本發明之一解決手段的吸附用墊，可保護所吸附的工件，且穩定進行工件的脫離。 In the invention disclosed in the present invention, the effects obtained by the representative composition can be simply described as follows. According to the adsorption pad of the solution of the present invention, the adsorbed workpiece can be protected and the detachment of the workpiece can be stably performed.
10‧‧‧吸附用墊 10‧‧‧Adsorption pad
11‧‧‧本體部 11‧‧‧ Body Department
11A‧‧‧空氣進出部 11A‧‧‧Air In and Out Department
11B‧‧‧導引本體部 11B‧‧‧Guiding body
11C‧‧‧帽蓋保持部 11C‧‧‧Cap Holder
11D‧‧‧保持部 11D‧‧‧ Keeping Department
11E‧‧‧保持部 11E‧‧‧ Keeping Department
11F、11G‧‧‧擋止部 11F, 11G‧‧‧ stop
12‧‧‧墊部 12‧‧‧ 垫部
12A‧‧‧前緣 12A‧‧‧ leading edge
12B‧‧‧墊貫通部 12B‧‧‧Material penetration
13‧‧‧軸部 13‧‧‧Axis
13A‧‧‧前端部 13A‧‧‧ front end
13B‧‧‧保持部 13B‧‧‧ Keeping Department
13C‧‧‧突緣部 13C‧‧‧Front Department
13D‧‧‧軸貫通部 13D‧‧‧ shaft penetration
14‧‧‧軸彈性部 14‧‧‧Axis Elastic Department
15‧‧‧活塞部 15‧‧‧Piston Department
15A‧‧‧凹入部 15A‧‧‧ recessed part
15B‧‧‧交叉貫通部 15B‧‧‧cross through section
16‧‧‧內部空間 16‧‧‧Internal space
16A‧‧‧軸室 16A‧‧‧Axis room
16B‧‧‧活塞室 16B‧‧‧Piston room
16C‧‧‧空氣貫通部 16C‧‧‧Air penetration
16D‧‧‧導引貫通部 16D‧‧‧Guide through
22、23‧‧‧密封部 22, 23‧‧‧ Sealing Department
24‧‧‧凹入部 24‧‧‧ recessed
25‧‧‧活塞彈性部 25‧‧‧Piston Elastic Department
圖1為本發明一實施形態之吸附用墊的剖面圖。 Fig. 1 is a cross-sectional view showing a pad for adsorption according to an embodiment of the present invention.
圖2為繼圖1之動作步驟中的吸附用墊剖面圖。 Figure 2 is a cross-sectional view of the adsorption pad in the operation step of Figure 1.
圖3為繼圖2之動作步驟中的吸附用墊剖面圖。 Figure 3 is a cross-sectional view of the adsorption pad in the operation step of Figure 2.
圖4為繼圖3之動作步驟中的吸附用墊剖面圖。 Figure 4 is a cross-sectional view of the adsorption pad in the operation step of Figure 3.
圖5為繼圖4之動作步驟中的吸附用墊剖面圖。 Figure 5 is a cross-sectional view of the adsorption pad in the operation step of Figure 4.
圖6為用以說明吸附用墊之動作狀態的圖表。 Fig. 6 is a graph for explaining an operation state of the adsorption pad.
在下文的本發明實施形態中，關於構成要素的數目(包含個數、數值、量、範圍等)，除了特別明示的情況或原理上顯然限定於特定數目的情況外，並不限定於該特定數目，也可為特定數目以上或以下。再者，提及構成要素等的形狀時，除了特別明示的情況及原理上可認為顯然並非如此的情況之外，也包含實質上近似 或類似該形狀的情況。 In the following embodiments of the present invention, the number of constituent elements (including the number, the numerical value, the quantity, the range, and the like) is not limited to the specific one except for the case where it is specifically indicated or the principle is obviously limited to a specific number. The number may also be a specific number or more. In addition, when a shape of a component or the like is mentioned, it is substantially similar to the case where it is considered that the case is not particularly clear, and the principle is obviously not the case. Or a case similar to this shape.
茲參照附圖，就本發明一實施形態的吸附用墊10加以說明。圖1至圖5為動作步驟中的吸附用墊10的剖面圖。圖6係用以說明吸附用墊10之動作狀態的圖表，位置1至位置5分別對應圖1至圖5。 The absorbent pad 10 according to an embodiment of the present invention will be described with reference to the drawings. 1 to 5 are cross-sectional views of the adsorption pad 10 in the operation step. Fig. 6 is a diagram for explaining an operation state of the adsorption pad 10, and positions 1 to 5 correspond to Figs. 1 to 5, respectively.
首先，概略說明吸附用墊10的構成。吸附用墊10係應用於例如使用真空實施吸附運送的領域，其係藉由例如螺紋機構或接頭經由管體(空氣流路)和空氣供應源(未圖示)連結。空氣供應源具備例如切換閥(電磁閥等)、調壓裝置、真空泵及空壓機，而為可對所連結的吸附用墊10實施空氣抽吸、供給的構成。因此，吸附用墊10可藉來自空氣供應源的真空抽吸(也稱為空氣抽吸)而將工件W(例如半導體晶片)吸附，或藉空氣供給使工件W脫離。 First, the configuration of the adsorption pad 10 will be briefly described. The adsorption pad 10 is applied to, for example, a field in which adsorption transportation is performed using a vacuum, and is connected to an air supply source (not shown) via a pipe body (air flow path) by, for example, a screw mechanism or a joint. The air supply source includes, for example, a switching valve (such as a solenoid valve), a pressure regulating device, a vacuum pump, and an air compressor, and is configured to perform air suction and supply to the connected adsorption pad 10. Therefore, the adsorption pad 10 can adsorb the workpiece W (for example, a semiconductor wafer) by vacuum suction (also referred to as air suction) from an air supply source, or detach the workpiece W by air supply.
此處，本實施形態中，係將藉空氣供應源所抽吸的空氣稱作「真空空氣」，將被供給的空氣稱作「真空破壞空氣」來說明。另外，真空吸附係指產生較周圍的高壓力為低的壓力以進行吸取的情況，未必限於1大氣壓以下的真空。 Here, in the present embodiment, the air sucked by the air supply source is referred to as "vacuum air", and the supplied air is referred to as "vacuum destroying air". Further, the vacuum adsorption means a case where a pressure lower than the surrounding high pressure is generated for suction, and is not necessarily limited to a vacuum of 1 atmosphere or less.
吸附用墊10係具備：本體部11、墊部12、軸部13、軸彈性部14、及活塞部15而構成。本實施形態中，吸附用墊10具有軸線X，且有以圖示軸線X的一方為上方、另一方為下方來說明的情況。 The adsorption pad 10 includes a main body portion 11 , a pad portion 12 , a shaft portion 13 , a shaft elastic portion 14 , and a piston portion 15 . In the present embodiment, the adsorption pad 10 has the axis X, and one of the axes X shown in the drawing is upward and the other is downward.
本體部11具有內部空間16。內部空間16具有：主要供軸部13存在的軸室16A；及主要供活塞部15存在 的活塞室16B。軸室16A及活塞室16B係相鄰接且相連通。該內部空間16可藉真空空氣而呈真空狀態。真空狀態可藉真空破壞空氣而加以破壞。因此，內部空間16也可稱為供真空空氣及真空破壞空氣流動的空氣流路。 The body portion 11 has an internal space 16. The internal space 16 has: an axial chamber 16A mainly for the presence of the shaft portion 13; and mainly for the presence of the piston portion 15 Piston chamber 16B. The shaft chamber 16A and the piston chamber 16B are adjacent to each other and communicate with each other. The internal space 16 can be vacuumed by vacuum air. The vacuum state can be destroyed by vacuum destroying the air. Therefore, the internal space 16 can also be referred to as an air flow path for vacuum air and vacuum to disrupt the flow of air.
本體部11在上方側具有和內部空間16之活塞室16B連通的空氣進出部11A。空氣進出部11A具有作為空氣流路的空氣貫通部16C。在空氣進出部11A中，吸附用墊10係和空氣供應源連結。再者，本體部11係和墊部12連通，具有供軸部13的前端部13A插入的導引貫通部16D。該導引貫通部16D係和內部空間16的軸室16A連通，並作為空氣流路。另外，因空氣貫通部16C及導引貫通部16D也作為空氣流路，故包含在內部空間16中。 The main body portion 11 has an air inlet and outlet portion 11A that communicates with the piston chamber 16B of the internal space 16 on the upper side. The air inlet and outlet portion 11A has an air penetration portion 16C as an air flow path. In the air inlet and outlet portion 11A, the adsorption pad 10 is coupled to an air supply source. Further, the main body portion 11 communicates with the pad portion 12, and has a guide penetration portion 16D into which the distal end portion 13A of the shaft portion 13 is inserted. The guide penetration portion 16D communicates with the shaft chamber 16A of the internal space 16 and serves as an air flow path. Further, since the air penetration portion 16C and the guide penetration portion 16D also serve as air flow paths, they are included in the internal space 16.
墊部12具有前緣12A(開口)，其係和內部空間16連通，且設於本體部11的下方側。亦即，墊部12和內部空間16係相連通。因此，不限於本體部11的內部空間16，也包含墊部12的內部空間，可謂皆為吸附用墊10整體的內部空間。 The pad portion 12 has a leading edge 12A (opening) that communicates with the internal space 16 and is provided on the lower side of the body portion 11. That is, the pad portion 12 and the internal space 16 are in communication. Therefore, it is not limited to the internal space 16 of the main body portion 11, and the internal space of the pad portion 12 is also included, and the internal space of the entire adsorption pad 10 can be said.
軸部13具有前端部13A及保持部13B，其係以前端部13A朝向墊部12的方式設於內部空間16。再者，軸部13在前端部13A的相反側具有直徑較導引貫通部16D為大的突緣部13C。因此，突緣部13C可將導引貫通部16D封塞。 The shaft portion 13 has a distal end portion 13A and a holding portion 13B which are provided in the internal space 16 such that the distal end portion 13A faces the pad portion 12. Further, the shaft portion 13 has a flange portion 13C having a larger diameter than the guide through portion 16D on the opposite side of the distal end portion 13A. Therefore, the flange portion 13C can close the guide through portion 16D.
軸部13係使其前端部13A向墊部12的內外往復移動。本實施形態中，軸部13往復移動之際，軸部13的前端部13A及保持部13B係在本體部11(導引本體部 11B)的導引貫通部16D內滑動。另外，為了使導引貫通部16D的空氣流路明確化，圖1等圖示中，詳細圖示有相對於軸線X左側為右側的前端部13A、及保持部13B。 The shaft portion 13 reciprocates the front end portion 13A toward the inside and the outside of the pad portion 12. In the present embodiment, when the shaft portion 13 reciprocates, the front end portion 13A of the shaft portion 13 and the holding portion 13B are attached to the main body portion 11 (the main body portion) 11B) slides in the guide through portion 16D. In addition, in order to clarify the air flow path of the guide penetration portion 16D, the front end portion 13A and the holding portion 13B which are the right side with respect to the left side of the axis X are illustrated in detail in FIG. 1 and the like.
軸彈性部14係設置成，在吸附用墊10呈自由狀態(沒有空氣出入的狀態)下，將前端部13A拉入墊部12內(內部空間16內)並保持軸部13(參照圖1)。具體而言，軸彈性部14在導引貫通部16D內設於本體部11的保持部11D(階差部)及軸部13的保持部13B(階差部)之間。 The shaft elastic portion 14 is provided such that the tip end portion 13A is pulled into the pad portion 12 (in the internal space 16) while the adsorption pad 10 is in a free state (with no air in and out), and the shaft portion 13 is held (refer to FIG. 1). ). Specifically, the shaft elastic portion 14 is provided between the holding portion 11D (step portion) of the main body portion 11 and the holding portion 13B (step portion) of the shaft portion 13 in the guide penetration portion 16D.
若依此種吸附用墊10，在將軸部13的前端部13A拉入墊部12內的狀態下，可使工件W吸附於墊部12(參照圖3)。亦即，不會因軸部13造成工件W的損傷，可保護所吸附的工件W。 According to the adsorption pad 10, the workpiece W can be attracted to the pad portion 12 while the tip end portion 13A of the shaft portion 13 is pulled into the pad portion 12 (see FIG. 3). That is, the workpiece W is not damaged by the shaft portion 13, and the workpiece W to be adsorbed can be protected.
再者，吸附用墊10係構成為伴隨著軸彈性部14的伸縮動作(上下動作)，軸部13會進行往復移動(上下動作)。在本實施形態中，藉由位在軸部13和空氣進出部11A之間且設於內部空間16的活塞部15，可使軸部13抵抗軸彈性部14向墊部12側推壓。該活塞部15係藉由推力而往復移動(上下動作)。例如，軸部13的前端部13A從墊部12突出時，因真空破壞空氣的作用(產生在軸室16A與活塞室16B之間的壓力差)而藉由活塞部15使軸部13被推出並向下移動，使軸彈性部14成為收縮的狀態。 Further, the adsorption pad 10 is configured such that the shaft portion 13 reciprocates (up and down) in accordance with the expansion and contraction operation (up and down operation) of the shaft elastic portion 14. In the present embodiment, the shaft portion 13 can be pressed against the pad portion 12 side against the shaft elastic portion 14 by the piston portion 15 provided between the shaft portion 13 and the air inlet portion 11A and provided in the internal space 16. The piston portion 15 reciprocates by a thrust (up and down motion). For example, when the front end portion 13A of the shaft portion 13 protrudes from the pad portion 12, the shaft portion 13 is pushed out by the piston portion 15 due to the action of the vacuum breaking air (the pressure difference generated between the shaft chamber 16A and the piston chamber 16B) And moving downward, the shaft elastic portion 14 is in a contracted state.
再者，吸附用墊10係構成為使軸部13在內部空間16內的行程量x1(參照圖1)大於軸部13的前端部13A向墊部12外突出的最大突出量x2(參照圖5)。藉此構成，使工件W脫離之際，在從墊部12排出真空破壞空氣的狀 態(參照圖4)後，即使工件W暫時還黏附在墊部12，也可用軸部13將工件W以機械方式推出(參照圖5)，可以穩定地進行工件W的脫離。因此，軸部13可用作為輔助所吸附的工件W的脫離之構成 Further, the adsorption pad 10 is configured such that the stroke amount x1 (see FIG. 1) of the shaft portion 13 in the internal space 16 is larger than the maximum projection amount x2 of the distal end portion 13A of the shaft portion 13 protruding outward from the pad portion 12 (refer to the figure). 5). With this configuration, when the workpiece W is detached, the vacuum is destroyed from the pad portion 12 After the state (see FIG. 4), even if the workpiece W temporarily adheres to the pad portion 12, the workpiece W can be mechanically pushed out by the shaft portion 13 (see FIG. 5), and the workpiece W can be stably detached. Therefore, the shaft portion 13 can be used as a component for assisting the detachment of the workpiece W to be adsorbed.
此外，工件W脫離後，亦即，軸部13從墊部12突出後，因可藉由突緣部13C使導引貫通部16D被封塞(參照圖5)，故可停止真空破壞空氣的排出。而且，藉由停止真空破壞空氣的排出，得以防止工件W被吹走。因此，可使輕量工件W的脫離穩定進行，獲致工件W生產性的提升(生產週期提升、機械運轉率提升)。 Further, after the workpiece W is detached, that is, after the shaft portion 13 protrudes from the pad portion 12, the guide through portion 16D can be closed by the flange portion 13C (see FIG. 5), so that the vacuum can be stopped to destroy the air. discharge. Moreover, by stopping the vacuum to destroy the discharge of the air, it is possible to prevent the workpiece W from being blown away. Therefore, the detachment of the lightweight workpiece W can be stably performed, and the productivity of the workpiece W can be improved (the production cycle is improved, and the mechanical operation rate is improved).
再者，因係藉突緣部13C封塞導引貫通部16D來進行真空破壞空氣的停止，故真空破壞空氣的壓力、流量、排出時間可概略地設定，得以減少調整工數。而且，因可防止工件被吹走，故不再需要使用控制真空破壞空氣的控制裝置，使用吸附用墊10的吸附系統的成本得以降低。 In addition, since the vacuum breakage air is stopped by closing the guide penetration portion 16D by the flange portion 13C, the pressure, the flow rate, and the discharge time of the vacuum destruction air can be roughly set, and the number of adjustments can be reduced. Moreover, since the workpiece can be prevented from being blown away, it is no longer necessary to use a control device for controlling the vacuum to destroy the air, and the cost of the adsorption system using the adsorption pad 10 can be reduced.
其次，具體說明吸附用墊10的構成。吸附用墊10具備本體部11，其具有內部空間16。本體部11係由例如金屬等的導電性構件構成。若使用導電性構件，可防止作為工件W的半導體晶片等電子零件的靜電破壞。 Next, the configuration of the adsorption pad 10 will be specifically described. The adsorption pad 10 includes a body portion 11 having an internal space 16 . The main body portion 11 is made of a conductive member such as metal. When a conductive member is used, electrostatic breakdown of an electronic component such as a semiconductor wafer as the workpiece W can be prevented.
內部空間16係在軸線X方向中從上方側向下方側依序連通空氣貫通部16C、活塞室16B、軸室16A、及導引貫通部16D所構成。此處，軸室16A的內徑係大於活塞室16B的內徑，軸室16A與活塞室16B之間會成為階差。該階差部則作為限制軸部13往上方側移動的擋止部 11F。再者，活塞室16B的內徑係大於空氣貫通部16C的內徑，活塞室16B與空氣貫通部16C之間會成為階差。該階差部則作為限制活塞部15向上方側移動的擋止部11G。 The internal space 16 is configured by sequentially connecting the air penetration portion 16C, the piston chamber 16B, the shaft chamber 16A, and the guide penetration portion 16D from the upper side to the lower side in the axis X direction. Here, the inner diameter of the shaft chamber 16A is larger than the inner diameter of the piston chamber 16B, and a step is formed between the shaft chamber 16A and the piston chamber 16B. The step portion serves as a stopper for restricting the upward movement of the shaft portion 13 11F. Further, the inner diameter of the piston chamber 16B is larger than the inner diameter of the air penetration portion 16C, and a step is formed between the piston chamber 16B and the air penetration portion 16C. This step portion serves as a stopper portion 11G that restricts the piston portion 15 from moving upward.
本體部11係構成為以具有空氣貫通部16C的部分作為空氣進出部11A。該空氣進出部11A係藉由例如螺紋機構或接頭經由管體連結至空氣供應源。本體部11的內部空間16中，係經由空氣進出部11A的空氣貫通部16C而藉空氣供應源抽吸空氣、或供應空氣。此外，吸附用墊10係設於空氣進出部11A與空氣供應源的連結部位，且具備用以防止發生空氣洩漏的密封部22(例如，密封墊片)。 The main body portion 11 is configured such that a portion having the air penetration portion 16C serves as the air inlet and outlet portion 11A. The air inlet and outlet portion 11A is coupled to the air supply source via a pipe body by, for example, a screw mechanism or a joint. In the internal space 16 of the main body portion 11, air is supplied or supplied by the air supply source via the air penetration portion 16C of the air inlet and outlet portion 11A. Further, the adsorption pad 10 is provided at a connection portion between the air inlet and outlet portion 11A and the air supply source, and is provided with a sealing portion 22 (for example, a gasket) for preventing air leakage.
再者，本體部11係構成為以具有導引貫通部16D的部分作為導引本體部11B。導引本體部11B係用以引導被插入導引貫通部16D的軸部13之前端部13A及直徑較前端部13A為大的保持部13B(大徑部)的往復移動。因此，在僅供前端部13A插入的小徑部分與供前端部13A及保持部13B插入的大徑部分之間會形成階差。另外，該階差部係作為保持軸彈性部14的保持部11D。 Further, the main body portion 11 is configured to have a portion having the guide through portion 16D as the guide main body portion 11B. The guide main body portion 11B guides the reciprocating movement of the front end portion 13A of the shaft portion 13 inserted into the guide penetration portion 16D and the holding portion 13B (large diameter portion) having a larger diameter than the distal end portion 13A. Therefore, a step is formed between the small-diameter portion into which the distal end portion 13A is inserted and the large-diameter portion into which the distal end portion 13A and the holding portion 13B are inserted. Further, the step portion serves as a holding portion 11D that holds the shaft elastic portion 14.
為了將軸部13或活塞部15等組件組裝於內部空間16，導引本體部11B可當作帽蓋藉螺紋機構形成可裝卸狀態。其次，吸附用墊10係設於本體部11的主要部分與作為帽蓋部分之導引本體部11B的連結部位，且具備用以防止空氣從內部空間16洩漏的密封部23(例如，O型環)。 In order to assemble the assembly such as the shaft portion 13 or the piston portion 15 to the internal space 16, the guide body portion 11B can be formed into a detachable state by the threaded mechanism as a cap. Next, the adsorption pad 10 is provided at a joint portion of the main portion of the main body portion 11 and the guide main portion 11B as a cap portion, and is provided with a sealing portion 23 for preventing air from leaking from the internal space 16 (for example, an O type) ring).
再者，吸附用墊10具備墊部12。墊部12係以例如腈橡膠、矽酮橡膠、導電性橡膠等的橡膠構件所構 成。藉由橡膠構件，可在與工件W接觸之際保護工件W。墊部12係藉本體部11(導引本體部11B)所具有的帽蓋保持部11C予以保持。本實施形態中，為了嵌合在突緣狀的帽蓋保持部11C，墊部12的內部形成有環溝，使墊部12可安裝(保持)在本體部11。只要是以橡膠構件構成的墊部12，本體部11與墊部12的連結部位的密封性即可獲得確保。另外，本實施形態中，本體部11與墊部12係形成各別的件體，但墊部12係安裝在本體部11，故本體部11與墊部12也可藉由例如樹脂材料一體成形。 Further, the adsorption pad 10 is provided with a pad portion 12. The pad portion 12 is constructed of a rubber member such as a nitrile rubber, an anthrone rubber, or a conductive rubber. to make. The workpiece W can be protected by contact with the workpiece W by the rubber member. The pad portion 12 is held by the cap holding portion 11C of the main body portion 11 (the guiding main body portion 11B). In the present embodiment, in order to fit the flange-shaped cap holding portion 11C, a ring groove is formed inside the pad portion 12, and the pad portion 12 can be attached (held) to the main body portion 11. The sealing portion of the joint portion between the main body portion 11 and the mat portion 12 can be secured by the pad portion 12 formed of a rubber member. Further, in the present embodiment, the main body portion 11 and the pad portion 12 are formed as separate bodies, but the pad portion 12 is attached to the main body portion 11, so that the main body portion 11 and the pad portion 12 can be integrally formed by, for example, a resin material. .
安裝在本體部11的墊部12具有和內部空間16(導引貫通部16D)連通的墊貫通部12B。該墊貫通部12B在用以確保吸附工件W用之面積的前緣12A係形成逐漸擴大的開口。在例如工件W為數mm四方的小型化、輕量化的半導體晶片的情況中，前緣12A的直徑雖為3mm左右，但依照工件W的大小、重量，也可為200mm左右。在墊部12吸附工件W時，此種墊貫通部12B係成為真空狀態(參照圖3)。 The pad portion 12 attached to the main body portion 11 has a pad penetration portion 12B that communicates with the internal space 16 (guide through portion 16D). The pad penetration portion 12B forms a gradually enlarged opening in the leading edge 12A for ensuring the area for adsorbing the workpiece W. For example, in the case of a miniaturized and lightweight semiconductor wafer in which the workpiece W is a few mm, the diameter of the leading edge 12A is about 3 mm, but it may be about 200 mm depending on the size and weight of the workpiece W. When the pad portion 12 adsorbs the workpiece W, the pad through portion 12B is in a vacuum state (see FIG. 3).
再者，吸附用墊10具備軸部13。軸部13和本體部11同樣，係由例如金屬等導電性構件所構成。軸部13係在長度方向(軸線X方向)中從下方側向上方側依序由前端部13A、保持部13B、突緣部13C所構成。保持部13B的直徑大於前端部13A，突緣部13C的直徑又大於保持部13B。 Further, the adsorption pad 10 includes a shaft portion 13. Similarly to the main body portion 11, the shaft portion 13 is made of a conductive member such as metal. The shaft portion 13 is composed of a distal end portion 13A, a holding portion 13B, and a flange portion 13C in order from the lower side toward the upper side in the longitudinal direction (the axis X direction). The diameter of the holding portion 13B is larger than the front end portion 13A, and the diameter of the flange portion 13C is larger than the holding portion 13B.
此種軸部13具有貫通於長度方向(軸線X方向)的軸貫通部13D。在吸附工件W時，軸貫通部13D係用作 空氣流路(參照圖2)。而且，軸貫通部13D係藉活塞部15進行開閉。軸貫通部13D藉活塞部15所封閉時，活塞部15係和軸部13的突緣部13C接觸。本實施形態中，係以活塞部15和軸部13的突緣部13C接觸的部位作為通口A，突緣部13C和導引本體部11B接觸的部位作為通口B來說明。 Such a shaft portion 13 has a shaft penetration portion 13D that penetrates in the longitudinal direction (the axis X direction). When the workpiece W is adsorbed, the shaft penetration portion 13D is used as Air flow path (refer to Figure 2). Further, the shaft penetration portion 13D is opened and closed by the piston portion 15. When the shaft penetration portion 13D is closed by the piston portion 15, the piston portion 15 comes into contact with the flange portion 13C of the shaft portion 13. In the present embodiment, a portion where the piston portion 15 and the flange portion 13C of the shaft portion 13 are in contact with each other is used as the port A, and a portion where the flange portion 13C and the guide body portion 11B are in contact with each other is described as the port B.
再者，突緣部13C具有從上面側(活塞部15側)凹陷的凹入部24。軸貫通部13D則在該凹入部24的內部側形成開口。藉由設置凹入部24，可使軸部13及活塞部15容易安裝於本體部11。另外，也可為不設置凹入部24，使突緣部13C的上面呈平坦面，且形成軸貫通部13D之開口的構成 Further, the flange portion 13C has a recessed portion 24 recessed from the upper surface side (the piston portion 15 side). The shaft penetration portion 13D has an opening formed on the inner side of the recess portion 24. By providing the recessed portion 24, the shaft portion 13 and the piston portion 15 can be easily attached to the main body portion 11. In addition, the recessed portion 24 may be provided, and the upper surface of the flange portion 13C may be a flat surface, and the opening of the shaft through portion 13D may be formed.
再者，吸附用墊10具備軸彈性部14。軸彈性部14係為由例如不銹鋼材構成的線圈狀彈簧，軸部13則插入其中。軸彈性部14係在導引貫通部16D內設於本體部11(導引本體部11B)的保持部11D與軸部13的保持部13B之間。然後，在自由狀態下，軸彈性部14可將前端部13A拉入墊部12內，並保持軸部13(參照圖1)。 Further, the adsorption pad 10 includes a shaft elastic portion 14. The shaft elastic portion 14 is a coil-shaped spring made of, for example, a stainless steel material, and the shaft portion 13 is inserted therein. The shaft elastic portion 14 is provided between the holding portion 11D of the main body portion 11 (the guide main body portion 11B) and the holding portion 13B of the shaft portion 13 in the guide penetration portion 16D. Then, in the free state, the shaft elastic portion 14 can pull the distal end portion 13A into the pad portion 12 and hold the shaft portion 13 (refer to FIG. 1).
本實施形態中，係構成為：軸部13在內部空間16內的行程量x1(參照圖1)大於軸部13的前端部13A向墊部12外突出的最大突出量x2(參照圖5)。此處，行程量x1係為從軸部13的突緣部13C接觸擋止部11F的狀態至軸部13的突緣部13C接觸導引本體部11B(通口B)為止的距離。 In the present embodiment, the stroke amount x1 (see FIG. 1) of the shaft portion 13 in the internal space 16 is larger than the maximum projection amount x2 of the distal end portion 13A of the shaft portion 13 that protrudes outward from the pad portion 12 (see FIG. 5). . Here, the stroke amount x1 is a distance from the state in which the flange portion 13C of the shaft portion 13 contacts the stopper portion 11F to the time when the flange portion 13C of the shaft portion 13 contacts the guide body portion 11B (the port B).
此外，吸附用墊10具備活塞部15。該活塞部15係在內部空間16內設於軸部13與空氣進出部11A之間 。該活塞部15係藉推力而往復移動(上下移動)。具體而言，活塞部15係藉真空空氣而向上方移動，並藉真空破壞空氣而向下方移動。 Further, the adsorption pad 10 is provided with a piston portion 15. The piston portion 15 is disposed between the shaft portion 13 and the air inlet and outlet portion 11A in the internal space 16. . The piston portion 15 reciprocates by the thrust (moving up and down). Specifically, the piston portion 15 is moved upward by the vacuum air, and is moved downward by the vacuum breaking air.
該活塞部15具有：空氣進出部11A側的凹入部15A；及延伸於和凹入部15A的深度方向(軸線X方向)交叉的方向，且和凹入部15A連通(在圖1中顯示軸線Y)的交叉貫通部15B。藉由向吸附用墊10供給的真空破壞空氣，活塞部15及軸部13會被下壓。在該下壓動作中，藉由交叉貫通部15B及空氣流路(形成於軸部13的外周面與內部空間16的內周面之間)，可將真空破壞空氣向墊部12送出。另外，也可在凹入部15A的底部預先設置沿著軸線X方向朝軸部13側貫通的小孔(空氣流量很小)。 The piston portion 15 has a concave portion 15A on the side of the air inlet and outlet portion 11A, and a direction extending in the depth direction (the direction of the axis X) of the concave portion 15A, and communicates with the concave portion 15A (the axis Y is shown in Fig. 1). Cross-through portion 15B. When the air supplied to the adsorption pad 10 breaks the air, the piston portion 15 and the shaft portion 13 are pressed down. In the pressing operation, the vacuum breakage air can be sent to the pad portion 12 by the intersecting penetration portion 15B and the air flow path (formed between the outer circumferential surface of the shaft portion 13 and the inner circumferential surface of the internal space 16). Further, a small hole (air flow rate) penetrating toward the shaft portion 13 side along the axis X direction may be provided in advance at the bottom of the recessed portion 15A.
再者，吸附用墊10具備活塞彈性部25。活塞彈性部25係為由例如不銹鋼材構成的線圈狀彈簧。該活塞彈性部25係以抵接於本體部11的保持部11E(凹入部)、及活塞部15的凹入部15A的方式加以保持(嵌入)。本實施形態中，係使用推力(彈簧負載)小於軸彈性部14的構成作為活塞彈性部25。 Further, the adsorption pad 10 is provided with a piston elastic portion 25. The piston elastic portion 25 is a coil spring made of, for example, a stainless steel material. The piston elastic portion 25 is held (embedded) so as to abut against the holding portion 11E (recessed portion) of the main body portion 11 and the concave portion 15A of the piston portion 15. In the present embodiment, the configuration in which the thrust (spring load) is smaller than the shaft elastic portion 14 is used as the piston elastic portion 25.
接著，說明吸附用墊10的動作方法。自由狀態(沒有空氣進出的狀態)的吸附用墊10，如圖1(對應圖6的位置1)所示，係呈軸部13的前端部13A被拉入墊部12內的狀態。因屬於自由狀態，故真空空氣及真空破壞空氣皆為關斷狀態。而且，工件W也未吸附。此外，通口A為關閉狀態，通口B為開啟狀態。 Next, a method of operating the adsorption pad 10 will be described. As shown in FIG. 1 (corresponding to position 1 in FIG. 6), the adsorption pad 10 in the free state (with no air in and out) is in a state in which the distal end portion 13A of the shaft portion 13 is pulled into the pad portion 12. Because it is in a free state, vacuum air and vacuum destroy air are all off. Moreover, the workpiece W is also not adsorbed. In addition, the port A is in a closed state, and the port B is in an open state.
對於自由狀態的吸附用墊10，若將真空空氣 狀態設成ON狀態(真空破壞空氣為OFF的狀態)，則會形成如圖2(對應圖6的位置2)所示的狀態。具體而言，保持在將前端部13A拉入墊部12內的狀態下，從內部空間16進行真空空氣抽吸。藉此作用，活塞部15會向上移動至接觸擋止部11G，使通口A成為開啟狀態。此時，會從墊部12的前緣12A至軸貫通部13D內、軸部13的外周面與內部空間16的內周面之間(導引貫通部16D及軸室16A)、包含活塞部15內部的活塞室16B、及空氣貫通部16C產生空氣流(真空氣流)。因此，可藉真空空氣在墊部12的前緣12A產生抽吸力。 For the free-state adsorption pad 10, if vacuum air is to be applied When the state is set to the ON state (the state in which the vacuum breakage air is OFF), a state as shown in FIG. 2 (corresponding to position 2 in FIG. 6) is formed. Specifically, vacuum air suction is performed from the internal space 16 while the front end portion 13A is pulled into the pad portion 12 . By this action, the piston portion 15 is moved upward to the contact stopper portion 11G, and the port A is opened. At this time, from the front edge 12A of the pad portion 12 to the inside of the shaft penetration portion 13D, between the outer circumferential surface of the shaft portion 13 and the inner circumferential surface of the internal space 16 (the guide through portion 16D and the shaft chamber 16A), and the piston portion are included. The internal piston chamber 16B and the air passage portion 16C generate an air flow (vacuum flow). Therefore, suction force can be generated at the leading edge 12A of the pad portion 12 by vacuum air.
接著，將真空空氣設成ON狀態而進行真空吸附時，如圖3(對應圖6的位置3)所示，工件W會形成被吸附在被墊部12的前緣12A的狀態。在吸附了工件W後，形成空氣氣流消失的真空狀態，通口A成為關閉狀態。在該狀態中，工件W即可被運送。 Next, when the vacuum air is set to the ON state and the vacuum suction is performed, as shown in FIG. 3 (corresponding to the position 3 in FIG. 6), the workpiece W is in a state of being attracted to the leading edge 12A of the pad portion 12. After the workpiece W is adsorbed, a vacuum state in which the air flow disappears is formed, and the port A is closed. In this state, the workpiece W can be transported.
以此方式，若依據吸附用墊10，即可在保持著將前端部13A拉入墊部12內的狀態下，從內部空間16進行真空空氣抽吸，使工件W吸附在墊部12。因此，在吸附時，軸部13不會和工件W接觸，工件W可受到保護，以減輕對工件W的損傷。 In this manner, according to the adsorption pad 10, vacuum air suction can be performed from the internal space 16 while the tip end portion 13A is pulled into the pad portion 12, and the workpiece W can be adsorbed to the pad portion 12. Therefore, at the time of adsorption, the shaft portion 13 does not come into contact with the workpiece W, and the workpiece W can be protected from damage to the workpiece W.
對於真空狀態的吸附用墊10，將真空破壞空氣設成ON狀態(真空空氣為OFF的狀態)時，則會形成如圖4(對應圖6的位置4)所示的狀態。亦即，若真空破壞空氣被供給時，吸附用墊10的內壓會上升，使真空破壞空氣從墊部12排出。 When the vacuum destruction air is set to the ON state (the vacuum air is OFF) in the suction pad 10 in the vacuum state, the state shown in FIG. 4 (corresponding to the position 4 of FIG. 6) is formed. That is, when the vacuum destruction air is supplied, the internal pressure of the adsorption pad 10 rises, and the vacuum destruction air is discharged from the pad portion 12.
具體而言，真空破壞空氣被供給時，藉著經由活塞部15將軸部13推出的推力，軸部13會往下方側移動。此時，活塞部15會接觸軸部13的突緣部13C，通口A則形成關閉狀態。在軸部13移動期間，真空破壞空氣即在導引貫通部16D的內周面與軸部13的外周面之間(通口B)產生空氣流，使真空破壞空氣從墊部12的前緣12A排出。藉由該真空破壞空氣，可產生工件W從墊部12的前緣12A脫離(未吸附)的動作。另外，藉由軸部13的行程量，可調整真空破壞空氣的排出時間。 Specifically, when the vacuum destruction air is supplied, the shaft portion 13 moves downward by the thrust pushing the shaft portion 13 through the piston portion 15. At this time, the piston portion 15 contacts the flange portion 13C of the shaft portion 13, and the port A is closed. During the movement of the shaft portion 13, the vacuum-damaged air generates a flow of air between the inner peripheral surface of the guide through portion 16D and the outer peripheral surface of the shaft portion 13 (port B), causing the vacuum to break the air from the leading edge of the pad portion 12. 12A is discharged. By the air breaking the air, the action of the workpiece W being detached (not adsorbed) from the leading edge 12A of the pad portion 12 can be generated. Further, the discharge time of the vacuum destruction air can be adjusted by the stroke amount of the shaft portion 13.
使真空破壞空氣從墊部12的前緣12A排出後，仍繼續供給真空破壞空氣，藉由活塞部15(真空破壞空氣)的推壓，使軸部13的前端部13A從墊部12的前緣12A突出。藉此作用，即使為工件W仍黏附在墊部12的前緣12A的情況(特別是工件W為輕量品時較容易發生)，也可藉由軸部13的推出動作使工件W脫離。 After the vacuum destruction air is discharged from the leading edge 12A of the pad portion 12, the vacuum destruction air is continuously supplied, and the front end portion 13A of the shaft portion 13 is pushed from the front of the pad portion 12 by the pressing of the piston portion 15 (vacuum breaking air). Edge 12A stands out. By this action, even if the workpiece W adheres to the leading edge 12A of the pad portion 12 (especially when the workpiece W is lightly sized), the workpiece W can be detached by the pushing operation of the shaft portion 13.
繼續將真空破壞空氣設成ON狀態以進行供給空氣時，即形成為圖5(對應圖6的位置5)所示的狀態。亦即，使軸部13的前端部13A從墊部12突出後，就可使真空破壞空氣停止從墊部12排出。在此處，會形成軸部13的前端部13A完全突出墊部12外的狀態(最大突出量x2)。具體而言，藉由活塞部15的推壓，軸部13的突緣部13C會往下移動直到接觸導引本體部11B，使通口B呈關閉狀態。藉此作用，從墊部12的前緣12A排出的真空破壞空氣就被遮斷，工件W不會被吹走，工件的脫離可以穩定進行。 When the vacuum destruction air is continuously turned ON to supply air, the state shown in FIG. 5 (corresponding to position 5 of FIG. 6) is formed. That is, after the front end portion 13A of the shaft portion 13 is protruded from the pad portion 12, the vacuum destruction air can be stopped from being discharged from the pad portion 12. Here, a state in which the front end portion 13A of the shaft portion 13 completely protrudes outside the pad portion 12 (maximum amount of protrusion x2) is formed. Specifically, by the pressing of the piston portion 15, the flange portion 13C of the shaft portion 13 moves downward until it contacts the guide body portion 11B, so that the port B is closed. By this action, the vacuum breaking air discharged from the leading edge 12A of the pad portion 12 is blocked, the workpiece W is not blown away, and the detachment of the workpiece can be stably performed.
10‧‧‧吸附用墊 10‧‧‧Adsorption pad
11‧‧‧本體部 11‧‧‧ Body Department
11A‧‧‧空氣進出部 11A‧‧‧Air In and Out Department
11B‧‧‧導引本體部 11B‧‧‧Guiding body
11C‧‧‧帽蓋保持部 11C‧‧‧Cap Holder
11D‧‧‧保持部 11D‧‧‧ Keeping Department
11E‧‧‧保持部 11E‧‧‧ Keeping Department
11F、11G‧‧‧擋止部 11F, 11G‧‧‧ stop
12‧‧‧墊部 12‧‧‧ 垫部
12A‧‧‧前緣 12A‧‧‧ leading edge
12B‧‧‧墊貫通部 12B‧‧‧Material penetration
13‧‧‧軸部 13‧‧‧Axis
13A‧‧‧前端部 13A‧‧‧ front end
13B‧‧‧保持部 13B‧‧‧ Keeping Department
13C‧‧‧突緣部 13C‧‧‧Front Department
13D‧‧‧軸貫通部 13D‧‧‧ shaft penetration
14‧‧‧軸彈性部 14‧‧‧Axis Elastic Department
15‧‧‧活塞部 15‧‧‧Piston Department
15A‧‧‧凹入部 15A‧‧‧ recessed part
15B‧‧‧交叉貫通部 15B‧‧‧cross through section
16‧‧‧內部空間 16‧‧‧Internal space
16A‧‧‧軸室 16A‧‧‧Axis room
16B‧‧‧活塞室 16B‧‧‧Piston room
16C‧‧‧空氣貫通部 16C‧‧‧Air penetration
16D‧‧‧導引貫通部 16D‧‧‧Guide through
22、23‧‧‧密封部 22, 23‧‧‧ Sealing Department
24‧‧‧凹入部 24‧‧‧ recessed
25‧‧‧活塞彈性部 25‧‧‧Piston Elastic Department
Claims (6)
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| JP2016043610A JP6325589B2 (en) | 2016-03-07 | 2016-03-07 | Suction pad |
| JP2016-043610 | 2016-03-07 |
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| TW201739681A true TW201739681A (en) | 2017-11-16 |
| TWI705037B TWI705037B (en) | 2020-09-21 |
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| TW106106933A TWI705037B (en) | 2016-03-07 | 2017-03-03 | Adsorption pad |
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| KR (1) | KR102535641B1 (en) |
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| JP2012203304A (en) * | 2011-03-28 | 2012-10-22 | Hitachi High-Technologies Corp | Fpd module assembling device |
| US9346075B2 (en) * | 2011-08-26 | 2016-05-24 | Nordson Corporation | Modular jetting devices |
| CN203702825U (en) * | 2014-01-16 | 2014-07-09 | 奇塑科技（江阴）有限公司 | Suction cup |
| US10040205B2 (en) * | 2014-10-10 | 2018-08-07 | Fuji Machine Mfg. Co., Ltd. | Suction nozzle |
-
2016
- 2016-03-07 JP JP2016043610A patent/JP6325589B2/en active Active
-
2017
- 2017-02-28 KR KR1020170026062A patent/KR102535641B1/en active IP Right Grant
- 2017-03-03 TW TW106106933A patent/TWI705037B/en active
- 2017-03-06 CN CN201710128425.4A patent/CN107165923B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170104379A (en) | 2017-09-15 |
| JP2017159378A (en) | 2017-09-14 |
| CN107165923B (en) | 2020-02-21 |
| CN107165923A (en) | 2017-09-15 |
| JP6325589B2 (en) | 2018-05-16 |
| KR102535641B1 (en) | 2023-05-23 |
| TWI705037B (en) | 2020-09-21 |
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