TW201736887A - 雷射加工裝置 - Google Patents

雷射加工裝置 Download PDF

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Publication number
TW201736887A
TW201736887A TW106101198A TW106101198A TW201736887A TW 201736887 A TW201736887 A TW 201736887A TW 106101198 A TW106101198 A TW 106101198A TW 106101198 A TW106101198 A TW 106101198A TW 201736887 A TW201736887 A TW 201736887A
Authority
TW
Taiwan
Prior art keywords
laser
laser beam
wavelength
emitting
light
Prior art date
Application number
TW106101198A
Other languages
English (en)
Chinese (zh)
Inventor
內田高弘
梁瀨淳
齋藤昌利
室木佑斗
Original Assignee
天田米亞基股份有限公司
天田控股股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 天田米亞基股份有限公司, 天田控股股份有限公司 filed Critical 天田米亞基股份有限公司
Publication of TW201736887A publication Critical patent/TW201736887A/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Laser Beam Processing (AREA)
TW106101198A 2016-01-14 2017-01-13 雷射加工裝置 TW201736887A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016005027 2016-01-14

Publications (1)

Publication Number Publication Date
TW201736887A true TW201736887A (zh) 2017-10-16

Family

ID=59311017

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106101198A TW201736887A (zh) 2016-01-14 2017-01-13 雷射加工裝置

Country Status (3)

Country Link
JP (1) JP6522166B2 (ja)
TW (1) TW201736887A (ja)
WO (1) WO2017122611A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI766642B (zh) * 2020-04-23 2022-06-01 南韓商普羅科技有限公司 使用垂直腔表面發射雷射器元件的倒裝晶片接合裝置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021118271A (ja) * 2020-01-27 2021-08-10 パナソニックＩｐマネジメント株式会社 レーザ発振器及びレーザ加工方法
JPWO2021172350A1 (ja) * 2020-02-26 2021-09-02
WO2023144995A1 (ja) * 2022-01-28 2023-08-03 三菱電機株式会社 レーザ装置およびレーザ加工機
CN115740746A (zh) * 2022-11-25 2023-03-07 深圳市鑫宸锐智能科技有限公司 一种vcsel激光焊接设备及焊接方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001119101A (ja) * 1999-10-20 2001-04-27 Mitsubishi Electric Corp レーザ装置及びそれを用いたレーザ加工装置
JP2002026452A (ja) * 2000-07-12 2002-01-25 Toyota Central Res & Dev Lab Inc 面発光型光源及びその製造方法、レーザ加工機用光源
US7006549B2 (en) * 2003-06-11 2006-02-28 Coherent, Inc. Apparatus for reducing spacing of beams delivered by stacked diode-laser bars
JP2006343712A (ja) * 2005-05-12 2006-12-21 Seiko Epson Corp 光源装置、走査型表示装置、プロジェクタ
DE102006010728A1 (de) * 2005-12-05 2007-06-06 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Laservorrichtung
JP2009094186A (ja) * 2007-10-05 2009-04-30 Seiko Epson Corp 光源装置、照明装置、モニタ装置及び画像表示装置
JP2009152524A (ja) * 2007-11-27 2009-07-09 Seiko Epson Corp 光源装置、照明装置、モニタ装置及び画像表示装置
CN107085288B (zh) * 2008-05-08 2020-03-24 贰陆激光企业有限责任公司 高亮度二极管输出方法和装置
JP2015115377A (ja) * 2013-12-10 2015-06-22 株式会社リコー 化合物半導体デバイス、光源装置、レーザ装置及び化合物半導体デバイスの製造方法
JP2015191977A (ja) * 2014-03-27 2015-11-02 ウシオ電機株式会社 半導体レーザ装置及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI766642B (zh) * 2020-04-23 2022-06-01 南韓商普羅科技有限公司 使用垂直腔表面發射雷射器元件的倒裝晶片接合裝置
TWI811939B (zh) * 2020-04-23 2023-08-11 南韓商普羅科技有限公司 使用垂直腔表面發射雷射器元件的倒裝晶片接合裝置
TWI811938B (zh) * 2020-04-23 2023-08-11 南韓商普羅科技有限公司 使用垂直腔表面發射雷射器元件的倒裝晶片接合裝置
US11810890B2 (en) 2020-04-23 2023-11-07 Protec Co., Ltd. Flip-chip bonding apparatus using VCSEL device

Also Published As

Publication number Publication date
WO2017122611A1 (ja) 2017-07-20
JP6522166B2 (ja) 2019-05-29
JPWO2017122611A1 (ja) 2018-08-09

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