TW201736887A - 雷射加工裝置 - Google Patents
雷射加工裝置 Download PDFInfo
- Publication number
- TW201736887A TW201736887A TW106101198A TW106101198A TW201736887A TW 201736887 A TW201736887 A TW 201736887A TW 106101198 A TW106101198 A TW 106101198A TW 106101198 A TW106101198 A TW 106101198A TW 201736887 A TW201736887 A TW 201736887A
- Authority
- TW
- Taiwan
- Prior art keywords
- laser
- laser beam
- wavelength
- emitting
- light
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016005027 | 2016-01-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201736887A true TW201736887A (zh) | 2017-10-16 |
Family
ID=59311017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106101198A TW201736887A (zh) | 2016-01-14 | 2017-01-13 | 雷射加工裝置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6522166B2 (ja) |
TW (1) | TW201736887A (ja) |
WO (1) | WO2017122611A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI766642B (zh) * | 2020-04-23 | 2022-06-01 | 南韓商普羅科技有限公司 | 使用垂直腔表面發射雷射器元件的倒裝晶片接合裝置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021118271A (ja) * | 2020-01-27 | 2021-08-10 | パナソニックIpマネジメント株式会社 | レーザ発振器及びレーザ加工方法 |
JPWO2021172350A1 (ja) * | 2020-02-26 | 2021-09-02 | ||
WO2023144995A1 (ja) * | 2022-01-28 | 2023-08-03 | 三菱電機株式会社 | レーザ装置およびレーザ加工機 |
CN115740746A (zh) * | 2022-11-25 | 2023-03-07 | 深圳市鑫宸锐智能科技有限公司 | 一种vcsel激光焊接设备及焊接方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001119101A (ja) * | 1999-10-20 | 2001-04-27 | Mitsubishi Electric Corp | レーザ装置及びそれを用いたレーザ加工装置 |
JP2002026452A (ja) * | 2000-07-12 | 2002-01-25 | Toyota Central Res & Dev Lab Inc | 面発光型光源及びその製造方法、レーザ加工機用光源 |
US7006549B2 (en) * | 2003-06-11 | 2006-02-28 | Coherent, Inc. | Apparatus for reducing spacing of beams delivered by stacked diode-laser bars |
JP2006343712A (ja) * | 2005-05-12 | 2006-12-21 | Seiko Epson Corp | 光源装置、走査型表示装置、プロジェクタ |
DE102006010728A1 (de) * | 2005-12-05 | 2007-06-06 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement und Laservorrichtung |
JP2009094186A (ja) * | 2007-10-05 | 2009-04-30 | Seiko Epson Corp | 光源装置、照明装置、モニタ装置及び画像表示装置 |
JP2009152524A (ja) * | 2007-11-27 | 2009-07-09 | Seiko Epson Corp | 光源装置、照明装置、モニタ装置及び画像表示装置 |
CN107085288B (zh) * | 2008-05-08 | 2020-03-24 | 贰陆激光企业有限责任公司 | 高亮度二极管输出方法和装置 |
JP2015115377A (ja) * | 2013-12-10 | 2015-06-22 | 株式会社リコー | 化合物半導体デバイス、光源装置、レーザ装置及び化合物半導体デバイスの製造方法 |
JP2015191977A (ja) * | 2014-03-27 | 2015-11-02 | ウシオ電機株式会社 | 半導体レーザ装置及びその製造方法 |
-
2017
- 2017-01-10 WO PCT/JP2017/000414 patent/WO2017122611A1/ja active Application Filing
- 2017-01-10 JP JP2017561608A patent/JP6522166B2/ja active Active
- 2017-01-13 TW TW106101198A patent/TW201736887A/zh unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI766642B (zh) * | 2020-04-23 | 2022-06-01 | 南韓商普羅科技有限公司 | 使用垂直腔表面發射雷射器元件的倒裝晶片接合裝置 |
TWI811939B (zh) * | 2020-04-23 | 2023-08-11 | 南韓商普羅科技有限公司 | 使用垂直腔表面發射雷射器元件的倒裝晶片接合裝置 |
TWI811938B (zh) * | 2020-04-23 | 2023-08-11 | 南韓商普羅科技有限公司 | 使用垂直腔表面發射雷射器元件的倒裝晶片接合裝置 |
US11810890B2 (en) | 2020-04-23 | 2023-11-07 | Protec Co., Ltd. | Flip-chip bonding apparatus using VCSEL device |
Also Published As
Publication number | Publication date |
---|---|
WO2017122611A1 (ja) | 2017-07-20 |
JP6522166B2 (ja) | 2019-05-29 |
JPWO2017122611A1 (ja) | 2018-08-09 |
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