TW201736514A - 硬化性樹脂組成物、硬化物、封裝材料、及半導體裝置 - Google Patents
硬化性樹脂組成物、硬化物、封裝材料、及半導體裝置 Download PDFInfo
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- TW201736514A TW201736514A TW106101111A TW106101111A TW201736514A TW 201736514 A TW201736514 A TW 201736514A TW 106101111 A TW106101111 A TW 106101111A TW 106101111 A TW106101111 A TW 106101111A TW 201736514 A TW201736514 A TW 201736514A
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- NRZWQKGABZFFKE-UHFFFAOYSA-N trimethylsulfonium Chemical group C[S+](C)C NRZWQKGABZFFKE-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016006661 | 2016-01-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201736514A true TW201736514A (zh) | 2017-10-16 |
Family
ID=59311816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106101111A TW201736514A (zh) | 2016-01-15 | 2017-01-13 | 硬化性樹脂組成物、硬化物、封裝材料、及半導體裝置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2017122712A1 (fr) |
| TW (1) | TW201736514A (fr) |
| WO (1) | WO2017122712A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018118356A1 (fr) * | 2016-12-20 | 2018-06-28 | Dow Silicones Corporation | Composition de silicone durcissable |
| JP7021049B2 (ja) * | 2018-10-30 | 2022-02-16 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物、その硬化物、及び光半導体装置 |
| KR102186929B1 (ko) * | 2018-12-18 | 2020-12-04 | 주식회사 엠알케이 | 고점착, 광확산 기능과 다양한 양면 이형 점착력을 가진 기능성 실리콘 점착제 및 이를 이용한 필름 |
| JP7301018B2 (ja) * | 2020-04-14 | 2023-06-30 | 信越化学工業株式会社 | シリル化イソシアヌレート化合物の混合物及び金属腐食防止剤 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5188928B2 (ja) * | 2008-10-24 | 2013-04-24 | 株式会社Ａｄｅｋａ | ケイ素含有硬化性組成物 |
| JP6300218B2 (ja) * | 2010-12-31 | 2018-03-28 | サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. | 封止材用透光性樹脂組成物、該透光性樹脂を含む封止材および電子素子 |
| JP5965195B2 (ja) * | 2012-04-11 | 2016-08-03 | 株式会社カネカ | ポリシロキサン系組成物 |
| JP5778875B2 (ja) * | 2013-01-09 | 2015-09-16 | 株式会社ダイセル | 硬化性樹脂組成物及びその硬化物 |
| WO2014125964A1 (fr) * | 2013-02-14 | 2014-08-21 | 株式会社ダイセル | Composition de résine durcissable, produit durci, dispositif semi-conducteur à élément d'étanchéité |
| JP6474801B2 (ja) * | 2014-06-06 | 2019-02-27 | 株式会社ダイセル | 硬化性樹脂組成物、硬化物、封止材、及び半導体装置 |
-
2017
- 2017-01-12 JP JP2017561150A patent/JPWO2017122712A1/ja active Pending
- 2017-01-12 WO PCT/JP2017/000746 patent/WO2017122712A1/fr active Application Filing
- 2017-01-13 TW TW106101111A patent/TW201736514A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2017122712A1 (ja) | 2018-11-01 |
| WO2017122712A1 (fr) | 2017-07-20 |
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