TW201713444A - Laser processing device capable of performing accurate curve processing even in a case of increasing the processing feed speed to perform the curved processing - Google Patents
Laser processing device capable of performing accurate curve processing even in a case of increasing the processing feed speed to perform the curved processing Download PDFInfo
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- TW201713444A TW201713444A TW105124800A TW105124800A TW201713444A TW 201713444 A TW201713444 A TW 201713444A TW 105124800 A TW105124800 A TW 105124800A TW 105124800 A TW105124800 A TW 105124800A TW 201713444 A TW201713444 A TW 201713444A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
Description
本發明是有關於對玻璃基板或半導體晶圓等之被加工物照射雷射光線並施行曲線加工之雷射加工裝置。 The present invention relates to a laser processing apparatus that irradiates a workpiece such as a glass substrate or a semiconductor wafer with laser light and performs curve processing.
在被分割預定線所劃分的表面上形成有IC、LSI等器件之晶圓是藉由切割裝置、雷射加工裝置而被分割為一個個的器件且利用於行動電話、個人電腦等電氣機器上。 A wafer in which a device such as an IC or an LSI is formed on a surface divided by a predetermined line to be divided is a device that is divided into individual devices by a cutting device or a laser processing device, and is used in an electric device such as a mobile phone or a personal computer. .
雷射加工裝置至少是由保持被加工物之保持設備、包含對保持在該保持設備上之被加工物照射雷射光線之聚光器的雷射光線照射設備、將該保持設備於X軸方向、Y軸方向上加工進給之加工進給設備、及控制設備所構成，而可以對被加工物施行高精度的加工。又，已知的是，與具備有以直線性為必要之切削刀之切割裝置不同，雷射加工裝置可進行曲線加工，而可以對例如半導體晶圓或玻璃基板以包含曲線之形狀之方式施行切斷加工(例如參照專利文獻1)。 The laser processing apparatus is at least a laser beam illuminating device including a holding device for holding a workpiece, and a concentrator including a laser beam for irradiating a workpiece to be held on the holding device, and the holding device is oriented in the X-axis direction The machining feed device and the control device are processed in the Y-axis direction, and the workpiece can be processed with high precision. Further, it is known that, unlike a cutting device having a cutting blade that is linear in necessity, the laser processing device can perform curve processing, and can be performed, for example, on a semiconductor wafer or a glass substrate in a shape including a curve. Cutting processing (for example, refer to Patent Document 1).
專利文獻1：日本專利特開2008-062289號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2008-062289
於是，在對被加工物施行曲線加工時，雖然在減慢上述加工進給設備之加工進給速度，花費時間慢慢地加工之情況下，可加工為期望之曲線，但當為了提升加工效率，而提升加工進給速度並依照已儲存於控制設備之目標軌道座標來將保持設備於X軸方向、Y軸方向上加工進給並施行曲線加工時，會產生下列的問題：由於該保持設備與被加工物的慣性力而使該雷射光線的聚光點偏離欲加工之曲線座標，並使其無法施行正確的曲線加工。 Therefore, when the machining of the workpiece is performed, although the machining feed rate of the machining feed device is slowed down and it takes time to process slowly, it can be processed into a desired curve, but in order to improve the machining efficiency. When the machining feed speed is increased and the holding device is machined in the X-axis direction and the Y-axis direction and subjected to curve processing in accordance with the target track coordinates already stored in the control device, the following problems occur: due to the holding device The convergence point of the laser light is offset from the coordinate of the workpiece to be processed, and the correct curve processing cannot be performed.
本發明是有鑑於上述事實而作成的發明，其主要的技術課題在於提供一種雷射加工裝置，其在對被加工物施行曲線加工之雷射加工裝置中，即便在提升加工進給速度來進行曲線加工之情況下，亦可以進行正確的曲線加工。 The present invention has been made in view of the above-described circumstances, and a main technical object thereof is to provide a laser processing apparatus that performs a process of performing a curve processing on a workpiece, even if the machining feed speed is increased. In the case of curve machining, correct curve machining is also possible.
為解決上述主體技術課題，依據本發明可提供一種雷射加工裝置，該雷射加工裝置至少是由以下所構成：保持被加工物之保持設備、具備有對保持在該保持設備之被加工物聚光雷射光線之聚光器的雷射光線照射設備、將該保持設備加工進給之加工進給設備、及控制設備， 該加工進給設備是由以下所構成：X軸方向移動設備，依據控制軌道座標將該保持設備於X軸方向上加工進給；及Y軸方向移動設備，於與X軸正交之Y軸方向上將該保持設備加工進給，該控制設備具備：目標軌道座標儲存部，將用於使雷射光線的聚光點沿被加工物的加工預定線移動之保持設備實際上應移動的目標軌道座標，以X座標、Y座標來儲存；軌跡座標儲存部，依據該控制軌道座標作動該X軸方向移動設備、及Y軸方向移動設備，並將該保持設備實際上已移動之軌跡座標以X座標、Y座標來儲存；及控制軌道座標修正設備，比較該目標軌道座標與該軌跡座標，並將該控制軌道座標修正成使該軌跡座標與該目標軌道座標一致。 In order to solve the above-mentioned main technical problem, according to the present invention, a laser processing apparatus can be provided, which is at least constituted by a holding device for holding a workpiece, and a workpiece to be held by the holding device. a laser beam illuminating device for concentrating a laser beam concentrator, a processing feed device for processing the holding device, and a control device, The machining feed device is composed of: an X-axis direction moving device that feeds the holding device in the X-axis direction according to the control track coordinates; and a Y-axis direction moving device in the Y-axis orthogonal to the X-axis The holding device is processed in the direction, and the control device includes: a target orbit coordinate storage portion that moves the condensing point of the laser ray along the planned processing line of the workpiece to actually move the target The track coordinates are stored by the X coordinate and the Y coordinate; the track coordinate storage unit activates the X-axis direction mobile device and the Y-axis direction mobile device according to the control track coordinate, and coordinates the track position of the holding device actually moved. The X coordinate and the Y coordinate are stored; and the control track coordinate correction device compares the target track coordinate with the track coordinate and corrects the control track coordinate such that the track coordinate is consistent with the target track coordinate.
較理想的是，該控制設備會將由該控制軌道座標修正設備所修正之控制軌道座標儲存於控制軌道座標儲存部，並依據已修正之該控制軌道座標來作動該X軸方向移動設備、及該Y軸方向移動設備，且對保持在該保持設備之被加工物施行雷射加工。 Preferably, the control device stores the control track coordinates corrected by the control track coordinate correction device in the control track coordinate storage portion, and activates the X-axis direction mobile device according to the modified control track coordinates, and The device is moved in the Y-axis direction, and laser processing is performed on the workpiece held in the holding device.
又，較理想的是，該控制設備是依據該控制軌道座標來使該X軸方向移動設備及該Y軸方向移動設備作動，並實施該軌跡座標與該目標軌道座標是否一致的確認動作，該確認動作的結果，若是在視為兩者為一致的容許範圍內， 即結束對於儲存在該控制軌道座標儲存部的控制軌道座標之修正，當不在容許範圍內的情況下，會進一步將該控制軌道座標修正成使該軌跡座標與該目標軌道座標朝一致之方向，並反覆進行該確認動作。 Moreover, preferably, the control device activates the X-axis direction moving device and the Y-axis direction moving device according to the control track coordinates, and performs a confirmation operation of whether the track coordinates and the target track coordinates match. Confirm the result of the action, if it is within the allowable range that is considered to be the same, That is, the correction of the control track coordinates stored in the control track coordinate storage portion is ended. When the control track coordinates are not within the allowable range, the control track coordinates are further corrected such that the track coordinates are aligned with the target track coordinates. This confirmation action is repeated.
依據本發明之雷射加工裝置，因為該控制設備具備：將用於使雷射光線的聚光點沿被加工物的加工預定線移動之保持設備於實施上應移動的目標軌道座標，以X座標、Y座標來儲存之目標軌道座標儲存部；依據該控制軌道座標作動該X軸方向移動設備、及Y軸方向移動設備，並將該保持設備實際上已移動之軌跡座標以X座標及Y座標來儲存之軌跡座標儲存部；以及比較該目標軌道座標及該軌跡座標，並將該控制軌道座標修正成使該軌跡座標與該目標軌道座標一致的控制軌道座標修正設備，所以即便將加工進給速度設定得較高，亦不會有因保持設備及被加工物的慣性力的影響，使雷射光線的聚光點偏離設計上的加工預定線之情形，而變得可施行正確的曲線加工。 According to the laser processing apparatus of the present invention, the control apparatus is provided with a target track coordinate to be moved by the holding device for moving the light collecting point of the laser light along the planned processing line of the workpiece, to X a target orbit coordinate storage unit for storing the coordinates and the Y coordinate; the X-axis direction moving device and the Y-axis direction moving device are activated according to the control track coordinates, and the track coordinates of the holding device actually moved are X coordinates and Y a coordinate coordinate storage portion stored in coordinates; and comparing the target track coordinates and the track coordinates, and correcting the control track coordinates to a control track coordinate correction device that matches the track coordinates with the target track coordinates, so even if processing is performed The speed is set higher, and there is no possibility that the spotlight of the laser light is deviated from the planned processing line due to the influence of the inertial force of the device and the workpiece, and the correct curve can be implemented. machining.
1‧‧‧雷射加工裝置 1‧‧‧ Laser processing equipment
2‧‧‧靜止基台 2‧‧‧Standing abutment
3‧‧‧工作夾台機構 3‧‧‧Working table mechanism
4‧‧‧雷射光線照射單元 4‧‧‧Laser light irradiation unit
5‧‧‧雷射光線照射設備 5‧‧‧Laser light irradiation equipment
6‧‧‧攝像設備 6‧‧‧Photography equipment
8‧‧‧控制設備 8‧‧‧Control equipment
10‧‧‧玻璃基板 10‧‧‧ glass substrate
10a‧‧‧表面 10a‧‧‧ surface
31、322‧‧‧導軌 31, 322‧‧‧ rails
32‧‧‧第1滑塊 32‧‧‧1st slider
33‧‧‧第2滑塊 33‧‧‧2nd slider
34‧‧‧圓筒構件 34‧‧‧Cylinder components
35‧‧‧罩台 35‧‧‧ Cover
36‧‧‧工作夾台 36‧‧‧Working table
37‧‧‧X軸方向移動設備 37‧‧‧X-axis mobile device
38‧‧‧Y軸方向移動設備 38‧‧‧Y-axis mobile device
41‧‧‧支撐構件 41‧‧‧Support members
42‧‧‧套殼 42‧‧‧shells
51‧‧‧脈衝雷射光線振盪設備 51‧‧‧Pulse laser ray oscillating equipment
52‧‧‧輸出調整設備 52‧‧‧Output adjustment equipment
53‧‧‧聚光器 53‧‧‧ concentrator
81‧‧‧中央處理裝置(CPU) 81‧‧‧Central Processing Unit (CPU)
82‧‧‧唯讀記憶體(ROM) 82‧‧‧Read-only memory (ROM)
83‧‧‧隨機存取記憶體(RAM) 83‧‧‧ Random Access Memory (RAM)
83a、83b、83c‧‧‧儲存區域 83a, 83b, 83c‧‧‧ storage area
84‧‧‧輸入介面 84‧‧‧Input interface
85‧‧‧輸出介面 85‧‧‧Output interface
100‧‧‧加工預定線 100‧‧‧Processing line
101‧‧‧目標軌道線 101‧‧‧target track line
102‧‧‧軌跡線 102‧‧‧Track line
103‧‧‧控制軌道線 103‧‧‧Control track line
321、331‧‧‧被引導溝 321,331‧‧‧guided ditch
361‧‧‧吸附夾頭 361‧‧‧Adsorption chuck
362‧‧‧夾具 362‧‧‧ fixture
371、381‧‧‧公螺桿 371, 381‧‧‧ male screw
372、382‧‧‧脈衝馬達 372, 382‧‧ ‧ pulse motor
374‧‧‧X軸方向位置檢測設備 374‧‧‧X-axis direction position detecting equipment
374a、384a‧‧‧線性尺規 374a, 384a‧‧‧linear ruler
374b、384b‧‧‧讀取頭 374b, 384b‧‧‧ read head
383‧‧‧軸承塊 383‧‧‧ bearing block
384‧‧‧Y軸方向位置檢測設備 384‧‧‧Y-axis direction position detecting device
531‧‧‧方向變換鏡 531‧‧‧ Directional change mirror
532‧‧‧聚光透鏡 532‧‧‧ Concentrating lens
F‧‧‧環狀框架 F‧‧‧Ring frame
LB‧‧‧脈衝雷射光線 LB‧‧‧pulse laser light
T‧‧‧保護膠帶 T‧‧‧Protection tape
P1、P2、P3‧‧‧點 P1, P2, P3‧‧ points
圖1是本發明之雷射加工裝置的立體圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a laser processing apparatus of the present invention.
圖2是裝備在圖1所示之雷射加工裝置上的雷射光線照射設備之方塊構成圖。 Figure 2 is a block diagram of a laser beam illumination apparatus equipped with the laser processing apparatus shown in Figure 1.
圖3是裝備於圖1所示之雷射加工裝置上的控制設備之方塊構成圖。 Figure 3 is a block diagram of a control device equipped on the laser processing apparatus shown in Figure 1.
圖4是顯示藉由圖1所示之雷射加工裝置而實施之雷射 加工狀態的說明圖。 Figure 4 is a view showing a laser implemented by the laser processing apparatus shown in Figure 1. Description of the processing status.
圖5是顯示儲存於圖3所示之控制設備之工作夾台的目標軌道座標之圖。 Figure 5 is a diagram showing the target track coordinates of the work chuck stored in the control device shown in Figure 3.
圖6是顯示藉由圖3所示之控制設備實際上使工作夾台移動的軌跡的軌跡座標之圖。 Figure 6 is a diagram showing the trajectory coordinates of a trajectory in which the control gantry is actually moved by the control device shown in Figure 3.
圖7是顯示將已儲存於圖3所示之控制設備的控制軌道座標，藉由目標軌道座標及軌跡座標來作修正的說明圖。 Fig. 7 is an explanatory view showing the control track coordinates which have been stored in the control device shown in Fig. 3, corrected by the target track coordinates and the track coordinates.
以下，關於本發明之雷射加工裝置之較佳的實施形態，參照附加圖式並進一步詳細地說明。 Hereinafter, preferred embodiments of the laser processing apparatus of the present invention will be described in further detail with reference to the accompanying drawings.
圖1中所示為本發明之雷射加工裝置的立體圖。圖1所示之雷射加工裝置1具備有靜止基台2、配置成可在該靜止基台2上於箭頭X所示之X軸方向上移動並保持被加工物的工作夾台機構3、及配置在靜止基台2上之雷射光線照射單元4。 A perspective view of the laser processing apparatus of the present invention is shown in FIG. The laser processing apparatus 1 shown in FIG. 1 is provided with a stationary base 2, a work clamping mechanism 3 that is arranged to move on the stationary base 2 in the X-axis direction indicated by an arrow X, and to hold a workpiece. And a laser beam irradiation unit 4 disposed on the stationary base 2.
上述工作夾台機構3具備有在靜止基台2上沿著X軸方向平行地配置的一對導軌31、31、在該導軌31、31上配置成可在X軸方向上移動之第1滑塊32、在該第1滑塊32上配置成可在與X軸方向正交之以箭頭Y表示之Y軸方向上移動的第2滑塊33、在該第2滑塊33上藉由圓筒構件34而受到支撐的罩台35、以及作為保持被加工物之保持設備的工作夾台36。此工作夾台36具備有由具有通氣性之多孔性材料所形成的吸附夾頭361，並形成為藉由作動圖未示之吸引 設備來將被加工物保持在為吸附夾頭361之上表面的保持面上。如此所構成的工作夾台36是藉由配置於圓筒構件34內的圖未示的脈衝馬達來使其旋轉。再者，在工作夾台36上配置有用於固定透過保護膠帶來支撐被加工物之環狀框架的夾具362。 The above-described work clamping mechanism 3 includes a pair of guide rails 31 and 31 which are arranged in parallel along the X-axis direction on the stationary base 2, and a first slide which is disposed on the guide rails 31 and 31 so as to be movable in the X-axis direction. The block 32 is disposed on the first slider 32 so as to be movable in the Y-axis direction indicated by the arrow Y orthogonal to the X-axis direction, and by the circle on the second slider 33 A cover table 35 that is supported by the tubular member 34, and a work chuck 36 that serves as a holding device for holding the workpiece. The working chuck 36 is provided with an adsorption chuck 361 formed of a porous material having air permeability, and is formed to be attracted by an actuating diagram. The apparatus holds the workpiece on the holding surface which is the upper surface of the chuck 361. The working chuck 36 configured as described above is rotated by a pulse motor (not shown) disposed in the cylindrical member 34. Further, a clamp 362 for fixing an annular frame that transmits the protective material to support the workpiece is disposed on the work chuck 36.
上述第1滑塊32，於下表面設有與上述一對導軌31、31嵌合的一對被導引溝321、321，並且設置有於上表面沿Y軸方向平行地形成的一對導軌322、322。如此所構成的第1滑塊32是藉由將被導引溝321、321嵌合在一對導軌31、31上，而構成為可沿一對導軌31、31在X軸方向上移動。圖示之工作夾台機構3具備有用於使第1滑塊32沿著一對導軌31、31在X軸方向上移動之X軸方向移動設備37。X軸方向移動設備37是被在上述一對導軌31與31之間平行地配置的公螺桿371、與用於旋轉驅動該公螺桿371之脈衝馬達372的輸出軸所傳動連結。再者，是將公螺桿371螺合在突出於第1滑塊32之中央部下表面而設置之圖未示的公螺塊上所形成之貫通母螺孔中。因此，藉由以脈衝馬達372將公螺桿371正轉及逆轉驅動，可使第1滑塊32沿導軌31、31在X軸方向上移動。 The first slider 32 is provided with a pair of guided grooves 321 and 321 that are fitted to the pair of guide rails 31 and 31 on the lower surface, and a pair of guide rails that are formed in parallel on the upper surface in the Y-axis direction. 322, 322. The first slider 32 configured as described above is configured to be fitted to the pair of guide rails 31 and 31 by the guided grooves 321 and 321 so as to be movable in the X-axis direction along the pair of guide rails 31 and 31. The work clamping mechanism 3 shown in the drawing includes an X-axis direction moving device 37 for moving the first slider 32 along the pair of rails 31 and 31 in the X-axis direction. The X-axis direction moving device 37 is connected to the output shaft of the pulse motor 372 for rotationally driving the male screw 371 by a male screw 371 disposed in parallel between the pair of guide rails 31 and 31. Further, the male screw 371 is screwed into the through female screw hole formed in the male screw (not shown) which is provided on the lower surface of the central portion of the first slider 32. Therefore, the first slider 32 can be moved in the X-axis direction along the guide rails 31 and 31 by the forward rotation and the reverse rotation of the male screw 371 by the pulse motor 372.
圖示之雷射加工裝置1具備有用於檢測上述工作夾台36之X軸方向位置的X軸方向位置檢測設備374。X軸方向位置檢測設備374是由沿著導軌31配置之線性尺規374a、和配置於第1滑塊32上並且與第1滑塊32一起沿線性尺規374a移動之讀取頭374b所構成。此X軸方向位置檢測設備 374的讀取頭374b是例如每1μm將1個脈衝的脈衝訊號傳送至後述之控制設備。然後，後述之控制設備會藉由計算輸入之脈衝訊號來檢測工作夾台36之X軸方向位置。再者，在上述X軸方向移動設備37之使用了脈衝馬達372作為驅動源的情況中，也可以藉由計算對脈衝馬達372輸出驅動訊號之後述的控制設備的驅動脈衝，來檢測工作夾台36之X軸方向的位置。又，在上述X軸方向移動設備37之使用了伺服馬達作為驅動源的情況中，也可以藉由將檢測伺服馬達之旋轉數的旋轉編碼器輸出之脈衝訊號傳送到後述之控制設備，並使控制設備計算所輸入之脈衝訊號，來檢測工作夾台36之X軸方向位置。 The laser processing apparatus 1 shown in the drawing includes an X-axis direction position detecting device 374 for detecting the position of the working chuck 36 in the X-axis direction. The X-axis direction position detecting device 374 is composed of a linear ruler 374a disposed along the guide rail 31, and a reading head 374b disposed on the first slider 32 and moving along the linear ruler 374a together with the first slider 32. . This X-axis direction position detecting device The read head 374b of the 374 transmits, for example, a pulse signal of one pulse per 1 μm to a control device to be described later. Then, the control device described later detects the position of the working chuck 36 in the X-axis direction by calculating the input pulse signal. Further, in the case where the pulse motor 372 is used as the drive source in the X-axis direction moving device 37, the operation clamp can be detected by calculating the drive pulse of the control device, which will be described later, by outputting the drive signal to the pulse motor 372. The position of the X-axis direction of 36. Further, in the case where the servo motor is used as the drive source in the X-axis direction moving device 37, the pulse signal output from the rotary encoder that detects the number of rotations of the servo motor may be transmitted to a control device to be described later. The control device calculates the input pulse signal to detect the position of the working chuck 36 in the X-axis direction.
上述第2滑塊33，於下表面設置有可與設置於上述第1滑塊32之上表面的一對導軌322、322嵌合的一對被導引溝331、331，並藉由將此被引導溝331、331嵌合於一對導軌322、322，而構成為可在Y軸方向上移動。圖示之工作夾台機構3具備有用來使第2滑塊33沿著設置在第1滑塊32上的一對導軌322、322在Y軸方向上移動的Y軸方向移動設備38。Y軸方向移動設備38包含有在上述一對導軌322和322之間平行地配置的公螺桿381、和用於旋轉驅動該公螺桿381之脈衝馬達382等驅動源。該公螺桿381為一端受到固定於上述第1滑塊32的上表面之軸承塊383旋轉自如地支撐，另一端被上述脈衝馬達382的輸出軸傳動連結。再者，是將公螺桿381螺合在突出於第2滑塊33之中央部下表面而設置之圖未示的公螺塊上所形成之貫通母螺孔中。因此，藉由 以脈衝馬達382將公螺桿381正轉及逆轉驅動，可使第2滑塊33沿導軌322、322在Y軸方向上移動。 The second slider 33 is provided with a pair of guided grooves 331 and 331 which are engageable with a pair of guide rails 322 and 322 provided on the upper surface of the first slider 32 on the lower surface, and The guided grooves 331 and 331 are fitted to the pair of guide rails 322 and 322, and are configured to be movable in the Y-axis direction. The work clamping mechanism 3 shown in the drawing includes a Y-axis direction moving device 38 for moving the second slider 33 along the pair of guide rails 322 and 322 provided on the first slider 32 in the Y-axis direction. The Y-axis direction moving device 38 includes a male screw 381 disposed in parallel between the pair of guide rails 322 and 322, and a drive source such as a pulse motor 382 for rotationally driving the male screw 381. The male screw 381 is rotatably supported by a bearing block 383 whose one end is fixed to the upper surface of the first slider 32, and the other end of which is driven and coupled by an output shaft of the pulse motor 382. Further, the male screw 381 is screwed into the through female screw hole formed in the male screw (not shown) which is provided on the lower surface of the central portion of the second slider 33. Therefore, by The male screw 381 is rotated forward and reverse by the pulse motor 382, and the second slider 33 can be moved in the Y-axis direction along the guide rails 322 and 322.
圖示之雷射加工裝置1具備有用於檢測上述第2滑塊33之Y軸方向位置的Y軸方向位置檢測設備384。Y軸方向位置檢測設備384是由沿著導軌322配置之線性尺規384a、和配置於第2滑塊33上並且與第2滑塊33一起沿線性尺規384a移動之讀取頭384b所構成。此Y軸方向位置檢測設備384的讀取頭384b是例如每1μm將1個脈衝的脈衝訊號傳送至後述之控制設備。然後，後述之控制設備會藉由計算輸入之脈衝訊號來檢測第2滑塊33之Y軸方向位置。再者，在上述Y軸方向移動設備38之使用了脈衝馬達382作為驅動源的情況下，也可以藉由計算對脈衝馬達382輸出驅動訊號之後述的控制設備的驅動脈衝，來檢測第2滑塊33之Y軸方向的位置。又，在上述Y軸方向移動設備38之使用了伺服馬達作為驅動源的情況下，也可以藉由將檢測伺服馬達之旋轉數的旋轉編碼器輸出之脈衝訊號傳送到後述之控制設備，並使控制設備計算所輸入之脈衝訊號，來檢測第2滑塊33之Y軸方向位置。 The laser processing apparatus 1 shown in the drawing includes a Y-axis direction position detecting device 384 for detecting the position of the second slider 33 in the Y-axis direction. The Y-axis direction position detecting device 384 is composed of a linear ruler 384a disposed along the guide rail 322, and a reading head 384b disposed on the second slider 33 and moving along the linear ruler 384a together with the second slider 33. . The read head 384b of the Y-axis direction position detecting device 384 transmits, for example, a pulse signal of one pulse per 1 μm to a control device to be described later. Then, the control device described later detects the position of the second slider 33 in the Y-axis direction by calculating the input pulse signal. Further, when the pulse motor 382 is used as the drive source in the Y-axis direction moving device 38, the second slip can be detected by calculating the drive pulse of the control device to be output to the pulse motor 382, which will be described later. The position of the block 33 in the Y-axis direction. Further, when the servo motor is used as the drive source in the Y-axis direction moving device 38, the pulse signal output from the rotary encoder that detects the number of rotations of the servo motor may be transmitted to a control device to be described later. The control device calculates the input pulse signal to detect the position of the second slider 33 in the Y-axis direction.
上述雷射光線照射單元4具備有配置於上述靜止基台2上的支撐構件41、被該支撐構件41所支撐且實質上水平延伸的套殼42、配置於該套殼42之雷射光線照射設備5、及配置於套殼42的前端部且可檢測應雷射加工之加工區域的攝像設備6。再者，攝像設備6具備照明被加工物的照明設備、捕捉以該照明設備所照明之區域的光學系統、以及 拍攝以該光學系統所捕捉到之像的攝像元件(CCD)等，並可將所拍攝到的圖像訊號傳送至後述之控制設備。 The laser beam irradiation unit 4 includes a support member 41 disposed on the stationary base 2, a casing 42 supported by the support member 41 and extending substantially horizontally, and laser light disposed on the casing 42. The apparatus 5 and the image pickup apparatus 6 disposed at the front end portion of the casing 42 and capable of detecting a processing area to be laser processed. Furthermore, the imaging device 6 includes an illumination device that illuminates the workpiece, an optical system that captures a region illuminated by the illumination device, and An imaging element (CCD) or the like that captures an image captured by the optical system is captured, and the captured image signal can be transmitted to a control device to be described later.
參照圖2說明上述雷射光線照射設備5。 The above-described laser beam irradiation apparatus 5 will be described with reference to Fig. 2 .
圖示之雷射光線照射設備5具備有脈衝雷射光線振盪設備51、調整由該脈衝雷射光線振盪設備51振盪產生之脈衝雷射光線LB之輸出的輸出調整設備52，以及將已藉由該輸出調整設備52調整過輸出之脈衝雷射光線聚光並對保持於工作夾台36上的被加工物照射的聚光器53。聚光器53是由方向變換鏡531與聚光透鏡532所構成，該方向變換鏡531將由上述脈衝雷射光線振盪設備51所振盪產生且已藉由該輸出調整設備52調整過輸出之脈衝雷射光線於圖2中朝向下方變換方向，該聚光透鏡532將已藉由該方向變換鏡531變換過方向的脈衝雷射光線聚光並對被保持於工作夾台36之被加工物10照射。再者，藉由聚光器53所聚光之脈衝雷射光線的聚光點位置是形成為藉由圖未示的聚光點位置調整設備，而在相對於作為工作夾台36之上表面的保持面為垂直之方向(Z軸方向)上被調整。如此構成之雷射光線照射設備5的脈衝雷射光線振盪設備51及輸出調整設備52，是藉由後述之控制設備而被控制。 The illustrated laser beam illumination device 5 is provided with a pulsed laser beam oscillating device 51, an output adjustment device 52 for adjusting the output of the pulsed laser beam LB oscillated by the pulsed laser ray oscillating device 51, and The output adjusting device 52 adjusts the concentrator 53 that illuminates the output pulsed laser light and illuminates the workpiece held on the working chuck 36. The concentrator 53 is composed of a direction changing mirror 531 and a collecting lens 532 which is generated by the pulsed laser ray oscillating device 51 and has been adjusted by the output adjusting device 52. The illuminating light is directed downward in FIG. 2, and the condensing lens 532 condenses the pulsed laser light that has been converted by the direction changing mirror 531 and illuminates the workpiece 10 held by the working chuck 36. . Furthermore, the position of the condensed spot of the pulsing laser light condensed by the concentrator 53 is formed by the condensing point position adjusting device not shown, but with respect to the upper surface as the working gantry 36. The holding surface is adjusted in the vertical direction (Z-axis direction). The pulsed laser beam oscillating device 51 and the output adjusting device 52 of the laser beam irradiation device 5 thus constructed are controlled by a control device to be described later.
圖示之雷射加工裝置1具備有圖3所示之控制設備8。控制設備8是由電腦所構成，且對按照控制程式做演算處理之中央處理裝置(CPU)81、保存控制程式等的唯讀記憶體(ROM)82、保存演算結果等之可讀寫的隨機存取記憶體(RAM)83、與輸入介面84，可輸入來自上述X軸方向位置 檢測設備374、Y軸方向位置檢測設備384、攝像設備6等的檢測訊號。然後，可從控制設備8的輸出介面85對上述X軸方向移動設備37、Y軸方向移動設備38、雷射光線照射設備5之脈衝雷射光線振盪設備51及輸出調整設備52等輸出控制訊號。 The laser processing apparatus 1 shown in the drawing is provided with the control device 8 shown in FIG. The control device 8 is a computer-readable, readable and writable random access to a central processing unit (CPU) 81 that performs arithmetic processing according to a control program, a read-only memory (ROM) 82 that stores a control program, and the like, and a storage calculation result. The access memory (RAM) 83 and the input interface 84 can input the position from the X-axis direction Detection signals of the detecting device 374, the Y-axis direction position detecting device 384, the imaging device 6, and the like. Then, the X-axis direction moving device 37, the Y-axis direction moving device 38, the pulsed laser ray oscillating device 51 of the laser ray illuminating device 5, and the output adjusting device 52 can output control signals from the output interface 85 of the control device 8. .
關於如以上形式所構成之雷射加工裝置1的作用，於以下進行說明。再者，雖然藉由該雷射加工裝置1加工被加工物時，可加工為組合了直線與曲線之形狀、或僅由曲線構成之形狀等各種形狀，但在以下之說明中，為了易於進行本申請案發明的作用之說明，是取將作為被加工物之玻璃基板以雷射加工切斷為圓形之情形為例來說明。 The operation of the laser processing apparatus 1 configured as described above will be described below. Further, when the workpiece is processed by the laser processing apparatus 1, it can be processed into various shapes such as a shape in which a straight line and a curved line are combined, or a shape formed only by a curved line. However, in the following description, in order to facilitate the processing. The description of the action of the invention of the present application will be described by taking a case where a glass substrate as a workpiece is cut into a circular shape by laser processing.
圖4中所示為藉由本發明之實施形態中的雷射加工裝置1加工作為被加工物之玻璃基板10之狀態。圖4所示之玻璃基板10是例如形成為厚度為200μm之正方形，且於表面10a上顯示有設計上所設定之應加工的加工預定線100(再者，該加工預定線100是為了說明而基於方便考量所顯示之線，並非實際上顯示在表面10a上之線。)。如此構成之玻璃基板10是如圖4所示地貼附在以覆蓋環狀框架F的內側開口部之方式裝設上外周部的保護膠帶T的表面。 Fig. 4 shows a state in which the glass substrate 10 as a workpiece is processed by the laser processing apparatus 1 according to the embodiment of the present invention. The glass substrate 10 shown in FIG. 4 is, for example, formed into a square having a thickness of 200 μm, and a planned line 100 to be processed which is designed to be formed is displayed on the surface 10a (again, the planned line 100 is for explanation) The line displayed on the surface 10a is not actually displayed based on the line of convenience.). The glass substrate 10 configured as described above is attached to the surface of the protective tape T on which the outer peripheral portion is attached so as to cover the inner opening portion of the annular frame F as shown in FIG. 4 .
於圖5中所顯示的是用於施行沿著設計上被設定之加工預定線100的加工之目標軌道座標(Xm,Yn)，並將其儲存到控制設備8之隨機存取記憶體(RAM)83的目標軌道座標儲存部(儲存區域83a)中，該目標軌道座標(Xm,Yn)是顯示形成工作夾台36實際上應移動之目標軌道線101的座 標位置。又，用以驅動X軸方向移動設備37、及Y軸方向移動設備38且進行工作夾台36的位置控制之控制軌道座標(Xo,Yp)是儲存在隨機存取記憶體(RAM)83之控制軌道座標儲存部(儲存區域83b)。再者，於初期狀態下，在該控制軌道座標儲存部中會儲存有與目標軌道座標(Xm,Yn)相同的座標資料。 Shown in FIG. 5 is a random access memory (RAM) for performing processing of the target track coordinates (Xm, Yn) along the design-predetermined processing line 100 and storing it in the control device 8. In the target orbit coordinate storage portion (storage region 83a) of 83, the target track coordinates (Xm, Yn) are seats for displaying the target track line 101 in which the work chuck 36 should actually move. Target location. Further, control track coordinates (Xo, Yp) for driving the X-axis direction moving device 37 and the Y-axis direction moving device 38 and performing position control of the work chuck 36 are stored in the random access memory (RAM) 83. The track coordinate storage portion (storage area 83b) is controlled. Further, in the initial state, the same coordinate data as the target track coordinates (Xm, Yn) is stored in the control track coordinate storage unit.
於此，在本發明的雷射加工裝置1中，在照射雷射光線來實際地加工被加工物之前，會在不照射雷射光線的情形下，令控制軌道座標修正設備執行，該控制軌道座標修正設備會修正儲存在控制軌道座標儲存部的控制軌道座標。 Here, in the laser processing apparatus 1 of the present invention, before the laser beam is irradiated to actually process the workpiece, the control track coordinate correction device is executed without irradiating the laser beam, and the control track is executed. The coordinate correction device corrects the control track coordinates stored in the control track coordinate storage.
首先，於雷射加工裝置1的工作夾台36上載置玻璃基板10的保護膠帶T側。然後，作動未圖示之吸引設備，隔著保護膠帶T將玻璃基板10吸引保持於工作夾台36上。然後，將裝設有被貼附於玻璃基板10之保護膠帶T的環狀框架F以夾具362固定。吸引保持有玻璃基板10之工作夾台36在以X軸方向移動設備37定位到攝像設備6的正下方，而將工作夾台36定位於攝像設備6的正下方時，會執行校準步驟，該校準步驟是以攝像設備6及控制設備8檢測玻璃基板10之應雷射加工的加工區域。亦即，藉由控制設備8，實施下述之校準步驟：為了將雷射光線照射設備5定位到應形成於玻璃基板10之加工預定線100的加工開始位置，而將工作夾台36定位到對應於該加工預定線100之加工開始位置之座標(X1、Y1)上。 First, the protective tape T side of the glass substrate 10 is placed on the work chuck 36 of the laser processing apparatus 1. Then, the suction device (not shown) is actuated, and the glass substrate 10 is sucked and held by the work chuck 36 via the protective tape T. Then, the annular frame F on which the protective tape T attached to the glass substrate 10 is attached is fixed by a jig 362. The working chuck 36 holding the glass substrate 10 is attracted to be positioned directly below the image pickup apparatus 6 in the X-axis direction moving device 37, and when the work chuck 36 is positioned directly below the image pickup apparatus 6, a calibration step is performed, which performs a calibration step, which The calibration step is to detect the processing area of the glass substrate 10 to be laser processed by the imaging device 6 and the control device 8. That is, by the control device 8, the following calibration step is carried out: in order to position the laser beam irradiation device 5 to a processing start position which should be formed on the processing line 100 of the glass substrate 10, the work chuck 36 is positioned to Corresponding to the coordinates (X1, Y1) of the processing start position of the processing planned line 100.
如上所述，若實施校準步驟後，控制設備8會停止來自雷射光線照射設備5的雷射光線的照射，其他則是依照實際的加工條件，且依據儲存於控制軌道座標儲存部(儲存區域83b)之控制軌道座標(Xo、Yp)，驅動X軸方向移動設備37及Y軸方向移動設備38來從預定的雷射加工開始位置移動工作夾台36。如上述，於初期狀態下，因為該控制軌道座標儲存部儲存有與目標軌道座標(Xm,Yn)相同的座標資料，所以實際上是按照目標軌道座標(Xm,Yn)來使工作夾台36移動。 As described above, after the calibration step is performed, the control device 8 stops the irradiation of the laser light from the laser beam irradiation device 5, and the others are stored according to the actual processing conditions and are stored in the control track coordinate storage portion (storage area). The control track coordinates (Xo, Yp) of 83b) drive the X-axis direction moving device 37 and the Y-axis direction moving device 38 to move the work chuck 36 from a predetermined laser machining start position. As described above, in the initial state, since the control track coordinate storage portion stores the same coordinate data as the target track coordinates (Xm, Yn), the work chuck 36 is actually made in accordance with the target track coordinates (Xm, Yn). mobile.
控制設備8除了按照儲存於控制軌道座標儲存部的控制軌道座標而驅動X軸方向移動設備37、及Y軸方向移動設備38來使工作夾台36移動外，也會透過輸入介面84接收來自X軸方向位置檢測設備374、Y軸方向位置檢測設備384的座標位置訊號，且使其對應於該控制軌道座標於隨機存取記憶體(RAM)83的軌跡座標儲存部(儲存區域83c)中依序儲存下去。如此一來，當使工作夾台36按照控制軌道座標移動到控制終端位置時，會檢測出如圖6所示之實際上工作夾台36所移動的軌跡座標(Xo、Yp)，而掌握以實際的軌跡座標所形成之軌跡線102。再者，實際所移動的軌跡座標(Xo、Yp)，是如上述地與作為控制軌道座標而被保存之一個個的控制軌道座標相對應並保存，且目標軌道座標、控制軌道座標、及軌跡座標的資料數量會被設定為相等。 The control device 8 receives the X-axis direction moving device 37 and the Y-axis direction moving device 38 to move the work chuck 36 in accordance with the control track coordinates stored in the control track coordinate storage portion, and also receives the X from the input interface 84. The coordinate position detecting device 374 and the coordinate position signal of the Y-axis direction position detecting device 384 are caused to correspond to the control track coordinates in the track coordinate storage portion (storage area 83c) of the random access memory (RAM) 83. Store it in order. In this way, when the working clamping table 36 is moved to the position of the control terminal according to the control track coordinates, the track coordinates (Xo, Yp) actually moved by the working clamping table 36 as shown in FIG. 6 are detected, and the grasping is performed. The trajectory line 102 formed by the actual track coordinates. Furthermore, the actually moved track coordinates (Xo, Yp) are corresponding to and saved as control track coordinates saved as control track coordinates as described above, and the target track coordinates, control track coordinates, and tracks The number of coordinates of the coordinates will be set equal.
如上述，若工作夾台36實際移動過的軌跡之座標已被儲存，控制設備8會藉由執行儲存於唯讀記憶體 (ROM)82的程式，算出儲存於目標軌道座標儲存部(儲存區域83a)的目標軌道座標(Xm,Yn)、與對應於該目標軌道座標之實際上工作夾台36所移動的軌跡座標(Xo、Yp)之座標間的距離，並算出將目標軌道座標作為控制軌道座標來使工作夾台36移動時的相對於目標軌道座標之偏差。 As described above, if the coordinates of the track actually moved by the work table 36 have been stored, the control device 8 will be stored in the read-only memory by execution. The program of (ROM) 82 calculates the target track coordinates (Xm, Yn) stored in the target track coordinate storage unit (storage area 83a) and the track coordinates of the actual work table 36 corresponding to the target track coordinates ( The distance between the coordinates of Xo and Yp), and the deviation from the target track coordinates when the target rail coordinate is used as the control track coordinate to move the work chuck 36 is calculated.
控制設備8是依據上述檢測出之偏差，而修正控制軌道，以使工作夾台36實際可移動的軌跡成為設成設計上的目標之目標軌道線101。亦即，如圖7及圖7之局部放大圖所示，相對於設成設計上的目標之目標軌道線101上的點P1，當實際的軌跡座標位置偏離到點P2時，會例如將以點P1為中心之點對象之位置上的點P3之位置設為新的控制軌道座標，並修正已儲存於控制軌道座標儲存設備(儲存區域83b)的座標。再者，此時，在該偏差量為容許的預定值以下的情況下，亦可不作修正。如此一來，可依據對應於初期狀態的各控制軌道座標之實際的軌跡座標，分別修正已儲存於控制軌道座標儲存設備(儲存區域83b)的值。然後，藉由該已修正的控制軌道座標形成新的控制軌道線103。 The control device 8 corrects the control track in accordance with the above-described detected deviation so that the trajectory in which the work chuck 36 is actually movable becomes the target track line 101 set as the design target. That is, as shown in the partial enlarged views of FIGS. 7 and 7, with respect to the point P1 on the target track line 101 set as the design target, when the actual track coordinate position deviates to the point P2, for example, The position of the point P3 at the position of the point object centered at the point P1 is set as a new control track coordinate, and the coordinates stored in the control track coordinate storage device (storage area 83b) are corrected. In this case, in the case where the amount of deviation is equal to or less than the allowable predetermined value, no correction may be made. In this way, the values already stored in the control track coordinate storage device (storage area 83b) can be individually corrected according to the actual track coordinates of the respective control track coordinates corresponding to the initial state. A new control track line 103 is then formed by the modified control track coordinates.
藉由上述修正而確定新的控制軌道座標後，控制設備8會進一步執行確認動作。在該確認動作中，雖然會變得反覆進行依據與上述之控制軌道座標修正設備的作動條件相同的條件來使工作夾台36移動之動作，但在上述動作中，相對於將作為初期狀態所設定的目標軌道座標作為控制軌道座標，來驅動X軸方向移動設備37及Y軸方向移動設備38之作法，在該確認動作中，是依據已修正的控制軌道 座標之值來驅動X軸方向移動設備37及Y軸方向移動設備38。 After the new control track coordinates are determined by the above correction, the control device 8 further performs the confirmation action. In the confirmation operation, the operation of moving the table 36 is performed in accordance with the same conditions as those of the above-described control track coordinate correction device. However, in the above operation, the operation is performed as an initial state. The set target track coordinates are used as control track coordinates to drive the X-axis direction moving device 37 and the Y-axis direction moving device 38. In the confirmation action, the corrected control track is based on the modified control track. The values of the coordinates drive the X-axis direction moving device 37 and the Y-axis direction moving device 38.
然後，對作為依據已修正之新的控制軌道座標而驅動X軸方向移動設備37及Y軸方向移動設備38之結果而得到的新的軌跡座標、與上述之目標軌道座標的距離進行確認，當該距離比作為容許範圍而設定之預定值更大時，會進一步修正已儲存於控制軌道座標儲存部之控制軌道座標，當該距離比該預定值更小，而視為實際的軌跡座標為涵蓋全周與目標軌道座標一致時，會結束確認動作，該控制軌道座標修正設備執行完成。 Then, the new track coordinates obtained as a result of driving the X-axis direction moving device 37 and the Y-axis direction moving device 38 based on the corrected new control track coordinates, and the distance from the target track coordinates are confirmed. When the distance is larger than a predetermined value set as the allowable range, the control track coordinates stored in the control track coordinate storage portion are further corrected, and when the distance is smaller than the predetermined value, the actual track coordinates are regarded as being covered. When the whole week coincides with the target track coordinates, the confirmation action is ended, and the control track coordinate correction device is executed.
當如以上進行而完成控制軌道座標之修正時，會依據已修正之控制軌道座標，令將該保持設備加工進給之加工進給設備執行，並且作動雷射光線照射設備5來進行對實際的被加工物的雷射加工。如此進行而得到的控制軌道座標，在對相同的被加工物施行雷射加工時，可以在不執行新的修正動作的情形下使用。又，因為實際上對被加工物施行雷射加工的過程中，也可檢測實際的軌跡座標與目標軌道座標的偏差，因此當該偏差量變大時，也可以暫時停止對被加工物的雷射加工，而令上述之控制軌道座標修正設備執行。 When the correction of the control track coordinates is completed as described above, the modified control track coordinates are used to execute the machining feed device that feeds the holding device, and the laser light irradiation device 5 is activated to perform the actual operation. Laser processing of the workpiece. The control track coordinates obtained in this way can be used without performing a new correction operation when laser processing is performed on the same workpiece. Further, since the deviation between the actual track coordinates and the target track coordinates can be detected during the laser processing of the workpiece, the laser for the workpiece can be temporarily stopped when the amount of the deviation becomes large. Processing, and the above control track coordinate correction device is executed.
再者，在本實施形態之說明中，雖然是以藉由X軸方向移動設備37及Y軸方向移動設備38使工作夾台36沿著成為圓形之軌道驅動之情況為例來說明，但相對於目標軌道座標之實際的軌跡座標的偏差量並不會單純地成為相 同。其原因在於：依據工作夾台36的位置，在構成X軸方向移動設備之脈衝馬達372、及構成Y軸方向移動設備之脈衝馬達382之中，為僅一方或僅另一方作動、或雙方的脈衝馬達372、382作動等，作動狀態並非一定，又，該脈衝馬達372、382因各自被要求之輸出不同，而輸出特性亦不同。 In the description of the present embodiment, the case where the work chuck 36 is driven along the circular track by the X-axis direction moving device 37 and the Y-axis direction moving device 38 will be described as an example. The amount of deviation from the actual trajectory coordinates of the target orbital coordinates does not simply become a phase with. The reason for this is that only one or only the other of the pulse motor 372 constituting the X-axis direction moving device and the pulse motor 382 constituting the Y-axis direction moving device are operated depending on the position of the work chuck 36. The pulse motors 372 and 382 are actuated, and the operating state is not constant. Moreover, the pulse motors 372 and 382 have different output characteristics depending on the required output.
在上述實施形態中，雖然將控制軌道座標的修正設成修正成僅因應偏差量之量，亦即從實際的軌跡座標點來看，是將以目標軌道座標上的座標點作為中心之點對象的位置形成為新的控制軌道座標點，但並不以此為限，亦可藉由限制每次執行的修正量，而作成少量地逐漸修正，並反覆進行確認動作，以修正成使實際的軌跡座標與目標軌道座標一致。藉由以該方式來進行，可以抑制實際上工作夾台36移動之軌跡座標無法迅速地收斂至目標軌道座標之問題。 In the above embodiment, the correction of the control track coordinates is set to be corrected to the amount of the deviation amount only, that is, from the actual track coordinate point, the point object centering on the coordinate point on the target track coordinates is used. The position is formed as a new control track coordinate point, but it is not limited thereto. Instead, the amount of correction performed each time is limited, and a small amount of gradual correction is performed, and the confirmation operation is repeatedly performed to correct the actual The track coordinates are consistent with the target track coordinates. By performing in this manner, it is possible to suppress the problem that the track coordinates on which the working chuck 36 moves can not quickly converge to the target track coordinates.
可於本發明之雷射加工裝置應用之雷射加工的方式並沒有被限定。可以應用以下各種習知的雷射加工：以對被加工物具有吸收性之波長的雷射光線，來對被加工物的表面施行剝離加工之方式；將對被加工物具有穿透性之波長的雷射光線的聚光點以較高的數值孔徑(例如，NA=0.8)定位於被加工物的內部並進行照射，而使其變質以得到改質層之方式；更進一步的有，施行將對被加工物具有穿透性之波長的雷射光線的聚光點，以較低的數值孔徑(例如，NA=0.4)定位於被加工物之上表面附近並進行照射，而形成從上表面到下表面的細孔與圍繞該細孔之非晶質之 形成所謂的潛盾型通孔之加工的方式等。 The manner of laser processing that can be applied to the laser processing apparatus of the present invention is not limited. Various conventional laser processes can be applied: a method in which a surface of a workpiece is subjected to a peeling process by a laser beam having a wavelength that absorbs a workpiece; and a wavelength that is transparent to the workpiece The concentrating point of the laser light is positioned at the inside of the workpiece with a higher numerical aperture (for example, NA = 0.8) and irradiated to deteriorate the manner to obtain the modified layer; further, implementation A condensing point of a laser beam having a wavelength at which a workpiece is penetrating is positioned at a lower numerical aperture (for example, NA = 0.4) near the upper surface of the workpiece and irradiated to form an upper surface. Fine pores from the surface to the lower surface and amorphous ones surrounding the pores A method of processing a so-called shield-type through hole or the like is formed.
101‧‧‧目標軌道線 101‧‧‧target track line
102‧‧‧軌跡線 102‧‧‧Track line
103‧‧‧控制軌道線 103‧‧‧Control track line
P1、P2、P3‧‧‧點 P1, P2, P3‧‧ points
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