JP3662542B2 - Laser processing apparatus and deviation correction method therefor - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing apparatus and a deviation correction method therefor.
[0002]
[Prior art]
Currently, there are welding work, removal work, modification work, and the like as processing using laser light. In particular, in removal operations such as drilling, cutting, trimming, and marking, high precision is required with downsizing of electronic devices in which processed products are incorporated.
[0003]
For example, in an electronic device where portability is important, such as a mobile phone, a notebook personal computer, or a PDA (Personal Digital Assistants), an accuracy of about ± 15 μm or less is required in order to reduce the substrate to be incorporated therein. .
[0004]
Conventionally, in processing that requires high accuracy, an image recognition device is installed to realize this, and the position of the laser optical system is determined based on the image processing result of the workpiece.
[0005]
For example, in a laser positioning processing method and apparatus disclosed in Japanese Patent Laid-Open No. 8-71780, an image recognition mark is provided on a workpiece, and the image recognition mark is picked up by an imaging camera at the start of work to perform position correction. Thus, it is configured to correct the displacement of the workpiece to be fixed or stopped. (Hereinafter referred to as Conventional Technology 1)
Further, for example, in the drilling apparatus using the laser beam shown in FIG. 1, as in the prior art 1, after adjusting the processing position based on the images captured by the imaging cameras 12 a and 12 b at the start of work, The processing accuracy is maintained by fixing the green sheets 1a and 1b on the basis of positioning pins 21 provided on an XY table 20 carrying the green sheets 1a and 1b. (Hereinafter referred to as Conventional Technology 2)
[Problems to be solved by the invention]
However, in the related arts 1 and 2, when working continuously for several hours, a deviation occurs with time due to temperature drift characteristics in an optical system such as a scanner or changes in the surrounding environment, and the required accuracy can be maintained. There is a problem of disappearing.
[0006]
The present invention has been made in view of the above problems, and an object thereof is to provide a laser processing apparatus for maintaining sufficient processing accuracy even when continuously operated, and a deviation correction method therefor.
[0007]
[Means for Solving the Problems]
  In order to achieve the object, the invention according to claim 1 is a laser processing apparatus that irradiates a processing object with a laser beam via a galvanometer mirror,
  On the table carrying the workpieceA first mark serving as a positioning reference with respect to a processing position irradiated with the laser light, and a second mark serving as a reference for correcting the positional deviation of the table,
  The position of the table with respect to the processing position of the laser beam is positioned based on the first mark, and the position of the table with respect to the processing position of the laser beam is determined based on the second mark after a predetermined time has elapsed.It is characterized by correcting the deviation.
[0008]
  As a result, the invention according to claim 1 provides a laser processing apparatus capable of maintaining sufficient processing accuracy even when continuously operated. In other words, on the side of the table carrying the workpieceA first mark serving as a positioning reference with respect to a processing position irradiated with laser light, and a second mark serving as a reference for correcting the positional deviation of the table;Provided,At the time of positioning, the amount of deviation between the table and the laser beam processing position is calculated with the first mark as a reference, and after a predetermined time has elapsed, the second markBased onBetween the table and the laser beam processing positionBy calculating the amount of deviation, it is easyBetween the table and the laser beam processing positionThe amount of deviation can be identified and based on thisDeviation between the table and laser beam processing positionCorrection can be performed easily.
[0009]
The invention described in claim 2 is a laser processing apparatus for irradiating a processing object with a laser beam via a galvanometer mirror, and positions the processing object provided on a table carrying the processing object. First relative coordinates of a first mark serving as a reference, a second mark indicating a predetermined position of the table, a processing portion created on a processing object, and the first mark are calculated. A first coordinate calculating unit; a second coordinate calculating unit that calculates a second relative coordinate between the processing unit and the second mark; a first storage unit that stores a predetermined relative coordinate in advance; Second storage means for storing the second relative coordinates calculated by the second coordinate calculation means, and at the time of the first correction, the first relative coordinates and the predetermined relative coordinates Correcting the position of the table based on the difference, and the table The second relative coordinate calculated by the second coordinate calculating unit with respect to the machined hole created after correcting the position is stored in the second storage unit, and at the time of subsequent correction, the second coordinate calculating unit The position of the table is corrected based on the calculated second relative coordinates and the second relative coordinates stored in the second storage means.
[0010]
As a result, the invention according to claim 2 provides a laser processing apparatus capable of maintaining sufficient processing accuracy even when continuously operated. That is, according to the present invention, the deviation is eliminated at the start of the work, and the deviation occurring afterward is calculated on the basis of the second mark with the position at this time as a reference. The amount can be calculated, and a laser processing apparatus that continuously performs highly accurate processing can be realized.
[0011]
In the invention according to claim 3, two or more workpieces are translated in parallel by irradiating two or more workpieces through a galvanometer mirror provided in a one-to-one manner. A laser processing apparatus for processing the above-described processing object, wherein two or more first, which are provided on a table carrying two or more processing objects and serve as a reference when each of the processing objects is positioned , A second mark indicating a predetermined position of the table, a processing part created on two or more processing objects, and the first corresponding to the two or more processing objects one-to-one. First coordinate calculation means for calculating first relative coordinates with each mark, and second relative coordinates between a processing part created on two or more objects to be processed and the second mark, respectively. A second coordinate calculating means that performs one-to-one correspondence with two or more workpieces First storage means for storing relative coordinates in advance, and second storage means for storing two or more second relative coordinates calculated by the second coordinate calculation means, Is corrected based on the first relative coordinates relating to the predetermined processing object and the predetermined relative coordinates relating to the predetermined processing object, and the first position relating to the other processing object. Correction to a control amount of a galvano scanner for irradiating the other processing object with the laser beam based on relative coordinates, a predetermined relative coordinate relating to the other processing object, and a movement amount by correcting the position of the table Adding a value, and storing the second relative coordinates calculated by the second coordinate calculation means with respect to two or more machining holes created after correcting the position of the table in the second storage means, During the subsequent correction, the second seat The position of the table is determined based on the second relative coordinates related to the predetermined processing object calculated by the calculation means and the second relative coordinates related to the predetermined processing object stored in the second storage means. Correction and movement by correcting the second relative coordinates relating to the other object to be processed and the second relative coordinates relating to the other object to be processed stored in the second storage means and the position of the table A correction value is added to the control amount of the galvano scanner for irradiating the laser beam to the other workpiece based on the amount.
[0012]
As a result, the invention according to claim 3 provides a laser processing apparatus capable of maintaining sufficient processing accuracy even when continuously operated. That is, according to the present invention, the deviation is eliminated at the start of the work, and the deviation occurring afterward is calculated on the basis of the second mark with the position at this time as a reference. The amount can be calculated, and a laser processing apparatus that continuously performs highly accurate processing can be realized.
[0013]
According to a fourth aspect of the present invention, there is provided a first mark which is provided on a table carrying the workpiece and serves as a reference when positioning the workpiece, and a second mark indicating a predetermined position of the table. A first coordinate calculating means for calculating a first relative coordinate between the first mark and the processing part created on the processing object and the first mark, and a second of the processing part and the second mark Second coordinate calculation means for calculating relative coordinates, first storage means for storing predetermined relative coordinates in advance, and second storage for storing the second relative coordinates calculated by the second coordinate calculation means. A deviation correction method in a laser processing apparatus that irradiates a workpiece with a laser beam via a galvano mirror, and the first relative coordinates and the predetermined The position of the table is corrected based on the difference from the relative coordinates. In addition, the second relative coordinate calculated by the second coordinate calculating unit with respect to the machining hole created after correcting the position of the table is stored in the second storage unit, and at the time of subsequent correction, the second relative coordinate is stored. The position of the table is corrected based on the second relative coordinates calculated by the coordinate calculating means and the second relative coordinates stored in the second storage means.
[0014]
  Thus, in the invention described in claim 4, there is provided a laser processing apparatus capable of maintaining sufficient processing accuracy even when continuously operated. That is, according to the present invention, the deviation is eliminated at the start of the work, and the deviation occurring afterward is calculated on the basis of the second mark with the position at this time as a reference. The amount can be calculated, and a laser processing apparatus that continuously performs highly accurate processing can be realized.
[0015]
According to a fifth aspect of the present invention, there are provided two or more first marks provided on a table carrying two or more workpieces and serving as a reference when each of the workpieces is positioned, A second mark indicating a predetermined position on the table, a processing part created on two or more workpieces, and a first mark corresponding to the two or more workpieces on a one-to-one basis. 1st coordinate calculation means which calculates 1 relative coordinate, respectively, 2nd coordinate which calculates 2nd relative coordinate of the process part created in two or more processed objects, and the 2nd mark, respectively A calculating means, a first storage means for storing in advance one-to-one predetermined relative coordinates corresponding to two or more workpieces, and two or more of the second coordinates calculated by the second coordinate calculating means. Second storage means for storing the relative coordinates of the two, the laser beam separated into two or more A deviation correction method in a laser processing apparatus that translates and processes two or more workpieces by irradiating two or more workpieces via a galvanometer mirror provided in a pair. Is corrected based on the first relative coordinates relating to the predetermined processing object and the predetermined relative coordinates relating to the predetermined processing object, and the first position relating to the other processing object. Correction to a control amount of a galvano scanner for irradiating the other processing object with the laser beam based on relative coordinates, a predetermined relative coordinate relating to the other processing object, and a movement amount by correcting the position of the table Adding a value, and storing the second relative coordinates calculated by the second coordinate calculation means with respect to two or more machining holes created after correcting the position of the table in the second storage means, Subsequent complement Sometimes, the second relative coordinate related to the predetermined processing object calculated by the second coordinate calculating means and the second relative coordinate related to the predetermined processing object stored in the second storage means. The position of the table is corrected based on the second relative coordinates regarding the other processing object, the second relative coordinates regarding the other processing object stored in the second storage means, and the A correction value is added to the control amount of the galvano scanner for irradiating the other processing object with the laser beam based on the movement amount by correcting the position of the table.
[0016]
As a result, the invention according to claim 5 provides a laser processing apparatus capable of maintaining sufficient processing accuracy even when continuously operated. That is, according to the present invention, the deviation is eliminated at the start of the work, and the deviation occurring afterward is calculated on the basis of the second mark with the position at this time as a reference. The amount can be calculated, and a laser processing apparatus that continuously performs highly accurate processing can be realized.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
[Features of the present invention]
In describing preferred embodiments of the present invention, the features of the present invention will be described first.
[0018]
The present invention is intended to improve the yield of products that require high accuracy by correcting a decrease in machining accuracy caused by continuous work.
[0019]
In order to realize this, the present invention is configured to measure a deviation in laser processing periodically or at any time and perform correction based on the measurement.
[0020]
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the drawings.
[First embodiment]
・ Schematic configuration
FIG. 2 shows a configuration in which the pulsed laser beam output from the laser oscillator 40 of this embodiment (see FIG. 3) is separated into two, and two workpieces (green sheets 1a and 1b) are processed at the same time. 1 is a perspective view for explaining a schematic configuration of a laser processing apparatus 100. FIG.
[0021]
In the laser processing apparatus 100 shown in FIG. 2, the laser beam output from the laser oscillator 40 is separated into two laser beams and input to the laser heads 10a and 10b, respectively.
[0022]
Further, the XY table 20 adjusts the irradiation position of the laser beam by moving in the X-axis direction, the Y-axis direction, and the Z-axis direction in the drawing. The XY table 20 carries green sheets 1a and 1b as processing objects. At this time, a positioning hole 25 serving as a mark is provided on the XY table 20 so that the green sheets 1a and 1b are installed at predetermined positions.
[0023]
In this configuration, the laser beams input to the laser heads 10a and 10b are applied to the green sheets 1a and 1b fixed on the XY table 20 via the galvano scanners 13a and 13b and the fθ lenses 11a and 11b, respectively. The
・ Optical system configuration
Here, the configuration of the optical system of the laser processing apparatus 100 will be described with reference to FIG.
[0024]
Referring to FIG. 3, the laser processing apparatus 100 is input with a transflective lens 42 for separating the laser beam output from the laser oscillator 40 into two laser beams having the same intensity as its optical system configuration. The galvano scanners 13a and 13b that scan so as to irradiate a predetermined position on the green sheet 1a or 1b and the laser light scanned by the galvano scanners 13a and 13b are collected at a processing position on the green sheet 1a or 1b. And fθ lenses 11a and 11b that emit light.
[0025]
Further, the laser oscillator 40 outputs a laser beam based on the trigger signal input from the control unit 30, and the output laser beam travels along a predetermined optical axis, such as bending mirrors 41, 43, and the like. The path is refracted by the transmission lens 42.
[0026]
With this configuration, the laser light output from the laser oscillator 40 is guided to a predetermined optical path and irradiated on the green sheets 1a and 1b.
・ Slip correction
Next, the correction method according to the present embodiment will be described in detail with reference to the drawings.
[0027]
In this embodiment, in order to correct the deviation in the laser processing apparatus 100, the green sheets are fixed with the control positions (swing angles) of the galvano scanners 13a and 13b in the laser heads 10a and 10b fixed at the center position of the scanning amplitude. Laser light is irradiated to 1a and 1b.
[0028]
  That is, at the time of starting work and after having been continuously operated for a predetermined time, processed holes (2a, 2b on the green sheets 1a, 1b under the same conditions: As shown in FIG.) And inspecting how much deviation has occurred since the start of work. Correction is performed based on the deviation obtained by this inspection.
[0029]
  Furthermore, in the present embodiment, the reference mark 22 is placed on the XY table 20 in order to simplify the work.(Corresponding to the second mark according to claims 1 to 5)Is provided. Thereby, it becomes possible to correct | amend based on the relative coordinate of this reference | standard mark 22 and processed hole 2a, 2b, and a labor is reduced significantly.
[0030]
Next, the procedure for correcting the deviation in the present embodiment will be described in detail with reference to the flowcharts shown in FIGS. 4 and 5 and FIG.
..Correction at start of operation
In the present embodiment, at the start of work, first, the operation shown in the flowchart of FIG. 4 is executed to correct the deviation at this point and to secure a reference value for the subsequent correction.
[0031]
  Referring to FIG. 4, as an operation at the start of work, first, the reference mark 22 provided on the XY table 20 is imaged using the X position imaging camera 23 and the Y position imaging camera 24 (step S1).01). However, the captured image data is stored in a memory or the like provided in the image processing apparatus 34 in FIG.
[0032]
Further, the green sheets 1a and 1b are set on the XY table 20 in the laser processing apparatus 100 based on the positioning holes 25 (step S102), and the control positions of the galvano scanners 13a and 13b are maintained at the center of the swing angle. In step S103, the green sheets 1a and 1b are irradiated with the laser light output from the laser oscillator 40 in this state (step S104). At this time, the green sheets 1a and 1b to be used may be for trial use.
[0033]
Thereafter, the processing holes 2a and 2b created in step S104 and their surroundings are imaged using the imaging cameras 12a and 12b (step S105).
[0034]
  Next, the green sheets 1a, 1b set on the XY table 20 are removed (step S106), and the positioning holes 25a, 25b (It corresponds to the first mark according to claims 1 to 5:FIG.(C)Reference) and its periphery are imaged (step S107). However, the positioning holes 25a and 25b may be arbitrary on the a side and b side, respectively, of the positioning holes 25 provided in the XY table 20, as shown in FIG. At this time, which positioning hole 25 is to be selected is set in advance. The XY table 20 (positions of the positioning holes 25a and 25b do not change before and after the green sheets 1a and 1b are removed. The reason why the green sheets 1a and 1b are removed is generally that the green sheets are flat and the XY table. This is because the positioning hole 25 on 20 is covered and hidden.
[0035]
  After that, by performing predetermined image processing on the processed holes 2a and 2b imaged in step S105 and the surrounding images and the positioning holes 25a and 25b imaged in step S106 and the surrounding images, positioning processing is performed. The relative coordinates of the processed holes 2a and 2b with the holes 25a and 25b as the base points are calculated (step S108). However, since the operation of calculating relative coordinates by predetermined image processing is well known, description thereof is omitted here. The relative coordinates obtained at this time are shown in FIG.(D)(Xa, Ya), (Xb, Yb).
[0036]
  Once the relative coordinates with respect to the positioning holes 25a and 25b are obtained in this way, next, in this embodiment, the relative coordinates of the machining hole 2a on either the a side or the b side, for example, the a side, are registered in advance. The XY table 20 is moved so as to become the coordinates that have been set, for example, the coordinates (Xa0, Ya0) at the time of design (step S109). As a result, the shift on the a side is corrected. That is, the coordinate data (Xa0, Ya0) at the design value, which is an ideal value, is stored in the memory or the like in the control unit 30 in FIG. 7, and the relative coordinates calculated by the control unit 30 in the process of step S109. The XY table 2 is controlled by the control unit 30 or manually so as to eliminate the difference (Xa0−Xa, Ya0−Ya) between (Xa, Ya) and the coordinates (Xa0, Ya0) of the design value.0Move the position of.
[0037]
Next, in order to correct the deviation on the b side, the relative coordinates (Xb- (Xa0-Xa), Yb- (Ya0-Ya)) of the machining hole 2b after the movement of the XY table 20 in step S109 are registered in advance. A difference from the coordinates that have been set, for example, the design coordinates (Xb0, Yb0) is calculated (step S110), and the control unit 30 calculates the difference (Xb0− (Xb− (Xa0−Xa)), Yb0− (Yb -(Ya0-Ya))) is registered in the scanner controller 33b in FIG. 7 as an offset (step S111). Thereby, the deviation on the b side is corrected. However, the scanner controller 33b for controlling the galvano scanner 13b will be described in detail below with reference to FIG.
[0038]
Further, in the present embodiment, the reference mark 22 is used as a base point by performing predetermined image processing on the image acquired in step S101 and the processed holes 2a and 2b and the surrounding images taken in step S104. Relative coordinates (XGa1, YGa1), (XGb1, YGb1) of the machining holes 2a, 2b are calculated (step S112). Further, the relative coordinates (XGa1, YGa1) and (XGb1, YGb1) calculated in step S112 are used as a reference when correcting after a predetermined time, for example, a memory provided in the control unit 30 in FIG. (Step S113).
[0039]
By operating as described above, deviation correction at the time of starting work and the relative positions of the processed holes 2a and 2b with respect to the reference mark 22 are specified. Further, by performing the operation shown in FIG. 4 a plurality of times, the processing accuracy can be made more reliable.
..Correction after continuous operation
Next, in this embodiment, after the laser processing apparatus 100 is continuously operated for a predetermined time (predetermined time) such as several hours, the flowchart shown in FIG. The deviation generated up to this point is calculated, and the machining accuracy is corrected based on this. The operation at this time will be described with reference to FIG.
[0040]
Referring to FIG. 5, in this embodiment, first, the reference mark 22 and its periphery are imaged using the X position imaging camera 24 and the Y position imaging camera 24 (step S201).
[0041]
Next, the green sheets 1a and 1b are set on the XY table 20 in the laser processing apparatus 100 based on the positioning holes 25 (step S202), and the control positions of the galvano scanners 13a and 13b are maintained at the center of the swing angle. In step S203, the green sheets 1a and 1b are irradiated with laser light output from the laser oscillator 40 in this state (step S204). At this time, the green sheets 1a and 1b to be used may be for trial use.
[0042]
Thereafter, the processing holes 2a and 2b created in step S204 and the periphery thereof are imaged using the imaging cameras 12a and 12b (step S205).
[0043]
As described above, when the image of the reference mark 22 and its surroundings and the processed holes 2a and 2b and their surrounding images are acquired, in this embodiment, by performing predetermined image processing on these images, Relative coordinates (XGa2, YGa2) and (XGb2, YGb2) of the machining holes 2a, 2b with the mark 22 as a base point are calculated (step S206).
[0044]
When the relative coordinates of this time are specified in this manner, the relative coordinates (XGa1, YGa1) stored in the operation at the start of the work shown in FIG. 4 and the relative coordinates (XGa2, YGa1) specified in step S206 are next. YGa2) is calculated (step S207), the XY table 20 is moved based on the calculated differences ((XGa2-XGa1), (YGa2-Ya1)) (step S208), and the machining hole 2a is coordinated. It is located at (XGa1, YGa1). As a result, the shift on the a side is corrected.
[0045]
Next, the relative coordinates (XGb1, YGb1) stored in the operation shown in FIG. 4 and the relative coordinates of the processed hole 2b after the movement (XGb2- (XGa2-XGa1), YGb2- (YGa2-Ya1)) 7 (step S209), and the calculated differences (XGb1- (XGb2- (XGa2-XGa1)), YGb1- (YGb2- (YGa2-Ya1)))) are used as the offset of the galvano scanner 13b. Is registered in the scanner controller 33b (step S210). Thereby, the deviation on the b side is corrected.
[0046]
By operating as described above, the deviation caused by operating continuously for a predetermined time is corrected. Further, it is possible to simplify the labor required for correction after continuous operation and to facilitate the correction work.
・ Control system configuration
Next, each operation | movement of each block which comprises the laser processing apparatus 100 is demonstrated using FIG.
[0047]
In FIG. 7, the control unit 30 controls the entire laser processing apparatus 100. Therefore, in this embodiment, first, the control unit 30 inputs a command for this to the scanner controllers 33a and 33b in order to position the swing angle of the galvano scanners 13a and 13b at the center of the amplitude.
[0048]
After irradiating the green sheets 1a and 1b with the laser light output from the laser oscillator 40 in this way, the control unit 30 controls the imaging cameras 12a and 12b via the imaging camera controllers 32a and 32b, thereby processing holes. 2a, 2b and its periphery are imaged. Further, the image data (green sheet 1a image and green sheet 1b image) acquired thereby is input to the image processing device 34 and temporarily held in a memory or the like in this.
[0049]
Next, when the user removes the green sheets 1a and 1b on the XY table 20 and inputs images of the positioning holes 25a and 25b, the control unit 30 receives the imaging cameras 12a and 32b via the imaging camera controllers 32a and 32b. 12b is controlled to image the positioning holes 25a and 25b and their surroundings. Also, the image data (a-side XY table image, b-side XY table image) acquired in this way is input to the image processing device 34 and temporarily held in a memory or the like in this.
[0050]
Thereafter, as in the operation shown in FIG. 4, the image processing device 34 calculates the relative positions of the processing holes 2a and 2b with the positioning holes 25a and 25b as the base points, and the position of the XY table 20 is controlled based on this. In addition, an offset is given to the control amount of the galvano scanner 13b.
[0051]
Further, before moving the XY table 20, the control unit 30 causes the X position imaging camera 23 and the Y position imaging camera 24 to image the reference mark 22 and its periphery via the imaging camera controller 33. Image data thus captured (reference mark 22 image (for X coordinate detection, Y coordinate detection)) is input to the image processing device 34 and temporarily held in a memory or the like in this.
[0052]
Thereafter, similar to the operations shown in FIGS. 4 and 5, the relative positions of the processed holes 2 a and 2 b with the reference mark 22 as a base point are calculated in the image processing device 34. However, the relative positions (XGa, YGa), (XGb, YGb) are (XGa1, YGa1), (XGa2, YGa2), (XGb1, YGb1), (XGb2, YGb2) in the flowcharts shown in FIGS. It corresponds to.
[0053]
The relative positions (XGa1, YGa1) and (XGb1, YGb1) are input to the control unit 30, and are stored and held in a memory or the like in the control unit 30 for reference when correction is performed after a predetermined time has elapsed. Further, the relative positions (XGa2, YGa2), (XGb2, YGb2) are input to the control unit 30, and the deviation is based on the comparison with the relative positions (XGa1, YGa1), (XGb1, YGb1) held in advance. Calculated.
[0054]
When the deviation is calculated in this way, the control unit 30 corrects the position of the XY table 20 based on the calculated deviation, and adds an offset to the control amount of the scanner controller 33b that controls the galvano scanner 13b. Thereby, it is possible to correct the deviation of the laser processing apparatus 100 that has occurred in the work over time, and to maintain high accuracy.
[Other Examples]
The above-described embodiments are merely examples of the preferred embodiment of the present invention, and the present invention can be implemented with various modifications without departing from the gist thereof.
[0055]
Furthermore, in the said Example, although the laser beam processing apparatus 100 which divides | segments a laser beam into two, translates, and processes with respect to the two green sheets 1a and 1b was given and demonstrated, an example was given, but this invention does this. The present invention is not limited, and for example, the present invention can be applied to a machine that processes only one green sheet at the same time, or a person who performs translation while processing three or more green sheets.
[0056]
【The invention's effect】
  As described above, according to the first aspect of the present invention, there is provided a laser processing apparatus capable of maintaining sufficient processing accuracy even when continuously operated. In other words, on the side of the table carrying the workpieceA first mark serving as a positioning reference with respect to a processing position irradiated with laser light, and a second mark serving as a reference for correcting the positional deviation of the table;Provided,At the time of positioning, the amount of deviation between the table and the laser beam processing position is calculated with the first mark as a reference, and after a predetermined time has elapsed, the second markBased onBetween the table and the laser beam processing positionBy calculating the amount of deviation, it is easyBetween the table and the laser beam processing positionThe amount of deviation can be identified and based on thisDeviation between the table and laser beam processing positionCorrection can be performed easily.
[0057]
Moreover, according to any one of Claims 2-5, the laser processing apparatus which can maintain sufficient processing precision even when it works continuously is provided. That is, according to the present invention, the deviation is eliminated at the start of the work, and the deviation occurring afterward is calculated on the basis of the second mark with the position at this time as a reference. The amount can be calculated, and a laser processing apparatus that continuously performs highly accurate processing can be realized.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a schematic configuration of a laser processing apparatus according to Prior Art 2. FIG.
FIG. 2 is a perspective view showing a schematic configuration of a laser processing apparatus 100 according to an embodiment of the present invention.
3 is a block diagram showing a configuration of an optical system of the laser processing apparatus 100. FIG.
FIG. 4 is a flowchart showing an example of a correction operation performed at the start of work in an embodiment of the present invention.
FIG. 5 is a flowchart illustrating an example of a correction operation performed after continuous operation according to an embodiment of the present invention.
6 is a view for explaining relative coordinates between the processing holes 2a and 2b created by the laser processing apparatus 100 and the reference mark 22 or positioning holes 25a and 25b in the embodiment of the present invention. FIG.
7 is a block diagram showing a configuration of a laser processing apparatus 100. FIG.
[Explanation of symbols]
1a, 1b Green sheet
2a, 2b drilled holes
10a, 10b Laser head
11a, 11b fθ lens
12a, 12b imaging camera
13a, 13b Galvano scanner
20 XY table
21 Positioning pin
22 fiducial mark
23 X position imaging camera
24 Y position imaging camera
25, 25a, 25b Positioning holes
30 Control unit
32a, 32b, 33 Imaging camera controller
33a, 33b Scanner controller
40 Laser oscillator
41, 43 Bending mirror
42 Transflective lens

Claims (5)

A laser processing apparatus for irradiating a processing object with laser light via a galvanometer mirror,
The table carrying the workpiece is provided with a first mark serving as a positioning reference for the processing position irradiated with the laser beam and a second mark serving as a reference for correcting the positional deviation of the table,
The position of the table with respect to the processing position of the laser beam is positioned based on the first mark, and the positional deviation of the table with respect to the processing position of the laser beam is corrected based on the second mark after a predetermined time has elapsed. The laser processing apparatus characterized by the above-mentioned. A laser processing apparatus for irradiating a processing object with laser light via a galvanometer mirror,
A first mark provided on a table carrying the workpiece, which serves as a reference when positioning the workpiece;
A second mark indicating a predetermined position of the table;
First coordinate calculating means for calculating a first relative coordinate between a processing portion created on a processing object and the first mark;
Second coordinate calculation means for calculating a second relative coordinate between the processing portion and the second mark;
First storage means for storing predetermined relative coordinates in advance;
And second storage means for storing the second relative coordinates calculated by the second coordinate calculation means,
At the time of the first correction, the position of the table is corrected based on the difference between the first relative coordinate and the predetermined relative coordinate, and the second portion relating to the processing portion created after the correction of the table position is performed. Storing the second relative coordinates calculated by the coordinate calculation means in the second storage means,
At the time of subsequent correction, the position of the table is corrected based on the second relative coordinates calculated by the second coordinate calculation means and the second relative coordinates stored in the second storage means. A laser processing apparatus characterized by the above. Laser processing that translates and processes two or more workpieces by irradiating the two or more workpieces with two or more separated laser beams via a galvano mirror provided on a one-to-one basis A device,
Two or more first marks provided on a table carrying two or more workpieces and serving as a reference for positioning the workpieces;
A second mark indicating a predetermined position of the table;
First coordinate calculation for respectively calculating first relative coordinates between a processing part created on two or more processing objects and the first mark corresponding to the two or more processing objects on a one-to-one basis. Means,
Second coordinate calculation means for calculating second relative coordinates between the processing part created on two or more processing objects and the second mark;
First storage means for storing in advance predetermined relative coordinates corresponding one-to-one to two or more workpieces;
Second storage means for storing two or more of the second relative coordinates calculated by the second coordinate calculation means;
At the time of the first correction, the position of the table is corrected based on the first relative coordinates relating to the predetermined processing object and the predetermined relative coordinates relating to the predetermined processing object, A control amount of the galvano scanner for irradiating the other processing object with the laser beam based on one relative coordinate, a predetermined relative coordinate relating to the other processing object, and a movement amount by correcting the position of the table And a second relative coordinate calculated by the second coordinate calculation means for two or more machining parts created after correcting the position of the table is stored in the second storage means. And
During the subsequent correction, the second relative coordinate relating to the predetermined processing object calculated by the second coordinate calculating means and the second relative relating to the predetermined processing object stored in the second storage means. The position of the table is corrected based on the coordinates, and the second relative coordinates related to the other processing object stored in the second storage means and the second relative coordinates related to the other processing object. A laser processing apparatus, wherein a correction value is added to a control amount of a galvano scanner for irradiating the other processing object with the laser beam based on coordinates and a movement amount by correcting the position of the table. A first mark provided on a table carrying the workpiece and serving as a reference for positioning the workpiece, a second mark indicating a predetermined position of the table, and the workpiece is created. A first coordinate calculating means for calculating a first relative coordinate between the processed portion and the first mark, and a second coordinate calculating for calculating a second relative coordinate between the processed portion and the second mark. Means, first storage means for storing predetermined relative coordinates in advance, and second storage means for storing the second relative coordinates calculated by the second coordinate calculation means, and a laser. A deviation correction method in a laser processing apparatus that irradiates a processing object with light via a galvanometer mirror,
At the time of the first correction, the position of the table is corrected based on the difference between the first relative coordinate and the predetermined relative coordinate, and the second portion relating to the processing portion created after the correction of the table position is performed. Storing the second relative coordinates calculated by the coordinate calculation means in the second storage means,
At the time of subsequent correction, the position of the table is corrected based on the second relative coordinates calculated by the second coordinate calculation means and the second relative coordinates stored in the second storage means. A deviation correction method in a laser processing apparatus characterized by the above. Two or more first marks provided on a table carrying two or more objects to be processed and serving as a reference when each of the objects to be processed is positioned, and a second indicating a predetermined position of the table A first relative coordinate is calculated for each of a mark, a processing part created on two or more workpieces, and the first mark corresponding to the two or more workpieces on a one-to-one basis. Coordinate calculating means, second coordinate calculating means for calculating second relative coordinates of the processing part created on two or more processing objects and the second mark, and two or more processing objects A first storage means for storing predetermined relative coordinates corresponding one-to-one with an object in advance, and a second storage for storing two or more second relative coordinates calculated by the second coordinate calculation means. And a galvanometer provided with one-to-one laser light separated into two or more. By irradiating through the over to two or more of the object, a deviation correction process in the laser processing apparatus for processing two or more of the object translating to,
At the time of the first correction, the position of the table is corrected based on the first relative coordinates relating to the predetermined processing object and the predetermined relative coordinates relating to the predetermined processing object, A control amount of the galvano scanner for irradiating the other processing object with the laser beam based on one relative coordinate, a predetermined relative coordinate relating to the other processing object, and a movement amount by correcting the position of the table And a second relative coordinate calculated by the second coordinate calculation means for two or more machining parts created after correcting the position of the table is stored in the second storage means. And
During the subsequent correction, the second relative coordinate relating to the predetermined processing object calculated by the second coordinate calculating means and the second relative relating to the predetermined processing object stored in the second storage means. The position of the table is corrected based on the coordinates, and the second relative coordinates related to the other processing object stored in the second storage means and the second relative coordinates related to the other processing object. A deviation in a laser processing apparatus, wherein a correction value is added to a control amount of a galvano scanner for irradiating the other processing object with the laser beam based on a coordinate and a movement amount by correcting the position of the table. Correction method.

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