TW201704331A - Metal hybrid resin and manufacturing method thereof - Google Patents
Metal hybrid resin and manufacturing method thereof Download PDFInfo
- Publication number
- TW201704331A TW201704331A TW105105365A TW105105365A TW201704331A TW 201704331 A TW201704331 A TW 201704331A TW 105105365 A TW105105365 A TW 105105365A TW 105105365 A TW105105365 A TW 105105365A TW 201704331 A TW201704331 A TW 201704331A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- resin
- phenol resin
- mixed resin
- atom
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 177
- 239000002184 metal Substances 0.000 title claims abstract description 177
- 229920005989 resin Polymers 0.000 title claims abstract description 93
- 239000011347 resin Substances 0.000 title claims abstract description 93
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000005011 phenolic resin Substances 0.000 claims abstract description 114
- 239000002923 metal particle Substances 0.000 claims abstract description 48
- 125000004429 atom Chemical group 0.000 claims abstract description 44
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 27
- 150000003839 salts Chemical class 0.000 claims description 44
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 35
- 239000002245 particle Substances 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 14
- 125000003172 aldehyde group Chemical group 0.000 claims description 14
- 239000011575 calcium Substances 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 239000011777 magnesium Substances 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 239000004332 silver Substances 0.000 claims description 13
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 229910052791 calcium Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 229910052749 magnesium Inorganic materials 0.000 claims description 8
- 238000006722 reduction reaction Methods 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 6
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 239000000463 material Substances 0.000 description 36
- 239000000805 composite resin Substances 0.000 description 25
- -1 alkyl aldehydes Chemical class 0.000 description 24
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 21
- 239000000243 solution Substances 0.000 description 18
- 239000011572 manganese Substances 0.000 description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 14
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 13
- 239000002904 solvent Substances 0.000 description 12
- 150000001299 aldehydes Chemical class 0.000 description 11
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- IAVREABSGIHHMO-UHFFFAOYSA-N 3-hydroxybenzaldehyde Chemical compound OC1=CC=CC(C=O)=C1 IAVREABSGIHHMO-UHFFFAOYSA-N 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000002131 composite material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 230000005484 gravity Effects 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 229910052727 yttrium Inorganic materials 0.000 description 7
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229920003987 resole Polymers 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 229930040373 Paraformaldehyde Natural products 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- 229910001961 silver nitrate Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 150000001450 anions Chemical class 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 4
- 229920002866 paraformaldehyde Polymers 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical class CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 3
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- QMMFVYPAHWMCMS-UHFFFAOYSA-N Dimethyl sulfide Chemical compound CSC QMMFVYPAHWMCMS-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 239000010955 niobium Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 3
- 235000013824 polyphenols Nutrition 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 2
- NTDQQZYCCIDJRK-UHFFFAOYSA-N 4-octylphenol Chemical compound CCCCCCCCC1=CC=C(O)C=C1 NTDQQZYCCIDJRK-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- YGCFIWIQZPHFLU-UHFFFAOYSA-N acesulfame Chemical compound CC1=CC(=O)NS(=O)(=O)O1 YGCFIWIQZPHFLU-UHFFFAOYSA-N 0.000 description 2
- 229960005164 acesulfame Drugs 0.000 description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 150000003934 aromatic aldehydes Chemical class 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- LJSQFQKUNVCTIA-UHFFFAOYSA-N diethyl sulfide Chemical compound CCSCC LJSQFQKUNVCTIA-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004312 hexamethylene tetramine Substances 0.000 description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 125000000468 ketone group Chemical group 0.000 description 2
- 239000011254 layer-forming composition Substances 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- YIXJRHPUWRPCBB-UHFFFAOYSA-N magnesium nitrate Chemical compound [Mg+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O YIXJRHPUWRPCBB-UHFFFAOYSA-N 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- BQJCRHHNABKAKU-KBQPJGBKSA-N morphine Chemical compound O([C@H]1[C@H](C=C[C@H]23)O)C4=C5[C@@]12CCN(C)[C@@H]3CC5=CC=C4O BQJCRHHNABKAKU-KBQPJGBKSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- HFFLGKNGCAIQMO-UHFFFAOYSA-N trichloroacetaldehyde Chemical compound ClC(Cl)(Cl)C=O HFFLGKNGCAIQMO-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 2
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical group C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- LHNRHYOMDUJLLM-UHFFFAOYSA-N 1-hexylsulfanylhexane Chemical compound CCCCCCSCCCCCC LHNRHYOMDUJLLM-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- PXSSNPBEHHJLDH-UHFFFAOYSA-N 2,3,4,5-tetramethylphenol Chemical class CC1=CC(O)=C(C)C(C)=C1C PXSSNPBEHHJLDH-UHFFFAOYSA-N 0.000 description 1
- UFBJCMHMOXMLKC-UHFFFAOYSA-N 2,4-dinitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O UFBJCMHMOXMLKC-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical compound OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- 229940093475 2-ethoxyethanol Drugs 0.000 description 1
- HFHFGHLXUCOHLN-UHFFFAOYSA-N 2-fluorophenol Chemical compound OC1=CC=CC=C1F HFHFGHLXUCOHLN-UHFFFAOYSA-N 0.000 description 1
- KQDJTBPASNJQFQ-UHFFFAOYSA-N 2-iodophenol Chemical compound OC1=CC=CC=C1I KQDJTBPASNJQFQ-UHFFFAOYSA-N 0.000 description 1
- CRBJBYGJVIBWIY-UHFFFAOYSA-N 2-isopropylphenol Chemical compound CC(C)C1=CC=CC=C1O CRBJBYGJVIBWIY-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- IQUPABOKLQSFBK-UHFFFAOYSA-N 2-nitrophenol Chemical compound OC1=CC=CC=C1[N+]([O-])=O IQUPABOKLQSFBK-UHFFFAOYSA-N 0.000 description 1
- QRQVZZMTKYXEKC-UHFFFAOYSA-N 3-(3-hydroxypropylsulfanyl)propan-1-ol Chemical compound OCCCSCCCO QRQVZZMTKYXEKC-UHFFFAOYSA-N 0.000 description 1
- GHCKBYSPHMLMEL-UHFFFAOYSA-N 3-butoxy-1-(2-hydroxyethylsulfanyl)propan-1-ol Chemical compound CCCCOCCC(O)SCCO GHCKBYSPHMLMEL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 1
- 229930188104 Alkylresorcinol Natural products 0.000 description 1
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Natural products OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- YDNKGFDKKRUKPY-JHOUSYSJSA-N C16 ceramide Natural products CCCCCCCCCCCCCCCC(=O)N[C@@H](CO)[C@H](O)C=CCCCCCCCCCCCCC YDNKGFDKKRUKPY-JHOUSYSJSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- HTIRHQRTDBPHNZ-UHFFFAOYSA-N Dibutyl sulfide Chemical compound CCCCSCCCC HTIRHQRTDBPHNZ-UHFFFAOYSA-N 0.000 description 1
- ZERULLAPCVRMCO-UHFFFAOYSA-N Dipropyl sulfide Chemical compound CCCSCCC ZERULLAPCVRMCO-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical group OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- XOBKSJJDNFUZPF-UHFFFAOYSA-N Methoxyethane Chemical compound CCOC XOBKSJJDNFUZPF-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-L Oxalate Chemical compound [O-]C(=O)C([O-])=O MUBZPKHOEPUJKR-UHFFFAOYSA-L 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- FUPQFCIVXRRLIO-UHFFFAOYSA-N benzaldehyde;2-hydroxybenzaldehyde Chemical compound O=CC1=CC=CC=C1.OC1=CC=CC=C1C=O FUPQFCIVXRRLIO-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 229940006460 bromide ion Drugs 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229940106189 ceramide Drugs 0.000 description 1
- ZVEQCJWYRWKARO-UHFFFAOYSA-N ceramide Natural products CCCCCCCCCCCCCCC(O)C(=O)NC(CO)C(O)C=CCCC=C(C)CCCCCCCCC ZVEQCJWYRWKARO-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- VEVZSMAEJFVWIL-UHFFFAOYSA-O cyanidin Natural products [O+]=1C2=CC(O)=CC(O)=C2C=C(O)C=1C1=CC=C(O)C(O)=C1 VEVZSMAEJFVWIL-UHFFFAOYSA-O 0.000 description 1
- 235000007336 cyanidin Nutrition 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- AEHWKBXBXYNPCX-UHFFFAOYSA-N ethylsulfanylbenzene Chemical compound CCSC1=CC=CC=C1 AEHWKBXBXYNPCX-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000002783 friction material Substances 0.000 description 1
- VGVYRHYDNGFIGF-UHFFFAOYSA-N fumarin Chemical compound OC=1OC2=CC=CC=C2C(=O)C=1C(CC(=O)C)C1=CC=CO1 VGVYRHYDNGFIGF-UHFFFAOYSA-N 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910001376 inorganic hypophosphite Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-M iodide Chemical compound [I-] XMBWDFGMSWQBCA-UHFFFAOYSA-M 0.000 description 1
- 229940006461 iodide ion Drugs 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000358 iron sulfate Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- MVFCKEFYUDZOCX-UHFFFAOYSA-N iron(2+);dinitrate Chemical compound [Fe+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MVFCKEFYUDZOCX-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- TYQCGQRIZGCHNB-JLAZNSOCSA-N l-ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(O)=C(O)C1=O TYQCGQRIZGCHNB-JLAZNSOCSA-N 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229960005181 morphine Drugs 0.000 description 1
- ULWOJODHECIZAU-UHFFFAOYSA-N n,n-diethylpropan-2-amine Chemical compound CCN(CC)C(C)C ULWOJODHECIZAU-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- VVGIYYKRAMHVLU-UHFFFAOYSA-N newbouldiamide Natural products CCCCCCCCCCCCCCCCCCCC(O)C(O)C(O)C(CO)NC(=O)CCCCCCCCCCCCCCCCC VVGIYYKRAMHVLU-UHFFFAOYSA-N 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- BTFQKIATRPGRBS-UHFFFAOYSA-N o-tolualdehyde Chemical compound CC1=CC=CC=C1C=O BTFQKIATRPGRBS-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- NRZWYNLTFLDQQX-UHFFFAOYSA-N p-tert-Amylphenol Chemical compound CCC(C)(C)C1=CC=C(O)C=C1 NRZWYNLTFLDQQX-UHFFFAOYSA-N 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Chemical compound [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229940100595 phenylacetaldehyde Drugs 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- NAYYNDKKHOIIOD-UHFFFAOYSA-N phthalamide Chemical compound NC(=O)C1=CC=CC=C1C(N)=O NAYYNDKKHOIIOD-UHFFFAOYSA-N 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- PBDKKYFZLPVGMK-UHFFFAOYSA-N prop-2-enal;prop-1-ene Chemical compound CC=C.C=CC=O PBDKKYFZLPVGMK-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- GPTFURBXHJWNHR-UHFFFAOYSA-N protopine acetate Natural products C1=C2C(=O)CC3=CC=C4OCOC4=C3CN(C)CCC2=CC2=C1OCO2 GPTFURBXHJWNHR-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 1
- 229940071536 silver acetate Drugs 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229940029273 trichloroacetaldehyde Drugs 0.000 description 1
- 229950002929 trinitrophenol Drugs 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
本發明係關於一種金屬混合樹脂及其製造方法。 The present invention relates to a metal mixed resin and a method of producing the same.
習知,嘗試藉由將金屬粒子摻合於樹脂材料,而向樹脂材料賦予金屬粒子特有之性質。所謂該金屬粒子特有之性質,例如可列舉:導電性、或機械強度之高低等。 Conventionally, it has been attempted to impart a characteristic property of metal particles to a resin material by blending metal particles with a resin material. The properties peculiar to the metal particles include, for example, conductivity or mechanical strength.
作為與此相關之技術,已知有專利文獻1或專利文獻2所揭示之技術。 As a technique related to this, a technique disclosed in Patent Document 1 or Patent Document 2 is known.
於專利文獻1中揭示有以下技術:製備含有一次粒徑為1~300nm之導電性粒子、硬化性樹脂、分散劑及溶劑之印刷用接著層形成油墨,將其印刷於基板上,並進行硬化,藉此形成複合層中之接著劑層。認為根據該技術,可提高基板與配線層之接著性,而降低連接電阻。 Patent Document 1 discloses a technique of preparing an ink for forming an adhesive layer comprising conductive particles having a primary particle diameter of 1 to 300 nm, a curable resin, a dispersing agent, and a solvent, and printing the same on a substrate and hardening it. Thereby, an adhesive layer in the composite layer is formed. According to this technique, it is considered that the adhesion between the substrate and the wiring layer can be improved, and the connection resistance can be lowered.
又,於專利文獻2中揭示有一種組成物集合,其含有導體層形成用組成物及導電性接著劑組成物;其中,該導體層形成用組成物含有“含分散介質及金屬氧化物”之無機粒子;該導電性接著劑組成物含有黏合劑材料及數量平均粒徑為1nm~3000nm之導電性粒子;認為根據上述導 電性黏著劑組成物,可表現出表面存在導電性之基板與由含金屬粒子分散液所形成之導體層的高接著性,而確保導體層與基板之導通。 Further, Patent Document 2 discloses a composition set including a conductor layer forming composition and a conductive adhesive composition, wherein the conductor layer forming composition contains "containing a dispersion medium and a metal oxide". Inorganic particles; the conductive adhesive composition comprising a binder material and conductive particles having a number average particle diameter of 1 nm to 3000 nm; The electrical adhesive composition can exhibit high adhesion of a substrate having conductivity on the surface and a conductor layer formed of a dispersion containing metal particles, and ensure conduction between the conductor layer and the substrate.
專利文獻1:日本特開2013-175559號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2013-175559
專利文獻2:國際公開第2013/018777號公報 Patent Document 2: International Publication No. 2013/018777
然而,本發明人等進行研究,結果已知存在如以下之課題。 However, the inventors of the present invention conducted research and found that the following problems exist.
即,於專利文獻1或專利文獻2所記載之技術中,雖然摻合金屬粒子與樹脂材料,但對於作為無機材料之金屬粒子與作為有機材料之樹脂材料而言,各自所具有之性質背離,而於金屬粒子之分散性之方面殘留課題。 In the technique described in Patent Document 1 or Patent Document 2, the metal particles and the resin material are blended, but the properties of the metal particles as the inorganic material and the resin material as the organic material are different from each other. On the other hand, there is a problem in the dispersion of metal particles.
此處,若分散性不充分,則例如有以下之顧慮:自外部向金屬粒子與樹脂材料之複合材料施加機械力時,自金屬粒子與樹脂材料之界面產生龜裂。 Here, when the dispersibility is insufficient, for example, when a mechanical force is applied from the outside to the composite material of the metal particles and the resin material, cracks are generated from the interface between the metal particles and the resin material.
本發明係鑒於如上述之課題而完成者,提供一種可將金屬粒子均勻地分散於樹脂,而表現出較高之機械強度之金屬樹脂複合材料。 The present invention has been made in view of the above problems, and provides a metal resin composite material which can uniformly disperse metal particles in a resin and exhibit high mechanical strength.
根據本發明,提供一種金屬混合樹脂,其含有以下之成分:(A)酚樹脂;與(B)金屬粒子,其由與上述酚樹脂中之氧原子配位之金屬原子所構成。 According to the present invention, there is provided a metal mixed resin comprising the following components: (A) a phenol resin; and (B) a metal particle composed of a metal atom coordinated to an oxygen atom in the above phenol resin.
又,根據本發明,提供一種金屬混合樹脂之製造方法,其包括如下步驟:(a)準備(A)酚樹脂之步驟; (b)準備(B')金屬鹽之溶液之步驟;及(c)混合上述(A)酚樹脂與上述(B')金屬鹽之溶液,使金屬原子與上述(A)酚樹脂中之氧原子進行配位,而獲得金屬混合樹脂之步驟。 Further, according to the present invention, there is provided a method for producing a metal mixed resin comprising the steps of: (a) preparing (A) a phenol resin; (b) a step of preparing a solution of the (B') metal salt; and (c) mixing a solution of the above (A) phenol resin and the above (B') metal salt to cause a metal atom and the oxygen in the (A) phenol resin The atom is coordinated to obtain a metal mixed resin step.
本發明之特徵在於:含有酚樹脂、與金屬粒子之複合材料,且構成金屬粒子之金屬原子與酚樹脂中之氧原子配位。 The present invention is characterized in that it contains a phenol resin and a composite material with metal particles, and the metal atoms constituting the metal particles are coordinated to the oxygen atoms in the phenol resin.
藉此,可使金屬粒子與樹脂經由化學鍵而鍵結,而可使金屬粒子均勻地分散於樹脂,又可表現出較高之機械強度。 Thereby, the metal particles and the resin can be bonded via a chemical bond, and the metal particles can be uniformly dispersed in the resin, and the mechanical strength can be exhibited.
再者,關於「金屬混合樹脂(metal hybrid resin)」之名稱,係本發明人等所命名者,且係指如上述之金屬粒子與樹脂材料經由配位鍵而鍵結之新穎金屬樹脂複合材料。 In addition, the name "metal hybrid resin" is a name given to the present inventors, and refers to a novel metal resin composite material in which a metal particle and a resin material are bonded via a coordinate bond as described above. .
上述之目的、及其他目的、特徵及優點係藉由以下所述之較佳之實施形態、及隨附其之以下圖式而進一步明確。 The above and other objects, features and advantages of the present invention will become more apparent from
圖1係對藉由實施例1所得之金屬樹脂複合材料進行測定而獲得之Ag3d窄掃描圖譜(narrow scan spectrum)之圖。 Fig. 1 is a graph showing the Ag3d narrow scan spectrum obtained by measuring the metal-resin composite obtained in Example 1.
圖2係對利用Ar離子對Ag箔進行過清洗之試樣進行測定而獲得之Ag3d窄掃描圖譜之圖。 Fig. 2 is a view showing a narrow scan pattern of Ag3d obtained by measuring a sample in which Ag foil was washed with Ar ions.
圖3係表示針對藉由實施例1所得之金屬樹脂複合材料,利用穿透式電子顯微鏡(TEM)觀察表面而獲得之結果之照片圖。 Fig. 3 is a photographic view showing the results obtained by observing the surface by a transmission electron microscope (TEM) with respect to the metal-resin composite material obtained in Example 1.
以下,基於實施形態對本發明詳細地進行說明。再者,本說明書中,「~」只要無特別事先說明,則表示自以上至以下。 Hereinafter, the present invention will be described in detail based on the embodiments. In the present specification, "~" means from the above to the following unless otherwise specified.
[金屬混合樹脂] [Metal Mixed Resin]
首先,對本實施形態之金屬混合樹脂進行說明。 First, the metal mixed resin of the present embodiment will be described.
本實施形態之金屬混合樹脂係含有以下之成分(A)及(B)者。 The metal mixed resin of the present embodiment contains the following components (A) and (B).
(A)酚樹脂 (A) phenolic resin
(B)金屬粒子,其由與酚樹脂中之氧原子配位之金屬原子所構成 (B) a metal particle composed of a metal atom coordinated to an oxygen atom in a phenol resin
((A)酚樹脂) ((A) phenol resin)
用於本實施形態之金屬混合樹脂之酚樹脂只要針對用途等,自公知之酚樹脂中適當選擇即可。 The phenol resin used in the metal-mixed resin of the present embodiment may be appropriately selected from known phenol resins for use or the like.
作為該酚樹脂,例如可使用酚醛清漆型酚樹脂、可溶酚醛型酚樹脂、芳基伸烷基型酚樹脂等。 As the phenol resin, for example, a novolak type phenol resin, a resol type phenol resin, an aryl alkylene type phenol resin, or the like can be used.
酚醛清漆型酚樹脂例如可藉由使酚類與醛類於酸性觸媒中進行反應而獲得。 The novolac type phenol resin can be obtained, for example, by reacting a phenol with an aldehyde in an acidic catalyst.
作為用於製造酚醛清漆型酚樹脂時之酚類,例如可列舉:苯酚、苯甲酚、二甲苯酚、乙基苯酚、對苯基苯酚、對第三丁基苯酚、對第三戊基苯酚、對辛基苯酚、對壬基苯酚、對異丙苯基苯酚(p-cumylphenol)、雙酚A、雙酚F、間苯二酚、2-羥基苯甲醛、3-羥基苯甲醛、4-羥基苯甲醛或該等之衍生物等。再者,亦可將該等酚類單獨或併用2種以上而使用。 Examples of the phenol used in the production of the novolac type phenol resin include phenol, cresol, xylenol, ethylphenol, p-phenylphenol, p-tert-butylphenol, and p-tert-pentylphenol. , p-octylphenol, p-nonylphenol, p-cumylphenol, bisphenol A, bisphenol F, resorcinol, 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4- Hydroxybenzaldehyde or such derivatives and the like. In addition, these phenols may be used alone or in combination of two or more.
又,作為用於製造酚醛清漆型酚樹脂之醛類,例如可列舉:甲醛、乙醛、丙醛、丁醛等烷基醛;苯甲醛等芳香族醛;2-羥基苯甲醛、3-羥基苯甲醛、4-羥基苯甲醛等具有羥基苯酚之芳香族醛等。作為甲醛源,可 列舉:福馬林(水溶液)、多聚甲醛、醇類之半縮甲醛(hemiformal)、三烷等。再者,亦可將該等醛類單獨或併用2種以上而使用。 Further, examples of the aldehyde used for producing the novolac type phenol resin include alkyl aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, and butyraldehyde; aromatic aldehydes such as benzaldehyde; 2-hydroxybenzaldehyde and 3-hydroxyl groups; An aromatic aldehyde having a hydroxyphenol or the like such as benzaldehyde or 4-hydroxybenzaldehyde. As a source of formaldehyde, fumarin (aqueous solution), paraformaldehyde, hemiformal of alcohol, and three Alkane, etc. In addition, these aldehydes may be used alone or in combination of two or more.
於合成酚醛清漆型酚樹脂時,關於酚類與醛類之反應莫耳比率,通常相對於酚類1莫耳,醛類為0.3~1.7莫耳,較佳為0.5~1.5莫耳。 In the synthesis of a novolak-type phenol resin, the molar ratio of the reaction between the phenol and the aldehyde is usually from 0.3 to 1.7 mol, preferably from 0.5 to 1.5 mol, based on 1 mol of the phenol.
又,作為用於製造酚醛清漆型酚樹脂之酸性觸媒,例如可列舉:草酸、醋酸等有機羧酸;苯磺酸、對甲苯磺酸、甲磺酸等有機磺酸;1-羥基亞乙基-1,1'-二膦酸、2-膦酸基丁烷-1,2,4-三羧酸等有機膦酸、鹽酸、硫酸、磷酸等無機酸等。再者,亦可將該等酸性觸媒單獨或併用2種以上而使用。 Further, examples of the acidic catalyst for producing a novolac type phenol resin include organic carboxylic acids such as oxalic acid and acetic acid; organic sulfonic acids such as benzenesulfonic acid, p-toluenesulfonic acid and methanesulfonic acid; and 1-hydroxyethylidene An organic phosphonic acid such as keto-1,1'-diphosphonic acid or 2-phosphonobutane-1,2,4-tricarboxylic acid; an inorganic acid such as hydrochloric acid, sulfuric acid or phosphoric acid. In addition, these acidic catalysts may be used alone or in combination of two or more.
可溶酚醛型酚樹脂例如可藉由使酚類與醛類於鹼金屬或胺類、二價金屬鹽等觸媒之存在下進行反應而獲得。 The resol type phenol resin can be obtained, for example, by reacting a phenol with an aldehyde in the presence of a catalyst such as an alkali metal or an amine or a divalent metal salt.
作為用於製造可溶酚醛型酚樹脂之酚類,例如可列舉:苯酚、鄰甲酚、間甲酚、對甲酚等甲酚類;2,3-二甲苯酚、2,4-二甲苯酚、2,5-二甲苯酚、2,6-二甲苯酚、3,4-二甲苯酚、3,5-二甲苯酚等二甲苯酚類;鄰乙基苯酚、間乙基苯酚、對乙基苯酚等乙基苯酚類;異丙基苯酚、丁基苯酚、對第三丁基苯酚等丁基苯酚類;對第三戊基苯酚、對辛基苯酚、對壬基苯酚、對異丙苯基苯酚等烷酚類;氟苯酚、氯苯酚、溴苯酚、碘苯酚等鹵化酚類;對苯基苯酚、胺基苯酚、硝基苯酚、二硝基苯酚、三硝基苯酚等單酚取代體、及1-萘酚、2-萘酚等單酚類;間苯二酚、烷基間苯二酚、五倍子酚、鄰苯二酚、烷基鄰苯二酚、對苯二酚、烷基對苯二酚、間苯三酚、雙酚A、雙酚F、雙酚S、二羥基萘等多酚類;2-羥基苯甲醛、3-羥基苯甲醛、4-羥基苯甲醛等具有醛基之酚類或該等之衍生物等。再者,亦可將該等酚類 單獨或混合2種以上而使用。 Examples of the phenol used for producing the resol type phenol resin include cresols such as phenol, o-cresol, m-cresol, and p-cresol; 2,3-xylenol and 2,4-dimethyl Dimethylphenols such as phenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol; o-ethylphenol, m-ethylphenol, Ethylphenols such as ethyl phenol; butyl phenols such as isopropyl phenol, butyl phenol, p-tert-butylphenol; p-tert-butylphenol, p-octylphenol, p-nonylphenol, p-isopropyl Alkanols such as phenylphenol; halogenated phenols such as fluorophenol, chlorophenol, bromophenol, iodophenol; monophenolic substitutions such as p-phenylphenol, aminophenol, nitrophenol, dinitrophenol, trinitrophenol Monophenols such as 1-naphthol and 2-naphthol; resorcinol, alkyl resorcinol, gallic phenol, catechol, alkyl catechol, hydroquinone, alkane Polyphenols such as hydroquinone, phloroglucin, bisphenol A, bisphenol F, bisphenol S, dihydroxynaphthalene, etc.; 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4-hydroxybenzaldehyde, etc. Aldehyde-based phenols or derivatives thereof Things and so on. Furthermore, the phenols may also be used. It can be used individually or in mixture of 2 or more types.
又,作為用於製造可溶酚醛型酚樹脂之醛類,例如可列舉:甲醛、多聚甲醛、三烷、乙醛、丙醛、聚甲醛、三氯乙醛、六亞甲基四胺、糠醛、乙二醛、正丁醛、己醛、丙烯醛(allyl aldehyde)、苯甲醛、巴豆醛、丙烯醛(acrolein)、四甲醛、苯乙醛、鄰甲苯甲醛、2-羥基苯甲醛、3-羥基苯甲醛、4-羥基苯甲醛等。亦可將該等醛類單獨或組合2種以上使用。再者,該等醛類中,就反應性優異、廉價之觀點而言,較佳為選用甲醛、多聚甲醛。 Further, examples of the aldehyde used for producing the resol type phenol resin include formaldehyde, paraformaldehyde, and trisole. Alkane, acetaldehyde, propionaldehyde, polyoxymethylene, trichloroacetaldehyde, hexamethylenetetramine, furfural, glyoxal, n-butyraldehyde, hexanal, allyl aldehyde, benzaldehyde, crotonaldehyde, propylene Acrolein, tetraformaldehyde, phenylacetaldehyde, o-tolualdehyde, 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4-hydroxybenzaldehyde, and the like. These aldehydes may be used alone or in combination of two or more. Further, among these aldehydes, formaldehyde and paraformaldehyde are preferably used from the viewpoint of excellent reactivity and low cost.
又,作為用於製造可溶酚醛型酚樹脂之觸媒,例如可列舉:氫氧化鈉、氫氧化鋰、氫氧化鉀等鹼金屬之氫氧化物;鈣、鎂、鋇等鹼土金屬之氧化物及氫氧化物;碳酸鈉、氨水、三乙基胺、六亞甲基四胺等胺類;醋酸鎂或醋酸鋅等二價金屬鹽等。該等觸媒可單獨使用或併用2種以上。 Further, examples of the catalyst for producing the resol type phenol resin include hydroxides of alkali metals such as sodium hydroxide, lithium hydroxide, and potassium hydroxide; and oxides of alkaline earth metals such as calcium, magnesium, and barium. And hydroxide; amines such as sodium carbonate, ammonia, triethylamine, hexamethylenetetramine; divalent metal salts such as magnesium acetate or zinc acetate. These catalysts may be used alone or in combination of two or more.
再者,製造可溶酚醛型酚樹脂時,作為酚類與醛類之反應莫耳比,較佳為相對於酚類1莫耳,醛類為0.80~2.50莫耳,進而較佳為醛類為1.00~2.30莫耳。 Further, when the resol type phenol resin is produced, the molar ratio of the reaction between the phenol and the aldehyde is preferably from 0.80 to 2.50 moles, more preferably from the phenol, to the aldehyde. It is 1.00~2.30 Mo.
芳基伸烷基型酚樹脂係表示於重複單位中具有一個以上之芳基伸烷基之酚樹脂。作為此種芳基伸烷基型酚樹脂,例如可列舉:二甲苯基型酚樹脂、聯苯二亞甲基型酚樹脂等。 The arylalkylene type phenol resin is a phenol resin having one or more arylalkylene groups in a repeating unit. Examples of such an arylalkylene-type phenol resin include a xylyl phenol resin and a biphenyl dimethylene phenol resin.
此種芳基伸烷基型酚樹脂之製造方法可根據公知方法而進行,且使用如上述之酚類作為原料即可。 The method for producing such an arylalkylene type phenol resin can be carried out according to a known method, and a phenol such as the above can be used as a raw material.
本實施形態之金屬混合樹脂具備如下特徵:構成後述之金屬 粒子之金屬原子與酚樹脂中之氧原子配位。此處,配位之氧原子並不限定於酚樹脂所具備之酚性羥基,亦可為源自其以外之官能基之氧原子,如上述般源自各種官能基之氧原子與金屬粒子發生交互作用,藉此可更為提高金屬粒子與酚樹脂之密合性。 The metal mixed resin of the present embodiment is characterized in that it constitutes a metal to be described later. The metal atom of the particle coordinates with the oxygen atom in the phenol resin. Here, the oxygen atom to be coordinated is not limited to the phenolic hydroxyl group of the phenol resin, and may be an oxygen atom derived from a functional group other than the above, and the oxygen atom and the metal particle derived from various functional groups are generated as described above. The interaction can thereby improve the adhesion of the metal particles to the phenol resin.
更具體而言,較佳為使用分子內具有脂肪族醇基之酚樹脂、分子內具有醚基之酚樹脂、分子內具有酮基之酚樹脂、分子內具有醛基之酚樹脂、分子內具有羧基之酚樹脂、分子內具有酯基之酚樹脂、分子內具有胺酯(urethane)基之酚樹脂作為酚樹脂。 More specifically, it is preferred to use a phenol resin having an aliphatic alcohol group in the molecule, a phenol resin having an ether group in the molecule, a phenol resin having a ketone group in the molecule, a phenol resin having an aldehyde group in the molecule, and having intramolecular A phenol resin having a carboxyl group, a phenol resin having an ester group in the molecule, and a phenol resin having an urethane group in the molecule are used as the phenol resin.
該等中,較佳為使用分子內具有酮基或醛基、羧基、酯基、胺酯基之類的羰基部位(羰基)之酚樹脂。 Among these, a phenol resin having a carbonyl moiety (carbonyl group) such as a ketone group or an aldehyde group, a carboxyl group, an ester group or an amine ester group in the molecule is preferably used.
藉由以上述方式進行,金屬原子可不僅與酚樹脂中之酚性羥基之氧原子配位,亦可一部分與羰基之氧原子配位。藉此,可更進一步提高金屬原子與酚樹脂之密合性。 By carrying out in the above manner, the metal atom may not only coordinate with the oxygen atom of the phenolic hydroxyl group in the phenol resin, but may also partially coordinate with the oxygen atom of the carbonyl group. Thereby, the adhesion between the metal atom and the phenol resin can be further improved.
再者,製造此種分子內具有羰基之酚樹脂時,關於先前列舉之酚類,只要使用分子內具有對應之官能基者作為原料即可。 In the case of producing a phenol resin having a carbonyl group in the molecule, the phenols listed above may be used as a raw material by using a functional group having a corresponding molecule in the molecule.
又,於使用分子內具有醛基之酚樹脂之情形時,亦有「變得容易製造金屬混合樹脂」此一優點。 Further, in the case of using a phenol resin having an aldehyde group in the molecule, there is also an advantage that "it becomes easy to produce a metal mixed resin".
即,如下所述,本實施形態中之金屬混合樹脂係將金屬鹽之溶液與酚樹脂進行混合,並使金屬原子與酚樹脂中之氧原子配位者,但於使用分子內具有醛基之酚樹脂作為金屬混合樹脂之原料之情形時,該醛基對構成金屬鹽之金屬陽離子帶來還原作用。又,藉由採用該條件,而有如下優點:變得容易使金屬原子與酚樹脂中之氧原子配位。 That is, as described below, in the metal mixed resin of the present embodiment, the solution of the metal salt is mixed with the phenol resin, and the metal atom is coordinated with the oxygen atom in the phenol resin, but the aldehyde group is used in the molecule. In the case where the phenol resin is used as a raw material of the metal mixed resin, the aldehyde group brings a reduction action to the metal cation constituting the metal salt. Further, by adopting this condition, there is an advantage in that it is easy to coordinate the metal atom with the oxygen atom in the phenol resin.
關於此種分子內具有醛基之酚樹脂,例如作為用於製造酚樹脂時之酚類,例如使用2-羥基苯甲醛、3-羥基苯甲醛、4-羥基苯甲醛之類的羥基苯甲醛或其衍生物即可。 The phenol resin having an aldehyde group in such a molecule, for example, as a phenol used in the production of a phenol resin, for example, hydroxybenzaldehyde such as 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde or 4-hydroxybenzaldehyde or Its derivatives can be.
藉由依據酚樹脂之公知之製造方法對該酚類進行轉換反應,而可製作所需之酚樹脂。 The phenol resin can be produced by a conversion reaction of the phenol according to a known production method of a phenol resin.
本實施形態之酚樹脂之數量平均分子量(Mn)可依據應用金屬混合樹脂之用途而適當設定,例如為150以上,較佳為200以上,更佳為250以上。 The number average molecular weight (Mn) of the phenol resin of the present embodiment can be appropriately set depending on the application of the metal mixed resin, and is, for example, 150 or more, preferably 200 or more, and more preferably 250 or more.
又,本實施形態之酚樹脂之數量平均分子量(Mn)例如為1500以下,較佳為1200以下,更佳為1000以下。 Further, the number average molecular weight (Mn) of the phenol resin of the present embodiment is, for example, 1,500 or less, preferably 1200 or less, more preferably 1,000 or less.
藉由設定為上述範圍,可賦予作為樹脂成分之適度靈活性。 By setting it as the said range, it can provide moderate flexibility as a resin component.
本實施形態之酚樹脂之重量平均分子量(Mw)可依據應用金屬混合樹脂之用途而適當設定,例如為200以上,較佳為300以上,更佳為400以上。 The weight average molecular weight (Mw) of the phenol resin of the present embodiment can be appropriately set depending on the application of the metal mixed resin, and is, for example, 200 or more, preferably 300 or more, and more preferably 400 or more.
又,本實施形態之酚樹脂之重量平均分子量(Mw)例如為2500以下,較佳為2000以下,更佳為1800以下。 Further, the weight average molecular weight (Mw) of the phenol resin of the present embodiment is, for example, 2,500 or less, preferably 2,000 or less, more preferably 1,800 or less.
藉由設定為上述範圍,可賦予作為樹脂成分之適度靈活性。 By setting it as the said range, it can provide moderate flexibility as a resin component.
又,本實施形態之酚樹脂之重量平均分子量相對於數量平均分子量之比(Mw/Mn)可依據該用途而適當設定,例如,作為上限值為2.5以下,較佳為2.2以下,更佳為2.0以下。藉由以上述方式進行設定,而變得容易表現出金屬混合樹脂所固有之性質。 Further, the ratio (Mw/Mn) of the weight average molecular weight to the number average molecular weight of the phenol resin of the present embodiment can be appropriately set depending on the use, and for example, the upper limit is 2.5 or less, preferably 2.2 or less, more preferably It is 2.0 or less. By setting in the above manner, it becomes easy to express the properties inherent to the metal mixed resin.
又,本實施形態之酚樹脂之重量平均分子量相對於數量平均分子量之 比(Mw/Mn)的下限值並無特別限定,例如為1.05以上。 Further, the weight average molecular weight of the phenol resin of the present embodiment is relative to the number average molecular weight The lower limit of the ratio (Mw/Mn) is not particularly limited, and is, for example, 1.05 or more.
再者,於本實施形態中,於製造金屬混合樹脂之階段中,由於進行化學反應,故而用作原料之酚樹脂、與金屬混合樹脂所含之酚樹脂有時分子量等未必一致。 Further, in the present embodiment, in the stage of producing the metal mixed resin, the phenol resin used as the raw material and the phenol resin contained in the metal mixed resin may not necessarily have the same molecular weight and the like due to the chemical reaction.
即,於製造金屬混合樹脂時,於考慮其製造條件之基礎上,事先以金屬混合樹脂所含之酚樹脂成為上述分子量範圍之方式設定成為原料之酚樹脂之分子量之情況可謂較佳之態樣。 In other words, in the case of producing a metal mixed resin, it is preferable to set the molecular weight of the phenol resin to be a raw material in such a manner that the phenol resin contained in the metal mixed resin is in the above molecular weight range in consideration of the production conditions.
本實施形態之酚樹脂相對於金屬混合樹脂整體較佳為包含10質量%以上,更佳為包含15質量%以上,進而較佳為包含20質量%以上。藉此,可謀求作為複合材料之適度可撓性之賦予、或加工性之提高。 The phenol resin of the present embodiment is preferably contained in an amount of 10% by mass or more, more preferably 15% by mass or more, and still more preferably 20% by mass or more based on the total amount of the metal mixed resin. Thereby, it is possible to provide an appropriate degree of flexibility or improvement in workability as a composite material.
又,本實施形態之酚樹脂相對於金屬混合樹脂整體較佳為含有99質量%以下,更佳為含有95質量%以下,進而較佳為含有90質量%以下。藉此,可提高源自金屬粒子之機械強度之表現程度。 In addition, the phenol resin of the present embodiment is preferably contained in an amount of 99% by mass or less, more preferably 95% by mass or less, and still more preferably 90% by mass or less based on the total amount of the metal mixed resin. Thereby, the degree of expression of the mechanical strength derived from the metal particles can be improved.
((B)由與酚樹脂中之氧原子配位之金屬原子所構成之金屬粒子) ((B) a metal particle composed of a metal atom coordinated to an oxygen atom in a phenol resin)
本實施形態之金屬混合樹脂含有「由與酚樹脂中之氧原子配位之金屬原子所構成」之金屬粒子。即,由於構成金屬粒子之金屬原子為與酚樹脂中之氧原子配位者,故而可使金屬粒子與酚樹脂之密合性較習知存在之複合材料更為增加。 The metal mixed resin of the present embodiment contains metal particles "consisting of a metal atom coordinated to an oxygen atom in a phenol resin". That is, since the metal atom constituting the metal particle is coordinated to the oxygen atom in the phenol resin, the adhesion between the metal particle and the phenol resin can be increased more than the conventional composite material.
此處,所謂「與氧原子配位」,更具體而言,係指氧原子(於此處稱為「O」)與金屬原子(於此處稱為「M」)化學連結為O-M鍵。 Here, "coordination with an oxygen atom" means, more specifically, an oxygen atom (herein referred to as "O") and a metal atom (herein referred to as "M") chemically linked to an O-M bond.
更具體而言,係指如下情況:於X射線光電子光譜法(ESCA(EIectron Spectroscopy for Chemical Analysis))中,對金屬粒子與樹脂之複合材料進行分析時,觀察到上述O-M鍵。 More specifically, it refers to the following situation: X-ray photoelectron spectroscopy (ESCA (EIectron) In the Spectroscopy for Chemical Analysis)), when the composite material of the metal particles and the resin was analyzed, the above O-M bond was observed.
構成本實施形態之金屬混合樹脂所含之金屬粒子之金屬原子可依據應用該金屬混合樹脂之用途而適當選擇。 The metal atom constituting the metal particles contained in the metal mixed resin of the present embodiment can be appropriately selected depending on the use of the metal mixed resin.
更具體而言,可採用選自由銀(Ag)、銅(Cu)、鋅(Zn)、鈣(Ca)、鐵(Fe)、鋁(Al)、鎂(Mg)、鈦(Ti)、鈧(Sc)、釩(V)、鉻(Cr)、錳(Mn)、鈷(Co)、鎳(Ni)、鎵(Ga)、鍶(Sr)、釔(Y)、鈮(Nb)、鉬(Mo)、釕(Ru)、鈀(Pd)、鎘(Cd)、鋇(Ba)、鑭(La)、鈰(Ce)、鐠(Pr)、釹(Nd)、鉕(Pm)、釤(Sm)、銪(Eu)、釓(Gd)、鋱(Tb)、鏑(Dy)、鈥(Ho)、鉺(Er)、銩(Tm)、鐿(Yb)、鑥(Lu)、鉿(Hf)、鉭(Ta)、鎢(W)、錸(Re)、鋨(Os)、銥(Ir)、鉑(Pt)及金(Au)所組成之群中之1種或2種以上之金屬原子。 More specifically, it may be selected from the group consisting of silver (Ag), copper (Cu), zinc (Zn), calcium (Ca), iron (Fe), aluminum (Al), magnesium (Mg), titanium (Ti), and antimony. (Sc), vanadium (V), chromium (Cr), manganese (Mn), cobalt (Co), nickel (Ni), gallium (Ga), antimony (Sr), antimony (Y), antimony (Nb), molybdenum (Mo), ruthenium (Ru), palladium (Pd), cadmium (Cd), barium (Ba), lanthanum (La), cerium (Ce), cerium (Pr), yttrium (Nd), yttrium (Pm), yttrium (Sm), 铕 (Eu), 釓 (Gd), 鋱 (Tb), 镝 (Dy), 鈥 (Ho), 铒 (Er), 銩 (Tm), 镱 (Yb), 鑥 (Lu), 铪One or more of the group consisting of (Hf), tantalum (Ta), tungsten (W), yttrium (Re), yttrium (Os), yttrium (Ir), platinum (Pt), and gold (Au) The metal atom.
該等中,就金屬混合樹脂之製造容易性、又應用領域之廣泛性而言,較佳為金屬原子為選自由銀(Ag)、銅(Cu)、鋅(Zn)、鈣(Ca)、鐵(Fe)、鋁(Al)、鎂(Mg)所組成之群中之1或2以上之金屬原子。 In the above, in terms of ease of production of the metal mixed resin and wide range of applications, the metal atom is preferably selected from the group consisting of silver (Ag), copper (Cu), zinc (Zn), and calcium (Ca). One or more metal atoms of the group consisting of iron (Fe), aluminum (Al), and magnesium (Mg).
本實施形態之金屬混合樹脂中所含之金屬粒子通常大部分為「0價」之金屬原子,但亦可一部分混合存在具有陽離子性之金屬離子。該金屬離子與酚樹脂之交互作用亦相輔相成,而可謀求機械強度之進一步提高。 The metal particles contained in the metal mixed resin of the present embodiment are usually a "zero-valent" metal atom, but a cationic metal ion may be partially mixed. The interaction between the metal ion and the phenol resin also complements each other, and further improvement in mechanical strength can be achieved.
本實施形態之金屬粒子之平均粒徑之下限值可視使用用途等而適當設定,例如為1nm以上,較佳為3nm以上,進而較佳為5nm以上。藉由以上述方式進行設定,而變得容易表現出所需之機械強度。 The lower limit of the average particle diameter of the metal particles of the present embodiment can be appropriately set, for example, 1 nm or more, preferably 3 nm or more, and more preferably 5 nm or more. By setting in the above manner, it becomes easy to express the required mechanical strength.
又,本實施形態之金屬粒子之平均粒徑之上限值可視使用用途等而適當設定,例如為1μm以下,較佳為600nm以下,更佳為300nm以下,進而較佳為150nm以下,進而更佳為100nm以下、尤佳為50nm以下。藉由以上述方式進行設定,可提高對酚樹脂之分散性。 In addition, the upper limit of the average particle diameter of the metal particles of the present embodiment can be appropriately set, for example, 1 μm or less, preferably 600 nm or less, more preferably 300 nm or less, still more preferably 150 nm or less, and further preferably 150 nm or less. It is preferably 100 nm or less, and particularly preferably 50 nm or less. By setting in the above manner, the dispersibility to the phenol resin can be improved.
再者,金屬混合樹脂中之金屬粒子之粒徑例如可藉由利用穿透式電子顯微鏡(TEM)進行觀察而決定。 Further, the particle diameter of the metal particles in the metal mixed resin can be determined, for example, by observation using a transmission electron microscope (TEM).
更具體而言,可利用穿透式電子顯微鏡(TEM)觀察金屬混合樹脂之表面,對任意選擇之100個金屬粒子之粒徑進行測定,將該平均值設為金屬粒子之平均粒徑。 More specifically, the surface of the metal mixed resin can be observed by a transmission electron microscope (TEM), and the particle diameter of arbitrarily selected 100 metal particles can be measured, and the average value is defined as the average particle diameter of the metal particles.
本實施形態之金屬粒子相對於金屬混合樹脂整體較佳為含有1質量%以上,更佳為含有3質量%以上,進而較佳為含有5質量%以上。藉此,可表現出金屬粒子固有之性能。 The metal particles of the present embodiment are preferably contained in an amount of 1% by mass or more, more preferably 3% by mass or more, and still more preferably 5% by mass or more based on the total amount of the metal mixed resin. Thereby, the inherent properties of the metal particles can be exhibited.
又,本實施形態之金屬粒子相對於金屬混合樹脂整體較佳為含有85質量%以下,更佳為含有75質量%以下,進而較佳為含有65質量%以下。藉此,可抑制作為金屬混合樹脂整體之比重,而可擴大應用之範圍。 In addition, the metal particles of the present embodiment are preferably contained in an amount of 85% by mass or less, more preferably 75% by mass or less, and still more preferably 65% by mass or less based on the total amount of the metal mixed resin. Thereby, the specific gravity of the entire metal mixed resin can be suppressed, and the range of application can be expanded.
(其他成分) (other ingredients)
又,本實施形態之金屬混合樹脂除上述之酚樹脂以外,亦可為了改善樹脂特性而摻合公知之樹脂材料。 Further, in addition to the above-described phenol resin, the metal mixed resin of the present embodiment may be blended with a known resin material in order to improve the resin properties.
又,亦可視需要而摻合通常之金屬樹脂複合材料所使用之各種添加劑,例如硬脂酸、硬脂酸鈣、或聚乙烯等脫模劑;氫氧化鈣等難燃劑;碳黑等著色劑;偶合劑;溶劑等。 Further, various additives used in a usual metal resin composite material may be blended as needed, such as a release agent such as stearic acid, calcium stearate or polyethylene; a flame retardant such as calcium hydroxide; and coloring such as carbon black Agent; coupling agent; solvent, etc.
本實施形態之金屬混合樹脂之比重可根據使用用途而適當 設定,作為該比重之下限值,例如為1.25g/cm3以上,較佳為1.27g/cm3以上,更佳為1.30g/cm3以上。 The specific gravity of the metal-mixed resin of the present embodiment can be appropriately set depending on the intended use, and the lower limit of the specific gravity is, for example, 1.25 g/cm 3 or more, preferably 1.27 g/cm 3 or more, and more preferably 1.30 g/ Cm 3 or more.
本實施形態之金屬混合樹脂之比重可根據使用用途而適當設定,作為該比重之上限,例如為16.6g/cm3以下,較佳為16.0g/cm3以下,更佳為15.5g/cm3以下。 The specific gravity of the metal mixed resin of the present embodiment can be appropriately set depending on the intended use, and the upper limit of the specific gravity is, for example, 16.6 g/cm 3 or less, preferably 16.0 g/cm 3 or less, and more preferably 15.5 g/cm 3 . the following.
[金屬混合樹脂之製造方法] [Manufacturing method of metal mixed resin]
繼而,對本實施形態之金屬混合樹脂之製造方法進行說明。 Next, a method of producing the metal mixed resin of the present embodiment will be described.
本實施形態之金屬混合樹脂之製造方法係包含以下步驟者。 The method for producing a metal mixed resin of the present embodiment includes the following steps.
(a)準備(A)酚樹脂之步驟;(b)準備(B')金屬鹽之溶液之步驟;及(c)混合(A)酚樹脂與(B')金屬鹽之溶液,並使金屬原子與(A)酚樹脂中之氧原子配位,而獲得金屬混合樹脂之步驟。 (a) a step of preparing (A) a phenol resin; (b) a step of preparing a solution of the (B') metal salt; and (c) mixing a solution of the (A) phenol resin and the (B') metal salt, and allowing the metal The step of coordinating an atom with an oxygen atom in the (A) phenol resin to obtain a metal mixed resin.
對以下各步驟進行說明。 The following steps are explained.
((a)步驟) ((a) step)
本步驟中,準備酚樹脂。 In this step, a phenol resin is prepared.
作為此處所使用之酚樹脂,適當選擇上述之酚樹脂即可。 As the phenol resin used herein, the above phenol resin may be appropriately selected.
((b)步驟) ((b) steps)
本步驟中,準備(B')金屬鹽之溶液。 In this step, a solution of the (B') metal salt is prepared.
此處,於本實施形態中,該(B')金屬鹽之溶液可使用對應於構成上述「由與(B)酚樹脂中之氧原子配位之金屬原子所構成之金屬粒子」之金屬原子的鹽而進行製備。 Here, in the present embodiment, the solution of the (B') metal salt may be a metal atom corresponding to the "metal particles composed of metal atoms coordinated to the oxygen atoms in the (B) phenol resin". The salt is prepared.
更具體而言,準備對應於「選自由銀(Ag)、銅(Cu)、鋅 (Zn)、鈣(Ca)、鐵(Fe)、鋁(Al)、鎂(Mg)、鈦(Ti)、鈧(Sc)、釩(V)、鉻(Cr)、錳(Mn)、鈷(Co)、鎳(Ni)、鎵(Ga)、鍶(Sr)、釔(Y)、鈮(Nb)、鉬(Mo)、釕(Ru)、鈀(Pd)、鎘(Cd)、鋇(Ba)、鑭(La)、鈰(Ce)、鐠(Pr)、釹(Nd)、鉕(Pm)、釤(Sm)、銪(Eu)、釓(Gd)、鋱(Tb)、鏑(Dy)、鈥(Ho)、鉺(Er)、銩(Tm)、鐿(Yb)、鑥(Lu)、鉿(Hf)、鉭(Ta)、鎢(W)、錸(Re)、鋨(Os)、銥(Ir)、鉑(Pt)及金(Au)所組成之群中之1種或2種以上之金屬原子」的金屬鹽即可。 More specifically, the preparation corresponds to "selected from silver (Ag), copper (Cu), zinc (Zn), calcium (Ca), iron (Fe), aluminum (Al), magnesium (Mg), titanium (Ti), strontium (Sc), vanadium (V), chromium (Cr), manganese (Mn), cobalt (Co), nickel (Ni), gallium (Ga), strontium (Sr), yttrium (Y), niobium (Nb), molybdenum (Mo), ruthenium (Ru), palladium (Pd), cadmium (Cd), ruthenium (Ba), 镧 (La), 铈 (Ce), 鐠 (Pr), 钕 (Nd), 鉕 (Pm), 钐 (Sm), 铕 (Eu), 釓 (Gd), 鋱 (Tb), 镝(Dy), 鈥 (Ho), 铒 (Er), 銩 (Tm), 镱 (Yb), 鑥 (Lu), 铪 (Hf), 钽 (Ta), tungsten (W), 铼 (Re), 锇The metal salt of one or two or more metal atoms of the group consisting of (Os), iridium (Ir), platinum (Pt), and gold (Au) may be used.
該等中,就金屬混合樹脂之製造容易性、又應用領域之廣泛性而言,較佳為使用對應於「選自由銀(Ag)、銅(Cu)、鋅(Zn)、鈣(Ca)、鐵(Fe)、鋁(Al)、鎂(Mg)所組成之群中之1種或2種以上之金屬原子」的金屬鹽。 Among these, in terms of easiness of production of the metal mixed resin and wide range of applications, it is preferred to use "corresponding to" selected from the group consisting of silver (Ag), copper (Cu), zinc (Zn), and calcium (Ca). A metal salt of one or two or more metal atoms of a group consisting of iron (Fe), aluminum (Al), and magnesium (Mg).
於本實施形態中,金屬鹽係由上述金屬原子之陽離子(cation)與陰離子(anion)所構成。 In the present embodiment, the metal salt is composed of a cation and an anion of the above metal atom.
作為此種陰離子,可列舉:氯離子、溴離子、碘離子等鹵離子;醋酸根離子、草酸根離子、富馬酸根離子等羧酸鹽離子;對甲苯磺酸鹽離子、甲磺酸鹽離子、丁磺酸鹽離子、苯磺酸鹽離子等磺酸鹽離子;硫酸根離子;過氯酸根離子;碳酸根離子;硝酸根離子等。 Examples of such an anion include a halide ion such as a chloride ion, a bromide ion, and an iodide ion; a carboxylate ion such as an acetate ion, an oxalate ion, or a fumarate ion; a p-toluenesulfonate ion and a methanesulfonate ion; , sulfonate ion such as butane sulfonate ion, besylate ion; sulfate ion; perchlorate ion; carbonate ion; nitrate ion.
於舉例對本實施形態之構成金屬混合樹脂之金屬粒子為銀、即銀粒子之情形進行說明時,準備銀離子與上述陰離子結合而成之鹽,然後製備溶液。 In the case where the metal particles constituting the metal mixed resin of the present embodiment are silver, that is, silver particles, a salt obtained by combining silver ions with the above anions is prepared, and then a solution is prepared.
再者,於使用銀之情形時,就對溶劑之溶解性較高之方面而言,較佳為使用硝酸根離子作為陰離子,而製成作為金屬鹽之硝酸銀。 Further, in the case of using silver, it is preferred to use nitrate ions as an anion in terms of solubility in a solvent to prepare silver nitrate as a metal salt.
當然,即便於使用銀以外之金屬之情形時,亦只要適當考慮 金屬鹽之溶解性等而選擇適當之金屬鹽即可。 Of course, even in the case of using metals other than silver, it is only appropriate to consider The appropriate metal salt may be selected by the solubility of the metal salt or the like.
例如,於使用銅作為金屬原子之情形時可使用硫酸銅或硝酸銅等;於使用鋅作為金屬原子之情形時可使用氯化鋅或硫酸鋅或硝酸鋅;於使用鈣作為金屬原子之情形時可使用氯化鈣或硝酸鈣;於使用鐵作為金屬原子之情形時可使用氯化鐵或硫酸鐵、硝酸鐵;於使用鋁作為金屬原子之情形時可使用硝酸鋁;於使用鎂作為金屬原子之情形時可使用氯化鎂、硫酸鎂、硝酸鎂等。 For example, copper or copper nitrate can be used in the case of using copper as a metal atom; zinc chloride or zinc sulfate or zinc nitrate can be used in the case of using zinc as a metal atom; in the case of using calcium as a metal atom Calcium chloride or calcium nitrate can be used; in the case of using iron as a metal atom, ferric chloride or iron sulfate, iron nitrate can be used; in the case of using aluminum as a metal atom, aluminum nitrate can be used; in the case of using magnesium as a metal atom In the case, magnesium chloride, magnesium sulfate, magnesium nitrate or the like can be used.
又,關於金屬鹽之金屬之價數,考慮對溶劑之溶解性或還原之容易性等而採用適當者即可。 Further, the valence of the metal of the metal salt may be appropriately determined in consideration of solubility in a solvent, easiness of reduction, and the like.
於本步驟中,準備金屬鹽之溶液,但使金屬鹽溶解之溶劑只要視該金屬鹽之特性而適當選擇即可。 In the present step, a solution of a metal salt is prepared, but a solvent for dissolving the metal salt may be appropriately selected depending on the characteristics of the metal salt.
例如,作為溶劑,可選擇水。如上所述,藉由使用水而變得有助於降低製造成本。 For example, as a solvent, water can be selected. As described above, it becomes helpful to reduce the manufacturing cost by using water.
又,作為溶劑,可採用水以外之有機溶劑,例如可使用甲醇、乙醇、丙醇、丁醇、戊醇、己醇、乙二醇等醇系溶劑;丙酮、甲基乙基酮、甲基異丁基酮等酮系溶劑;二甲基醚、二乙基醚、甲基乙基醚、二丙基醚、四氫呋喃等醚系溶劑、甲基賽璐蘇、乙基賽璐蘇、丁基賽璐蘇、乙酸甲基賽璐蘇、乙酸乙基賽璐蘇等賽璐蘇類;N-甲基-2-吡咯啶酮或N,N-二甲基甲醯胺等醯胺系溶劑;碳酸二甲酯等。該等有機溶劑可單獨使用,又亦可組合使用數個。 Further, as the solvent, an organic solvent other than water may be used. For example, an alcohol solvent such as methanol, ethanol, propanol, butanol, pentanol, hexanol or ethylene glycol; acetone, methyl ethyl ketone or methyl group; a ketone solvent such as isobutyl ketone; an ether solvent such as dimethyl ether, diethyl ether, methyl ethyl ether, dipropyl ether or tetrahydrofuran; methyl siatone, ethyl cyanidin, butyl Ceramide, vinyl acetate acesulfame, ethyl acesulfame acetate, etc.; phthalamide solvent such as N-methyl-2-pyrrolidone or N,N-dimethylformamide; Dimethyl carbonate and the like. These organic solvents may be used singly or in combination of several.
又,於該等有機溶劑與水進行混合之情形時,亦可藉由適當與水進行混合而使用。 Further, when the organic solvent is mixed with water, it may be used by mixing with water as appropriate.
又,本實施形態之金屬鹽之溶液亦可以提高金屬鹽之溶解性等為目的而調整溶液之pH值。 Further, the solution of the metal salt of the present embodiment can adjust the pH of the solution for the purpose of improving the solubility of the metal salt and the like.
本實施形態之金屬鹽之溶液中之金屬鹽之濃度例如為1%以上,較佳為3%以上,進而較佳為5%以上。又,金屬鹽之溶液中之金屬鹽之濃度例如為20%以下,較佳為15%以下,更佳為12%以下。 The concentration of the metal salt in the solution of the metal salt of the present embodiment is, for example, 1% or more, preferably 3% or more, and more preferably 5% or more. Further, the concentration of the metal salt in the solution of the metal salt is, for example, 20% or less, preferably 15% or less, more preferably 12% or less.
藉由設定在上述範圍,而可穩定地自金屬鹽向所需之金屬粒子轉換。 By setting it within the above range, it is possible to stably convert from a metal salt to a desired metal particle.
再者,該金屬鹽之濃度係定義為溶解之金屬鹽之質量相對於溶液整體質量之比率。 Further, the concentration of the metal salt is defined as the ratio of the mass of the dissolved metal salt to the overall mass of the solution.
((c)步驟) ((c) step)
本步驟中,將酚樹脂與金屬鹽之溶液進行混合,並使金屬原子與酚樹脂中之氧原子配位,而獲得金屬混合樹脂。 In this step, a solution of a phenol resin and a metal salt is mixed, and a metal atom is coordinated with an oxygen atom in the phenol resin to obtain a metal mixed resin.
具體而言,將上述酚樹脂與金屬鹽之溶液進行混合,對金屬鹽進行還原反應,藉此由金屬鹽形成金屬粒子(即,以「0價」之金屬粒子之形式析出),而獲得金屬混合樹脂。 Specifically, the phenol resin and the metal salt solution are mixed, and the metal salt is subjected to a reduction reaction, whereby metal particles are formed from the metal salt (that is, precipitated as "zero-valent" metal particles) to obtain a metal. Mixed resin.
進行本步驟時,對上述之金屬鹽進行還原反應。 When this step is carried out, the above metal salt is subjected to a reduction reaction.
該還原反應可使用公知之還原劑,亦可活用原因在於酚樹脂之結構之還原性官能基而進行。 The reduction reaction can be carried out by using a known reducing agent or by using a reducing functional group of a structure of a phenol resin.
即,如上所述,於本實施形態中可採用分子內具有醛基之酚樹脂作為酚樹脂。 That is, as described above, in the present embodiment, a phenol resin having an aldehyde group in a molecule can be used as the phenol resin.
於該情形時,分子內之醛基對構成金屬鹽之金屬陽離子帶來還原作用,而可轉換為金屬粒子。 In this case, the aldehyde group in the molecule imparts a reduction to the metal cation constituting the metal salt, and can be converted into a metal particle.
於使用此種分子內具有醛基之酚樹脂之情形時,相對於溶液 所含之金屬鹽之質量,例如可使用0.1倍量以上之酚樹脂,較佳為可使用0.5倍量之酚樹脂,更佳為可使用2倍量之酚樹脂。 In the case of using a phenol resin having an aldehyde group in the molecule, relative to the solution For the quality of the metal salt to be contained, for example, 0.1 times or more of the phenol resin may be used, preferably 0.5 times the amount of the phenol resin, and more preferably 2 times the amount of the phenol resin.
又,使用之酚樹脂量之上限無特別限定,例如為100倍量以下。 Moreover, the upper limit of the amount of the phenol resin to be used is not particularly limited, and is, for example, 100 times or less.
又,作為分子內具有醛基之酚樹脂以外之還原劑,可採用公知者,例如可使用次磷酸鈉、二甲胺硼烷、硼氫化鈉、硼氫化鉀、甲醛、肼、抗壞血酸等無機或有機之還原劑。 Further, as a reducing agent other than the phenol resin having an aldehyde group in the molecule, a known one may be used, and for example, inorganic or sodium hypophosphite, dimethylamine borane, sodium borohydride, potassium borohydride, formaldehyde, hydrazine, ascorbic acid or the like may be used. Organic reducing agent.
還原劑之使用量可根據其種類而適當設定,只要設定僅充分量之金屬粒子析出之量即可。 The amount of the reducing agent to be used can be appropriately set depending on the type thereof, and it suffices to set only a sufficient amount of metal particles to be precipitated.
又,於本步驟中,為了促進還原反應,可適當使用還原輔助劑。例如,於使用硝酸銀作為金屬鹽,且混合分子內具有醛基之酚樹脂之情形時,可使用二甲硫醚、二乙硫醚、二丙硫醚、二丁硫醚、二戊硫醚、二己硫醚、二苯硫醚、乙基苯基硫醚、硫代二乙醇、硫代二丙醇、硫代二丁醇、1-(2-羥乙基硫代)-2-丙醇、1-(2-羥乙基硫代)-2-丁醇、1-(2-羥乙基硫代)-3-丁氧基-1-丙醇等作為還原輔助劑。 Further, in this step, in order to promote the reduction reaction, a reducing aid can be suitably used. For example, in the case of using silver nitrate as a metal salt and mixing a phenol resin having an aldehyde group in the molecule, dimethyl sulfide, diethyl sulfide, dipropyl sulfide, dibutyl sulfide, dipentane sulfide, Dihexyl sulfide, diphenyl sulfide, ethyl phenyl sulfide, thiodiethanol, thiodipropanol, thiodibutanol, 1-(2-hydroxyethylthio)-2-propanol 1-(2-hydroxyethylthio)-2-butanol, 1-(2-hydroxyethylthio)-3-butoxy-1-propanol or the like is used as a reducing aid.
又,同樣地亦可使用胺化合物或醇類作為還原輔助劑。 Further, an amine compound or an alcohol may be used as a reducing aid in the same manner.
更具體的而言,可使用作為胺化合物之氨、乙基胺、二乙基胺、三乙基胺、丙基胺、二丙基胺、三丙基胺、異丙基二乙基胺、二乙醇胺、三乙醇胺、嗎福啉、乙二胺、吡啶等作為還原輔助劑。 More specifically, ammonia, ethylamine, diethylamine, triethylamine, propylamine, dipropylamine, tripropylamine, isopropyldiethylamine, which are amine compounds, can be used. Diethanolamine, triethanolamine, morphine, ethylenediamine, pyridine, etc. are used as reducing assistants.
又,作為醇類,可使用乙氧基乙醇、乙二醇、二乙二醇等作為還原輔助劑。 Further, as the alcohol, ethoxyethanol, ethylene glycol, diethylene glycol or the like can be used as the reducing assistant.
又,本步驟亦可混合各種原料後進行加熱而進行。 Moreover, this step can also be carried out by mixing various raw materials and heating.
進行該加熱時之溫度條件之下限值例如為30℃以上,較佳為40℃以 上,更佳為45℃以上。又,溫度條件之上限值例如為100℃以下,較佳為90℃以下,更佳為80℃以下。 The lower limit of the temperature condition at which the heating is performed is, for example, 30 ° C or higher, preferably 40 ° C. Above, more preferably 45 ° C or more. Further, the upper limit of the temperature condition is, for example, 100 ° C or lower, preferably 90 ° C or lower, more preferably 80 ° C or lower.
關於反應時間,只要一面觀察所混合之原料之變化程度,一面適當設定即可,反應時間之下限值例如為10分鐘以上,較佳為30分鐘以上,更佳為1小時以上。又,反應時間之上限值例如為24小時以下,較佳為12小時以下,更佳為8小時以下。 The reaction time may be appropriately set as long as the degree of change of the mixed raw materials is observed, and the lower limit of the reaction time is, for example, 10 minutes or longer, preferably 30 minutes or longer, more preferably 1 hour or longer. Further, the upper limit of the reaction time is, for example, 24 hours or shorter, preferably 12 hours or shorter, more preferably 8 hours or shorter.
[用途] [use]
本實施形態之金屬混合樹脂由於可將金屬粒子均勻地分散於樹脂,而表現出較高之機械強度,故而期待向廣泛用途之展開。 The metal-mixed resin of the present embodiment exhibits high mechanical strength because the metal particles can be uniformly dispersed in the resin, and thus it is expected to be widely used.
又,著眼於本實施形態之金屬混合樹脂所具有之導電性,期待本實施形態之金屬混合樹脂亦可用作導電材料,且著眼於本實施形態之金屬混合樹脂之導熱性,期待本實施形態之金屬混合樹脂亦可用作散熱材料。 In view of the electrical conductivity of the metal-mixed resin of the present embodiment, it is expected that the metal-mixed resin of the present embodiment can be used as a conductive material, and the thermal conductivity of the metal-mixed resin of the present embodiment is focused on. The metal mixed resin can also be used as a heat dissipating material.
具體而言,期待本實施形態之金屬混合樹脂作為陶瓷電容器或功率電感器等中之電子構件之應用;作為輪胎之胎圈部等汽車零件之應用;作為摩擦材料或研磨材料之應用;此外之作為藕合磁石、建築材料、結構材料、運動用品、隔音材料之應用。 Specifically, the metal mixed resin of the present embodiment is expected to be used as an electronic component in a ceramic capacitor, a power inductor, or the like; as an application for an automobile part such as a bead portion of a tire; as a friction material or an abrasive material; As a combination of magnets, building materials, structural materials, sporting goods, sound insulation materials.
以上對本發明之實施形態進行了敍述,但該等為本發明之例示,可採用上述以外之各種構成。 Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above may be employed.
實施例Example
以下,藉由實施例,進一步具體地說明本發明,但本發明之範圍並不限定於該等之實施例等。 Hereinafter, the present invention will be specifically described by way of examples, but the scope of the invention is not limited to the examples and the like.
[酚樹脂1之製造] [Manufacture of phenol resin 1]
首先,準備具備攪拌翼、溫度計、滴液漏斗、冷凝器之1L四口燒瓶,裝入4-羥基苯甲醛24.4g(0.20莫耳)、92%多聚甲醛6.5g(0.20莫耳)、作為溶劑之醋酸210.0g與2-乙氧基乙醇186.0g,並進行攪拌,使該等均勻地溶解。 First, a 1 L four-necked flask equipped with a stirring blade, a thermometer, a dropping funnel, and a condenser was prepared, and 24.4 g (0.20 mol) of 4-hydroxybenzaldehyde and 6.5 g (0.20 mol) of 92% paraformaldehyde were charged. 210.0 g of acetic acid of the solvent and 186.0 g of 2-ethoxyethanol were stirred and uniformly dissolved.
其後,向滴液漏斗添加98%硫酸73.4g,一面以燒瓶內不會升至60℃以上之方式觀察溫度,一面逐次少量地滴加該硫酸。 Thereafter, 73.4 g of 98% sulfuric acid was added to the dropping funnel, and the temperature was observed so as not to rise to 60 ° C or more in the flask, and the sulfuric acid was added dropwise in small portions.
於硫酸之滴加結束之階段,進行升溫直至內溫成為100℃,自內溫成為100℃之時點開始一面保持溫度,一面進行2小時反應。 At the end of the dropwise addition of sulfuric acid, the temperature was raised until the internal temperature became 100 ° C, and the reaction was carried out for 2 hours while the internal temperature was maintained at 100 ° C.
反應後,確認燒瓶之內溫降低至30℃以下,將燒瓶之內容物注入1L水,回收此時所析出之固體(回收量(乾燥後):22g)。 After the reaction, it was confirmed that the internal temperature of the flask was lowered to 30 ° C or lower, and the contents of the flask were poured into 1 L of water, and the solid precipitated at this time (recovered amount (after drying): 22 g) was collected.
乾燥所得之固體並進行分析,結果確認到該固體為分子內具有醛基之酚樹脂。再者,數量平均分子量(Mn)、重量平均分子量(Mw)、重量平均分子量相對於數量平均分子量之比(Mw/Mn)係如下所述。 The obtained solid was dried and analyzed, and it was confirmed that the solid was a phenol resin having an aldehyde group in the molecule. Further, the ratio of the number average molecular weight (Mn), the weight average molecular weight (Mw), and the weight average molecular weight to the number average molecular weight (Mw/Mn) is as follows.
‧數量平均分子量(Mn):334 ‧ number average molecular weight (Mn): 334
‧重量平均分子量(Mw):607 ‧ Weight average molecular weight (Mw): 607
‧重量平均分子量相對於數量平均分子量之比(Mw/Mn):1.82 ‧ Ratio of weight average molecular weight to number average molecular weight (Mw/Mn): 1.82
再者,於本實施例項中,數量平均分子量及重量平均分子量之測定係利用GPC(Gel Permeation Chromatography),使用TSK-GEL G1000H、G2000H、G3000H作為管柱種,使用四氫呋喃作為流動相而進行。又,使用單分散聚苯乙烯作為標準物質。 Further, in the present embodiment, the measurement of the number average molecular weight and the weight average molecular weight was carried out by using GPC (Gel Permeation Chromatography) using TSK-GEL G1000H, G2000H, and G3000H as a column type, and using tetrahydrofuran as a mobile phase. Also, monodisperse polystyrene was used as a standard substance.
於以下所示之實施例及比較例中,重複相同之操作而逐次獲得酚樹脂1,並使用其而製作金屬樹脂複合材料。 In the examples and comparative examples shown below, the phenol resin 1 was successively obtained by repeating the same operation, and a metal resin composite material was produced using the same.
(實施例1) (Example 1)
準備具備攪拌翼、溫度計、滴液漏斗、冷凝器之1L四口燒瓶,於該燒瓶內裝入上述中所得之酚樹脂1 30.0g、使氫氧化鈉4.6g(0.11莫耳)溶解於水300g而成之氫氧化鈉水溶液、硫代二乙醇6.0g(0.05莫耳)、1N硝酸銀31.6g(0.03莫耳)。進行攪拌,使該等均勻地溶解後,進行升溫直至內溫成為50℃,自內溫成為50℃之時點開始一面保持溫度,一面進行2小時反應。 A 1 L four-necked flask equipped with a stirring blade, a thermometer, a dropping funnel, and a condenser was prepared, and 10.00.0 g of the phenol resin obtained above was placed in the flask, and 4.6 g (0.11 mol) of sodium hydroxide was dissolved in water 300 g. Aqueous sodium hydroxide solution, thiodiethanol 6.0 g (0.05 mol), 1 N silver nitrate 31.6 g (0.03 mol). After stirring, the mixture was uniformly dissolved, and the temperature was raised until the internal temperature became 50 ° C. The reaction was carried out for 2 hours while the internal temperature was 50 ° C.
反應後,確認燒瓶之內溫降低至30℃以下,自滴液漏斗滴加醋酸0.5g,使反應系統自中性成為以pH值=5為界限之弱酸性,藉此使金屬樹脂複合材料析出。 After the reaction, it was confirmed that the internal temperature of the flask was lowered to 30 ° C or lower, and 0.5 g of acetic acid was added dropwise from the dropping funnel to make the reaction system neutral to a weak acidity with a pH of 5, thereby precipitating the metal resin composite material. .
最後,對燒瓶內所析出之金屬樹脂複合材料進行回收(回收量(乾燥後):33g)。 Finally, the metal resin composite material precipitated in the flask was recovered (recovered amount (after drying): 33 g).
乾燥所得之固體,利用GPC對可溶於四氫呋喃之部分進行分子量之測定。數量平均分子量(Mn)、重量平均分子量(Mw)、重量平均分子量相對於數量平均分子量之比(Mw/Mn)係如下所述。 The obtained solid was dried, and the molecular weight of the fraction soluble in tetrahydrofuran was measured by GPC. The ratio of the number average molecular weight (Mn), the weight average molecular weight (Mw), and the weight average molecular weight to the number average molecular weight (Mw/Mn) is as follows.
‧數量平均分子量(Mn):282 ‧ number average molecular weight (Mn): 282
‧重量平均分子量(Mw):478 ‧ Weight average molecular weight (Mw): 478
‧重量平均分子量相對於數量平均分子量之比(Mw/Mn):1.70 ‧ Ratio of weight average molecular weight to number average molecular weight (Mw/Mn): 1.70
針對實施例1中所得之金屬樹脂複合材料,利用Thermo Fisher Scientific股份有限公司製造之X射線光電子光譜分析裝置Escalab-220iXL進行測定。 The metal resin composite material obtained in Example 1 was measured by an X-ray photoelectron spectroscopy apparatus Escalab-220iXL manufactured by Thermo Fisher Scientific Co., Ltd.
再者,關於測定條件,係如下所述。 Further, the measurement conditions are as follows.
‧照射X射線:單色AlKα ‧ Irradiation X-ray: Monochrome AlKα
‧檢測深度:約5nm ‧Detection depth: about 5nm
‧X射線點徑:約1mm ‧X-ray spot diameter: about 1mm
將表示針對實施例1中所得之金屬樹脂複合材料,測定Ag3d窄掃描圖譜所得之結果之圖以圖1表示。又,與此相對應地,將對利用Ar離子清潔過Ag箔之試樣所測得之Ag3d窄掃描圖譜之圖以圖2表示。 A graph showing the results of measuring the Ag3d narrow scan pattern for the metal resin composite material obtained in Example 1 is shown in Fig. 1. Further, in response to this, a graph of the Ag3d narrow scan pattern measured on the sample in which the Ag foil was cleaned with Ar ions is shown in Fig. 2 .
於圖1所示之圖中,Ag3d窄掃描圖譜之峰位置在368.9eV,另一方面,於圖2所示之圖中,峰位置在368.3eV,於該等中觀察到峰位置之差異。 In the graph shown in Fig. 1, the peak position of the Ag3d narrow scan pattern is 368.9 eV, and on the other hand, in the graph shown in Fig. 2, the peak position is 368.3 eV, and the difference in peak position is observed in these.
通常,Ag單獨成分之波峰係於368.1~368.3eV附近被觀察到,相對於此,例如於醋酸銀之類的Ag原子與O原子進行交互作用之化合物中,該波峰移動至368.3~368.9eV(出處:Handbook of X-ray Photoelectron Spectroscopy(Physical Electronics))。 Generally, the peak of the Ag component is observed in the vicinity of 368.1 to 368.3 eV. In contrast, for example, in a compound in which an Ag atom such as silver acetate interacts with an O atom, the peak shifts to 368.3 to 368.9 eV ( Source: Handbook of X-ray Photoelectron Spectroscopy (Physical Electronics)).
自上述情況證實,實施例1中所得之金屬樹脂複合材料係於其化學結構中具有Ag-O鍵。 From the above, it was confirmed that the metal resin composite material obtained in Example 1 had an Ag-O bond in its chemical structure.
又,實施例1中所得之金屬樹脂複合材料係利用穿透式電子顯微鏡(TEM)觀察該複合材料之表面。將其結果示於圖3。 Further, the metal resin composite material obtained in Example 1 was observed on the surface of the composite material by a transmission electron microscope (TEM). The result is shown in Fig. 3.
如該圖3所示,實施例1中所得之金屬樹脂複合材料係均勻地含有數十奈米級(平均粒徑:13nm)之銀粒子者。 As shown in FIG. 3, the metal-resin composite material obtained in Example 1 uniformly contained silver particles of a tens of nanometer order (average particle diameter: 13 nm).
(實施例2) (Example 2)
準備具備攪拌翼、溫度計、滴液漏斗、冷凝器之1L四口燒瓶,於該燒瓶內裝入上述中所得之酚樹脂1 30.0g、使氫氧化鈉4.6g(0.11莫耳)溶解於水300.0g中而成之氫氧化鈉水溶液、硫代二乙醇6.0g(0.05莫耳)、1N 硝酸銀15.8g(0.015莫耳)。進行攪拌,使該等均勻地溶解後,進行升溫直至內溫成為50℃,自內溫成為50℃之時點開始一面保持溫度,一面進行2小時反應。 A 1 L four-necked flask equipped with a stirring blade, a thermometer, a dropping funnel, and a condenser was prepared, and 10.00.0 g of the phenol resin obtained above was placed in the flask, and 4.6 g (0.11 mol) of sodium hydroxide was dissolved in water 300.0. NaOH aqueous solution, thiodiethanol 6.0g (0.05 m), 1N Silver nitrate 15.8 g (0.015 mol). After stirring, the mixture was uniformly dissolved, and the temperature was raised until the internal temperature became 50 ° C. The reaction was carried out for 2 hours while the internal temperature was 50 ° C.
反應後,確認燒瓶之內溫降低至30℃以下,自滴液漏斗滴加醋酸0.5g,使反應系統自中性成為以pH值=5為界限之弱酸性,藉此,使金屬樹脂複合材料析出。 After the reaction, it was confirmed that the internal temperature of the flask was lowered to 30 ° C or lower, and 0.5 g of acetic acid was added dropwise from the dropping funnel to make the reaction system neutral to a weak acidity with a pH of 5, thereby making the metal resin composite material Precipitate.
最後,對燒瓶內所析出之金屬樹脂複合材料進行回收(回收量(乾燥後):31g)。 Finally, the metal resin composite material precipitated in the flask was recovered (recovered amount (after drying): 31 g).
(實施例3) (Example 3)
準備具備攪拌翼、溫度計、滴液漏斗、冷凝器之1L四口燒瓶,於該燒瓶內裝入上述中所得之酚樹脂1 30.0g、使氫氧化鈉4.6g(0.11莫耳)溶解於水300g中而成之氫氧化鈉水溶液、硫代二乙醇6.0g(0.05莫耳)、1N硝酸銀31.6g(0.03莫耳)。進行攪拌,使該等均勻地溶解後,進行升溫直至內溫成為30℃,自內溫成為30℃之時點開始一面保持溫度,一面進行24小時反應。 A 1 L four-necked flask equipped with a stirring blade, a thermometer, a dropping funnel, and a condenser was prepared, and 10.00.0 g of the phenol resin obtained above was placed in the flask, and 4.6 g (0.11 mol) of sodium hydroxide was dissolved in water 300 g. Aqueous sodium hydroxide solution, thiodiethanol 6.0 g (0.05 mol), 1 N silver nitrate 31.6 g (0.03 mol). After stirring, the mixture was uniformly dissolved, and the temperature was raised until the internal temperature became 30 ° C. The reaction was continued for 24 hours from the time when the internal temperature became 30 ° C.
反應後,確認燒瓶內溫降低至30℃以下,自滴液漏斗滴加醋酸0.5g,使反應系統自中性成為以pH值=5為界限之弱酸性,藉此,使金屬樹脂複合材料析出。 After the reaction, it was confirmed that the internal temperature of the flask was lowered to 30 ° C or lower, and 0.5 g of acetic acid was added dropwise from the dropping funnel to make the reaction system neutral to a weak acidity with a pH of 5, thereby precipitating the metal resin composite material. .
最後,對燒瓶內所析出之金屬樹脂複合材料進行回收(回收量(乾燥後):33g)。 Finally, the metal resin composite material precipitated in the flask was recovered (recovered amount (after drying): 33 g).
(比較例1) (Comparative Example 1)
使用Laboplastomill,將上述中所得之酚樹脂1 95g、與平均粒徑1μm 之銀粉(DOWA公司製造)5g混練30分鐘,而獲得金屬樹脂複合材料。 Using Laboplastomill, the phenol resin obtained in the above was 95 g, and the average particle diameter was 1 μm. Silver powder (manufactured by DOWA Co., Ltd.) was kneaded for 5 minutes for 5 minutes to obtain a metal resin composite material.
(比較例2) (Comparative Example 2)
使用Laboplastomill,將上述中所得之酚樹脂1 90g、與平均粒徑1μm之銀粉(DOWA公司製造)10g混練30分鐘,而獲得金屬樹脂複合材料。 Using a Laboplastomill, 90 g of the phenol resin obtained above and 10 g of silver powder (manufactured by DOWA Co., Ltd.) having an average particle diameter of 1 μm were kneaded for 30 minutes to obtain a metal resin composite material.
針對實施例1~3及比較例1、2中所得之金屬樹脂複合材料,基於以下進行評價。 The metal resin composite materials obtained in Examples 1 to 3 and Comparative Examples 1 and 2 were evaluated based on the following.
(比重) (proportion)
使用各實施例及各比較例中所得之金屬樹脂複合材料,藉由基於加壓壓力100MPa、模具溫度:175℃之條件之壓縮成形,而製作ISO 294-4所示之60×60×2mm之試片。 The metal resin composite material obtained in each of the examples and the comparative examples was subjected to compression molding under the conditions of a press pressure of 100 MPa and a mold temperature of 175 ° C to prepare 60 × 60 × 2 mm as shown in ISO 294-4. Audition.
針對該試片,依據JIS K 6911測定比重。將結果示於表1。 For this test piece, the specific gravity was measured in accordance with JIS K 6911. The results are shown in Table 1.
(撓曲強度) (flexural strength)
使用各實施例及各比較例中所得之金屬樹脂複合材料,藉由基於加壓壓力100MPa、模具溫度:175℃之條件之壓縮成形,而製作ISO 178所示之80×10×4mm之試片。 Using the metal resin composite material obtained in each of the examples and the comparative examples, a test piece of 80 × 10 × 4 mm shown in ISO 178 was produced by compression molding under the conditions of a press pressure of 100 MPa and a mold temperature of 175 °C. .
繼而,針對所得之試片,依據ISO 178測定撓曲強度。將結果示於表1。 Then, for the obtained test piece, the flexural strength was measured in accordance with ISO 178. The results are shown in Table 1.
各實施例之金屬樹脂複合材料與各比較例之金屬樹脂複合材料由於比重之差異不大,故作為複合材料中之銀粒子之含量,可謂大致 相同水準。然而,於將各實施例與各比較例之撓曲強度進行比較時,觀察到該等之強度存在顯著差異。 The metal-resin composite material of each of the examples and the metal-resin composite material of each comparative example have a small difference in specific gravity, so that the content of the silver particles in the composite material is roughly The same level. However, when the flexural strengths of the respective examples and the comparative examples were compared, it was observed that there was a significant difference in the strengths.
其證實如下情況:本發明之金屬樹脂複合材料(金屬混合樹脂)由於金屬與樹脂經由化學鍵而鍵結,故而表現出適度密合性,甚至可達成較高之機械強度者。 It is confirmed that the metal resin composite material (metal mixed resin) of the present invention exhibits moderate adhesion due to bonding of a metal and a resin via a chemical bond, and even achieves high mechanical strength.
產業上之可利用性 Industrial availability
本發明之金屬混合樹脂由於可將金屬粒子均勻地分散於樹脂,而表現出較高之機械強度,故期待向廣泛用途之展開。 Since the metal mixed resin of the present invention exhibits high mechanical strength because the metal particles can be uniformly dispersed in the resin, it is expected to be spread to a wide range of applications.
又,著眼於本發明之金屬混合樹脂所具有之導電性,期待本發明之金屬混合樹脂亦可用作導電材料,且著眼於本發明之金屬混合樹脂之導熱性,期待本發明之金屬混合樹脂亦可用作散熱材料。 Further, focusing on the electrical conductivity of the metal mixed resin of the present invention, it is expected that the metal mixed resin of the present invention can also be used as a conductive material, and attention is paid to the thermal conductivity of the metal mixed resin of the present invention, and the metal mixed resin of the present invention is expected. Can also be used as a heat sink material.
該申請係主張以2015年2月27日提出申請之日本專利申請特願2015-038557號為基礎之優先權,且將其揭示之全部內容併入本文中。 The application is based on the priority of Japanese Patent Application No. 2015-038557, filed on Feb. 27, 2015, the entire disclosure of which is incorporated herein.
Claims (12)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015038557 | 2015-02-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201704331A true TW201704331A (en) | 2017-02-01 |
Family
ID=56788547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105105365A TW201704331A (en) | 2015-02-27 | 2016-02-24 | Metal hybrid resin and manufacturing method thereof |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6706804B2 (en) |
TW (1) | TW201704331A (en) |
WO (1) | WO2016136571A1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4173684A (en) * | 1977-09-06 | 1979-11-06 | The Mead Corporation | Production of novel metal modified novolak resins and their use in pressure sensitive papers |
JP2006193640A (en) * | 2005-01-14 | 2006-07-27 | Showa Highpolymer Co Ltd | Phenolic resin composition and highly water-resistant phenolic resin cured product using the same |
KR20140050016A (en) * | 2011-06-30 | 2014-04-28 | 코넬 유니버시티 | Hybrid materials and nanocomposite materials, methods of making same, and uses thereof |
JPWO2016009754A1 (en) * | 2014-07-14 | 2017-04-27 | 住友ベークライト株式会社 | Manufacturing method of conductive resin, conductive resin, conductive paste, and electronic member |
-
2016
- 2016-02-18 JP JP2017502307A patent/JP6706804B2/en not_active Expired - Fee Related
- 2016-02-18 WO PCT/JP2016/054660 patent/WO2016136571A1/en active Application Filing
- 2016-02-24 TW TW105105365A patent/TW201704331A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2016136571A1 (en) | 2017-12-07 |
WO2016136571A1 (en) | 2016-09-01 |
JP6706804B2 (en) | 2020-06-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103980103B (en) | Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof | |
TW201105699A (en) | Epoxy resin composition, prepreg and cured products thereof | |
JP2017071517A (en) | Refractory composition and refractory | |
TWI466965B (en) | Method for producing novolak resin and novolak resin | |
JP2009067921A (en) | Oil-modified phenolic resin emulsion | |
TW201704331A (en) | Metal hybrid resin and manufacturing method thereof | |
CN103857722A (en) | Epoxy resin mixture, epoxy resin composition, prepreg, and curing product of each | |
JP2017071810A (en) | Sintering material and sintered body | |
JP2018150464A (en) | Method for producing phenol resin | |
JP2017071562A (en) | Antibacterial composition | |
JP2017073222A (en) | Conductive material | |
JP2017071667A (en) | Wet paper friction material | |
JP2017071668A (en) | Adhesive for metal | |
JP5527007B2 (en) | Interfacial strengthened glass filler and phenolic resin molding material | |
CN112020533A (en) | Method for producing titanate-modified phenol resin composition, phenol resin composition for friction material, and friction material | |
CN104693676A (en) | Phenol resin composition, thermosetting resin composition, and cured product | |
JPWO2016009754A1 (en) | Manufacturing method of conductive resin, conductive resin, conductive paste, and electronic member | |
JP2017097060A (en) | Photosensitive resin composition and production method of photosensitive resin pattern | |
JP2006257136A (en) | Method for producing novolac type phenolic resin | |
JP2014169236A (en) | Method for synthesizing saturated hydrocarbon or unsaturated hydrocarbon, synthesized product and catalyst composite | |
JP5338058B2 (en) | Phenolic resin composition | |
JP3797359B2 (en) | Paint composition | |
JPH11209563A (en) | Phenolic resin composition | |
JP2009227817A (en) | Phenol resin composition, its manufacturing method, and friction material | |
JP2001234026A (en) | Flame-retardant resin composition |