TW201641722A - Thin film forming apparatus - Google Patents

Abstract

Provided is a thin film forming apparatus which has high productivity at low cost. A rotary device 21 comprising a turn table is disposed in a film forming chamber 11. After the alignment of an object 5a, 5b on which a film is to be formed at an alignment position 16, the object 5a, 5b, which is aligned with respect to a mask 4a, 4b, is placed on a substrate holder 34a, 34b provided on the rotary device 21. The rotary device 21 is rotated so as to transfer the object 5a, 5b to a film formation position 15. Thereafter, a film forming source 22 emitting fine particles of a film forming material is moved so as to form a thin film on the object 5a, 5b located at the film formation position 15. At this time, another object 5a, 5b on which a film has not been formed yet can be disposed at the alignment position 16 and the position thereof can be adjusted. Thus, the thin film forming apparatus 10 requires only one film forming source 22 and one apparatus necessary for alignment.

Description

Film forming device

The present invention relates to the technical field of a thin film forming apparatus, and more particularly to a thin film forming apparatus which forms a thin film with good efficiency.

When a film of a film-forming material is formed on a large-sized film formation object such as a glass substrate, a technique is generally employed in which a film formation object is placed in a vacuum chamber while being formed from a film formation source. On the other hand, the fine particles such as the vapor of the film forming material are released while moving to a position facing the film formation object, and the fine particles are attached to the surface of the film formation object.

The component symbol 110 of Fig. 6 is a film forming apparatus of the present technology, and two film forming chambers 111a and 111b and a plurality of vacuum chambers 113 are disposed around the transfer chamber 112, and the respective chambers 111a, 111b, and 113 are provided. It is connected to the transfer chamber 112.

Inside the two film forming chambers 111a and 111b, The substrate holder 121 is disposed, and an imaging device 135 such as a camera is disposed above the substrate holder 121, and a film formation source 122 is disposed below.

The film formation source 122 is attached to the film formation source moving device 131. When the film formation source moving device 131 operates, the film formation source 122 is placed at a position below the substrate holder 121 and is horizontally reciprocated. mobile.

Inside the transfer chamber 112, a substrate moving device 125 formed by a substrate transfer robot is disposed. The component symbol 105a of FIG. 6(b) represents a film formation object that is carried into the film forming chamber 111a by the substrate moving device 125 and disposed on the substrate holder 121.

When the film formation object 105a is carried into the film formation chamber 111a, it is placed inside the film formation chamber 111a and placed in a positioning device (not shown) before being placed on the substrate holder 121. In this state, the alignment mark of the film formation object 105a and the alignment mark of the substrate holder 121 are imaged by the imaging device 135, and the imaging result is output to the control device 136, and the film formation object is formed. The position error between the 105a and the substrate holder 121 is detected, and the film formation object 105a is moved by the control device 136 so that the position error is reduced, and the position error is reduced. It is disposed on the substrate holder 121.

The substrate holder 121 is provided with a through hole, and is placed on the surface of the film formation object 105a on the substrate holder 121, and is exposed on the bottom surface of the through hole.

At a portion of the surface of the film formation source 122 opposite to the film formation object 105a, a plurality of discharge holes 123 are provided, and if the particles of the film formation material are discharged from the discharge hole 123, When the film formation source moving device 131 moves the film formation source 122, the fine particles are adhered to the surface of the film object 105a exposed on the bottom surface of the through hole, and the film grows.

In the case where a film is formed on the surface of the film formation object 105a in the inside of the film formation chamber 111a in one of the film formation chambers 111a, the inside of the other film formation chamber 111b is placed. The film formation object 105b on the substrate moving device 125 is carried in.

In the film forming apparatus 110 of FIGS. 6(a) and 6(b), when a film is formed on the surface of the film forming object 105a in the inside of the film forming chamber 111a, the film is formed on the surface of the film forming object 105a. The film formation target 105b which is not formed is carried into the film formation chamber 111b of the other one, and the film formation object 105b is aligned with the film formation object 105b. Therefore, the film formation projects of the film formation objects 105a and 105b are Will not be interrupted.

However, in the film forming apparatus 110, the substrate moving device 125 is shared by the two film forming chambers 111a and 111b, but the film forming chambers 111a and 111b of the two film forming chambers are respectively The film formation source 122 and the film formation source moving device 131 are disposed without being low in cost.

In the film forming apparatus 210 of Fig. 7 (a), one film forming chamber 211 and a plurality of vacuum chambers 214 are connected around the transfer chamber 212, and the inside of the film forming chamber 211 is connected to the film forming chamber 211. Is configured with 2 units Substrate holders 221a, 221b.

The film formation source moving device 231 is disposed so as to cover the lower position of one of the substrate holders 221a and the lower position of the other substrate holder 221b, and one film formation source 222 is moved by the film formation source. When the apparatus 231 is moved, it can move while facing the one of the two substrate holders 221a and 221b.

Therefore, as shown in the figure (b), the film formation object 205a is disposed on one of the substrate holders 221a, and is discharged from the discharge hole 223 at a position below the film formation object 205a. The fine particles of the film material move while the film formation source 222 faces the film formation target 205a, and during the growth of the film, the substrate moving device 225 disposed in the transfer chamber 212 can be placed on the film. The film formation object 205b is carried into the film formation chamber 211, and is aligned with the other substrate holder 221b.

However, in the film forming apparatus 210, the film forming source 222 can be provided one by one, but it is necessary to separately arrange the image forming apparatus 235 and the registration moving device on each of the substrate holders 221a and 221b, and There is a need for a low cost film forming apparatus.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Laid-Open Patent Publication No. 2012-174609

[Patent Document 2] Japanese Patent No. 4510609

The present invention has been made in an effort to solve the above problems of the prior art, and an object thereof is to provide a low-cost film forming apparatus.

In order to solve the above problems, the present invention provides a film forming apparatus including: a film forming chamber; and a rotating device disposed in the film forming chamber, and is provided with a mask and a film. a plurality of substrate holders for rotating the object in the film forming chamber; and a main imaging device for the mask disposed on the substrate holder at the position of the alignment and opposite to the mask The image forming object is imaged, and the control device obtains a first positional error between the mask and the film formation object based on an imaging result of the main imaging device, and causes the first position to be In the method of reducing the error, the film formation object is moved, and the film formation object is placed in the mask in a state of being aligned; and the film formation source is disposed in the film formation chamber. Internally, and releasing the fine particles of the film forming material; and the film forming source moving device moves the film forming source inside the film forming chamber and passes the surface opposite to the film forming place, by the foregoing The rotation of the rotary device, the mask to be aligned, and the object to be film-formed are moved from the alignment position to the film formation site, and the film formation source passes through the fine particles while The opposite surface of the film formation site, the aforementioned particles The film is formed by passing through the through hole of the substrate holder and the window portion of the mask to the film formation object.

The present invention is a film forming apparatus in which an auxiliary imaging device that images the above-described mask and the film formation object positioned at the film formation site is provided, and based on the result of imaging by the auxiliary imaging device, The second positional error between the film formation object and the mask is taken out.

The present invention is a film forming apparatus including a holding device that fixes the mask and the film formation object placed on the mask to the rotating device.

The present invention is a thin film forming apparatus in which the second position error is compared with a second reference value, and when the second position error is larger than the second reference value, the film formation target The object is not formed into the film and is returned to the alignment position together with the mask by the rotation of the rotating device.

The present invention provides a film forming apparatus including: a film forming chamber; and a rotating device disposed in the film forming chamber and provided with a plurality of substrate holders in which a film object is disposed And rotating the inside of the film forming chamber; and the main imaging device images the substrate holder disposed at the position of the alignment position and the film formation object facing the substrate holder; and the control device According to the imaging result of the main imaging device, the first positional error between the substrate holder and the film formation object is taken out, and the film formation target is made such that the first position error is reduced. The object moves and is in the shape of the alignment The film formation object is disposed at the substrate holder; and the film formation source is disposed inside the film formation chamber to release the fine particles of the film formation material; and the film formation source moving device is configured to The film forming source moves inside the film forming chamber and passes through the surface opposite to the film forming place, and the substrate holder and the film forming object which are aligned by the rotation of the rotating device are Moving from the alignment position to the film formation site, the film formation source is placed on the surface opposite to the film formation site while the fine particles are discharged, and the fine particles pass through the through holes of the substrate holder The film formation object is reached to form a film.

The present invention is a film forming apparatus in which an auxiliary imaging device that images the substrate holder and the film formation object positioned at the film formation site is provided, and the image is captured by the auxiliary imaging device. In order to extract the second positional error between the film formation object and the mask.

The present invention is a film forming apparatus including a holding device that fixes the substrate holder and the film formation object placed on the substrate holder to the rotating device.

The present invention is a thin film forming apparatus in which the second position error is compared with a second reference value, and when the second position error is larger than the second reference value, the film formation target The object is not formed into the film and is returned to the aforementioned alignment place by the rotation of the rotating device.

The present invention is a film forming apparatus in which the substrate holder is provided with two sets, and the center of rotation of the rotating apparatus is used as a middle The two substrates of the aforementioned substrate holders are disposed at opposite sides of each other.

According to the present invention, it is possible to form a film on the surface of the film formation object without performing a film formation source and a device required for alignment, and to perform alignment of other film formation objects. .

By the holding device, the occurrence of the positional error during the rotational movement is prevented, and when it is generated, it is detected before the film formation by the auxiliary imaging device, and the alignment can be performed again. The position error caused by the rotational movement does not occur.

4a, 4b‧‧‧ mask

5a, 5b‧‧‧ film formation objects

10‧‧‧film forming device

15‧‧‧ film formation site

16‧‧‧ Alignment place

21‧‧‧Rotating device (rotary table)

22‧‧‧ Film source

25‧‧‧Substrate loading and unloading device

27‧‧‧Substrate mobile device

31‧‧‧ Film source mobile device

33‧‧‧ Rotating Center

34a, 34b‧‧‧ substrate holder

35‧‧‧Main camera

36‧‧‧Main control unit

45‧‧‧Auxiliary camera

46‧‧‧Auxiliary control device

48‧‧‧ drive

Fig. 1 is a plan view showing the inside of a film forming apparatus of the present invention.

[Fig. 2] (a1) is a cross-sectional view taken along line AA of Fig. 1, and (a2) is a diagram for explaining a state in which a film formation object is placed by using a cross-sectional view taken along line AA, (b1) FIG. 1 is a cross-sectional view taken along the line BB of FIG. 1, and (b2) is a view for explaining a state in which a film formation object is placed by using a BB line cut-off cross-sectional view.

[Fig. 3] (a) to (c) are plan views (1) for explaining a film forming process.

[Fig. 4] (d) to (f) are plan views (2) for explaining a film forming process.

[Fig. 5] (g) ~ (i) is used to describe the film forming process Floor plan (3).

[Fig. 6] (a) and (b) are prior art film forming apparatuses (1).

[Fig. 7] (a) and (b) are prior art film forming apparatuses (2).

The film forming apparatus of the present invention will be described.

Referring to Fig. 1, a film forming apparatus 10 of the present invention is provided with a transfer chamber 12.

Around the transfer chamber 12, a film forming chamber 11 for forming a film, a vacuum chamber 14 for performing film formation processing and subsequent processing, and a loading/unloading chamber 13 for carrying in and carrying out the film formation object are disposed. Each of the chambers 11, 13, 14 is connected to the transfer chamber 12.

Each of the chambers 11 to 14 is provided with a vacuum exhausting device and is configured to be evacuated. The component symbol 18 of Fig. 1 is a vacuum exhaust device connected to the film forming chamber 11, and the reference numeral 19 is a vacuum exhausting device connected to the transfer chamber 12. Each of the chambers 11 to 14 is evacuated and is set to have a vacuum atmosphere. Each of the chambers 11 to 14 is partitioned by a vacuum valve that can be opened and closed, but the description of the opening and closing is omitted here.

Inside the transfer chamber 12, a substrate loading/unloading device 25 is provided. The substrate loading/unloading device 25 includes a wrist 38 and a hand 39, and is configured to expand and contract the wrist 38 by the rotation of the rotating shaft 37. The hand 39 will move in the horizontal plane.

The film formation object in which the film is formed in the film formation chamber 11 is placed on the hand 39, and moves between the respective chambers 11, 13, 14 and the transfer chamber 12, and is placed in the loading/unloading chamber 13 The film formation object is placed on the hand 39 and taken out from the loading/unloading chamber 13, and then carried into the film forming chamber 11 or other vacuum chamber 14 through the transfer chamber 12.

Inside the film forming chamber 11, a disk-shaped rotating device 21 is horizontally provided.

2(a1) is a cross-sectional view taken along line A-A of FIG. 1, and FIG. 2(b1) is a cross-sectional view taken along line B-B of FIG. The component symbol 32 of Fig. 2 (a1) represents a rotating shaft in which one end is vertically mounted at the rotating device 21.

A drive unit 48 such as a motor is provided outside the film forming chamber 11, and the other end of the rotating shaft 32 is connected to the driving device 48. When the driving device 48 is operated, the rotating shaft 32 is formed on the rotating shaft. Rotate around the center axis of 32.

On the other hand, if the rotating shaft 32 rotates around the central axis thereof, the rotating device 21 rotates in the same plane with the center of rotation 33 as the center of the portion to be mounted which is the rotating shaft 32 as the center. Here, it rotates in a horizontal plane.

The film formation source moving device 31 is disposed on one of the both surfaces of the rotating device 21 (here, the bottom surface side of the film forming chamber 11). The rotating device 21 is moved at a portion directly above the film forming source moving device 31 and is not positioned at the film forming source. The portion directly above the device 31 is configured to be disposed at a position directly above the film formation source moving device 31 when rotated 180 degrees with the rotation center 33 as the center. The portion moves to a place that is not positioned directly above, and a portion that is not positioned directly above the film formation source moving device 31 moves to a position directly above the position.

On the other side of the rotating device 21 (in this case, the top plate side), above the portion directly above the film forming source moving device 31, the auxiliary image capturing device 45 is disposed, and is not positioned. Above the portion directly above the film source moving device 31, a main imaging device 35 and a substrate moving device 27 are disposed.

The main imaging device 35 and the auxiliary imaging device 45 are respectively connected to the main control device 36 and the auxiliary control device 46 disposed outside the film forming chamber 11, and represent the signals and representatives of the imaging results captured by the main imaging device 35. The signals of the imaging results captured by the auxiliary imaging device 45 are output to the main control device 36 and the auxiliary control device 46, respectively.

In the rotating device 21, a plurality of through holes 49a and 49b are formed, and a plurality of substrate holders 34a and 34b are formed by the respective through holes 49a and 49b and the edge portions of the through holes 49a and 49b. In the rotating device 21, the center of rotation 33 is centered, and one substrate holders 34a and 34b are formed at positions opposite to each other, and each of the substrate holders 34a and 34b is respectively Masks 4a, 4b are provided. The masks 4a and 4b are metal plates of a thin plate shape and are placed on the edges of the through holes 49a and 49b of the substrate holders 34a and 34b. In the mask At 4a and 4b, a window portion is formed at a specific position, and through holes 49a and 49b of the substrate holders 34a and 34b are located at the bottom surface.

When the substrate holders 34a and 34b are rotationally moved by the rotation of the rotating device 21, the substrate holders 34a and 34b and the masks 4a and 4b can be placed inside the film forming chamber 11 to be static. In the place where the transfer chamber 12 is located, the film-forming source moving device 31 and the auxiliary image pickup device are formed as the film formation place 15 as the film formation place 15 as the center of the rotation center 33 and the center of the rotation center 33. 45. The main imaging device 35 and the substrate moving device 27 are disposed at a position opposite to the film formation site 15, and the main imaging device 35 and the substrate moving device 27 are disposed at a position opposite to the alignment site 16.

The film formation object that is carried into the inside of the film formation chamber 11 from the transfer chamber 12 is first placed on the substrate moving device 27.

The component symbol 5a of Fig. 3(a) represents a film formation object disposed at the substrate moving device 27.

The film formation object 5a and the masks 4a and 4b are respectively provided with alignment marks, and the alignment marks of the film formation object 5a on the substrate moving device 27 and the mask 4a are provided by the main imaging device 35. The alignment mark is imaged, and if the signal representing the image pickup result is output to the main control device 36, the main control device 36 determines the positional relationship based on the relative position of the registration mark in the image pickup result. The first position error is taken out, and the first position error is a position at which the relative position between the film formation object 5a and the mask 4a on the substrate moving device 27 is opposite to the ideal position. The error on the alignment site 16 between the two.

The substrate moving device 27 is controlled by the main control device 36.

In the main control unit 36, the first and second reference values are stored, and the main control unit 36 compares the first position error with the first reference value, and the first position error is compared with the first reference value. In the larger case, the film formation object 5a is moved relative to the mask 4a to reduce the positional error, and the first position error is again obtained by the imaging by the main imaging device 35.

In this manner, the main control unit 36 repeatedly performs "retrieving the first position error by imaging by the main imaging device 35" and "comparing the first position error with the first reference value" and "being the first" When the positional error is larger than the first reference value, the alignment operation of the operation of causing the film formation object 5a and the mask 4a to move relative to each other and narrowing the positional error becomes the first position error. When the value is less than or equal to the reference value, the film formation object 5a and the mask 4a are regarded as being in a state of being aligned, and the film formation object 5a is lowered to arrange the film formation object 5a on the mask 4a.

At the substrate holders 34a, 34b, holding means 47a, 47b are provided, and the masks 4a, 4b on the alignment place 16 are placed in alignment with respect to the masks 4a, 4b. The film formation objects 5a and 5b on the masks 4a and 4b are clamped by the holding devices 47a and 47b, and are fixed to the substrate holders 34a and 34b by the holding devices 47a and 47b. This state is shown in Fig. 2 (a2), Fig. 2 (b2), and Fig. 3 (b).

Since the substrate holders 34a and 34b are fixed to the rotating device 21, the film formation objects 5a and 5b fixed to the substrate holders 34a and 34b are fixed to the rotating device 21.

In this case, the holding devices 47a and 47b press and hold the film formation objects 5a and 5b arranged in the aligned state on the masks 4a and 4b together with the masks 4a and 4b. The device on the rotating device 21, the holding device 47a, 47b, may be a device that is pressed and fixed by a spring, or the mask 4a, 4b and the film forming object 5a may be adhered by an adhesive sheet, 5b is followed by and fixed to the device on the rotating device 21.

Further, the holding devices 47a and 47b may be configured such that the rotating device 21 is formed of a magnetic material that is attracted by the magnet in advance, and the magnets included in the holding devices 47a and 47b are disposed in the mask 4a. The film formation objects 5a and 5b at 4b are further formed by the attraction between the magnet and the rotating device 21, and the masks 4a and 4b and the film formed on the masks 4a and 4b are formed. The objects 5a, 5b are fixed to the rotating device 21.

Next, when the rotating device 21 is rotated about the rotation center 33, the plurality of (two in this case) substrate holders 34a and 34b are together with the masks 4a and 4b on the substrate holders 34a and 34b. Similarly, as shown in FIG. 3(c), the same rotation center 33 is generally used as the center and rotated at the same angle in the same direction.

If the rotating device 21 makes a 180 degree rotation, as shown in FIG. 4(d), the substrate holder positioned at the alignment site 16 34a moves to the film formation place 15, and the substrate holder 34b, which was previously positioned at the film formation place 15, moves to the alignment place 16.

At this time, since the mask 4a and the film formation object 5a disposed on the mask 4a are rotated together, even if the rotation speed of the rotating device 21 is increased, the mask 4a and the mask are disposed. A positional shift does not occur between the film formation objects 5a on 4a, and is maintained in a state of being aligned.

The film formation source moving device 31 is disposed so as to cover the place opposite to the film formation place 15 and the place on both sides of the film formation place 15, and the film formation source 22 is formed by the film formation source moving device 31. It is configured to be able to pass through the surface opposite to the film formation site 15 .

At a position on the surface of the film formation source 22 that is opposite to the film formation place 15, a discharge hole 23 is provided, and the fine particles of the film formation material are discharged from the discharge hole 23.

The fine particles of the film forming material may be generated inside the film forming source 22, or may be configured to move the fine particles generated by other devices to the film forming source 22 and to discharge the holes 23 from the film forming source 22. release.

The single surface of the mask 4a positioned on the film formation place 15 is exposed under the bottom surface of the through hole 49a of the substrate holder 34a.

When the rotating device 21 is stationary after being rotated by 180 degrees, the alignment mark of the mask 4a which is stationary at the film forming place 15 and the film forming object 5a on the mask 4a are aligned. The symbol is imaged by the auxiliary imaging device 45, and the imaging result is output to the auxiliary control device 46.

The auxiliary control device 46 extracts the second position which is the positional error on the film formation place 15 based on the positional relationship between the mask 4a at the film formation site 15 and the relative position between the film formation objects 5a. The error is compared with the second reference value and the comparison result is output to the main control unit 36.

When the second position error is equal to or less than the second reference value, the main control unit 36 causes the film formation source 22 to start moving by the film formation source moving device 31 while releasing the fine particles.

When the first reference value compared with the first position error and the second reference value compared with the second position error are the same value, the second position error is more than the second reference value. When the rotation device 21 is rotated at a high speed and is suddenly stopped, the relative position between the mask 4a that is rotated and the film formation object 5a changes, and the positional error becomes large.

When the second positional error is larger than the second reference value, the main control unit 36 rotates the rotating device 21 without starting the movement of the film forming source 22, and causes the mask at the film forming place 15 to be placed. 4a and the film formation object 5a are returned to the alignment place 16.

After that, the holding by the holding device 47a is released, and the film formation object 5a is moved to the mask 4a or the rotating device 21, and then the main control device 36 operates the substrate moving device 27. When the film formation target 5a is separated from the mask 4a and the above-described alignment process is performed, when the first positional error is equal to or less than the first reference value, the film formation object 5a and the mask 4a are regarded as being Made a state of alignment, Further, the film formation object 5a is lowered and placed on the mask 4a, and the rotating device 21 is rotated to move from the alignment place 16 to the film formation place 15.

After that, the auxiliary imaging device 46 images the film formation object 5a and the mask 4a positioned at the film formation site 15, and extracts the second position error, and compares it with the second reference value. In the case where the reference value is larger, the film formation object 5a and the mask 4a are returned to the alignment place 16 without performing the film formation process, and when the second reference value is equal to or lower than the second reference value, the system starts. Film forming engineering.

In this manner, the mask 4a and the film formation object that are rotated from the alignment position 16 to the film formation place 15 are rotated either when the alignment is performed again or when the alignment is not performed. The positional error between the objects 5a is detected as a second position error and compared with the second reference value.

Fig. 4(e) shows a state in which the film formation source 22 that has started to move while releasing the fine particles on one side is in front of the film formation object 5a.

When the film formation source 22 releases the fine particles of the film forming material from the discharge hole 23 and reaches the surface opposite to the film formation site 15, the discharged fine particles are brought to the film formation site 15.

At the film formation place 15, the surface of the mask 4a is exposed at the through hole 49a of the substrate holder 34a, and the fine particles reaching the film formation place 15 pass through the through hole 49a and the mask of the substrate holder 34a. In the window portion of 4a, the fine particles are attached to the surface of the film object 5a exposed on the window portion and adhered, and the film of the film forming material grows.

The film formation object 5a is in a state of being aligned with respect to the mask 4a, and is formed in a state in which the positional error is reduced with respect to the position of the mask 4a. Therefore, the film formation source 22 is formed. When the surface opposite to the film formation site 15 passes through the surface opposite to the film formation site 15, the fine particles reach the exposed portion of the mask 4a without any omission, and the film is accurately formed on the film formation object 5a. It should be at the location where the film is formed.

In the period from the substrate loading/unloading device 25 to the inside of the film forming chamber 11 by the substrate loading/unloading device 25, the unformed film forming object 5b is loaded into the film forming apparatus 22, and When the film is formed on the substrate moving device 27 and is formed on the film formation object 5a at the film formation site 15, the film is formed at the alignment site 16 by the main image pickup device 35. The alignment mark and the position of the film object 5b are imaged at the alignment mark of the mask 4b at the alignment site 16, and the first position error is detected by the main control device 36, and the alignment engineering is performed. Before the film source 22 passes through the location facing the film formation site 15, the positional error between the mask 4b of the alignment site 16 and the film formation object 5b is reduced.

Then, the film formation object 5b is placed on the mask 4b positioned at the alignment place 16 while being held in the aligned position, and is fixed to the rotating device 21 by the holding device 47b. At this point, the film formation object 5b and the mask 4b which are aligned are fixed to the rotating device 21.

Figure 4(f) shows the following states: In the alignment place 16, the film formation object 5b is placed on the mask 4b positioned at the alignment place 16, and is fixed by the holding device 47b at the film formation place. At 15 points, the film formation source 22 passes through the surface opposite to the film formation site 15.

Further, the film formation source 22 does not have a surface opposite to the alignment site 16, and the fine particles discharged from the film formation source 22 do not reach the substrate holder 34b positioned at the alignment site 16. Therefore, the film system does not grow at the film formation object 5b disposed on the substrate moving device 27 or the alignment site 16.

When the film formation source 22 is placed on the surface opposite to the film formation site 15, a film having a specific film thickness is formed at the film formation object 5a positioned on the film formation site 15. Next, as shown in Fig. 5(g), the rotating device 21 is rotated, and as shown in Fig. 5(h), the mask 4b and the unfilmed film which is aligned with respect to the mask 4b are formed. The film object 5b is fixed and moved to the film formation place 15, and the film formation object 5a on which the film is formed is moved together with the mask 4a to the alignment place 16, and the holding device 47a is released. By the substrate moving device 27, the film formation object 5a on which the film is formed is separated from the mask 4a, and then the film formation/removal device 25 is moved to the transfer chamber 12 by the substrate loading/unloading device 25. Then, it is carried out from the inside of the transfer chamber 12.

In Fig. 5(i), the state after the carry-out is shown. The film formation object 5a that has been carried out is carried into another vacuum chamber 14. The mask 4a separated from the film formation object 5a is not carried out, and remains on the substrate holder 34a.

As described above, when the film formation targets 5a and 5b which are not formed are rotated from the alignment place 16 to the film formation place 15, the film formation source 22 is placed in front of the film formation place 15 in advance. In the place other than the place, after the film formation objects 5a and 5b are stationary on the film formation place 15, the film formation source 22 is moved on the film formation place 15 when the film formation source 22 is released while releasing the fine particles. A film is formed at a portion where the window portions of the masks 4a, 4b of the objects 5a, 5b are located.

When a film is formed on the film formation object 5a (or 5b) at the film formation site 15, the film formation object 5b (or 5a) which is not formed can be disposed on the substrate at the alignment site 16. The device 27 is moved and aligned with respect to the mask 4b (or 4a).

In addition, the fine particles discharged from the film formation source 22 when the rotating device 21 rotates are not allowed to reach the surface of the film formation objects 5a and 5b that are rotated, or the microparticles are not allowed to reach the rotating device 21. An anti-adhesion plate that shields the fine particles is provided in a manner other than the portion of the film formation site 15.

Further, in the above example, the alignment between the masks 4a and 4b on the alignment position 16 and the film formation objects 5a and 5b is performed, but the masks 4a and 4b may not be disposed. The film formation objects 5a and 5b are placed on the substrate holders 34a and 34b on the substrate holders 34a and 34b to form a film formation process. In this case, alignment is performed on the substrate holders 34a and 34b in advance. In the alignment project, instead of using the alignment mark of the mask, the alignment marks of the substrate holders 34a and 34b are used to take out the substrate by the main imaging device 35 and the main control device 36. The first positional error between the holders 34a and 34b and the film formation objects 5a and 5b facing the substrate holders 34a and 34b, and between the film formation objects 5a and 5b and the substrate holders 34a and 34b. In the aligning process, when the first positional error is equal to or less than the first reference value, the film formation objects 5a and 5b are placed on the substrate holders 34a and 34b, and the film formation targets are held by the holding devices 47a and 47b. The objects 5a, 5b are fixed to the substrate holders 34a, 34b, and the rotating device 21 is rotated and rotated from the alignment place 16 to the film forming place 15, and the film is placed at the film forming place 15 When the auxiliary imaging device 45 captures the alignment mark of the film formation objects 5a and 5b and the alignment marks of the substrate holders 34a and 34b, the second position error is extracted and the second reference value is obtained. In comparison, when the second position error is equal to or less than the second reference value, the film formation process is started, and when the second position error is larger than the second reference value, the film formation object 5a can be formed. 5b returns from the film formation place 15 to the alignment place 16, and the alignment work is performed again.

Further, in each of the above-described examples, the film formation objects 5a and 5b that are loaded on the substrate moving device 27 with respect to the masks 4a and 4b positioned at the alignment position 16 or the rotating device 21 are configured. In the state in which the film formation objects 5a and 5b are placed on the substrate loading/unloading device 25, the substrate loading/unloading device 25 is moved and positioned in the same state. The first positional error between the masks 4a and 4b at the position 16 or the rotating device 21 is reduced, and then the film formation objects 5a and 5b are placed on the masks 4a and 4b on the alignment place 16 or On the substrate holders 34a, 34b.

As described above, when the film formation is performed at the film formation site 15 and the alignment is performed at the alignment site 16, the main imaging device 35 is disposed at the alignment site 16, and the film formation object is disposed. 5a, 5b and the alignment marks of the masks 4a, 4b are imaged, and according to the result, the alignment operation is performed by the main control device 36, and further, by the auxiliary imaging device 45, it is moved to the rotation. When the film formation objects 5a and 5b at the film site 15 and the masks 4a and 4b or the second position error between the rotating devices 21 are confirmed, when the second position error is larger than the second reference value, , can be re-aligned.

In addition, when the first positional error is large, the main control device 36 can adjust the rotational speed of the rotating device 21, for example, so that the film formation object 5a generated during the rotation can be formed. The change in the relative position between the 5b and the masks 4a, 4b is reduced.

In the case where the second positional error of the film formation objects 5a and 5b is large, the film formation object 5a, 5b which is aligned in the subsequent direction can be moved by the film formation process. When the film formation position is 15, the rotational speed is slowed, and the relative position between the film formation objects 5a and 5b and the masks 4a and 4b which are rotated from the alignment position 16 to the film formation place 15 is changed. Zoom out.

In addition, in the film formation place 15, it is impossible to reduce the second position error between the film formation objects 5a and 5b and the masks 4a and 4b or between the film formation objects 5a and 5b and the rotating device 21. The relative position is changed.

In addition, in the above embodiment, although in addition to the main control device The auxiliary control device 46 is further provided in addition to the third control unit 46. However, the operation of the main control device 36 and the operation of the auxiliary control device 46 may be performed by one control device. The main control unit 36 and the auxiliary control unit 46 are regarded as one control unit.

Although the film formation material is an organic compound, the film formation source 22 may be configured to emit particles of an inorganic compound.

Further, in the above-described example, the first and second positional errors are positive, and when the first positional error is equal to or less than the first reference value, it is considered that the alignment is performed, but the configuration may be configured. In order to make the first position error smaller than the first reference value, it is considered that the opponent is performed.

In the above example, the film formation process is started when the second position error is equal to or lower than the second reference value. However, the second position error may be set to be less than the second reference value. When, start the film forming project.

In addition, although the first reference value and the second reference value are the same numerical values, when the position error due to the rotation is allowed to be allowed, the second reference value may be set to be smaller. The first reference value is larger.

Further, the present invention also includes an invention that does not have an auxiliary imaging device.

4a, 4b‧‧‧ mask

10‧‧‧film forming device

11‧‧‧ Filming room

12‧‧‧Transfer room

13‧‧‧ moving into and out of the room

14‧‧‧vacuum room

15‧‧‧ film formation site

16‧‧‧ Alignment place

18, 19‧‧‧ vacuum exhaust

21‧‧‧Rotating device (rotary table)

22‧‧‧ Film source

23‧‧‧ Release hole

25‧‧‧Substrate loading and unloading device

27‧‧‧Substrate mobile device

31‧‧‧ Film source mobile device

32‧‧‧Rotary axis

33‧‧‧ Rotating Center

34a, 34b‧‧‧ substrate holder

35‧‧‧Main camera

36‧‧‧Main control unit

37‧‧‧Rotary axis

38‧‧‧ wrist

39‧‧‧Hand

45‧‧‧Auxiliary camera

46‧‧‧Auxiliary control device

47a, 47b‧‧‧ Keeping device

49a, 49b‧‧‧through holes

Claims (13)

A film forming apparatus comprising: a film forming chamber; and a rotating device disposed in the film forming chamber, and provided with a plurality of substrate holders for arranging a mask and a film forming object, and Rotating in the film forming chamber; and the main imaging device images the above-mentioned mask disposed on the substrate holder positioned at the alignment position and the film formation object facing the mask; and The control device obtains a first positional error between the mask and the film formation object based on an imaging result of the main imaging device, and reduces the first position error to form the film. The object moves, and the film formation object is placed in the mask in a state where the object is aligned; and the film formation source is disposed inside the film forming chamber, and the fine particles of the film forming material are discharged; And a film formation source moving device that moves the film formation source inside the film formation chamber and passes it to a position opposite to the film formation site, and is aligned before the rotation of the rotation device The mask and the film formation object are moved from the alignment position to the film formation site, and the film formation source passes through the surface opposite to the film formation site while the fine particles are discharged, and the fine particles pass through The through hole of the substrate holder and the window portion of the mask reach the film formation object to form a film. The film forming apparatus according to the first aspect of the invention, wherein the auxiliary imaging device that images the mask and the film formation object positioned at the film formation site is provided, according to the auxiliary image pickup device As a result of the imaging, the second positional error between the film formation object and the mask is taken out. The film forming apparatus according to the first aspect of the invention, further comprising: a holding device that fixes the mask and the film formation object placed on the mask to the rotating device. The film forming apparatus according to claim 2, further comprising a holding device that fixes the mask and the film formation object placed on the mask to the rotating device. The film forming apparatus according to the second aspect of the invention, wherein the second position error is compared with a second reference value, and when the second position error is larger than the second reference value, The film formation object is returned to the alignment position together with the mask by the rotation of the rotating device without forming the film. The film forming apparatus according to claim 4, wherein the second position error is compared with a second reference value, and when the second position error is larger than the second reference value, The film formation object is returned to the alignment position together with the mask by the rotation of the rotating device without forming the film. A film forming apparatus characterized by comprising: a film forming chamber; and The rotating device is disposed in the film forming chamber, and is provided with a plurality of substrate holders that are arranged to form a film object, and is rotated in the film forming chamber; and the main image capturing device is positioned at the position where the positioning device is located The substrate holder and the film formation object facing the substrate holder are imaged; and the control device is configured to take out between the substrate holder and the film formation object based on the imaging result of the main imaging device. In the first positional error, the film formation object is moved so that the first position error is reduced, and the film formation object is placed on the substrate holder in a state of being aligned; a film forming source disposed inside the film forming chamber and releasing fine particles of a film forming material; and a film forming source moving device for moving the film forming source inside the film forming chamber and passing it In the place on the opposite side of the film formation site, the substrate holder and the film formation object which are aligned by the rotation of the rotating device are moved from the alignment position to the aforementioned Properties, forming the source line side by side releasing the fine particles forming the surface properties of the opposing properties, the fine particles, the line through the through holes of the substrate holder and reaches the object to be film to form a film. The film forming apparatus according to claim 7, wherein the substrate support for the position at the film forming place is provided The auxiliary imaging device that images the film formation target and the image pickup device obtains a second positional error between the film formation object and the mask based on the result of the image pickup by the auxiliary image pickup device. The film forming apparatus according to claim 7, further comprising a holding device that fixes the substrate holder and the film formation object placed on the substrate holder to the rotating device. The film forming apparatus according to the invention of claim 8, wherein the substrate holder and the film forming object placed on the substrate holder are fixed to the rotating device. The film forming apparatus according to claim 8, wherein the second position error is compared with a second reference value, and when the second position error is larger than the second reference value, The film formation object is returned to the alignment position by the rotation of the rotating device without being formed into the film. The film forming apparatus according to claim 10, wherein the second position error is compared with a second reference value, and when the second position error is larger than the second reference value, The film formation object is returned to the alignment position by the rotation of the rotating device without being formed into the film. The film forming apparatus according to any one of the preceding claims, wherein the substrate holder is provided in two, and the substrate support of the two rotating machines is centered on the center of rotation of the rotating device. The holders are placed at opposite sides of each other.