CN107429387B - Film forming device - Google Patents
Film forming device Download PDFInfo
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- CN107429387B CN107429387B CN201680015597.4A CN201680015597A CN107429387B CN 107429387 B CN107429387 B CN 107429387B CN 201680015597 A CN201680015597 A CN 201680015597A CN 107429387 B CN107429387 B CN 107429387B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/52—Means for observation of the coating process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of inexpensive and higher film forming device of production is provided.The rotating device (21) being made of turntable is configured in the inside of film forming room (11), after having carried out the alignment of film forming object (5a, 5b) in alignment place (16), configuration has carried out the film forming object (5a, 5b) of the alignment between mask (4a, 4b) on the substrate holder (34a, 34b) for being set to rotating device (21), rotates rotating device (21) and is moved in film forming place (15).Then, it moves film deposition source (22) while discharging the fine particle of filmogen, forms film on the film forming object (5a, 5b) in film forming place (15).At this point, the film forming object (5a, 5b) not formed a film can be configured in alignment place (16) and be aligned.Therefore, in this film forming device (10), device needed for having a film deposition source (22) and an alignment.
Description
Technical field
The present invention relates to the technical fields of film forming device, in particular to the film that film is efficiently formed forms dress
It sets.
Background technique
When forming the film of filmogen on the large-scale film forming object such as glass substrate, following technology is widely used:
Film forming object is configured in vacuum chamber, on one side from fine particles such as the steams of film deposition source release filmogen, makes it on one side
It is mobile in the position opposed with film forming object, so that fine particle is attached to the surface of film forming object.
The appended drawing reference 110 of Fig. 6 is the film forming device of the technology, around conveying chamber 112 configuration there are two at
Film room 111a, 111b and multiple vacuum chambers 113, each room 111a, 111b, 113 are connected to conveying chamber 112.
It is each configured with substrate holder 121 in the inside of Liang Ge film forming room 111a, 111b, in the top of substrate holder 121
Configured with the filming apparatus such as camera 135, film deposition source 122 is configured in lower section.
Film deposition source 122 is installed on film deposition source mobile device 131, if film deposition source mobile device 131 acts, film deposition source 122
It is moved back and forth in the horizontal direction in the lower position of substrate holder 121.
The substrate moving device 125 being made of substrate conveyer robot is configured in the inside of conveying chamber 112.Fig. 6's (b)
Appended drawing reference 105a, which is shown, to be moved to the inside of film forming room 111a and configured in substrate holder 121 by substrate moving device 125
On film forming object.
When film forming object 105a is moved in film forming room 111a, before being configured on substrate holder 121,
It is configured in alignment mobile device (not shown) in the inside of film forming room 111a, in this state, is formed a film by 135 Duis of filming apparatus
The alignment mark of object 105a and the alignment mark of substrate holder 121 are shot, and shooting result is output to control device
136, the location error to form a film between object 105a and substrate holder 121 is detected, and film forming object 105a utilizes control
Device 136 is mobile in a manner of making location error become smaller, and is configured on substrate holder 121 with the state that location error becomes smaller.
Through hole is equipped on substrate holder 121, the surface for being configured at the film forming object 105a of substrate holder 121 is being passed through
Expose the bottom surface of through-hole.
The part facing with film forming object 105a in the surface of film deposition source 122 is equipped with multiple relief holes 123, if
The mobile film deposition source 122 of film deposition source mobile device 131 is utilized while discharging the fine particle of filmogen from relief hole 123,
Then fine particle reaches the surface exposed in the through hole bottom surface of film forming object 105a, adheres to and grows film.
In Fig. 6 (b), the phase of film is formed on the surface of film forming object 105a in the inside in a film forming room 111a
Between, the film forming object 105b for being placed in substrate moving device 125 is moved to the inside of another film forming room 111b.
In this way, Fig. 6 (a), Fig. 6 (b) film forming device 110 in, the inside in a film forming room 111a at
During the surface of film object 105a forms film, the film forming not formed a film can be moved in the inside of another film forming room 111b
Object 105b, and carry out film forming object 105b contraposition, therefore can not interrupt to film forming object 105a, 105b at
Membrane process.
However, in the film forming device 110, although Liang Ge film forming room 111a, 111b share the mobile dress of a substrate
125 are set, but is each configured with film deposition source 122 and film deposition source mobile device 131 in the inside of Liang Ge film forming room 111a, 111b, no
It can realize low cost.
In the film forming device 210 of Fig. 7 (a), film forming room 211 and more is connected with around conveying chamber 212
A vacuum chamber 214, and there are two substrate holder 221a, 221b in the configuration of the inside of a film forming room 211.
Film deposition source mobile device 231 spreads the lower position of a substrate holder 221a with another substrate holder 221b's
Configure to lower position, it, being capable of one side and two bases if a film deposition source 222 is moved using film deposition source mobile device 231
Any of board mount 221a, 221b are facing to be moved on one side.
Therefore, as shown in Figure 7 (b), the configuration film forming object 205a on a substrate holder 221a, in the film forming object
The lower position of object 205a discharges the fine particle of filmogen from relief hole 223 on one side, makes film deposition source 222 and film forming on one side
Object 205a is moved face to face, can be in the substrate being configured in conveying chamber 212 during being growing out film
The film forming object 205b not formed a film is loaded in mobile device 225, is moved in into film forming room 211, and is carried out and another substrate
The alignment of bracket 221b.
However, although a film deposition source 222 can be arranged, being needed in each substrate branch in the film forming device 210
Filming apparatus 235, alignment mobile device are respectively configured on frame 221a, 221b, it is desirable that the further film forming device of low cost.
Patent document 1: Japanese Unexamined Patent Publication 2012-174609 bulletin.
Patent document 2: Japanese Patent 4510609.
Summary of the invention
The present invention is made to solve the unfavorable condition of the above-mentioned prior art, its purpose is to provide it is a kind of it is low at
This film forming device.
To solve the above-mentioned problems, the present invention is a kind of film forming device, which includes film forming room；
Rotating device is configured in above-mentioned film forming room, multiple substrate holders equipped with configuration mask and the object that forms a film, and above-mentioned
It is rotated in film forming room；Main filming apparatus, to be located at alignment field aforesaid substrate bracket on the aforementioned mask that configures and
Facing above-mentioned film forming object is shot with aforementioned mask；Control device, according to the shooting of above-mentioned main filming apparatus
As a result, finding out the first position error between aforementioned mask and above-mentioned film forming object, keep above-mentioned film forming object mobile, so as to
Reduce above-mentioned first position error, above-mentioned film forming object is configured at by aforementioned mask with the state aligned；Film deposition source,
Its inside for being configured at above-mentioned film forming room, discharges the fine particle of filmogen；And film deposition source mobile device, make it is above-mentioned at
Film source moves through the place facing with film forming place in the inside of above-mentioned film forming room, by the rotation of above-mentioned rotating device
Turn, the aforementioned mask aligned and above-mentioned film forming object is made to be moved to above-mentioned film forming place from above-mentioned alignment place, on
It states film deposition source and passes through the place facing with above-mentioned film forming place while discharging above-mentioned fine particle, above-mentioned fine particle is logical
It crosses the through hole of aforesaid substrate bracket and the window portion of aforementioned mask and reaches above-mentioned film forming object, form film.
The film forming device that the present invention is discussed further below, be equipped with to be located at above-mentioned film forming place aforementioned mask with it is upper
State the auxiliary filming apparatus that is shot of film forming object, according to taken by above-mentioned auxiliary filming apparatus as a result, finding out on
State the second position error between film forming object and aforementioned mask.
The present invention is following film forming devices, has the above-mentioned film forming by aforementioned mask and configuration in aforementioned mask
Object is fixed on the holding meanss of above-mentioned rotating device.
The present invention is following film forming devices: said second position error is by compared with the second a reference value, above-mentioned
In the case that two location errors are bigger than above-mentioned second a reference value, above-mentioned film forming object does not form above-mentioned film, but by upper
The rotation for stating rotating device returns to above-mentioned alignment place together with aforementioned mask.
The present invention is a kind of film forming device, which includes film forming room；Rotating device is configured at
In above-mentioned film forming room, equipped with multiple substrate holders for film forming object configuration, and rotated in above-mentioned film forming room；Main shooting dress
Set, to be located at alignment field aforesaid substrate bracket and the film forming object facing with aforesaid substrate bracket shoot；
Control device is found out between aforesaid substrate bracket and above-mentioned film forming object according to the shooting result of above-mentioned main filming apparatus
First position error, keep above-mentioned film forming object mobile, to reduce above-mentioned first position error, with the shape aligned
Above-mentioned film forming object is configured at aforesaid substrate bracket by state；Film deposition source is configured at the inside of above-mentioned film forming room, release film forming
The fine particle of material；And film deposition source mobile device, move through above-mentioned film deposition source in the inside of above-mentioned film forming room
With the facing place in film forming place, by the rotation of above-mentioned rotating device, make the aforesaid substrate bracket aligned with it is upper
It states film forming object and is moved to above-mentioned film forming place from above-mentioned alignment place, above-mentioned film deposition source discharges above-mentioned fine particle one on one side
While by the place facing with above-mentioned film forming place, above-mentioned fine particle is reached by the through hole of aforesaid substrate bracket
Film forming object is stated, film is formed.
The present invention is following film forming devices, be equipped with to be located at above-mentioned film forming place aforesaid substrate bracket with it is above-mentioned
The auxiliary filming apparatus that film forming object is shot, as a result, finding out above-mentioned according to taken by above-mentioned auxiliary filming apparatus
The second position error to form a film between object and aforementioned mask.
The present invention is following film forming devices, is had aforesaid substrate bracket and configuration on aforesaid substrate bracket
Above-mentioned film forming object is fixed on the holding meanss of above-mentioned rotating device.
The present invention is following film forming devices: said second position error is by compared with the second a reference value, above-mentioned
In the case that two location errors are bigger than above-mentioned second a reference value, above-mentioned film forming object does not form above-mentioned film, but by upper
The rotation for stating rotating device returns to above-mentioned alignment place.
The present invention is following film forming devices: aforesaid substrate bracket there are two setting, in the rotation of above-mentioned rotating device
Centered on the heart, two aforesaid substrate branch are set up in reciprocal side.
In accordance with the invention it is possible to form a film on one side in the case where the device needed for being not provided with multiple film deposition sources and contraposition
The surface of object forms film, carries out the contraposition of other film forming objects on one side.
By holding meanss, the generation of the location error in moving in rotation can be prevented, in the feelings for producing location error
Under condition, it can be detected before film forming using auxiliary filming apparatus, and aligned again, therefore there is no by moving in rotation
Unfavorable condition caused by the location error of middle generation.
Detailed description of the invention
Fig. 1 is the inside top figure of film forming device of the invention.
Fig. 2 (a1) is the line A-A cut-away sectional view of Fig. 1, and Fig. 2 (a2) is for being illustrated using line A-A cut-away sectional view
The figure of state configured with film forming object, Fig. 2 (b1) is the line B-B cut-away sectional view of Fig. 1, and Fig. 2 (b2) is for using
Line B-B cut-away sectional view illustrates the figure of the state configured with film forming object.
Fig. 3 (a) ~ Fig. 3 (c) is for illustrating the top view of film formation process (1).
Fig. 4 (d) ~ Fig. 4 (f) is for illustrating the top view of film formation process (2).
Fig. 5 (g) ~ Fig. 5 is (i) for illustrating the top view of film formation process (3).
Fig. 6 (a), Fig. 6 (b) are the film forming devices (1) of the prior art.
Fig. 7 (a), Fig. 7 (b) are the film forming devices (2) of the prior art.
Specific embodiment
Film forming device of the invention is illustrated.
Referring to Fig.1, film forming device 10 of the invention has conveying chamber 12.
The film forming room 11 for forming film, the preceding processing and post-processing for carrying out film formation are configured with around conveying chamber 12
Vacuum chamber 14 and carry out the moving out of moving in of moving out of film forming object and move in room 13, each room 11,13,14 is connected to conveying
Room 12.
It is equipped with vacuum pumping hardware in each room 11 ~ 14, is respectively structured as being vacuum-evacuated.The appended drawing reference 18 of Fig. 1 is
It is connected to the vacuum pumping hardware of film forming room 11, appended drawing reference 19 is the vacuum pumping hardware for being connected to conveying chamber 12.Each room 11 ~
14 are set as being vacuum-evacuated, and are formed with vacuum environment.The vacuum valve that each room 11 ~ 14 can be opened and closed separates, but omits
The explanation of opening and closing.
It is moved out in the inside of conveying chamber 12 equipped with substrate and moves in device 25.Substrate, which moves out, moves in device 25 with arm 38 and machine
Device hand 39, and be configured to, if keeping arm 38 flexible by the rotation of rotary shaft 37, mechanical hand 39 moves in the horizontal plane.
It is placed in mechanical hand 39 in the film forming object that film forming room 11 forms film, in each room 11,13,14 and conveying chamber
It is moved between 12, is configured at and moves out the film forming object for moving in room 13 and be placed in mechanical hand 39 and move in room 13 from moving out and take
Out, it by conveying chamber 12, is moved in film forming room 11 or other vacuum chambers 14.
Disk-shaped rotating device 21 is equipped on the internal water level land of film forming room 11.
Here, Fig. 2 (a1) is the line A-A cut-away sectional view of Fig. 1, and Fig. 2 (b1) is the line B-B cut-away sectional view of Fig. 1.Figure
Appended drawing reference 32 2(a1) shows one end and is vertically mounted in the rotary shaft of rotating device 21.
Driving devices 48, the other ends of rotary shaft 32 such as motor, which are equipped with, in the outside of film forming room 11 is connected to driving device
48, if driving device 48 acts, rotary shaft 32 is rotated around the central axis of rotary shaft 32.
Moreover, if rotary shaft 32 is rotated around center axis thereof, rotating device 21 is to be equipped with the part of rotary shaft 32
Centered on center, that is, rotation center 33, rotate in the same plane.It here is to rotate in the horizontal plane.
A surface side (being the bottom surface side of film forming room 11 here) in the two sides of rotating device 21 is mobile configured with film deposition source
Device 31.Rotating device 21 be configured to be divided into positioned at the surface of film deposition source mobile device 31 part and be located at
Two parts of the part of the surface of film source mobile device 31, when having rotated 180 degree centered on rotation center 33, before
It is partially moved to not directly on top place positioned at the surface of film deposition source mobile device 31, is not located at film deposition source before and moves
The surface of dynamic device 31 is partially moved to directly on top place.
In the surface positioned at film deposition source mobile device 31 of another surface side (being ceiling side here) of rotating device 21
Match configured with auxiliary filming apparatus 45 in the top of the part for the surface for not being located at film deposition source mobile device 31 partial top
It is equipped with main filming apparatus 35 and substrate moving device 27.
Main filming apparatus 35 is connected to the main control dress in the exterior arrangement of film forming room 11 with auxiliary filming apparatus 45
36 and sub-controlling unit 46 are set, indicate the signal for the shooting result that main filming apparatus 35 takes and indicate auxiliary filming apparatus
The signal of 45 shooting results taken is exported to main control unit 36 and sub-controlling unit 46 respectively.
Be formed with multiple through hole 49a, 49b in rotating device 21, each through hole 49a, 49b and each through hole 49a,
The marginal portion of 49b, composition have multiple substrate holder 34a, 34b.In the rotating device 21, centered on rotation center 33,
It is respectively formed with substrate holder 34a, a 34b in the position of mutually opposite side, is respectively configured in each substrate holder 34a, 34b
There are mask 4a, 4b.Mask 4a, 4b are laminal metal plates, are positioned in through hole 49a, 49b's of substrate holder 34a, 34b
On edge.In mask 4a, 4b, it is formed with window portion, the through hole of substrate holder 34a, 34b 49a, 49b in defined position
In the bottom surface of mask 4a, 4b.
When the rotation by rotating device 21 makes substrate holder 34a, 34b moving in rotation, as substrate holder 34a, 34b
It can be in the place of the internal stationary of film forming room 11, if the place that will be close to conveying chamber 12 is set as alignment place with mask 4a, 4b
16, by centered on rotation center 33 and the place of the side opposite with place 16 is directed at is set as film forming place 15, then film deposition source
Mobile device 31 and auxiliary filming apparatus 45 are configured at place that can be facing with film forming place 15, main filming apparatus 35 and base
Plate mobile device 27 is configured at place that can be facing with place 16 is directed at.
The film forming object for being moved to the inside of film forming room 11 from conveying chamber 12 is configured in substrate moving device 27 first.
The appended drawing reference 5a of Fig. 3 (a) indicates the film forming object for being configured at substrate moving device 27.
It is respectively equipped with alignment mark on film forming object 5a and mask 4a, 4b, if shooting base using main filming apparatus 35
The alignment mark of film forming object 5a in plate mobile device 27 and the alignment mark of mask 4a, and the letter that will indicate shooting result
Number it is output to main control unit 36, then main control unit 36 is utilized, according to the opposite position of the alignment mark in shooting result
Relationship, find out opposite position between the film forming object 5a and mask 4a on substrate moving device 27, with it is ideal
Error, that is, first position error on alignment place 16 between opposite position.
Substrate moving device 27 is controlled by main control unit 36.
It is stored with the first, second a reference value in main control unit 36, using main control unit 36, compares first position mistake
Difference and first reference value in the case that error is bigger than first reference value in first position, make form a film object 5a and mask 4a phase
It moves over the ground and reduces location error, find out first position error again by the shooting of main filming apparatus 35.
In this way, main control unit 36 carries out aligning process as follows, which repeats by main filming apparatus 35
Shooting find out first position error, by first position error compared with first reference value and in first position error than
So that film forming object 5a and mask 4a is relatively moved and is reduced location error in the case that one a reference value is big, is missed in first position
When difference reaches first reference value or less, being considered as film forming object 5a and mask 4a becomes the state that contraposition is completed, and makes film forming pair
Film forming object 5a is configured on mask 4a as object 5a decline.
On substrate holder 34a, 34b be equipped with holding meanss 47a, 47b, be aligned place 16 on mask 4a, 4b and with
Film forming object 5a, 5b on mask 4a, 4b, which are configured, relative to mask 4a, 4b state aligned is kept device
47a, 47b clamping, and substrate holder 34a, 34b are fixed on using holding meanss 47a, 47b.By the state indicate Fig. 2 (a2),
In Fig. 2 (b2), Fig. 3 (b).
Since substrate holder 34a, 34b are fixed in rotating device 21, it is fixed on the film forming of substrate holder 34a, 34b
Object 5a, 5b are fixed in rotating device 21.
Here, holding meanss 47a, 47b are will to configure the film forming object on mask 4a, 4b with the state after aligning
5a, 5b press and are held in the device of rotating device 21 together with mask 4a, 4b, and holding meanss 47a, 47b, which can be, utilizes bullet
Spring pressing and fixed device are also possible to consolidate mask 4a, 4b and film forming object 5a, 5b bonding using bonding sheet
Due to the device of rotating device 21.
In addition, holding meanss 47a, 47b can also be set as, in advance by the magnetic material being attracted to a magnet of rotating device 21
It is formed, magnet possessed by holding meanss 47a, 47b is configured on film forming object 5a, the 5b configured on mask 4a, 4b,
By generating attraction between magnet and rotating device 21, thus the film forming by mask 4a, 4b and configuration on mask 4a, 4b
Object 5a, 5b are fixed on rotating device 21.
Next, if rotating device 21 is rotated centered on rotation center 33, multiple (being two here) substrate holders
34a, 34b are such as shown in Figure 3 together with mask 4a, 4b on substrate holder 34a, 34b, with identical rotation center 33
Centered on to identical direction rotate identical angle.
If rotating device 21 rotates 180 degree, such as shown in Fig. 4 (d), it is located at the substrate holder 34a in alignment place 16 before
It is moved to film forming place 15, the substrate holder 34b for being located at film forming place 15 before is moved to alignment place 16.
At this point, since mask 4a and film forming object 5a of the configuration on mask 4a are rotated together with, even if increasing
The rotation speed of rotating device 21 will not generate position between the film forming object 5a on mask 4a in mask 4a and configuration
Offset is set, the state of contraposition is maintained.
Film deposition source mobile device 31 spreads the field of the both sides in the place and form a film place 15 facing with film forming place 15
Institute's ground configuration, film deposition source 22 utilize film deposition source mobile device 31, can pass through the place facing with film forming place 15.
Position in the surface of film deposition source 22, can be facing with film forming place 15 is equipped with relief hole 23, from release
The fine particle of the release of hole 23 filmogen.
The fine particle of filmogen can be generated in the inside of film deposition source 22, can also will utilize the generation of another device
Fine particle is moved to film deposition source 22 and discharges from the relief hole of film deposition source 22 23.
The single side of mask 4a on film forming place 15 exposes under the bottom surface of the through hole 49a of substrate holder 34a.
After rotating device 21 rotates 180 degree, when becoming static, in the static mask 4a in place 15 that forms a film to fiducial mark
Remember and shot with the alignment mark of the film forming object 5a on mask 4a by auxiliary filming apparatus 45, shooting result is output to auxiliary
Help control device 46.
Sub-controlling unit 46 is according to the opposite position between the mask 4a for being located at film forming place 15 and film forming object 5a
Relationship is set, the second position error as the location error on film forming place 15 is found out, by second position error and the second benchmark
Value compares, and comparison result is output to main control unit 36.
Main control unit 36 on one side discharges film deposition source 22 in the case where second position error is the second a reference value situation below
Fine particle starts the movement carried out by film deposition source mobile device 31 on one side.
It is being phase with the first reference value of first position application condition and with the second a reference value of second position application condition
With value in the case where, if second position error is big than the second a reference value, due to rotating device 21 high speed rotation with promptly
Stop, causing the mask 4a rotated and the relative position for the object 5a that forms a film to change, location error becomes larger.
If second position error is bigger than the second a reference value, main control unit 36 does not start moving and making to revolve for film deposition source 22
Rotary device 21 rotates, and returns to the mask 4a for being located at film forming place 15 with film forming object 5a and is directed at place 16.
Then, the holding carried out by holding meanss 47a is released, the object 5a that makes to form a film is as relative to mask 4a, rotation
The state that device 21 can move, then, main control unit 36 act substrate moving device 27, leave film forming object 5a
Mask 4a carries out above-mentioned contraposition process, when in first position, error reaches first reference value or less, be considered as film forming object 5a with
Mask 4a becomes the state for completing contraposition, makes film forming object 5a decline and is configured on mask 4a, revolves rotating device 21
Turn, is moved to film forming place 15 from alignment place 16.
Then, the film forming object 5a and mask 4a in film forming place 15 are located at using the auxiliary shooting of filming apparatus 46, is found out
The second position error in the case where bigger than the second a reference value, makes to form a film without film formation process compared with the second a reference value
Object 5a is directed at place 16 with mask 4a return, in the second a reference value situation below, starts film formation process.
In this way, being moved in the case where being aligned again and in the case where not aligned from the rotation of alignment place 16
The location error moved between the mask 4a in film forming place 15 and film forming object 5a is all detected as second position error
Out, and with the second a reference value it is compared.
Fig. 4 (e) is shown starts mobile film deposition source 22 and film forming object 5a practises physiognomy while discharging fine particle
To state before.
If 22 one side of film deposition source discharges the fine particle of filmogen from relief hole 23, reach on one side and film forming 15 phase of place
The place faced, the then fine particle released reach film forming place 15.
In film forming place 15, the surface of mask 4a is exposed in the through hole 49a of substrate holder 34a, reaches film forming place
15 fine particle passes through the window portion of the through hole 49a and mask 4a of substrate holder 34a, and fine particle reaches and is attached to film forming
The surface in window portion exposing in object 5a, grows the film of filmogen.
The object 5a that forms a film is to be subtracted relative to the state after mask 4a contraposition with the location error relative to mask 4a
Small state forms film, therefore 22 one side of film deposition source and film forming place 15 are facing, on one side by practising physiognomy with film forming place 15
Pair place, reach to fine particle exhaustive the part of the exposing of mask 4a, film forming object 5a on should form film
Position accurately form film.
To film deposition source 22 by with before the facing place in film forming place 15, moved out using substrate move in device 25 at
The film forming object 5b not formed a film is moved in the inside of film room 11, and is configured on substrate moving device 27, when positioned at film forming field
When forming film on 15 film forming object 5a, at alignment place 16, using the shooting of main filming apparatus 35 do not form a film at
The alignment mark of film object 5b is directed at the alignment mark of the mask 4b in place 16 with being located at, and is detected using main control unit 36
First position error carries out contraposition process, before film deposition source 22 is by the place facing with film forming place 15, makes alignment field
16 mask 4b and film forming object 5b between location error become smaller.
Next, the object 5b that forms a film is configured to and is located at alignment place 16 while maintaining the state after contraposition
On mask 4b, and it is fixed on rotating device 21 using holding meanss 47b, completes film forming object 5b and mask the 4b quilt of contraposition
It is fixed on rotating device 21.
Fig. 4 (f) is shown, and at alignment place 16, film forming object 5b is configured in the mask 4b for being located at alignment place 16
On, and to be kept the fixed state of device 47b, at film forming place 15, film deposition source 22 is to have passed through and film forming 15 phase of place
The state in the place faced.
In addition, film deposition source 22 will not be directed at that place 16 is facing, the fine particle that film deposition source 22 is discharged will not reach
Substrate holder 34b positioned at alignment place 16.Therefore, substrate moving device 27 will not be configured in, be aligned on place 16
Film is grown on film forming object 5b.
If film deposition source 22 is by the place facing with film forming place 15, in the film forming object being located on film forming place 15
The film of regulation film thickness is formed on object 5a.Then, as shown in Figure 5 (g) shows, rotating device 21 is rotated, as shown in Fig. 5 (h), will be covered
Mould 4b and fixed relative to the mask 4b film forming object 5b not formed a film for completing contraposition and be rotatably moved to film forming place 15,
And it moves together the film forming object 5a for being formed with film with mask 5a and is directed at place 16, release holding meanss 47a, benefit
After separating the film forming object 5a for being formed with film with mask 4a with substrate moving device 27, is moved out using substrate and move in dress
Setting 25 makes film forming object 5a be moved to conveying chamber 12, then moves out from the inside of conveying chamber 12.
Fig. 5 (i) shows the state after moving out.The film forming object 5a moved out is moved in other vacuum chambers 14.With at
The mask 4a of film object 5a separation is not moved out, but is stayed on substrate holder 34a.
As described above, film forming is rotatably moved to from alignment place 16 in film forming object 5a, the 5b not formed a film
When on place 15, film deposition source 22 is made to be located at the place other than the place facing with film forming place 15 in advance, in film forming object
After 5a, 5b are static on film forming place 15, if film deposition source 22 starts to move while discharging fine particle, in film forming field
Part where the window portion of mask 4a, 4b of film forming object 5a, 5b on 15 form film.
When form a film place 15 form a film object 5a(or 5b) on form film when, can alignment place 16 will not
The film forming object 5b(of film forming perhaps 5a) configuration on substrate moving device 27 and carries out relative to mask 4b(or 4a)
Contraposition.
Furthermore it is possible to be arranged block fine particle prevent plate, to be released when rotating device 21 is rotated from film deposition source 22
The fine particle put, which will not reach the surface of film forming object 5a, 5b of rotation or fine particle, will not reach rotating device
Part other than 21 part for being located at film forming place 15.
In addition, in above-mentioned example, although carried out mask 4a, 4b on alignment place 16 and film forming object 5a, 5b it
Between contraposition, but can in the case where mask 4a, 4b not being configured at substrate holder 34a, 34b will form a film object 5a, 5b
It is configured at substrate holder 34a, 34b and carries out film formation process, can be in this case, in advance in substrate holder 34a, 34b shape
Replace the alignment mark of mask in contraposition process at alignment mark, using the alignment mark of substrate holder 34a, 34b, utilizes
Main filming apparatus 35 finds out substrate holder 34a, 34b and the film forming facing with substrate holder 34a, 34b with main control unit 36
First position error between object 5a, 5b carries out the contraposition between film forming object 5a, 5b and substrate holder 34a, 34b
Process, when first position error is first reference value or less, by film forming object 5a, 5b configuration in substrate holder 34a, 34b
On, film forming object 5a, 5b are fixed on substrate holder 34a, 34b using holding meanss 47a, 47b, rotate rotating device 21
And it is rotatably moved to film forming place 15 from alignment place 16, it is static in film forming place 15, and shot using auxiliary filming apparatus 45
Form a film the alignment mark of object 5a, 5b and the alignment mark of substrate holder 34a, 34b, second position error is found out, with second
A reference value compares, and starts film formation process in the case where second position error is the second a reference value situation below, than the second a reference value
In the case where big, make to form a film object 5a, 5b carry out contraposition process from film forming place 15 back to alignment place 16 again.
In addition, making to load relative to mask 4a, the 4b or rotating device 21 for being located at alignment place 16 in above-mentioned each example
It is mobile in film forming object 5a, 5b of substrate moving device 27, then reduce first position error, but can also be in substrate
Move out the state moved in and be placed with film forming object 5a, 5b on device 25, make substrate move out move in device 25 it is mobile and reduce with
First position error between mask 4a, the 4b or rotating device 21 in alignment place 16, the object 5a that will form a film later,
5b configuration is on mask 4a, 4b on alignment place 16 or on substrate holder 34a, 34b.
As described above, in the case where forming a film the film forming of place 15 and being aligned in alignment place 16, Neng Gou
Alignment place 16 configures main filming apparatus 35, shoots to the alignment mark of film forming object 5a, 5b and mask 4a, 4b, with
The result carries out alignment operation using main control unit 36, and is moved to film forming using the auxiliary confirmation of filming apparatus 45 rotation
Second position error between film forming object 5a, the 5b and mask 4a, 4b or rotating device 21 in place 15, in the second position
In the case that error is bigger than the second a reference value, contraposition is re-started.
In addition, can be carried out reducing rotating device 21 by main control unit 36 in the biggish situation of first position error
The adjustment such as rotation speed, reduce the change of the relative position between film forming object 5a, the 5b generated when rotation and mask 4a, 4b
Change.
In addition, can also start film formation process in the biggish situation of second position error of film forming object 5a, 5b,
And when next making film forming object 5a, 5b for being aligned be moved to film forming place 15, reduce rotation speed, to subtract
The small relative position being rotatably moved to from alignment place 16 between film forming object 5a, the 5b and mask 4a, 4b in film forming place 15
Variation.
In addition, being set as to change between film forming object 5a, 5b and mask 4a, 4b or forming a film in film forming place 15
Relative position between object 5a, 5b and rotating device 21, to reduce second position error.
In addition, in the above-described embodiments, sub-controlling unit 46 is provided with independently of 36 ground of main control unit, but can also be with
The movement of main control unit 36 and the movement of sub-controlling unit 46 are carried out, by control device alternatively, it is also possible to by master control
Device 36 processed is considered as a control device with sub-controlling unit 46.
Although above-mentioned filmogen is organic compound, film deposition source 22 can also discharge the particle of inorganic compound.
In addition, in above-mentioned example, the first, second location error is positive number, it is set as in first position error being the first benchmark
Value completes contraposition when following, but also can be set to and complete contraposition than first reference value hour in first position error.
In addition, in above-mentioned example, start film formation process when second position error is the second a reference value or less, but can also be with
In the second position error less than the second a reference value when start film formation process.
In addition, though first reference value and the second a reference value are set as identical number, but generated in permission by rotation
In the case where small location error, the second a reference value can also be made to be greater than first reference value.
In addition, the present invention also includes the invention without auxiliary filming apparatus.
Description of symbols
4a, 4b ... mask
5a, 5b ... film forming object
10 ... film forming devices
15 ... film forming places
16 ... alignment places
21 ... rotating devices (turntable)
22 ... film deposition sources
25 ... substrates, which move out, moves in device
27 ... substrate moving devices
31 ... film deposition source mobile devices
33 ... rotation centers
34a, 34b ... substrate holder
35 ... main filming apparatus
36 ... main control units
45 ... auxiliary filming apparatus
46 ... sub-controlling units
48 ... driving devices.
Claims (9)
1. a kind of film forming device, which is characterized in that the film forming device includes
Film forming room；
Rotating device is configured in above-mentioned film forming room, multiple substrate holders equipped with configuration mask and the object that forms a film, and
It is rotated in above-mentioned film forming room；
Main filming apparatus, to configuration be located at alignment field aforesaid substrate bracket on aforementioned mask and and aforementioned mask
Facing above-mentioned film forming object is shot；
Control device is found out between aforementioned mask and above-mentioned film forming object according to the shooting result of above-mentioned main filming apparatus
First position error, keep above-mentioned film forming object mobile, to reduce above-mentioned first position error, with the shape aligned
Above-mentioned film forming object is configured at aforementioned mask by state；
Film deposition source is configured at the inside of above-mentioned film forming room, discharges the fine particle of filmogen；And
Film deposition source mobile device moves through above-mentioned film deposition source in the inside of above-mentioned film forming room facing with film forming place
Place,
By the rotation of above-mentioned rotating device, the aforementioned mask that is aligned and above-mentioned film forming object are from above-mentioned alignment place
It is moved to above-mentioned film forming place, above-mentioned film deposition source passes through while discharging above-mentioned fine particle practises physiognomy with above-mentioned film forming place
Pair place, above-mentioned fine particle reaches above-mentioned film forming pair by the through hole of aforesaid substrate bracket and the window portion of aforementioned mask
As object, film is formed,
Equipped with to the aforementioned mask and the auxiliary filming apparatus that is shot of above-mentioned film forming object for being located at above-mentioned film forming place,
As a result, finding out second between above-mentioned film forming object and aforementioned mask according to taken by above-mentioned auxiliary filming apparatus
Location error.
2. film forming device as described in claim 1, which is characterized in that
With the holding that the above-mentioned film forming object of aforementioned mask and configuration in aforementioned mask is fixed on to above-mentioned rotating device
Device.
3. film forming device as described in claim 1, which is characterized in that
Said second position error is bigger than above-mentioned second a reference value in said second position error by compared with the second a reference value
In the case of, above-mentioned film forming object does not form above-mentioned film, but by the rotation of above-mentioned rotating device, together with aforementioned mask
Back to above-mentioned alignment place.
4. film forming device as claimed in claim 2, which is characterized in that
Said second position error is bigger than above-mentioned second a reference value in said second position error by compared with the second a reference value
In the case of, above-mentioned film forming object does not form above-mentioned film, but by the rotation of above-mentioned rotating device, together with aforementioned mask
Back to above-mentioned alignment place.
5. a kind of film forming device, which is characterized in that the film forming device includes
Film forming room；
Rotating device is configured in above-mentioned film forming room, equipped with multiple substrate holders for film forming object configuration, and above-mentioned
It is rotated in film forming room；
Main filming apparatus, to be located at alignment field aforesaid substrate bracket and the film forming object facing with aforesaid substrate bracket
Object is shot；
Control device finds out aforesaid substrate bracket and above-mentioned film forming object according to the shooting result of above-mentioned main filming apparatus
Between first position error, keep above-mentioned film forming object mobile, to reduce above-mentioned first position error, to be aligned
State above-mentioned film forming object is configured at aforesaid substrate bracket；
Film deposition source is configured at the inside of above-mentioned film forming room, discharges the fine particle of filmogen；And
Film deposition source mobile device moves through above-mentioned film deposition source in the inside of above-mentioned film forming room facing with film forming place
Place,
By the rotation of above-mentioned rotating device, the aforesaid substrate bracket that is aligned and above-mentioned film forming object are from above-mentioned alignment
Place is moved to above-mentioned film forming place, and above-mentioned film deposition source passes through and above-mentioned film forming place while discharging above-mentioned fine particle
Facing place, above-mentioned fine particle reach above-mentioned film forming object by the through hole of aforesaid substrate bracket, are formed thin
Film,
It is filled equipped with the auxiliary shooting shot to the aforesaid substrate bracket and above-mentioned film forming object that are located at above-mentioned film forming place
It sets,
As a result, finding out between above-mentioned film forming object and aforesaid substrate bracket according to taken by above-mentioned auxiliary filming apparatus
Second position error.
6. film forming device as claimed in claim 5, which is characterized in that
Above-mentioned rotating dress is fixed on the above-mentioned film forming object on aforesaid substrate bracket by aforesaid substrate bracket and configuration
The holding meanss set.
7. film forming device as claimed in claim 5, which is characterized in that
Said second position error is bigger than above-mentioned second a reference value in said second position error by compared with the second a reference value
In the case of, above-mentioned film forming object does not form above-mentioned film, but returns to above-mentioned alignment by the rotation of above-mentioned rotating device
Place.
8. film forming device as claimed in claim 6, which is characterized in that
Said second position error is bigger than above-mentioned second a reference value in said second position error by compared with the second a reference value
In the case of, above-mentioned film forming object does not form above-mentioned film, but returns to above-mentioned alignment by the rotation of above-mentioned rotating device
Place.
9. such as film forming device described in any item of the claim 1 to 8, which is characterized in that
If there are two aforesaid substrate bracket, centered on the rotation center of above-mentioned rotating device, by two aforesaid substrate brackets that
This is set to opposite side.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-051304 | 2015-03-13 | ||
| JP2015051304A JP2017171946A (en) | 2015-03-13 | 2015-03-13 | Thin film deposition system |
| PCT/JP2016/052639 WO2016147710A1 (en) | 2015-03-13 | 2016-01-29 | Thin film forming apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107429387A CN107429387A (en) | 2017-12-01 |
| CN107429387B true CN107429387B (en) | 2019-09-03 |
Family
ID=56919675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680015597.4A Active CN107429387B (en) | 2015-03-13 | 2016-01-29 | Film forming device |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP2017171946A (en) |
| KR (1) | KR20170105614A (en) |
| CN (1) | CN107429387B (en) |
| TW (1) | TWI681065B (en) |
| WO (1) | WO2016147710A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6662841B2 (en) * | 2017-12-21 | 2020-03-11 | 株式会社アルバック | Vapor deposition equipment |
| JP7292948B2 (en) * | 2019-04-24 | 2023-06-19 | キヤノン株式会社 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW523943B (en) * | 2001-12-26 | 2003-03-11 | Ritdisplay Corp | Deposition apparatus of organic light emitting device |
| CN101084326A (en) * | 2004-10-22 | 2007-12-05 | 阿德文泰克全球有限公司 | Substrate-to-mask alignment and securing system |
| JP2010209459A (en) * | 2009-02-13 | 2010-09-24 | Hitachi High-Technologies Corp | Organic el device production device, film deposition system, organic el device production method, and film deposition method |
| JP2013171811A (en) * | 2012-02-23 | 2013-09-02 | Hitachi High-Technologies Corp | Deposition device |
| CN103710678A (en) * | 2012-09-28 | 2014-04-09 | 株式会社日立高新技术 | Vapor deposition apparatus and vapor deposition method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4701815B2 (en) * | 2005-04-26 | 2011-06-15 | 株式会社アルバック | Deposition equipment |
| JP4855398B2 (en) * | 2005-06-15 | 2012-01-18 | 株式会社アルバック | Film forming apparatus, thin film manufacturing apparatus, and film forming method |
| JP2013151760A (en) * | 2013-04-25 | 2013-08-08 | Hitachi High-Technologies Corp | Method for replacing shadow mask |
-
2015
- 2015-03-13 JP JP2015051304A patent/JP2017171946A/en active Pending
-
2016
- 2016-01-29 CN CN201680015597.4A patent/CN107429387B/en active Active
- 2016-01-29 WO PCT/JP2016/052639 patent/WO2016147710A1/en active Application Filing
- 2016-01-29 KR KR1020177023624A patent/KR20170105614A/en not_active Application Discontinuation
- 2016-01-29 JP JP2017506125A patent/JP6500084B2/en active Active
- 2016-02-19 TW TW105104939A patent/TWI681065B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW523943B (en) * | 2001-12-26 | 2003-03-11 | Ritdisplay Corp | Deposition apparatus of organic light emitting device |
| CN101084326A (en) * | 2004-10-22 | 2007-12-05 | 阿德文泰克全球有限公司 | Substrate-to-mask alignment and securing system |
| JP2010209459A (en) * | 2009-02-13 | 2010-09-24 | Hitachi High-Technologies Corp | Organic el device production device, film deposition system, organic el device production method, and film deposition method |
| JP2013171811A (en) * | 2012-02-23 | 2013-09-02 | Hitachi High-Technologies Corp | Deposition device |
| CN103710678A (en) * | 2012-09-28 | 2014-04-09 | 株式会社日立高新技术 | Vapor deposition apparatus and vapor deposition method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107429387A (en) | 2017-12-01 |
| JP2017171946A (en) | 2017-09-28 |
| WO2016147710A1 (en) | 2016-09-22 |
| JPWO2016147710A1 (en) | 2017-11-24 |
| KR20170105614A (en) | 2017-09-19 |
| JP6500084B2 (en) | 2019-04-10 |
| TW201641722A (en) | 2016-12-01 |
| TWI681065B (en) | 2020-01-01 |
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