TW201637779A - Cutting method and cutting device - Google Patents

Cutting method and cutting device Download PDF

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TW201637779A
TW201637779A TW104141441A TW104141441A TW201637779A TW 201637779 A TW201637779 A TW 201637779A TW 104141441 A TW104141441 A TW 104141441A TW 104141441 A TW104141441 A TW 104141441A TW 201637779 A TW201637779 A TW 201637779A
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cutting
cutting edge
mixture
workpiece
edge
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TW104141441A
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Chinese (zh)
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TWI695753B (en
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Yukiko Matsumoto
Michael Gadd
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Disco Corp
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Abstract

To provide a cutting method that can increase productivity or suppress degradation in quality of a work being cut, and to provide a cutting device. There is provided the cutting method for cutting a work using a cutting blade. The cutting method executes a cutting step of turning the cutting blade to cut the work while supplying a cutting water to the work (step ST1). The cutting method executes a step of spraying a mixture of a gas and a fine grain to the cutting blade during the cutting step (step ST4).

Description

切削方法及切削裝置 Cutting method and cutting device

本發明,係有關於切削方法及切削裝置。 The present invention relates to a cutting method and a cutting device.

將被形成有IC、LSI等之積體電路的晶片藉由樹脂來作了封裝之CSP(Chip Size Package)、QFN(Quad Flat Non-leaded package)等之矩形基板、或者是玻璃或藍寶石等之脆性材料之基板等的各種之基板、以及半導體晶圓或光元件晶圓,係沿著對於各元件作區劃之格子狀的溝道(street)而被作切斷。而,各種的基板,係被分割為各個的晶片(元件),被分割後之晶片(元件),係被廣泛利用在行動電話或個人電腦等之電性機器或電子零件中。 A rectangular substrate such as a CSP (Chip Size Package) or a QFN (Quad Flat Non-leaded package) in which a wafer having an integrated circuit such as an IC or an LSI is formed of a resin, or a glass or sapphire or the like Various substrates such as a substrate of a brittle material, and a semiconductor wafer or an optical element wafer are cut along a grid-like street that is divided for each element. Further, various substrates are divided into individual wafers (components), and the divided wafers (components) are widely used in electrical equipment or electronic components such as mobile phones and personal computers.

在上述基板等之被加工物的分割中,係使用有切削刃。切削刃,在使用開始之初始時,係能夠以使刃尖之形狀維持在特定之形狀的狀態下而遂行加工。故而,藉由使用開始之初始時的切削刃所分割出的晶片,係從表面起直到背面而垂直地被切斷。但是,切削刃,由於其之刃尖係會逐漸消耗,因此若是反覆進行被加工物之切削,則刃尖之形狀係會逐漸變化。因此,若是反覆進行被加工 物之切削,則在分割後的晶片處,係會產生轉印有切削刃之刃尖之形狀之虞。若是刃尖之形狀的變化變得過大,則會有在分割後之晶片的背面側處產生有不理想的突出部之虞。又,若是反覆進行被加工物之切削,則會在切削刃處附著有切削屑並產生堵塞,而變得無法對於基板適當地進行切削。故而,在被加工物的分割中,為了將切削刃之刃尖的形狀成形或者是為了將堵塞除去,係有必要定期性地進行刃尖之修整。 In the division of the workpiece such as the above-mentioned substrate, a cutting edge is used. When the cutting edge is initially used, the cutting edge can be processed while maintaining the shape of the blade tip in a specific shape. Therefore, the wafer divided by the cutting edge at the beginning of the start is cut vertically from the surface to the back surface. However, since the cutting edge is gradually consumed by the blade tip, if the workpiece is repeatedly cut, the shape of the blade edge gradually changes. Therefore, if it is processed repeatedly When the object is cut, the shape of the blade edge on which the cutting edge is transferred is generated at the divided wafer. If the change in the shape of the blade tip is too large, there is a possibility that an undesired protruding portion is formed on the back side of the divided wafer. Further, when the workpiece is repeatedly cut, the chips are adhered to the cutting edge and clogging occurs, and the substrate cannot be appropriately cut. Therefore, in the division of the workpiece, in order to shape the shape of the cutting edge of the cutting edge or to remove the clogging, it is necessary to regularly perform the trimming of the cutting edge.

因此,在先前技術之切削裝置中,係將修整板(dressing board)保持在用以保持被加工物之吸盤台或者是修整板用之保持部處。先前技術之切削裝置,係在被加工物之分割中,定期性地使切削刃對於修整板而作特定量之切入,並進行切削刃之修整(例如,參考專利文獻1以及專利文獻2)。 Therefore, in the cutting device of the prior art, the dressing board is held at the holding portion for holding the workpiece or the holding portion for the trimming plate. In the cutting device of the prior art, the cutting edge is cut into a predetermined amount for the dressing plate, and the cutting edge is trimmed (for example, refer to Patent Document 1 and Patent Document 2).

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本特開2010-000588號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-000588

[專利文獻2]日本特開2006-218571號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2006-218571

然而,在先前技術之切削裝置的構成中,由 於係將修整板作保持,並使切削刃對於修整板而作特定量之切入以進行切削刃之修整,因此,在修整板之保持以及對位中,係需要耗費時間,而有著無法將生產性充分地提昇的問題。 However, in the construction of the prior art cutting device, The system maintains the trimming plate and allows the cutting edge to cut a certain amount for the trimming plate to trim the cutting edge. Therefore, in the maintenance and alignment of the trimming plate, it takes time and cannot be produced. The problem of sexually adequately improving.

本發明之目的,係在於解決上述問題,並提供一種能夠提昇生產性或者是能夠對於被作切削之被加工物之品質降低的情形作抑制之切削方法以及切削裝置。 An object of the present invention is to solve the above problems and to provide a cutting method and a cutting apparatus capable of improving productivity or suppressing deterioration of the quality of a workpiece to be cut.

為了解決上述課題並達成目的,本發明之切削方法,係為使用切削刃來對於被加工物進行切削之切削方法,其特徵為,係具備有:對於被加工物供給切削水,並使該切削刃旋轉而切削該被加工物之切削工程;和在該切削工程中,對於該切削刃吹附流體和微粒子之混合物之工程。 In order to solve the above problems and achieve the object, the cutting method of the present invention is a cutting method for cutting a workpiece using a cutting edge, and is characterized in that the cutting water is supplied to the workpiece and the cutting is performed. A cutting process in which the blade is rotated to cut the workpiece; and in the cutting process, a process of blowing a mixture of the fluid and the microparticles is performed on the cutting edge.

為了解決上述課題並達成目的,本發明之切削裝置,其特徵為,係具備有:於表面上保持被加工物之保持部;和具備有可自由旋轉之心軸以及被裝著於該心軸上之切削刃之切削手段;和在相對於該心軸之中心軸線方向而為垂直並且與該保持部之表面相平行之方向上,相對於該心軸而使該保持部作相對性移動之移動手段;和朝向被加工物而供切削水之切削水供給部,該切削裝置,並具備有:在被加工物之切削中,將流體和微粒子之混合物朝向該切削刃而作供給之混合物供給部。 In order to solve the above problems and achieve the object, a cutting apparatus according to the present invention includes: a holding portion that holds a workpiece on a surface; and a spindle that is freely rotatable and is attached to the spindle Cutting means for cutting the upper cutting edge; and moving the holding portion relative to the mandrel in a direction perpendicular to a central axis direction of the mandrel and parallel to a surface of the holding portion And a cutting water supply unit that supplies cutting water to the workpiece, the cutting apparatus further comprising: a mixture supply of the mixture of the fluid and the fine particles toward the cutting edge during cutting of the workpiece unit.

又,上述切削裝置,係可構成為,係對於在該心軸處所流動之電流進行監測,並基於該電流值之大小,而決定是否要供給該混合物。 Further, the cutting device may be configured to monitor a current flowing through the mandrel and determine whether or not to supply the mixture based on the magnitude of the current value.

又,上述切削裝置,係可構成為,該微粒子係為水溶性。 Further, in the above cutting device, the fine particles may be made water-soluble.

本發明,由於係構成為在切削工程中對於切削刃吹附流體和微粒子之混合物,而對於切削刃之刃尖進行修整,因此,係可發揮下述之效果:亦即是,係能夠提昇生產性,並且能夠對於被加工物之品質降低的情形作抑制。 According to the present invention, since the cutting edge of the cutting edge is trimmed by blowing a mixture of the fluid and the fine particles to the cutting edge in the cutting process, the following effects can be obtained: that is, the production can be improved. It is possible to suppress the deterioration of the quality of the workpiece.

1‧‧‧切削裝置 1‧‧‧Cutting device

10‧‧‧保持部 10‧‧‧ Keeping Department

11a‧‧‧表面 11a‧‧‧ surface

20‧‧‧切削手段 20‧‧‧ cutting means

21‧‧‧心軸 21‧‧‧ mandrel

22‧‧‧切削刃 22‧‧‧ cutting edge

27‧‧‧切削水供給噴嘴(切削水供給部) 27‧‧‧Cutting water supply nozzle (cutting water supply unit)

29、60‧‧‧混合物供給部 29, 60‧‧‧Mixed Supply Department

30‧‧‧X軸移動手段(移動手段) 30‧‧‧X-axis moving means (moving means)

40‧‧‧Y軸移動手段(移動手段) 40‧‧‧Y-axis moving means (moving means)

50‧‧‧Z軸移動手段(移動手段) 50‧‧‧Z-axis moving means (moving means)

W‧‧‧被加工物 W‧‧‧Processed objects

K‧‧‧混合物 K‧‧‧Mixture

[圖1]圖1,係為實施形態1之切削裝置的構成例之立體圖。 Fig. 1 is a perspective view showing a configuration example of a cutting device according to a first embodiment.

[圖2]圖2,係為對於實施形態1之切削裝置的吸盤台以及被加工物作展示之立體圖。 Fig. 2 is a perspective view showing a chuck table and a workpiece of the cutting device of the first embodiment.

[圖3]圖3,係為對於圖2中所示之被加工物的其他例作展示之立體圖。 Fig. 3 is a perspective view showing another example of the workpiece shown in Fig. 2.

[圖4]圖4,係為對於圖2中所示之被加工物的又一其他例作展示之立體圖。 Fig. 4 is a perspective view showing still another example of the workpiece shown in Fig. 2.

[圖5]圖5,係為對於實施形態1之切削裝置的切削 手段之構成例作展示之立體圖。 FIG. 5 is a cutting of the cutting device of the first embodiment; FIG. The configuration of the means is shown as a perspective view.

[圖6]圖6,係為對於實施形態1之切削裝置的切削刃和混合物供給部作展示之圖。 Fig. 6 is a view showing a cutting edge and a mixture supply portion of the cutting device of the first embodiment.

[圖7]圖7(a),係為對於在實施形態1之切削裝置的切削刃處附著有切削屑之狀態作展示之圖,圖7(b),係為對於將圖7(a)中所示之切削屑作除去的狀態作展示之圖。 Fig. 7(a) is a view showing a state in which the cutting chips are attached to the cutting edge of the cutting device of the first embodiment, and Fig. 7(b) is for Fig. 7(a). The state in which the chips shown are removed is shown in the figure.

[圖8]圖8,係為實施形態1之切削裝置的切削刃之刃尖的剖面圖。 Fig. 8 is a cross-sectional view showing a cutting edge of a cutting edge of the cutting device of the first embodiment.

[圖9]圖9,係為對於實施形態1之切削裝置的混合物供給部對於切削刃之刃尖進行修整的狀態作展示之剖面圖。 [ Fig. 9] Fig. 9 is a cross-sectional view showing a state in which the blade supply tip of the cutting device of the first embodiment is trimmed with respect to the cutting edge of the cutting edge.

[圖10]圖10(a),係為對於實施形態1之切削方法作展示的流程圖之其中一例,圖10(b),係為在圖10(a)所示之切削工程中所實行的流程圖之其中一例。 Fig. 10 (a) is an example of a flow chart showing the cutting method of the first embodiment, and Fig. 10 (b) is carried out in the cutting work shown in Fig. 10 (a). An example of the flow chart.

[圖11]圖11(a),係為對於實施形態1之切削方法的將混合物作吹附之工程的切削刃之刃尖的概要作展示之剖面圖,圖11(b),係為對於實施形態1之切削方法的將混合物作了吹附後之切削刃之刃尖的概要作展示之剖面圖。 Fig. 11 (a) is a cross-sectional view showing the outline of the cutting edge of the cutting edge of the cutting method of the cutting method of the first embodiment, and Fig. 11 (b) is for In the cutting method of the first embodiment, a cross-sectional view showing the outline of the cutting edge of the cutting edge after the mixture is blown is shown.

[圖12]圖12,係為對於本發明之實施形態2之切削裝置的混合物供給部作展示之立體圖。 Fig. 12 is a perspective view showing a mixture supply unit of the cutting device according to the second embodiment of the present invention.

[圖13]圖13,係為對於圖12中所示之混合物供給部對於切削刃進行修整的狀態作展示之側剖面圖。 Fig. 13 is a side cross-sectional view showing a state in which the mixture supply portion shown in Fig. 12 is trimmed with respect to the cutting edge.

[圖14]圖14,係為對於本發明之實施形態3之切削裝置的切削手段以及混合物供給部作展示之側面圖。 Fig. 14 is a side view showing a cutting device and a mixture supply portion of the cutting device according to the third embodiment of the present invention.

[圖15]圖15,係為對於本發明之實施形態4之切削裝置的切削手段以及混合物供給部作展示之側面圖。 Fig. 15 is a side view showing a cutting device and a mixture supply portion of the cutting device according to the fourth embodiment of the present invention.

[圖16]圖16,係為對於實施形態1之變形例之切削裝置的混合物供給部對切削刃之刃尖進行修整的狀態作展示之剖面圖。 [Fig. 16] Fig. 16 is a cross-sectional view showing a state in which a blade supply tip of a cutting device according to a modification of the first embodiment trims a blade edge of a cutting edge.

[圖17]圖17(a),係為對於實施形態1之變形例之切削方法的將混合物作吹附之工程的切削刃之刃尖的概要作展示之剖面圖,圖17(b),係為對於實施形態1之變形例之切削方法的將混合物作了吹附後之切削刃之刃尖的概要作展示之剖面圖。 Fig. 17 (a) is a cross-sectional view showing the outline of the cutting edge of the cutting edge of the cutting method of the cutting method according to the modification of the first embodiment, Fig. 17 (b), A cross-sectional view showing the outline of the cutting edge of the cutting edge after the mixture is blown to the cutting method according to the modification of the first embodiment.

以下,參考圖面並針對用以實施本發明之形態(實施形態)作詳細說明。本發明係並不被以下之實施形態中所記載之內容所限定。又,在以下所記載的構成要素中,係包含有當業者能夠容易地推測到者以及實質性為相同者。進而。以下所記載之構成,係能夠適宜作組合。又,在不脫離本發明之要旨的範圍內,係可進行各種之省略、置換或者是變更。 Hereinafter, the form (embodiment) for carrying out the invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. Further, among the constituent elements described below, those who can easily estimate the facts and who are substantially the same are included. and then. The configurations described below can be suitably combined. Further, various omissions, substitutions, and changes may be made without departing from the scope of the invention.

(實施形態1) (Embodiment 1)

根據圖面,針對本發明之實施形態1的切削方法以及切削裝置作說明。圖1,係為實施形態1之切削裝置的構成例之立體圖。圖2,係為對於實施形態1之切削裝置的 吸盤台以及被加工物作展示之立體圖。圖3,係為對於圖2中所示之被加工物的其他例作展示之立體圖。圖4,係為對於圖2中所示之被加工物的又一其他例作展示之立體圖。圖5,係為對於實施形態1之切削裝置的切削手段之構成例作展示之立體圖。圖6,係為對於實施形態1之切削裝置的切削刃和混合物供給部作展示之圖。圖7(a),係為對於在實施形態1之切削裝置的切削刃處附著有切削屑之狀態作展示之圖,圖7(b),係為對於將圖7(a)中所示之切削屑作除去的狀態作展示之圖。圖8,係為實施形態1之切削裝置的切削刃之刃尖的剖面圖。圖9,係為對於實施形態1之切削裝置的混合物供給部對於切削刃之刃尖進行修整的狀態作展示之剖面圖。 The cutting method and the cutting device according to the first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a cutting device according to a first embodiment. 2 is a view of the cutting device of the first embodiment A three-dimensional view of the suction cup table and the processed object. Fig. 3 is a perspective view showing another example of the workpiece shown in Fig. 2. Fig. 4 is a perspective view showing still another example of the workpiece shown in Fig. 2. Fig. 5 is a perspective view showing a configuration example of a cutting device of the cutting device of the first embodiment. Fig. 6 is a view showing a cutting edge and a mixture supply portion of the cutting device of the first embodiment. Fig. 7(a) is a view showing a state in which the cutting chips are attached to the cutting edge of the cutting device of the first embodiment, and Fig. 7(b) is for the case shown in Fig. 7(a). The state in which the chips are removed is shown in the figure. Fig. 8 is a cross-sectional view showing a cutting edge of a cutting edge of the cutting device of the first embodiment. Fig. 9 is a cross-sectional view showing a state in which the tip of the cutting edge is trimmed in the mixture supply unit of the cutting device of the first embodiment.

實施形態1之切削裝置1,係為藉由使具備有切削刃22之切削手段20和保持有被加工物W之保持部10作相對移動,而對於被加工物W進行切削者。切削裝置1,係如同圖1中所示一般,具備有將被加工物W以表面11a來作吸引保持之保持部10、和切削手段20、和輸入手段100、以及控制手段90。又,切削裝置1,係至少包含有使保持部10朝向X軸方向移動之X軸移動手段30(相當於移動手段)、和使切削手段20朝向與X軸方向相正交之Y軸方向移動之Y軸移動手段40、和使切削手段20朝向與X軸方向以及Y軸方向相正交之Z軸方向移動之Z軸移動手段50,而構成之。另外,切削裝置1,係在裝置本體2上設置有門型之柱部3。 In the cutting apparatus 1 of the first embodiment, the workpiece W is cut by relatively moving the cutting means 20 including the cutting edge 22 and the holding portion 10 holding the workpiece W. The cutting device 1 is provided with a holding portion 10 for sucking and holding the workpiece W on the surface 11a, and a cutting means 20, an input means 100, and a control means 90, as shown in Fig. 1. Further, the cutting apparatus 1 includes at least an X-axis moving means 30 (corresponding to a moving means) for moving the holding portion 10 in the X-axis direction, and moving the cutting means 20 in the Y-axis direction orthogonal to the X-axis direction. The Y-axis moving means 40 and the Z-axis moving means 50 for moving the cutting means 20 in the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction are configured. Further, in the cutting device 1, a column type column portion 3 is provided on the device body 2.

於此,被加工物W,係為藉由切削裝置1而被加工之板狀的加工對象。在實施形態1中,如同圖2中所示一般,係身為在藉由相互正交之複數之分割預定線L所區劃出的各區域中被配設有藉由樹脂密封部S來作了密封的元件D並且在分割預定線L處被配設有未圖示之電極的封裝基板(例如,QFN(Quad Flat Non-leaded package)基板)。作為被加工物W之封裝基板,係藉由讓切削裝置1之控制手段90使保持部10和具備有切削刃22之切削手段20作相對移動,而對於分割預定線L施加切削加工,並被分割成各個的元件D。 Here, the workpiece W is a plate-shaped processing target that is processed by the cutting device 1. In the first embodiment, as shown in Fig. 2, the body is provided with the resin sealing portion S in each of the regions defined by the plurality of division lines L which are orthogonal to each other. The sealed element D is provided with a package substrate (for example, a QFN (Quad Flat Non-leaded Package) substrate) having an electrode (not shown) at the division planned line L. In the package substrate of the workpiece W, the holding unit 10 and the cutting tool 20 including the cutting edge 22 are relatively moved by the control means 90 of the cutting device 1, and the cutting process is applied to the dividing line L, and Divided into individual elements D.

又,在本發明中,被加工物W,係並不被限定於封裝基板,亦可為圖3中所示之在表面上被層積了於表面上被形成有絕緣膜和電路的功能層FL之圓板狀的晶圓,亦可為圖4中所示之在分割預定線L處被形成有TEG(Test Element Group)或CMP(Chemical Mechanical Polishing)用之假圖案等的金屬M之以矽、藍寶石、錄等作為母材的圓板狀之半導體晶圓或光元件晶圓。又,在本發明中,被加工物W,係亦可藉由玻璃來構成,且亦可為BGA(Ball Grid Array)基板、具備有絕緣膜之基板。另外,形成功能層FL之絕緣膜,係為藉由由SiO2膜、或是SiOF、BSG(SiOB)等之無機物系之膜、或是聚醯亞胺系、聚對二甲苯(parylene)系等之身為聚合物膜的有機物系之膜所成的低介電率絕緣體被膜(Low-k膜)所構成者。 Further, in the present invention, the workpiece W is not limited to the package substrate, and may be a functional layer on the surface of which the insulating film and the circuit are formed on the surface as shown in FIG. The disk-shaped wafer of FL may be a metal M having a dummy pattern such as TEG (Test Element Group) or CMP (Chemical Mechanical Polishing) formed at the division planned line L as shown in FIG. A disk-shaped semiconductor wafer or an optical element wafer as a base material of ruthenium, sapphire, or the like. Further, in the present invention, the workpiece W may be formed of glass, and may be a BGA (Ball Grid Array) substrate or a substrate provided with an insulating film. Further, an insulating film of the functional layer FL, as based film by a film of SiO 2 or SiOF, BSG (SiOB), etc. The inorganic material-based, or polyimide-based, parylene (Parylene) based It is composed of a low dielectric constant insulator film (Low-k film) made of a film of an organic film of a polymer film.

保持部10,係如同圖1中所示一般,包含有 具備表面11a之保持台11、和旋轉台19,而構成之。保持台11,係在表面11a上載置被加工物W,並藉由透過被設置在表面11a上之吸引孔13(展示於圖2中)來進行吸引,而藉由負壓來將被加工物W作吸引保持。吸引孔13,係與被加工物W之元件D以1對1來作對應設置。在保持台11之表面11a上,係被形成有與各分割預定線L相對應的切削刃22用之收容溝15。在將被加工物W分割成各元件D時,切削手段20之切削刃22係侵入至收容溝15中。旋轉台19,係為能夠使保持台11在與和表面11a相正交之Z軸方向相平行的未圖示之軸線周圍作旋轉者。又,保持部10,係藉由X軸移動手段30而被可自由於X軸方向上移動地作設置。 The holding portion 10 is as shown in FIG. 1 and includes The holding table 11 having the surface 11a and the rotating table 19 are provided. The holding table 11 is placed on the surface 11a to carry the workpiece W, and is sucked by the suction hole 13 (shown in FIG. 2) provided on the surface 11a, and the workpiece is pressed by the negative pressure. W is attractive for retention. The suction hole 13 is provided in correspondence with the element D of the workpiece W in a one-to-one correspondence. On the surface 11a of the holding table 11, a receiving groove 15 for the cutting edge 22 corresponding to each of the planned dividing lines L is formed. When the workpiece W is divided into the respective elements D, the cutting edge 22 of the cutting means 20 intrudes into the accommodation groove 15. The turntable 19 is configured such that the holding table 11 can rotate around an axis (not shown) parallel to the Z-axis direction orthogonal to the surface 11a. Further, the holding portion 10 is provided to be movable in the X-axis direction by the X-axis moving means 30.

切削手段20,係為一面對於被保持在保持部10處之被加工物W供給未圖示之切削水一面藉由切削刃22來對於被加工物W進行切削者。切削手段20,係經由Y軸移動手段40、Z軸移動手段50等而被設置在柱部3處。切削手段20,係藉由Y軸移動手段40而被可自由於Y軸方向上移動地作設置,並藉由Z軸移動手段50而被可自由於Z軸方向上移動地作設置。 In the cutting means 20, the workpiece W is cut by the cutting edge 22 while supplying the cutting water (not shown) to the workpiece W held by the holding portion 10. The cutting means 20 is provided at the column portion 3 via the Y-axis moving means 40, the Z-axis moving means 50, and the like. The cutting means 20 is provided to be movable in the Y-axis direction by the Y-axis moving means 40, and is movably movable in the Z-axis direction by the Z-axis moving means 50.

切削手段20,係如同圖5中所示一般,具備有使中心軸線與Y軸方向(相當於索引(INDEX方向)相互一致之心軸21、和被裝著於心軸21之前端處的切削刃22、以及刃蓋體24。心軸21,係被可旋轉地支持於心軸殼體23處,並與被收容在心軸殼體23中之未圖示之刃驅 動源作連結。刃驅動源,係藉由從未圖示之電源所供給之電力,而使心軸21在中心軸線周圍旋轉。另外,係將被供給至刃驅動源處之電力的電流,稱作心軸電流。心軸電流,係藉由圖5中所示之心軸電流檢測部25而被檢測出來。心軸電流檢測部25,係將檢測結果輸出至控制手段90處。另外,若是當心軸21在中心軸線周圍旋轉時、亦即是當切削刃22對於被加工物W進行切削時的阻抗(亦稱作負載)變大,則心軸電流係上升。也就是說,若是切削刃22變得難以進行切削,則心軸電流係上升。 The cutting means 20 is provided with a mandrel 21 which makes the central axis and the Y-axis direction (corresponding to the index (INDEX direction) coincide with each other, and the cutting which is attached to the front end of the mandrel 21, as shown in FIG. The blade 22 and the blade cover body 24. The spindle 21 is rotatably supported by the spindle housing 23 and is driven by an unillustrated blade housed in the spindle housing 23. The source is connected. The blade drive source rotates the mandrel 21 around the central axis by electric power supplied from a power source (not shown). In addition, the current that is supplied to the power at the blade drive source is referred to as a spindle current. The spindle current is detected by the spindle current detecting unit 25 shown in Fig. 5 . The spindle current detecting unit 25 outputs the detection result to the control means 90. Further, when the mandrel 21 rotates around the central axis, that is, when the cutting edge 22 cuts the workpiece W (also referred to as a load), the spindle current rises. That is, if the cutting edge 22 becomes difficult to perform cutting, the spindle current rises.

切削刃22,係為具備有略環形狀之極薄的切削砥石,並可自由裝卸地被裝著在心軸21處。切削刃22,係藉由以刃驅動源所產生的旋轉力來進行旋轉驅動。切削刃22,係為將電鑄、電著接著、金屬接著、樹脂接著、陶瓷接著等作為接著劑,並藉由此些之接著劑中的其中一者來將鑽石等之砥粒26(展示於圖7(a)以及圖7(b)中)作了固定的圓環狀之刃。另外,在本實施形態1中,如同圖5以及圖6中所示一般,作為切削刃22,係使用具備有基台(亦稱作轂)22b並藉由電鑄接著來將鑽石砥粒作了固定的切削刃。 The cutting edge 22 is provided with an extremely thin cutting stone having a substantially ring shape, and is detachably attached to the mandrel 21. The cutting edge 22 is rotationally driven by a rotational force generated by a blade drive source. The cutting edge 22 is formed by electroforming, electroforming, metal bonding, resin bonding, ceramic bonding or the like as an adhesive, and by using one of the adhesives, the diamond or the like 26 is displayed. A fixed annular blade is provided in Figs. 7(a) and 7(b). Further, in the first embodiment, as shown in Figs. 5 and 6, generally, as the cutting edge 22, a base (also referred to as a hub) 22b is used and the diamond is granulated by electroforming. A fixed cutting edge.

刃蓋體24,係為被固定在心軸殼體23之前端部處,並將切創刃22之除了下方以外的外周作覆蓋者。刃蓋體24,係如同圖5中所示一般,具備有對於切削刃22供給切削水之一對的切削水供給噴嘴27、和混合物供給部29。 The blade cover 24 is fixed to the front end of the mandrel housing 23, and covers the outer periphery of the cutting edge 22 except for the lower side. The blade cover 24 is provided with a cutting water supply nozzle 27 that supplies one pair of cutting water to the cutting edge 22, and a mixture supply portion 29, as shown in FIG.

切削水供給噴嘴27,係為藉由對於切削刃22供給切削水而朝向被加工物W供給切削水之切削水供給部。切削水供給噴嘴27,係包夾著切削刃22而被配設在刃蓋體24之下端部的Y軸方向之兩側處,並為用以對於切削刃22之兩側方供給切削水者。切削水供給噴嘴27,係被裝著在刃蓋體24之下端部處,並與X軸方向相平行地而朝向水平方向延伸,並且被形成為於其之側面處具備有噴射切削水之噴射細縫27a的圓筒形狀。在切削水供給噴嘴27處,係經由被安裝於刃蓋體24之上端部處的連結部28以及被形成於刃蓋體24之內部的未圖示之切削水供給路徑,而被供給有從未圖示之切削水源而來之切削水。 The cutting water supply nozzle 27 is a cutting water supply unit that supplies cutting water to the workpiece W by supplying cutting water to the cutting edge 22 . The cutting water supply nozzle 27 is disposed on both sides of the lower end portion of the blade body 24 in the Y-axis direction with the cutting edge 22 interposed therebetween, and is used for supplying cutting water to both sides of the cutting edge 22. . The cutting water supply nozzle 27 is attached to the lower end portion of the blade cover body 24, and extends in the horizontal direction in parallel with the X-axis direction, and is formed to have a jet of jet cutting water at its side surface. The cylindrical shape of the slit 27a. The cutting water supply nozzle 27 is supplied with a cutting water supply path that is attached to the upper end portion of the blade body 24 and a cutting water supply path (not shown) formed inside the blade body 24. Cutting water from a cutting water source not shown.

混合物供給部29,係為在被加工物W之切削中將流體和微粒子之混合物K(展示於圖9中)朝向切削刃22而作供給者。混合物供給部29,係藉由將流體和微粒子之混合物K吹附至切削刃22之刃尖22a處,而將切削屑CW(展示於圖7(a)中)從刃尖22a除去,並且對於切削刃22之刃尖22a進行修整,而將該刃尖22a在剖面處而與Y軸方向相平行地來形成者。 The mixture supply unit 29 supplies the mixture K of the fluid and the fine particles (shown in FIG. 9) toward the cutting edge 22 during the cutting of the workpiece W. The mixture supply portion 29 removes the cutting chips CW (shown in Fig. 7(a)) from the cutting edge 22a by blowing a mixture K of the fluid and fine particles to the cutting edge 22a of the cutting edge 22, and The blade edge 22a of the cutting edge 22 is trimmed, and the blade edge 22a is formed in parallel with the Y-axis direction at the cross section.

混合物供給部29,係被設置在刃蓋體24內,並如同圖9中所示一般,被形成為與切削刃22之兩側面相平行的直線狀。混合物供給部29,係具備有與切削刃22之刃尖22a(展示於圖6以及圖7中)相對面之混合物噴出口29a。混合物供給部29,係使混合物噴出口29a之中央與切削刃22之厚度方向的中央相對面。又,在本實施 形態1中,由於切削刃22係具備有基台22b,因此,混合物供給部29,係被配置為不會使從混合物噴出口29a所吹附至刃尖22a處的混合物K被吹附至基台22b處的方向。又,在本發明中,當切削刃22係為並不具備有基台22a之所謂無轂刃的情況時,混合物供給部29,係被配置為不會使從混合物噴出口29a所吹附至刃尖22a處的混合物K被吹附至將切削刃22裝著於心軸21之前端上的螺帽處之方向。 The mixture supply portion 29 is provided in the blade body 24, and as shown in Fig. 9, is formed in a straight line parallel to both side faces of the cutting edge 22. The mixture supply unit 29 is provided with a mixture discharge port 29a that faces the blade edge 22a of the cutting edge 22 (shown in Figs. 6 and 7). The mixture supply unit 29 is such that the center of the mixture discharge port 29a faces the center of the cutting edge 22 in the thickness direction. Also, in this implementation In the first aspect, since the cutting edge 22 is provided with the base 22b, the mixture supply unit 29 is disposed so that the mixture K blown from the mixture discharge port 29a to the blade edge 22a is not attached to the base. The direction at station 22b. Further, in the present invention, when the cutting edge 22 is a so-called hubless blade that does not include the base 22a, the mixture supply portion 29 is disposed so as not to be attached from the mixture discharge port 29a. The mixture K at the blade tip 22a is blown to the direction in which the cutting edge 22 is attached to the nut on the front end of the mandrel 21.

混合物供給部29,係從混合物供給源29b而被供給有被作了加壓之流體和微粒子之混合物K,並將被供給而來之混合物K朝向切削刃22之刃尖22a而與切削刃22之兩側面相平行地來作吹附。另外,在本實施形態1中,作為被作了加壓之流體,係使用藉由0.1MPa(表壓力)~0.6MPa(表壓力)之空氣或氮等的惰性氣體所構成之氣體,並作為微粒子而使用有身為水溶性之小蘇打(碳酸氫鈉)。小蘇打,在水溶時係成為弱鹼性。小蘇打,係使用一般所能夠購入者,例如,係可使用(股份有限公司)三和通商所輸入者。在實施形態1中,小蘇打之平均粒徑,係為40μm程度。 The mixture supply unit 29 is supplied with the mixture K of the pressurized fluid and the fine particles from the mixture supply source 29b, and supplies the supplied mixture K toward the cutting edge 22a of the cutting edge 22 and the cutting edge 22 The two sides are blown in parallel. Further, in the first embodiment, as the fluid to be pressurized, a gas composed of an inert gas such as air or nitrogen of 0.1 MPa (gauge pressure) to 0.6 MPa (gauge pressure) is used as the gas. The microparticles are used as a water-soluble baking soda (sodium hydrogencarbonate). Baking soda, when it is dissolved in water, becomes weakly alkaline. Baking soda, which is generally available to purchasers, for example, can be used by (3) and the company. In the first embodiment, the average particle size of baking soda is about 40 μm.

又,在本實施形態1中,如同圖9中所示一般,係以使從混合物噴出口29a所直接吹附至切削刃22之刃尖22a處的混合物K之寬幅H1會成為較切削刃22之厚度T而更小的方式,來形成混合物噴出口29a。所謂從混合物噴出口29a所直接吹附至切削刃22之刃尖22a 處的混合物K之寬幅H1,係指從混合物噴出口29a而直接碰撞至切削刃22之刃尖22a的混合物K之Y軸方向的寬幅。因此,本實施形態1之混合物供給部29,若是將混合物K吹附至在圖8所示之剖面中為與Y軸方向相平行的切削刃22之刃尖22a處,則如同圖9中所示一般,係成為使切削刃22之刃尖22a的Y軸方向之中央消耗。又,在本發明中,切削刃22,一般係使用刃尖22a之厚度T為30μm~1mm程度者,混合物噴出口29a之口徑,亦係以成為與切削刃22之刃尖22a的厚度同等程度為理想。 Further, in the first embodiment, as shown in Fig. 9, the width H1 of the mixture K which is directly blown from the mixture discharge port 29a to the blade edge 22a of the cutting edge 22 becomes a relatively cutting edge. The thickness T of 22 is smaller to form the mixture discharge port 29a. The blade tip 22a directly attached to the cutting edge 22 from the mixture discharge port 29a The width H1 of the mixture K at the place is a width in the Y-axis direction of the mixture K which directly collides with the blade tip 22a of the cutting edge 22 from the mixture discharge port 29a. Therefore, in the mixture supply unit 29 of the first embodiment, if the mixture K is blown to the blade edge 22a of the cutting edge 22 which is parallel to the Y-axis direction in the cross section shown in Fig. 8, it is as shown in Fig. 9. Generally, the center edge of the blade edge 22a of the cutting edge 22 is consumed in the Y-axis direction. Further, in the present invention, the cutting edge 22 is generally such that the thickness T of the blade edge 22a is about 30 μm to 1 mm, and the diameter of the mixture discharge port 29a is also equal to the thickness of the blade edge 22a of the cutting edge 22. Ideal.

又,在本發明中,作為流體,係亦可使用身為液體之純水、或者是藉由純水等之液體和空氣或氮等的惰性氣體所構成之氣體的混合物(所謂2流體)。亦即是,在本發明中,作為流體,係可使用藉由空氣或氮等之惰性氣體所構成之氣體、或者是藉由純水等之液體和空氣或氮等的惰性氣體所構成之氣體的混合物(所謂2流體),此些中之其中一者。又,在本發明中,作為微粒子,係可使用平均粒徑為10μm~100μm之身為水溶性粒子並且在水溶時會成為微酸性、微鹼性或中性者,或者是,係亦可為塑膠等之非水溶性者。進而,作為微粒子,係亦可為氧化鋁(Al2O3)、將貝殼粉碎所構成的包含氧化鈣脂粉體、尼龍(聚醯胺)等之樹脂者。進而,微粒子之平均粒徑,係以身為5μm~50μm為理想。微粒子之種類、大小,係因應於切削刃22之接著劑而適宜作選擇。例如,若是使用藉由 大粒徑之氧化鋁所構成的微粒子,則對於切削刃22之衝擊係為大,修整速度係為快,每單位時間之修整量係變多。又,在使用藉由輕的樹脂等所構成之微粒子的情況時,係能夠進行對於切削刃22之衝擊為小而對於修整速度以及每單位時間之修整量作了抑制的和緩之修整。又,當作為流體而使用純水,並作為微粒子而使用小蘇打等之水溶性之物的情況時,較理想,係在切削刃22之附近、亦即是在接近於切削刃22之位置處,來進行流體和微粒子之混合。於此情況,較理想,係使供給流體之供給管和供給微粒子之供給管,在切削刃22之附近、亦即是在即將到達切削刃22處之前而合流,並作成混合物K。 Further, in the present invention, as the fluid, a pure liquid which is a liquid or a mixture of a liquid such as pure water and an inert gas such as air or nitrogen (so-called two fluids) may be used. In the present invention, as the fluid, a gas composed of an inert gas such as air or nitrogen, or a gas composed of a liquid such as pure water or an inert gas such as air or nitrogen may be used. a mixture (so-called 2 fluids), one of these. Further, in the present invention, as the fine particles, those having an average particle diameter of 10 μm to 100 μm may be used as water-soluble particles, and when they are dissolved in water, they may be slightly acidic, slightly alkaline or neutral, or may be Non-water soluble such as plastic. Further, the fine particles may be alumina (Al 2 O 3 ) or a resin containing a calcium oxide powder or a nylon (polyamide) formed by pulverizing a shell. Further, the average particle diameter of the fine particles is preferably from 5 μm to 50 μm. The type and size of the microparticles are suitably selected in accordance with the adhesive of the cutting edge 22. For example, if fine particles composed of alumina having a large particle diameter are used, the impact on the cutting edge 22 is large, the dressing speed is fast, and the amount of dressing per unit time is increased. When a fine particle composed of a light resin or the like is used, the impact on the cutting edge 22 can be made small, and the dressing speed and the amount of dressing per unit time can be suppressed. Further, when pure water is used as the fluid and a water-soluble substance such as baking soda is used as the fine particles, it is preferably in the vicinity of the cutting edge 22, that is, at a position close to the cutting edge 22. To mix fluids and particles. In this case, it is preferable that the supply pipe for supplying the fluid and the supply pipe for supplying the fine particles are merged in the vicinity of the cutting edge 22, that is, immediately before reaching the cutting edge 22, and the mixture K is formed.

X軸移動手段30,係為在相對於心軸21之中心軸線方向而為垂直並且與保持部10之表面11a相平行的方向上而使保持部10相對於心軸21來作相對性移動者。 The X-axis moving means 30 is a relative movement of the holding portion 10 with respect to the mandrel 21 in a direction perpendicular to the central axis direction of the mandrel 21 and parallel to the surface 11a of the holding portion 10. .

輸入手段100,係被與控制手段90作連接,並被設置於顯示加工動作之狀態的顯示手段101處。顯示手段101,係藉由液晶顯示器、有機EL顯示器等之顯示面板等所構成。顯示手段101,係因應於從控制手段90所輸入之訊號,而顯示文字、圖形、畫像等之資訊。輸入手段100,係為使作業員進行按鍵操作者,並藉由被設置在顯示手段101之顯示面全面上的觸控面板等所構成。輸入手段100,係將與所受理了的操作相對應之訊號對於控制手段90作輸入。 The input means 100 is connected to the control means 90 and is provided at the display means 101 for displaying the state of the machining operation. The display means 101 is constituted by a display panel or the like such as a liquid crystal display or an organic EL display. The display means 101 displays information such as characters, graphics, portraits, and the like in response to signals input from the control means 90. The input means 100 is configured to allow a worker to perform a button operation, and is configured by a touch panel or the like provided on the display surface of the display means 101. The input means 100 inputs a signal corresponding to the accepted operation to the control means 90.

控制手段90,係為對於構成切削裝置1之上述之構成要素分別作控制者。控制手段90,係為使切削裝置1進行對於被加工物W之加工動作、亦即是進行實施形態1之切削方法者。另外,控制手段90,例如係以藉由CPU等所構成的演算處理裝置或者是具備有ROM、RAM等之未圖示之微處理器作為主體而構成者。控制手段90,係被與顯示手段101和當作業員將加工內容資訊等作登錄時所使用之輸入手段100等作連接。 The control means 90 is a controller for each of the above-described constituent elements constituting the cutting device 1. The control means 90 is a method in which the cutting device 1 performs a machining operation on the workpiece W, that is, the cutting method of the first embodiment. In addition, the control means 90 is constituted by, for example, an arithmetic processing device including a CPU or the like, or a microprocessor (not shown) including a ROM or a RAM. The control means 90 is connected to the display means 101 and the input means 100 used when the operator registers the processed content information or the like.

接著,針對實施形態1之切削裝置1之加工動作、亦即是針對實施形態1之切削方法作說明。實施形態1之切削方法,係為使用切削刃22來對於被加工物W進行切削之切削方法。圖10(a),係為對於實施形態1之切削方法作展示的流程圖之其中一例,圖10(b),係為在圖10(a)所示之切削工程中所實行的流程圖之其中一例。圖11(a),係為對於實施形態1之切削方法的將混合物作吹附之工程的切削刃之刃尖的概要作展示之剖面圖,圖11(b),係為對於實施形態1之切削方法的將混合物作了吹附後之切削刃之刃尖的概要作展示之剖面圖。 Next, the processing operation of the cutting apparatus 1 of the first embodiment, that is, the cutting method of the first embodiment will be described. The cutting method according to the first embodiment is a cutting method in which the workpiece W is cut using the cutting edge 22. Fig. 10 (a) is an example of a flow chart showing the cutting method of the first embodiment, and Fig. 10 (b) is a flow chart executed in the cutting work shown in Fig. 10 (a). One of them. Fig. 11 (a) is a cross-sectional view showing the outline of the cutting edge of the cutting edge of the cutting method of the cutting method of the first embodiment, and Fig. 11 (b) is for the first embodiment. A cross-sectional view showing the outline of the cutting edge of the cutting edge after the mixture is blown by the cutting method.

在切削方法中,首先,作業員係將加工內容資訊登錄至控制手段90中,並將被加工物W載置於從切削手段20而分離了的保持部10處,當存在有從作業員而來之加工動作之開始指示的情況時,切削裝置1係開始加工動作。在加工動作中,控制手段90,係將被載置於保持部10處之被加工物W作吸引保持,並使將被加工物W 作了吸引保持的保持部10移動至切削手段20之下方處。 In the cutting method, first, the operator registers the processed content information in the control means 90, and places the workpiece W on the holding portion 10 separated from the cutting means 20, and when there is a slave worker When the start of the machining operation is instructed, the cutting device 1 starts the machining operation. In the machining operation, the control means 90 sucks and holds the workpiece W placed on the holding portion 10, and causes the workpiece W to be processed. The holding portion 10 that has been suctioned and held moves to the lower side of the cutting means 20.

又,控制手段90,在實行了對位之後,係基於加工內容資訊,而從切削水供給噴嘴27來將切削水供給至切削刃22處,並一面使切削刃22旋轉一面使保持部10和切削刃22沿著分割預定線L來作相對性移動,以實行對於被加工物W進行切削之切削工程(步驟ST1)。控制手段90,係基於加工內容資訊,而判定切削工程是否結束(步驟ST2),若是判定切削工程尚未結束(步驟ST2:NO),則係反覆實行切削工程。控制手段90,若是判定切削工程結束(步驟ST2:YES),則係在使切削手段20藉由Z軸移動手段50來從被加工物W分離之後。藉由X軸移動手段50來使保持部10從切削手段20之下方分離。之後,控制手段90,若是使保持部10從切削手段20之下方分離,則係解除保持部10之吸引保持,作業員係將保持部10上之已完成切削加工的被加工物W除去,並將切削加工前之被加工物W載置於保持部10處。反覆進行此種工程,切削裝置1,係對於被加工物W進行切削。 Further, after the alignment is performed, the control means 90 supplies the cutting water to the cutting edge 22 from the cutting water supply nozzle 27 based on the machining content information, and rotates the cutting edge 22 while holding the holding portion 10 and The cutting edge 22 is relatively moved along the division planned line L to perform cutting work for cutting the workpiece W (step ST1). The control means 90 determines whether or not the cutting process is completed based on the machining content information (step ST2), and if it is determined that the cutting process has not been completed (step ST2: NO), the cutting process is repeatedly executed. When the control means 90 determines that the cutting process is completed (step ST2: YES), the cutting means 20 is separated from the workpiece W by the Z-axis moving means 50. The holding portion 10 is separated from the lower side of the cutting means 20 by the X-axis moving means 50. After that, when the holding unit 10 is separated from the lower side of the cutting unit 20, the control unit 90 releases the suction and holding of the holding unit 10, and the worker removes the workpiece W that has been subjected to the cutting process on the holding unit 10, and The workpiece W before the cutting is placed on the holding portion 10. This type of work is repeated, and the cutting device 1 performs cutting on the workpiece W.

在實施形態1之切削方法中,起因於切削刃22和被加工物W之間的組合,如同圖11(a)中所示一般,在切削工程中,切削刃22之刃尖22a的主要是Y軸方向之兩端部會有所消耗。控制手段90,係判斷在切削工程(步驟ST1)中心軸電流是否為特定值以上(步驟ST3)。另外,此一所謂特定值,較理想,係設為對於切削刃22之刃尖22a的切削屑CW之附著或者是切削刃22之刃尖22a 的消耗會對於切削加工造成不良影響之程度的值。 In the cutting method of the first embodiment, due to the combination between the cutting edge 22 and the workpiece W, as shown in Fig. 11(a), in the cutting process, the tip 22a of the cutting edge 22 is mainly Both ends of the Y-axis direction are consumed. The control means 90 determines whether or not the central axis current is equal to or greater than a specific value in the cutting process (step ST1) (step ST3). Further, this so-called specific value is preferably set as the adhesion to the cutting edge CW of the cutting edge 22a of the cutting edge 22 or the cutting edge 22a of the cutting edge 22. The value of the consumption will have an adverse effect on the cutting process.

控制手段90,若是判斷心軸電流係為特定值以上(步驟ST3:YES),則係使混合物供給源29b動作,或是使其維持於動作的狀態,並在切削工程中實行從混合物供給部29來對於切削刃22之刃尖22a吹附氣體和微粒子的混合物K之工程(步驟ST4),而回到步驟ST3。如此一來,如同圖11(a)中所示一般,混合物K主要係被吹附至切削刃22之刃尖22a的Y軸方向之中央處,並如同圖7(b)中所示一般,將切削屑CW除去,並且對於刃尖22a的Y軸方向之中央進行修整。將切削屑CW除去並對於刃尖22a作了修整的混合物K之微粒子,由於係身為水溶性之小蘇打,因此,係溶解於切削水中,並與切削水一同地而通過未圖示之排出口來排出至切削裝置1外。如此這般,實施形態1之切削方法,若是心軸電流係為特定值以上,則係一面切削被加工物W一面對於切削刃22吹附混合物K,而進行切削刃22之修整。 When the control means 90 determines that the spindle current system is equal to or greater than a specific value (step ST3: YES), the mixture supply source 29b is operated or maintained in the operating state, and the mixture supply unit is executed in the cutting process. 29, the process of blowing the mixture K of the gas and the fine particles to the blade edge 22a of the cutting edge 22 (step ST4), and returning to step ST3. As a result, as shown in FIG. 11(a), the mixture K is mainly blown to the center of the Y-axis direction of the blade edge 22a of the cutting edge 22, and as shown in FIG. 7(b), The chips CW are removed, and the center of the blade edge 22a in the Y-axis direction is trimmed. The fine particles of the mixture K, which are removed by the cuttings CW and trimmed to the cutting edge 22a, are dissolved in the cutting water and pass through the unillustrated row together with the cutting water because the body is water-soluble baking soda. The outlet is discharged to the outside of the cutting device 1. In the cutting method of the first embodiment, when the mandrel current system is equal to or greater than a specific value, the workpiece W is cut while the workpiece W is being cut, and the cutting edge 22 is trimmed.

控制手段90,若是判斷心軸電流係並非為特定值以上(步驟ST3:NO),則係使混合物供給源29b停止或者是維持於停止了的狀態(步驟ST5),並回到步驟ST3。如此這般,控制手段90,係在切削工程中,對於在心軸21處所流動之心軸電流進行監測,並基於此心軸電流值之大小,而決定是否要供給混合物K。如此一來,如同圖11(b)中所示一般,切削刃22之刃尖22a係被與Y軸方向相平行地而形成。 When the control means 90 determines that the spindle current system is not equal to or greater than the specific value (step ST3: NO), the mixture supply source 29b is stopped or maintained in the stopped state (step ST5), and the process returns to step ST3. In this manner, the control means 90 monitors the mandrel current flowing at the mandrel 21 in the cutting process, and determines whether or not the mixture K is to be supplied based on the magnitude of the mandrel current value. As a result, as shown in FIG. 11(b), the blade edge 22a of the cutting edge 22 is formed in parallel with the Y-axis direction.

如同上述一般,若依據實施形態1之切削方法以及切削裝置1,則係在切削工程中對於切削刃22之刃尖22a吹附氣體和微粒子之混合物K,而對於切削刃22之刃尖22a進行修整。因此,係能夠在切削工程中將切削屑CW從切削刃22之刃尖22a除去,並且能夠將刃尖22a在剖面處而保持為與Y軸方向相平行。故而,若依據實施形態1之切削方法及切削裝置1,則係能夠對於被作切削之被加工物W之品質降低的情形作抑制。又,由於係在切削工程中而對於切削刃22之刃尖22a進行修整,因此係並不需要為了進行修整而設置專用之工程。故而,若依據實施形態1之切削方法及切削裝置1,則係能夠達成修整作業之效率化並提升生產性。 As described above, according to the cutting method and the cutting apparatus 1 of the first embodiment, the mixture K of the gas and the fine particles is blown to the cutting edge 22a of the cutting edge 22 in the cutting process, and the cutting edge 22a of the cutting edge 22 is performed. trim. Therefore, it is possible to remove the cuttings CW from the cutting edge 22a of the cutting edge 22 in the cutting process, and to maintain the cutting edge 22a parallel to the Y-axis direction at the cross section. Therefore, according to the cutting method and the cutting apparatus 1 of the first embodiment, it is possible to suppress the deterioration of the quality of the workpiece W to be cut. Further, since the cutting edge 22a of the cutting edge 22 is trimmed during the cutting process, it is not necessary to provide a dedicated project for trimming. Therefore, according to the cutting method and the cutting apparatus 1 of the first embodiment, it is possible to achieve the efficiency of the trimming work and improve the productivity.

又,若依據實施形態1之切削方法及切削裝置1,則作為被加工物W,在對於封裝基板、在分割預定線L處被形成有TEG或CMP用之假圖案(假墊片)等之金屬M的半導體晶圓或光元件晶圓進行切削的情況時,係能夠抑制金屬M之對於切削刃22的堵塞。若依據實施形態1之切削方法及切削裝置1,則當作為被加工物W而對於藉由玻璃所構成者來進行切削的情況時,係使起因於由混合物K所致之修整而磨耗了的砥粒26脫落,而能夠對於碎屑作抑制。若依據實施形態1之切削方法及切削裝置1,則當作為被加工物W而對於BGA基板進行切削的情況時,係能夠將切削刃22之刃尖22a在水平方向上而維持為平坦。若依據實施形態1之切削方法及切削裝置1, 則當作為被加工物W而對於具備有絕緣膜之基板進行切削的情況時,係能夠抑制對於切削刃22之樹脂的堵塞。若依據實施形態1之切削方法及切削裝置1,則當作為被加工物W而對於在表面上層積有功能層FL之圓板狀之晶圓進行切削的情況時,係能夠對於功能層FL之剝離作抑制。 Further, according to the cutting method and the cutting apparatus 1 of the first embodiment, a dummy pattern (false pad) for TEG or CMP is formed on the package substrate at the planned dividing line L as the workpiece W. When the semiconductor wafer or the optical element wafer of the metal M is cut, it is possible to suppress clogging of the cutting edge 22 of the metal M. According to the cutting method and the cutting apparatus 1 of the first embodiment, when the workpiece W is cut as the workpiece W, it is worn by the trimming by the mixture K. The granules 26 fall off and can suppress the debris. According to the cutting method and the cutting apparatus 1 of the first embodiment, when the BGA substrate is cut as the workpiece W, the blade edge 22a of the cutting edge 22 can be maintained flat in the horizontal direction. According to the cutting method and cutting device 1 of the first embodiment, When the substrate having the insulating film is cut as the workpiece W, clogging of the resin of the cutting edge 22 can be suppressed. According to the cutting method and the cutting apparatus 1 of the first embodiment, when the wafer W having the functional layer FL laminated on the surface is cut as the workpiece W, the functional layer FL can be used. Peeling is suppressed.

又,若依據切削方法及切削裝置1,則由於混合物供給部29係對於刃尖22a之Y軸方向的中央作修整,因此係能夠將在切削工程中而Y軸方向之兩端部有所消耗的切削刃22之刃尖22a在剖面處而保持為與Y軸方向相平行。進而,若依據切削方法及切削裝置1,則由於從混合物供給部29所對於切削刃22之刃尖22a直接吹附的混合物K之寬幅H1係較切削刃22之厚度T而更小,因此混合物供給部29係能夠對於切削刃22之Y軸方向的中央進行修整。 Further, according to the cutting method and the cutting apparatus 1, since the mixture supply unit 29 trims the center of the blade edge 22a in the Y-axis direction, it is possible to consume both ends in the Y-axis direction during the cutting process. The blade edge 22a of the cutting edge 22 is maintained at a cross section parallel to the Y-axis direction. Further, according to the cutting method and the cutting apparatus 1, the width H1 of the mixture K directly blown from the blade edge 22a of the cutting edge 22 from the mixture supply portion 29 is smaller than the thickness T of the cutting edge 22, so that it is smaller. The mixture supply unit 29 can trim the center of the cutting edge 22 in the Y-axis direction.

若依據切削方法及切削裝置1,則由於混合物供給部29係與切削刃22之兩側面相平行地而以直線狀作延伸存在,並且混合物噴出口29a之中央係與切削刃22之刃尖22a之Y軸方向的中央相對面,因此,係能夠將切削刃22之刃尖22a在剖面處而保持為與Y軸方向相平行。又,若依據切削方法及切削裝置1,則由於係將混合物供給部29設置在刃蓋體24處,因此係能夠在切削工程中確實地進行修整。 According to the cutting method and the cutting apparatus 1, the mixture supply portion 29 extends linearly in parallel with both side faces of the cutting edge 22, and the center of the mixture discharge port 29a and the cutting edge 22a of the cutting edge 22 Since the center opposing surface in the Y-axis direction is such that the cutting edge 22a of the cutting edge 22 can be held parallel to the Y-axis direction at the cross section. Further, according to the cutting method and the cutting apparatus 1, since the mixture supply unit 29 is provided in the blade body 24, it is possible to perform the trimming surely in the cutting process.

進而,若依據切削方法及切削裝置1,則由於 若是心軸電流成為特定值以上而切削刃22變得難以進行切削,則係將混合物K吹附至切削刃22之刃尖22a處,因此,係能夠在必要的時序處而進行修整,而不會有造成混合物K之浪費或者是對於切削刃22作必要以上之修整並導致其之壽命縮短的情形。 Further, according to the cutting method and the cutting device 1, If the spindle current becomes a specific value or more and the cutting edge 22 becomes difficult to perform cutting, the mixture K is blown to the cutting edge 22a of the cutting edge 22, so that it can be trimmed at the necessary timing without There is a case where the mixture K is wasted or the cutting edge 22 is trimmed more than necessary and the life thereof is shortened.

於此,作為切削刃22,為了對於硬質之被加工物W進行切削,係使用藉由金屬接著(由金屬所成之結合材)來將鑽石砥粒牢固地作了固定的刃、電鑄刃。若是切削繼續進行,則鑽石砥粒係會磨耗,但是,由於金屬接著之保持力係為大,因此有所磨耗的鑽石砥粒係難以脫落。於此,若依據切削方法及切削裝置1,則藉由將混合物K對於切削刃22之刃尖22a作吹附並進行修整,係易於使鑽石砥粒從金屬接著而脫落,而能夠藉由尚未磨耗之鑽石砥粒來適當地進行切削。又,雖然並不侷限於金屬接著的情況,但是,起因於高壓之混合物K被噴射至切削刃22之接著部分處,如同圖7(b)中所示一般,切削刃22之接著部分係會被侵蝕為凹狀。藉由起因於此侵蝕所致的凹狀之部分,切削屑CW係成為容易被從切削刃22而排出,並且係能夠使磨耗了的砥粒26易於脫落。 Here, as the cutting edge 22, in order to cut the hard workpiece W, a blade which is firmly fixed by a metal (a bonding material made of a metal) is used, and an electroforming blade is firmly fixed. . If the cutting is continued, the diamond granules will be worn. However, since the metal retaining force is large, the worn diamond granules are hard to fall off. Here, according to the cutting method and the cutting apparatus 1, by kneading and trimming the mixture K with respect to the blade edge 22a of the cutting edge 22, it is easy to cause the diamond granules to fall off from the metal, and it is possible to The worn diamond particles are properly cut. Further, although not limited to the case of metal follow-up, the mixture K resulting from the high pressure is sprayed to the subsequent portion of the cutting edge 22, as shown in Fig. 7(b), the subsequent portion of the cutting edge 22 is Eroded into a concave shape. By the concave portion due to the erosion, the cuttings CW are easily discharged from the cutting edge 22, and the worn granules 26 can be easily detached.

若依據實施形態1之切削方法以及切削裝置1,則由於係作為構成混合物K之微粒子而使用水溶性之小蘇打,因此就算是將混合物K吹附至旋轉中之切削刃22處,混合物K之微粒子也會成為迅速地溶解於切削水中。故而,就算是在切削工程中吹附混合物K並進行修 整,也能夠對於混合物K飛散至周邊的情形作抑制。進而,由於係能夠將混合物K之微粒子與切削水一同回收,因此係並不會產生另外設置回收手段之需求。 According to the cutting method of the first embodiment and the cutting device 1, since the water-soluble baking soda is used as the fine particles constituting the mixture K, even if the mixture K is blown to the rotating cutting edge 22, the mixture K The microparticles also become rapidly dissolved in the cutting water. Therefore, even in the cutting project, the mixture K is blown and repaired. In addition, it is also possible to suppress the case where the mixture K is scattered to the periphery. Further, since the fine particles of the mixture K can be recovered together with the cutting water, there is no need to additionally provide a means for recycling.

[實施形態2] [Embodiment 2]

根據圖面,針對本發明之實施形態2的切削方法以及切削裝置1作說明。圖12,係為對於本發明之實施形態2之切削裝置的混合物供給部作展示之立體圖。圖13,係為對於圖12中所示之混合物供給部對於切削刃進行修整的狀態作展示之側剖面圖。在圖12以及圖13中,針對與實施形態1相同的部份,係附加相同之元件符號,並省略說明。 The cutting method and the cutting device 1 according to the second embodiment of the present invention will be described with reference to the drawings. Fig. 12 is a perspective view showing a mixture supply unit of the cutting device according to the second embodiment of the present invention. Fig. 13 is a side cross-sectional view showing a state in which the mixture supply portion shown in Fig. 12 is trimmed to the cutting edge. In FIGS. 12 and 13 , the same components as those in the first embodiment are denoted by the same reference numerals, and their description is omitted.

實施形態2之切削裝置1,係如同圖12中所示一般,並不使切削手段20之刃蓋體24具備有混合物供給部29,而是具備有在被加工物W之切削的中斷期間中朝向切削刃22而供給混合物K之混合物供給部60。混合物供給部60,係如同圖13中所示一般,具備有被固定在吸盤台10之鄰旁的修整部61、和將從混合物供給源29b所供給之混合物K導引至修整部61處的供給管62、和吸引修整部61內之混合物K的吸引單元63、以及將修整部61內之混合物K導引至吸引單元63處的排出管64。另外,在實施形態2中,混合物供給部60之修整部61,雖係被固定在吸盤台10之鄰旁,但是,在本發明中,係並不被限定於此,亦可將混合物供給部60之修整部61鄰接 於吸盤台10而作設置。又,在本發明中,不論是將混合物供給部60之修整部61設置在切削裝置1之裝置本體2的何處均可。 In the cutting device 1 of the second embodiment, as shown in FIG. 12, the blade cover 24 of the cutting device 20 is not provided with the mixture supply portion 29, but is provided with an interruption period during the cutting of the workpiece W. The mixture supply unit 60 of the mixture K is supplied toward the cutting edge 22 . The mixture supply unit 60, as shown in Fig. 13, is provided with a trimming portion 61 fixed to the vicinity of the chuck table 10, and a mixture K supplied from the mixture supply source 29b to the trimming portion 61. The supply pipe 62, and the suction unit 63 that sucks the mixture K in the trimming portion 61, and the discharge pipe 64 that guides the mixture K in the trimming portion 61 to the suction unit 63. Further, in the second embodiment, the trimming portion 61 of the mixture supply unit 60 is fixed to the vicinity of the chuck table 10. However, in the present invention, the mixture is not limited thereto, and the mixture supply unit may be used. 60 trimming unit 61 adjacent Set up on the suction table 10. Further, in the present invention, the dressing portion 61 of the mixture supply portion 60 may be provided in the device body 2 of the cutting device 1.

修整部61,係被形成為於長邊方向的其中一端處連接供給管62並於另外一端處連接有排出管64的箱狀。修整部61,係將長邊方向與X軸方向相平行地作配置,並於內部設置有將從供給管62所供給而來之混合物K朝向排出管64來沿著X軸方向流動之通路61b。修整部61,係在與切削刃22相對向之上面61a處,設置有於X軸方向上作延伸並且使切削刃22之刃尖作侵入的侵入孔65。 The trimming portion 61 is formed in a box shape in which the supply pipe 62 is connected to one end in the longitudinal direction and the discharge pipe 64 is connected to the other end. The trimming portion 61 is disposed such that the longitudinal direction thereof is parallel to the X-axis direction, and the passage 61b that flows from the supply pipe 62 toward the discharge pipe 64 in the X-axis direction is provided inside. . The trimming portion 61 is provided with an intrusion hole 65 extending in the X-axis direction and invading the blade edge of the cutting edge 22 at an upper surface 61a opposed to the cutting edge 22.

混合物供給部60,係將從混合物供給源29b所供給而來之混合物K,與X軸方向相平行地而吹附到侵入至侵入孔65內之切削刃22之刃尖22a處,並對於切削刃22進行修整。又,混合物供給部60,係朝向侵入至侵入孔65內之切削刃22之刃尖22a的旋轉方向R之相反方向而吹附混合物K(以使切削刃22之一點和混合物K之相對速度變大的方式來進行吹附,而為理想)。混合物供給部60,藉由朝向侵入至侵入孔65內之切削刃22之刃尖22a的旋轉方向R之相反方向而吹附混合物K,係能夠將修整的速度提高。混合物供給部60,係為將混合物K與X軸方向相平行地而作吹附並對於將混合物K吹附至被加工物W一事作限制者。 The mixture supply unit 60 blows the mixture K supplied from the mixture supply source 29b in parallel with the X-axis direction to the blade edge 22a of the cutting edge 22 that intrudes into the intrusion hole 65, and for cutting The blade 22 is trimmed. Further, the mixture supply unit 60 blows the mixture K toward the opposite direction to the rotation direction R of the cutting edge 22 of the cutting edge 22 in the intrusion hole 65 (to change the relative speed of one point of the cutting edge 22 and the mixture K). The big way to do it is to blow it up, but ideal.) The mixture supply unit 60 can increase the speed of the dressing by blowing the mixture K in the opposite direction to the rotation direction R of the cutting edge 22 of the cutting edge 22 in the intrusion hole 65. The mixture supply unit 60 is configured to blow the mixture K in parallel with the X-axis direction and to restrict the blowing of the mixture K to the workpiece W.

令實施形態2之切削裝置1使用切削刃22來 對於被加工物W進行切削之切削方法,係具備有:對於被加工物W供給切削水,並使該切削刃22旋轉而切削被加工物W之切削工程;和在該切削之中斷期間中,對於該切削刃22吹附作為流體之氣體和微粒子之混合物K之工程。具體而言,切削裝置1之控制裝置90,係在針對分割預定線L而每切削1條線或者是每切削複數條線時,驅動X軸移動手段30、Y軸移動手段40以及Z軸移動手段50而使切削刃22移動,並使切削刃22之刃尖侵入至侵入孔65中,且對於切削刃22之刃尖而以特定時間來吹附混合物K,以進行修整。又,實施形態2之切削裝置1,係亦可在結束了1個的被加工物W之切削之後並且被交換為切削前之被加工物W之前、亦即是在被加工物W之切削的中斷期間中,驅動X軸移動手段30、Y軸移動手段40以及Z軸移動手段50而使切削刃22移動,並使切削刃22之刃尖侵入至侵入孔65中,且對於切削刃22之刃尖而以特定時間來吹附混合物K,以進行修整。又,實施形態2之切削裝置1的控制手段90,係亦能夠與實施形態1相同的,對於在心軸21處所流動之電流進行監測,並基於電流值之大小,而決定是否要進行修整。實施形態2之切削裝置1,係與實施形態1相同的,作為流體,係使用藉由空氣或氮等之惰性氣體所構成之氣體、或者是亦可並不限定於氣體,而使用藉由純水等之液體或者是純水等之液體和空氣或氮等的惰性氣體所構成之氣體的混合物(所謂2流體)。 The cutting device 1 of the second embodiment is used with the cutting edge 22 The cutting method for cutting the workpiece W includes a cutting process in which the cutting water is supplied to the workpiece W, and the cutting edge 22 is rotated to cut the workpiece W; and during the interruption of the cutting, The cutting edge 22 is blown with a work of a mixture K of a gas and a fine particle as a fluid. Specifically, the control device 90 of the cutting device 1 drives the X-axis moving means 30, the Y-axis moving means 40, and the Z-axis movement every time one line is cut or a plurality of lines are cut for the dividing line L. The means 50 moves the cutting edge 22 and causes the cutting edge of the cutting edge 22 to intrude into the intrusion hole 65, and the mixture K is blown for a specific time with respect to the cutting edge of the cutting edge 22 for trimming. Further, the cutting device 1 of the second embodiment may be cut before the workpiece W is finished and exchanged for the workpiece W before cutting, that is, by the workpiece W. In the interruption period, the X-axis moving means 30, the Y-axis moving means 40, and the Z-axis moving means 50 are driven to move the cutting edge 22, and the cutting edge of the cutting edge 22 intrudes into the intrusion hole 65, and for the cutting edge 22 The blade K is used to blow the mixture K at a specific time for trimming. Further, the control means 90 of the cutting apparatus 1 according to the second embodiment can monitor the current flowing through the mandrel 21 in the same manner as in the first embodiment, and determine whether or not to perform trimming based on the magnitude of the current value. The cutting device 1 of the second embodiment is the same as the first embodiment, and the fluid is made of a gas composed of an inert gas such as air or nitrogen, or may be used without being limited to a gas. A liquid such as water or a mixture of a liquid such as pure water and an inert gas such as air or nitrogen (so-called 2 fluid).

如同上述一般,若依據實施形態2之切削方法以及切削裝置1,則係在切削的中斷期間中對於切削刃22之刃尖22a吹附流體和微粒子之混合物K,而對於切削刃22之刃尖22a進行修整。因此,係能夠在切削之中斷期間中將切削屑CW從切削刃22之刃尖22a除去,並且能夠將刃尖22a在剖面處而保持為與Y方向相平行。故而,若依據實施形態2之切削方法及切削裝置1,則係與實施形態1相同的,能夠對於被作切削之被加工物W之品質降低的情形作抑制。 As described above, according to the cutting method of the second embodiment and the cutting device 1, the mixture K of the fluid and the fine particles is blown to the cutting edge 22a of the cutting edge 22 during the interruption of the cutting, and the cutting edge of the cutting edge 22 is applied. 22a is trimmed. Therefore, it is possible to remove the cuttings CW from the cutting edge 22a of the cutting edge 22 during the interruption of the cutting, and to keep the cutting edge 22a parallel to the Y direction at the cross section. Therefore, according to the cutting method and the cutting apparatus 1 of the second embodiment, the same as in the first embodiment, it is possible to suppress the deterioration of the quality of the workpiece W to be cut.

又,若依據實施形態2之切削方法及切削裝置1,則由於係在切削之中斷期間中而對於切削刃22之刃尖22a進行修整,因此係並不需要為了進行修整而設置專用之工程,並且混合物K也不會有對於被加工物W造成影響的情況。故而,若依據實施形態1之切削方法及切削裝置1,則係能夠達成修整作業之效率化並提升生產性,並且能夠對於被加工物W之品質降低的情形作抑制。進而,混合物供給部60,由於係具備有修整部61和供給管62以及排出管63,因此係能夠對於混合物K擴散至外部的情形作抑制。 Further, according to the cutting method and the cutting apparatus 1 of the second embodiment, since the cutting edge 22a of the cutting edge 22 is trimmed during the cutting interruption period, it is not necessary to provide a dedicated project for trimming. Further, the mixture K does not have an influence on the workpiece W. Therefore, according to the cutting method and the cutting apparatus 1 of the first embodiment, it is possible to achieve the efficiency of the trimming work and improve the productivity, and it is possible to suppress the deterioration of the quality of the workpiece W. Further, since the mixture supply unit 60 includes the trimming unit 61, the supply tube 62, and the discharge tube 63, it is possible to suppress the diffusion of the mixture K to the outside.

又,若依據實施形態2之切削方法及切削裝置1,則由於係使切削刃22之刃尖22a,侵入至被形成在鄰接於吸盤台10而設置的混合物供給部60之修整部61處之侵入孔65內,並進行修整,因此在進行修整時,係並不需要將切削刃22精密地作定位。又,若依據實施形 態2之切削方法及切削裝置1,則由於係使切削刃22之刃尖22a,侵入至被形成在鄰接於吸盤台10而設置的混合物供給部60之修整部61處之侵入孔65內,並進行修整,因此係能夠對於混合物K被吹附至被加工物W處並導致被加工物W受到傷害的情形作抑制。 Further, according to the cutting method and the cutting device 1 of the second embodiment, the blade edge 22a of the cutting edge 22 is infiltrated into the trimming portion 61 formed in the mixture supply portion 60 provided adjacent to the chuck table 10. Since the inside of the hole 65 is intruded and trimmed, it is not necessary to precisely position the cutting edge 22 during dressing. Again, depending on the implementation In the cutting method of the second embodiment and the cutting device 1, the blade edge 22a of the cutting edge 22 is caused to enter the intrusion hole 65 formed in the trimming portion 61 of the mixture supply portion 60 provided adjacent to the chuck table 10, And trimming is performed, so that it is possible to suppress the case where the mixture K is blown to the workpiece W and causes the workpiece W to be damaged.

又,實施形態2之切削裝置1,係亦能夠與於以下所展示之實施形態4相同的而具備有檢測出切削刃22之磨耗量的未圖示之刃磨耗檢測手段。刃磨耗檢測手段,係與實施形態4相同的,具備有包夾切削刃22之發光元件和受光元件,並藉由將受光元件所受光了的光量檢測出來,而檢測出切削刃22之磨耗量,並將檢測結果輸出至控制手段90處。實施形態2之切削裝置1,在具備有刃磨耗檢測手段的情況時,係亦可構成為檢測出切削刃22之刃尖22a的磨耗量,並對於Z軸移動手段50作控制,而進行修整時之切削刃22的Z軸方向之位置的控制,以得到一定之修整寬幅。於此情況,係亦可具備有使混合物供給部60之修整部61在Z軸方向上移動之未圖示的移動手段,並對於Z軸移動手段50或/及未圖示之移動手段作控制,而進行修整時之切削刃22的Z軸方向之位置的控制。 Further, the cutting apparatus 1 of the second embodiment can be provided with a blade wear detecting means (not shown) that detects the amount of wear of the cutting edge 22, similarly to the fourth embodiment shown below. The blade wear detecting means is the same as that of the fourth embodiment, and includes a light-emitting element and a light-receiving element that sandwich the cutting edge 22, and detects the amount of wear of the cutting edge 22 by detecting the amount of light received by the light-receiving element. And outputting the detection result to the control means 90. In the case where the cutting tool 1 of the second embodiment is provided with the edge wear detecting means, the cutting amount of the cutting edge 22 can be detected, and the Z axis moving means 50 can be controlled to be trimmed. At the same time, the position of the cutting edge 22 in the Z-axis direction is controlled to obtain a certain trim width. In this case, a moving means (not shown) for moving the trimming portion 61 of the mixture supply unit 60 in the Z-axis direction may be provided, and the Z-axis moving means 50 or/and a moving means not shown may be controlled. And the control of the position of the cutting edge 22 in the Z-axis direction at the time of dressing is performed.

若依據實施形態2,則係可得到以下之切削方法及切削裝置1。 According to the second embodiment, the following cutting method and cutting device 1 can be obtained.

(附記1) (Note 1)

一種切削方法,係為使用切削刃22來對於被加工物W進行切削之切削方法,其特徵為,係具備有:對於被加工物W供給切削水,並使該切削刃22旋轉而切削該被加工物W之切削工程;和在該切削工程之中斷期間中,對於該切削刃22吹附流體和微粒子之混合物K之工程。 A cutting method is a cutting method for cutting a workpiece W using the cutting edge 22, and is characterized in that the cutting water is supplied to the workpiece W, and the cutting edge 22 is rotated to cut the The cutting work of the workpiece W; and the engineering of blowing the mixture K of the fluid and the fine particles for the cutting edge 22 during the interruption of the cutting work.

(附記2) (Note 2)

一種切削裝置1,其特徵為,係具備有:於表面上保持被加工物W之保持部10;和具備有可自由旋轉之心軸21以及被裝著於該心軸21上之切削刃22之切削手段20;和在身為該心軸21之中心軸線方向的Y軸方向、和相對於Y軸方向而為垂直並且與該保持部10之表面11a相平行之方向之X軸方向、以及相對於Y軸方向和該保持部10之表面11a而相垂直之Z軸方向上,使該切削刃22相對於保持部10而作相對性移動之X軸移動手段30、Y軸移動手段40和Z軸移動手段50;和朝向被加工物W而供給切削水之切削水供給部27,該切削裝置1,並具備有:鄰接於前述保持部10地而被設置,並且在被加工物W之切削的中斷期間中,將流體和微粒子之混合物K朝向該切削刃22而作供給之混合物供給部60。 A cutting apparatus 1 comprising: a holding portion 10 that holds a workpiece W on a surface thereof; and a spindle 21 that is freely rotatable and a cutting edge 22 that is attached to the spindle 21 The cutting means 20; and the X-axis direction which is the direction of the central axis of the mandrel 21, and the X-axis direction which is perpendicular to the Y-axis direction and which is parallel to the surface 11a of the holding portion 10, and The X-axis moving means 30 and the Y-axis moving means 40 for relatively moving the cutting edge 22 with respect to the holding portion 10 in the Z-axis direction perpendicular to the Y-axis direction and the surface 11a of the holding portion 10 The Z-axis moving means 50 and the cutting water supply unit 27 for supplying the cutting water to the workpiece W, the cutting apparatus 1 is provided adjacent to the holding unit 10, and is provided in the workpiece W In the interruption period of the cutting, the mixture K of the fluid and the fine particles is supplied to the mixture supply portion 60 which is supplied to the cutting edge 22.

(附記3) (Note 3)

如附記2所記載之切削裝置1,其中,係對於在該心軸21處所流動之電流進行監測,並基於該電流值之大 小,而決定是否要供給該混合物K。 The cutting device 1 according to the second aspect, wherein the current flowing at the mandrel 21 is monitored and based on the current value Small, and decide whether to supply the mixture K.

[實施形態3] [Embodiment 3]

根據圖面,針對本發明之實施形態3的切削方法以及切削裝置1作說明。圖14,係為對於本發明之實施形態3之切削裝置的切削手段以及混合物供給部作展示之側面圖。在圖14中,針對與實施形態1以及實施形態2相同的部份,係附加相同之元件符號,並省略說明。 The cutting method and the cutting device 1 according to the third embodiment of the present invention will be described with reference to the drawings. Fig. 14 is a side view showing a cutting device and a mixture supply portion of the cutting device according to the third embodiment of the present invention. In FIG. 14 , the same components as those in the first embodiment and the second embodiment are denoted by the same reference numerals, and their description is omitted.

實施形態3之切削裝置1,係如同圖14中所示一般,使切削手段20之刃蓋體24具備有混合物供給部29。實施形態3之混合物供給部29,係如同圖14中所示一般,具備有被固定在刃蓋體24處之修整部29c、和將從混合物供給源29b所供給之混合物K導引至修整部29c處的供給管62、和吸引修整部29c內之混合物K的吸引單元63、以及將修整部29c內之混合物K導引至吸引單元63處的排出管64。 In the cutting device 1 of the third embodiment, as shown in FIG. 14, the blade cover 24 of the cutting device 20 is provided with the mixture supply portion 29. The mixture supply unit 29 of the third embodiment is provided with a dressing portion 29c fixed to the blade body 24 and a mixture K supplied from the mixture supply source 29b to the dressing portion as shown in Fig. 14 . The supply pipe 62 at 29c, and the suction unit 63 that sucks the mixture K in the trimming portion 29c, and the mixture K in the trimming portion 29c are guided to the discharge pipe 64 at the suction unit 63.

修整部29c,係被形成為於長邊方向的其中一端處連接供給管62並於另外一端處連接有排出管64的筒狀。修整部29c,係將長邊方向與切削刃22之刃尖22a的切線相平行地作配置,並於內部設置有將從供給管62所供給而來之混合物K朝向排出管64來沿著切削刃22之刃尖22a之切線而流動之通路29d。修整部29c,係設置有使切削刃22之刃尖22a恆常作侵入的侵入孔29e。修整部29c,係藉由使切削刃22之刃尖22a中的相較於心軸21 而更從被加工物W遠離之場所侵入至侵入孔29e內並使混合物K沿著切削刃22之刃尖22a之切線方向流動,而對於混合物K被吹附至被加工物W處的情形作限制。 The trimming portion 29c is formed in a tubular shape in which the supply pipe 62 is connected to one end in the longitudinal direction and the discharge pipe 64 is connected to the other end. The trimming portion 29c is disposed such that the longitudinal direction thereof is parallel to the tangent of the blade edge 22a of the cutting edge 22, and the mixture K supplied from the supply pipe 62 is disposed inside the discharge pipe 64 to be cut along the inside. A passage 29d through which the cutting edge 22a of the blade 22 flows. The trimming portion 29c is provided with an intrusion hole 29e for constantly invading the blade edge 22a of the cutting edge 22. The trimming portion 29c is formed by making the cutting edge 22 of the cutting edge 22 opposite to the mandrel 21 Further, the inside of the workpiece W is intruded into the intrusion hole 29e, and the mixture K flows along the tangential direction of the cutting edge 22a of the cutting edge 22, and the mixture K is blown to the workpiece W. limit.

混合物供給部60,係將從混合物供給源29b所供給而來之混合物K,吹附到侵入至侵入孔29e內之切削刃22之刃尖22a處,並對於切削刃22進行修整。又,混合物供給部60,係朝向侵入至侵入孔29e內之切削刃22之刃尖22a的旋轉方向R之相反方向而吹附混合物K(以使切削刃22之一點和混合物K之相對速度變大的方式來進行吹附,而為理想)。混合物供給部60,藉由朝向切削刃22之刃尖22a的旋轉方向R之相反方向而吹附混合物K,係能夠將修整的速度提高。 The mixture supply unit 60 blows the mixture K supplied from the mixture supply source 29b to the blade edge 22a of the cutting edge 22 that has entered the intrusion hole 29e, and trims the cutting edge 22. Further, the mixture supply unit 60 blows the mixture K in the opposite direction to the rotation direction R of the cutting edge 22 of the cutting edge 22 which intrudes into the intrusion hole 29e (to change the relative speed of one point of the cutting edge 22 and the mixture K). The big way to do it is to blow it up, but ideal.) The mixture supply unit 60 can blow the mixture K in the opposite direction to the rotation direction R of the cutting edge 22 of the cutting edge 22, thereby improving the speed of dressing.

令實施形態3之切削裝置1使用切削刃22來對於被加工物W進行切削之切削方法,係具備有:對於被加工物W供給切削水,並使該切削刃22旋轉而切削被加工物W之切削工程;和在該切削工程中,對於該切削刃22吹附作為流體之氣體和微粒子之混合物K之工程。又,實施形態3之切削裝置1的控制手段90,係亦能夠與實施形態1相同的,對於在心軸21處所流動之電流進行監測,並基於電流值之大小,而決定是否要進行修整。實施形態3之切削裝置1,係與實施形態1相同的,作為流體,係使用藉由空氣或氮等之惰性氣體所構成之氣體、或者是亦可並不限定於氣體,而使用藉由純水等之液體或者是純水等之液體和空氣或氮等的惰性氣體所構成之氣體 的混合物(所謂2流體)。 The cutting device 1 of the third embodiment is configured to cut the workpiece W by using the cutting edge 22, and to supply the cutting water to the workpiece W, and to rotate the cutting edge 22 to cut the workpiece W. The cutting process; and in the cutting process, the cutting edge 22 is blown with a mixture of gas and fine particles K as a fluid. Further, the control means 90 of the cutting apparatus 1 of the third embodiment can monitor the current flowing through the mandrel 21 in the same manner as in the first embodiment, and determine whether or not to perform trimming based on the magnitude of the current value. The cutting device 1 of the third embodiment is the same as the first embodiment, and a gas composed of an inert gas such as air or nitrogen is used as the fluid, or may be used without being limited to a gas. a liquid such as water or a gas composed of pure water or an inert gas such as air or nitrogen Mixture (so called 2 fluids).

如同上述一般,若依據實施形態3之切削方法以及切削裝置1,則係在切削工程中對於切削刃22之刃尖22a吹附氣體和微粒子之混合物K,而對於切削刃22之刃尖22a進行修整。因此,係能夠在切削工程中將切削屑CW從切削刃22之刃尖22a除去,並且能夠將刃尖22a在剖面處而保持為與Y軸方向相平行。故而,若依據實施形態3之切削方法及切削裝置1,則係與實施形態1以及實施形態2相同的,能夠對於被作切削之被加工物W之品質降低的情形作抑制。 As described above, according to the cutting method of the third embodiment and the cutting apparatus 1, the mixture K of the gas and the fine particles is blown to the cutting edge 22a of the cutting edge 22 in the cutting process, and the cutting edge 22a of the cutting edge 22 is performed. trim. Therefore, it is possible to remove the cuttings CW from the cutting edge 22a of the cutting edge 22 in the cutting process, and to maintain the cutting edge 22a parallel to the Y-axis direction at the cross section. Therefore, according to the cutting method and the cutting apparatus 1 of the third embodiment, as in the first embodiment and the second embodiment, it is possible to suppress the deterioration of the quality of the workpiece W to be cut.

又,若依據實施形態3之切削方法及切削裝置1,則由於係在切削工程中而對於切削刃22之刃尖22a進行修整,因此係並不需要為了進行修整而設置專用之工程。故而,若依據實施形態3之切削方法及切削裝置1,則係能夠達成修整作業之效率化並提升生產性。進而,若依據實施形態3之切削方法以及切削裝置1,則由於係使切削手段20之刃蓋體24具備有混合物供給部29,因此,係能夠在切削工程中以外(亦可為在並未藉由切削刃22而對於被加工物W進行切削時)的對於1條線或者是複數線進行了切削之後(如同實施形態2一般地並不使切削刃22移動至修整部61處地)而開始混合物K之供給並進行修整。故而,實施形態3之切削方法及切削裝置1,係能夠成為不需要耗費起因於切削刃22之移動以及與修整部61間之對位所導致的時間。進而,實施形態3之切削 方法以及切削裝置1,由於係使切削手段20之刃蓋體24具備有混合物供給部29,而能夠在切削工程中以外來進行修整,因此,係能夠對於將切削刃22朝向Y軸方向進送的時間作活用而進行修整。 Further, according to the cutting method and the cutting apparatus 1 of the third embodiment, since the cutting edge 22a of the cutting edge 22 is trimmed during the cutting process, it is not necessary to provide a dedicated project for trimming. Therefore, according to the cutting method and the cutting apparatus 1 of the third embodiment, the efficiency of the trimming operation can be improved and the productivity can be improved. Further, according to the cutting method and the cutting device 1 of the third embodiment, since the blade cover 24 of the cutting device 20 is provided with the mixture supply portion 29, it can be used in the cutting process (or not After cutting one line or a plurality of lines when the workpiece W is cut by the cutting edge 22 (as in the second embodiment, the cutting edge 22 is generally not moved to the trim portion 61) The supply of the mixture K is started and trimmed. Therefore, the cutting method and the cutting apparatus 1 of the third embodiment can be caused by the time required for the movement of the cutting edge 22 and the alignment with the trimming portion 61. Further, the cutting of the third embodiment In the cutting device 1 , since the blade cover 24 of the cutting device 20 is provided with the mixture supply portion 29 and can be trimmed other than in the cutting process, the cutting edge 22 can be fed in the Y-axis direction. The time is trimmed for use.

又,若依據實施形態3之切削方法及切削裝置1,則由於混合物供給部29係使切削刃22之刃尖22a中的相較於心軸21而更從被加工物W遠離的場所侵入至侵入孔29e內並進行修整,因此係能夠對於混合物K被吹附至被加工物W處並導致被加工物W受到傷害的情形作抑制。若依據實施形態3之切削方法及切削裝置1,則由於係使切削手段20之刃蓋體24具備有混合物供給部29,因此係並不需要在吸盤台10之周圍設置進行修整之物品,故而係能夠謀求吸盤台10周圍之省空間化。 Further, according to the cutting method and the cutting apparatus 1 of the third embodiment, the mixture supply unit 29 intrudes the blade edge 22a of the cutting edge 22 from the position away from the workpiece W to the position of the workpiece W. The inside of the hole 29e is intruded and trimmed, so that it is possible to suppress the case where the mixture K is blown to the workpiece W and the workpiece W is damaged. According to the cutting method and the cutting apparatus 1 of the third embodiment, since the blade cover 24 of the cutting device 20 is provided with the mixture supply unit 29, it is not necessary to provide the trimming article around the chuck table 10, so that it is not necessary to provide the trimming article around the chuck table 10. It is possible to save space around the suction table 10.

[實施形態4] [Embodiment 4]

根據圖面,針對本發明之實施形態4的切削方法以及切削裝置1作說明。圖15,係為對於本發明之實施形態4之切削裝置的切削手段以及混合物供給部作展示之側面圖。在圖15中,針對與實施形態1、實施形態2以及實施形態3相同的部份,係附加相同之元件符號,並省略說明。 The cutting method and the cutting device 1 according to the fourth embodiment of the present invention will be described with reference to the drawings. Fig. 15 is a side view showing a cutting device and a mixture supply portion of the cutting device according to the fourth embodiment of the present invention. In FIG. 15 , the same components as those in the first embodiment, the second embodiment, and the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.

實施形態4之切削裝置1,係如同圖15中所示一般,除了實施形態3之混合物供給部29以外,更具備有刃磨耗檢測手段29f和供給部移動手段29g。刃磨耗 檢測手段29f,係具備有包夾切削刃22之發光元件和受光元件,並藉由將受光元件所受光了的光量檢測出來,而檢測出切削刃22之磨耗量,並將檢測結果輸出至控制手段90處。 In addition to the mixture supply unit 29 of the third embodiment, the cutting apparatus 1 of the fourth embodiment further includes a blade wear detecting means 29f and a supply unit moving means 29g. Blade wear The detecting means 29f includes a light-emitting element and a light-receiving element that sandwich the cutting edge 22, and detects the amount of wear of the cutting edge 22 by detecting the amount of light received by the light-receiving element, and outputs the detection result to the control. At 90.

供給部移動手段29g,係為依循控制手段90之命令而使混合物供給部29沿著切削刃22之徑方向移動者。供給部移動手段29g,係藉由使空氣汽缸之桿伸縮,來使混合物供給部29沿著切削刃22之徑方向移動。 The supply unit moving means 29g moves the mixture supply unit 29 in the radial direction of the cutting edge 22 in accordance with an instruction from the control means 90. The supply unit moving means 29g moves the mixture supply unit 29 in the radial direction of the cutting edge 22 by expanding and contracting the rod of the air cylinder.

令實施形態4之切削裝置1使用切削刃22來對於被加工物W進行切削之切削方法,係具備有:對於被加工物W供給切削水,並使該切削刃22旋轉而切削被加工物W之切削工程;和在該切削工程中,對於該切削刃22吹附流體(液體及/或氣體)和微粒子之混合物K之工程。又,實施形態4之切削裝置1的控制手段90,係亦能夠與實施形態1相同的,對於在心軸21處所流動之電流進行監測,並基於電流值之大小,而決定是否要進行修整。實施形態4之切削裝置1,係與實施形態1相同的,作為流體,係使用藉由空氣或氮等之惰性氣體所構成之氣體、或者是亦可並不限定於氣體,而使用藉由純水等之液體或者是純水等之液體和空氣或氮等的惰性氣體所構成之氣體的混合物(所謂2流體)。 The cutting device 1 of the fourth embodiment is configured to cut the workpiece W by using the cutting edge 22, and to supply the cutting water to the workpiece W, and to rotate the cutting edge 22 to cut the workpiece W. The cutting process; and in the cutting process, the process of blowing a mixture K of fluid (liquid and/or gas) and fine particles for the cutting edge 22. Further, in the control means 90 of the cutting apparatus 1 of the fourth embodiment, the current flowing through the mandrel 21 can be monitored in the same manner as in the first embodiment, and whether or not trimming is to be performed based on the magnitude of the current value can be determined. The cutting device 1 of the fourth embodiment is the same as the first embodiment, and a gas composed of an inert gas such as air or nitrogen is used as the fluid, or may be used without being limited to a gas. A liquid such as water or a mixture of a liquid such as pure water and an inert gas such as air or nitrogen (so-called 2 fluid).

進而,實施形態4之切削裝置1的控制手段90,係基於刃磨耗檢測手段29f之檢測結果,而以使混合物供給部29所供給之混合物K會與切削刃22之刃尖22a 相衝突的方式,來控制供給部移動手段29g,並因應於切削刃22之消耗程度,來對於切削刃22和混合物供給部29之間的相對位置作調整。具體而言,供給部移動手段29g,由於若是切削刃22之磨耗有所進展則刃之直徑係會變小,因此係使混合物供給部29相對性地朝向切削刃22之中心方向而(平行)移動。又,在本發明中,供給部移動手段29g,係亦可針對相對於混合物供給部29之水平面的傾斜度(相對於切削刃22而供給混合物K之角度)作調整。也就是說,在本發明中,供給部移動手段29,係亦可針對切削刃22之徑方向的切削刃22與混合物供給部29之間之相對位置作調整,亦可針對相對於混合物供給部29之水平面的傾斜度作調整,亦可針對切削刃22之徑方向的切削刃22與混合物供給部29之間之相對位置以及相對於混合物供給部29之水平面的傾斜度作調整。 Further, the control means 90 of the cutting apparatus 1 according to the fourth embodiment is based on the detection result of the edge wear detecting means 29f so that the mixture K supplied from the mixture supply portion 29 and the cutting edge 22a of the cutting edge 22 In a conflicting manner, the supply portion moving means 29g is controlled, and the relative position between the cutting edge 22 and the mixture supply portion 29 is adjusted in accordance with the degree of consumption of the cutting edge 22. Specifically, in the supply unit moving means 29g, since the diameter of the blade is reduced as the wear of the cutting edge 22 progresses, the mixture supply portion 29 is relatively oriented toward the center of the cutting edge 22 (parallel). mobile. Further, in the present invention, the supply unit moving means 29g may be adjusted with respect to the inclination of the horizontal plane of the mixture supply unit 29 (the angle at which the mixture K is supplied with respect to the cutting edge 22). That is, in the present invention, the supply portion moving means 29 may be adjusted for the relative position between the cutting edge 22 and the mixture supply portion 29 in the radial direction of the cutting edge 22, or may be directed to the mixture supply portion. The inclination of the horizontal plane of 29 is adjusted, and the relative position between the cutting edge 22 and the mixture supply portion 29 in the radial direction of the cutting edge 22 and the inclination with respect to the horizontal plane of the mixture supply portion 29 can be adjusted.

如同上述一般,若依據實施形態4之切削方法以及切削裝置1,則係在切削工程中對於切削刃22之刃尖22a吹附氣體或液體和微粒子之混合物K,而對於切削刃22之刃尖22a進行修整。因此,係能夠在切削工程中將切削屑CW從切削刃22之刃尖22a除去,並且能夠將刃尖22a在剖面處而保持為與Y軸方向相平行。故而,若依據實施形態4之切削方法及切削裝置1,則係與實施形態1~實施形態3相同的,能夠對於被作切削之被加工物W之品質降低的情形作抑制。 As described above, according to the cutting method of the fourth embodiment and the cutting device 1, the mixture of the gas or the liquid and the fine particles K is blown to the cutting edge 22a of the cutting edge 22 in the cutting process, and the cutting edge of the cutting edge 22 is used. 22a is trimmed. Therefore, it is possible to remove the cuttings CW from the cutting edge 22a of the cutting edge 22 in the cutting process, and to maintain the cutting edge 22a parallel to the Y-axis direction at the cross section. Therefore, according to the cutting method and the cutting apparatus 1 of the fourth embodiment, it is possible to suppress the deterioration of the quality of the workpiece W to be cut, similarly to the first to third embodiments.

又,若依據實施形態4之切削方法及切削裝 置1,則由於係在切削工程中而對於切削刃22之刃尖22a進行修整,因此係並不需要為了進行修整而設置專用之工程。故而,若依據實施形態4之切削方法及切削裝置1,則係能夠達成修整作業之效率化並提升生產性。進而,若依據實施形態4之切削方法以及切削裝置1,則由於係使切削手段20之刃蓋體24具備有混合物供給部29,因此,係能夠在切削工程中以外(亦可為在並未藉由切削刃22而對於被加工物W進行切削時)的對於1條線或者是複數線進行了切削之後(如同實施形態2一般地並不使切削刃22移動至修整部61處地)而開始混合物K之供給並進行修整。故而,實施形態3之切削方法及切削裝置1,係能夠成為不需要耗費起因於切削刃22之移動以及與修整部61間之對位所導致的時間。進而,實施形態3之切削方法以及切削裝置1,由於係使切削手段20之刃蓋體24具備有混合物供給部29,而能夠在切削工程中以外來進行修整,因此,係能夠對於將切削刃22朝向Y軸方向進送的時間作活用而進行修整。 Moreover, according to the cutting method and the cutting device of the fourth embodiment When set to 1, the cutting edge 22a of the cutting edge 22 is trimmed in the cutting process, so that it is not necessary to provide a dedicated project for trimming. Therefore, according to the cutting method and the cutting apparatus 1 of the fourth embodiment, it is possible to achieve the efficiency of the trimming work and improve the productivity. Further, according to the cutting method and the cutting device 1 of the fourth embodiment, since the blade cover 24 of the cutting device 20 is provided with the mixture supply portion 29, it can be used in the cutting process (or not After cutting one line or a plurality of lines when the workpiece W is cut by the cutting edge 22 (as in the second embodiment, the cutting edge 22 is generally not moved to the trim portion 61) The supply of the mixture K is started and trimmed. Therefore, the cutting method and the cutting apparatus 1 of the third embodiment can be caused by the time required for the movement of the cutting edge 22 and the alignment with the trimming portion 61. Further, in the cutting method and the cutting device 1 of the third embodiment, since the blade cover body 24 of the cutting device 20 is provided with the mixture supply portion 29, it can be trimmed other than in the cutting process, so that the cutting edge can be used for the cutting edge The time taken by the 22 toward the Y-axis direction is used for trimming.

又,若依據實施形態4之切削方法及切削裝置1,則由於混合物供給部29係使切削刃22之刃尖22a中的相較於心軸21而更從被加工物W遠離的場所侵入至侵入孔29e內並進行修整,因此係能夠對於混合物K被吹附至被加工物W處並導致被加工物W受到傷害的情形作抑制。若依據實施形態4之切削方法及切削裝置1,則由於係使切削手段20之刃蓋體24具備有混合物供給部 29,因此係並不需要在吸盤台10之周圍設置進行修整之物品,故而係能夠謀求吸盤台10周圍之省空間化。 Further, according to the cutting method and the cutting apparatus 1 of the fourth embodiment, the mixture supply unit 29 intrudes the blade edge 22a of the cutting edge 22 from the place where the workpiece W is further away from the spindle 21 The inside of the hole 29e is intruded and trimmed, so that it is possible to suppress the case where the mixture K is blown to the workpiece W and the workpiece W is damaged. According to the cutting method and the cutting apparatus 1 of the fourth embodiment, the blade cover 24 of the cutting device 20 is provided with the mixture supply unit. Therefore, it is not necessary to provide an article for trimming around the chuck table 10, so that it is possible to save space around the chuck table 10.

進而,若依據實施形態4之切削方法以及切削裝置1,則由於係基於刃磨耗檢測手段29f之檢測結果,而對於供給部移動手段29作控制並定位於使混合物供給部29所供給之混合物K會與切削刃22之刃尖22a相衝突的位置處,因此,係能夠在切削中而確實地進行修整。 Further, according to the cutting method and the cutting device 1 of the fourth embodiment, the supply unit moving means 29 is controlled and positioned to supply the mixture K supplied from the mixture supply unit 29 based on the detection result of the edge wear detecting means 29f. It will be at a position that conflicts with the cutting edge 22a of the cutting edge 22, and therefore, it can be surely trimmed during cutting.

若依據實施形態3以及實施形態4,則係可得到以下之切削裝置1。 According to the third embodiment and the fourth embodiment, the following cutting device 1 can be obtained.

(附記4) (Note 4)

一種切削裝置1,其特徵為,係具備有:於表面上保持被加工物W之保持部10;和具備有可自由旋轉之心軸21以及被裝著於該心軸21上之切削刃22之切削手段20;和朝向被加工物W而供給切削水之切削水供給部27,該切削裝置1,並具備有:被安裝於前述切削手段20處,並且在被加工物W之切削中,將流體和微粒子之混合物K沿著該切削刃22之刃尖22a的切線而作供給之混合物供給部29。 A cutting apparatus 1 comprising: a holding portion 10 that holds a workpiece W on a surface thereof; and a spindle 21 that is freely rotatable and a cutting edge 22 that is attached to the spindle 21 The cutting means 20 and the cutting water supply unit 27 that supplies the cutting water to the workpiece W, the cutting apparatus 1 is provided to be attached to the cutting means 20, and in the cutting of the workpiece W, The mixture K of the fluid and the fine particles is supplied to the mixture supply portion 29 along the tangent to the cutting edge 22a of the cutting edge 22.

(附記5) (Note 5)

如附記4中所記載之切削裝置1,其中,係具備有檢測出前述切削刃22之磨耗量的刃磨耗檢測手段29f、和基 於前述刃磨耗檢測手段29f之檢測結果,而對於前述混合物供給部29之位置作調整之供給部移動手段29g。 The cutting device 1 according to the fourth aspect of the invention includes the blade wear detecting means 29f and the base for detecting the amount of wear of the cutting edge 22. The supply unit moving means 29g for adjusting the position of the mixture supply unit 29 by the detection result of the blade wear detecting means 29f.

[變形例] [Modification]

根據圖面,針對本發明之實施形態1~實施形態4之變形例的切削方法以及切削裝置1作說明。圖16,係為對於實施形態1~實施形態4之變形例之切削裝置的混合物供給部對於切削刃之刃尖進行修整的狀態作展示之剖面圖。圖17(a),係為對於實施形態1~實施形態4之變形例之切削方法的將混合物作吹附之工程的切削刃之刃尖的概要作展示之剖面圖,圖17(b),係為對於實施形態1~實施形態4之變形例之切削方法的將混合物作了吹附後之切削刃之刃尖的概要作展示之剖面圖。另外,在圖16以及圖17中,針對與前述實施形態1~實施形態4相同的部份,係附加相同之元件符號,並省略說明。 The cutting method and the cutting device 1 according to the modifications of the first to fourth embodiments of the present invention will be described with reference to the drawings. Fig. 16 is a cross-sectional view showing a state in which the tip of the cutting edge is trimmed in the mixture supply unit of the cutting device according to the modification of the first to fourth embodiments. Fig. 17 (a) is a cross-sectional view showing the outline of the cutting edge of the cutting edge of the cutting method of the cutting method according to the modification of the first to fourth embodiments, Fig. 17 (b), A cross-sectional view showing the outline of the cutting edge of the cutting edge after the mixture is blown to the cutting method according to the modification of the first to fourth embodiments. In the same manner as in the above-described first to fourth embodiments, the same reference numerals will be given to the same portions as those in the first embodiment to the fourth embodiment, and the description thereof will be omitted.

在變形例中,如同圖16中所示一般,係以使從混合物噴出口29a所直接吹附至切削刃22之刃尖22a處的混合物K之寬幅H2會成為較切削刃22之厚度T而更大的方式,來形成混合物噴出口29a。因此,變形例之混合物供給部29,若是將混合物K吹附至在剖面中為與Y軸方向相平行的切削刃22之刃尖22a處,則如同圖16中所示一般,係成為使切削刃22之刃尖22a的Y軸方向之兩端部消耗。 In the modification, as shown in Fig. 16, the width H2 of the mixture K which is directly blown from the mixture discharge port 29a to the blade edge 22a of the cutting edge 22 becomes the thickness T of the cutting edge 22. In a larger way, a mixture discharge port 29a is formed. Therefore, in the mixture supply portion 29 of the modification, if the mixture K is blown to the blade edge 22a of the cutting edge 22 which is parallel to the Y-axis direction in the cross section, as shown in Fig. 16, the cutting is performed. Both ends of the blade tip 22a in the Y-axis direction are consumed.

又,在變形例之切削方法中,起因於切削刃 22和被加工物W之間的組合,如同圖17(a)中所示一般,在切削工程中,切削刃22之刃尖22a的主要是Y軸方向之中央會有所消耗。因此,在變形例之切削方法中,當在切削工程中而心軸電流為特定值以上時,係對於切削刃22之刃尖22a吹附混合物K,並對於切削刃22之刃尖22a的Y軸方向之兩端部進行修整。故而,在變形例之切削方法中,係能夠將在切削工程中而Y軸方向之中央有所消耗的切削刃22之刃尖22a,如同圖17(b)中所示一般地在剖面處而保持為與Y軸方向相平行。進而,若依據變形例之切削方法及切削裝置1,則係與實施形態1~實施形態4相同的,係能夠使生產性提昇並對於被加工物之品質的降低作抑制,並且由於從混合物供給部29所對於切削刃22之刃尖22a直接吹附的混合物K之寬幅H2係較切削刃22之厚度T而更大,因此混合物供給部29係能夠對於切削刃22之Y軸方向的兩端部進行修整。 Moreover, in the cutting method of the modification, the cutting edge is caused The combination between 22 and the workpiece W is as shown in Fig. 17 (a), and in the cutting process, the tip end 22a of the cutting edge 22 is mainly consumed in the center of the Y-axis direction. Therefore, in the cutting method of the modification, when the mandrel current is greater than or equal to a specific value in the cutting process, the mixture K is blown to the blade edge 22a of the cutting edge 22, and Y to the blade edge 22a of the cutting edge 22 Both ends of the axial direction are trimmed. Therefore, in the cutting method of the modified example, the cutting edge 22a of the cutting edge 22 which is consumed in the center of the Y-axis direction during the cutting process can be generally at the cross section as shown in Fig. 17 (b). Keep parallel to the Y-axis direction. Further, according to the cutting method and the cutting apparatus 1 according to the modification, it is possible to improve productivity and reduce the deterioration of the quality of the workpiece, and to supply the mixture from the mixture, in the same manner as in the first to fourth embodiments. The width H2 of the mixture K directly blown by the blade edge 22a of the cutting edge 22 is larger than the thickness T of the cutting edge 22, so that the mixture supply portion 29 can be two in the Y-axis direction of the cutting edge 22. The ends are trimmed.

在前述之實施形態1~實施形態4以及變形例中,雖係在刃蓋體24處設置混合物供給部29並且構成為能夠與切削工程同時地而進行修整,但是,在本發明中,係亦可並不在刃蓋體24處設置混合物供給部29。於此情況,較理想,係在切削裝置1之例如從保持部10而分離的特定之位置處,設置混合物供給部29,並在切削工程以外而實行將混合物K吹附至切削刃22之刃尖22a處的工程。 In the first to fourth embodiments and the modifications described above, the mixture supply unit 29 is provided in the blade cover 24 and is configured to be trimmed simultaneously with the cutting process. However, in the present invention, The mixture supply portion 29 may not be provided at the blade cover 24. In this case, it is preferable that the mixture supply portion 29 is provided at a specific position of the cutting device 1 separated from the holding portion 10, for example, and the blade K is attached to the cutting edge 22 outside the cutting process. The work at the tip 22a.

又,在前述之實施形態1~實施形態4以及變 形例中,係在刃蓋體24處設置混合物供給部29,並且若是心軸電流成為特定值以上,則將混合物K吹附至切削刃22之刃尖22a處。然而,在本發明中,係亦可在刃蓋體24處設置混合物供給部29,並且並不基於心軸電流地來在切削工程中恆常將混合物K吹附至切削刃22之刃尖22a處。 Further, in the above-described first to fourth embodiments and changes In the example, the mixture supply portion 29 is provided at the blade cover body 24, and if the mandrel current is equal to or higher than a specific value, the mixture K is blown to the blade edge 22a of the cutting edge 22. However, in the present invention, the mixture supply portion 29 may be provided at the blade cover body 24, and the mixture K is constantly attached to the blade edge 22a of the cutting edge 22 in the cutting process without the mandrel current. At the office.

在前述之實施形態1~實施形態4以及變形例中,係適用在僅具備有1個的切削手段20之切削裝置1中。然而,在本發明中,係亦可適用於具備有2個的切削手段20之所謂雙切割型的切削裝置中。另外,在適用於雙切割型之切削裝置中時,亦同樣的,係可將混合物供給部29設置在刃蓋體24處,亦可設置在從保持部10而分離的特定之位置處。又,在雙切割型之切削裝置中,當將混合物供給部29設置在從保持部10而分離的特定之位置處的情況時,係只要將混合物供給部29至少設置1個即可。進而,本發明之切削裝置1,係可將混合物供給部29安裝於刃蓋體24處,亦可使混合物供給源29將混合物K與X軸方向相平行地而供給至切削刃22之刃尖22a處。 In the first to fourth embodiments and the modifications described above, the present invention is applied to the cutting device 1 including only one cutting device 20. However, in the present invention, it is also applicable to a so-called double-cut type cutting device including two cutting means 20. Further, in the case of being applied to a double-cut type cutting device, the mixture supply portion 29 may be provided at the blade cover body 24 or at a specific position separated from the holding portion 10. Further, in the double-cut type cutting device, when the mixture supply portion 29 is provided at a specific position separated from the holding portion 10, at least one of the mixture supply portions 29 may be provided. Further, in the cutting apparatus 1 of the present invention, the mixture supply unit 29 may be attached to the blade body 24, or the mixture supply source 29 may supply the mixture K to the cutting edge of the cutting edge 22 in parallel with the X-axis direction. 22a.

又,在實施形態1、實施形態3以及實施形態4中,係亦可將混合物K與X軸方向相平行地而供給至切削刃22之Z軸方向之中央的刃尖22a處。又,在實施形態1~實施形態4中,係亦可除了對於在心軸處所流動之電流進行監測並基於電流值之大小而決定是否要供給混合物K以外,亦更進而藉由用以實行對位等之未圖示之攝像 手段來恆常或者是於特定時序處而對於切削溝之狀態(切屑等之大小)作攝像,並根據該攝像結果,而當切削溝之狀態並非為容許範圍內的情況時,進行修整。另外,所謂特定時序,係可為基於進行了切削加工之被加工物W的枚數、被加工物W之大小、切削刃22之驅動積算時間等的至少1個而決定者。又,在實施形態1~實施形態4中,係亦可並不藉由攝像手段來對於切削溝之狀態作攝像,而在基於進行了切削加工之被加工物W的枚數、被加工物W之大小、切削刃22之驅動積算時間等的至少1個所判斷之特定之時序處,進行修整。 Further, in the first embodiment, the third embodiment, and the fourth embodiment, the mixture K may be supplied to the blade edge 22a at the center of the Z-axis direction of the cutting edge 22 in parallel with the X-axis direction. Further, in the first to fourth embodiments, in addition to monitoring the current flowing at the mandrel and determining whether or not to supply the mixture K based on the magnitude of the current value, it is also possible to perform the alignment. Camera not shown The means is to photograph the state of the cutting groove (the size of the chip or the like) at a constant timing or at a specific timing, and according to the imaging result, when the state of the cutting groove is not within the allowable range, the trimming is performed. In addition, the specific timing may be determined based on at least one of the number of workpieces W to be subjected to the cutting process, the size of the workpiece W, and the drive integration time of the cutting edge 22. Further, in the first to fourth embodiments, the number of workpieces W that have been subjected to the cutting process and the workpiece W can be imaged without using the imaging means for the state of the cutting groove. Trimming is performed at a specific timing determined by at least one of the size and the drive integration time of the cutting edge 22.

另外,本發明係並不被限定於上述實施形態、變形例。亦即是,係能夠在不脫離本發明之要點的範圍內而作各種之變形並實施。 Further, the present invention is not limited to the above-described embodiments and modifications. In other words, various modifications and improvements can be made without departing from the spirit and scope of the invention.

Claims (4)

一種切削方法,係為使用切削刃來對於被加工物進行切削之切削方法,其特徵為,係具備有:對於被加工物供給切削水,並使該切削刃旋轉而切削該被加工物之切削工程;和在該切削工程中,對於該切削刃吹附流體和微粒子之混合物之工程。 A cutting method is a cutting method for cutting a workpiece using a cutting edge, and is characterized in that the cutting water is supplied to the workpiece, and the cutting edge is rotated to cut the workpiece. Engineering; and in the cutting process, the engineering of the mixture of fluid and microparticles is blown to the cutting edge. 一種切削裝置,其特徵為,係具備有:於表面上保持被加工物之保持部;和具備有可自由旋轉之心軸以及被裝著於該心軸上之切削刃之切削手段;和在相對於該心軸之中心軸線方向而為垂直並且與該保持部之表面相平行之方向上,相對於該心軸而使該保持部作相對性移動之移動手段;和朝向被加工物而供切削水之切削水供給部,該切削裝置,並具備有:在被加工物之切削中,將流體和微粒子之混合物朝向該切削刃而作供給之混合物供給部。 A cutting device characterized by comprising: a holding portion for holding a workpiece on a surface; and a cutting device having a freely rotatable spindle and a cutting edge mounted on the spindle; and a moving means for relatively moving the holding portion with respect to the mandrel in a direction perpendicular to a central axis direction of the mandrel and parallel to a surface of the holding portion; and for facing the workpiece The cutting water supply unit for cutting water includes a mixture supply unit that supplies a mixture of a fluid and fine particles toward the cutting edge during cutting of the workpiece. 如申請專利範圍第2項所記載之切削裝置,其中,係對於在該心軸處所流動之電流進行監測,並基於該電流值之大小,而決定是否要供給該混合物。 The cutting device according to claim 2, wherein the current flowing through the mandrel is monitored, and whether or not the mixture is to be supplied is determined based on the magnitude of the current value. 如申請專利範圍第2項或第3項所記載之切削裝置,其中,該微粒子係為水溶性。 The cutting device according to claim 2, wherein the fine particles are water-soluble.
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