TW201632443A - Detaching method and detaching apparatus - Google Patents

Abstract

A holding mechanism 30 of the present invention maintains the adhered body WK by holding the first plate-like body BL, and makes an abutment member 340 abutted against the second plate-like body SB. A plurality of detaching mechanisms 51~5N, which are movably linked with the f abutment member 340 along the detaching direction and arranged along the detaching direction parallel to the main surface of the adhered body WK, make the two plate bodies detach by sequentially holding the second plate-like body SB and making the second plate-like body SB move away from the first plate-like body BL. With regard to the movement start timing, it is determined by executing the movement of abutment member 340 in advance, and actually measuring the position information representing the position of the abutment member 340 in motion and the timing of the abutment member 340 passing through the opposing position of the detaching mechanisms 51~5N.

Description

Stripping method and stripping device

The present invention relates to a peeling method and a peeling apparatus for peeling two sheet-like bodies which are directly or in close contact with each other via a thin layer.

As a technique for forming a specific pattern or film on a plate-like body such as a glass substrate or a semiconductor substrate, there is a technique of transferring a pattern or a film (hereinafter referred to as a "pattern" or the like) carried on another plate-like body to a substrate. . In this technique, it is necessary to peel the two sheet-like bodies after the two sheets are adhered to each other and the pattern or the like is transferred from one sheet to the other without damaging the pattern or the like.

For example, the technique described in the patent document 1 (Japanese Patent Laid-Open Publication No. 2014-189350) is incorporated. In this technique, the close-fitting body including the first plate-shaped body and the second plate-shaped body which are in close contact with each other is held in a horizontal posture by adsorbing and holding the first plate-shaped body on the stage. Further, the plurality of peeling mechanisms arranged on the second plate-like body side sequentially abut against the second plate-shaped body, and move while moving away from the first plate-shaped body while holding the second plate-shaped body, thereby The peeling between the one plate-shaped body and the second plate-shaped body advances in a specific peeling direction. At this time, it is managed that the contact member moves toward the peeling direction while abutting against the surface of the second plate-shaped body, thereby peeling off at a fixed speed.

The size of the plate is increased, or the film is carried between the two plates. In the case of the shape, there is a difference or a decrease in the number or interval of the peeling mechanisms provided corresponding to the difference in the adhesive force. Further, in order to control the peeling advance well by the coordinated operation of the peeling mechanism and the contact member, it is preferable that the time until the peeling mechanism abuts against the surface of the second plate-shaped body and is held after the contact member passes As short as possible. In order to achieve this, it is necessary to prevent the peeling mechanism from rapidly abutting against the surface of the second plate-shaped body after the abutting member passes, while preventing the interference between the peeling mechanism and the abutting member. Therefore, it is required to appropriately and simply set the operation timing of each peeling mechanism that cooperates with the abutting member in accordance with the arrangement of the peeling mechanism.

In the above background art, the number of the peeling mechanisms is small, and the intervals thereof are also large. Therefore, it is relatively easy to optimize the operation timing. For example, a method in which the device learns the correspondence relationship between the position of the abutting member and the movement timing of the peeling mechanism by the teaching operation in advance can be used. However, if the number of sets of the peeling mechanism becomes large, the adjustment work becomes very complicated.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique for separating the two sheet-like members that are in close contact with each other, and in the peeling device, the peeling mechanism can be operated according to the arrangement of the peeling mechanism. Simply optimized.

In order to achieve the above object, the aspect of the peeling method of the present invention is a peeling method in which the first plate-shaped body and the second plate-shaped body are directly or evenly separated by a thin layer, and the peeling method comprises: a disposing step, The holding body holds the contact body by holding the first plate-shaped body, and each of the plurality of peeling mechanisms that partially abuts the second plate-shaped body and maintains the function of the second plate-shaped body Arranging a gap between the surface of the second plate-shaped body and the peeling mechanism along a peeling direction parallel to a surface of the second plate-shaped body; and a peeling step, the abutting member abuts against the second The surface of the plate-shaped body moves in the peeling direction on the gap space with the peeling mechanism, and each of the peeling mechanisms sequentially moves toward the second plate-shaped body in the peeling direction and abuts against the passing of the abutting member. After the surface of the second plate-shaped body, the second plate-shaped body is held while The second plate-shaped body is separated from the first plate-shaped body while moving in the direction away from the first plate-shaped body; and the movement timing of each of the peeling mechanisms is based on the abutting member in the peeling direction in advance. The abutting member obtained by the movement is set by a correspondence relationship between the timing of the opposing position of the peeling mechanism and the positional information indicating the position of the abutting member in the peeling direction.

Further, in order to achieve the above object, an aspect of the peeling device of the present invention includes: a holding mechanism that holds the first plate-shaped body and the second plate-shaped body directly or through a thin layer by holding the first plate-shaped body a contact body that is in close contact with each other; the abutting member abuts against the surface of the second plate-shaped body of the adhesion body held by the holding mechanism, and is parallel to the surface of the second plate-shaped body Moving in the peeling direction; a plurality of peeling mechanisms are arranged in the peeling direction, and each of them has a function of partially contacting the second plate-shaped body to hold the second plate-shaped body, and is capable of abutting against the second plate a contact position between the surface of the plate-like body and a standby position away from the surface of the second plate-shaped body to provide a gap for the passage of the abutting member; and a control mechanism for controlling the peeling mechanism and a peeling operation is performed by the movement of the abutting member; and in the peeling operation, the abutting member abuts against the surface of the second plate-shaped body and faces the gap space with the peeling mechanism The peeling direction moves, and each of the peeling mechanisms sequentially moves toward the second plate-shaped body in the peeling direction and abuts against the surface of the second plate-shaped body after the abutting member passes The second plate-shaped body moves away from the first plate-shaped body to separate the second plate-shaped body from the first plate-shaped body, and the movement timing of each of the peeling mechanisms is based on the abutting member along the advance The abutting member obtained by the movement in the peeling direction is set by a correspondence relationship between the timing of the opposing position of the peeling mechanism and the positional information indicating the position of the abutting member in the peeling direction.

In the invention of such a configuration, according to the correspondence between the timing of the opposing position of the abutting member and the position of the abutting member when the abutting member is moved, the setting is determined. The movement timing of each of the peeling mechanisms in which the joining members cooperate to advance the peeling. That is, the operation of the peeling mechanism is determined after grasping the correspondence between the timing at which the abutting member actually passes the opposing position with the peeling mechanism and the position information indicating the position of the abutting member. Therefore, regardless of how the peeling mechanism is disposed, each peeling mechanism can be operated at a timing corresponding to the arrangement thereof. Therefore, it is possible to prevent the abutting member from colliding with the peeling mechanism before the abutting member passes the peeling mechanism, or the second plate-shaped body is too slow to be peeled off by the peeling mechanism. The problem is that the action of each peeling mechanism can be optimized.

As described above, according to the present invention, the movement timing of each peeling mechanism can be made to correspond to the actual arrangement of the peeling mechanism, and the interference between the abutting member and the peeling mechanism can be avoided, and the operation of each peeling mechanism can be easily optimized.

1‧‧‧ peeling device

3‧‧‧Loading block

5‧‧‧Upper adsorption block

5i‧‧‧Adsorption unit

5i1‧‧‧beam components

5i2‧‧‧column components

5i3‧‧‧column components

5i4‧‧‧ board components

5i5‧‧‧ Lifting mechanism

5i6‧‧‧pad support member

5i7‧‧‧Adsorption pad

5i4 (i = 1, 2, ..., N) ‧ ‧ board components

5i6 (i = 1, 2, ..., N) ‧ ‧ pad holding member

5i6y‧‧‧(+Y) side end face

5i7 (i = 1, 2, ..., N) ‧ ‧ adsorption pad

5N‧‧‧Adsorption unit (peeling mechanism)

11‧‧‧Main frame

30‧‧‧Moving station (holding mechanism)

31‧‧‧ horizontal stage

32‧‧‧Conical stage

33‧‧‧Initial stripping unit

34‧‧‧roll unit

50‧‧‧Support framework

51‧‧‧Adsorption unit (peeling mechanism)

52‧‧‧Adsorption unit (peeling mechanism)

53‧‧‧Adsorption unit (peeling mechanism)

54‧‧‧Adsorption unit

70‧‧‧Control unit

310‧‧‧ (horizontal stage)

311‧‧‧ slot

312‧‧‧ slot

320‧‧‧ (of the cone stage) upper surface

331‧‧‧ Pressing members

332‧‧‧Support arm

333‧‧‧rail

334‧‧‧column components

335‧‧‧ Lifting mechanism

336‧‧‧Base section

337‧‧‧Location adjustment agency

340‧‧‧ peeling roller (abutment member)

341‧‧‧ Slider

342‧‧‧ Slider

343‧‧‧lower angled pieces

344‧‧‧ Lifting mechanism

345‧‧‧Upper angled pieces

346‧‧‧Support roll

347‧‧‧Photography department (detection mechanism, camera organization)

351‧‧‧rail

352‧‧‧rail

353‧‧‧Motor (pulse motor)

354‧‧‧Rolling screw mechanism

517‧‧‧Adsorption pad

527‧‧‧Adsorption pad

537‧‧‧Adsorption pad

547‧‧‧Adsorption pad

557‧‧‧Adsorption pad

701‧‧‧CPU

702‧‧‧Motor Control Department

703‧‧‧Valve Control Department

704‧‧‧Negative Pressure Supply Department

705‧‧‧UI Department

706‧‧‧Image Processing Department

BL‧‧‧layer (first plate)

C1‧‧‧pulse count value

C2‧‧‧ pulse count value

C3‧‧‧ pulse count value

C4‧‧‧ pulse count value

C5‧‧‧pulse count value

E‧‧‧ ridge line

IM‧‧‧ image

Ls‧‧ baseline

SB‧‧‧ substrate (second plate)

WK‧‧‧ workpiece (closed body)

V3‧‧‧ valve group

V5‧‧‧ valve group

S101~S109‧‧‧Steps

Θ‧‧‧ corner

‧‧‧‧角

‧‧‧‧角

+X‧‧‧ directions

-X‧‧‧ directions

+Y‧‧ Direction

-Y‧‧ Direction

+Z‧‧‧ directions

-Z‧‧‧ directions

Fig. 1 is a perspective view showing an embodiment of a peeling device of the present invention.

Fig. 2 is a perspective view showing the main configuration of the peeling device.

Fig. 3 is a side view showing the structure of the initial peeling unit and the positional relationship of the respective parts.

Fig. 4 is a block diagram showing the electrical configuration of the peeling device.

5A, 5B, 5C, and 5D are views showing the operation of each unit in the process of the peeling operation.

6A, 6B, and 6C are views showing examples in which the arrangement patterns of the adsorption units are different.

7A and 7B are views showing the positional relationship between the roller unit and the adsorption unit.

8A, 8B, and 8C are views showing a state in which an adsorption unit is imaged by an imaging unit.

Fig. 9 is a flow chart showing a method of setting the movement timing of the adsorption unit.

10A and 10B are views for explaining the principle of the movement timing of the adsorption unit.

Fig. 1 is a perspective view showing an embodiment of a peeling device of the present invention. Uniformly Indicates the direction in each figure, and sets the XYZ orthogonal coordinate axis as shown in the lower right of Figure 1. Here, the XY plane represents a horizontal plane. Further, the Z axis represents a vertical axis, and more specifically, the (-Z) direction indicates a vertical direction.

This peeling device 1 is a device for peeling off two plate-like bodies carried in a state in which the main surfaces are in close contact with each other. For example, it is used in one part of a pattern forming process for forming a specific pattern on the surface of a substrate such as a glass substrate or a semiconductor substrate. More specifically, in the pattern forming process, the pattern forming material is uniformly applied to the surface of the cladding layer which is temporarily carried on the carrier to be transferred onto the substrate of the substrate to be transferred, (coating step). Then, the coating layer is patterned by patterning the surface-processed plate according to the pattern shape against the coating layer (patterning step). The patterned coating layer is adhered to the substrate in this manner (transfer step), whereby the pattern is finally transferred from the cladding layer to the substrate.

At this time, in order to separate the substrate and the coating which are in close contact between the plate and the coating in the patterning step or in the transfer step, the apparatus can be suitably applied. Of course, it can be used for both of them, and can also be used for other purposes. For example, it can also be applied to a peeling process when a film supported on a carrier is transferred to a substrate. In addition to this, the apparatus can be applied to all processes in which two sheet-like bodies which are directly or in contact with each other through a thin layer such as a film are peeled off.

The peeling device 1 has a structure in which the stage block 3 and the upper adsorption block 5 are fixed to the main frame 11 attached to the frame. Fig. 1 is a view showing the internal structure of the device and omitting the frame. Further, in addition to the respective blocks, the peeling device 1 includes the following control unit 70 (Fig. 4).

The stage block 3 has a stage 30 for placing a plate and a coating, or a bonded body (hereinafter referred to as a "workpiece") in which the substrate and the coating are in close contact with each other. The stage 30 includes a horizontal stage portion 31 whose upper surface is a substantially horizontal plane, and a tapered stage portion 32 whose upper surface is a plane having a slope of several degrees (for example, about 2 degrees) with respect to a horizontal plane. An initial peeling unit 33 is provided in the vicinity of the end portion on the (-Y) side of the tapered stage portion 32 of the stage 30. Further, the roller unit 34 is provided so as to straddle the horizontal stage portion 31.

On the other hand, the upper adsorption block 5 includes a support frame 50 in which the autonomous frame 11 is erected and disposed to cover the upper portion of the stage block 3. N groups (N is a natural number) of adsorption units 51, 52, 53, ..., 5N are mounted on the support frame 50. The adsorption units 51 to 5N are sequentially arranged in the (+Y) direction. Hereinafter, when it is necessary to distinguish each adsorption unit, the i-th (i is a natural number) adsorption unit 5i will be referred to as an "i-th adsorption unit" in the (+Y) direction.

Fig. 2 is a perspective view showing the main configuration of the peeling device. More specifically, FIG. 2 shows the structure of the stage 30, the roller unit 34, and the i-th adsorption unit 5i in each configuration of the peeling device 1. The stage 30 includes a horizontal stage portion 31 whose upper surface 310 is substantially horizontal, and a tapered stage portion 32 whose upper surface 320 is a tapered surface that is inclined by a few degrees with respect to the horizontal plane. The upper surface 310 of the horizontal stage portion 31 has a planar size slightly larger than the planar size of the workpiece to be placed.

The tapered stage portion 32 is provided in close contact with the (-Y) side end portion of the horizontal stage portion 31. The portion of the upper surface 320 that is in contact with the horizontal stage portion 31 is located at the same height (Z-direction position) as the upper surface 310 of the horizontal stage portion 31. On the other hand, as the horizontal stage portion 31 moves away from the (-Y) direction, the upper surface 320 retreats downward (i.e., the (-Z) direction. Therefore, in the entire stage 30, the horizontal surface of the upper surface 310 of the horizontal stage portion 31 is continuous with the tapered surface of the upper surface 320 of the tapered stage portion 32, and the ridge line portion E of the connection is extended in the X direction. Straight line.

Further, a lattice-shaped groove is formed in the upper surface 310 of the horizontal stage portion 31. More specifically, a lattice-shaped groove 311 is provided at a central portion of the upper surface 310 of the horizontal stage portion 31. In addition, the peripheral portion of the upper surface 310 of the horizontal stage portion 31 is provided so as to surround the region in which the groove 311 is formed and the shape of the side of the tapered stage portion 32 in the rectangular shape is removed. Slot 312. The grooves 311 and 312 are connected to the negative pressure supply unit 704 (FIG. 4) described below via a control valve, and have a function as an adsorption tank, that is, the adsorption holding cylinder 30 is carried by being supplied with a negative pressure. Set the workpiece. The two types of grooves 311 and 312 are not connected to the stage, and are connected to the negative pressure supply unit 704 via independent control valves. Therefore, in addition to the adsorption using two types of tanks, it is also possible to use only one type of tank for adsorption.

A roller unit 34 is provided across the stage 30 thus constructed. Specifically In the X-direction end portions of the horizontal stage portion 31, a pair of guide rails 351 and 352 are extended in the Y direction, and the guide rails 351 and 352 are fixed to the main frame 11. Further, the roller unit 34 is slidably attached to the guide rails 351 and 352.

The roller unit 34 includes sliders 341 and 342 that are slidably engaged with the guide rails 351 and 352, respectively. A lower corner piece 343 is provided across the upper portion of the stage 30 and extending in the X direction so as to connect the sliders 341 and 342. In the lower corner piece 343, an upper angled piece 345 is attached to the lower and lower angled piece 344 by a lifting mechanism 344. Further, a cylindrical peeling roller 340 having an X-direction in the axial direction is rotatably attached to the upper gusset 345.

When the upper gusset 345 is lowered downward (-Z) by the elevating mechanism 344, the lower surface of the peeling roller 340 abuts against the upper surface of the workpiece placed on the stage 30. On the other hand, in a state in which the upper gusset 345 is positioned above the (+Z) direction by the elevating mechanism 344, the peeling roller 340 is separated from the upper surface of the workpiece. In the upper gusset 345, a support roller 346 for suppressing the bending of the peeling roller 340 is rotatably mounted, and a rib useful for preventing the upper horn 345 from bending itself is appropriately provided. The peeling roller 340 and the backup roller 346 do not have a driving source, and the like is free to rotate.

The roller unit 34 is movable in the Y direction by the motor 353 attached to the main frame 11. More specifically, the lower corner piece 343 is coupled to, for example, a ball screw mechanism 354 as a conversion mechanism that converts the rotational motion of the motor 353 into a linear motion. When the motor 353 rotates, the lower corner piece 343 moves in the Y direction along the guide rails 351, 352, whereby the roller unit 34 moves in the Y direction. The movable range of the peeling roller 340 accompanying the movement of the roller unit 34 is set to the position near the (-Y) side end of the horizontal stage portion 31 in the (-Y) direction, and is set in the (+Y) direction to The position near the (+Y) side end of the horizontal stage portion 31 is set.

Further, an imaging unit 347 is attached to the roller unit 34. The imaging unit 347 is, for example, a CCD camera (charge-coupled device camera) having an imaging function, and is attached to the upper horn 345 with the imaging direction facing upward. As will be described later in detail, the imaging unit 347 moves in the Y direction together with the peeling roller 340 in association with the movement of the roller unit 34. The adsorption unit 51 and the like arranged above the roller unit 34 are taken.

Next, the configuration of the i-th adsorption unit 5i (i = 1, 2, ..., N) will be described. Further, the first to N-th adsorption units 51 to 5N have the same configuration. The i-th adsorption unit 5i has a beam member 5i1 extending in the X direction and fixed to the support frame 50. The pair of column members 5i2 and 5i3 are attached to the beam member 5i1 so as to be displaced from each other in the (-Z) direction. The plate members 5i2 and 5i3 are attached to the column members 5i2 and 5i3 so as to be lifted and lowered by the guide rails that are blocked in the drawing. The plate member 5i4 is driven up and down by an elevating mechanism 5i5 including a motor and a switching mechanism (for example, a ball screw mechanism).

A square rod-shaped pad supporting member 5i6 extending in the X direction is attached to the lower portion of the plate member 5i4. On the lower surface of the pad supporting member 5i6, a plurality of adsorption pads 5i7 are arranged at equal intervals in the X direction. 2 shows a state in which the i-th adsorption unit 5i is moved upwards from the actual position. When the plate member 5i4 is moved downward by the elevating mechanism 5i5, the adsorption pad 5i7 can be lowered onto the horizontal stage portion 31. The surface 310 is extremely close to the position. In a state in which the workpiece is placed on the stage 30, the adsorption pad 5i7 abuts against the upper surface of the workpiece. Each of the adsorption pads 5i7 is given a negative pressure from the negative pressure supply portion 704 described below to adsorb and hold the upper surface of the workpiece.

Fig. 3 is a side view showing the structure of the initial peeling unit and the positional relationship of the respective parts. First, the structure of the initial peeling unit 33 will be described with reference to Figs. 1 and 3 . The initial peeling unit 33 has a rod-shaped pressing member 331 extending above the tapered stage portion 32 and extending in the X direction, and the pressing member 331 is supported by the support arm 332. The support arm 332 is attached to the column member 334 so as to be movable up and down via a guide rail 333 extending in the vertical direction. The support arm 332 moves up and down relative to the column member 334 by the action of the lifting mechanism 335. The column member 334 is supported by the base portion 336 attached to the main frame 11, and the position of the column member 334 in the Y direction can be adjusted on the base portion 336 by a position adjustment mechanism 337 within a specific range.

The workpiece WK, which is a peeling target, is placed on the stage 30 composed of the horizontal stage portion 31 and the tapered stage portion 32. The workpiece in the above-described patterning step is a close-contact body in which a plate and a coating layer are adhered to each other via a film of a pattern forming material. On the other hand, the workpiece in the transfer step will The substrate and the cladding are adhered to each other via a patterned pattern. Hereinafter, the peeling operation of the peeling device 1 in the case where the bonded body of the substrate SB and the cladding layer BL in the transfer step is used as the workpiece WK will be described. When the dense body composed of the plate and the cladding layer is used as the workpiece, the peeling can be performed by the same method.

In the workpiece WK, the cladding layer BL has a larger planar size than the substrate SB. The substrate SB is in close contact with the substantially central portion of the cladding layer BL. The workpiece WK is placed on the stage 30 with the cladding layer BL on the bottom and the substrate SB on the top. At this time, as shown in FIG. 3, the (-Y) side end portion of the substrate SB in the workpiece WK is substantially above the ridge line portion E of the boundary between the horizontal stage portion 31 and the tapered stage portion 32, and is more detailed. In other words, the workpiece WK is placed on the stage 30 so that the ridge portion E is slightly closer to the (-Y) side. Therefore, the cladding layer BL on the outer side of the substrate SB in the (-Y) direction is disposed so as to protrude from the tapered stage portion 32 so as to be above the lower surface of the cladding layer BL and the tapered stage portion 32. A gap is created between the surfaces 320. The angle θ between the lower surface of the cladding layer BL and the upper surface 320 of the tapered stage portion 32 is about the same as the taper angle of the tapered stage portion 32 (2 degrees in the present embodiment).

The horizontal stage portion 31 is provided with adsorption grooves 311 and 312 for adsorbing and holding the lower surface of the cladding layer BL. The adsorption groove 311 adsorbs the lower surface of the cladding layer BL which is in contact with the lower portion of the substrate SB, and on the other hand, the adsorption groove 312 adsorbs the lower surface of the cladding layer BL which is outside the substrate SB. The adsorption grooves 311 and 312 can be independently turned on and off, and the two types of adsorption grooves 311 and 312 can be used together to strongly adsorb the coating layer BL. On the other hand, by using only the outer adsorption groove 312 for adsorption, the central portion of the coating layer BL on which the pattern is effectively formed is not adsorbed, and pattern damage caused by the bending of the coating layer BL due to adsorption can be prevented. . By independently controlling the supply of the negative pressure to the adsorption groove 311 at the center portion and the adsorption groove 312 at the peripheral portion, the adsorption and retention of the coating layer BL can be switched depending on the purpose.

The first to Nth adsorption units 51 to 5N and the separation roller 340 of the roller unit 34 are disposed above the workpiece WK adsorbed and held by the stage 30 in this manner. As described above, a plurality of adsorption pads 5i7 are arranged in the X direction in the lower portion of the i-th adsorption unit 5i. In more detail, suck The attachment pad 5i7 is formed of a material having flexibility and elasticity such as rubber or silicone resin, and has a function that the lower surface abuts against the upper surface of the workpiece WK (more specifically, the upper surface of the substrate SB) to adsorb the workpiece. Hereinafter, the adsorption pads provided in the respective adsorption units 51, 52, ..., 5N are distinguished from each other by the reference numerals 517, 527, ..., 5N7.

The first adsorption unit 51 is disposed above the (-Y)-side end of the horizontal stage portion 31, and adsorbs the upper surface of the (-Y)-side end portion of the substrate SB when descending. On the other hand, the Nth adsorption unit 5N is disposed above the (+Y) side end portion of the substrate SB placed on the stage 30, and adsorbs the upper surface of the (+Y) side end portion of the substrate SB when descending. . The second adsorption unit 52 to the (N-1) adsorption unit 5 (N-1) are appropriately dispersed and disposed between these, and for example, the adsorption pads 517 to 5N7 can be formed at substantially equal intervals in the Y direction. Further, as described below, the interval between the adsorption pads 517 to 5N7 may be set to be uneven as needed. Between the adsorption units 51 to 5N, the movement in the vertical direction and the on and off of the adsorption can be performed independently of each other.

The peeling roller 340 moves in the up and down direction to move toward and away from the substrate SB, and horizontally moves along the substrate SB by moving in the Y direction. In a state where the peeling roller 340 is lowered, it abuts on the upper surface of the substrate SB and horizontally moves while rolling. The position of the peeling roller 340 when moving to the most (-Y) side is the position closest to the (+Y) side of the adsorption pad 517 of the first adsorption unit 51. In order to realize the arrangement to the above-mentioned close position, the adsorption unit having the same structure as the ith adsorption unit 5i shown in FIG. 2 is as shown in FIG. 1 and the other second to N-th adsorption units 52 to the first adsorption unit 51. The 5N is mounted to the support frame 50 in the opposite direction.

The initial peeling unit 33 adjusts the Y-direction position such that the pressing member 331 is positioned above the coating layer BL that protrudes above the tapered stage portion 32. Further, the lower end of the pressing member 331 is lowered by the support arm 332 to be lowered to press the upper surface of the coating layer BL. At this time, in order to prevent the pressing member 331 from injuring the coating layer BL, the front end of the pressing member 331 is formed of an elastic member.

Fig. 4 is a block diagram showing the electrical configuration of the peeling device. The various parts of the device are controlled by a control unit 70. The control unit 70 includes a CPU (Central Processing Unit) A unit 701, a motor control unit 702, a valve control unit 703, a negative pressure supply unit 704, a user interface (UI, User Interface) unit 705, and an image processing unit 706. The CPU 701 controls the overall operation of the device. The motor control unit 702 controls motors provided in the respective units. The valve control unit 703 controls the valves provided in the respective units. The negative pressure supply unit 704 generates a negative pressure supplied to each unit. The UI unit 705 has a function of accepting an operation input from a user or reporting the status of the device to the user. The image processing unit 706 performs specific image processing in accordance with the image signal. Further, the control unit 70 may not include the negative pressure supply portion when the negative pressure supplied from the outside such as the factory power can be utilized.

The motor control unit 702 drives and controls the motor group 353 and the elevating mechanisms 335 and 344 provided in the stage block 3, and the motor groups such as the elevating mechanisms 515 to 5N5 provided in the respective adsorption units 51 to 5N of the upper adsorption block 5. The valve control unit 703 controls the valve group V3 that is connected to the piping path provided in the adsorption grooves 311 and 312 of the horizontal stage unit 31 from the negative pressure supply unit 704 to individually supply a specific negative pressure to the adsorption grooves. And a valve group V5 or the like for supplying a specific negative pressure to each of the adsorption pads 517 to 5N by the negative pressure supply unit 704 connected to the pipe paths of the adsorption pads 517 to 5N7.

The image processing unit 706 receives the image signal output from the imaging unit 347 and performs specific image processing. The details will be described later, and the image processing unit 706 detects the image of the i-th adsorption unit from the image captured by the imaging unit 347.

Next, the operation of the peeling device 1 configured as described above will be described. The peeling operation performed by the peeling device 1 is basically the same as the peeling operation of the peeling device described in the above-mentioned Patent Document 1 (Japanese Laid-Open Patent Publication No. 2014-189350). Therefore, the detailed description of the peeling operation of the peeling device 1 will be omitted. Here, the operation of each part in the peeling operation will be briefly described.

When the workpiece WK, which is the object to be peeled off, is carried into the peeling device 1 from the outside and placed on a specific position of the stage 30, the respective parts of the apparatus are positioned in the initial state shown in FIG. In the initial state, the workpiece WK is adsorbed by one or both of the adsorption grooves 311, 312. hold. Further, the pressing member 331 of the initial peeling unit 33, the peeling roller 340 of the roller unit 34, and the adsorption pads 517 to 5N7 of the first to Nth adsorption units 51 to 5N are all separated from the workpiece WK. Each of the adsorption units 5i is disposed with a sufficient gap between the adsorption pad 5i7 and the substrate SB so as not to interfere with the roller unit 34 that moves in the Y direction. Further, the peeling roller 340 is in a state of being separated from the workpiece WK at a position slightly closer to the (+Y) side than the adsorption pad 517 of the first adsorption unit 51. The peeling action is performed from such an initial state.

5A to 5D are views showing the operation of each part in the process of the peeling operation. First, the first adsorption unit 51 is lowered, and the adsorption pad 517 abuts against the upper surface of the (-Y) side end portion of the substrate SB to hold the substrate SB by vacuum suction. Further, the peeling roller 340 is lowered to abut against the upper surface of the substrate SB. As shown in FIG. 5A, the pressing member 331 descends from this state and presses the end portion of the blanket layer BL. The end of the cladding layer BL protrudes above the tapered stage portion 32 so as to have a gap between the lower surface thereof and the upper surface 320 of the tapered stage 32. Therefore, the end portion of the coating layer BL is pressed downward by the pressing member 331, and the end portion of the coating layer BL is bent downward along the tapered surface of the tapered stage portion 32. As a result, peeling is started by the end portion of the substrate SB adsorbed and held by the first adsorption unit 51 and the coating layer BL are separated.

Then, as shown in FIG. 5B, the first adsorption unit 51 starts to rise, and the peeling roller 340 abuts on the surface of the substrate SB while moving while moving in the (+Y) direction. Thereby, the peeling of the substrate SB and the cladding layer BL proceeds in the (+Y) direction. Since the peeling roller 340 abuts, peeling does not occur beyond the area where the peeling roller 340 abuts on the substrate SB. By moving the peeling roller 340 to the (+Y) direction at a fixed speed while abutting against the substrate SB, the peeling advance speed can be maintained constant.

Hereinafter, the boundary between the peeling region where the substrate SB and the cladding layer BL have been peeled off and the unpeeled region where the cladding layer BL has not been peeled off is referred to as a "peeling boundary line". The peeling roller 340 is a roller member that extends in the X direction, and one surface abuts against the substrate SB and moves in the (+Y) direction. Therefore, the peeling boundary line is maintained linearly in the direction in which the roll is extended, that is, in the X direction, and is performed in the (+Y) direction at a constant speed. Thereby, it is possible to reliably prevent the occurrence of the change in the advance speed due to the peeling. Pattern damage caused by stress concentration.

The adsorption unit 52, 53, ... sequentially descends the substrate SB after passing through the peeling roller 340, and abuts against the substrate SB immediately after the self-coating layer BL is peeled off and holds the substrate SB. Specifically, as shown in FIG. 5B, the second adsorption unit 52 starts to descend and advance toward the substrate SB when the peeling roller 340 passes the position directly below it. When the adsorption pad 527 abuts against the upper surface of the substrate SB, the substrate SB is adsorbed and held by the second adsorption unit 52 by the negative pressure supplied from the negative pressure supply portion 704.

As shown in FIG. 5C, the second adsorption unit 52 shifts to rise when the adsorption holding of the substrate SB is started. Thereafter, the substrate SB is held by the first adsorption unit 51 and the second adsorption unit 52. Thereby, the substrate SB from which the self-coating layer BL is peeled off can be more reliably maintained, and the substrate SB can be prevented from being bent downward to be in contact with the cladding layer BL or from the adsorption pad 517. Further, by appropriately maintaining the angle between the substrate SB and the cladding layer BL in the vicinity of the peeling boundary, it is possible to obtain an effect of facilitating the peeling.

Similarly, the other adsorption units 53, 54, ..., 5N start to descend when the peeling roller 340 passes under the adsorption unit, and start to adsorb and hold up when the adsorption pad abuts against the substrate SB, thereby lifting the substrate SB upward. Party Tila. Each of the adsorption units is stopped at a point in time until it rises to a specific height from the stage 30.

The most downstream (+Y) side adsorption unit 5N in the peeling advance direction holds the substrate SB and rises to a specific position. Thus, as shown in FIG. 5D, the substrate SB and the cladding layer BL are completely separated to complete the peeling. The peeling roller 340 and the pressing member 331 are retracted to a position away from the substrate SB and the cladding layer BL, so that the separated substrate SB and the cladding layer BL can be carried out, and the peeling operation is completed.

In the peeling operation as described above, the number of the adsorption units to be disposed and the arrangement thereof are preferably changed depending on the type or thickness of the substrate SB and the type of the pattern or film formed between the coating layer BL and the coating layer BL. situation.

6A to 6C are views showing examples in which the arrangement patterns of the adsorption units are different. E.g, In the case where the adhesion between the substrate SB and the cladding layer BL is relatively weak, as shown in FIG. 6A, the substrate SB after the separation is preferably The angle α formed by the coating layer BL is kept at a relatively small value to be peeled off. For such a purpose, the pulling force required for peeling is also small, so that the adsorbing units can be disposed at a large interval in the Y direction.

On the other hand, for example, when the adhesion between the substrate SB and the cladding layer BL is relatively strong, as shown in FIG. 6B, it is preferable to maintain the angle β formed by the substrate SB after the peeling and the cladding layer BL to be larger. Peel off at the value. In addition, the force of pulling the substrate SB must be made larger. Therefore, it is necessary to make the interval between the adsorption units in the Y direction smaller, so that it is necessary to increase the number of the adsorption units according to the situation.

Further, for example, when the rigidity of the substrate SB is high and it is difficult to bend, it is necessary to reduce the angle formed by the substrate SB and the cladding layer BL while pulling the substrate SB with a relatively high pulling force. In this case, it is also necessary to increase the number of adsorption units. For example, in order to cope with such a situation, as shown in FIG. 6C, it is also considered that the vicinity of the end portion of the substrate SB is close to the arrangement of the adsorption unit or the like, and the interval between the adsorption units is not uniform.

As described above, the number of the adsorption units to be disposed and the like can be changed according to the purpose, and the utilization range of the apparatus is expanded and convenient. However, in order to be able to achieve this, the following problems arise.

7A and 7B are views showing the positional relationship between the roller unit and the adsorption unit. As shown in FIG. 7A, the roller unit 34 moves at a fixed speed in the (+Y) direction in the peeling operation. On the other hand, the adsorption unit 5i holds and lifts the substrate SB by raising and lowering the plate member 5i4 provided with the adsorption pad 5i7 at the lower portion in the Z direction. Therefore, if the movement timing of the members is improperly set, there is a possibility that the two interfere with each other.

As shown in Fig. 7B, in principle, if the plate member 5i4 starts to descend after the roller unit 34 passes the position directly below, no interference occurs. However, in order to maintain the angle α formed by the substrate SB and the cladding layer BL, the peeling is stably performed, and it is preferable to use the adsorption pad as quickly as possible. 5i7 holds the substrate SB after the peeling roller 340 passes. In other words, it is preferable that the interval W in the Y direction of the (+Y) side end surface 5i6y of the pad supporting member 5i6 and the position where the peeling roller 340 abuts on the substrate SB when the suction pad 5i7 starts to fall is as small as possible, and it is preferable to make it This interval W is zero.

Conventionally, the movement timing of each unit for realizing such an operation is set, for example, by an operator performing a teaching operation in which the apparatus associates the timing signal periodically output with the movement timing of each unit and memorizes it. However, as described above, the teaching operation becomes complicated when the number of the adsorption units is large or when the arrangement is uneven, and even if the fine adjustment corresponding to the offset of the mounting position is included, the operation is performed. The number of steps will become huge.

Therefore, the peeling apparatus 1 of the present embodiment has a function of detecting the positional relationship between the roller unit 34 and each of the adsorption units 5i when the roller unit 34 is moved, and determines the movement timing of each adsorption unit 5i based on the result. Specifically, the roller unit 34 is provided with an imaging unit 347 ( FIG. 2 ), and the imaging unit 347 moves integrally with the separation roller 340 in association with the movement of the roller unit 34 . Further, the roller unit 34 passes under the adsorption unit 5i, and the imaging unit 347 photographs the adsorption unit 5i located above, whereby the position of each adsorption unit 5i observed from the roller unit 34 is grasped by image processing. Based on the result, the movement timing of each adsorption unit 5i based on the shift timing of the roller unit 34 is set.

8A to 8C are views showing a state in which an adsorption unit is photographed by an imaging unit. As shown in FIG. 8A, the imaging unit 347 is fixed to the upper gusset 345 at a position substantially directly above the peeling roller 340 so that the imaging direction is upward. Therefore, the image IM captured by the imaging unit 347 when the roller unit 34 is located directly below the adsorption unit 5i includes an image of a portion of the adsorption unit 5i such as the pad supporting member 5i6 as shown in FIG. 8B. In other words, it is understood that when the image of the adsorption unit 5i is included in the image IM captured by the imaging unit 347, the roller unit 34 is located directly below the adsorption unit 5i. Thereby, the timing at which the roller unit 34 passes the position directly under the respective adsorption units 5i during the movement thereof can be grasped.

The image signal output from the imaging unit 347 is analyzed by the image processing unit 706. Image The control unit 706 detects, from the image IM, a portion of the adsorption unit 5i that interferes with the roller unit 34, that is, a portion located on the most downstream side of the traveling direction of the roller unit 34. This is because the interference of the roller unit 34 and the adsorption unit 5i can be surely prevented by grasping the timing of passing the portion through the upper portion of the roller in advance. In the present embodiment, the (+Y) side end surface 5i6y of the pad supporting member 5i6 is detected as the portion.

As shown in FIG. 8C, a reference line Ls is set in the image IM. The reference line Ls corresponds to the interval W shown in FIG. 7B, that is, in the image IM when the interval between the (+Y) side end surface 5i6y of the pad supporting member 5i6 and the position where the peeling roller 340 abuts on the substrate SB is 0. The position of the pad support member end face 5i6y. Therefore, when the position of the pad supporting member end face 5i6y in the image IM coincides with the reference line Ls, the interval W can be made zero. In the above case, each of the adsorption units 5i can be defined as a movement timing at which the adsorption pad 5i7 starts to descend with the interval W being zero accompanying the movement of the roller unit 34.

More specifically, the timing at which the respective adsorption units 5i are imaged by the imaging unit 347 can be correlated with the position of the roller unit 34 that has moved, by using signals generated periodically with the operation of the apparatus. When the motor 353 that moves the roller unit 34 is, for example, a stepping motor-like pulse motor, the number of driving pulses output from the motor control unit 702 for driving the motor 353 can be used as information indicating the position of the roller unit 34. Since the amount of rotation of the motor is proportional to the number of driving pulses, the count value of the driving pulse from the start of driving becomes the positional information indicating the current position of the roller unit 34. Therefore, when the information on the position of the index roller unit 34 is correlated with the timing at which the image IM of the adsorption unit 5i is photographed is detected, the timing at which the roller unit 34 passes the position directly below the adsorption unit 5i can be individually grasped.

As described above, by knowing the position and the passage timing of the roller unit 34, it is possible to set the movement timing of each adsorption unit 5i which is not required to interfere with the roller unit 34 and which is required to hold the substrate SB without delay after the roller passes. As the position information, various information indicating the position of the roller unit 34 can be used. In addition to the number of motor drive pulses exemplified herein, periodicity such as the time measurement value from the start of driving or the count value of the control clock may be used in association with the movement of the roller unit 34. The measured value of the signal generated by the ground, and the like. Alternatively, the position information may be obtained from an output signal from a detecting mechanism having a function of detecting the position of the roller unit, for example, an output signal of a positioning sensor or a linear encoder, and an image signal from a monitoring camera.

In addition, the basic sequence of operations of each adsorption unit 5i is: (1) the plate member 5i4 descends toward the substrate SB; (2) when the adsorption pad 5i7 abuts against the substrate SB and adsorbs and holds the substrate SB, stops falling; and (3) The plate member 5i4 is raised to a specific position; the sequence itself is not changed depending on the number of the adsorption units or the arrangement position. The start timing of the above (1) is changed depending on the number of placements or the arrangement positions of the adsorption units.

In the present embodiment, the timing at which the plate member 5i4 of each adsorption unit 5i starts to descend is defined by the drive pulse count value of the motor 353. That is, the number of drive pulses of the motor 353 given to the drive roller unit 34 is counted, and when the count value from the start of the drive reaches a predetermined value, the plate member 5i4 of the adsorption unit 5i starts to descend. This predetermined value is individually set for each adsorption unit 5i, and is automatically set based on the image acquired by the imaging unit 347, while the roller unit 34 is actually moving. Therefore, the operator's work load is greatly reduced, and the movement timing of each adsorption unit 5i can be set in the same process regardless of the number or arrangement of the adsorption units 5i.

Fig. 9 is a flow chart showing a method of setting the movement timing of the adsorption unit. 10A and 10B are diagrams illustrating the principle thereof. The setting processing of the movement timing based on this principle is executed by the CPU 701 executing a control program stored in advance to cause each unit of the apparatus to perform a specific operation.

In this processing, first, each part of the apparatus is set to the initial state (step S101). The initial state at this time is a state different from the initial state of the above-described peeling operation. As shown in FIG. 10A, the workpiece is not placed on the stage 30 in the initial state in the process. In addition, each suck The plate member 5i4 of the attachment unit 5i is positioned at a position that is separated upward from the stage 30, and is in a state in which interference does not occur even if the roller unit 34 moves.

Further, the roller unit 34 is positioned in the Z direction at a position where the peeling roller 340 is not in contact with the stage 30, as shown by a broken line in the drawing, and is positioned in the Y direction in the Y direction, that is, (+ The adsorption pad 517 of the first adsorption unit 51 located on the most upstream side in the Y) direction is on the upstream side, that is, the (-Y) side.

The imaging by the imaging unit 347 and the image processing by the image processing unit 706 are started from the initial state as described above (step S102). The image processing performed by the image processing unit 706 analyzes the captured image IM to detect the processing of the pad supporting member end face 5i6y. For example, a well-known edge detection process can be used to detect an edge corresponding to the end face 5i6y of the pad supporting member from the image IM.

Then, by applying a drive pulse to the motor 353, the roller unit 34 starts moving in the (+Y) direction, and counting of the number of pulses is started (steps S103, S104). Thereby, while the pulse counting, the imaging of the imaging unit 347, and the analysis by the image processing unit 706 are continued, the roller unit 34 moves in the (+Y) direction.

When the edge corresponding to the end surface 5i6y of the pad supporting member is detected from the image IM photographed by the imaging unit 347 at any time (YES in step S105), the pulse count value at this time is stored (step S106). If the edge is not detected, step S106 is skipped.

Further, the pulse count value to be obtained is a value when the end surface 5i6y of the pad supporting member coincides with the reference line Ls. However, there may be a case where the position of the pad supporting member end face 5i6y and the reference line detected in the image IM are as shown in FIG. 10B according to the arrangement of the adsorption unit 5i and the timing at which the imaging unit 347 captures an image. Ls is inconsistent. In this case, the difference Δy between the position of the pad supporting member end face 5i6y and the reference line Ls in the Y direction is calculated from the image IM. Since the amount of movement of the roller unit 34 per pulse is known, the pulse count value when the pad supporting member end face 5i6y reaches the reference line Ls can be calculated from the value and the difference Δy. In step S106, the pulse count value thus calculated is memorized.

Until the roller unit 34 reaches the end position on the most (+Y) side of its movable range (YES in step S107), the movement of the roller unit 34 and the edge detection of the image IM are continued. Thus, for each of the adsorption units 51, 52, 53, 54, 55, ..., the pulse count values c1, c2, c3, c4, and c5 when the roller unit 34 passes the position directly below the adsorption unit 5i are obtained. ,... As shown in the figure, when the arrangement of the adsorption unit 5i is not uniform, the measured pulse count value also becomes irregular.

When the roller unit 34 reaches the end position, the movement of the roller unit 34 and the imaging of the imaging unit 347 are stopped (step S108). Then, the operation timing of each of the adsorption units 51, 52, ... is determined based on the pulse count values c1, c2, ... corresponding to the respective adsorption units 51, 52, ... (step S109). Specifically, for each of the adsorption units 5i, a predetermined value of the pulse count value corresponding to when the plate member 5i4 of the adsorption unit 5i starts to descend is determined.

In general, the respective adsorption units 51, 52, ... may start to operate when the pulse count value from the start of the movement of the roller unit 34 is the count values c1, c2, ... stored in advance. However, when there is a time difference of one pulse or more from the start of the falling of the plate member 5i4 to the interference with the roller unit 34, the count value corresponding thereto may be added as a compensation value. Further, an appropriate time difference can be given between the timing at which the pulse is generated and the timing at which the plate member 5i4 starts to fall. The operation timing of each adsorption unit 5i is determined in this manner.

In the peeling operation performed later, the drive pulse for moving the roller unit 34 is counted, and each of the adsorption units 51, 52, ... is sequentially operated each time the count value becomes the above-mentioned predetermined value, so that the plate member 5i4 starts. decline. Thereby, the adsorption pad 5i7 can pass through the substrate SB immediately after leaving the peeling roller 340 and just after leaving the coating layer BL, and hold the substrate SB.

As described above, the present embodiment is a peeling device 1 in which the cladding layer BL which is in close contact with each other to form the workpiece WK and the substrate SB are peeled off. In the peeling device 1, the stage 30 adsorbs and holds the coating layer BL. Further, the plurality of adsorption units 5i arranged in the Y direction are sequentially brought into contact with the substrate SB to be held, and moved in a direction away from the self-coating layer BL. Thereby, peeling between the layer and the coating layer BL Advancing from one end of the substrate SB to the other end. At this time, the peeling roller 340 abuts on the substrate SB while moving at a constant speed in the forward direction of peeling. Thereby, the peeling can be advanced in one direction and at a constant speed, and the peeling can be favorably advanced while preventing the damage of the pattern or the like.

The adsorption unit 5i is required not to interfere with the peeling roller 340 when the peeling roller 340 moves, and to quickly hold the substrate SB after the peeling roller 340 passes. In the present embodiment, the peeling roller 340 actually moves, and in this process, the image pickup unit 347 photographs each of the adsorption units 5i, and grasps the position of each of the adsorption units 5i observed from the peeling roller 340 from the image. Then, based on the result, the timing of the operation of each adsorption unit 5i is determined in association with the position information of the peeling roller 340. Therefore, regardless of the number or configuration of the adsorption unit 5i, the same process can be used to optimize the movement timing of each adsorption unit 5i. As a result, the burden on the operator who performs the adjustment work can be greatly reduced, and the malfunction due to human error can be prevented.

The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the invention. For example, in the above embodiment, in order to associate the movement of the roller unit 34 with the position of each adsorption unit 5i, an imaging unit 347 including a CCD camera having an imaging function is used. However, the mechanism for detecting the position of the adsorption unit 5i is not limited to such a mechanism having an imaging function.

For example, an illuminator may be provided in one of the roller unit 34 and each of the adsorption units 5i, and a photodetector may be provided in the other, and the position of the adsorption unit 5i may be detected from the timing at which the light is received from the illuminator. Further, a configuration may be adopted in which the photointerrupter is used to block (or unblock) the light when the roller unit 34 passes the position directly below the adsorption unit 5i. Further, it is not limited to the detection by such an optical method, and may be, for example, a mechanical detection method using a micro switch or an electromagnetic detection method using a magnetic sensor.

Further, for example, in the movement timing setting process of the above-described embodiment, the movement of the roller unit 34 is started from the position closer to the (-Y) side than the first adsorption unit 51. The reason for this is that, similarly to the other adsorption units, the position of the first adsorption unit 51 is also related to the roller unit. The number of driving pulses of 34 is correlated and memorized. However, the first adsorption unit 51 holds the (-Y)-side end portion of the substrate SB, and its position does not affect the number or arrangement of the adsorption units. Therefore, the position of the first adsorption unit 51 may be known, and the position of each adsorption unit after the second adsorption unit 52 may be grasped by the movement of the roller unit 34. At this time, the transition start position of the roller unit 34 can be set to the position between the first adsorption unit 51 and the second adsorption unit 52 in the Y direction, for example, the same as the initial position of the peeling operation shown in FIG.

Further, for example, in the above-described embodiment, the imaging unit 347 is attached to the upper corner piece 345 of the roller unit 34. However, as described above, the imaging unit 347 is used to determine the movement timing of each adsorption unit 5i before the peeling operation. It does not have a special function in the peeling action. Therefore, as a configuration in which the imaging unit is detachable from the roller unit, the imaging unit can be removed from the roller unit after the movement timing of each adsorption unit 5i is determined. For example, in the case where the number of the adsorption unit 5i or the configured product is not changed after the factory shipment, the device may be shipped in a state where the image pickup unit is removed after the adjustment. Further, in order to monitor the operation of each part in the peeling operation, the imaging unit may be used.

Further, for example, in the above-described embodiment, the carrier 30 is provided with the lattice-shaped adsorption grooves 311 and 312 to adsorb and hold the coating layer BL. However, the shape of the adsorption groove is not limited thereto. For example, an annular adsorption tank may be provided, and an adsorption hole for supplying a negative pressure may be appropriately disposed to adsorb the coating.

Further, in the above-described embodiment, the pressure applied to the substrate SB is lowered by controlling the rise of each of the adsorption units 51 to 5N so that the posture of the substrate SB after peeling is maintained close to the plane, but the pulling of the substrate SB is performed. The aspect is not limited to this. For example, each of the adsorption units may be stopped at a fixed height such that the substrate after peeling is substantially horizontal, or the substrate may be held in a posture that is curved with a specific curvature. These can be freely set by controlling the rise of each adsorption unit.

Further, in the above embodiment, the substrate and the cladding are held by vacuum adsorption. However, the aspect of maintaining is not limited to this. For example, it can also be adsorbed and held by electrostatic or magnetic attraction. In particular, the first adsorption unit 51 that holds the substrate SB first can hold the substrate by mechanically sandwiching the peripheral edge portion of the substrate regardless of the adsorption.

Further, in the above-described embodiment, the coating layer BL is protruded and held by the tapered stage portion 32, and the coating layer 331 is bent by the pressing member 331 to form a peeling action. However, such an operation is not a necessary condition, and for example, peeling may be started only by pulling by the first adsorption unit 51. In this case, it is not necessary to provide a tapered portion on the stage.

As described above, in the present embodiment, the cladding layer BL and the substrate SB correspond to the "first plate-shaped body" and the "second plate-shaped body" of the present invention, respectively, and these are integrated by a pattern or the like. The workpiece WK corresponds to the "closed body" of the present invention. Further, in the present embodiment, the (+Y) direction corresponds to the "peeling direction" of the present invention.

Further, in the above embodiment, the stage 30 functions as the "holding means" of the present invention. Further, each of the plurality of adsorption units 5i functions as a "peeling mechanism" of the present invention. More specifically, the movable portion including the plate member 5i4 and the adsorption pad 5i7 in the adsorption unit 5i corresponds to a "peeling mechanism". Further, the peeling roller 340 functions as the "contact member" of the present invention. Then, the number of drive pulses given to the motor 353 of the drive roller unit 34 corresponds to the "position information" of the present invention. Further, in the above embodiment, the imaging unit 347 functions as the "detection mechanism" and the "imaging mechanism" of the present invention.

As described above, the present invention may be configured such that a detection mechanism that moves integrally with the contact member in the peeling direction and detects the peeling mechanism is provided, and the detection result is based on the detection mechanism. The movement timing of each of the peeling mechanisms is set in correspondence with the position information. By detecting the peeling mechanism by the detecting means that moves integrally with the abutting member, the position of the moving and peeling mechanism of the abutting member can be accurately and accurately grasped.

In this case, for example, the detecting means may be configured to have an imaging function of the photographing and peeling mechanism, and detect the passage and peeling of the abutting member based on the photographed image. The timing of the opposite position of the organization. In such a configuration, the detachment of the other member is prevented by detecting the peeling mechanism photographed in the form of an image.

Further, for example, as for the setting of the movement timing, the contact member may be moved in the peeling direction in a state in which the peeling mechanism is arranged with respect to the holding mechanism that does not hold the contact body, and the peeling mechanism is detected based on the detecting mechanism. And set it up. In the setting of the movement timing of the peeling mechanism of the present invention, it is not necessary to hold the closet to the holding mechanism.

Further, for example, as the position information, various kinds of information obtained by measuring a signal periodically generated in association with the movement of the abutting member can be used. Various periodic signals are generated in the device, and the position of the abutting member can be appropriately indicated by the measured value. For example, the number of driving pulses of the pulse motor that moves the abutting member in the peeling direction can be used as the position information. Since the amount of movement of the abutting member is proportional to the number of driving pulses given to the pulse motor that drives the same, the position of the abutting member can be expressed with high accuracy by using the measured value of the number of driving pulses.

Further, for example, the holding mechanism holds the adhesion body in a horizontal posture in which the second plate-shaped body is on the upper side, and the peeling mechanism may be arranged above the adhesion body. In such an aspect, the peeling advances by pulling the second plate-shaped body upward while holding the first plate-like body in a horizontal posture. This allows the first plate shape to be maintained in the most stable posture, and prevents the first plate-shaped body from following the second plate-shaped body when the second plate-shaped body is separated, and the peeling failure is prevented.

[Industrial availability]

The present invention can be applied not only to a peeling process in a pattern forming process in which a two-plate-like body is adhered to a pattern or the like, but is not limited to a process accompanied by such pattern transfer, and can be suitably applied to direct or Various purposes of good peeling of the two plate-like bodies that are in close contact with each other through a thin layer.

5N‧‧‧Adsorption unit (peeling mechanism)

30‧‧‧Moving station (holding mechanism)

31‧‧‧ horizontal stage

32‧‧‧Conical stage

51‧‧‧Adsorption unit (peeling mechanism)

52‧‧‧Adsorption unit (peeling mechanism)

53‧‧‧Adsorption unit (peeling mechanism)

54‧‧‧Adsorption unit

310‧‧‧ (horizontal stage)

320‧‧‧ (of the cone stage) upper surface

331‧‧‧ Pressing members

340‧‧‧ peeling roller (abutment member)

BL‧‧‧layer (first plate)

SB‧‧‧ substrate (second plate)

WK‧‧‧ workpiece (closed body)

+X‧‧‧ directions

+Y‧‧ Direction

+Z‧‧‧ directions

Claims (12)

A peeling method for peeling off a first plate-shaped body and a second plate-shaped body directly or via a thin layer, and comprising: a disposing step of holding the first plate-shaped body by a holding mechanism And the plurality of peeling mechanisms each having a function of partially contacting the second plate-shaped body and holding the second plate-shaped body are held along the surface of the second plate-shaped body. a direction in which the surface of the second plate-shaped body is spaced apart from the peeling mechanism, and a peeling step, wherein the abutting member abuts against the surface of the second plate-shaped body and the peeling mechanism The gap space moves in the peeling direction, and each of the peeling mechanisms sequentially moves toward the second plate-shaped body in the peeling direction and abuts against the surface of the second plate-shaped body after the abutting member passes. Moving the second plate-shaped body away from the first plate-shaped body while moving the first plate-shaped body while moving away from the first plate-shaped body; and moving the timing of each of the peeling mechanisms Correspondence between the timing of the opposing position of the abutting member obtained by moving the abutting member in the peeling direction in advance and the position information indicating the position of the abutting member in the peeling direction And set. The peeling method of claim 1, wherein a detecting means that moves in the peeling direction integrally with the abutting member and detects the peeling mechanism is provided, and the peeling is set based on a correspondence relationship between the detection result of the detecting means and the position information. The movement timing of each organization. The peeling method of claim 2, wherein the detecting means has an image capturing function for capturing the peeling mechanism, and detects a timing at which the abutting member passes the opposing position with the peeling mechanism based on the captured image. The peeling method of claim 2, wherein the abutting member moves in the peeling direction in a state in which the peeling mechanism is arranged with respect to the holding mechanism that does not hold the contact body, and the detecting means detects the peeling mechanism. The stripping method according to any one of claims 1 to 4, wherein the position information is information obtained by measuring a signal periodically generated accompanying movement of the abutting member. The peeling method of claim 5, wherein the position information is a number of driving pulses of the pulse motor that moves the abutting member in the peeling direction. The peeling method according to any one of claims 1 to 4, wherein, in the disposing step, the holding mechanism holds the close-contact body in a horizontal posture in which the second plate-shaped body is located on an upper side, and the peeling mechanism is arranged in the above Above the dense body. A peeling device comprising: a holding mechanism that holds a first plate-shaped body and a second plate-shaped body in close contact with each other directly or via a thin layer by holding the first plate-shaped body; the abutting member One surface abuts against the surface of the second plate-shaped body of the adhesion body held by the holding mechanism, and moves along a peeling direction parallel to the surface of the second plate-shaped body; a plurality of peeling mechanisms are along The peeling direction is arranged, and each of them has a function of partially contacting the second plate-shaped body and holding the second plate-shaped body, and is capable of abutting on a contact position of the surface of the second plate-shaped body, Moving between a standby position away from the surface of the second plate-shaped body and provided with a gap for the passage of the abutting member; and a control mechanism that controls the movement of the peeling mechanism and the abutting member to perform a peeling action And in the peeling operation, the abutting member abuts on the surface of the second plate-shaped body The gap space of the peeling mechanism moves in the peeling direction, and each of the peeling mechanisms sequentially moves toward the second plate-shaped body in the peeling direction and abuts against the second plate-shaped body after the abutting member passes After the surface, while moving the second plate-shaped body in the direction away from the first plate-shaped body, the second plate-shaped body is separated from the first plate-shaped body, and the movement timing of each of the peeling mechanisms is based on The relationship between the timing of the opposing position of the abutting member obtained by moving the abutting member in the peeling direction and the positional information indicating the position of the abutting member in the peeling direction is set up. The peeling device according to claim 8, comprising a detecting means for detecting the peeling mechanism while moving integrally with the abutting member, wherein the control means sets the peeling based on a correspondence relationship between a detection result of the detecting means and the position information. The movement timing of each organization. The peeling device of claim 9, wherein the detecting mechanism is an image capturing mechanism that photographs the peeling mechanism. The peeling device according to any one of claims 8 to 10, comprising a pulse motor for moving the abutting member in the peeling direction, wherein the position information is a number of driving pulses of the pulse motor. The peeling device according to any one of claims 8 to 10, wherein the holding means holds the adherend in a horizontal posture in which the second plate-like body is positioned on the upper side, and the peeling mechanism is arranged above the close-contact body.