TWI528105B - Detaching apparatus and detaching method - Google Patents

Description

Peeling device and peeling method

The present invention relates to a peeling device and a peeling method in which two sheet-like bodies that are in close contact with each other are separated and separated.

As a technique for forming a specific pattern or film on a plate-like body such as a glass substrate or a semiconductor substrate, a pattern or a film (hereinafter referred to as a "pattern or the like") carried on another plate-like body is transferred to the substrate. In this technique, it is necessary to peel two sheets of the plate-like body and to transfer the pattern or the like from one to the other, and then peel off the two plate-shaped bodies without damaging the pattern or the like.

For example, Japanese Laid-Open Patent Publication No. 2008-287949 discloses an apparatus for peeling a substrate for forming an element and a substrate for transfer which are in close contact with each other. In this technique, the two bonded substrates are held in a horizontal posture by the substrate holding portion, and the upper and lower substrates are moved in the direction of vacuum suction. The upper and lower substrates are respectively adsorbed and held by a plurality of adsorption pads arranged in a dispersed manner.

The apparatus described in Japanese Laid-Open Patent Publication No. 2008-287949 is an adsorption head in which a plurality of adsorption pads are arranged in a row at a predetermined interval in the longitudinal direction of the substrate. Moreover, all the adsorption heads are moved toward the upper surface of the substrate, and the adsorption pads are evacuated in a state where all the adsorption pads are in contact with the upper surface of the substrate, and the upper side is adsorbed by the plurality of adsorption pads. The substrate. Thereafter, the adsorption head of the most upstream side in the peeling advance direction is separated from the substrate holding portion to peel off one of the substrates, and further, the second, third, fourth, and fifth from the most upstream side. The adsorption head is separated from the substrate holding portion in this order to perform substrate peeling. Therefore, there is a case where not only the first substrate peeling, that is, the substrate peeling due to the movement of the adsorption head on the most upstream side occurs, but also when the subsequent adsorption head is separated from the substrate holding portion and the substrate is peeled off, the adsorption is also performed. The local part of the substrate is peeled off between the substrates, and the peeling cannot be promoted under appropriate management. In particular, the adsorption pads of the second, third, and fourth adsorption heads are often in contact with a region in which a pattern or the like is formed, and a strong peeling force is concentrated on the region to cause a pattern or the like. Damage.

The present invention has been made in view of the above problems, and it is an object of the invention to provide a technique in which two sheet-like bodies that are in close contact with each other can be peeled off and separated stably and stably.

An aspect of the present invention is a peeling apparatus characterized in that a first plate-shaped body and a second plate-shaped body which are in close contact with each other are provided, and includes: a holding device that holds the first plate-shaped body; and an upstream side The peeling device has an upstream side adsorption portion that is a portion of the surface of the second plate-shaped body that is opposite to the surface of the second plate-shaped body that is in contact with the surface of the first plate-shaped body, and adsorbs the second adsorption portion on the upstream side adsorption portion. In the plate-like body, the upstream adsorption portion is separated from the holding device, and the adsorbed portion of the second plate-shaped body adsorbed by the upstream adsorption portion is peeled off from the first plate-shaped body, and the second plate is advanced in the peeling and pushing direction. The downstream side peeling device has a downstream side adsorption portion provided on the downstream side surface of the adsorbed portion in the peeling advance direction toward the back surface of the second plate-shaped body, and moves the downstream side adsorption portion to In the second plate-shaped body, the peeling portion peeled off by the upstream side peeling device and the back-adhesive surface of the peeling portion are adsorbed, and then the downstream side adsorbing portion is separated from the holding device in the state of adsorbing the second plate-shaped body, and is pushed toward the peeling. Directional advancement 2 stripping of the plate body; monitoring device for monitoring the relative position of the downstream side adsorption portion with respect to the opposite surface of the second plate body; and control device based on the position relative to the relative position obtained by the monitoring device Information, under the use The adsorption of the second plate-shaped body by the side adsorption unit is started.

Moreover, another aspect of the present invention is a peeling method characterized in that the first plate-shaped body and the second plate-shaped body which are in close contact with each other are separated, and the method includes the following steps: maintaining the step by holding The first sheet-like body is held by the device, and the first peeling step is performed by adsorbing a portion of the surface of the second plate-shaped body opposite to the surface of the second plate-shaped body opposite to the surface of the first plate-shaped body by the upstream side adsorption portion. In other words, the second plate-shaped body is adsorbed, and the upstream adsorption portion is separated from the holding device, and the adsorbed portion of the second plate-shaped body adsorbed by the upstream adsorption portion is peeled off from the first plate-shaped body, thereby promoting the peeling. The step of advancing the peeling of the second plate-shaped body; and the moving step of the downstream side adsorption portion in the peeling-propelling direction on the downstream side of the adsorbed portion, and the upstream-side adsorption portion self-holding device in the second plate-shaped body The anti-adhesion surface of the peeling portion that is separated and peeled off is moved; the monitoring step is performed to move the anti-adhesion surface of the peeling portion, and monitor the relative position of the downstream side adsorption portion with respect to the anti-adhesion surface of the second plate-shaped body; Based on relative position Corresponding position information, the timing of the adsorption of the second plate-shaped body by the downstream side adsorption unit is adjusted, and the second peeling step is started simultaneously with the adsorption of the second plate-shaped body by the downstream side adsorption unit or After the adsorption is started, the downstream adsorption portion is separated from the holding device in a state in which the downstream side adsorption portion adsorbs the anti-adhesion surface of the separation portion, and the second plate-shaped body is peeled off in the peeling direction.

In the above-described configuration, one of the second plate-shaped members (adsorbed portion) is peeled off from the first plate-shaped body, and the second plate-shaped body is peeled off in the peeling direction. Here, as the upstream adsorption portion on which the adsorption site is adsorbed is moved away from the holding device, the second plate-shaped body is peeled off. However, as the upstream adsorption portion is separated from the holding device, the movement of the upstream separation device becomes It is difficult to reflect the progress of the stripping. Therefore, in the present invention, after the peeling portion is adsorbed by the downstream side adsorption portion of the downstream side peeling device on the downstream side in the peeling advancement direction, the downstream side adsorption portion is separated from the holding device, and the peeling in the peeling advancement direction is continued. . Moreover, the retention by the upstream side peeling device cannot suppress the deflection of the peeling portion, but the peeling portion can be held by the downstream side adsorption portion of the downstream side peeling device. Controls the posture of the second plate-shaped body. As described above, according to the present invention, the first plate-shaped body and the second plate-shaped body which are in close contact with each other can be favorably peeled off, and good peeling performance can be exhibited.

Further, the warpage shape of the peeling portion is not fixed, and the adhesion between the first plate-shaped body and the second plate-shaped body or the rigidity of the second plate-shaped body changes. In other words, even if the distance between the upstream side adsorption portions and the holding portion is the same, for example, when the adhesion force is relatively high, the peeling advancement becomes relatively small, and the warpage becomes small. Therefore, the downstream side adsorption portion needs to move relatively long before coming into contact with the peeling portion. On the other hand, when the adhesion is relatively low, contrary to the above, the moving distance of the downstream adsorption portion before the contact with the peeling portion is shortened. As described above, when the downstream side adsorption unit adsorbs the peeling portion of the second plate-shaped body that has been peeled off from the first plate-shaped body by the movement of the upstream adsorption portion, the control is performed by the downstream adsorption unit. The adsorption start timing of the anti-bonding surface of the second plate-shaped body becomes important. In this aspect, the present invention monitors the relative position of the downstream side adsorption portion with respect to the opposite surface of the second plate-shaped body, and the second plate-shaped body by the downstream side adsorption portion based on the positional information on the relative position. The adsorption starts to be controlled. Therefore, regardless of the difference between the adhesion between the first plate-shaped body and the second plate-shaped body or the rigidity of the second plate-shaped body, the downstream adsorption portion can always stably adsorb the second plate-shaped body at an appropriate timing. Stripping treatment.

According to the present invention, the second plate-shaped body is separated from the holding member by the peeling portion of the second plate-shaped body which is peeled off by the upstream side peeling device at an appropriate timing, and the second plate-shaped body is advanced to the second plate shape. The peeling of the body can thereby promote the peeling stably and favorably.

1‧‧‧ peeling device

3‧‧‧ platform block

5‧‧‧Upper adsorption block

11‧‧‧Main frame

30‧‧‧ Platform (holding device)

31‧‧‧Horizontal Platform Division

32‧‧‧Conical Platform Division

33‧‧‧Initial stripping unit

34‧‧‧roll unit

50‧‧‧Support framework

51‧‧‧Adsorption unit (upstream side stripping device)

52‧‧‧Adsorption unit (upstream side stripping device)

53‧‧‧Adsorption unit (downstream side stripping device)

54‧‧‧Adsorption unit (downstream side stripping device)

70‧‧‧Control unit (control device)

310‧‧‧ (top of horizontal platform section 31) upper surface

311‧‧‧Adsorption tank

312‧‧‧Adsorption tank

320‧‧‧ (of the tapered platform portion 32) upper surface

331‧‧‧ Pushing members

332‧‧‧Support arm

333‧‧‧rail

334‧‧‧column components

335‧‧‧ Lifting mechanism

336‧‧‧ base

337‧‧‧Adjustment agency

340‧‧‧ peeling roller

341, 342‧‧‧ slider

343‧‧‧lower corner

344‧‧‧ Lifting mechanism

345‧‧‧ upper corner

346‧‧‧Support roll

351, 352‧ ‧ rail

353‧‧‧Motor

354‧‧‧Rolling screw mechanism

517‧‧‧Adsorption pad

518‧‧‧Negative Pressure Supply Department

521‧‧‧beam components

522, 523‧‧‧ column components

524‧‧‧Board components

525‧‧‧ Lifting mechanism

526‧‧‧pad support members

527‧‧‧Adsorption pad

527‧‧‧Adsorption pad

527a~527y‧‧‧Adsorption pad

527A‧‧‧Adsorption site

527B‧‧‧ bellows

527z1‧‧‧Adsorption pad

527z2‧‧‧Adsorption pad

528‧‧‧Negative Pressure Supply Department

529‧‧‧Connected components

530‧‧‧Laser Displacement Meter (Monitoring Device, Distance Measurement Department)

537‧‧‧Adsorption pad

537‧‧‧Adsorption pad

537z1‧‧‧Adsorption pad

537z2‧‧‧Adsorption pad

538‧‧‧Negative Pressure Supply Department

547‧‧‧Adsorption pad

547‧‧‧Adsorption pad

547z1‧‧‧Adsorption pad

547z2‧‧‧Adsorption pad

548‧‧‧Negative pressure supply department

701‧‧‧CPU (control device)

702‧‧‧Motor Control Department

703‧‧‧Valve Control Department

704‧‧‧ Negative Pressure Generation Department

705‧‧‧User Interface (UI) Department

5181‧‧‧Management

5182‧‧‧Management

5183‧‧‧Management

5184‧‧‧ pressure gauge

5281‧‧‧Management

5282‧‧‧Management

5283‧‧‧Management

5284‧‧‧Management

5285‧‧‧ pressure gauge

5286‧‧‧ Pressure gauge (monitoring device, pressure measurement department)

BL‧‧‧ coating

E‧‧‧ ridge line

PR‧‧‧ peeling site

SB‧‧‧ substrate

SR‧‧‧Adsorbed parts

V3‧‧‧ valve group

V51‧‧‧ control valve (upstream side switching unit)

V52‧‧‧Control valve (downstream side switching unit)

V521‧‧‧Control valve (1st switching part)

V522‧‧‧Control valve (2nd switching part)

WK‧‧‧ workpiece

X‧‧‧ direction

Y‧‧‧ peeling direction

Z‧‧‧ direction

θ‧‧‧An angle formed by the lower surface of the cladding layer BL and the upper surface 320 of the tapered platform portion 32

Fig. 1 is a perspective view showing a first embodiment of the peeling device of the present invention.

Fig. 2 is a perspective view showing the main configuration of the peeling device.

Fig. 3 is a side view showing the structure of the initial peeling unit and the positional relationship of the respective parts.

Fig. 4 is a block diagram showing the electrical configuration of the peeling device.

5A to 5C are diagrams schematically showing the configuration of an adsorption unit.

Fig. 6 is a view schematically showing the positional relationship of each unit in each stage of the process and the negative pressure supply state of the negative pressure supply unit.

Fig. 7 is a view schematically showing the positional relationship of each unit in each stage of the process and the negative pressure supply state of the negative pressure supply unit.

Fig. 8 is a view schematically showing the positional relationship of each unit in each stage of the process and the negative pressure supply state of the negative pressure supply unit.

Fig. 9 is a view schematically showing the positional relationship of each unit in each stage of the process and the negative pressure supply state of the negative pressure supply unit.

Fig. 10 is a view schematically showing the positional relationship of each unit in each stage of the process and the negative pressure supply state of the negative pressure supply unit.

11A to 11C are diagrams schematically showing only the positional relationship of each unit in each stage of the process.

12A to 12D are views showing a second embodiment of the peeling device of the present invention.

13A to 13D are views showing a third embodiment of the peeling device of the present invention.

Fig. 14 is a view schematically showing the positional relationship of each unit in each stage of the process in the third embodiment and the negative pressure supply state of the negative pressure supply unit.

Fig. 15 is a view schematically showing the positional relationship of each unit in each stage of the processing in the third embodiment and the negative pressure supply state of the negative pressure supply unit.

A. First embodiment

Fig. 1 is a perspective view showing a first embodiment of the peeling device of the present invention. In order to uniformly represent the directions of the respective figures, the XYZ orthogonal coordinate axes are set as shown in the lower right of FIG. Here, the XY plane represents a horizontal plane, and the Z axis represents a vertical axis. In more detail, the (+Z) direction indicates the direction of the vertical direction.

The peeling device 1 is for peeling off two sheets that are carried in a state in which the main surfaces are in close contact with each other. Plate-like device. For example, it is used for forming a part of a pattern forming process of a specific pattern on the surface of a substrate such as a glass substrate or a semiconductor substrate. More specifically, the pattern forming process is performed by uniformly applying a pattern forming material to a surface of a coating layer that temporarily transports a carrier to be transferred to a pattern of a substrate to be transferred, (coating step), The surface-processed plate is pressed against the coating layer on the coating layer according to the shape of the pattern, thereby patterning the coating layer (patterning step), and the coating layer formed with the pattern in this manner is adhered to the substrate ( Transfer step) whereby the pattern is ultimately transferred from the cladding to the substrate.

In this case, the apparatus can be preferably applied for the purpose of separating between the substrate and the cladding layer which are in contact with each other in the patterning step, or between the substrate and the cladding layer which are in close contact with each other in the transfer step. Of course, it can be used for both of them, and can also be used for other purposes. For example, it can also be applied to a peeling process when a film carried on a carrier is transferred to a substrate.

The peeling device 1 has a structure in which a platform block 3 and an upper adsorption block 5 are fixed to a main frame 11 attached to a casing. In Fig. 1, in order to show the internal structure of the device, the illustration of the housing is omitted. Further, in addition to the blocks, the peeling device 1 includes a control unit 70 (FIG. 4) which will be described later.

The platform block 3 has a platform 30 for mounting a plate or a substrate and a cover layer (hereinafter referred to as a "workpiece"). The platform 30 includes a horizontal platform portion 31, and the upper surface thereof is substantially horizontal. And a tapered platform portion 32 having a plane having an inclination of the upper surface with respect to the horizontal plane by a few degrees (for example, about 2 degrees). An initial peeling unit 33 is provided on the tapered platform portion 32 side of the stage 30, that is, in the vicinity of the end portion on the (-Y) side. Further, the roller unit 34 is provided so as to straddle the horizontal platform portion 31.

On the other hand, the upper adsorption block 5 includes a support frame 50, the autonomous frame 11 is erected, and is disposed to cover the upper portion of the platform block 3; and the first adsorption unit 51, the second adsorption unit 52, and the third adsorption unit 53 and a fourth adsorption unit 54, which are attached to the support frame 50. The adsorption units 51 to 54 are sequentially arranged in the (+Y) direction.

Fig. 2 is a perspective view showing the main configuration of the peeling device. More specifically, Figure 2 The structure of the stage 30, the roller unit 34, and the second adsorption unit 52 in each configuration of the peeling device 1 is shown. The platform 30 includes a horizontal platform portion 31 having an upper surface 310 that is substantially horizontal; and a tapered platform portion 32 having an upper surface 320 that is tapered. The upper surface 310 of the horizontal platform portion 31 has a planar size that is slightly larger than the planar size of the workpiece being placed.

The tapered platform portion 32 is closely attached to the (-Y)-side end portion of the horizontal platform portion 31, and the portion of the flat upper surface 320 that is in contact with the horizontal platform portion 31 is located in the same manner as the upper surface 310 of the horizontal platform portion 31. The height (Z-direction position), on the other hand, retreats downward, that is, in the (-Z) direction, as moving away from the horizontal platform portion 31 in the (-Y) direction. Therefore, the platform 30 as a whole is continuous with the horizontal surface of the upper surface 310 of the horizontal platform portion 31 and the tapered surface of the upper surface 320 of the tapered platform portion 32, and the connected ridge portion E is linearly extending in the X direction. .

Further, a lattice-shaped groove is formed in the upper surface 310 of the horizontal platform portion 31. More specifically, a lattice-shaped groove 311 is provided in a central portion of the upper surface 310 of the horizontal platform portion 31, and surrounds the region in which the groove 311 is formed, and is formed in a rectangular shape except for the tapered platform portion 32 side. Outline beyond one side In the manner of a font, a groove 312 is provided in a peripheral portion of the upper surface 310 of the horizontal platform portion 31. The grooves 311 and 312 are connected to a negative pressure generating portion 704 (FIG. 4) to be described later via a control valve, and have a suction groove for adsorbing and holding the workpiece placed on the stage 30 by supplying a negative pressure. Features. The two types of grooves 311 and 312 are not connected to the platform, and are connected to the negative pressure generating unit 704 via independent control valves. Therefore, in addition to the adsorption using the two grooves, only one groove can be used. Adsorption. As described above, in the present embodiment, the platform 30 functions as the "holding device" of the present invention.

The roller unit 34 is provided in such a manner as to span the platform 30 constructed as described above. Specifically, the pair of guide rails 351 and 352 are extended in the Y direction along both end portions of the horizontal platform portion 31 in the X direction, and the guide rails 351 and 352 are fixed to the main frame 11 . Further, the roller unit 34 is attached slidably with respect to the guide rails 351 and 352.

The roller unit 34 includes sliders 341 and 342 that are slidably engaged with the guide rails 351 and 352, respectively, and is connected to the upper portion of the platform 30 in such a manner as to connect the sliders 341 and 342. The extension is set at a lower angle 343 in the X direction. At the lower corner 343, the upper corner 345 is lifted and lowered on both sides via a pair of appropriate lifting mechanisms 344. Further, a cylindrical peeling roller 340 extending in the X direction is rotatably attached to the upper corner 345.

When the upper corner 345 is lowered downward by the elevating mechanism 344, that is, in the (-Z) direction, the lower surface of the peeling roller 340 abuts against the upper surface of the workpiece placed on the stage 30. On the other hand, in a state in which the upper corner 345 is positioned at the upper position, that is, the position in the (+Z) direction by the elevating mechanism 344, the peeling roller 340 is separated from the upper surface of the workpiece. At the upper corner 345, a support roller 346 for suppressing the deflection of the peeling roller 340 is rotatably mounted, and a rib for preventing the deflection of the upper corner 345 itself is appropriately provided. The peeling roller 340 and the backup roller 346 do not have a driving source, and these are free to rotate.

The roller unit 34 is movable in the Y direction by the motor 353 attached to the main frame 11. More specifically, the lower corner 343 is coupled to, for example, a ball screw mechanism 354 that is a conversion mechanism that converts the rotational motion of the motor 353 into a linear motion. When the motor 353 rotates, the lower corner 343 is along the guide rails 351 and 352 in the Y direction. Moving, whereby the roller unit 34 moves in the Y direction. The movable range of the peeling roller 340 accompanying the movement of the roller unit 34 is set to the vicinity of the (-Y) side end of the horizontal platform portion 31 in the (-Y) direction, and is set to the horizontal platform in the (+Y) direction. The (+Y) side end portion of the portion 31 is further outward, that is, further advanced toward the (+Y) side.

Next, the configuration of the second adsorption unit 52 will be described. In addition, each of the first to fourth adsorption units 51 to 54 has the same structure, and the structure of the second adsorption unit 52 will be representatively described. The second adsorption unit 52 has a beam member 521 extending in the X direction and fixed to the support frame 50, and the pair of column members 522 and 523 extending vertically downward, that is, in the (-Z) direction are positioned in the X direction. It is attached to the beam member 521 differently. The column members 522 and 523 are attached to the plate member 524 so as to be lifted and lowered by a guide rail hidden in the drawing. The plate member 524 is driven up and down by a lifting mechanism 525 including a motor and a switching mechanism (for example, a ball screw mechanism).

A rod-shaped pad supporting member extending in the X direction is attached to the lower portion of the plate member 524 526, a plurality of adsorption pads 527 are arranged at equal intervals in the X direction on the lower surface of the pad supporting member 526. 2 shows a state in which the second adsorption unit 52 is moved to a position higher than the actual position. However, when the plate member 524 is moved downward by the elevating mechanism 525, the adsorption pad 527 can be lowered to an extremely close to the horizontal platform. The position of the upper surface 310 of the portion 31 is in contact with the upper surface of the workpiece in a state where the workpiece is placed on the stage 30. Each of the adsorption pads 527 is given a negative pressure from the negative pressure generating portion 704 (FIG. 4) via the negative pressure supply portion 528 (FIGS. 5A, 5C) which will be described later, and the upper surface of the workpiece is adsorbed and held.

Fig. 3 is a side view showing the structure of the initial peeling unit and the positional relationship of the respective parts. First, the structure of the initial peeling unit 33 will be described with reference to Figs. 1 and 3 . The initial peeling unit 33 has a rod-shaped pressing member 331 extending in the X direction above the tapered platform portion 32, and the pressing member 331 is supported by the support arm 332. The support arm 332 is attached to the column member 334 so as to be movable up and down via a guide rail 333 extending in the vertical direction, and the support arm 332 is moved up and down with respect to the column member 334 by the action of the elevating mechanism 335. The column member 334 is supported by the base portion 336 attached to the main frame 11, but the position of the column member 334 on the base portion 336 in the Y direction can be adjusted within a specific range by the position adjustment mechanism 337.

The workpiece WK as a object to be peeled off is placed on the stage 30 composed of the horizontal land portion 31 and the tapered land portion 32. In the above-mentioned patterning step, the workpiece-based plate and the coating layer are in close contact with each other by the film of the pattern forming material. On the other hand, in the transfer step, the workpiece-based substrate and the cladding layer are in close contact with each other via the patterned pattern. In the following, the peeling operation of the peeling device 1 when the bonded body of the substrate SB and the coating layer BL in the transfer step is the workpiece WK will be described. However, the bonded body of the plate and the coating layer is used as the workpiece. In the case, the peeling can also be carried out by the same method.

In the case of the workpiece WK, it is assumed that the cladding layer BL has a larger planar size than the substrate SB. The substrate SB is in close contact with a substantially central portion of the cladding layer BL. The workpiece WK is placed below the cladding layer BL, and the substrate SB is placed above the substrate 30. At this point, as shown in Figure 3. The workpiece WK is placed on the platform 30 in such a manner that the (-Y) side end portion of the substrate SB in the workpiece WK is substantially above the ridge line portion E at the boundary between the horizontal platform portion 31 and the tapered platform portion 32, and Specifically, it is a position slightly shifted toward the (-Y) side of the ridge portion E. Therefore, the cladding layer BL on the outer side of the substrate SB in the (-Y) direction is disposed to protrude above the tapered land portion 32, and the lower surface of the cladding layer BL and the tapered land portion 32 are above. A gap is created between the surfaces 320. The angle θ between the lower surface of the cladding layer BL and the upper surface 320 of the tapered land portion 32 is about the same as the taper angle of the tapered land portion 32 (2 degrees in this embodiment).

The horizontal platform portion 31 is provided with adsorption grooves 311 and 312 for adsorbing and holding the lower surface of the cladding layer BL. The adsorption groove 311 adsorbs the lower surface of the cladding layer BL that is in contact with the lower portion of the substrate SB. On the other hand, the adsorption groove 312 adsorbs the lower surface of the cladding layer BL outside the substrate SB. The adsorption grooves 311 and 312 can be opened independently of each other. ‧ The adsorption is closed, so that the two types of adsorption grooves 311 and 312 can be used together to strongly adsorb the coating layer BL. On the other hand, by using only the outer adsorption groove 312 for adsorption, the central portion of the coating layer BL in which the pattern is effectively formed is not adsorbed, and the deflection of the coating layer BL due to adsorption can be prevented. Damage caused by the pattern. As described above, by independently controlling the supply of the negative pressure to the adsorption grooves 311 at the center portion and the adsorption grooves 312 at the peripheral portion, the adsorption and holding of the coating layer BL can be switched depending on the purpose.

The first to fourth adsorption units 51 to 54 and the separation roller 340 of the roller unit 34 are disposed above the workpiece WK held by the stage 30 in this manner. As described above, a plurality of adsorption pads 527 are arranged in parallel in the X direction in the lower portion of the second adsorption unit 52. More specifically, the adsorption pad 527 has an adsorption site 527A integrally formed of a material having flexibility and elasticity such as rubber or enamel resin, and the lower surface abuts on the upper surface of the workpiece WK (more specifically, The workpiece WK is adsorbed on the upper surface of the substrate SB; and the bellows portion 527B has a stretchability in the up-down direction (Z direction). The adsorption pads disposed on the other adsorption units 51, 53 and 54 are also of the same construction, but the following are provided by the suction The adsorption pads of the units 51, 53 and 54 are denoted by reference numerals 517, 537 and 547, respectively, to distinguish each other.

The first adsorption unit 51 is provided above the (-Y) side end portion of the horizontal platform portion 31, and adsorbs the upper surface of the (-Y) side end portion of the substrate SB when descending. On the other hand, the fourth adsorption unit 54 is disposed above the (+Y) side end portion of the substrate SB placed on the stage 30, and adsorbs the upper surface of the (+Y) side end portion of the substrate SB when descending. The second adsorption unit 52 and the third adsorption unit 53 are appropriately dispersed and disposed therebetween. For example, the adsorption pads 517 to 547 may be substantially equally spaced in the Y direction. The movement in the up and down direction and the opening and closing of the adsorption can be performed independently of each other between the adsorption units 51 to 54. Further, the configuration and operation for controlling the supply of the negative pressure in each of the adsorption units 51 to 54 will be described in detail later.

The peeling roller 340 is moved in the up-down direction to move away from the substrate SB, and moves horizontally along the substrate SB by moving in the Y direction. In a state in which the peeling roller 340 is lowered, it is horizontally moved while abutting against the upper surface of the substrate SB and rotating. The position of the peeling roller 340 when moving to the most (-Y) side is the position of the first adsorption unit 51 closest to the (+Y) side of the adsorption pad 517. In order to realize the arrangement to such an approach position, the first adsorption unit 51 is the same as the second adsorption unit 52 shown in FIG. 2, and as shown in FIG. 1 and other second to fourth adsorption units. 52 to 54 are mounted in the support frame 50 in opposite directions.

The initial peeling unit 33 adjusts its Y-direction position in such a manner that the pressing member 331 is positioned above the cladding layer BL that protrudes above the tapered land portion 32. Further, by the lowering of the support arm 332, the lower end of the pressing member 331 is lowered to push the upper surface of the cladding layer BL. At this time, the front end of the pressing member 331 is formed of an elastic member so that the pressing member 331 does not scratch the coating layer BL.

Fig. 4 is a block diagram showing the electrical configuration of the peeling device. Each unit of the apparatus is controlled by a control unit 70 corresponding to an example of the "control device" of the present invention. The control unit 70 includes a CPU (Central Processing Unit) 701, which manages the device The overall operation; the motor control unit 702 controls the motors provided in the respective units; the valve control unit 703 controls the valves provided in the respective units; the negative pressure generating unit 704 generates the negative pressure supplied to the respective units; and the user A interface (UI) portion 705 for receiving an operation input from a user or reporting the status of the device to the user. Furthermore, the control unit 70 may not include the negative pressure generating portion when the negative pressure supplied from the outside such as the factory power transmission line can be utilized.

The motor control unit 702 drives and controls the motor group 353 provided in the platform block 3, and the motor group provided in the elevating mechanisms 335 and 344 and the elevating mechanism 525 of each of the adsorption units 51 to 54 of the upper adsorption block 5, respectively. The valve control unit 703 controls the valve group V3 and the valve groups V51, V521, V522 and the like, and the valve group V3 is provided on the piping path connecting the negative pressure generating unit 704 and the adsorption grooves 311 and 312 provided in the horizontal platform unit 31. The valve groups V51, V521, and V522 are provided in the negative pressure supply unit connected to the adsorption pads 517 to 547 from the negative pressure generating unit 704, and are used to individually supply a specific negative pressure to the adsorption tanks. A specific negative pressure is supplied to each of the adsorption pads 517 to 547.

5A to 5C are diagrams schematically showing the configuration of an adsorption unit. In the present embodiment, each of the adsorption units 51 to 54 has 25 adsorption pads. Further, negative suction supply units 518, 528, 538, and 548 are provided in the adsorption units 51 to 54, respectively, and the supply of the negative pressure to the adsorption pad and the supply stop can be switched. In the present embodiment, the adsorption unit 51 is a mechanism that advances the peeling direction, that is, the direction in which the peeling is advanced (+Y) is located on the most upstream side, and the upstream end of the adsorption plate or the substrate is First, the coating layer BL is peeled off, and each of the other adsorption units 52 to 54 adsorbs a peeling portion peeled off by the upstream adsorption unit of the adsorption unit to further promote the peeling. As described above, since the functions of the adsorption unit are different, in the present embodiment, the configuration of the negative pressure supply unit differs by the adsorption unit 51 and the adsorption units 52 to 54.

The adsorption unit 51 has 25 adsorption pads 517 arranged in the X direction, as shown in FIG. 5B, and is divided into 8 adsorption pads, 9 adsorption pads, and 8 adsorption pads from the (-X) direction side (+X) direction side. The three adsorption pad groups are connected to the negative pressure generating portion 704 via the negative pressure supply portion 518. The negative pressure supply The donor portion 518 has three manifolds 5181 to 5183, and the manifold 5181 is connected to eight adsorption pads 517 constituting the adsorption pad group on the (-X) side, and the manifold 5182 is connected to the group of adsorption pads constituting the center. The adsorption pads 517 are connected, and the manifold 5183 is connected to the eight adsorption pads 517 constituting the adsorption pad group on the (+X) side. Further, the number of the adsorption pads 517, the grouping of the groups, and the like are arbitrary.

Each of the manifolds 5181 to 5183 is connected to the negative pressure generating portion 704 via a control valve V51. Therefore, when the control valve V51 is opened in response to the opening command from the valve control unit 703 of the control unit 70, the suction pad 517 is given a negative pressure via the manifolds 5181 to 5183. Conversely, the control valve V51 is closed in accordance with the closing command from the valve control unit 703, whereby the supply of the negative pressure to the adsorption pad 517 is stopped. As described above, in the present embodiment, the control valve V51 functions as a switching unit that switches the supply of the negative pressure to the adsorption pad 517 and the supply of the negative pressure, and corresponds to an example of the "upstream switching unit" of the present invention. Further, by controlling the valve V51, all of the adsorption pads 517 can be simultaneously supplied with a negative pressure, and at the same time, the negative pressure supply can be stopped at the same time. Further, reference numeral 5184 in Fig. 5B is a pressure gauge for measuring the pressure in each adsorption pad 517.

Similarly to the adsorption unit 51, the adsorption units 52 to 54 also have 25 adsorption pads arranged in the X direction, and the negative pressure supply and the negative pressure supply to the adsorption pad can be independently switched by the negative pressure supply units 528, 538, and 548, respectively. The pressure supply stops. The negative pressure supply units 528, 538, and 548 have the same configuration. Therefore, the configuration of the negative pressure supply unit 528 will be described below, and the remaining negative pressure supply units 538 and 548 are denoted by the same reference numerals, and the description thereof will be omitted.

In the adsorption unit 52, 25 adsorption pads 527 are arranged in the X direction. Furthermore, in the case where the 25 adsorption pads 527 are described separately from each other, the present specification refers to the adsorption pads 527 arranged from the most (-X) side to the (+X) side, respectively, as adsorption pads 527a to 527y, respectively. In the case of the case, it is simply referred to as "adsorption pad 527".

The adsorption pad 527 is divided into one adsorption pad, seven adsorption pads, four adsorption pads, one adsorption pad, four adsorption pads, and seven adsorption holes from the (-X) direction side (+X) direction side. Adsorption pad, 1 suction The seven adsorption pad groups attached to the pad, and the N-th (N=1, 2, 3, 4, 5, 6, and 7) adsorption pad groups from the (-X) side are respectively configured as follows. That is, the following composition is distinguished: the first adsorption pad group: adsorption pad 527a; the second adsorption pad group: adsorption pad 527b to 527h; the third adsorption pad group: adsorption pad 527i to 527l; the fourth Adsorption pad group: adsorption pad 527m; 5th adsorption pad group: adsorption pad 527n~527q; 6th adsorption pad group: adsorption pad 527r~527x; 7th adsorption pad group: adsorption pad 527y.

The second, third, fifth, and sixth adsorption pad groups in the group of adsorption pads comprise a plurality of adsorption pads 527 as described above. Therefore, the negative pressure supply unit 528 has four manifolds 5281 to 5284 corresponding thereto. The manifolds 5281 of the manifolds 5281 to 5284 are connected to the adsorption pads 527b to 527h constituting the second adsorption pad group, and the manifold 5282 is connected to the adsorption pads 527i to 527l constituting the third adsorption pad group. The manifold 5283 is connected to the adsorption pads 527n to 527q constituting the fifth adsorption pad group, and the manifold 5284 is connected to the adsorption pads 527r to 527x constituting the sixth adsorption pad group.

Each of the manifolds 5281 to 5284 is connected to the negative pressure generating portion 704 via a control valve V521. Therefore, when the control valve V521 is opened according to the opening command from the valve control unit 703 of the control unit 70, the adsorption pads 527b to 527h, 527i to 527l, 527n to 527q, and 527r to 527x are given negative via the manifolds 5281 to 5284. Pressure. On the contrary, the control valve V521 is closed in response to the closing command from the valve control unit 703, whereby the supply of the negative pressure to the adsorption pads 527b to 527h, 527i to 527l, 527n to 527q, and 527r to 527x is stopped. As described above, in the present embodiment, the control valve V521 functions as a switching unit that switches between the negative pressure supply to the adsorption pads 527b to 527h, 527i to 527l, 527n to 527q, and 527r to 527x, and the negative pressure supply stop. Negative pressure is supplied to the adsorption pads 527b to 527h, 527i to 527l, 527n to 527q, and 527r to 527x, and the negative pressure supply can be stopped at the same time. Again, the picture The symbol 5285 is a pressure gauge for measuring the pressure of each of the adsorption pads 527b~527h, 527i~527l, 527n~527q, and 527r~527x.

On the other hand, since the remaining adsorption pad groups each include a single adsorption pad 527a, 527m, and 527y, the manifold is not provided, and the adsorption pads 527a, 527m, and 527y are connected to the negative pressure generating portion 704 via the control valve V522. Therefore, when the control valve V522 is opened in response to an opening command from the valve control unit 703 of the control unit 70, a negative pressure is applied to the adsorption pads 527a, 527m, and 527x. On the contrary, the control valve V522 is closed in accordance with the closing command from the valve control unit 703, whereby the supply of the negative pressure to the adsorption pads 527a, 527m, and 527x is stopped. As described above, in the present embodiment, the control valve V522 functions as a switching unit that switches the supply of the negative pressure to the adsorption pads 527a, 527m, and 527x and the supply of the negative pressure, and simultaneously supplies the adsorption pads 527a, 527m, and 527x. Negative pressure, in turn, can stop the supply of negative pressure at the same time. Further, reference numeral 5286 in the drawing is a pressure gauge for measuring the pressure of each of the adsorption pads 527a, 527m, and 527x, and corresponds to an example of the "monitoring device" and the "pressure measuring portion" of the present invention.

Next, an operation of the peeling apparatus configured as described above will be described with reference to Figs. 6 to 11A, 11B, and 11C. 6 to 10 are diagrams schematically showing the positional relationship of each unit in each stage of the process and the negative pressure supply state of the negative pressure supply unit. 11A to 11C are diagrams schematically showing only the positional relationship of each unit in each stage of the process. This stripping process is performed by executing the processing program previously stored by the CPU 701 to control the completion of each unit. In the case where the adherend of the substrate SB and the cladding layer BL is used as the workpiece WK as described above, the peeling operation of the peeling device 1 will be described.

First, when the workpiece WK is loaded to the position on the stage 30 by the operator or the external transfer robot or the like, that is, the holding step is performed, the apparatus is initialized and the respective units are set to a specific initial state. In the initial state, the workpiece WK is adsorbed and held by one or both of the adsorption grooves 311, 312, so that the pressing member 331 of the initial peeling unit 33, the peeling roller 340 of the roller unit 34, and the first to fourth The adsorption pads 517 to 547 of the adsorption units 51 to 54 are all separated from the workpiece WK, and no negative pressure is supplied to any of the adsorption pads 517 to 547. also, The peeling roller 340 is in the movable range and is located closest to the (-Y) side.

As shown in Fig. 6, the first adsorption unit 51 and the peeling roller 340 are lowered from this state. During this movement, the control valve V51 maintains the state in which the supply of the negative pressure is stopped. Further, if only the distance set in advance by the thickness of the workpiece WK is lowered, as shown in FIG. 7, the adsorption pads 517 of the first adsorption unit 51 are respectively brought into contact with the upper surface of the workpiece WK. Then, the control valve V51 is opened by the command from the valve control unit 703, and the negative pressure is applied from the negative pressure generating unit 704 to the adsorption pad 517 of the first adsorption unit 51 via the manifolds 5181 to 5183. Thereby, the (-Y) side end portion of the upper surface of the substrate SB, that is, the opposite side of the opposite surface to the surface of the cladding layer BL is adsorbed and held by the adsorption pad 517. The portion adsorbed by the adsorption pad 517 as described above corresponds to an example of the "adsorbed portion" of the present invention. Further, the peeling roller 340 abuts on the upper surface of the substrate SB at the (+Y) side adjacent position. Further, the hatching of the column (a) in Fig. 7 indicates that the adsorption pad is subjected to the negative pressure supply, and the downward arrow indicated in the vicinity of the pressing member 331 in the column (b) of Fig. 7 means In the step of continuing from the state shown in the figure, the pressing member 331 is moved in the direction of the arrow. For these aspects, the same is true in the following figures.

Here, the contact area where the peeling roller 340 abuts is a position where the effective area of the device is more effectively transferred, and the effective area which functions as a device is further outside, that is, the position closer to the (-Y) side from the effective area. Therefore, the inside of the effective region is not affected by the adsorption by the first adsorption unit 51 or the pressing of the peeling roller 340.

Next, the initial peeling unit 33 is actuated to lower the pressing member 331 and press the end portion of the coating layer BL. The end of the cladding layer BL protrudes above the tapered land portion 32, and there is a gap between the lower surface of the cladding layer BL and the upper surface 320 of the tapered land portion 32. Therefore, the pressing member 331 pushes the end portion of the coating layer BL downward, whereby the end portion of the coating layer BL is bent downward along the tapered surface of the tapered land portion 32. As a result, the end portion of the substrate SB adsorbed and held by the first adsorption unit 51 is separated from the coating layer BL to start peeling. The pressing member 331 is formed in a rod shape extending in the X direction, and its length in the X direction is set to be longer than the coating layer BL. Therefore, the abutting region of the pressing member 331 abutting on the covering layer BL is self-contained. The (-X) side end portion of the cladding layer BL extends linearly from the (+X) side end portion. Thereby, the coating layer BL can be bent into a cylindrical shape, and the boundary between the peeled region where the substrate SB and the coating layer BL have been peeled off and the unpeeled region which has not been peeled off can be formed (hereinafter referred to as "peeling junction" Line") is set to be linear.

From this state, the first adsorption unit 51 is raised, and in synchronization with this, the peeling roller 340 is moved in the (+Y) direction. Specifically, the movement of the peeling roller 340 is started at the timing when the peeling boundary line moving in the (+Y) direction by the rise of the first adsorption unit 51 reaches the immediately below the peeling roller 340. Thereby, the abutment area moves in the (+Y) direction. Thereafter, the first adsorption unit 51 moves upward at a fixed speed, that is, in the (+Z) direction, and the peeling roller 340 moves in the (+Y) direction at a fixed speed.

Further, as shown in FIG. 8, the first adsorption unit 51 holding the end portion of the substrate SB is raised, thereby pulling away the peeling direction of the coated portion BL by the adsorbed portion SR of the substrate SB adsorbed by the adsorption pad 517 ( The +Y) direction is advanced, but since the peeling roller 340 is abutted, there is no case where the contact area of the peeling roller 340 is exceeded and the peeling is promoted. The peeling roller 340 is moved in the (+Y) direction at a fixed speed while abutting against the substrate SB, whereby the peeling advance speed can be fixedly maintained. In other words, the peeling boundary line is a straight line along the direction in which the roller extends, that is, the X direction, and is advanced in the (+Y) direction at a constant speed. Thereby, it is possible to surely prevent the damage of the pattern due to the stress concentration caused by the variation in the pushing speed of the peeling.

Further, the peeling roller 340 is waited for the second adsorption position. The second adsorption position is a position immediately below the second adsorption unit 52 on the upper surface of the substrate SB, and is a position at which the adsorption of the second adsorption unit 52 is received. When the peeling roller 340 passes through the second adsorption position, the lowering of the second adsorption unit 52 is started as shown in FIG. In other words, in the peeling advancement direction (+Y) of the peeling advancement, the first adsorption unit 51 that is located on the upstream side of the second adsorption unit 52 rises, and the adsorption pad 527 is peeled off from the coating layer BL (substrate). The portion of the SB located between the first adsorption unit 51 and the peeling roller 340) moves (moving step).

Further, in accordance with the instruction from the valve control unit 703, the second adsorption unit 52 is lowered. Only the control valve V522 is opened, and the negative pressure generating unit 704 supplies a negative pressure to the three adsorption pads 527a, 527m, and 527y. Further, the negative pressure supply system of the 22 adsorption pads 527b to 527l and 527n to 527x other than the three adsorption pads 527a, 527m, and 527y is still in a stopped state. In other words, the second adsorption unit 52 is lowered while sucking on the (-X) side, the center, and the (+X) side in the X direction. At the time point when the lower surface of the adsorption pad 527 composed of the elastic member having elasticity is abutted against the peeling portion PR of the substrate SB, the adsorption substrate SB is caught, and the pressure value measured by the pressure gauge 5286 is largely changed. Therefore, by monitoring the pressure value output from the pressure gauge 5286, that is, by performing the monitoring step, it is possible to accurately detect that the second adsorption unit 52 is lowered until the adsorption pad 527 can adsorb the position of the peeling portion PR.

Here, since only the peeling site PR of the substrate SB is adsorbed by the adsorption pad 527, it is also possible to provide a negative pressure to all the adsorption pads 527 during the lowering of the second adsorption unit 52. However, during the period of the contact with the substrate SB, there is a possibility that the adsorption pad 527 sucks the atmosphere, applies a large load to the negative pressure generating portion 704, and the negative pressure generating portion 704 gives the first adsorption unit 51. The value of the negative pressure changes, and the substrate SB held by the adsorption pad 517 is kept offset. On the other hand, in order to detect the contact of the adsorption pad 527 with the peeling portion PR, the number of the adsorption pads 527 to which the negative pressure is applied during the lowering of the second adsorption unit 52 is largely limited, whereby the above problem can be greatly reduced. And the above abutment detection is performed accurately. In view of this, in the present embodiment, the three adsorption pads 527a, 527m, and 527y not only function as the adsorption substrate SB but also function to confirm the contact of the substrate SB with the separation portion PR. The abutment confirms that the adsorption unit functions as a separate unit. On the other hand, the other adsorption pads 527b to 527l and 527n to 527x function as a dedicated adsorption portion for holding and holding the peeling portion PR. In the present embodiment, the three adsorption pads 527a, 527m, and 527y are used as the contact confirmation. However, the number or arrangement position of the adsorption pads used as the contact confirmation and adsorption unit is arbitrary and is not limited. However, from the viewpoint of suppressing the variation of the negative pressure value, it is preferable to set it to at least a smaller number than the dedicated adsorption portion.

When the suction pad 527 is detected to be in contact with the peeling portion PR of the substrate SB by the monitoring of the pressure value, as shown in FIG. 10, the control valve V521 is opened in accordance with an instruction from the valve control unit 703, and the negative pressure generating portion 704 is also applied. Negative pressure is supplied to the remaining 22 adsorption pads 527b to 527l and 527n to 527x. Thereby, the peeling site PR of the holding substrate SB is sucked by all of the 25 adsorption pads 527. Further, it is also possible to wait for the substrate SB to be pulled up after all the adsorption pads 527 have been lowered to a specific position. In either case, the failure of adsorption can be prevented by making the adsorption pad 527 flexible. This aspect is also the same in the following embodiments.

After the adsorption of the substrate SB is started, the movement of the second adsorption unit 52 is changed to increase. Thereby, the advancement speed of the peeling is still controlled by the peeling roller 340, and the main system for pulling up the peeled substrate SB is taken from the first adsorption unit 51 to the second adsorption unit 52. Moreover, the substrate SB after peeling is switched from being held by the first adsorption unit 51 to being held by the first adsorption unit 51 and the second adsorption unit 52, and the holding portion is increased. Further, as shown in FIG. 11A, when the respective adsorption units 51 to 54 are raised, the relative position in the Z direction between the respective adsorption units 51 to 54 is maintained so that the posture of the substrate SB after peeling is substantially flat.

Then, when the peeling roller 340 passes through the third adsorption position immediately below the third adsorption unit 53, the third adsorption unit 53 is lowered, and the main body of the substrate SB for peeling is pulled from the second adsorption unit 52. The third adsorption unit 53 moves. The lowering, the adsorption holding, and the substrate pulling system of the third adsorption unit 53 are performed in the same manner as the lowering of the second adsorption unit, the adsorption holding, and the substrate pulling. Further, after the peeling roller 340 passes through the fourth adsorption position, the fourth adsorption unit 54 is lowered to pull up the substrate SB. At this time, the same operation as the lowering, the adsorption holding, and the substrate pulling of the second adsorption unit 52 is also performed.

In this manner, the substrate SB is pulled by the fourth adsorption unit 54, whereby the entire substrate SB is pulled from the cladding layer BL as shown in FIG. 11B. Therefore, after the fourth adsorption unit 54 is raised, the separation roller 340 is moved to the (+Y) side of the platform 30 to stop the movement. Next, as shown in FIG. 11C, the adsorption units 51 to 54 are all raised to the same height and then stopped. Further, the pressing member 331 of the initial peeling unit 33 is moved away from the cladding layer BL, and moved to a position higher than the upper surface of the cladding layer BL and closer to the (-Y) side end portion of the cladding layer BL (- Y) The back position of the side. Thereafter, the adsorption holding of the coating layer BL by the adsorption tank is released, and the separated substrate SB and the coating layer BL are carried out outside the apparatus, whereby the peeling process is completed.

The reason why the heights of the respective adsorption units 51 to 54 are the same is that the substrate SB and the cladding layer BL after the separation are held in parallel, so that the insertion by the external robot or the operator is carried out by hand. It is easy to take and transfer the cladding layer BL and the substrate SB to the hand.

As described above, according to the present embodiment, the peeling progress of the substrate SB in the peeling advancement direction (the +Y direction in the present embodiment) is carried out, and the peeling portion PR of the substrate SB is held by the downstream suction pad to further promote the peeling. For example, during the period in which the (-Y) side end portion of the substrate SB is held by the adsorption pad 517 of the first adsorption unit 51 while being peeled off, the second adsorption unit 52 located on the downstream side of the adsorption pad 517 is adsorbed. After the pad 527 holds the peeling portion PR of the substrate SB, the peeling is further promoted. In the peeling stage, the first adsorption unit 51 and the adsorption pad 517 function as the "upstream side separation device" and the "upstream side adsorption unit" of the present invention, respectively, and the second adsorption unit 52 and the adsorption pad 527 are used. Each of the functions is a "downstream side peeling device" and a "downstream side adsorption unit" of the present invention.

In addition, after the peeling is performed on the adsorbed portion SR (see FIG. 11A) of the substrate SB by the adsorption pad 527 of the second adsorption unit 52, the peeling is performed on the downstream side of the adsorption pad 527. After the adsorption pad 537 of the third adsorption unit 53 holds the peeling portion PR of the substrate SB, the peeling is further promoted. In the peeling stage, the second adsorption unit 52 and the adsorption pad 527 function as the "upstream side separation device" and the "upstream side adsorption unit" of the present invention, respectively, and the third adsorption unit 53 and the adsorption pad 537 are used. Each of the "downstream side peeling device" and the "downstream side adsorption unit" of the present invention performs work. can.

In addition, after the peeling is performed on the adsorbed portion SR (see FIG. 11B) of the substrate SB by the adsorption pad 537 of the third adsorption unit 53, the peeling is performed on the downstream side of the adsorption pad 537. After the adsorption pad 547 of the fourth adsorption unit 54 holds the peeling portion PR of the substrate SB, the peeling is further promoted. In the peeling stage, the third adsorption unit 53 and the adsorption pad 537 function as the "upstream side separation device" and the "upstream side adsorption unit" of the present invention, respectively, and the fourth adsorption unit 54 and the adsorption pad 547 are used. Each of the functions is a "downstream side peeling device" and a "downstream side adsorption unit" of the present invention.

As described above, the holding portion of the substrate SB is sequentially changed in accordance with the advancement of the peeling, whereby the holding of the substrate SB can be surely achieved, and the posture of the substrate SB after peeling can be easily maintained. Further, since the peeling can be promoted while imparting a stable peeling force as described above, the pattern is also prevented from being damaged. Further, by arranging the adsorption unit in accordance with the size of the substrate SB, it is also possible to flexibly correspond to the enlargement of the substrate SB.

Further, the peeling portion PR is a region which has been peeled off from the coating layer BL, and the second to fourth adsorption units 52 to 54 which re-adsorb the substrate SB during the peeling progress are in contact with the peeling portion PR, so there is no such In the case of the case, the pattern transferred to the substrate SB is scratched by adsorption.

In addition, the peeling roller 340 extending in the X direction orthogonal to the peeling advance direction Y is brought into contact with the substrate SB, and the peeling roller 340 is moved at a fixed speed in the direction in which the peeling is pushed, and the substrate SB is pulled. Therefore, the peeling advancement speed can be kept constant and the between the substrate SB and the cladding layer BL can be peeled off favorably.

Further, the second to fourth adsorption units 52 to 54 monitor the pressure in the adsorption pad functioning as the contact confirmation confirmation adsorption unit by the pressure gauge, and the signal indicating the pressure value is used as the adsorption pad relative to the substrate SB. The position information of the relative position of the anti-closed surface is output to the control unit 70. Moreover, the control unit 70 is based on the pressure in the drop based on the adsorption unit When the change in the force value is detected and the contact of the adsorption pad against the substrate SB is detected, the supply of the negative pressure to the adsorption pad functioning as the dedicated adsorption portion is started. Therefore, the following effects are obtained.

As described above, the adsorption pad is moved from the horizontal land portion 31 to the (+Z) direction in a state in which one portion (the adsorbed portion SR) of the substrate SB is held by the adsorption pad functioning as the upstream adsorption portion. When the peeling is advanced, the warpage of the substrate SB cannot be avoided. Further, the amount of warpage differs depending on the adhesion between the substrate SB and the cladding layer BL, the rigidity of the substrate SB, and the like. Therefore, the position in the Z direction in which the adsorption pad functioning as the downstream side adsorption portion abuts on the separation portion PR of the substrate SB is not fixed, and is displaced according to conditions such as the adhesion force. Therefore, in the present embodiment, as described above, the pressure value in the lowering of the adsorption unit, that is, the monitoring step is monitored, and the abutment of the adsorption pad to the peeling portion PR is accurately detected based on the change in the pressure value. Then, the abutment detection is used as a trigger to start supply of negative pressure to the adsorption pad dedicated for holding (adjustment step). As a result, the adsorption pad corresponding to the downstream side adsorption unit can stably perform the peeling treatment by adsorbing the peeled portion of the substrate SB at an appropriate timing. Further, since the adsorption pad used for pressure monitoring is limited to a few (three of the 25 in the present embodiment), the pressure in the adsorption pad of the adsorbed substrate SB can be prevented from being greatly lowered, so that the adsorption can be stably performed. Stripping treatment.

B. Second embodiment

12A to 12D are views showing a second embodiment of the peeling device of the present invention. In the second embodiment, the adsorption pad that functions as the contact confirmation and the adsorption unit is provided on the downstream side of the adsorption pad that functions as the retention-only adsorption unit, and the other is different from the first embodiment. The configuration is basically the same as that of the first embodiment. In the following description, the same reference numerals will be given to the same components, and the description thereof will be omitted.

In the same manner as the adsorption unit 51, each of the adsorption units 52 to 54 of the second embodiment has not only 25 adsorption pads arranged in the X direction as the retention-only adsorption portion but also two adsorptions. The pad is set to abut the confirmation and use the adsorption portion. Further, the adsorption units 52 to 54 can independently switch the supply of the negative pressure to the suction pad and the supply of the negative pressure by the negative pressure supply units 528, 538, and 548, respectively. The negative pressure supply units 528, 538, and 548 have the same configuration. Therefore, the configuration of the negative pressure supply unit 528 will be described below, and the remaining negative pressure supply units 538 and 548 are denoted by the same reference numerals, and the description of the configuration will be omitted.

The adsorption unit 52 has 25 adsorption pads 527 which are arranged in the X direction and two adsorption pads which are disposed on the (-X) side and the (+X) side on the downstream side of the adsorption pad row. 527z1, 527z2. The 25 holding dedicated adsorption pads 527 on the upstream side of the adsorption pads are the same as the adsorption pads 517 of the adsorption unit 51, and are divided into 8 adsorption pads from the (X) direction side (+X) direction side. 9 adsorption pad groups and 3 adsorption pad groups of 8 adsorption pads. Further, the negative pressure supply unit 528 has three manifolds 5281 to 5283, and the manifold 5281 is connected to eight adsorption pads 527 constituting the adsorption pad group on the (+X) side, and the manifold 5182 is connected to the adsorption pad constituting the center. The nine adsorption pads 527 of the group are connected, and the manifold 5283 is connected to the eight adsorption pads 527 constituting the adsorption pad group on the (-X) side.

Each of the manifolds 5281 to 5283 is connected to the negative pressure generating unit 704 via a control valve V521. Therefore, when the control valve V521 is opened in response to an opening command from the valve control unit 703 of the control unit 70, a negative pressure is applied to the holding dedicated suction pad 527 via the manifolds 5281 to 5283. Conversely, the control valve V521 is closed in accordance with the closing command from the valve control unit 703, whereby the supply of the negative pressure holding the dedicated suction pad 527 is stopped. As described above, in the present embodiment, the control valve V521 functions as a first switching unit that switches the supply of the negative pressure to the adsorption pad 527 and the supply of the negative pressure, and can supply the negative pressure to the holding dedicated adsorption pad 527 at the same time. , can stop the negative pressure supply at the same time.

In addition, the contact-recognition adsorption pads 527z1 and 527z2 are connected to the (+X)-side holding dedicated adsorption pad 527 and the (-X)-side holding dedicated adsorption pad 527 by the connection member 529, and are integrally formed with the adsorption pad 527. The Z direction moves freely. In addition, in the second embodiment, two contact-adjusting adsorption pads 527z1 and 527z2 are provided on the downstream side, and one of the suction-adjusting adsorption pads is provided. The number is arbitrary and is not limited to "2". However, from the viewpoint of suppressing the variation of the negative pressure, it is preferably set to be smaller than the number of the dedicated adsorption pads.

Further, the negative pressure supply unit 528 includes a control valve V522 in addition to the control valve V521, and the contact confirmation adsorption pads 527z1 and 527z2 are connected to the negative pressure generation unit 704 via the control valve V522. Therefore, when the control valve V522 is opened in response to an opening command from the valve control unit 703 of the control unit 70, a negative pressure is applied to the contact confirmation suction pads 527z1 and 527z2. On the other hand, the control valve V522 is closed in response to the closing command from the valve control unit 703, whereby the supply of the negative pressure of the contact confirmation suction pads 527z1 and 527z2 is stopped. As described above, in the present embodiment, the control valve V522 functions as a second switching unit that switches the supply of the negative pressure to the adsorption pads 527z1 and 527z2 and the supply of the negative pressure, and can simultaneously contact the contact adsorption pad 527z1. The 527z2 supplies a negative pressure, and at the same time, the negative pressure supply can be stopped at the same time.

In the second embodiment, which is configured as described above, in the same manner as in the first embodiment, the upper surface of the substrate SB is adsorbed and held by the adsorption pad 517, and the peeling roller 340 is adjacent to the (+Y) side. After the pressing member 331 is lowered and the pressing member 331 is lowered, the first adsorption unit 51 is raised, and the peeling roller 340 is turned (+Y) in synchronization with this. Move in direction. Thereby, the first adsorption unit 51 that holds the (-Y)-side end portion (the adsorbed portion SR) of the substrate SB is raised, thereby pulling off the (-Y)-side end portion of the substrate SB and peeling off from the coating layer BL. Advance in the direction of (+Y).

When the peeling roller 340 passes through the second adsorption position, the second adsorption unit 52 is lowered, and only the control valve V522 is opened in response to a command from the valve control unit 703, and the negative pressure generating unit 704 abuts the contact confirmation suction pad 527z1. 527z2 supplies negative pressure. Furthermore, the supply of the negative pressure to the dedicated adsorption pad 527 is still in a stopped state.

Further, when the pressure value in the adsorption detecting pads 527z1 and 527z2 is measured by the pressure gauge 5286 in the lowering of the second adsorption unit 52, the monitoring of the pressure values in the adsorption pads 527z1 and 527z2 (monitoring step) is detected, and the adsorption pads 527z1 and 527z2 are detected. When the peeling portion of the substrate SB is attached, the control valve V521 is opened in accordance with an instruction from the valve control unit 703, and the negative pressure generating portion 704 is held by the negative pressure generating portion 704. The pad 527 supplies a negative pressure (adjustment step). Thereby, the peeling portion of the substrate SB is adsorbed and held by all of the adsorption pads 527, 527z1, and 527z2.

After the adsorption of the substrate SB by the dedicated adsorption pad 527 is started, the movement of the second adsorption unit 52 is changed to increase. Thereby, the advancement speed of the peeling is still controlled by the peeling roller 340, and the main system for pulling up the peeled substrate SB is taken from the first adsorption unit 51 to the second adsorption unit 52. Moreover, the substrate SB after peeling is switched from being held by the first adsorption unit 51 to being held by the first adsorption unit 51 and the second adsorption unit 52, and the holding portion is increased. In addition, when each of the adsorption units 51 to 54 is raised, the relative position in the Z direction between the adsorption units 51 to 54 is maintained so that the posture of the substrate SB after peeling is substantially flat.

Then, when the peeling roller 340 passes through the third adsorption position immediately below the third adsorption unit 53, the third adsorption unit 53 is lowered, and the main body of the substrate SB for peeling is pulled from the second adsorption unit 52. The third adsorption unit 53 moves. The lowering, the adsorption holding, and the substrate pulling system of the third adsorption unit 53 are performed in the same manner as the lowering of the second adsorption unit, the adsorption holding, and the substrate pulling. Further, after the peeling roller 340 passes through the fourth adsorption position, the fourth adsorption unit 54 is lowered to pull up the substrate SB. At this time, the same operation as the lowering, the adsorption holding, and the substrate pulling of the second adsorption unit 52 is also performed.

In this way, the substrate SB is pulled up by the fourth adsorption unit 54, whereby the entire substrate SB is pulled away from the cladding layer BL. Thereafter, in the same manner as in the first embodiment, the separated substrate SB and the cladding layer BL are carried out outside the apparatus, whereby the peeling process is completed.

As described above, in the second embodiment, for example, during the period in which the substrate SB is held while being held by the adsorption pad 517, the adsorption is provided in the second adsorption unit 52 by the adsorption-recognition adsorption pads 527z1 and 527z2. After the pad 527 holds the peeled portion of the substrate SB, the peeling is further promoted. In the peeling stage, the adsorption pads 517 and 527 function as the "upstream side adsorption unit" and the "downstream side adsorption unit" of the present invention, respectively. Further, after the peeling, the substrate SB is held while being held by the adsorption pad 527, and the peeling is advanced. In the meantime, the peeling portion of the substrate SB is held by the adsorption pad 537 (including the adsorption pads 537z1 and 537z2) on the downstream side of the adsorption pad 527, and the peeling is further promoted. In the peeling stage, the adsorption pad 527 functions as the "upstream adsorption portion" of the present invention, and the adsorption pad 537 functions as the "downstream adsorption portion" of the present invention. Further, after the peeling is continued, the substrate SB is held by the adsorption pad 547 (including the adsorption pads 547z1 and 547z2) on the downstream side of the adsorption pad 537 while the substrate SB is being held while being held by the adsorption pad 537. After the peeling site, the peeling is further advanced. In the peeling stage, the adsorption pad 537 functions as the "upstream adsorption portion" of the present invention, and the adsorption pad 547 functions as the "downstream adsorption portion" of the present invention. Therefore, the second embodiment exhibits the same operational effects as those of the first embodiment.

C. Third embodiment

13A to 13D are views showing a third embodiment of the peeling device of the present invention. The third embodiment differs greatly from the first embodiment or the second embodiment in that the position of the opposite position of the peeling portion PR (Figs. 14 and 15) of the suction pad with respect to the back surface of the substrate SB is shown. Information acquisition. In other words, in the first embodiment and the second embodiment, the pressure in the adsorption pad functioning as the contact-recognition-use adsorption unit is monitored, and the signal indicating the pressure value is used as the anti-adhesion surface of the adsorption pad with respect to the substrate SB. The position information of the relative position is output to the control unit 70. On the other hand, in the peeling apparatus of the third embodiment, the distance between the adsorption pad and the peeling portion PR of the substrate SB is monitored by the laser displacement meter, and a signal indicating the measured distance is output as the position information to the control unit. 70. In the following, the characteristic configuration of the peeling device of the third embodiment will be described with reference to FIG. 13 and the same components as those of the first embodiment will be denoted by the same reference numerals and will not be described.

In the third embodiment, the adsorption unit 51 is the same as the adsorption unit 51 of the first embodiment and the second embodiment. On the other hand, each of the adsorption units 52 to 54 is the same as the adsorption unit 51, and not only 25 adsorption pads are arranged in the X direction, but also one laser position is provided. Shift 530. Further, the adsorption units 52 to 54 can independently switch the supply of the negative pressure to the suction pad and the supply of the negative pressure by the negative pressure supply units 528, 538, and 548, respectively. The negative pressure supply units 528, 538, and 548 have the same configuration. Therefore, the configuration of the negative pressure supply unit 528 will be described below, and the remaining negative pressure supply units 538 and 548 are denoted by the same reference numerals, and the description thereof will be omitted.

The adsorption unit 52 has 25 adsorption-only adsorption pads 527 arranged in the X direction and a laser displacement meter 530 disposed on the downstream side of the adsorption pad row. The 25 adsorption pads 527 function as the adsorption-only adsorption unit. Similarly to the adsorption pad 517 of the adsorption unit 51, the three adsorption pad groups are divided into eight adsorption pads, nine adsorption pads, and eight adsorption pads from the (-X) direction side (+X) direction side. . Further, the negative pressure supply unit 528 has three manifolds 5281 to 5283, and the manifold 5281 is connected to eight adsorption pads 527 constituting the adsorption pad group on the (-X) side, and the manifold 5182 is connected to the adsorption pad constituting the center. The nine adsorption pads 527 of the group are connected, and the manifold 5283 is connected to the eight adsorption pads 527 constituting the adsorption pad group on the (+X) side.

Each of the manifolds 5281 to 5283 is connected to the negative pressure generating unit 704 via a control valve V52. Therefore, when the control valve V52 is opened in response to the opening command from the valve control unit 703 of the control unit 70, a negative pressure is applied to all of the adsorption pads 527 via the manifolds 5281 to 5283. Conversely, the control valve V52 is closed in accordance with the closing command from the valve control unit 703, whereby the supply of the negative pressure to all of the adsorption pads 527 is stopped. As described above, in the present embodiment, the control valve V52 functions as a switching unit that switches the supply of the negative pressure to the adsorption pad 527 and the supply of the negative pressure, and can simultaneously supply the negative pressure to the adsorption pad 527, and can simultaneously stop the negative pressure. Pressure supply.

The laser displacement meter 530 is coupled to the adsorption pad 527 at the central portion of the 25 adsorption pads in the X direction by the connection member 529, and is movable integrally with the adsorption pad 527 in the Z direction. Therefore, the laser displacement meter 530 measures the distance between the adsorption pad 527 and the peeling portion PR of the substrate SB, and outputs a signal related to the distance to the control unit 70 as position information. As described above, the laser displacement meter 530 is equivalent to the "monitoring device" and "distance" of the present invention. As an example of the measuring unit, the number and arrangement position of the laser displacement meter 530 are arbitrary, and are not limited thereto. Further, as long as the distance can be measured, a distance measuring unit other than the laser displacement meter can be used. For example, the adsorption pad 527 can be collectively photographed from the (+X) side or the (-X) side of the stage 30. The substrate SB obtains the above distance from the image.

Next, an operation of the peeling apparatus of the third embodiment configured as described above will be described with reference to Figs. 14 and 15 . FIG. 14 and FIG. 15 are diagrams schematically showing the positional relationship of each unit in each stage of the process in the third embodiment and the negative pressure supply state of the negative pressure supply unit. In the third embodiment, which is configured as described above, in the same manner as in the first embodiment, the (-Y) side end portion of the substrate SB is adsorbed and held by the adsorption pad 517 as the adsorbed portion SR, and The peeling roller 340 abuts on the upper surface of the substrate SB at the adjacent position on the (+Y) side, and further lowers the pressing member 331 to press the end portion of the coating layer BL, and then starts the rise of the first adsorption unit 51, and This synchronization causes the peeling roller 340 to move in the (+Y) direction. Thereby, the first adsorption unit 51 that holds the (-Y) side end portion (the adsorbed portion SR) of the substrate SB is raised, whereby the substrate SB is pulled and the peeling of the coating layer BL is advanced in the (+Y) direction.

Further, as shown in FIG. 14, when the peeling roller 340 passes through the second adsorption position, the distance measured by the laser displacement meter 530 is started as the second adsorption unit 52 is lowered (the peeling portion of the adsorption pad 527 and the substrate SB) Monitoring of the distance of PR). Furthermore, at this stage, the negative pressure supply system for all of the adsorption pads 527 is still in a stopped state.

Further, when the distance from the second adsorption unit 52 is detected to be lower than the threshold value and the adsorption pad 527 abuts on the peeling portion PR of the substrate SB, as shown in FIG. 15, it is opened in accordance with an instruction from the valve control unit 703. The control valve V52 is also supplied with a negative pressure from the holding dedicated suction pad 527 from the negative pressure generating portion 704. Thereby, the peeling site PR of the substrate SB is adsorbed by all the adsorption pads 527.

After the adsorption of the substrate SB by the adsorption pad 527 is started, the movement of the second adsorption unit 52 is changed to increase. Then, in the same manner as in the first embodiment, the third adsorption unit is started at the time when the peeling roller 340 passes through the third adsorption position immediately below the third adsorption unit 53. When the 53 is lowered, the main body of the lifted substrate SB is moved from the second adsorption unit 52 to the third adsorption unit 53. The lowering, the adsorption holding, and the substrate pulling system of the third adsorption unit 53 are performed in the same manner as the lowering of the second adsorption unit, the adsorption holding, and the substrate pulling. Further, after the peeling roller 340 passes through the fourth adsorption position, the fourth adsorption unit 54 is lowered to pull up the substrate SB. At this time, the same operation as the lowering, the adsorption holding, and the substrate pulling of the second adsorption unit 52 is also performed.

The substrate SB is pulled up by the fourth adsorption unit 54, whereby the entire substrate SB is pulled away from the cladding layer BL. Thereafter, in the same manner as in the first embodiment, the separated substrate SB and the cladding layer BL are carried out outside the apparatus, whereby the peeling process is completed.

As described above, in the third embodiment, for example, while the substrate SB is held while being held by the adsorption pad 517, the peeling portion of the substrate SB is held by the adsorption pad 527 provided in the second adsorption unit 52. Further promote the divestiture. In the peeling stage, the adsorption pads 517 and 527 function as the "upstream side adsorption unit" and the "downstream side adsorption unit" of the present invention, respectively. In addition, after the peeling is continued while the substrate SB is held by the adsorption pad 527, the peeling portion of the substrate SB is held by the adsorption pad 537 located on the downstream side of the adsorption pad 527, and the peeling is further promoted. . In the peeling stage, the adsorption pad 527 functions as the "upstream adsorption portion" of the present invention, and the adsorption pad 537 functions as the "downstream adsorption portion" of the present invention. Further, after the peeling is continued while the substrate SB is held by the adsorption pad 537, the peeling portion of the substrate SB is held by the adsorption pad 547 located on the downstream side of the adsorption pad 537, and the peeling is further promoted. . In the peeling stage, the adsorption pad 537 functions as the "upstream adsorption portion" of the present invention, and the adsorption pad 547 functions as the "downstream adsorption portion" of the present invention. Therefore, the third embodiment exhibits the same operational effects as those of the first embodiment.

Further, in the third embodiment, the start timing of the supply of the negative pressure to the adsorption pads 527, 537, and 547 is adjusted based on the distance measured by the laser displacement meter 530 (adjustment step) Step). Therefore, the supply of the negative pressure in a state where the adsorption pad is not in contact with the anti-adhesion surface of the substrate SB can be avoided, and the value of the negative pressure applied to each adsorption unit by the negative pressure generating portion 704 can be effectively suppressed from fluctuating.

Further, in the first to third embodiments, the cladding layer BL and the substrate SB correspond to an example of the "first plate-shaped body" and the "second plate-shaped body" of the present invention, respectively.

D. Other

It is to be noted that the present invention is not limited to the above-described embodiments, and various modifications may be made in addition to the above without departing from the spirit and scope of the invention. For example, in the above embodiment, the grid 30 is provided with the lattice-shaped adsorption grooves 311 and 312, and the coating layer BL is adsorbed and held. However, the shape of the adsorption groove is not limited thereto. For example, an annular adsorption tank may be provided, and the adsorption hole for supplying a negative pressure may be appropriately disposed to adsorb the coating layer.

Further, in the above embodiment, the substrate and the cladding layer are held by vacuum suction, but the aspect of the substrate is not limited thereto. For example, it is also possible to perform adsorption holding by electrostatic or magnetic adsorption. In particular, the first peeling device that holds the outside of the effective region of the substrate can be held by mechanically holding the peripheral edge portion of the substrate without being held by adsorption.

Further, in the above-described embodiment, the rise of each of the adsorption units 51 to 54 is controlled to reduce the stress applied to the substrate SB so that the posture of the substrate SB after peeling is maintained close to the plane, but the substrate SB is The aspect of pulling is not limited to this. For example, the adsorption unit may be stopped at a fixed height such that the substrate after peeling is substantially horizontal, or the substrate may be held in a posture that is bent as having a specific curvature. These lines can be freely set by controlling the ascending state of each adsorption unit.

Further, in the above-described embodiment, four adsorption units are disposed on the upper portion of the substrate SB to sequentially adsorb the substrate SB. However, the number of adsorption units is arbitrary, and is not limited thereto. If the substrate is large, the number of adsorption units may be increased, and if it is small, the adsorption unit may be reduced.

Further, in the above embodiment, the cladding layer BL is protruded from the tapered land portion 32 to protect The pressing layer 338 is bent by the pressing member 331 to form a peeling notch. However, the above-described situation is not a necessary condition, and for example, it may be set only by the pulling of the first adsorption unit. Start peeling off. In this case, there is no need to set the taper on the platform.

The present invention can be applied to a peeling process in which two sheet-like bodies are closely adhered to a pattern forming process such as a transfer pattern, and the like, in addition to the various purposes of peeling off two plate-like bodies that are in close contact with each other, Good application, not limited to those who accompany such a pattern transfer.

30‧‧‧ platform

31‧‧‧Horizontal Platform Division

32‧‧‧Conical Platform Division

51‧‧‧Adsorption unit

52‧‧‧Adsorption unit

53‧‧‧Adsorption unit

54‧‧‧Adsorption unit

310‧‧‧ (top of horizontal platform section 31) upper surface

320‧‧‧ (of the tapered platform portion 32) upper surface

331‧‧‧ Pushing members

340‧‧‧ peeling roller

517‧‧‧Adsorption pad

518‧‧‧Negative Pressure Supply Department

527‧‧‧Adsorption pad

527a~527y‧‧‧Adsorption pad

528‧‧‧Negative Pressure Supply Department

704‧‧‧ Negative Pressure Generation Department

5181‧‧‧Management

5182‧‧‧Management

5183‧‧‧Management

5184‧‧‧ pressure gauge

5281‧‧‧Management

5282‧‧‧Management

5283‧‧‧Management

5284‧‧‧Management

5285‧‧‧ pressure gauge

5286‧‧‧ pressure gauge

BL‧‧‧ coating

PR‧‧‧ peeling site

SB‧‧‧ substrate

SR‧‧‧Adsorbed parts

V51‧‧‧ control valve

V521‧‧‧ control valve

V522‧‧‧Control valve

WK‧‧‧ workpiece

X‧‧‧ direction

Y‧‧‧ peeling direction

Z‧‧‧ direction

Claims (12)

A peeling device for peeling off a first plate-shaped body and a second plate-shaped body that are in close contact with each other, comprising: a holding device that holds the first plate-shaped body; and an upstream side peeling device that has adsorption holding An upstream side adsorption portion of a portion of the surface of the second plate-shaped body that is in contact with the surface of the first plate-shaped body opposite to the first plate-shaped body, and the second plate-shaped body is adsorbed by the upstream adsorption portion When the upstream side adsorption unit is separated from the holding device, the adsorbed portion of the second plate-shaped body adsorbed by the upstream side adsorption unit is peeled off from the first plate-shaped body, and the first step is advanced in the peeling advancement direction. (2) peeling of the plate-shaped body; the downstream side peeling device having the downstream side of the adsorbed portion in the peeling advancing direction, and the downstream side adsorbing portion provided facing the anti-adhesion surface of the second plate-shaped body The downstream side adsorption unit moves the peeling portion peeled off by the upstream side peeling member in the second plate-shaped body to adsorb the back-contact surface of the peeling portion, and then causes the downstream side The attachment portion is separated from the holding member in a state in which the second plate-like body is adsorbed, and the peeling of the second plate-shaped body is advanced in the peeling advancement direction; and the monitoring device monitors the downstream side adsorption portion with respect to the second plate And a control device for the second plate-shaped body by the downstream side adsorption unit based on the position information related to the relative position obtained by the monitoring device Adsorption begins to be controlled. The peeling device according to claim 1, wherein the downstream side peeling device has a first adsorption unit and a second adsorption unit, and functions as the downstream side adsorption unit; and the first switching unit switches to the first (1) the negative pressure supply and the negative pressure supply stop of the adsorption unit; and the second switching unit switches the supply of the negative pressure and the supply of the negative pressure to the second adsorption unit; and the first adsorption unit and the second adsorption unit During the period in which the peeling portion is integrally formed, the negative pressure supply to the first adsorption unit is stopped by the first switching unit, and the second pressure is supplied to the second adsorption unit by the second switching unit. The monitoring device includes a pressure measuring unit that measures the pressure of the second adsorption unit, and outputs a pressure value measured by the pressure measuring unit as the position information, and the control device controls the first switching as follows. In other words, the supply of the negative pressure to the first adsorption unit is started based on the change in the pressure value during the movement of the first adsorption unit and the second adsorption unit to the separation portion. The peeling device according to claim 2, wherein the first adsorption portion and the second adsorption portion are arranged in a width direction of the second plate-shaped body orthogonal to the peeling advancement direction. The peeling device according to claim 3, wherein the downstream side adsorption portion of the plurality of downstream side adsorption portions located at both ends and the central portion in the width direction is the second adsorption portion, and the remaining downstream adsorption portion is the The first adsorption unit. The peeling device according to claim 2, wherein the second adsorption unit is disposed on a downstream side of the first adsorption unit in the peeling advancement direction. The peeling device according to claim 5, wherein the downstream side peeling device has a plurality of the first adsorption portions arranged in a width direction of the second plate-shaped body orthogonal to the peeling advance direction as the downstream side adsorption portion And the number of the second adsorption portions smaller than the first adsorption unit. The stripping device of claim 1, wherein The downstream side peeling device has a downstream side switching unit that switches the negative pressure supply and the negative pressure supply stop of the downstream side adsorption unit, and stops the negative side adsorption unit while the downstream side adsorption unit approaches the peeling portion. In the pressure supply, the monitoring device includes a distance measuring unit that measures a distance between the back-contact surface of the second plate-shaped body and the downstream-side adsorption portion in the movement of the downstream-side adsorption portion toward the peeling portion. As the position information, the control device controls the downstream side switching unit to start supply of the negative pressure to the downstream side adsorption unit at a time point when the distance becomes a threshold value. The peeling device according to claim 7, wherein the distance measuring unit moves the gauge to measure the distance while moving integrally with the downstream side adsorption unit. The peeling device according to any one of claims 1 to 8, wherein the adsorbed portion is an upstream end portion of the second plate-shaped body in the peeling advancing direction of the anti-adhesion surface of the second plate-shaped body, The upstream side peeling device has an upstream side switching unit that switches the negative pressure supply and the negative pressure supply stop of the upstream side adsorption unit, and the upstream side switching unit stops while the upstream side adsorption unit moves to the adsorbed portion. When the upstream side adsorption unit abuts against the adsorbed portion, the negative pressure supply to the upstream side adsorption unit starts the supply of the negative pressure to the upstream side adsorption unit. A peeling method for peeling off the first plate-shaped body and the second plate-shaped body which are in close contact with each other, comprising the step of holding the first plate-shaped body by holding the device; a peeling step of adsorbing one of the surfaces of the second plate-shaped body on the opposite side of the surface of the second plate-shaped body that is in contact with the first plate-shaped body by the upstream side adsorption portion a portion in which the second plate-shaped body is adsorbed, and the upstream adsorption portion is separated from the holding device, and the adsorbed portion of the second plate-shaped body adsorbed by the upstream adsorption portion is formed from the first plate shape. The body is peeled off to advance the peeling of the second plate-shaped body in the peeling advancement direction, and the moving step is such that the downstream side adsorbing portion is on the downstream side of the adsorbed portion in the peeling advancing direction to the second plate-shaped body The movement of the anti-adhesion surface of the peeling portion where the upstream side adsorption portion is separated from the holding device, and the monitoring step of monitoring the downstream side adsorption portion relative to the peeling portion moving toward the anti-adhesion surface a relative position of the anti-adhesive surface of the second plate-shaped body; and an adjustment step of adjusting the adsorption of the second plate-shaped body by the downstream side adsorption unit based on position information related to the relative position And a second peeling step of pressing the adsorption of the second plate-shaped body by the downstream side adsorption unit simultaneously or after the start of adsorption The downstream portion by suction to attract the anti-adhesion state of the release surface portion of the downstream side of the adsorption section so that the holding means away from said propelling direction of the release promoting the release of the second plate-like member. The peeling method of claim 10, wherein the downstream side adsorption unit is provided with a first adsorption unit and a second adsorption unit, and the moving step stops supply of negative pressure to the first adsorption unit, and The second adsorption unit supplies a negative pressure, and the monitoring step measures the pressure of the second adsorption unit and outputs the pressure value as the position information, and the adjustment step is performed by the first adsorption unit and the second adsorption unit. The supply of the negative pressure to the first adsorption unit is started by the change in the pressure value during the movement of the peeling portion. The peeling method of claim 10, wherein the moving step stops the supply of the negative pressure to the downstream side adsorption portion, and the monitoring step measures the distance between the reverse-bonding surface of the second plate-shaped body and the downstream-side adsorption portion. As the position information, the adjustment step is to start supply of the negative pressure to the downstream adsorption unit at a time point when the distance is equal to or less than the threshold.