TW201615344A - Work-piece grinding method - Google Patents

Abstract

The subject of the present invention is to provide a work-piece grinding method capable of inhibiting a contactor from damage even when a plurality of work-pieces are held at the same time for grinding. To solve the problem, the work-piece grinding method comprises a holding step, a pre-measurement step, a retreating step, a first grinding step and a second grinding step. The holding step is provided to hold a plurality of work-pieces on a holding surface of a holding mechanism. The pre-measurement step is provided to contact the contactor of a height measurement mechanism on the back of the work-piece while rotating the holding mechanism. The retreating step is provided to move the contactor away from the back. The first grinding step is provided to grind the work-piece until the grinding wheel is positioned to the lowest height position of the work-piece. The second grinding step is provided to grind the work-piece to a height equal to a desired product thickness. In the pre-measurement step, the rotational speed of the holding mechanism is slower than that of the holding mechanism of the first grinding step.

Description

Grinding method of workpiece Field of invention

The present invention relates to a method of grinding a plurality of workpieces.

Background of the invention

In the case where various workpieces are thinned and ground to a desired thickness, grinding is performed while measuring the thickness of the workpiece, and the grinding is finished once the desired thickness is reached. As a method of measuring the thickness of the workpiece, it is known to contact the contactor of the thickness measuring device with the surface of the workpiece and the surface of the holding table holding the workpiece to determine the height difference. A contact type measurement method for determining the thickness of the workpiece is obtained by the value of the difference (see, for example, Patent Document 1).

On the other hand, among wafers formed of sapphire, gallium nitride (GaN) or the like as a workpiece, there are wafers having a smaller diameter than a general wafer. Regarding the grinding of a wafer having such a small diameter, it has been possible to reduce the amount of grinding by holding a plurality of wafers on the same holding surface of one holding table and then simultaneously grinding a plurality of wafers. A technique of time is proposed (see, for example, Patent Document 2).

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2000-006018

Patent Document 2: Japanese Patent Laid-Open Publication No. 2012-101293

Summary of invention

If the measurement is performed while the plurality of wafers are being ground by the contact type measurement method, the two contactors shown in Patent Documents 1 and 2 may be damaged. Therefore, the applicant of the present invention proposes to link the two. A contactor for the contactor. However, even in such a measuring device, when a plurality of workpieces having a high difference in height before grinding are brought into contact with the contactor in a state of high-speed rotation, there is a fear that the contactor is broken.

An object of the present invention is to provide a method of grinding a workpiece that can prevent breakage of a contactor even when a plurality of workpieces are simultaneously held for grinding.

In order to solve the above problems and achieve the object, the grinding method of the workpiece according to the first aspect of the present invention is a grinding method for simultaneously grinding a workpiece, characterized in that a grinding device is used, and the grinding device includes a holding mechanism that rotates around a rotating shaft that is perpendicular to the holding surface of the workpiece, and a grinding mechanism that grinds the grinding wheel that is used to grind the upper surface of the workpiece held by the holding mechanism A grinding mechanism that approaches and moves away from the holding surface in a direction orthogonal to the holding surface, and a height measuring mechanism that measures the height of the upper surface of the workpiece ground by the grinding mechanism.

The method for grinding a workpiece includes: a holding step of arranging and holding a plurality of workpieces having a size smaller than the holding surface on the holding surface of the holding mechanism; and preparing a measuring step after the holding step is performed While the contactor of the height measuring mechanism contacts the upper surface of the workpiece, the holding mechanism is rotated to measure the height of the plurality of workpieces, and the lowest height is found; the retreating step is performed after the preliminary measuring step is performed The contactor is retracted away from the upper surface of the workpiece; in the first grinding step, after the retracting step is performed, the holding mechanism is rotated and the grinding feed mechanism is actuated to grind the workpiece by the grinding wheel Until the grinding wheel is positioned at the lowest height position of the workpiece measured by the height measuring mechanism, the height of the plurality of workpieces is uniform; and the second grinding step is performed. After the grinding step, the retracted contactor is brought into contact with the upper surface of the workpiece, and the workpiece is ground by the grinding mechanism while rotating the holding mechanism until the height is reached. The height of the workpiece measured by the measuring mechanism reaches the desired thickness of the finished product, and the speed at which the holding mechanism rotates in the preliminary measuring step is slower than the speed at which the holding mechanism rotates in the first grinding step, and The speed at which the contactor passing through the upper surface of the workpiece of different heights is broken.

Therefore, in the grinding method of the workpiece according to the present invention, the height of the workpiece before the grinding is measured while rotating the holding mechanism at a slow speed, and after the minimum height is detected, the contactor is temporarily made. Retreat, And after grinding with a grinding mechanism to match the height of all the workpieces with the lowest height, the contactor is again brought into contact with the workpiece and ground to the thickness of the finished product. According to this, in the case where the grinding method performs grinding while holding a plurality of workpieces at the same time, the effect of suppressing breakage of the contactor is exhibited.

1‧‧‧ grinding device

10‧‧‧ Keeping institutions

10a‧‧‧ Keep face

10b‧‧‧The outer part

100‧‧‧Control agency

2‧‧‧ device body

20‧‧‧grinding mechanism

21‧‧‧Mobile abutments

23‧‧‧ grinding wheel

24‧‧‧ Spindle

24a‧‧‧Flange

25‧‧‧Grinstone abutment

26‧‧‧ grinding grinding stone

27‧‧‧Spindle motor

28‧‧‧ spindle housing

29‧‧‧Support

3‧‧‧ Column Department

30‧‧‧ grinding feed mechanism

31‧‧‧Processing feed motor

33‧‧‧rails

34‧‧‧ lead screw

40‧‧‧ Height measuring agency

41‧‧‧ Body Department

42‧‧‧ Measuring arm

42a‧‧‧ front end

42b‧‧‧ base end

43‧‧‧Contactor

44‧‧‧Air supply source

45‧‧‧ cylinder

46‧‧‧needle support members

47, 49a‧‧ ‧ parallel

48‧‧‧Contacts

48a‧‧‧Contact points

49‧‧‧Parallel contact

49b‧‧‧ Warpage Department

A‧‧‧Rotary axis

B‧‧‧ Swing Center

C‧‧‧Circle

L‧‧‧ length

M‧‧‧ holding components

P‧‧‧ points

T‧‧‧ finished thickness

V‧‧‧ Deviation

W‧‧‧Processed objects

W1, W2, W3‧‧‧ interval

WR‧‧‧Back (upper surface)

WS‧‧‧ surface

X, Y, Z‧‧ Direction

Fig. 1 is an external perspective view showing a configuration of a grinding device used in a grinding method of a workpiece according to an embodiment.

FIG. 2 is a perspective view of a holding mechanism, a height measuring mechanism, and the like of the grinding device used in the grinding method of the workpiece according to the embodiment.

Fig. 3 is a perspective view of a height measuring mechanism and a plurality of workpieces of the grinding apparatus used in the grinding method of the workpiece according to the embodiment.

4 is a plan view showing a height measuring mechanism and the like of a grinding device used in a grinding method of a workpiece according to the embodiment, and a plurality of workpieces.

Fig. 5 is a side view showing an outline of a preliminary measurement procedure of a grinding method of a workpiece according to the embodiment.

Fig. 6 is a side view showing an outline of a first grinding step of a grinding method of a workpiece according to the embodiment.

Fig. 7 is a side view showing an outline of a second grinding step of the grinding method of the workpiece according to the embodiment.

FIG. 8 is a side view of a holding mechanism, a height measuring mechanism, and the like of the grinding apparatus used in the grinding method of the workpiece according to the embodiment.

Fig. 9 is a plan view showing a holding mechanism, a height measuring mechanism, and the like of the grinding apparatus used in the grinding method of the workpiece according to the embodiment.

Form for implementing the invention

The embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. Further, the constituent elements described below include those which can be easily conceived or substantially identical to those having ordinary knowledge in the technical field to which the present invention pertains. Further, the configurations described below can be combined as appropriate. Further, various configurations may be omitted, substituted, or changed without departing from the spirit and scope of the invention.

[Embodiment]

A method of grinding a workpiece according to an embodiment of the present invention will be described based on the drawings. Fig. 1 is an external perspective view showing a configuration of a grinding device used in a grinding method of a workpiece according to an embodiment. FIG. 2 is a perspective view of a holding mechanism, a height measuring mechanism, and the like of the grinding device used in the grinding method of the workpiece according to the embodiment. Fig. 3 is a perspective view of a height measuring mechanism and a plurality of workpieces of the grinding apparatus used in the grinding method of the workpiece according to the embodiment. 4 is a plan view showing a height measuring mechanism and the like of a grinding device used in a grinding method of a workpiece according to the embodiment, and a plurality of workpieces.

The grinding method (hereinafter, abbreviated as grinding method) of the workpiece according to the present embodiment uses the grinding device 1 shown in Fig. 1 . The grinding device 1 is a device that grinds (corresponds to machining) on a plurality of workpieces W (shown in FIG. 3) at the same time. Here, in the present embodiment, the workpiece W to be processed is a disk-shaped semiconductor wafer or an optical element wafer in which ruthenium, sapphire, gallium nitride (GaN) or the like is used as a base material. The workpiece W is formed, for example, on the surface WS A plurality of regions are divided into a grid-shaped dividing line called a street, and elements are formed in the divided regions. As shown in FIG. 3, the workpiece W is attached to the holding member M, and the back surface WR of the back side of the surface WS is maintained in a state in which a plurality of the holding members M are held. Figure 4) is ground with a grinding stone 26. In the present embodiment, the holding member M is formed in a disk shape, and the five workpieces W are disposed at equal intervals in the circumferential direction at the outer edge portion of the holding member M.

As shown in FIG. 1, the grinding apparatus 1 includes a holding mechanism 10, a grinding mechanism 20, a grinding feed mechanism 30, a height measuring mechanism 40, a control mechanism 100, and the like.

The holding mechanism 10 is a mechanism that mounts the surface WS of the workpiece W via the holding member M and has a holding surface 10a for sucking and holding the plurality of workpieces W placed thereon. As shown in Fig. 2, the holding mechanism 10 is formed in a disk shape formed of porous ceramics or the like, and is connected to a vacuum suction source (not shown) through a vacuum suction path (not shown). The workpiece W placed on the holding surface 10a is held in such a manner that the holding member M is sucked.

The holding mechanism 10 has a holding surface 10a formed to have a size larger than the size of the workpiece W. That is, the workpiece W is formed to have a smaller size than the holding surface 10a. The holding mechanism 10 is moved in the Y-axis direction within a range from a machining position that covers the lower portion of the grinding mechanism 20 to a position that is separated from the lower portion of the grinding mechanism 20 by a holding mechanism moving mechanism (not shown). The holding mechanism 10 can hold the attraction by a rotary drive mechanism not shown The workpiece W is rotated around a rotation axis A (indicated by a one-dot chain line in FIGS. 2 and 3) that is orthogonal to the holding surface 10a and passes through the center of the holding surface 10a. The holding mechanism 10 holds a plurality of workpieces W on the holding surface 10a via the holding member M, and holds the plurality of workpieces W at equal intervals around the rotation axis A on the holding surface 10a. on.

The grinding feed mechanism 30 is a mechanism that moves the grinding mechanism 20 in parallel with the Z-axis in a direction in which it is close to and away from the holding surface 10a. The grinding feed mechanism 30 includes a machining feed motor 31 and the like. The machining feed motor 31 is a motor for feeding the moving base 21 on which the grinding mechanism 20 is mounted along the guide rail 33. The machining feed motor 31 is attached to the column portion 3 which is erected from the apparatus body 2 of the grinding device 1, and a lead screw 34 is attached to the output shaft. The lead screw 34 is configured to be parallel to the Z axis and is supported to be rotatable about the axis in the column portion 3. The lead screw 34 is screwed into a nut (not shown) mounted on the moving base 21. The guide rail 33 is attached to the column portion 3 in parallel with the Z-axis to support the moving base 21 so as to be slidable in the Z-axis direction.

The grinding mechanism 20 is a mechanism that grinds the grinding liquid as the machining liquid while supplying the back surface WR (corresponding to the upper surface) of the plurality of workpieces W held by the holding mechanism 10. As shown in FIG. 1, the grinding mechanism 20 includes a spindle 24 that mounts the grinding wheel 23 at the front end, a spindle motor 27, and the like.

The grinding wheel 23 is a tool for grinding the back surface WR of the workpiece W. The grinding wheel 23 is provided with a disc-shaped grindstone base 25 and a plurality of grinding grindstones 26. The grindstone base 25 is attached to the flange portion 24a provided at the front end of the main shaft 24 by bolts or the like. The grinding stone 26 is provided on the outer edge portion of the grindstone base 25 Set into a ring shape. The grinding stone 26 is composed of well-known abrasive grains, a bonding agent with fixed abrasive grains, and the like, and the spindle 24 is rotated about a Z axis parallel to the vertical direction by a spindle motor 27 to grind the workpiece. The back of the W is WR. Further, as shown in FIG. 4, the grinding stone 26 is passed through the rotation axis A of the holding mechanism 10 at the machining position by the rotation of the spindle motor 27. Therefore, in the grinding, a part of the back surface WR of the workpiece W held by the holding mechanism 10 is exposed.

The main shaft 24 is housed in the spindle housing 28 so as to be rotatable about the Z axis. The spindle housing 28 is held by a support portion 29 mounted on the moving base 21. The spindle motor 27 rotates the spindle 24 (i.e., the grinding wheel 23) about the Z axis.

The height measuring mechanism 40 is a mechanism for measuring the height of the back surface WR of the plurality of workpieces W that is ground by the grinding mechanism 20 from the holding surface 10a of the holding mechanism 10. The height measuring mechanism 40 is moved in the Y-axis direction together with the holding mechanism 10 in a range covering the machining position and the loading and unloading position by the holding mechanism moving mechanism. As shown in FIG. 2, the height measuring mechanism 40 includes a body portion 41, a measuring arm 42 supported by the body portion 41 so as to be swingable in the up and down direction, and two contactors attached to the front end portion 42a of the measuring arm 42. 43. The body portion 41 is in the vicinity of the holding mechanism 10 disposed at the processing position. The body portion 41 supports the measuring arm 42 so as to be swingable to move the front end portion 42a up and down. The main body portion 41 is provided with a cylinder 45 which, when the pressurized gas is supplied from the air supply source 44, presses the proximal end side below the swing center B of the measuring arm 42 to make it The front end portion 42a of the measuring arm 42 rises. Also, a useful portion is provided on the body portion 41 for detecting the measuring arm 42. A detecting mechanism (not shown) that oscillates the rotational position of the center B to detect the height of the back surface WR of the workpiece W. The detecting mechanism outputs the detection result to the control mechanism 100.

The measuring arm 42 is formed in a rod (cylindrical) shape, and is supported by the main body portion 41 so as to be swingable about the base end portion 42b. The needle support member 46 on which the two contactors 43 are attached is provided on the front end portion 42a of the measuring arm 42.

The two contactors 43 are formed in a rod (cylindrical) shape and are attached to the needle supporting member 46. The two contactors 43 include a parallel portion 47 that is parallel to the measuring arm 42 and a contact portion 48 that extends from the front end of the parallel portion 47 toward the holding surface 10a of the holding mechanism 10 to come into contact with the back surface WR of the workpiece W. A contact point 48a that is in contact with the back surface WR of the workpiece W is formed at the lower end of the contact portion 48. The two contactors 43 are disposed at the same height position by the contact points 48a that are in contact with the back surface WR of the workpiece W exposed during the grinding. The two contactors 43 are arranged such that the parallel portions 47 are parallel to each other and spaced apart in the horizontal direction, and the length L of the contact portions 48 is made equal. As shown in FIGS. 3 and 4, the two contactors 43 are disposed apart by a space W1 which is smaller than the circumference C centered on the rotation axis A of the holding mechanism 10 (a little chain in FIG. 4). The line shows that the interval W2 in the circumferential direction of the workpiece W which is arranged in the upper direction is larger. The measuring arm 42, the needle supporting member 46, and the contactor 43 are made of stainless steel or the like.

In addition, the circumferential distance W2 of the adjacent workpiece W in the present invention means the interval W2 on the circumference C through which the contact point 48a passes over the back surface WR of the workpiece W. Further, in the present embodiment, the interval W1 between the two contactors 43 means the interval W1 between the centers of the contactors 43. Further, the interval W1 between the two contactors 43 is formed to be much smaller than the interval W3 between the points P at which the outer edge of the back surface WR of the workpiece W intersects the circumference C.

By arranging the two contactors 43 and performing the grinding of the plurality of workpieces W by the holding mechanism 10 via the holding member M, when the contactors 43 on one side are located between the plurality of workpieces W At the same time, the contactor 43 on the other side contacts the back surface WR of any one of the plurality of workpieces W, so that the height measuring mechanism 40 can always measure the height position of the back surface WR of the workpiece W. In this way, the height measuring mechanism 40 is formed so as not to make the contactor by making the interval W1 between the two contactors 43 larger than the interval W2 between the adjacent workpieces W. 43 is dropped between the workpieces W, and the height position of the back surface WR of the workpiece W can be measured at all times.

The control mechanism 100 is a mechanism that controls the above-described constituent elements constituting the grinding device 1 to cause the grinding device 1 to perform a machining operation on the workpiece W. In addition, the control unit 100 is configured to include, for example, a calculation processing device including a CPU or the like, a microprocessor such as a ROM or a RAM, and the like, and can be connected to a state for displaying a processing operation. A display mechanism (not shown) and an operation mechanism (not shown) used when an operator logs in the processed content information or the like.

Next, the machining operation of the grinding apparatus 1 of the present embodiment (that is, the grinding method using the grinding apparatus 1) will be described based on the drawings. Fig. 5 is a side view showing an outline of a preliminary measurement procedure of a grinding method of a workpiece according to the embodiment. Fig. 6 is a side view showing an outline of a first grinding step of a grinding method of a workpiece according to the embodiment. Figure 7 is a view showing the workpiece of the embodiment A side view of an outline of a second grinding step of the grinding method. The grinding method is a grinding method in which a plurality of workpieces W are simultaneously ground to grind a plurality of workpieces W to a desired finished product thickness T (as shown in FIG. 7). First, the operator registers the processed content information in the control unit 100, and when the operator has made an instruction to start the machining operation, the grinding device 1 starts the machining operation (that is, the grinding method). The grinding method includes a holding step, a preliminary measuring step, a retreating step, a first grinding step, and a second grinding step.

First, in the holding step, the grinding method places a plurality of workpieces W whose surface WS is attached to the holding member M on the holding mechanism 10 at a loading and unloading position that is separated from the lower side of the grinding mechanism 20. In this way, the control mechanism 100 can arrange and hold a plurality of workpieces W having a size smaller than the holding surface 10a on the holding surface 10a of the holding mechanism 10. Further, the control mechanism 100 supplies the pressurized gas from the air supply source 44 to the cylinder 45 to compare the front end portion 42a of the measuring arm 42 with the contactor 43 as shown by the two-dot chain line in FIG. The holding surface 10a of the holding mechanism 10 is further raised. Then, proceed to the preliminary measurement step.

In the preliminary measurement step, the control mechanism 100 moves the holding mechanism 10 by the holding mechanism moving mechanism after the holding step has been performed to position the holding mechanism 10 to the processing position, and stops the cylinder 45 from the air supply source 44. The pressurized gas is supplied so that the contact point 48a of the two contactors 43 comes into contact with the back surface WR of the workpiece W held by the holding mechanism 10. In addition, since the preliminary measurement step is performed before the back surface WR of the plurality of workpieces W is ground, there is a height deviation V of, for example, 100 μm or less, for example, about 50 μm, of the back surface WR of the plurality of workpieces W (Fig. 5) shape.

As shown in FIG. 5, the control mechanism 100 causes the contactor 43 to contact the back surface WR of the workpiece W, and the rotation mechanism drives the holding mechanism 10 around the rotation axis A, and the height measuring mechanism 40 measures a plurality of The height of the back surface WR of the workpiece W. Then, the control unit 100 finds the height of the back surface WR of the workpiece W having the lowest height among the back surfaces WR of the plurality of workpieces W. Further, in the preliminary measurement step, the control means 100 performs one rotation by the number of rotations of the lowest speed among the number of rotations of the holding mechanism 10, for example, 3 to 10 rpm. In the present embodiment, the control mechanism 100 rotates the holding mechanism 10 once at 5 rpm in the preliminary measurement step. Then, proceed to the backoff step.

In the evacuation step, the control mechanism 100 supplies the pressurized gas from the air supply source 44 to the cylinder 45 after the preparatory measurement step has been performed, so that the measurement arm 42 front end portion 42a and the contactor 43 are raised. Then, the control mechanism 100 retracts the contactor 43 away from the back surface WR of the workpiece W. Then, the first grinding step is performed.

In the first grinding step, after the retracting step has been performed, the control mechanism 100 positions the grinding wheel 23 rotated by the spindle motor 27 on the rotating shaft A of the rotating holding mechanism 10 as shown in FIG. And the rotation mechanism drives the holding mechanism 10 to rotate about the rotation axis A. Then, the control mechanism 100 activates the machining feed motor 31 of the grinding feed mechanism 30 while rotating the holding mechanism 10 by the rotation driving mechanism until the lower end of the grinding stone 26 of the grinding wheel 23 is positioned to be used. The position of the back surface WR of the lowest workpiece W among the back surface WR of the plurality of workpieces W measured by the height measuring mechanism 40 Set it up.

Then, as shown in FIG. 6, the control mechanism 100 causes the grinding mechanism 20 to approach the holding surface 10a by the grinding feed mechanism 30, and the grinding wheel 23 mainly faces the workpiece W having the lowest back surface WR. The workpiece W is ground to match the heights of the back surface WR of the plurality of workpieces W. In the first grinding step, the grinding wheel 23 can be used to grind only the workpiece W having the lowest back surface WR in a state where the contactor 43 is moved away from the back surface WR of the workpiece W. In the workpiece W, the workpiece W having the lowest back surface WR may be ground a little, and all the workpieces W may be ground. Further, in the first grinding step, the control mechanism 100 estimates the height of the back surface WR of the workpiece W based on the feed amount of the grinding mechanism 20 of the grinding feed mechanism 30. Then, the second grinding step is performed.

In the second grinding step, the control mechanism 100 stops the pressurization of the cylinder 45 from the air supply source 44 while the holding mechanism 10 and the grinding wheel 23 are kept rotating after the first grinding step has been performed. The supply of gas causes the contact point 48a of the two contactors 43 that have been retracted to contact the back surface WR of the workpiece W held by the holding mechanism 10. Then, as shown in FIG. 7, the control mechanism 100 slowly lowers the grinding wheel 23 by the grinding feed mechanism 30 to grind the feed to the back surface WR of the workpiece W, and grinds the grinding wheel 23 The sharpening stone 26 grinds the back surface WR of the workpiece W. In the grinding, the height of the back surface WR is always measured by the height measuring mechanism 40.

The control mechanism 100 rotates the grinding wheel 23 while rotating the holding mechanism 10 to grind the workpiece W by the grinding mechanism 20 until the height of the back surface WR of the plurality of workpieces W measured by the height measuring mechanism 40 It reaches the height corresponding to the desired finished product thickness T. Then, as shown in FIG. 7, the control mechanism 100 advances the grinding mechanism 20 by the grinding feed mechanism 30 when the height of the back surface WR of the workpiece W reaches a height corresponding to the desired finished product thickness T. Keep away from the workpiece W. Further, the control mechanism 100 supplies the pressurized gas from the air supply source 44 to the cylinder 45 so that the front end portion 42a of the measuring arm 42 and the contactor 43 rise more than the holding surface 10a of the holding mechanism 10, and The rotation of the holding mechanism 10 is stopped.

The control mechanism 100 thereafter moves the holding mechanism 10 from the processing position below the grinding mechanism 20 toward the loading and unloading position by the holding mechanism moving mechanism. Then, when the holding mechanism 10 is at the loading and unloading position, the control mechanism 100 stops the movement of the holding mechanism 10 by the holding mechanism moving mechanism, and releases the suction and holding of the workpiece W by the holding mechanism 10. When the workpiece W after grinding is exchanged with the workpiece W before grinding, the grinding apparatus 1 can grind the workpiece W in the same manner as the above-described steps. Further, the number of rotations for rotating the holding mechanism 10 in the preliminary measurement step is faster in the first grinding step and the second grinding step, and for example, in the embodiment, it is rotated at 300 rpm.

As described above, in the grinding method, the number of rotations (speeds) at which the holding mechanism 10 is rotated in the preliminary measurement step is smaller than the number of rotations in which the holding mechanism 10 is rotated in the first grinding step and the second grinding step ( Speed) is still slow. Further, in the grinding method, since the number of rotations (speeds) for rotating the holding mechanism 10 in the preliminary measurement step is as slow as possible, it is formed so as not to be processed at different heights before grinding. The speed at which the contactor 43 passing over the back surface WR of the object W is broken. Furthermore, in the embodiment, in the preliminary measurement step The number of revolutions (speed) at which the holding mechanism 10 is rotated is the slowest number of revolutions (speed) within a possible range. However, in the present invention, the number of rotations (speed) at which the holding mechanism 10 is rotated in the preliminary measurement step is slower than the number of rotations that can be used in the first grinding step and the second grinding step, and even if The number of revolutions (speed) at which the contactor 43 is not damaged by contact with the workpiece W may be used.

As described above, in the grinding method of the present embodiment, the height of the back surface WR of the workpiece W before grinding is measured while the holding mechanism 10 is rotated at a relatively slow speed in the preliminary measurement step. Further, in the preliminary measurement step, after the height of the back surface WR of the lowest workpiece W is detected, the contactor 43 is temporarily retracted in the first grinding step, and the grinding mechanism 20 performs the grinding mechanism 20 Grinding is performed until the height of the back surface WR of all the workpieces W coincides with the object W having the lowest height of the back surface WR. Therefore, it is possible to suppress the contactor 43 from contacting the outer surface of the workpiece W that is rotated at a high speed, and the like, and it is possible to suppress the damage of the contactor 43. According to this, in the grinding method, when a plurality of workpieces W are simultaneously held by the holding mechanism 10 and ground, even if there is a height deviation V of the back surface WR of the workpiece W, the contactor 43 can be prevented from being damaged.

Further, in the second grinding step after the first grinding step has been performed, the contactor 43 is brought into contact with the back surface WR of the workpiece W, and the workpiece W is detected by the height measuring mechanism 40. The height of the back surface WR is ground. Therefore, the grinding method can suppress breakage of the contactor 43, and form the desired thickness T of the workpiece W.

Further, the grinding device 1 is provided with two contactors 43, and the two contactors 43 are arranged at intervals of W1, and the interval W1 is maintained to be maintained. The rotation axis A of the mechanism 10 is arranged on the circumference of the center, and the interval W2 in the circumferential direction of the adjacent workpiece W is also large. Further, the interval W1 between the two contactors 43 is formed to be much smaller than the interval W3 between the point P at which the outer edge of the back surface WR of the workpiece W crosses the circumference C. Therefore, when the contactor 43 on one side of the grinding is located between the plurality of workpieces W, the contactor 43 on the other side must be in contact with the back surface WR of any one of the workpieces W to be measurable. Therefore, even in the case where a plurality of workpieces W are simultaneously held and ground, there is no situation in which the contactor 43 is dropped between the workpiece W or stuck to the workpiece W, and The contactor 43 is stabilized so as to be in contact with the back surface WR of the workpiece W to measure the thickness of the workpiece W.

In the grinding apparatus 1 including the suppression falling mechanism that suppresses the contactor 43 from falling between the workpieces W, it is possible to suppress the contactor 43 from contacting the outer surface of the workpiece W that is rotated at a high speed. Etc., it is possible to suppress the damage of the contactor 43.

[Modification 1]

Next, a method of grinding a workpiece according to a first modification of the embodiment of the present invention will be described with reference to the drawings. FIG. 8 is a side view of a holding mechanism, a height measuring mechanism, and the like of the grinding apparatus used in the grinding method of the workpiece according to the embodiment. In FIG. 8, the same portions as those in the embodiment are denoted by the same reference numerals and will not be described.

In the grinding apparatus 1 used in the grinding method according to the first modification of the embodiment, only one contactor 43 is attached to the front end portion 42a of the measuring arm 42 of the height measuring mechanism 40, and the contactor 43 is provided. Under the contact portion 48 The end is provided with parallel contact portions 49. The parallel contact portion 49 includes a linear parallel portion 49a parallel to the holding surface 10a of the holding mechanism 10, and a warped portion 49b connected to both ends of the parallel portion 49a. The parallel portion 49a (that is, the parallel contact portion 49) is formed to be longer than the interval W2 of the workpiece W adjacent to the holding mechanism 10. The warpage portion 49b is warped so as to gradually fall upward from both ends of the parallel portion 49a to suppress the contact portion 48 from falling between the plurality of workpieces W. Forming the parallel portion 49a (i.e., the parallel contact portion 49) to be longer than the interval W2 of the adjacent workpiece W constitutes a suppression drop of the contactor 43 falling between the workpieces W. mechanism. The grinding apparatus 1 used in the grinding method of Modification 1 may include a drop prevention mechanism.

The grinding method according to the first modification of the embodiment is a grinding apparatus 1 using the height measuring mechanism 40 having the above configuration, and includes a holding step, a preliminary measurement step, a retracting step, a first grinding step, and a second grinding. step. According to the grinding method of the first modification of the embodiment, the contactor 43 can be prevented from coming into contact with the outer surface of the workpiece W that is rotated at a high speed, and the contactor 43 can be prevented from being damaged. According to this, in the grinding method, when the plurality of workpieces W are simultaneously held by the holding mechanism 10 and ground, the contactor 43 of the contactor can be prevented from being damaged even if there is a height deviation V of the back surface WR of the workpiece W. The situation.

Further, in the grinding apparatus 1 used in the grinding method according to the first modification of the embodiment, since the measuring arm 42 of the height measuring mechanism 40 includes the parallel contact portion 49, the measuring arm 42 of the height measuring mechanism 40 does not Will fall between the workpiece W, that is, there will be no doubt that it will be damaged, and the workpiece can be processed. The thickness of W is formed as the finished thickness T. Further, the contactor 43 can be stabilized to contact the back surface WR of the workpiece W to measure the thickness of the workpiece W.

[Modification 2]

Next, a method of grinding a workpiece according to a second modification of the embodiment of the present invention will be described with reference to the drawings. Fig. 9 is a plan view showing a holding mechanism, a height measuring mechanism, and the like of the grinding apparatus used in the grinding method of the workpiece according to the embodiment. In FIG. 9, the same portions as those in the embodiment will be denoted by the same reference numerals and will not be described.

In the grinding apparatus 1 used in the grinding method of the second modification of the embodiment, as shown in Fig. 9, the contactor 43 attached to the front end portion 42a of the measuring arm 42 of the height measuring mechanism 40 is provided with only one. . Further, in the grinding method according to the second modification of the embodiment, the grinding device 1 having the height measuring mechanism 40 having the above configuration is used, and includes a holding step, a preliminary measuring step, a retreating step, a first grinding step, and a second grinding. Cutting steps. In the holding step of the grinding method according to the second modification of the embodiment, the workpiece W is held without gaps in the holding member M so that the interval W2 between the adjacent workpieces W becomes larger than the contact portion. The width on the circumference C of 48 is also small to arrange and hold the plurality of workpieces (shown in Fig. 9) in a seamless manner on the holding surface 10a. The workpiece W is held in the holding member M without a gap so that the interval W2 between the adjacent workpieces W becomes smaller than the width on the circumference C of the contact portion 48, and the falling mechanism is suppressed. The grinding apparatus 1 used in the grinding method of Modification 2 includes a suppression drop mechanism.

According to the grinding method of the second modification of the embodiment, in the same manner as the embodiment, the plurality of workpieces W are simultaneously held by the holding mechanism 10 In the case of grinding, even if there is a height deviation V of the back surface WR of the workpiece W, the contactor 43 can be prevented from being damaged. Further, in the grinding method according to the second modification of the embodiment, since the plurality of workpieces W are held on the holding surface 10a without gaps in the holding step, the measuring arm 42 of the height measuring mechanism 40 does not exist. The thickness of the workpiece W can be measured by contacting the back surface WR of the workpiece W with a fear of breakage.

Further, in the present invention, the grinding apparatus 1 may include a plurality of holding mechanisms 10 and a grinding mechanism 20. In the present invention, the control mechanism 100 can also be controlled to calculate the difference between the height position measured in the grinding and the height position of the holding surface 10a of the holding mechanism 10 by the height measuring mechanism 40 before grinding. Then, the thickness of the workpiece W is obtained from the difference, and is ground until it reaches the desired thickness T of the finished product.

Further, in the present invention, when the outer diameter of the holding surface 10a of the holding mechanism 10 is formed to be substantially equal to the outer diameter of the workpiece W or the holding member M, it is additionally provided to have one contact with the outer circumference of the holding surface 10a. A height measuring mechanism (not shown) of the contactor of the outer peripheral portion 10b (shown in Fig. 2 and the like). The control mechanism 100 can also make the contactor of the height measuring mechanism separately provided in the grinding contact with the outer peripheral portion 10b, and always measure the height position of the holding mechanism 10 to determine the processed value from the measured value or the like. The thickness of the object W.

Furthermore, the present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the spirit and scope of the invention.

1‧‧‧ grinding device

10‧‧‧ Keeping institutions

10a‧‧‧ Keep face

40‧‧‧ Height measuring agency

41‧‧‧ Body Department

42‧‧‧ Measuring arm

42a‧‧‧ front end

43‧‧‧Contactor

46‧‧‧needle support members

47‧‧‧Parallel

48‧‧‧Contacts

48a‧‧‧Contact points

A‧‧‧Rotary axis

M‧‧‧ holding components

W‧‧‧Processed objects

WR‧‧‧Back (upper surface)

WS‧‧‧ surface

V‧‧‧ Deviation

Claims (1)

A grinding method of a workpiece, which is a grinding method for simultaneously grinding a workpiece, characterized in that it uses a grinding device including a rotating shaft that is orthogonal to a holding surface that holds the workpiece a holding mechanism for mounting a grinding wheel for grinding a grinding wheel of an upper surface of the workpiece held by the holding mechanism, and approaching and moving the grinding mechanism in a direction orthogonal to the holding surface a grinding feed means, and a height measuring mechanism for measuring a height of an upper surface of the workpiece to be ground by the grinding mechanism, the method of grinding the workpiece comprising: a holding step, the holding of the holding mechanism Arranging and holding a plurality of workpieces having a size smaller than the holding surface; preparing a measuring step, after the holding step is performed, the contact mechanism of the height measuring mechanism is brought into contact with the upper surface of the workpiece to make the holding mechanism Rotating to measure the height of a plurality of workpieces and finding the lowest height; the retreating step, after performing the preliminary measurement step, moving the contactor away from the upper surface of the workpiece After the first grinding step, after the retreating step has been performed, the holding mechanism is rotated and the grinding feed mechanism is actuated to grind the workpiece by the grinding wheel until the grinding wheel is positioned to be utilized The height measuring mechanism measures the lowest height position of the workpiece, and the heights of the plurality of workpieces are consistent; In the second grinding step, after the first grinding step is performed, the retracted contactor is brought into contact with the upper surface of the workpiece, and the workpiece is ground by the grinding mechanism while rotating the holding mechanism until The height of the workpiece measured by the height measuring mechanism reaches the desired thickness of the finished product, and the speed at which the holding mechanism rotates in the preliminary measuring step is slower than the speed at which the holding mechanism rotates in the first grinding step. And the speed at which the contactor passing through the upper surface of the workpiece of different heights is not broken.