TWI651163B - Grinding method - Google Patents

Abstract

The object of the present invention is to shorten the grinding time. The solution is to have the following steps: preparing the grinding step, grinding the plate-shaped workpiece with the grinding component before reaching the thickness of the finished product; determining the thickness of the plate-shaped workpiece after the preliminary grinding by the thickness measuring step; Calculating the amount of change of the distance between the holding surface of the working chuck and the grinding surface of the fine grinding stone before and after the tilt adjustment of the working chuck, and the height adjusting step according to the thickness of the measured plate-shaped workpiece; In the state where the grinding surface has contacted the upper surface of the plate-shaped workpiece, the inclination of the working table is adjusted while adjusting the height of the fine grinding assembly, so that the relative moving speed of the fine grinding stone and the plate-shaped workpiece becomes zero. .

Description

Grinding method Field of invention

The present invention relates to a grinding method in which the thickness of a plate-like workpiece is measured while being ground to a desired thickness.

Background of the invention

In the grinding process, a method of measuring the thickness of a plate-like workpiece by a contact height gauge and grinding it is known (see, for example, Patent Document 1). The contact type height gauge is such that a pair of contactors contacts the upper surface of the plate-like workpiece and the upper surface of the working chuck, and the thickness of the plate-shaped workpiece is detected by the difference in height of the contact position. Moreover, as a grinding method of a bonded workpiece composed of a plurality of plate-shaped workpieces, a method of grinding while measuring the thickness of the workpiece on the upper side of the grinding target by a non-contact thickness measuring unit is known ( Refer to, for example, Patent Document 2). The non-contact thickness measuring unit detects the thickness of the plate-like workpiece from the optical path difference of the laser light reflected from the upper surface and the lower surface of the upper workpiece.

In addition, a method of grinding the thickness of the plate-like workpiece while measuring the thickness of the plate-shaped workpiece is also known (see, for example, Patent Document 3). In this grinding method, the protective tape is included in the contact height gauge during rough grinding. The rough grinding amount is adjusted while adjusting the total thickness of the plate-shaped workpiece of thickness. Then, at the time of finish grinding, the amount of the fine grinding is controlled while measuring the thickness of the plate-like workpiece by the non-contact thickness measuring unit. Moreover, in addition to the above-described grinding method, the inclination of the working clamp relative to the grinding assembly is adjusted according to the measured thickness of the plate-shaped workpiece, and the method of grinding the plate-shaped workpiece at an equal thickness is also It is known (refer to, for example, Patent Document 4).

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2008-073785

Patent Document 2: Japanese Patent Laid-Open Publication No. 2008-264913

Patent Document 3: Japanese Patent Laid-Open Publication No. 2007-335458

Patent Document 4: Japanese Patent Laid-Open Publication No. 2013-119123

Summary of invention

In the grinding method described in Patent Document 4, in order to adjust the inclination of the work chuck, the thickness of the predetermined position of the plate-like workpiece is measured in a state where the grinding assembly is retracted (raised) from the work chuck. Then, the tilt of the work chuck is adjusted based on the measurement result. Therefore, the moving distance of the grinding assembly to the grinding start position becomes long, and the grinding process takes a long time.

Further, in the case where the thickness of the plate-like workpiece is not measured, the inclination of the upper surface of the working chuck is adjusted after the grinding grindstone is retracted from the working table. Then, the height of the upper surface of the working clamp is measured again, and the height of the upper surface before and after the tilt is adjusted according to The difference is used to calculate the grinding feed. In this way, since the measurement is performed twice before and after the tilt adjustment, it takes a lot of time to calculate the grinding feed amount. Accordingly, in addition to the increase in the moving distance of the grinding assembly, it takes a lot of time for the grinding process.

The present invention has been made in view of the above, and it is an object of the invention to provide a grinding method which can shorten the grinding time.

The grinding method of the present invention is a grinding method using a grinding device having a working chuck for holding a plate-like workpiece, and a grinding surface of the grinding grindstone abutting against a plate shape held by the working chuck The upper surface of the workpiece is ground to reduce the thickness of the grinding assembly, the grinding assembly is brought close to and away from the working clamping table, and the grinding feed assembly is ground in the grinding feed direction, and the grinding is performed by the grinding assembly. A measuring unit for measuring the thickness of the plate-shaped workpiece, a radial direction moving assembly for moving the measuring assembly in the radial direction of the working chuck, and a tilt adjusting assembly for adjusting the tilt relationship between the working chuck and the grinding assembly. The grinding method is composed of a preliminary grinding step of grinding a plate-shaped workpiece at a thickness that does not reach a predetermined thickness of the finished product by using a grinding assembly, and a thickness measuring step of moving the component in a radial direction to make the measuring component The thickness of the plate-shaped workpiece that has been ground in the preliminary grinding step is moved in the radial direction to measure the thickness in the radial direction; the calculation step is to make the thickness of the finished product in the radial direction uniform, and is determined according to the thickness. When the measurement result measured in the step is adjusted by the tilt adjustment unit to adjust the tilt relationship between the work clamp and the grinding assembly, the change is calculated. The amount of change in the distance between the upper surface of the working chuck and the grinding surface of the grinding stone; the height adjusting step, which causes the grinding feed assembly and the tilt adjusting assembly to act together according to the amount of change calculated in the calculating step, and In the tilt adjustment operation by the tilt adjustment unit, the grinding surface is maintained in contact with the ground surface of the plate-shaped workpiece in the preliminary grinding step; and the fine grinding step and the height adjustment step are performed by the measuring unit The thickness of the plate-like workpiece is ground by grinding the feed assembly with the grinding feed assembly to grind the plate-shaped workpiece to a predetermined thickness of the finished product.

According to this configuration, the grinding surface of the grinding stone located at a predetermined height with respect to the work chuck can be transferred to the plate-like workpiece through the preliminary grinding step. Therefore, by measuring the thickness of the plate-like workpiece, the distance between the upper surface of the working chuck and the grinding surface of the grinding stone can be indirectly determined. Further, from the measurement result of the thickness of the plate-like workpiece, the amount of change in the distance between the upper surface of the working chuck and the grinding surface of the grinding stone when the inclination of the working table is adjusted can be calculated. Then, according to the amount of change, the grinding unit and the tilt adjusting unit are operated together in such a manner as to maintain the contact state between the ground surface and the grinding surface of the plate-like workpiece. Therefore, the height of the grinding assembly can be adjusted in accordance with the tilt adjustment action of the work clamp. According to this, the moving distance of the grinding assembly at the time of tilt adjustment can be minimized, and the grinding time can be shortened.

The grinding method of the present invention is a grinding method using a grinding device, which has a working clamping table for holding a plate-like workpiece, and a grinding surface of the grinding stone is abutted against a plate shape held by the working clamping table. The upper surface of the workpiece is ground to reduce the thickness of the grinding assembly, the grinding assembly is brought close to and away from the working clamping table, and the grinding feed assembly is ground in the grinding feed direction, and the grinding is performed for measurement. a measuring assembly for the thickness of the plate-shaped workpiece to be ground by the assembly, a radial direction moving assembly for moving the measuring assembly in the radial direction of the working clamping table, and a tilt adjusting assembly for adjusting the tilt relationship between the working clamping table and the grinding assembly . The grinding method is composed of a preliminary grinding step of grinding a plate-shaped workpiece at a thickness that does not reach a predetermined thickness of the finished product by using a grinding assembly, and a thickness measuring step of moving the component in a radial direction to make the measuring component The thickness of the plate-shaped workpiece that has been ground in the preliminary grinding step is moved in the radial direction to measure the thickness in the radial direction; the calculation step is to make the thickness of the finished product in the radial direction uniform, and is determined according to the thickness. When the tilting adjustment unit adjusts the tilt relationship between the work chuck and the grinding assembly by the measurement result measured in the step, the amount of change in the distance between the upper surface of the changing work chuck and the grinding surface of the grinding grindstone is calculated; An adjustment step of causing the grinding feed assembly and the tilt adjustment assembly to operate together according to the amount of change calculated in the calculation step, and maintaining the grinding feed rate of the grinding assembly with the grinding feed assembly; and the fine grinding step, height After the adjustment step, the plate-shaped workpiece is ground to the pre-set by grinding the feed assembly with the grinding feed assembly while measuring the thickness of the plate-like workpiece with the measuring assembly. Until the thickness of the finished product.

According to this configuration, the grinding surface of the grinding stone located at a predetermined height with respect to the work chuck can be transferred to the plate-like workpiece through the preliminary grinding step. Therefore, by measuring the thickness of the plate-like workpiece, the distance between the upper surface of the working chuck and the grinding surface of the grinding stone can be indirectly determined. Moreover, it is possible to calculate from the thickness measurement result of the plate-shaped workpiece that the work clamp has been adjusted. The amount of change in the distance between the upper surface of the working chuck and the grinding surface of the grinding stone when tilted. Then, based on the amount of change, the grinding unit and the tilt adjusting unit are operated together so that the relative moving speed of the grinding stone and the plate-like workpiece becomes the grinding feed speed. That is, the tilt of the work chuck can be adjusted while grinding the plate-like workpiece. According to this, the tilt adjustment time can be effectively utilized, and the grinding time can be shortened.

According to the present invention, the amount of movement of the grinding assembly can be minimized, and the grinding time can be shortened.

1‧‧‧ grinding device

10‧‧‧Abutment

11, 12 ‧ ‧ column

13‧‧‧ films

15‧‧‧ piece robot

16‧‧‧Machine arm

17‧‧‧Hands

20‧‧‧ Positioning agency

21‧‧‧Premium

22‧‧‧Locating pin

25‧‧‧ Washing agency

30‧‧‧ Moving into the component

31‧‧‧ moving into the arm

32‧‧‧Moving into the mat

35‧‧‧Removing components

36‧‧‧Withdrawal arm

37‧‧‧ Moving out of the mat

40‧‧‧ turntable

41‧‧‧Working table

42‧‧‧ Keep face

43‧‧‧ tilt adjustment assembly

43a‧‧‧ movable column

43b‧‧‧Fixed column

50, 70‧‧‧ grinding feed components

51, 71‧‧‧ rails

52‧‧‧Z-axis abutment

53, 73‧‧‧ shell

54, 74‧‧‧ Ball screw

55, 75‧‧‧ drive motor

60‧‧‧ rough grinding components

63‧‧‧ coarse grinding stone

64, 84‧‧‧ grinding wheel

67, 82‧‧‧ Mounting

80‧‧‧ fine grinding components (grinding components)

83‧‧‧ fine grinding stone

83a‧‧‧ grinding surface

85‧‧‧Upper surface height measuring component

86‧‧‧Contactor

88‧‧‧ Thickness measurement components

89‧‧‧Winning arm (moving component in radial direction)

W‧‧‧plate workpiece

Wa‧‧‧outweek

Wb‧‧‧ Central

X, Y, Z‧‧ Direction

Fig. 1 is a perspective view of a grinding apparatus of the embodiment.

Fig. 2 is a schematic view showing the periphery of a fine grinding position of the grinding apparatus of the embodiment.

3A to 3D are explanatory views of a first operation pattern of the grinding method of the embodiment.

4A to 4D are explanatory views of a second operation pattern of the grinding method of the embodiment.

5A to 5D are explanatory views of a third operation pattern of the grinding method of the embodiment.

Form for implementing the invention

Hereinafter, the grinding device will be described with reference to the drawings. Fig. 1 is a perspective view of a grinding apparatus of the embodiment. Further, in the present embodiment, the configuration shown in Fig. 1 is not limited. Grinding device as long as it can be used on the board The grinding of the workpiece is performed in any form.

As shown in Fig. 1, the grinding device 1 is a full auto type processing device, and is configured to carry out processing, rough grinding, fine grinding, and cleaning of the plate-shaped workpiece W. A series of operations formed by the processing and unloading processes are implemented in a fully automated manner. The plate-shaped workpiece W is formed in a substantially disk shape, and is formed of a semiconductor substrate such as tantalum or gallium arsenide or an inorganic material substrate such as ceramics, glass or sapphire, or a package substrate of a semiconductor product.

On the front side of the base 10 of the grinding apparatus 1, a pair of sheets 13 in which a plurality of plate-like workpieces W are accommodated are placed. Behind the pair of cassettes 13, a sheet cassette robot 15 that takes out the sheet-like workpiece W to the sheet cassette 13 is provided. The both sides of the cassette robot 15 are provided with a positioning mechanism 20 for positioning the plate-shaped workpiece W before grinding, and a cleaning mechanism 25 for washing the ground plate-shaped workpiece W. Between the positioning mechanism 20 and the cleaning mechanism 25, a loading unit 30 that carries the plate-shaped workpiece W before grinding into the working table 41 and a plate-shaped workpiece W that has been ground from the working table 41 are provided. Move out component 35.

The cassette robot 15 is configured by providing a hand portion 17 on the front end of the robot arm 16 formed by the multi-section link. The cassette robot 15 transports the ground plate-shaped workpiece W from the sheet cassette 13 to the cassette mechanism 13 from the sheet cleaning unit 25, in addition to the sheet-like workpiece W before the grinding. The positioning mechanism 20 is configured by arranging a plurality of positioning pins 22 that can advance and retreat with respect to the center of the temporary table 21 around the temporary table 21. In the positioning mechanism 20, the center of the plate-like workpiece W is positioned to the center of the temporary stage 21 by abutting the plurality of positioning pins 22 against the outer periphery of the plate-like workpiece W that has been placed on the temporary stage 21. .

The loading unit 30 is configured by providing a loading pad 32 on the front end of the carrying arm 31 that can be wound around the base 10. In the loading unit 30, the plate-like workpiece W is lifted from the temporary stage 21 by loading the pad 32, and the plate-shaped workpiece W is carried into the working table by winding the loading pad 32 by the loading arm 31. 41. The carry-out unit 35 is configured by providing a carry-out pad 37 on the front end of the carry-out arm 36 that can be wound around the base 10. In the carry-out unit 35, the plate-like workpiece W is lifted from the work chuck 41 by the carry-out pad 37, and the plate-like workpiece W is lifted from the work chuck 41 by the carry-out arm 36 winding the carry-out pad 37. Move out.

The cleaning mechanism 25 is configured by providing various nozzles (not shown) that spray washing water and dry air toward a turntable (not shown). In the cleaning mechanism 25, the rotary table holding the plate-like workpiece W is lowered into the base 10, and the washing water is sprayed into the base 10 to rotate the plate-shaped workpiece W, and then the dry air is blown. The plate-shaped workpiece W is dried. Behind the carry-in unit 30 and the carry-out unit 35, a turntable 40 for arranging the three work chucks 41 at equal intervals in the circumferential direction is provided.

On the upper surface of the working chuck 41, a holding surface 42 is formed by a porous ceramic material (see Fig. 2). The holding surface 42 is formed in a conical shape having a slightly lower outer circumference with the rotation center of the working chuck 41 as an apex (see FIG. 2). When the holding plate-shaped workpiece W is sucked on the holding surface 42, the plate-like workpiece W also forms a gently inclined conical shape along the holding surface 42. The work chuck 41 adjusts the tilt with respect to the coarse grinding unit 60 and the fine grinding unit (grinding unit) 80 through the tilt adjusting unit 43 (refer to FIG. 2). The tilt adjustment unit 43 will be described later.

By intermittently rotating the turntable 40 at intervals of 120 degrees, the loading and unloading position for loading and unloading the plate-like workpiece W, the rough grinding position facing the rough grinding assembly 60, and the fine grinding assembly can be sequentially positioned. 80 pairs of fine grinding positions. In the rough grinding position, the plate-like workpiece W on the working chuck 41 is coarsely ground to a predetermined thickness by the coarse grinding assembly 60. In the fine grinding position, the plate-like workpiece W on the working chuck 41 is finely ground to the finished thickness by the fine grinding assembly 80. In the vicinity of the rough grinding position and the fine grinding position, the column portion 11 supporting the coarse grinding assembly 60 and the column portion 12 supporting the fine grinding assembly 80 are erected upright.

In front of the column portion 11, a grinding feed assembly 50 for grinding the feed in the grinding feed direction is provided with the coarse grinding assembly 60 approaching and away from the work chuck 41. In the grinding feed unit 50, a pair of guide rails 51 (only one shown) parallel to the Z-axis direction are disposed on the front surface of the column portion 11, and the Z-axis base 52 driven by the motor is slidably disposed in a pair. The guide rail 51 is constructed. On the front side of the Z-axis base 52, a coarse grinding assembly 60 is supported through the housing 53. A ball screw 54 is screwed to the back side of the Z-axis base 52, and a drive motor 55 is coupled to one end of the ball screw 54. The coarse grinding assembly 60 can be moved along the guide rail 51 in the Z-axis direction by rotationally driving the ball screw 54 with the drive motor 55.

On the front side of the column portion 12, a grinding feed assembly 70 for grinding the feed in the grinding feed direction is provided with the fine grinding assembly 80 approaching and away from the work chuck 41. In the grinding feed unit 70, a pair of guide rails 71 (only one shown) parallel to the Z-axis direction are disposed on the front surface of the column portion 12, and a Z-axis base (not shown) for driving the motor is slidably It is configured to be disposed on a pair of guide rails 71. In front of the Z-axis abutment, a fine grinding assembly 80 is supported through the housing 73. In Z A ball screw 74 is screwed to the back side of the shaft base, and a drive motor 75 is coupled to one end of the ball screw 74. By rotating the ball screw 74 by the drive motor 75, the fine grinding assembly 80 can be moved along the guide rail 71 in the Z-axis direction.

The rough grinding unit 60 and the fine grinding unit 80 are configured by providing the mounts 62 and 82 at the lower end of the cylindrical main shaft. A grinding wheel 64 for rough grinding in which a plurality of rough grinding stones 63 are arranged in a ring shape may be attached to the lower surface of the mount 62 of the rough grinding unit 60. The rough grinding grindstone 63 is composed of, for example, a diamond grindstone in which diamond abrasive grains are fixed by a bonding agent such as a metal binder or a resin binder. Further, a grinding wheel 84 in which a plurality of fine grinding stones 83 are arranged in a ring shape may be attached to the lower surface of the mount 82 of the fine grinding unit 80. The fine grinding stone 83 is formed of abrasive grains having a finer grain size than the coarse grinding stone 63.

Further, at the rough grinding position, a contact type upper surface height measuring unit 85 which is adjacent to the rough grinding unit 60 to measure the height of the upper surface of the plate-like workpiece W is provided. The upper surface height measuring unit 85 is a contact type height gauge, and the contactor 86 is brought into contact with the upper surface of the plate-like workpiece W to detect the height of the upper surface of the plate-like workpiece W from the height of the contact position. Further, in the fine grinding position, a non-contact thickness measuring assembly 88 adjacent to the fine grinding assembly 80 to measure the thickness of the plate-like workpiece W is provided. The thickness measuring unit 88 irradiates the plate-shaped workpiece W with laser light, and measures the thickness of the plate-like workpiece W from the optical path difference of the laser light reflected on the upper surface and the lower surface of the plate-shaped workpiece W.

Further, a control unit 90 that integrally controls each part of the grinding apparatus 1 is provided in the base 10. The control unit 90 performs coarse grinding control of the coarse grinding assembly 60, fine grinding control of the fine grinding assembly 80, thickness measurement control of the plate-shaped workpiece W, and tilt adjustment control of the working chuck 41 of the tilt adjusting assembly 43. Various controls such as. Furthermore, the control unit 90 is constituted by a processor, a memory, or the like that performs various processes. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) or a RAM (Random Access Memory) depending on the application. In the memory, the rough grinding amount, the thickness measurement result of the plate-shaped workpiece W, the finished product thickness of the target plate-shaped workpiece W, the tilt adjustment amount of the work chuck 41, and the like can be temporarily stored.

In the grinding apparatus 1, the plate-like workpiece W is conveyed from the inside of the cassette 13 to the positioning mechanism 20, and the positioning mechanism 20 centers the plate-shaped workpiece W. Next, the plate-like workpiece W is carried onto the work chuck 41, and the plate-shaped workpiece W is positioned to the rough grinding position and the fine grinding position by the rotation of the turntable 40. In the rough grinding position, coarse grinding is performed while measuring the upper surface height of the plate-like workpiece W on the upper surface height measuring unit 85, and the plate-shaped workpiece W is ground to a predetermined thickness by the coarse grinding unit 60. The amount of grinding is up. In the fine grinding position, the thickness of the plate-like workpiece W is measured at a plurality of positions after the plate-shaped workpiece W is preliminarily ground to a thickness that does not reach the thickness of the finished product. Then, based on the measurement result of the thickness, the inclination of the work chuck 41 is finely adjusted while the fine grinding unit 80 and the tilt adjustment unit 43 are operated together. After the tilt adjustment, the plate-like workpiece W can be ground to the finished thickness, and the plate-like workpiece W can be formed into an equal thickness.

Hereinafter, the configuration of the grinding unit and the work chuck according to the present embodiment will be described with reference to Fig. 2 . Fig. 2 is a schematic view showing the periphery of a fine grinding position of the grinding apparatus of the embodiment. Further, Fig. 2 shows a state in which the plate-like workpiece after the rough grinding is finished is positioned to the fine grinding position.

As shown in FIG. 2, the work chuck 41 is disposed to be rotatable on the turntable 40 by the tilt adjustment assembly 43. The tilt adjustment unit 43 is formed by two movable columns 43a (only one is shown) and one fixed post 43b, and supports the vicinity of the outer periphery of the work chuck 41 at three points. The movable column 43a is constituted by, for example, an electric actuator. In the tilt adjusting unit 43, the working chuck 41 is tilted with the fixed post 43b as a fulcrum by the vertical movement of the two movable columns 43a. For example, at the time of the finish grinding, the two movable columns 43a are actuated so that the grinding surface 83a of the fine grinding stone 83 and the holding surface 42 of the work chuck 41 are parallel, thereby adjusting the work. The tilt of the clamping table 41. A fine grinding assembly 80 is disposed above the turntable 40. The work chuck 41 will be positioned such that the grinding stone 83 passes through the center of the plate-like workpiece W. The fine grinding unit 80 causes the grinding surface 83a of the grinding stone 83 to abut against the upper surface of the plate-like workpiece W held by the working chuck 41 to reduce the thickness of the plate-like workpiece W.

On the side of the fine grinding assembly 80, a thickness measuring unit 88 for measuring the thickness of the plate-like workpiece W is provided. The thickness measuring unit 88 is a front end of a winding arm (radial direction moving unit) 89 that is disposed around a predetermined position on the outer circumference of the turntable 40 as a fulcrum. The winding arm (radially moving component) 89 constitutes a radial direction moving component in the patent application, and the thickness measuring component 88 is spliced by a winding arm (radial direction moving component) 89 to be applied to the plate-shaped workpiece W. The upper direction moves in the radial direction. Moreover, the thickness measuring unit 88 irradiates the plate-shaped workpiece W with laser light, and calculates the thickness of the plate-shaped workpiece W based on the optical path difference of the laser light reflected on the upper and lower surfaces of the plate-shaped workpiece W. The thickness measurement is performed at three positions in the vicinity of the center of the work chuck 41, in the vicinity of the outer circumference of the work chuck 41, and between the center and the outer circumference. Furthermore, in this embodiment In the state, the configuration in which the thickness of the plate-like workpiece W is measured at three positions will be described, but the configuration is not limited thereto. The measurement position may be any number of positions as long as it is two or more.

The thickness measuring assembly 88, the grinding feed assembly 70, and the tilt adjustment assembly 43 are coupled to the control assembly 90. The thickness of the plate-like workpiece W measured by the thickness measuring unit 88 is output to the control unit 90. Further, the control unit 90 calculates the holding surface 42 of the working chuck 41 and the fine grinding when the inclination relationship between the working chuck 41 and the fine grinding unit 80 has been adjusted from the measured thickness measurement results at the three positions measured. The amount of change in the distance of the grinding surface 83a of the grindstone 83. That is, the position can be measured from three points in the radial direction to recognize the inclination of the work chuck 41.

The control unit 90 controls the amount of driving of the movable column 43a of the tilt adjusting unit 43 and the feed amount of the grinding feed unit 70 in accordance with the amount of change. After the tilt adjustment, the control unit 90 monitors the grinding feed amount of the grinding feed unit 70 while monitoring the thickness of the plate-like workpiece W by the thickness measuring unit 88 until the predetermined thickness of the plate-shaped workpiece W is reached. Furthermore, the thickness of the finished product of the predetermined plate-shaped workpiece W is stored in the memory of the control unit 90.

Next, a grinding method performed by the first operation type will be described. 3A to 3D are explanatory views of a first operation pattern of the grinding method of the embodiment. 4A to 4D are explanatory views of a second operation pattern of the grinding method of the embodiment.

As shown in FIG. 3A to FIG. 3D, in the grinding method of the present embodiment, the preliminary grinding step, the thickness measuring step, and the calculation are performed at the fine grinding position. The step, the height adjustment step, and the fine grinding step are performed in this order. Further, the grinding feed speed of the fine grinding assembly 80 at the fine grinding position is relatively slow with respect to the grinding feed speed of the coarse grinding assembly 60 (refer to FIG. 1) at the rough grinding position. Therefore, in the grinding method of the present embodiment, the time required for the entire grinding step can be shortened by shortening the operation time at the fine grinding position as much as possible.

Before positioning the plate-shaped workpiece W to the fine grinding position, first, a rough grinding step (refer to FIG. 1) is performed at the rough grinding position. In the rough grinding step, rough grinding is performed while measuring the height of the upper surface of the plate-like workpiece W, and the plate-shaped workpiece W is coarsely ground until the target rough grinding amount is reached. Further, in the rough grinding step, the inclination of the work chuck 41 is adjusted such that the grinding surface of the rough grinding unit 60 and the holding surface 42 of the work chuck 41 are parallel. However, errors may be included in the parallelism of the ground surface of the rough grinding assembly 60 and the retaining surface 42 of the working chuck 41. According to this, the plate-like workpiece W after the rough grinding has an uneven thickness distribution. In the first operation type, the plate-shaped workpiece W in which the central portion is formed thin by the rough grinding step and the outer peripheral portion is formed thick is described.

After the rough grinding step is completed, the plate-like workpiece W is positioned from the rough grinding position to the fine grinding position by intermittent rotation of the turntable 40. At this time, the work chuck 41 maintains the tilt state at the time of rough grinding as it is, and is positioned to the fine grinding position. However, on the rough grinding unit 60 and the fine grinding unit 80, the contact angle of the grinding surface to the plate-like workpiece W is sometimes subtly different due to a mounting error or the like. Therefore, in the grinding method of the present embodiment, first, the preliminary grinding of the finish grinding assembly 80 is performed at the fine grinding position. step.

As shown in Fig. 3A, in the preliminary grinding step, the plate-like workpiece W is ground by a finish grinding assembly 80 at a thickness that does not reach a predetermined thickness of the finished product. Specifically, the fine grinding unit 80 is lowered while rotating, and the plate-shaped workpiece W is pre-ground by rotating the grinding surface 83a of the fine grinding stone 83 and the upper surface of the plate-shaped workpiece W. cut. Then, when the predetermined amount of grinding is reached, the feeding action of the grinding moving assembly is stopped. At this time, the grinding surface 83a comes into contact with the upper surface of the plate-like workpiece W. Further, at this time, the rotation operation of the finish grinding unit 80 can also be stopped.

In the preliminary grinding step, since only the upper surface of the plate-like workpiece W is slightly ground, the upper surface of the plate-like workpiece W can be trimmed. According to this, in the subsequent thickness measurement step, it is possible to prevent the measurement light irradiated from the thickness measuring unit 88 from being diffusely reflected on the upper surface of the plate-like workpiece W. As a result, the influence on the thickness measurement of the plate-like workpiece W can be suppressed to a minimum. Further, the surface shape of the grinding surface 83a of the fine grinding stone 83 can be transferred onto the plate-like workpiece W, and the grinding surface 83a and the upper surface of the plate-shaped workpiece W can be aligned. Thereby, the thickness of the plate-like workpiece W can be regarded as the distance between the grinding surface 83a of the fine grinding stone 83 and the holding surface 42 of the working chuck 41.

Next, a thickness measuring step is performed. As shown in FIG. 3B, in the thickness measuring step, after the grinding feed of the fine grinding unit 80 is temporarily stopped, the thickness measuring unit is made with respect to the plate-like workpiece W which has been ground in the preliminary grinding step. 88 moves in the radial direction. Thereby, the thickness of the plate-like workpiece W can be measured. Specifically, the winding arm 89 (radial direction moving unit) is wound to move the thickness measuring unit 88 from the center of the plate-like workpiece W toward the outer circumference. At this time, the thickness measuring unit 88 measures the thickness of the plate-like workpiece W at any three positions in the radial direction of the plate-like workpiece W.

Next, the calculation step is carried out. In the calculation step, the amount of change in the distance between the holding surface 42 and the grinding surface 83a before and after the tilt adjustment is calculated based on the measurement result measured in the thickness measurement step. The distance between the holding surface 42 and the grinding surface 83a is different depending on the three positions measured, so that the inclination of the working chuck 41 can be recognized from the measurement result. Further, from the inclination, the amount of change in the distance between the holding surface 42 and the grinding surface 83a required to make the holding surface 42 and the grinding surface 83a parallel can be calculated. In other words, the amount of change in the distance between the holding surface 42 and the grinding surface 83a required to process the plate-like workpiece W into a uniform thickness can be calculated from the thickness measurement result of the plate-like workpiece W.

Next, a height adjustment step is performed. As shown in FIG. 3C, in the height adjustment step, the grinding feed unit 70 and the tilt adjustment unit 43 are operated together based on the amount of change in the distance between the holding surface 42 and the grinding surface 83a calculated in the calculation step. At this time, the rotation of the fine grinding unit 80 and the work chuck 41 can also be stopped. In the state shown in Fig. 3C, since the outer circumference becomes thicker than the center of the plate-like workpiece W, the movable column 43a of the tilt adjusting member 43 is raised to increase the amount of grinding of the outer peripheral portion. As the movable column 43a rises, the fine grinding assembly 80 can be raised by an amount corresponding to the rising of the holding surface 42 of the work chuck 41. For example, the distance at which the outer circumference Wa of the upper surface of the plate-shaped workpiece W rises is the rising distance of the finish grinding unit 80 in accordance with the amount of rise of the movable column 43a.

At this time, the fine grinding assembly 80 will conform to the movement of the movable column 43a. On the other hand, it rises at the same speed as the rising speed of the movable column 43a. For example, the speed at which the outer circumference Wa of the upper surface of the plate-like workpiece W rises according to the rising speed of the movable column 43a is the ascending speed of the fine grinding unit 80. That is, the moving speed (feeding speed) of the fine grinding unit 80 and the moving speed of the movable column 43a of the tilt adjusting unit 43 can be controlled so that the relative movement speed of the fine grinding stone 83 and the plate-like workpiece W becomes zero. Thereby, in the tilt adjustment operation, the grinding surface 83a is maintained in contact with the vicinity of the outer periphery of the upper surface (ground surface) of the plate-like workpiece W. Therefore, the amount of movement of the fine grinding unit 80 at the time of tilt adjustment can be minimized, and the time required for the tilt adjustment can be shortened. As a result of the tilt adjustment unit 43 being driven, the inclination of the work chuck 41 can be adjusted such that the grinding surface 83a and the holding surface 42 are parallel, so that the finished thickness of the plate-like workpiece W is formed to be equal.

Next, a fine grinding step is carried out. As shown in Fig. 3D, in the finish grinding step, the plate-like workpiece W is ground until a predetermined thickness of the finished product is reached. At the time of finish grinding, the fine grinding unit 80 and the working chuck 41 are rotated, and the fine grinding unit 80 is ground and fed by the grinding feed unit 70. The finish grinding is performed while measuring the thickness of the plate-like workpiece W by the thickness measuring unit 88 positioned above the outer periphery of the plate-like workpiece W. Then, when the measured value reaches the set thickness of the finished product, the grinding feed is stopped, and the finish grinding is ended. As a result, the plate-like workpiece W can be ground with an equal thickness.

Next, a second operation pattern will be described with reference to FIGS. 4A to 4D. In the second operation type, the shape of the plate-shaped workpiece after rough grinding is different from that of the first operation type. Further, in the second operation type, the plate is formed thicker by the rough grinding step and the outer peripheral portion is formed thin. The workpiece is described.

As shown in Fig. 4A, first, in the fine grinding position, a preliminary grinding step is performed to grind the plate-like workpiece W at a thickness that does not reach a predetermined thickness of the finished product. Then, as shown in FIG. 4B, the thickness measuring step is performed, and the thickness is measured at three positions of the plate-like workpiece W. Next, the calculation step is performed, and based on the measurement results measured in the thickness measurement step, the amount of change in the distance between the holding surface 42 of the work chuck 41 and the grinding surface 83a of the fine grinding stone 83 before and after the tilt adjustment is calculated.

Next, a height adjustment step is performed. As shown in FIG. 4C, in the height adjustment step, the grinding feed unit 70 and the tilt adjustment unit 43 are operated together based on the amount of change in the distance between the holding surface 42 and the grinding surface 83a calculated in the calculation step. In the state shown in Fig. 4C, as described above, since the outer circumference becomes thinner than the center of the plate-like workpiece W, the movable column 43a of the tilt adjusting member 43 is lowered to increase the amount of grinding of the central portion. . As the movable column 43a is lowered, the fine grinding assembly 80 can be lowered by an amount corresponding to the lowering of the holding surface 42 of the working chuck 41. For example, the distance at which the center Wb of the upper surface of the plate-like workpiece W is lowered in accordance with the amount of decrease in the lowering of the movable column 43a becomes the descending distance of the finish grinding unit 80.

At this time, the fine grinding unit 80 follows the movement of the movable column 43a and falls at the same speed as the descending speed of the movable column 43a (grinding feed). For example, the speed at which the center Wb of the upper surface of the plate-like workpiece W is lowered in accordance with the descending speed of the movable column 43a is the descending speed of the fine grinding unit 80. That is, the moving speed (feeding speed) of the fine grinding assembly 80 and the moving speed of the movable column 43a of the tilt adjusting assembly 43 can be controlled so that the grinding stone 83 and the plate are finely ground. The relative moving speed of the workpiece W becomes zero. Thereby, in the tilt adjustment operation, the grinding surface 83a is maintained in contact with the vicinity of the center of the upper surface (ground surface) of the plate-like workpiece W. Therefore, the amount of movement of the fine grinding unit 80 at the time of tilt adjustment can be minimized, and the time required for the tilt adjustment can be shortened. As a result of the tilt adjustment unit 43 being driven, the inclination of the work chuck 41 can be adjusted such that the grinding surface 83a and the holding surface 42 are parallel, so that the finished thickness of the plate-like workpiece W is formed to be equal.

Next, a fine grinding step is carried out. As shown in Fig. 4D, in the fine grinding step, the plate-like workpiece W is ground until a predetermined thickness of the finished product is reached. As a result, the plate-like workpiece W can be ground with an equal thickness. As described above, in the second operation type, the time required for the entire grinding step can be shortened by shortening the operation time at the fine grinding position as much as possible.

As described above, according to the first and second operational patterns of the grinding method of the present embodiment, the grinding surface 83a of the fine grinding stone 83 which is positioned at a predetermined height with respect to the working table 41 can be transmitted through the preliminary grinding step. Transfer to the plate-like workpiece W. Therefore, by measuring the thickness of the plate-like workpiece W, the distance between the holding surface 42 and the grinding surface 83a can be obtained. Moreover, the amount of change in the distance between the holding surface 42 and the grinding surface 83a when the inclination of the working chuck 41 has been adjusted can be calculated from the thickness measurement result of the plate-like workpiece W. Then, based on the amount of change, the fine grinding unit 80 and the tilt adjusting unit 88 are operated together to maintain the contact state between the upper surface (the ground surface) of the plate-like workpiece W and the grinding surface 83a. Therefore, the height of the fine grinding assembly 80 can be adjusted in accordance with the tilt adjustment operation of the work chuck 41. According to this, the moving distance of the fine grinding unit 80 at the time of tilt adjustment can be minimized, and the grinding time can be shortened.

Next, a third operation pattern of the grinding method of the present embodiment will be described with reference to Figs. 5A to 5D. The third operation type differs from the first operation type in that the inclination adjustment is performed while grinding. In the following, the main points are mainly explained in terms of different points. In addition, in the third operation type, the plate-shaped workpiece in which the central portion is formed thin and the outer peripheral portion is formed thick by the rough grinding step will be described, but the configuration is not limited thereto. It is also applicable to a plate-like workpiece in which the central portion is formed thicker and the outer peripheral portion is formed to be thin as shown in FIG.

As shown in Fig. 5A, first, in the fine grinding position, a preliminary grinding step is performed to grind the plate-like workpiece W at a thickness that does not reach a predetermined thickness of the finished product. Then, as shown in FIG. 5B, the thickness measuring step is performed, and the thickness is measured at three positions of the plate-like workpiece W. Next, the calculation step is performed, and the amount of change in the distance between the holding surface 42 of the work chuck 41 and the grinding surface 83a of the finish grinding stone 83 before and after the tilt adjustment is calculated based on the measurement result measured in the thickness measurement step.

Next, a height adjustment step is performed. As shown in FIG. 5C, in the height adjustment step, the grinding feed unit 70 and the tilt adjustment unit 43 are operated together based on the amount of change in the distance between the holding surface 42 and the grinding surface 83a calculated in the calculation step. At this time, the fine grinding unit 80 and the work chuck 41 are rotated. In the state shown in Fig. 5C, as described above, since the outer circumference becomes thicker than the center of the plate-like workpiece W, the movable column 43a of the tilt adjusting unit 43 is raised to increase the amount of grinding of the outer peripheral portion. . On the other hand, the fine grinding unit 80 presses the grinding surface 83a against the plate-like workpiece W and lowers (grinding feed) by maintaining the feed rate by the grinding feed unit 70. With this, The tilt adjustment of the work chuck 41 can be performed while grinding the plate-like workpiece W.

At this time, the feed speed of the finish grinding unit 80 is adjusted so that the lowering speed of the fine grinding unit 80 to the movable column 43a becomes a speed suitable for fine grinding. That is, the moving speed (feeding speed) of the fine grinding unit 80 and the moving speed of the movable column 43a of the tilt adjusting unit 43 can be controlled so that the relative moving speed of the fine grinding stone 83 and the plate-shaped workpiece W is equal to Grinding feed rate. For example, the grinding feed of the fine grinding unit 80 can be stopped, and the rising speed of the movable column 43a of the tilt adjusting unit 43 can be used to bring the outer circumference Wa of the upper surface of the plate-shaped workpiece W toward the same speed as the grinding feed. Fine grinding grindstone 83 grinding feed. Further, the grinding feed of the finish grinding assembly 80 may not be stopped. In this case, by making the rising speed of the movable column 43a as fast as the feeding speed of the fine grinding unit 80, the relative moving speed of the fine grinding stone 83 and the plate-like workpiece W can be made equal to the grinding speed. Give speed.

In this way, since the grinding is also performed in the tilt adjustment, the time of the tilt adjustment can be effectively utilized. Further, it is not necessary to raise the fine grinding unit 80 for the tilt adjustment, and the amount of movement can be minimized. According to this, the time required for the tilt adjustment can be shortened. As a result of the tilt adjustment unit 43 being driven, the inclination of the work chuck 41 can be adjusted such that the grinding surface 83a and the holding surface 42 are parallel, so that the finished thickness of the plate-like workpiece W is formed to be equal.

After the tilt adjustment, the feed is continued in this state and transferred to the fine grinding step. As shown in Fig. 5D, in the finish grinding step, the plate-like workpiece W is ground until a predetermined thickness of the finished product is reached. As a result, the plate-like workpiece W can be ground with an equal thickness. In this way, the third operation type is performed while grinding the plate-shaped workpiece W in the height adjustment step. The tilt adjustment of the work chuck 41 not only shortens the tilt adjustment time, but also shortens the fine grinding time in the fine grinding step. Accordingly, it is possible to shorten the time required for the entire grinding step by minimizing the operation time of the grinding device 1 (see FIG. 1) at the fine grinding position.

Furthermore, the present invention is not limited to the above embodiments, and various modifications can be made. In the above-described embodiments, the size, shape, and the like shown in the drawings are not limited thereto, and may be appropriately changed within the scope of the effects of the present invention. Further, any suitable modifications can be made without departing from the scope of the invention.

For example, in the above-described embodiment, the thickness measuring unit 88 is configured to irradiate the plate-shaped workpiece W with laser light to measure the thickness of the plate-shaped workpiece W. However, the configuration is not limited thereto. The thickness measuring unit 88 may be configured in any form as long as it can measure the thickness of the plate-shaped workpiece W.

Further, in the above-described embodiment, the configuration in which the three work chucks 41 are disposed on the turntable 40 is formed, but the configuration is not limited thereto. The turntable 40 may be provided in a plurality of working chucks 41 at equal intervals in the circumferential direction. For example, two work chucks 41 may be disposed on the turntable 40, or four or more work chucks 41 may be disposed.

Further, in the above-described embodiment, the inclination adjustment unit 43 is configured by the two movable columns 43a and the one fixing column 43b. However, the configuration is not limited thereto. The tilt adjustment unit 43 may be configured by one or three fixed columns 43b with three or more movable columns 43a, or may be configured by only three or more movable columns 43a.

Further, in the above-described embodiment, the grinding device 1 is configured to perform the first, second, and third operational modes, but the configuration is not limited thereto. The operation mode of the grinding device 1 may include the above-described preliminary grinding step, thickness measuring step, calculation step, height adjusting step, and fine grinding step.

Further, in the above-described embodiment, in the height adjustment step of the third operation type, the tilt adjustment of the work chuck 41 is performed while the fine grinding unit 80 is being ground and fed, but the configuration is not limited. This constitutes. In the height adjustment step, the grinding feed of the grinding feed unit 70 may be temporarily stopped in a state where the fine grinding unit 80 is rotated, and the tilt adjustment of the work chuck 41 may be performed. In this case, the moving speed of the movable column 43a must be set to the grinding feed speed suitable for fine grinding.

Further, in the above-described embodiment, the grinding feed assembly 70 and the tilt adjustment unit 43 are operated together in accordance with the amount of change in the distance between the holding surface 42 and the grinding surface 83a, but the configuration is not limited thereto. Composition. It is also possible to cause the grinding feed assembly 70 and the tilt adjustment unit 43 to operate together according to the amount of change in the angle formed by the holding surface 42 and the grinding surface 83a.

Industrial availability

As described above, the present invention has an effect of shortening the grinding time, and is particularly useful for a grinding method in which the thickness of the plate-like workpiece is measured while being ground to a desired thickness.

Claims (2)

A grinding method is a grinding method using a grinding device, the grinding device is provided with a working clamping table for holding a plate-shaped workpiece, and the grinding surface of the grinding stone is abutted against the plate-shaped workpiece held by the working clamping table Grinding assembly for reducing the thickness of the upper surface, causing the grinding assembly to approach and away from the working clamping table, grinding the feeding grinding feed assembly in the grinding feed direction, measuring the grinding assembly a measuring component for the thickness of the ground plate-shaped workpiece, a radial direction moving component for moving the measuring component in a radial direction of the working clamping table, and adjusting an inclined relationship between the working clamping table and the grinding assembly a tilt adjusting assembly, the grinding method comprising: a preliminary grinding step of grinding a plate-like workpiece at a thickness that does not reach a predetermined thickness of the finished product; a thickness measuring step in which the radial direction The direction shifting component moves the measuring component in a radial direction on the plate-like workpiece that has been ground in the preliminary grinding step to measure the thickness in the radial direction; the calculating step, in order to make the finished thickness in the radial direction In order to equalize, when the tilting relationship of the working clamping table and the grinding assembly is adjusted by the tilt adjusting assembly according to the measurement result measured in the thickness measuring step, the upper surface of the working clamping table and the grinding are calculated. a change amount of the distance of the grinding surface of the grinding stone; a height adjustment step of causing the grinding feed assembly and the tilt adjusting assembly to operate together according to the amount of change calculated in the calculating step, and adjusting at the tilt The grinding surface of the component is tilted Maintaining a state of being in contact with the ground surface of the plate-shaped workpiece in the preliminary grinding step; and a fine grinding step of measuring the thickness of the plate-shaped workpiece with the measuring unit after the height adjusting step The assembly is ground to feed the plated workpiece to a predetermined thickness of the finished product. A grinding method is a grinding method using a grinding device, the grinding device is provided with a working clamping table for holding a plate-shaped workpiece, and the grinding surface of the grinding stone is abutted against the plate-shaped workpiece held by the working clamping table Grinding assembly for reducing the thickness of the upper surface, causing the grinding assembly to approach and away from the working clamping table, grinding the feeding grinding feed assembly in the grinding feed direction, measuring the grinding assembly a measuring component for the thickness of the ground plate-shaped workpiece, a radial direction moving component for moving the measuring component in a radial direction of the working clamping table, and adjusting an inclined relationship between the working clamping table and the grinding assembly a tilt adjusting assembly, the grinding method comprising: a preliminary grinding step of grinding a plate-like workpiece at a thickness that does not reach a predetermined thickness of the finished product; a thickness measuring step in which the radial direction The direction shifting component moves the measuring component in a radial direction on the plate-like workpiece that has been ground in the preliminary grinding step to measure the thickness in the radial direction; the calculating step, in order to make the finished thickness in the radial direction In order to equalize, when the tilting relationship of the working clamping table and the grinding assembly is adjusted by the tilt adjusting assembly according to the measurement result measured in the thickness measuring step, the upper surface of the working clamping table and the grinding are calculated. Grinding stone The amount of change in the distance of the grinding surface; the height adjustment step of causing the grinding feed assembly and the tilt adjusting assembly to act together according to the amount of change calculated in the calculating step, and maintaining the grinding assembly and the The relative movement speed of the plate-shaped workpiece of the work clamping table is equal to the grinding feed speed; and the fine grinding step, after the height adjustment step, the grinding feed is measured while measuring the thickness of the plate-shaped workpiece with the measuring component The assembly grinds the grinding assembly to grind the plate-like workpiece to a predetermined thickness of the finished product.