TW201615314A - 焊料膏 - Google Patents

焊料膏 Download PDF

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Publication number
TW201615314A
TW201615314A TW104128206A TW104128206A TW201615314A TW 201615314 A TW201615314 A TW 201615314A TW 104128206 A TW104128206 A TW 104128206A TW 104128206 A TW104128206 A TW 104128206A TW 201615314 A TW201615314 A TW 201615314A
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TW
Taiwan
Prior art keywords
copper
tin
particles
solder paste
rich
Prior art date
Application number
TW104128206A
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English (en)
Inventor
賽巴提恩 弗里茲雀
喬金 舒茲
喬治 托德勒
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賀利氏德國有限責任兩合公司
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Publication of TW201615314A publication Critical patent/TW201615314A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本發明係關於一種焊料膏，其含有以下組分或由以下組分組成：(i)10-30重量%之至少一種類型之粒子，每種粒子包含>0至□500wt-ppm之磷分率，且係選自由銅粒子、富銅之銅/鋅合金粒子及富銅之銅/錫合金粒子組成之群；(ii)60-80重量%之至少一種類型之粒子，其選自由錫粒子、富錫之錫/銅合金粒子、富錫之錫/銀合金粒子及富錫之錫/銅/銀合金粒子組成之群；及(iii)3-30重量%焊料助熔劑，其中金屬粒子(i)及(ii)之平均粒子直徑□15μm。

Description

焊料膏
本發明係關於一種用於將電子組件牢固黏結連接至基板的方法，一種用於該方法之焊料膏及一種在該方法中獲得之裝置。
WO 2011/009597 A1揭示一種用於將電子組件牢固黏結連接至基板的方法，其包含a)提供具有待連接第一表面的電子組件及具有待連接第二表面的基板，b)將焊料膏塗覆至該等待連接表面中之至少一者，c)適當佈置該電子組件及該基板，使得電子組件之待連接第一表面及基板之待連接第二表面藉助於焊料膏彼此接觸，及d)自c)焊接該裝置以便在電子組件與基板之間產生牢固黏結連接。焊料膏之塗覆層的厚度至少為20μm。用於該方法中的焊料膏含有(i)10-30重量%(重量百分比)銅粒子，(ii)60-80重量%粒子，其由選自由錫及錫銅合金組成之群的至少一種物質製成，及(iii)3-30重量%焊料助熔劑，其中銅粒子及由選自由錫及錫銅合金組成之群的至少一種物質製成的粒子之平均粒子直徑15μm。
本申請人已注意到，可出人意料地使用自WO 2011/009597 A1獲知之方法獲得進一步改良之焊接連接，特定言之，在例如250℃至300℃範圍內之高溫條件下，藉由使用由銅及/或富銅之銅/錫及/或銅/鋅合金製成的粒子(每種粒子之磷含量為>0至500wt-ppm)作為焊料膏中之銅粒子來獲得可可靠的焊接連接。
因此，本發明係關於一種用於將電子組件牢固黏結連接至基板 的方法，其包含a)提供具有待連接第一表面的電子組件及具有待連接第二表面的基板；b)將焊料膏塗覆至待連接之該等表面中之至少一者上；c)佈置該電子組件及該基板，使得電子組件之待連接第一表面與基板之待連接第二表面藉助於該焊料膏彼此接觸；及d)自c)焊接該裝置以便在電子組件與基板之間產生牢固黏結連接；其中該焊料膏含有(i)10-30重量%之至少一種類型之粒子，每種粒子包含>0至500wt-ppm之磷分率，且選自由銅粒子、富銅之銅/鋅合金粒子及富銅之銅/錫合金粒子組成之群，(ii)60-80重量%之至少一種類型之粒子，其選自由錫粒子、富錫之錫/銅合金粒子、富錫之錫/銀合金粒子及富錫之錫/銅/銀合金粒子組成之群，及(iii)3-30重量%焊料助熔劑，其中金屬粒子(i)及(ii)之平均粒子直徑15μm，且其中焊料膏之塗覆層的厚度至少為20μm。
本發明亦關於一種焊料膏，其含有(i)10-30重量%之至少一種類型之粒子，每種粒子包含>0至500wt-ppm之磷分率，且選自由銅粒子、富銅之銅/鋅合金粒子及富銅之銅/錫合金粒子組成之群，(ii)60-80重量%之至少一種類型之粒子，其選自由錫粒子、富錫之錫/銅合金粒子、富錫之錫/銀合金粒子及富錫之錫/銅/銀合金粒子組成之群，及(iii)3-30重量%焊料助熔劑，其中金屬粒子(i)及(ii)之平均粒子直徑15μm。
在本發明之範疇中，術語電子組件應理解為意謂電氣及/或電子電路之組件。電子組件可為例如晶片(較佳不具有外殼之裸晶片(半導體晶片))、半導體二極體、電晶體、電阻器或電容器。
在本發明之範疇中，術語基板應理解為意謂與電子組件連接之 物體。基板可為例如印刷電路板、直接黏結銅(DBC或DCB)或引線框架。
術語印刷電路板在本文中用作印刷電路卡、板或印刷電路之同義詞，且描述用於電子組件之載體。印刷電路板由與導電連接黏附(印刷導體)之電絕緣材料組成。纖維加強塑膠材料例如可用作電絕緣材料。
術語直接黏結銅用於指陶瓷板(例如，由氧化鋁、氮化鋁或氧化鈹製成)，其中一個表面或彼此平行之具有最大表面積的兩個表面與銅在高溫下經由氧化製程黏結。在所選擇之條件下，銅與氧之共熔混合物形成，並連接至銅及基板氧化物。
引線框架應理解為基本上僅由晶片載體及連接導線組成之積體電路(integrated circuit，IC；微晶片)外殼。術語引線框架在本文中用作術語連接框架及晶片載體的同義詞。晶片載體包含基板，其構成晶片載體之基座框架且由以下金屬製造，例如銅、銅合金、銅及修飾劑(例如，鎳、銀或金)之組合、鐵鎳合金或其他鎳鋼合金。
電子組件包含至少一個第一表面，其意欲用於藉助於經由焊料膏產生之接觸層將電子組件連接至基板表面。該表面同樣可為較大表面之部分。
基板至少包含第二表面，其意欲用於藉助於經由焊料膏產生之接觸層將基板連接至上文所述之電子組件之表面。該表面亦可同樣為較大表面之部分。
根據本發明，藉助於經由焊料膏產生之接觸層連接至基板的電子組件表面稱為「待連接第一表面」，且藉助於經由焊料膏產生之接觸層連接至電子組件的基板表面稱為「待連接第二表面」。
慣例上，金屬化層已至少塗覆至電子組件之待連接第一表面。金屬化層已至少塗覆至基板之待連接第二表面亦為慣例的。慣例上， 電子組件及基板至少在待連接表面上擁有金屬化層。因此，慣例上，電子組件在位於與基板表面上之金屬化層相對的表面上包含金屬化層，且該等金屬化層經由接觸層彼此連接。在本發明之範疇中，通常存在之電子組件之金屬化層為電子組件之部分，且通常存在之基板之金屬化層為基板之部分。
金屬化層(若存在)較佳占電子組件之至少一個表面的一部分表面積之至少50%，更佳至少70%，甚至更佳至少90%且尤佳至少95%，諸如100%。在基板上，金屬化層較佳占經由接觸層連接至電子組件之表面的一部分表面積之至少50%，更佳至少70%，甚至更佳至少90%且尤佳至少95%，諸如100%。
金屬化層較佳為可焊接層。金屬化層較佳含有選自由銅、銀、金、錫及鈀組成之群的至少一種元素。金屬化層可全部由該等元素、該等元素之可焊接化合物或該等元素之混合物或合金組成。
將根據本發明之焊料膏塗覆至電子組件或基板之待連接表面中之至少一者上。
根據本發明之焊料膏含有(相對於其重量)(i)10-30重量%，較佳12-28重量%且更佳15-25重量%之至少一種類型之粒子，其包含>0至500wt-ppm，較佳>0至100wt-ppm，更佳>0至50wt-ppm且尤其>0至10wt-ppm之磷分率，且選自由銅粒子、富銅之銅/鋅合金粒子及富銅之銅/錫合金粒子組成之群，(ii)60-80重量%，較佳62-78重量%且更佳65-75重量%之至少一種類型之粒子，其選自由錫粒子、富錫之錫/銅合金粒子、富錫之錫/銀合金粒子及富錫之錫/銅/銀合金粒子組成之群，及(iii)3-30重量%，較佳5-20重量%且更佳6-15重量%之焊料助熔劑，其中金屬粒子(i)及(ii)之平均粒子直徑15μm。
根據本發明之焊料膏較佳含有(相對於其重量)(i)10-30重量%，較佳12-28重量%且更佳15-25重量%之至少一種類型之粒子，其包含 >0至500wt-ppm，較佳>0至100wt-ppm，更佳>0至50wt-ppm且尤其>0至10wt-ppm之磷分率，且係選自由銅粒子、富銅之銅/鋅合金粒子及富銅之銅/錫合金粒子組成之群，(ii)60-80重量%，較佳62-78重量%且更佳65-75重量%之至少一種類型之粒子，其選自由錫粒子、富錫之錫/銅合金粒子、富錫之錫/銀合金粒子及富錫之錫/銅/銀合金粒子組成之群，及(iii)3-30重量%，較佳5-20重量%且更佳6-15重量%之焊料助熔劑，其中金屬粒子(i)及(ii)之平均粒子直徑15μm。
焊料膏中所含之銅粒子之銅的純度較佳為至少99.9%(3N)且更佳至少99.99%(4N)。在由富銅之銅/鋅合金及/或富銅之銅/錫合金製成之粒子之情形下，組成為60至99.5重量%銅及相對應地0.5至40重量%鋅及/或錫。在各情形下，所有粒子之磷分率均為>0至500wt-ppm，較佳>0至100wt-ppm，更佳>0至50wt-ppm且尤其>0至10wt-ppm。粒子較佳為藉由在惰性氣體氛圍中霧化所產生的粒子，或換言之，藉由霧化液體(熔融)銅及/或將指定銅合金中之任一者熔化至惰性氣體氛圍中所產生的粒子。
如上所述，焊料膏含有至少一種類型之粒子，其選自由錫粒子、富錫之錫/銅合金粒子、富錫之錫/銀合金粒子及富錫之錫/銅/銀合金粒子組成之群。該等錫粒子及/或富錫金屬粒子為所謂的焊料。
若焊料膏含有由富錫之錫/銅、錫/銀及/或錫/銅/銀合金製成的焊接金屬粒子，則其錫分率較佳在95-99.5重量%範圍內，且銅及/或銀分率因此在0.5-5重量%範圍內。
金屬粒子(i)及(ii)之平均粒子直徑15μm，較佳13μm，更佳11μm，且甚至更佳8μm。平均粒子直徑較佳在2-15μm範圍內，更佳在2-13μm範圍內，甚至更佳在2-11μm範圍內且又甚至更佳在2-8μm範圍內。
本文中所用之術語「平均粒子直徑」意謂可用光學顯微鏡測定 之平均粒徑(d50)。此類型之量測可用光學顯微鏡，例如以200倍放大率，結合常見數位影像處理系統(CCD數位相機及分析軟體)，例如來自Microvision Instruments之量測系統進行。舉例而言，15μm之平均粒子直徑可意謂至少90%粒子之粒子直徑15μm，且少於10%粒子之粒子直徑大於15μm。因此，在2-15μm範圍內的平均粒子直徑意謂至少90%粒子之粒子直徑在2-15μm範圍內，且少於10%粒子之粒子直徑小於2μm或大於15μm。
根據本發明，少於1%之粒子(i)及(ii)超過某一粒子直徑可為較佳的。少於1%之粒子(i)及(ii)可超過的該粒子直徑較佳為15μm，更佳11μm且甚至更佳8μm。
粒子(i)及(ii)可具有不同幾何形狀。然而，粒子(i)及(ii)在形狀上較佳為球形。然而，熟習此項技術者顯而易見，當前採用之粒子(i)及(ii)之微量部分由於製備原因在形狀上可為非球形的。然而，較佳的為至少90重量%，更佳至少95重量%，甚至更佳至少99重量%或100重量%之粒子(i)及(ii)以球形形狀存在。亦較佳的為焊料膏含有少於5重量%，更佳少於1重量%，甚至更佳少於0.1重量%(例如0重量%)之呈片狀的粒子(i)及(ii)。
存在於焊料膏中之焊料助熔劑的目標為在焊接製程期間還原基板表面及/或電子組件表面(亦即，去氧化)，在焊接製程之前或之後防止再生氧化物形成，及減少外來物質夾雜。此外，焊料助熔劑之添加應降低液體焊料之表面張力。舉例而言，松香、基於松香之樹脂系統、基於水之樹脂系統或基於羧酸(諸如檸檬酸、己二酸、肉桂酸及二苯乙醇酸之羧酸)之系統、胺(例如，三級胺)及溶劑(例如，含有水及多元醇(諸如，乙二醇或甘油)的極性固體)可用作焊料助熔劑。
此外，根據本發明之焊料膏可進一步含有以下成分，諸如醇、脂肪酸(例如，飽和脂肪酸，諸如油酸、肉豆蔻酸、棕櫚酸、十七 酸、硬脂酸或二十烷酸)、聚矽氧烷化合物或磷化物。
根據本發明之焊料膏不含鉛，且因此無鉛。在本發明之範疇內，無鉛應理解為意謂焊料膏不含鉛，除了可能由於技術原因存在污染鉛。因此，無鉛應理解為意謂鉛含量按焊料膏之重量計少於1，較佳少於0.5，更佳少於0.1，甚至更佳少於0.01重量%且尤其0重量%。
根據本發明，電子組件及基板經由焊接以牢固黏結方式彼此連接。因此，牢固黏結連接為經連接之搭配物經由原子力或分子力保持在一起的連接。其較佳為僅可藉由破壞連接方式來分離的非可分離連接。
根據本發明，首先形成之裝置由基板、電子組件及根據本發明之焊料膏層(其位於基板與電子組件之間)組成。因此，基板及電子組件經佈置使得基板之待連接第一表面及電子組件之待連接第二表面經由焊料膏彼此接觸。通常，焊料膏較佳使基板之金屬化層(通常存在)與電子組件之金屬化層(通常存在)接觸。
較佳地，出於此目的，首先將根據本發明之焊料膏層塗覆至基板之待連接表面，較佳塗覆至含有金屬化層之基板表面。塗覆可經由根據先前技術之已知方法中之任一者，例如網版印刷方法、模板印刷方法、噴射或分配技術實現。焊料膏不需要覆蓋基板之整個表面。確切而言，焊料膏同樣可僅塗覆至部分基板表面，例如塗覆至所選擇之焊接表面。隨後，將電子組件之表面，較佳包含金屬化層之表面置放於焊料膏上，因此焊料膏經塗覆。
焊料膏之塗覆層的厚度為至少20μm，更佳至少25μm且甚至更佳至少50μm。根據一較佳實施例，塗覆層之厚度在20-150μm範圍內，更佳在30-120μm範圍內且尤佳在50-100μm範圍內。在本發明之範疇內，術語塗覆層之厚度應理解為意謂在焊接之前，在基板及電子組件之待連接表面之間的距離，較佳在基板及電子組件之待連接表面 之金屬化層之間的距離。因此，塗覆層之厚度基本上藉由所採用之焊料膏的數量測定。
在後續焊料製程期間，電子組件與基板之間的距離明顯減小了可能近似50%，其視焊料膏之精確組成而定。
最終焊接由電子組件、基板及焊料膏(位於電子組件與基板之間)組成的裝置，其與由電子組件、基板及介入接觸層組成的裝置形成相關聯。根據一般定義，焊接應理解為意謂在不達到材料之固相線溫度的情況下，牢固黏結結合材料的熱方法。
對於焊接，將上文所述之裝置加熱，較佳均勻加熱直至達到實際焊接溫度。根據一較佳實施例，在3℃/秒之速率下進行加熱。
焊接溫度較佳高於所採用焊料之熔化溫度大約10-50℃，更佳大約15-45℃且甚至更佳25-35℃(例如，大約30℃)。根據另一較佳實施例，焊接溫度低於280℃，例如在240-260℃範圍內。
對於焊接，保持溫度高於根據本發明之焊料膏中所含的焊料之液相線溫度，例如持續至少15秒，較佳至少20秒且甚至更佳至少30秒之時段。
據推測，將焊接裝置冷卻至低於焊料膏中存在的焊料之液相線溫度與將源自類型(i)之粒子的銅擴散至已在焊接製程期間產生的共熔錫銅相中相關聯。
宜使由電子組件、基板及在焊接製程期間獲得之介入接觸層製成的裝置在焊接製程之後經受熱處理。熱處理應理解為意謂用低於焊料之液相線溫度的熱量處理裝置。
熱處理較佳在高於40℃，例如在40-217℃範圍內，更佳在100-210℃範圍內且甚至更佳在150-205℃範圍內之溫度下進行。熱處理較佳進行1分鐘至24小時，更佳10分鐘至10小時且甚至更佳20分鐘至1小時之持續時間。熱處理之持續時間通常與溫度相關，且持續時間愈 長，則用於熱處理之溫度愈低。
根據本發明之方法無需對用於製備由電子組件、基板及介入接觸層製成之裝置的慣例方法進行昂貴的修改。特定言之，根據本發明之方法不與關於用於習知焊接方法之機械的特定需求相關聯。因此，根據本發明之方法可例如在習知條件下及使用現有機械(若存在)進行。
根據一較佳實施例，根據本發明之裝置可係或係藉助於上文所述之方法製備。
在根據本發明之裝置中，電子組件與基板之間的距離較佳為8-50μm，更佳10-30μm且甚至更佳12-28μm。該距離應理解為電子組件及基板之待連接表面之間的距離，其中金屬化層(通常存在)為電子組件及/或基板之部分。因此，指定距離對應於在焊接之後於電子組件與基板之間的接觸層之厚度。
根據本發明，焊接條件(尤其焊料膏之塗覆層之厚度、溫度及時間)及(若可應用)熱處理條件(尤其溫度及時間)可在上文所述之焊接製程中調整，以便獲得上文所述之接觸層。形成具有所需性質之接觸層可經由分析對應顯微斷面易於追蹤。
實例： 本發明實例1：
所製備之焊料膏含有69重量百分比之平均粒子直徑為8μm之錫銅合金(SnCu0.7)粒子、20重量百分比之平均粒子直徑為8μm及磷分率為5wt-ppm之銅粒子及11重量百分比之基於松香之焊料助熔劑系統。
將焊料膏經由金屬模板塗覆至銅片上。焊料膏之塗覆層之厚度為75μm。隨後，將具有焊料膏之銅片表面藉由機器與包含由鎳/銀製成的金屬化層之尺寸為2mm×2mm之裸晶片組態。出於此目的，將裸 晶片適當置放在焊料膏上，使得裸晶片之金屬化層經由該焊料膏接觸銅片之表面。
隨後將由銅片、裸晶片及介入焊料膏製成的裝置放入焊接爐中，在2.5開爾文/秒之速率下加熱至260℃之溫度，且將該溫度維持30秒以用於焊接。
本發明實例2：
唯一除銅粒子之磷分率為500wt-ppm以外，程序與實例1中相同。
參考實例3：
唯一除銅粒子之磷分率為1,100wt-ppm以外，程序與實例1中相同。
參考實例4：
唯一除銅粒子之磷分率為3,000wt-ppm以外，程序與實例1中相同。
參考實例5：
除焊料膏含有87重量百分比之平均粒子直徑為8μm之錫銅合金(SnCu0.7)粒子、無銅粒子及13重量百分比之基於松香之焊料助熔劑系統以外，程序與實例1中相同。
顯而易見，在根據實例1至5製備之焊接連接及/或焊接裝置之穩定性的各種測試中，根據本發明實例1及2製備之裝置的焊接連接比根據參考實例3及4或根據參考實例5製備之裝置展示在200℃下明顯更高剪切強度。

Claims (12)

  1. 一種焊料膏，其含有以下組分或由以下組分組成：(i)10-30重量%之至少一種類型之粒子，每種粒子包含>0至500wt-ppm之磷分率，且係選自由銅粒子、富銅之銅/鋅合金粒子及富銅之銅/錫合金粒子組成之群，(ii)60-80重量%之至少一種類型之粒子，其選自由錫粒子、富錫之錫/銅合金粒子、富錫之錫/銀合金粒子及富錫之錫/銅/銀合金粒子組成之群，及(iii)3-30重量%焊料助熔劑，其中金屬粒子(i)及(ii)之平均粒子直徑15μm。
  2. 如請求項1之焊料膏，其中該磷含量為>0至100wt-ppm。
  3. 如請求項1之焊料膏，其中該等富銅之銅/鋅合金或富銅之銅/錫合金之組成為60至99.5重量%銅及0.5至40重量%鋅或錫。
  4. 如請求項1之焊料膏，其中該等類型(i)粒子為藉由在惰性氣體氛圍中霧化製備的粒子。
  5. 如請求項1之焊料膏，其中該等富錫之錫/銅合金、錫/銀合金或錫/銅/銀合金之組成為95-99.5重量%錫及0.5-5重量%銅、銀或銅加銀。
  6. 一種用於將電子組件牢固黏結連接至基板之方法，其包含a)提供具有待連接第一表面之電子組件及具有待連接第二表面之基板；b)將如前述請求項中任一項之焊料膏塗覆至該等待連接表面中之至少一者上；c)佈置該電子組件及該基板，使得該電子組件之該待連接第 一表面及該基板之該待連接第二表面藉助於該焊料膏彼此接觸；及d)焊接來自c)之該裝置，以便在該電子組件與該基板之間產生牢固黏結連接；其中焊料膏之塗覆層之厚度為至少20μm。
  7. 如請求項6之方法，其中該電子組件為晶片、半導體二極體、電晶體、電阻器或電容器。
  8. 如請求項6之方法，其中該基板為印刷電路板、直接黏結銅或引線框架。
  9. 如請求項6之方法，其中該焊料膏係藉由網版印刷方法、模板印刷方法、噴射或分配技術塗覆。
  10. 如請求項6之方法，其中焊接溫度係在240-260℃範圍內。
  11. 如請求項6之方法，其中將完成步驟d)後所獲得之裝置在40-217℃範圍內之溫度下熱處理1分鐘至24小時之時段。
  12. 一種裝置，其係根據如請求項6之方法獲得。
TW104128206A 2014-08-27 2015-08-27 焊料膏 TW201615314A (zh)

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