TW201603179A - Table assembly for supporting semiconductor packages - Google Patents
Table assembly for supporting semiconductor packages Download PDFInfo
- Publication number
- TW201603179A TW201603179A TW104115825A TW104115825A TW201603179A TW 201603179 A TW201603179 A TW 201603179A TW 104115825 A TW104115825 A TW 104115825A TW 104115825 A TW104115825 A TW 104115825A TW 201603179 A TW201603179 A TW 201603179A
- Authority
- TW
- Taiwan
- Prior art keywords
- vacuum
- gantry assembly
- disposed
- semiconductor package
- vacuum chamber
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明揭露關於用以支撐半導體封裝體之台架組裝體，更具體地說，關於用以支撐經切割製程而個體化的半導體封裝體的台架組裝體。The present invention discloses a gantry assembly for supporting a semiconductor package, and more particularly, a gantry assembly for supporting a semiconductor package that is individualized by a dicing process.
通常，半導體器件藉由重複地進行一連串的製造製程，來形成於作為半導體基板的矽晶圓上。而該矽晶圓上形成的該半導體器件藉由切割(Dicing)製程被切割，藉由接合(Bonding)製程來接合至基板。被接合的半導體器件，藉由封裝(molding)製程來封裝，而在該製程中可得到由多個半導體封裝體所組成的半導體條帶(semiconductor strip)。Generally, a semiconductor device is formed on a germanium wafer as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The semiconductor device formed on the germanium wafer is cut by a Dicing process and bonded to the substrate by a bonding process. The bonded semiconductor device is packaged by a molding process in which a semiconductor strip composed of a plurality of semiconductor packages is obtained.
該多個半導體封裝體可藉由切割製程由半導體條帶個體化，並且藉由分類製程被分為及格品或不良品。具體來說，個體化後的半導體器件可在托盤台架上藉由檢測裝置來檢測，然後再依據檢測結果被分類為及格品以及不良品。The plurality of semiconductor packages can be individualized by the semiconductor strip by a dicing process, and are classified into a defective product or a defective product by a sorting process. Specifically, the individualized semiconductor devices can be detected on the tray gantry by the detecting device, and then classified into the compliant products and the defective products according to the detection results.
當藉由檢測裝置來進行檢測製程時，該台架組裝體可於該半導體封裝體之間部分地露出。過去，由於該台架組裝體的一些部分暴出於半導體封裝體之間，因此檢測半導體封裝體並不容易。When the detection process is performed by the detecting device, the gantry assembly can be partially exposed between the semiconductor packages. In the past, it was not easy to detect a semiconductor package because some portions of the gantry assembly were exposed between semiconductor packages.
本案之台架組裝體包括真空板，該真空板中形成至少一真空孔於其中，該真空孔用以真空吸附個別的半導體封裝體，並具有本體，本體與真空板之低位部連接，並建構為提供與真空孔連通之真空艙。半導體封裝體可藉由多個檢出器被傳送到合格品盤或是不良品盤。當一些半導體封裝體被檢出器拾起時，透過真空艙中對應到被撿起半導體封裝體的真空孔，發生真空損失(vacuum loss)，其結果為，用以真空吸附剩餘半導體器件的真空力可能降低。The gantry assembly of the present invention comprises a vacuum plate, wherein the vacuum plate has at least one vacuum hole formed therein for vacuumly adsorbing the individual semiconductor package, and has a body connected to the lower portion of the vacuum plate and constructed To provide a vacuum chamber that communicates with the vacuum holes. The semiconductor package can be transferred to a qualified or defective disk by a plurality of detectors. When some semiconductor packages are picked up by the detector, a vacuum loss occurs in the vacuum chamber corresponding to the vacuum hole in which the semiconductor package is picked up, and as a result, the vacuum for vacuum adsorbing the remaining semiconductor device The force may be reduced.
進一步地，當該半導體封裝體的數量以及/或尺寸有變更時，必須要改變托盤台架。於此類例子中。製造半導體的成本可能會因時間而增加，而且更換托盤台架時也耗費成本。Further, when the number and/or size of the semiconductor package is changed, the tray gantry must be changed. In such an example. The cost of manufacturing semiconductors may increase over time and costly when replacing pallet racks.
本發明揭露提供一種台架組裝體，可輕易地檢測半導體封裝體，並且支撐多種半導體封裝體。The present invention provides a gantry assembly that can easily detect a semiconductor package and support a plurality of semiconductor packages.
根據一些示範實施例，用以支撐半導體封裝體之台架組裝體可包括真空板及本體。該真空板支撐半導體封裝體，並且具有吸附區域，該吸附區域中形成有真空孔貫穿其中，以真空吸附半導體封裝體；該本體與該真空板之低位部連接，以提供與真該空孔連通之真空艙。更具體地，該真空板可包括螢光材料。According to some exemplary embodiments, the gantry assembly for supporting the semiconductor package may include a vacuum plate and a body. The vacuum plate supports the semiconductor package and has an adsorption region, wherein the adsorption region is formed with a vacuum hole penetrating therein to vacuum adsorb the semiconductor package; the body is connected to the lower portion of the vacuum plate to provide connection with the hole Vacuum chamber. More specifically, the vacuum panel may comprise a fluorescent material.
根據一些示範實施例，該真空板可包括螢光材料層。According to some exemplary embodiments, the vacuum panel may include a layer of phosphor material.
根據一些示範實施例，該該真空板可包括基盤板、配置於基盤板上的吸附墊、以及形成於該吸附墊上的螢光材料層。According to some exemplary embodiments, the vacuum panel may include a substrate plate, an adsorption pad disposed on the substrate plate, and a layer of phosphor material formed on the adsorption pad.
根據一些示範實施例，該真空板可包括基盤板，以及配置於該基盤板上的吸收墊。更具體地，其中該吸附墊由包含螢光材料的橡膠或樹脂形成。According to some exemplary embodiments, the vacuum panel may include a base plate and an absorbent pad disposed on the base plate. More specifically, wherein the adsorption pad is formed of a rubber or a resin containing a fluorescent material.
根據一些示範實施例，具有貫孔之隔板水平配置於該真空艙中。According to some exemplary embodiments, a partition having a through hole is horizontally disposed in the vacuum chamber.
根據一些示範實施例，台架組裝體可更包含至少一真空單元，該真空單元配置於該真空艙中，並且建構為提供真空壓力至真空艙中。According to some exemplary embodiments, the gantry assembly may further include at least one vacuum unit disposed in the vacuum chamber and configured to provide vacuum pressure into the vacuum chamber.
根據一些示範實施例，該真空單元可與壓縮空氣源連接。進一步地，該真空單元可具有中空管形狀從而提供來自該真空艙中壓縮空氣源的空氣所流動的氣流通道，並且具有至少一開口，其建構為連接該空氣的氣流通道與真空艙，以便提供真空艙中的真空壓力。According to some exemplary embodiments, the vacuum unit may be coupled to a source of compressed air. Further, the vacuum unit may have a hollow tube shape to provide an air flow passage from the air of the compressed air source in the vacuum chamber, and have at least one opening configured to connect the air flow passage and the vacuum chamber so that Provides vacuum pressure in the vacuum chamber.
根據一些示範實施例，該本體可包括配置於該真空板下方的低位板；以及該真空板及該低位板之間的邊牆，以形成真空艙。According to some exemplary embodiments, the body may include a lower plate disposed under the vacuum plate; and a side wall between the vacuum plate and the lower plate to form a vacuum chamber.
根據一些示範實施例，該低位板可具有：與真空泵連接的多個真空通道；以及用以連接該真空通道以及該真空艙之多個第二真空孔。According to some exemplary embodiments, the lower plate may have: a plurality of vacuum passages connected to the vacuum pump; and a plurality of second vacuum holes for connecting the vacuum passage and the vacuum chamber.
根據一些示範實施例，其中各個該半導體封裝體係由多個真空孔所真空吸附。According to some exemplary embodiments, each of the semiconductor package systems is vacuum adsorbed by a plurality of vacuum holes.
根據一些示範實施例，該台架組裝體更包含：止擋單元，配置於該真空艙內，以調整吸附區域之尺寸；驅動部，建構為使該止擋單元與該吸附區域之下表面之周圍部緊密接觸，以減少吸附區域之尺寸。According to some exemplary embodiments, the gantry assembly further includes: a stop unit disposed in the vacuum chamber to adjust a size of the adsorption region; and a driving portion configured to make the stop unit and a lower surface of the adsorption region The surrounding parts are in close contact to reduce the size of the adsorption area.
根據一些示範實施例，該止擋單元包含：第一止擋部件，建構為與該吸附區域之下表面的第一周圍部緊密接觸；第二止擋部件，配置於該第一止擋部件中，且建構為與第一周圍部中的第二周圍部緊密接觸；支撐部件，建構為支撐該第一止擋部件及該第二止擋部件；以及彈性部件，配置於該第一止擋部件以及該支撐部件之間，特別是當支撐部件藉由該驅動部往上移動時，該第一止擋部件比該第二止擋部件先與該吸收區域的該下表面緊密接觸。According to some exemplary embodiments, the stop unit includes: a first stop member configured to be in close contact with a first peripheral portion of a lower surface of the adsorption region; and a second stop member disposed in the first stop member And being configured to be in close contact with the second peripheral portion of the first surrounding portion; the support member configured to support the first stop member and the second stop member; and the elastic member disposed on the first stop member And between the support members, particularly when the support member is moved upward by the drive portion, the first stop member is in close contact with the lower surface of the absorbing region than the second stop member.
根據一些示範實施例，該止擋部件進一步包含第二彈性部件，該第二彈性部件配置於該第二止擋部件及該支撐部件之間。According to some exemplary embodiments, the stop member further includes a second elastic member disposed between the second stop member and the support member.
根據一些示範實施例，多個凹部形成於該真空板的上表面部，各個凹部與該真空孔連接。According to some exemplary embodiments, a plurality of recesses are formed in an upper surface portion of the vacuum plate, and each of the recesses is coupled to the vacuum hole.
以下配合附錄圖示，詳細說明根據本揭露之實施例的晶粒結著方法以及裝置。本揭露亦可做多樣的變化以及以多種不同型態實施，因此將於圖示以及說明書中說明特定的實施例，然而本揭露不應被視為受到此些實施例敘述之限制。更確切地說，在不脫離本揭露之精神及技術範疇內的修改、同等內容、代替皆為落入本揭露之範疇內。於圖示當中，為達清楚標示之目的，結構之尺寸可能有放大或縮小的情形。The method and apparatus for grain bonding according to embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The present disclosure is also to be construed as being limited by the various embodiments. Rather, modifications, equivalents, and substitutions are intended to be included within the scope of the disclosure. In the illustrations, the size of the structure may be enlarged or reduced for the purpose of clear marking.
「第一」或「第二」等詞可使用於敘述不同的單元，然而此些單元不應受限於此些詞彙。此些詞彙僅用於區分某個單元與另一者。例如，在不脫離本發明範疇內第一單元可命名為第二單元，反之亦然。Words such as "first" or "second" may be used to describe different elements, but such elements are not limited to such words. These terms are only used to distinguish one unit from another. For example, a first unit may be named a second unit, and vice versa, without departing from the scope of the invention.
此處使用之詞彙僅用於敘述特定實施例，但並非意圖性地限制本揭露。單一形式的詞彙可包括它本身反對意義以外的多個形式。於說明書當中，例如「包括」、「包含」、「具有」等詞彙用於具體化此處揭露的某個特徵、數量、步驟、操作、單元、構件，或是其組合的存在，並且須認知並非事先地將一個或多個的其他特徵、數量、步驟、操作、單元、構件或是其組合排除。The vocabulary used herein is for the purpose of describing particular embodiments only, and is not intended to limit the disclosure. A single form of vocabulary can include multiple forms of its own opposition to meaning. In the description, the words "including", "comprising", "having" or "the" are used to embo It is not necessary to exclude one or more other features, quantities, steps, operations, units, components, or combinations thereof.
除非有另行定義，包括技術用語以及科學用語，在此的用法與熟習該技術領域者所理解之涵義相同。可更進一步地理解的是，除非有另行定義，否則一般定義於字典的詞彙，應該解釋為與相關領域文章具有一致的意義，而不該解釋為具有不切實際或過度形式上的意義。Unless otherwise defined, including technical terms and scientific terms, the usage herein is the same as understood by those skilled in the art. It can be further understood that, unless otherwise defined, a vocabulary generally defined in a dictionary should be interpreted as having a consistent meaning with a related art article, and should not be interpreted as having an impractical or excessive formal meaning.
圖1以及圖2為顯示根據一示範實施例之托盤台架。1 and 2 are diagrams showing a pallet gantry according to an exemplary embodiment.
參考圖1以及圖2，根據本發明一示範性實施例，托盤台架100可用於支撐多個半導體封裝體10。具體地說，托盤台架100可用於真空吸附由半導體條帶(semiconductor strip)經切割製程個體化出來的半導體封裝體10，因而穩定地支撐半導體封裝體10，並且更進一步地穩定移動半導體封裝體10。Referring to FIGS. 1 and 2, a tray gantry 100 can be used to support a plurality of semiconductor packages 10, in accordance with an exemplary embodiment of the present invention. Specifically, the tray stage 100 can be used for vacuum-adsorbing the semiconductor package 10 individualized by the semiconductor strip (semiconductor strip), thereby stably supporting the semiconductor package 10, and further stabilizing the mobile semiconductor package. 10.
被支撐於托盤台架100上的半導體封裝體10可藉由檢測相機來檢測(未示出)，並且根據檢測結果被分類為合格品或是不良品。例如，雖未於圖示中示出，半導體封裝體10根據檢測結果可被多個檢出器傳送至合格品盤或是不良品盤。The semiconductor package 10 supported on the tray stage 100 can be detected by a detecting camera (not shown), and classified as a good or defective according to the detection result. For example, although not shown in the drawings, the semiconductor package 10 can be transferred to a good quality product or a defective quality disk by a plurality of detectors based on the detection result.
托盤台架100可包括真空板110以及本體120。真空板100用於支撐半導體封裝體10；本體120與真空板110之低位部連接。真空板110可具有吸附區域，吸附區域當中形成有真空孔112貫穿其中，以便真空吸附半導體封裝體10。本體120可建構為提供與真空孔112連通之真空艙122。例如，真空板110可為矩形板狀，且本體120可為具開口上部之矩形盒狀。The tray gantry 100 can include a vacuum panel 110 and a body 120. The vacuum board 100 is used to support the semiconductor package 10; the body 120 is connected to the lower portion of the vacuum board 110. The vacuum panel 110 may have an adsorption region through which a vacuum hole 112 is formed to vacuum-adsorb the semiconductor package 10. The body 120 can be configured to provide a vacuum chamber 122 in communication with the vacuum aperture 112. For example, the vacuum panel 110 may have a rectangular plate shape, and the body 120 may have a rectangular box shape with an open upper portion.
根據一示範實施例，各個半導體封裝體10可由多個真空孔112真空吸附。也就是說，真空板110的真空孔112可建構為各個半導體封裝體10對應多個真空孔112。According to an exemplary embodiment, each of the semiconductor packages 10 may be vacuum adsorbed by a plurality of vacuum holes 112. That is to say, the vacuum holes 112 of the vacuum panel 110 can be constructed such that the respective semiconductor packages 10 correspond to the plurality of vacuum holes 112.
圖3為顯示圖1所示真空板的放大斷面圖。Figure 3 is an enlarged cross-sectional view showing the vacuum panel shown in Figure 1.
參考圖3，多個真空孔112可用於真空吸附一個半導體封裝體10。與一個真空孔用於真空吸附一個半導體封裝體的先前技術相比，由於使用相對較小的多個真空孔112來真空吸附一個半導體封裝體，即使半導體封裝體10的尺寸改變，也不需要更換托盤台架100。Referring to FIG. 3, a plurality of vacuum holes 112 may be used to vacuum adsorb a semiconductor package 10. Compared with the prior art in which a vacuum hole is used for vacuum-adsorbing a semiconductor package, since a semiconductor package is vacuum-adsorbed by using a relatively small plurality of vacuum holes 112, even if the size of the semiconductor package 10 is changed, there is no need to replace it. Pallet gantry 100.
圖4為顯示具有不同尺寸的多個半導體封裝體的狀態之放大斷面圖，該多個半導體封裝體被圖1所示的真空板所支撐。4 is an enlarged cross-sectional view showing a state of a plurality of semiconductor packages having different sizes supported by the vacuum plate shown in FIG. 1.
參考圖3及圖4，與圖3所示半導體封裝體10相較，當具有不同尺寸的半導體封裝體10A被支撐於真空板110時，當中一些的真空孔112可配置於半導體封裝體10A之間。然而，由於真空孔112具有相對較小內徑，自半導體封裝體10A之間的真空孔112的真空損失可忽略，半導體封裝體10A可充分地被真空吸附。Referring to FIG. 3 and FIG. 4, when the semiconductor package 10A having different sizes is supported on the vacuum board 110, some of the vacuum holes 112 may be disposed in the semiconductor package 10A. between. However, since the vacuum holes 112 have a relatively small inner diameter, the vacuum loss from the vacuum holes 112 between the semiconductor packages 10A is negligible, and the semiconductor package 10A can be sufficiently vacuum-adsorbed.
根據範例實施例，多個凹部114可形成於真空板110的上表面部。真空孔112可各自與凹部114連接，且可因凹部114的關係於半導體封裝體10下方形成小的真空艙。凹部114可用於增加施加真空壓力至半導體封裝體10的面積。According to example embodiments, a plurality of recesses 114 may be formed on an upper surface portion of the vacuum panel 110. The vacuum holes 112 may be connected to the recesses 114, respectively, and a small vacuum chamber may be formed under the semiconductor package 10 due to the relationship of the recesses 114. The recess 114 can be used to increase the applied vacuum pressure to the area of the semiconductor package 10.
此時未於圖中示出的檢測相機可移動式地配置於台架組裝體100上，以檢測半導體封裝體10。檢測相機可得到台架組裝體100上的半導體封裝體10的影像，而圖像處理裝置(未示出)可檢測半導體封裝體10的表面狀況、商標或商品名的標誌、以及使用圖像的類似用途。The detecting camera not shown in the drawing is movably disposed on the gantry assembly 100 to detect the semiconductor package 10. The detection camera can obtain an image of the semiconductor package 10 on the gantry assembly 100, and the image processing device (not shown) can detect the surface condition of the semiconductor package 10, the logo of the trademark or trade name, and the image using Similar use.
具體地，該檢測相機可包括螢光單元，以照亮台架組裝體100之半導體封裝體10。例如，該檢測相機可包括軸向照明單元，以照明半導體封裝體10。Specifically, the detecting camera may include a fluorescent unit to illuminate the semiconductor package 10 of the gantry assembly 100. For example, the detection camera can include an axial illumination unit to illuminate the semiconductor package 10.
根據示範實施例，真空板110可包括螢光材料。螢光材料可擴散或是反射來自照明單元所照射的光線。因此，露出於半導體封裝體10之間及周圍的真空板110的高位部以及一些真空孔112，有可能不被檢測相機所感測到。According to an exemplary embodiment, the vacuum panel 110 may include a fluorescent material. The fluorescent material can diffuse or reflect light from the illumination unit. Therefore, the high portion of the vacuum panel 110 and some of the vacuum holes 112 exposed between and around the semiconductor package 10 may not be sensed by the detecting camera.
例如，如圖所示，螢光材料層130可形成於真空板110上。例如，螢光材料層130可藉塗布包含螢光材料的矽氧樹脂來形成。較佳地螢光材料層130可形成於凹部114及真空孔112的內表面、以及真空板110的上表面。For example, as shown, a layer of phosphor material 130 can be formed on vacuum panel 110. For example, the phosphor material layer 130 can be formed by coating a silicone resin containing a fluorescent material. Preferably, the phosphor layer 130 may be formed on the inner surface of the recess 114 and the vacuum hole 112, and the upper surface of the vacuum panel 110.
圖5為圖1所示真空板的另一例之斷面圖，而圖6為圖5所示真空板之放大斷面圖。Figure 5 is a cross-sectional view showing another example of the vacuum panel shown in Figure 1, and Figure 6 is an enlarged cross-sectional view showing the vacuum panel shown in Figure 5.
參考圖5及圖6，真空板110可包括：基盤板110A；以及吸附墊110B，其配置於基盤板110A，且真空孔112可形成為貫穿基盤板110A及吸附墊110B。例如，真空孔112可包括形成為貫穿該基盤板110A之下真空孔112A；以及形成為貫穿吸附墊110B之上真空孔112B。Referring to FIGS. 5 and 6, the vacuum panel 110 may include: a base plate 110A; and an adsorption pad 110B disposed on the base plate 110A, and the vacuum holes 112 may be formed to penetrate the base plate 110A and the adsorption pad 110B. For example, the vacuum hole 112 may include a vacuum hole 112A formed through the lower surface of the base plate 110A; and a vacuum hole 112B formed through the adsorption pad 110B.
例如，插入有吸附墊110B之第二凹部，可形成於基盤板110A之上表面部。具體地說，吸附墊110B可由可撓性材料形成，以便穩定地真空吸附半導體封裝體10。當中例如吸附墊110B可由矽氧樹脂、橡膠、或其他類似者形成。For example, the second recess into which the adsorption pad 110B is inserted may be formed on the upper surface portion of the base plate 110A. Specifically, the adsorption pad 110B may be formed of a flexible material in order to stably vacuum-adsorb the semiconductor package 10. For example, the adsorption pad 110B may be formed of a silicone resin, rubber, or the like.
根據一示範實施例，螢光材料132可形成於吸收墊110B上。螢光材料層132可藉塗布具螢光材料之矽氧樹脂於吸附墊110B上來形成。According to an exemplary embodiment, the phosphor material 132 may be formed on the absorbent pad 110B. The phosphor material layer 132 can be formed by coating a neodymium resin having a fluorescent material on the adsorption pad 110B.
根據另一示範實施例，吸附墊110B可由具螢光材料之橡膠或樹脂來形成。在此例中可省略螢光材料層132。According to another exemplary embodiment, the adsorption pad 110B may be formed of a rubber or a resin having a fluorescent material. The phosphor material layer 132 may be omitted in this example.
雖未示出，背光單元(未示出)可配置於真空艙122之中。例如，該背光單元可包括多個發光二極體。詳細地說，具有矩形環狀之照明框架可配置於本體120的內側牆，而發光二極體可安裝於該照明框架的內側表面。Although not shown, a backlight unit (not shown) may be disposed in the vacuum chamber 122. For example, the backlight unit may include a plurality of light emitting diodes. In detail, the illumination frame having a rectangular ring shape may be disposed on the inner wall of the body 120, and the light emitting diode may be mounted on the inner side surface of the illumination frame.
再次參考圖1及圖2，具多個貫孔142之隔牆140可水平配置於真空艙122，且至少一真空單元150可配置於隔牆140下方，以提供真空壓力至真空艙122。隔牆140可用於均勻地提供真空壓力至真空孔112。Referring again to FIGS. 1 and 2 , a partition wall 140 having a plurality of through holes 142 may be horizontally disposed in the vacuum chamber 122 , and at least one vacuum unit 150 may be disposed under the partition wall 140 to provide vacuum pressure to the vacuum chamber 122 . The partition wall 140 can be used to uniformly supply vacuum pressure to the vacuum hole 112.
真空艙122可被隔板140分隔為上真空艙及下真空艙。真空單元150可配置於下真空艙，而真空壓力可均勻地由經貫孔142提供至上真空艙。The vacuum chamber 122 can be divided by the partition 140 into an upper vacuum chamber and a lower vacuum chamber. The vacuum unit 150 can be disposed in the lower vacuum chamber, and the vacuum pressure can be uniformly supplied to the upper vacuum chamber through the through holes 142.
真空單元150可提供壓縮空氣之氣流通道於本體120的內部空間，即真空艙122中。具體地說，真空單元150可如圖1及圖2所示，具有縱向延伸於真空艙122中的中空管狀，並且可具有與真空艙122連通之開口152。The vacuum unit 150 can provide a flow of compressed air to the interior space of the body 120, ie, the vacuum chamber 122. Specifically, the vacuum unit 150, as shown in FIGS. 1 and 2, has a hollow tubular shape extending longitudinally in the vacuum chamber 122 and may have an opening 152 in communication with the vacuum chamber 122.
真空單元150可與壓縮空氣源160連接，以供給壓縮空氣。自壓縮空氣源160供給的壓縮空氣可於真空單元150中高速流動。詳細地說，真空單元150的端部可與壓縮空氣源160連接，而壓縮空氣可經由真空單元150的另一端部釋放出本體120。Vacuum unit 150 can be coupled to compressed air source 160 to supply compressed air. The compressed air supplied from the compressed air source 160 can flow at a high speed in the vacuum unit 150. In detail, the end of the vacuum unit 150 may be connected to the compressed air source 160, and the compressed air may release the body 120 via the other end of the vacuum unit 150.
真空單元150的內部壓力可比在本體中(即受到壓縮空氣氣流的真空艙122的壓力)還低。而真空艙122的空氣可經由開口152被吸入真空單元150。因此，真空壓力可由真空單元150提供至真空艙122，而半導體封裝體10則可因而真空吸附於真空板110上。The internal pressure of the vacuum unit 150 may be lower than in the body (i.e., the pressure of the vacuum chamber 122 subjected to the flow of compressed air). The air of the vacuum chamber 122 can be drawn into the vacuum unit 150 via the opening 152. Therefore, the vacuum pressure can be supplied to the vacuum chamber 122 by the vacuum unit 150, and the semiconductor package 10 can thus be vacuum-adsorbed onto the vacuum panel 110.
雖然圖上顯示三個真空單元150配置於真空艙122上，但真空單元150的數量為可變。因此，本發明之範疇並不受到真空單元150的數量限定。Although three vacuum units 150 are shown on the vacuum chamber 122, the number of vacuum units 150 is variable. Therefore, the scope of the present invention is not limited by the number of vacuum units 150.
真空單元150可經空氣管與壓縮空氣源160連接。例如，雖未顯示於圖中，壓縮空氣源160可包括空氣泵、空氣筒，以接收壓縮空氣等。Vacuum unit 150 can be coupled to compressed air source 160 via an air tube. For example, although not shown in the figures, the compressed air source 160 can include an air pump, an air cylinder to receive compressed air, and the like.
當多個真空單元150如圖2所示般使用時，軌道式歧管162可配置於真空單元150與壓縮空氣源160之間。詳細地說，歧管162可用於均勻地供給壓縮空氣至真空單元150。歧管162可藉主空氣管164與壓縮空氣源160連接，並且藉由支空氣管166與真空單元150連接。When a plurality of vacuum units 150 are used as shown in FIG. 2, the rail manifold 162 may be disposed between the vacuum unit 150 and the compressed air source 160. In detail, the manifold 162 can be used to uniformly supply compressed air to the vacuum unit 150. Manifold 162 may be coupled to compressed air source 160 by main air tube 164 and to vacuum unit 150 by air tube 166.
根據示範實施例，止擋單元170可配置於真空艙122，以調整該吸附區域之尺寸，該吸附區域當中形成有真空孔112貫穿於其中。止擋單元170可藉由驅動部180垂直移動。驅動部180可使止擋單元170 與該吸附區域之下表面之周圍部緊密接觸，以減輕該吸附區域的尺寸。According to an exemplary embodiment, the stop unit 170 may be disposed in the vacuum chamber 122 to adjust the size of the adsorption region, in which the vacuum hole 112 is formed. The stop unit 170 can be vertically moved by the driving portion 180. The driving portion 180 can bring the stopper unit 170 into close contact with the peripheral portion of the lower surface of the adsorption region to reduce the size of the adsorption region.
例如，止擋單元170可為矩形環狀。或者止擋單元170可為條狀。於此情形下四個止擋單元170可於真空艙122內配置為矩形環狀。For example, the stop unit 170 can be a rectangular ring shape. Or the stop unit 170 may be in the form of a strip. In this case, the four stop units 170 may be configured in a rectangular ring shape in the vacuum chamber 122.
圖7及圖8為圖1及圖2所示止擋單元及驅動部的運作之斷面圖。7 and 8 are cross-sectional views showing the operation of the stopper unit and the driving unit shown in Figs. 1 and 2 .
參考圖7及圖8，止擋單元170可包括：第一止擋部件172，其建構為與該吸附區域之下表面的第一周圍部緊密接觸；第二止擋部件174，其配置於第一止擋部件172內側，並且建構為與第一周圍部內側的第二周圍部緊密接觸。Referring to FIGS. 7 and 8, the stop unit 170 may include a first stop member 172 configured to be in close contact with a first peripheral portion of a lower surface of the adsorption region, and a second stop member 174 disposed at the An inner side of the stop member 172 is constructed to be in close contact with the second peripheral portion on the inner side of the first peripheral portion.
第一止擋單元172及第二止擋單元174可由支撐部件176予以支撐，驅動部180可垂直移動支撐部件176。例如，驅動部180可包括氣壓缸。然而，驅動部180的構成為可變，因而本發明的範疇並不因驅動部180的構成而受限定。The first stop unit 172 and the second stop unit 174 can be supported by the support member 176, and the drive portion 180 can vertically move the support member 176. For example, the drive portion 180 may include a pneumatic cylinder. However, since the configuration of the drive unit 180 is variable, the scope of the present invention is not limited by the configuration of the drive unit 180.
根據一示範實施例，第一止擋單元172可彈性地被支撐於支撐部件176上。例如，如螺旋彈簧等的彈性部件178可配置於第一止擋部件172以及支撐部件176之間，且第一止擋部件172藉彈性單元178而位於比止擋部件174還高處。因此，當支撐部件176藉由驅動部180往上移動時，第一止擋部件172可在第二止擋部件174之前與 該吸附區域之下表面緊密接觸。According to an exemplary embodiment, the first stop unit 172 is resiliently supported on the support member 176. For example, an elastic member 178 such as a coil spring may be disposed between the first stopper member 172 and the support member 176, and the first stopper member 172 is located higher than the stopper member 174 by the elastic unit 178. Therefore, when the support member 176 is moved upward by the driving portion 180, the first stopper member 172 can be in close contact with the lower surface of the adsorption region before the second stopper member 174.
雖未於圖式中顯示出，第二彈性部件(未示出)可配置於第二止擋部件174及支撐部件176之間，以便吸收第二止擋部件174及該吸附驅動之下表面之間的震動。然而即使如此，第一止擋部件170可設定地比第二止擋單元174還高。Although not shown in the drawings, a second elastic member (not shown) may be disposed between the second stopper member 174 and the support member 176 to absorb the second stopper member 174 and the suction-driven lower surface. The vibration between the two. Even so, however, the first stop member 170 can be set higher than the second stop unit 174.
如圖所示，使用第一止擋部件172及第二止擋部件174。然而，可選地，第三止擋部件(未示出)可更配置於第二止擋部件174內側。因此，本發明之範疇，並不受止擋部件的數量所限定。As shown, the first stop member 172 and the second stop member 174 are used. Alternatively, however, a third stop member (not shown) may be disposed further inside the second stop member 174. Therefore, the scope of the invention is not limited by the number of stop members.
驅動部180可調整 第一止擋部件172與 第二止擋部件174的高度，以便調整該吸附區域的尺寸。例如，驅動部180可選擇性地使第一止擋部件172或是與第一止擋部件172與第二止擋部件174兩者，與半導體封裝體10的整體尺寸(即半導體條帶之尺寸)之該吸附區域之下表面緊密接觸。The driving portion 180 can adjust the heights of the first stopper member 172 and the second stopper member 174 to adjust the size of the adsorption region. For example, the driving portion 180 can selectively make the first stopper member 172 or both the first stopper member 172 and the second stopper member 174 and the overall size of the semiconductor package 10 (ie, the size of the semiconductor strip). The surface of the adsorption region is in close contact with the surface.
例如，如圖7所示，當具有相對較小的第一尺寸之半導體封裝體10A為被支撐在真空板110上時，驅動部180可使第一止擋部件172與該吸附區域之下表面之周圍部緊密接觸。進一步地，如圖8所示，當具有比該第一尺寸還小的第二尺寸之半導體封裝體10B被支撐於真空板110上時，驅動部180可使第一止擋部件172以及第二止擋部件174與該吸附區域中下表面的第一周圍部及第二周圍部緊密接觸。For example, as shown in FIG. 7, when the semiconductor package 10A having a relatively small first size is supported on the vacuum panel 110, the driving portion 180 may cause the first stopper member 172 and the lower surface of the adsorption region. The surrounding parts are in close contact. Further, as shown in FIG. 8, when the semiconductor package 10B having the second size smaller than the first size is supported on the vacuum panel 110, the driving portion 180 may make the first stopper member 172 and the second The stopper member 174 is in close contact with the first peripheral portion and the second peripheral portion of the lower surface of the adsorption region.
結果，即使半導體封裝體10有所更換也不需要變更台架組裝體100。As a result, it is not necessary to change the gantry assembly 100 even if the semiconductor package 10 is replaced.
圖9與圖10為根據另一示範實施例的台架組裝體的斷面圖。9 and 10 are cross-sectional views of a gantry assembly in accordance with another exemplary embodiment.
參考圖9及圖10，用於支撐半導體封裝體10的台架組裝體100可包括：真空板100，具有吸附區域，該吸附區域中形成有貫穿其中的真空孔112；本體190，與真空板110的低位部連接，並且建構為提供與真空孔112連通之真空艙122。Referring to FIGS. 9 and 10, the gantry assembly 100 for supporting the semiconductor package 10 may include a vacuum panel 100 having an adsorption region in which a vacuum hole 112 penetrating therethrough is formed; a body 190, and a vacuum panel The lower portion of the 110 is coupled and constructed to provide a vacuum chamber 122 in communication with the vacuum aperture 112.
本體190可包括：低位板192，配置於真空板110下方；邊牆194，可用於提供真空艙122。具體地說，低位板192可具有：多個與真空泵200連接的真空通道196；以及多個第二真空孔198，用於連接真空通道196與真空艙122。The body 190 can include a lower plate 192 disposed below the vacuum plate 110 and a side wall 194 for providing the vacuum chamber 122. Specifically, the lower plate 192 may have a plurality of vacuum passages 196 connected to the vacuum pump 200, and a plurality of second vacuum holes 198 for connecting the vacuum passage 196 and the vacuum chamber 122.
雖未顯示於圖式中，例如真空泵200可包括圖1及圖2所示真空單元，真空通道196可藉真空管與該真空單元之開口連接。Although not shown in the drawings, for example, the vacuum pump 200 may include the vacuum unit shown in FIGS. 1 and 2, and the vacuum passage 196 may be connected to the opening of the vacuum unit by a vacuum tube.
根據上述本發明之示範實施例，台架組裝體100可包括：真空板110，具有吸附區域，該吸附區域當中形成有貫穿其中的真空孔112；本體120，與真空板110之低位部連接；並建構為提供與真空孔112連通之真空艙122。具體地說，螢光材料層130可形成於真空板110上。因此，當由檢測相機獲得半導體封裝體之圖像時，半導體封裝體10周圍的真空板110之上位部可不被偵測到。According to the exemplary embodiment of the present invention, the gantry assembly 100 may include a vacuum panel 110 having an adsorption region in which a vacuum hole 112 is formed therein, and a body 120 connected to the lower portion of the vacuum panel 110; It is also constructed to provide a vacuum chamber 122 in communication with the vacuum aperture 112. Specifically, the phosphor layer 130 may be formed on the vacuum panel 110. Therefore, when an image of the semiconductor package is obtained by the detecting camera, the upper portion of the vacuum panel 110 around the semiconductor package 10 may not be detected.
進一步地，露出於半導體封裝體10之間的一些真空孔112，礙於螢光材料層30的關係可不被檢測相機所檢測出。因此能夠充分地改善半導體封裝體10的檢測信賴性。Further, some of the vacuum holes 112 exposed between the semiconductor packages 10 may not be detected by the detecting camera due to the relationship of the fluorescent material layer 30. Therefore, the detection reliability of the semiconductor package 10 can be sufficiently improved.
更進一步地，真空板110可建構為：具有相對較小尺寸的多個真空孔112，以真空吸附半導體封裝體10。因此，即使半導體封裝體的尺寸有變動，也不需要變更台架封裝體100。也就是說，台架組裝體100可有效處理多種不同尺寸的半導體封裝體。結果，可充分地降低半導體封裝體10的製造成本。Further, the vacuum panel 110 may be constructed as a plurality of vacuum holes 112 having a relatively small size to vacuum-adsorb the semiconductor package 10. Therefore, even if the size of the semiconductor package varies, it is not necessary to change the gantry package 100. That is to say, the gantry assembly 100 can effectively process a plurality of semiconductor packages of different sizes. As a result, the manufacturing cost of the semiconductor package 10 can be sufficiently reduced.
雖然如上述說明書實施例說明本案之用於支撐半導體封裝體之台架組裝體，但並不限定於實施例內容。因此，熟悉本技術領域者可以很容易地理解到，在不脫離附錄權利要求所定義之本發明之精神以及範疇內，可做出多樣的修改與變更。Although the gantry assembly for supporting the semiconductor package of the present invention is described as an embodiment of the above description, it is not limited to the embodiment. Therefore, various modifications and changes can be made without departing from the spirit and scope of the invention as defined by the appended claims.
10、10A、10B‧‧‧半導體封裝體
100‧‧‧托盤台架
110‧‧‧真空板
110A‧‧‧基盤板
110B‧‧‧吸附墊
112‧‧‧真空孔
112A‧‧‧低位真空孔
112B‧‧‧高位真空孔
114‧‧‧凹部
120‧‧‧本體
122‧‧‧真空艙
130‧‧‧隔牆部件
140‧‧‧隔板
142‧‧‧貫孔
150‧‧‧真空單元
152‧‧‧開口
160‧‧‧壓縮空氣源
162‧‧‧歧管
164‧‧‧主空氣管
166‧‧‧分支空氣管
170‧‧‧止擋元件
172‧‧‧第一止擋組件
174‧‧‧第二止擋組件
176‧‧‧支撐組件
178‧‧‧彈性組件
180‧‧‧驅動部
190‧‧‧本體
192‧‧‧低位板
194‧‧‧邊牆
196‧‧‧真空通道
198‧‧‧第二真空孔
200‧‧‧真空泵10, 10A, 10B‧‧‧ semiconductor package
100‧‧‧Tray rack
110‧‧‧vacuum board
110A‧‧‧Base plate
110B‧‧‧Adsorption pad
112‧‧‧vacuum hole
112A‧‧‧Low vacuum hole
112B‧‧‧High vacuum hole
114‧‧‧ recess
120‧‧‧ body
122‧‧‧vacuum
130‧‧‧ partition wall components
140‧‧‧Baffle
142‧‧‧through holes
150‧‧‧vacuum unit
152‧‧‧ openings
160‧‧‧Compressed air source
162‧‧‧Management
164‧‧‧main air tube
166‧‧‧Branch air tube
170‧‧‧stop element
172‧‧‧First stop assembly
174‧‧‧second stop assembly
176‧‧‧Support components
178‧‧‧Flexible components
180‧‧‧ Drive Department
190‧‧‧ Ontology
192‧‧‧low board
194‧‧‧ Side wall
196‧‧‧vacuum channel
198‧‧‧ second vacuum hole
200‧‧‧vacuum pump
由下列細節敘述配合參考附錄之圖式將可更容易理解本發明之實施例。其中各圖式如下說明。Embodiments of the present invention will be more readily understood from the following detailed description. The drawings are as follows.
圖1及圖2為顯示根據一示範實施例的台架組裝體之斷面圖。1 and 2 are cross-sectional views showing a gantry assembly according to an exemplary embodiment.
圖3為顯示圖1所示真空板之放大斷面圖。Figure 3 is an enlarged cross-sectional view showing the vacuum panel shown in Figure 1.
圖4為顯示具不同尺寸之半導體封裝體被圖1所示真空板所支撐狀態之放大斷面圖。4 is an enlarged cross-sectional view showing a state in which a semiconductor package having different sizes is supported by the vacuum panel shown in FIG. 1.
圖5為圖1所示真空板的另一例之斷面圖。Figure 5 is a cross-sectional view showing another example of the vacuum panel shown in Figure 1.
圖6為圖5所示真空板之放大斷面圖。Figure 6 is an enlarged cross-sectional view of the vacuum panel shown in Figure 5.
圖7及圖8為顯示圖1及圖2所示止擋單元以及驅動部之運作之斷面圖。7 and 8 are cross-sectional views showing the operation of the stopper unit and the driving unit shown in Figs. 1 and 2 .
圖9及圖10顯示根據另一示範實施例之台架組裝體之斷面圖。9 and 10 show cross-sectional views of a gantry assembly in accordance with another exemplary embodiment.
10‧‧‧半導體封裝體 10‧‧‧Semiconductor package
100‧‧‧托盤台架 100‧‧‧Tray rack
110‧‧‧真空板 110‧‧‧vacuum board
112‧‧‧真空孔 112‧‧‧vacuum hole
120‧‧‧本體 120‧‧‧ body
122‧‧‧真空艙 122‧‧‧vacuum
130‧‧‧隔牆部件 130‧‧‧ partition wall components
140‧‧‧隔板 140‧‧‧Baffle
150‧‧‧真空單元 150‧‧‧vacuum unit
160‧‧‧壓縮空氣源 160‧‧‧Compressed air source
162‧‧‧歧管 162‧‧‧Management
164‧‧‧主空氣管 164‧‧‧main air tube
166‧‧‧分支空氣管 166‧‧‧Branch air tube
170‧‧‧止擋元件 170‧‧‧stop element
180‧‧‧驅動部 180‧‧‧ Drive Department
Claims (14)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140063099A KR101627913B1 (en) | 2014-05-26 | 2014-05-26 | Table assembly for supporting semiconductor packages |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201603179A true TW201603179A (en) | 2016-01-16 |
| TWI556347B TWI556347B (en) | 2016-11-01 |
Family
ID=54867536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104115825A TWI556347B (en) | 2014-05-26 | 2015-05-19 | Table assembly for supporting semiconductor packages |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101627913B1 (en) |
| TW (1) | TWI556347B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108435714A (en) * | 2018-04-12 | 2018-08-24 | 环维电子(上海)有限公司 | A kind of Novel dry ice cleaning pedestal and its cleaning method |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105643234A (en) * | 2016-04-11 | 2016-06-08 | 群光电子(苏州)有限公司 | Sensor bracket adsorption carrier of automatic dynamic adjusting optical assemble machine |
| KR102406385B1 (en) * | 2018-01-19 | 2022-06-08 | 한미반도체 주식회사 | Sawing Apparatus of Semiconductor Materials |
| CN110653589A (en) * | 2019-10-23 | 2020-01-07 | 东莞市集银智能装备有限公司 | Backlight unit assembling equipment and carrying platform thereof |
| CN114147640B (en) * | 2021-12-06 | 2024-07-19 | 精劲精密机械南通有限公司 | Production and manufacturing process for high-precision ultrathin mechanical structural part |
| CN115091035B (en) * | 2022-06-30 | 2023-06-16 | 中南大学 | Battery cell pole piece production and cutting control system |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040084128A (en) * | 2003-03-26 | 2004-10-06 | 한미반도체 주식회사 | Chuck table of Sawing equipment |
| KR100890191B1 (en) * | 2007-10-08 | 2009-03-25 | 한국뉴매틱(주) | Vacuum jig |
| KR20110029225A (en) * | 2009-09-15 | 2011-03-23 | 임권현 | Top-board for vacuum-chuck |
| JP2011233743A (en) * | 2010-04-28 | 2011-11-17 | Disco Abrasive Syst Ltd | Method for detecting edges of cut groove |
| TWI527747B (en) * | 2012-02-28 | 2016-04-01 | 炭研軸封精工股份有限公司 | Non-contact adsorbing disk |
| JP2015057589A (en) * | 2013-08-16 | 2015-03-26 | 富士フイルム株式会社 | Production method of radiation image detector |
-
2014
- 2014-05-26 KR KR1020140063099A patent/KR101627913B1/en active IP Right Grant
-
2015
- 2015-05-19 TW TW104115825A patent/TWI556347B/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108435714A (en) * | 2018-04-12 | 2018-08-24 | 环维电子(上海)有限公司 | A kind of Novel dry ice cleaning pedestal and its cleaning method |
| CN108435714B (en) * | 2018-04-12 | 2023-08-29 | 环维电子(上海)有限公司 | Novel dry ice cleaning base and cleaning method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150135910A (en) | 2015-12-04 |
| TWI556347B (en) | 2016-11-01 |
| KR101627913B1 (en) | 2016-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI556347B (en) | Table assembly for supporting semiconductor packages | |
| TWI584396B (en) | Pallet table for supporting semiconductor packages | |
| KR101896800B1 (en) | Apparatus for picking up semiconductor packages | |
| TWI566291B (en) | A cutting device, an adsorption mechanism and a device having an adsorption mechanism | |
| KR101647877B1 (en) | Table assembly for supporting semiconductor packages | |
| TW201540149A (en) | Apparatus and method for detaching chip | |
| KR101684803B1 (en) | Vacuum table for vacuum-adsorbing semiconductor packages | |
| KR102267946B1 (en) | Apparatus for transferring semiconductor packages and semiconductor strip | |
| CN104425334A (en) | Manufacturing method of semiconductor apparatus and semiconductor manufacturing apparatus | |
| KR102401363B1 (en) | Vacuum table for vacuum-adsorbing semiconductor packages | |
| TW201616591A (en) | Apparatus for handling semiconductor packages and method of acquiring location information of semiconductor packages using the same | |
| JP6266386B2 (en) | Semiconductor test system | |
| TW201445146A (en) | Electrical test equipment | |
| KR102041182B1 (en) | Method for testing semiconductor package | |
| KR20120054002A (en) | Substrate attaching apparatus | |
| KR102158825B1 (en) | Apparatus for picking up semiconductor packages | |
| KR20180069381A (en) | Vacuum chuck supporting semiconductor substrate | |
| TWI514506B (en) | Apparatus for positioning electronic components | |
| KR101601210B1 (en) | Device for adhering and pressing semiconductor package | |
| TWI585412B (en) | Probe unit and led chip testing apparatus having the same | |
| KR102158819B1 (en) | Apparatus for picking up semiconductor packages | |
| CN109531478B (en) | Assembling clamp and assembling equipment for ceramic packaging device | |
| KR101550394B1 (en) | Manufacturing Apparatus for LED Package Using Stencil Technique, Fluorescence Layer Manufacturing Method and LED Package Manufacturing Method Using the Same | |
| KR102312862B1 (en) | Apparatus for picking up semiconductor packages | |
| KR20150137257A (en) | Suction pad for holding a semiconductor package |