TW201541086A - Electrode structure, inspection jig, and method of manufacturing electrode structure - Google Patents

Abstract

The present invention discloses an electrode structure easily solving the problem of exposed electrical wires resulting from worn electrodes, an inspection jig using the electrode structure, and a method of manufacturing electrode structure. A electrode structure (1) comprises: an insulating substrate portion (13) having an approximately-flat surface (11) and a through hole (12) formed by extension along a direction intersecting the surface (11); an electrical wire (3) fixedly attached to the through hole (12), wherein the electrical wire has one end portion inserted into the through hole (12) for allowing a front end (31) of the end portion to be located more inwardly compared to the location of an opening portion (14) of the through hole (12) opened on the surface (11); and an electrode (2) formed by plating the front end (31) with a nickel having greater harness than that of the electrical wire (3).

Description

Electrode structure, detection jig, and method of manufacturing electrode structure

The present invention relates to an electrode structure for forming an electrode, a detecting jig using the electrode structure, and a method of manufacturing the electrode structure.

The well-known substrate detecting jig is such that the rear end of the contact terminal contacting the detecting target substrate is in contact with the electrode, and the electrode and the detecting signal processing portion are connected by wires, whereby the contact terminal is connected to the detecting signal processing portion, and the substrate can be Detection is performed (for example, refer to Patent Document 1).

However, according to the above-described substrate detecting jig, the rear end of the contact terminal is in contact with the electrode, and there is a problem that the electrode is worn and the electric wire is exposed.

[Practical Technical Literature]

Patent Document 1

Japanese Patent Publication No. 2009-8516

The present invention provides an electrode structure which is easy to reduce abrasion of an electrode by abrasion of an electrode, a detection jig using the electrode structure, and a method of manufacturing the electrode structure.

An electrode structure according to the present invention includes: an insulating base portion having a substantially flat surface and extending a through hole in a direction crossing the surface; and inserting one end portion in the through hole The tip end of the end portion is located at a position further inward of the opening portion of the through hole on the surface, and is fixed to the wire of the through hole; and the electrode formed by gold plating the tip end with a first metal having a hardness higher than that of the wire .

Moreover, preferably, the electrode is approximately flush with the face.

Also, preferably, a surface gold plating layer formed of a second metal is formed on the surface of the electrode.

Moreover, preferably, the first metal is nickel and the second metal is gold.

Further, the detecting jig according to the present invention includes: the electrode structure described above; a probe having a line shape; and guiding one end of the probe to a detection point of the substrate to be detected, and to the electrode of the electrode structure The support at the other end of the probe is guided.

Further, according to the method of manufacturing an electrode structure of the present invention, the method comprises the steps of: forming an insulating base portion having a substantially flat surface and extending a through hole in a direction crossing the surface; a hole is inserted into an end of the opening of the opening in the through hole, and an insertion end of the end of the electric wire is fixed in the through hole; the end surface of the end portion and the end portion The surface of the base material portion is flush, and the end portion is processed by a first processing program; the end portion is etched from the opening portion, and the end portion of the end portion is etched further inward than the opening portion. And arranging the front end of the end portion with a first metal having a hardness greater than that of the wire to form a gold plating procedure for the electrode.

Moreover, preferably, the manufacturing method further comprises a second processing step of processing the electrode so that the electrode is approximately flush with the surface.

Moreover, preferably, the manufacturing method further comprises a surface gold plating process of forming a gold plating layer on the surface of the electrode by a second metal plating.

According to the invention, the tip end of the electric wire is located in the through hole at a position further inward than the opening portion, and the tip end portion is plated with gold to form an electrode with a first metal having a hardness higher than that of the electric wire. Therefore, gold plating is performed in a state in which the through hole is surrounded by the inner wall of the through hole, and it is easy to increase the thickness of the electrode. Moreover, if the thickness of the electrode larger than the hardness of the electric wire is increased, it is easy to reduce the problem that the electric wire is exposed due to wear of the electrode.

Further, the flat surface of the base portion and the front end surface of the electrode are flush, thereby improving the positional accuracy in the height direction of the electrode.

Further, the surface of the electrode is coated with a gold plating layer on the surface to prevent corrosion of the electrode.

Moreover, the electrode is formed of nickel which is harder than copper which is generally used as a wire material, thereby reducing wear of the electrode. Further, a gold plating layer on the surface of the electrode is formed to prevent the electrode from being corroded.

According to the invention, the other end of the probe contacts the electrode and the electrode is worn. However, since the electrode is made of a first metal having a hardness higher than that of the wire, the degree of wear is reduced. As a result, the problem that the electric wire is exposed due to wear of the electrode is reduced.

According to the present invention, since the electrode structure described above can be produced, the thickness of the electrode having a hardness higher than that of the electric wire is increased, and the problem that the electric wire is exposed due to abrasion of the electrode is apt to be reduced.

Further, the flat surface of the base portion and the front end surface of the electrode are flush, thereby improving the positional accuracy in the height direction of the electrode.

Further, the surface of the electrode is coated with a gold plating layer on the surface to prevent corrosion of the electrode.

The electrode structure, the detecting jig, and the method for producing the electrode structure of the present invention as described above tend to reduce the problem that the electric wire is exposed due to abrasion of the electrode.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals are given to the same elements, and the description thereof will be omitted. Fig. 1 is a schematic longitudinal cross-sectional view showing an embodiment of a detecting jig 7 having an electrode structure 1 according to an embodiment of the present invention, and showing a state at the time of non-detection. Fig. 2 is a schematic longitudinal cross-sectional view showing the detecting jig 7 having the electrode structure 1 shown in Fig. 1 in a state of detection.

The detecting jig 7 includes a frame 7A as a base, an electrode structure 1 having a plurality of electrodes 2, a plurality of probes Pr, a support E, a pressurizing portion 10, and the like. Here, the support body E is composed of the detection side support body E1, the electrode side support body E2, and the connection member E3 which is spaced apart by a predetermined distance from the detection side support body E1 and the electrode side support body E2.

The probe Pr is formed of a tough metal such as tungsten (W), high speed steel (SKH), beryllium copper (BeCu), or other electric conductor, and has a linear shape (rod shape) having a bendable elasticity (flexibility). )form. For example, the diameter of the probe Pr is, for example, about 100 μm.

The detection side support body E1 has a plurality of detection guide holes (not shown), and guides the detection end of the front end portion of the plurality of probes Pr to the wiring pattern of the detection target substrate 100. Further, the electrode-side support E2 has a plurality of electrode guiding holes (not shown) for guiding the rear end portions of the respective probes Pr to the plurality of electrodes 2. Each of the electrodes 2 is connected to the substrate detecting device by the electric wire 3. As described above, the tip end portion of the conductive probe Pr is in contact with the detection point of the substrate 100, and the rear end portion of the probe Pr is in contact with the electrode 2 connected to the substrate detecting device, whereby the substrate detecting device can detect the wiring pattern of the substrate 100. Further, although there is no pattern, a surface gold plating layer 4 is formed on the surface of each electrode 2.

The substrate 100 is placed in contact with the facing surface F of the substrate 100 facing the support E, as in the first drawing showing the non-detecting state, and the second drawing showing the detecting state, and if the substrate 100 is opposed to the supporting body E The support E (the detection side support E1, the electrode side support E2, and the connection member E3) is relatively moved toward the electrode structure 1 against the application pressure of the pressurizing portion 10.

As a result, the rear end portion of the probe Pr is pressed in the direction of the tip end portion of the electrode 2, and therefore the tip end portion of the probe Pr protrudes from the opposing surface F. Moreover, in the second drawing, for convenience of explanation, the state in which the tip end portion of the probe Pr protrudes from the opposing surface F is displayed.

Due to the force of the force, the tip end portion of the probe Pr is pressed in contact with the detection point facing the substrate 100, and the probe Pr existing in an inclined state between the detection side support body E1 and the electrode side support body E2 The middle part will become curved (tortuous). Therefore, according to the elastic restoring force of the probe Pr thus deformed, the tip end portion of the probe Pr contacts the detection point with a predetermined contact pressure, and the rear end portion of the probe Pr contacts the electrode 2 at a predetermined contact pressure, thereby maintaining the probe. The contact state of the front end of the needle and the detection point, and the contact state of the probe rear end and the electrode 2.

Fig. 3 is a cross-sectional view showing an embodiment of the configuration of the electrode structure 1 shown in Fig. 1. The electrode structure 1 shown in FIG. 3 includes an approximately flat surface 11 disposed to face the electrode-side support E2, and has an insulating property in which the through-holes 12 are formed in a direction intersecting (straight) with the surface 11 The base portion 13 is inserted into the through hole 12 so that the distal end 31 of the one end portion is located further inward than the opening portion 14 of the through hole 12 that is open on the surface 11 , and is fixedly attached to the through hole 12 . A copper (Cu) wire 3; and an electrode 2 formed by gold plating the front end 31 with a first metal (for example, nickel (Ni)) having a hardness higher than that of the wire 3.

The end face of the electrode 2 is flush with the face 11. Moreover, the end face of the electrode 2 is plated with a second metal such as gold (Au) so that a surface gold plating layer 4 is formed on the end face of the electrode 2. The thickness of the electrode 2 is, for example, 5 μm or more based on the abrasion resistance, and the thicker the better, and the thickness is preferably about 10 μm in practical use. The thickness of the gold plating layer 4 is, for example, 0.5 μm to 2 μm, more preferably 1 μm. Further, in each of the drawings, for the sake of easy reference, the electric wire 3, the electrode 2, and the surface gold plating layer 4 have a cross-sectional line indicating a cross section and a case where they are omitted.

As the electric wire 3, for example, a so-called magnetic wire such as an enameled wire (copper wire to which a coating is attached) can be used. The resin 5 is filled in the gap between the electric wire 3 and the through hole 12. The front end portion of the electric wire 3 is fixedly attached to the through hole 12 by the resin 5.

Fig. 4 and Fig. 5 are schematic views for explaining one embodiment of the method of manufacturing the electrode structure 1 shown in Fig. 3, respectively. First, in (a) of FIG. 4, the electric wire 3 is inserted into the through hole 12 formed in the base material portion 13. That is, one end portion of the electric wire 3 is inserted into the through hole 12 from the opposite side of the opening portion 14 in which the through hole 12 is opened on the surface 11. Next, in FIG. 4(b), in order to fix and attach the end portion of the electric wire 3 to the through hole 12, the gap between the through hole 12 and the electric wire 3 is filled with a curable resin which is thermally cured or photohardened. 5 is hardened. Thereby, the electric wire 3 is fixedly attached to the through hole 12. Fig. 4(a) and Fig. 4(b) correspond to an embodiment of the insertion procedure.

Next, in (c) of FIG. 4, the portion protruding from the opening 14 of the electric wire 3 is cut, and the cross section is polished, that is, the end surface of the front end 31 is flush with the surface 11. (c) of Fig. 4 corresponds to an embodiment of the first processing program.

Next, in (a) of Fig. 5, the front end 31 of the copper is etched by about 10 μm. (a) of FIG. 5 corresponds to an embodiment of an etching process, in which one end portion of the electric wire 3 is etched from the opening portion 14 side, and the end portion 31 of the end portion is further inward than the opening portion 14 . At this time, in the first processing procedure of (c) of FIG. 4, the front end 31 is processed to be flush with the surface 11 and then etched so that the recessed depth of the front end 31 by etching is about 10 μm. Improve machining accuracy.

Next, in (b) of FIG. 5, nickel plating (for example, nickel (Ni)) is performed on the front end 31 located at the inner side of the surface 11 with a first metal having a hardness higher than that of the electric wire 3, thereby forming the electrode 2. . Nickel plating is continued until the tip end of the electrode 2 protrudes from the opening portion 14. (b) of Fig. 5 corresponds to an example of a gold plating procedure. As the gold plating method, for example, a brush plating method can be used.

Next, in (c) of Fig. 5, the electrode 2 is polished until the front end of the electrode 2 is flush with the face 11. (c) of Fig. 5 corresponds to an embodiment of the second processing program. Next, in (d) of FIG. 5, the front end of the electrode 2 is gold-plated with a second metal (for example, gold (Au)) to form a gold plating layer 4 on the surface. (d) of Fig. 5 corresponds to an embodiment of the surface gold plating process. As described above, the electrode structure 1 shown in Fig. 3 can be formed according to the manufacturing method shown in Figs. 4(a) to 5(d).

Figs. 6 and 7 are schematic views for explaining a comparison example of the effects of the electrode structure 1 formed by the manufacturing methods shown in Figs. 4 and 5 . 6 and 7 are the first processing procedure shown in (c) of FIG. 4, and the gold plating is performed on the end surface of the front end 31 to form an electrode without performing the etching procedure of (a) of FIG. 2, and then implement a gold-plated cross-sectional view. Fig. 6 shows a case where the thickness of nickel plating is about 1 μm, and Fig. 7 shows a case where the thickness of nickel plating is about 10 μm. In addition, in FIGS. 3 to 7, for the sake of convenience of explanation, the feature portion and the like are emphasized, and a conceptual explanatory diagram such as the thickness of the gold plating layer or the thickness of the electric wire 3 is not the same as the actual size ratio.

As described above, each time the substrate 100 is disposed on the detecting jig 7, since the rear end portion of the probe Pr elastically contacts the surface gold plating layer 4 with a predetermined contact pressure, the surface gold plating layer 4 is worn out as the substrate 100 is repeatedly detected. And the electrode 2 under the surface gold plating layer 4 is also worn.

As shown in Fig. 6, when the nickel plating thickness is about 1 μm, it is easy to form the electrode 2 having a thickness of about 1 μm at the tip end 31, and the surface gold plating layer 4 is formed thereon. However, if the electrode 2 is thin and is in contact with the rear end portion of the probe Pr, the electrode 2 is easily worn.

In Fig. 8 and Fig. 9, a probe Pr having a diameter of 70 μm is used. As shown in Fig. 1 and Fig. 2, the support E of the substrate 100 is repeatedly pressed 2 million times, that is, the probe Pr is formed on the surface. After the electrode 2 of the gold plating layer 4 was contacted for 2 million times, a photograph of the gold plating layer 4 and the electrode 2 on the surface was taken. Fig. 8 is an experimental result when the electrode structure 1 shown in Fig. 3 and Fig. 5(d) is used, and Fig. 9 is an experiment when the electrode structure related to the comparative example shown in Fig. 6 is used. result.

In one embodiment shown in Fig. 8, the surface gold plating layer 4 is cut, but the depth of the surface of the gold plating layer 4 is only 1.7 μm, and the electric wire 3 is not exposed. However, in one embodiment shown in Fig. 9, the surface of the gold plating layer 4 is cut to a depth of 6.4 μm to expose the electric wires 3. That is, in one embodiment shown in Fig. 9, since the electrode 2 is thin, the nickel electrode 2 is cut, and the rear end of the probe Pr reaches the copper electric wire 3. Then, since copper is softer than nickel, as shown in Fig. 9, the wear caused by the rear end of the probe Pr is large, and the depth of cut of the electric wire 3 is increased.

As described above, in the comparative example shown in Fig. 6, when the electrode 2 is thin, the copper wire 3 is cut to a large extent, and a large amount of copper powder is generated, which causes a problem of short-circuit between the adjacent electrodes 2. Moreover, if the copper wire 3 is exposed, the front end 31 of the wire 3 is oxidized, which increases the contact resistance of the probe Pr and the wire 3. Therefore, there is a fear that the detection by the detecting jig 7 cannot be performed normally.

On the contrary, in the electrode structure 1 shown in Fig. 3, since the electrode 2 having a large hardness is formed thick, as shown in Fig. 8, the surface of the gold plating layer 4 is cut to a depth of only 1.7 μm. 3 was not exposed, no copper powder was produced, and the amount of nickel powder was not much. Thereby, the problem of short-circuit failure between the adjacent electrodes 2 can be reduced, and the front end 31 of the electric wire 3 can be prevented from being oxidized. Therefore, after the substrate detection is repeated for 2 million times, the detection by the detecting jig 7 can be reduced. problem.

On the other hand, as shown in Fig. 7, when the electric wire 3 is not etched and the thickness of the nickel plating is increased, the electrode 2 is enlarged in the lateral direction, so that the interval between the adjacent electrodes 2 becomes small. Further, the electrode 2 formed by gold plating has a large manufacturing variation, and as shown in Fig. 7, the electrodes 2 have variations in electrode height from each other. If a deviation occurs in the height of the electrode, in the detecting jig 7, the detection point of the probe Pr on the substrate 100 varies in the amount of protrusion or the applied pressure, and the detection accuracy of the substrate 100 is reduced.

Further, when the gold plating is performed by the brush plating method on the front end 31 which is flush with the surface 11, the thickness of the gold plating is increased, and in the gold plating process, an oxide film is formed on the portion in contact with the oxygen in the air, and it is feared that the gold plating is easily peeled off. Further, as shown in Fig. 7, when the side surface of the electrode 2 is exposed to the air and the surface of the electrode 2 is gold-plated to form the surface gold plating layer 4, the area of the gold plating layer 4 on the surface is increased, and the amount of gold used is also increased. The problem of increased costs. Further, in Fig. 7, although the thickness of the electrode 2 is emphasized, in actuality, if the electric wire 3 is not etched and the thick electrode 2 is formed by gold plating on the front end 31 which is flush with the surface 11, With the difficulties.

On the other hand, according to the method of manufacturing the electrode structure 1 shown in Figs. 4 and 5, and the electrode structure 1 shown in Fig. 3, the thickness of the electrode 2 is increased, and the probe Pr is easily reduced. The wear caused by the contact. Thereby, the problem that the electrode 2 is worn and the electric wire 3 is exposed can be reduced, and generation of copper powder or oxidation of the tip end 31 can be suppressed. As a result, the durability of the electrode structure 1 can be improved. Further, compared with the case where the thickness of the nickel plating is increased without etching the electric wire 3 as shown in Fig. 7, since the electrode 2 is not widened in the lateral direction, the interval between the adjacent electrodes 2 is appropriately maintained, and the electrode 2 is The side faces are not exposed to the air, so that the area of the gold plating layer 4 on the surface is minimized, which results in a reduction in gold consumption and a reduction in cost.

Further, in the second processing procedure of (c) of Fig. 5, the tip end of the electrode 2 is flush with the face 11, whereby the position of the front end between the electrodes 2 is uniform. A thin surface gold plating layer 4 of about 1 μm is formed thereon, whereby the front end surface position of each surface gold plating layer 4 is also made uniform, and as a result, the amount of protrusion of the probe Pr to the substrate 100 is detected in the detecting jig 7. Or the pressure is applied to be uniform, so that the detection accuracy of the substrate 100 can be improved.

Moreover, preferably, the surface gold plating layer 4 prevents the electrode 2 from being oxidized. However, it is not necessary to form the surface gold plating layer 4 on the surface of the electrode 2, and the surface gold plating process may not be performed. Further, the second metal used in the surface gold plating layer 4 may not necessarily be gold.

Moreover, preferably, the second machining program allows the front end of the electrode 2 to be flush with the face 11 with high precision. However, it is not necessary to implement the second processing program. The thickness of the gold plating will be controlled in the gold plating process so that the front end of the electrode 2 is processed to be approximately flush with the face 11.

Moreover, the front end of the electrode 2 does not have to be approximately flush with the face 11. For example, the tip end of the electrode 2 may be located in the through hole 12 at a position further inward from the opening portion 14.

Moreover, the electric wire 3 does not have to be copper, and the electrode 2 (first metal) does not have to be nickel. As long as the electrode 2 (first metal) is harder than the wire 3, it is possible.

Further, although the embodiment shows the case where the electrode structure 1 is mounted in the detecting jig 7, the electrode structure 1 is not limited to being built in the detecting jig 7. The electrode structure 1 can also be used for applications other than the detection device.

1‧‧‧Electrode structure
2‧‧‧electrode
3‧‧‧Wire
4‧‧‧ surface gold plating
5‧‧‧Resin
7‧‧‧Detection fixture
7A‧‧‧Frame
10‧‧‧ Pressing department
11‧‧‧ Face
12‧‧‧through holes
13‧‧‧Parts
14‧‧‧ openings
31‧‧‧ front end
100‧‧‧Substrate
E‧‧‧Support
E1‧‧‧ side support
E2‧‧‧electrode side support
E3‧‧‧Connecting parts
F‧‧‧ opposite
Pr‧‧‧ probe

Fig. 1 is a schematic longitudinal cross-sectional view showing an embodiment of a detecting jig having an electrode structure according to an embodiment of the present invention, and shows a state at the time of non-detection. Fig. 2 is a schematic longitudinal cross-sectional view showing the detection jig of the electrode structure shown in Fig. 1 in a state of detection. Fig. 3 is a cross-sectional view showing an embodiment of the configuration of the electrode structure shown in Fig. 1. Fig. 4 is a schematic explanatory view showing an embodiment of a method of manufacturing an electrode structure shown in Fig. 3. Fig. 5 is a schematic explanatory view showing an embodiment of a method of manufacturing an electrode structure shown in Fig. 3. Fig. 6 is a schematic view for explaining a comparative example of the effect of the electrode structure formed by the manufacturing method shown in Figs. 4 and 5; Fig. 7 is a schematic view for explaining a comparative example of the effect of the electrode structure formed by the manufacturing method shown in Figs. 4 and 5; Fig. 8 is a schematic view showing the experimental results when the electrode structure shown in Fig. 3 is used. Fig. 9 is a schematic view showing the results of experiments using the electrode structure of the comparative example shown in Fig. 6.

1‧‧‧Electrode structure

2‧‧‧electrode

3‧‧‧Wire

4‧‧‧ surface gold plating

5‧‧‧Resin

11‧‧‧ Face

12‧‧‧through holes

13‧‧‧Parts

14‧‧‧ openings

31‧‧‧ front end

Claims (8)

An electrode structure comprising: a base material portion having an insulating property and having a flat surface, extending in a direction crossing the surface to form a through hole; and an electric wire, one end of the electric wire being inserted into the through hole The wire is fixedly attached to the through hole at a position where one end of the end portion is located inward of the opening of the through hole on one of the openings, and an electrode which is harder than the wire One of the largest first metals is formed by gold plating the front end. The electrode structure according to claim 1, wherein the electrode is flush with the surface. The electrode structure according to claim 1 or 2, wherein a surface of the electrode is formed with a surface-plated layer formed of a second metal. The electrode structure according to claim 3, wherein the first metal is nickel and the second metal is gold. A test fixture comprising: the electrode structure according to any one of claims 1 to 4; a probe having a linear shape; and a support body for detecting one of the substrates as one of the detection targets A point is directed to one end of the probe and the other end of the probe is directed to the electrode of the electrode structure. A method of manufacturing an electrode structure, comprising the steps of: inserting a substrate from a through-hole for an insulating one having a flat surface and extending in a direction crossing the surface to form a through hole An end portion of one of the electric wires is inserted into the through hole in an opposite side of the opening of the opening, and the end portion of the electric wire is fixedly attached to the through hole; the first processing procedure is to make the end portion The end surface is flush with the surface of the base material portion, and the end portion is processed. The etching process is performed by etching the end portion from the opening portion side so that one end of the end portion enters further inward than the opening portion. And a gold plating process, the front end of the end portion is plated with a first metal having a hardness greater than that of the wire to form an electrode. The method for manufacturing an electrode structure according to claim 6, further comprising the following steps: The second processing step of processing the electrode such that the electrode is flush with the surface. The method for manufacturing an electrode structure according to claim 6 or 7, further comprising the following steps: a surface gold plating process, wherein a surface of the electrode is plated with a second metal to form a gold plating layer.