JPH0580124A - Semiconductor element inspecting device - Google Patents

Abstract

PURPOSE:To provide a semiconductor element inspecting device, which can test a semiconductor chip having a large number of electrodes at an extra-high speed and with high precision through probing. CONSTITUTION:The probe side of a wire connecting a wiring board 30 of a tester to each probe 28 is held in a through hole in an insulated base board 29 and the tip of the probe 28 is formed in a single piece with the wire, or is formed from a spring probe held by another insulated base board or a needle formed by a film formation technique held by another insulated base board. Further the wire is covered with an insulative covering 34 and enclosed with a grounded electroconductive material 36, and thereby a coaxial cable for test signals is formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection device, and more particularly to a semiconductor device inspection device for inspecting electrical performance by contacting a large number of electrodes or probe contact terminals of a semiconductor device such as an IC or LSI.

[0002]

2. Description of the Related Art FIG. 13A is an external view of a semiconductor wafer 1 used for measurement. A semiconductor element (chip) 2 such as an LSI is separated from the wafer 1 as shown in FIG. A large number of electrodes 3 are arranged on the periphery of the chip 2. Further, the electrode 3 of the chip 2 has a tungsten needle probe 5 of a probe card 4 shown in FIG.
It was made to press and contact by rubbing by the spring pressure and inspecting an electric characteristic. FIG. 15 is a top view of FIG.

FIG. 16 is a perspective view of a chip 2 having a solder ball 6 on each electrode. As shown in FIG. 17, the solder balls 6 of the chip 2 are made to face the electrodes 8 on the surface of the wiring board 7. Since all electrodes are collectively connected with each other, it is widely used to efficiently connect high-density semiconductor elements with high yield. Japanese Patent Laid-Open No. 58-73129 discloses an example of a method and apparatus for inspecting a semiconductor element having solder balls on the electrodes. FIG. 18 is an explanatory view of the above-mentioned known technique, and FIG. 19 is a partial sectional view thereof. As shown in FIG. 19, a signal conductor wiring 9 having a constant characteristic impedance and having a power supply conductor layer 10 as a reference layer is embedded in the multilayer wiring board 11, and the protruding electrode 1 is provided at the tip thereof.
Two are provided. Further, in the characteristic inspection, as shown in FIG. 18, the projecting electrodes 12 are pressed against the solder balls 6 on the surface of the chip 2 and are heated by the heat source 13 to melt the solder to send and receive the inspection signal. After the inspection, the solder is melted again to separate the protruding electrodes 12.

Further, the electrodes having an extremely narrow pitch on the surface of the semiconductor element 2 are connected to the inspection apparatus with the interval enlarged by the multilayer wiring board 11. Japanese Unexamined Patent Publication No. 64-71141 discloses an example of an inspection device that does not melt the solder in the chip electrode portion. FIG. 20 is a cross-sectional view of the probe portion of the inspection device. Inspection signals are transmitted and received from the coaxial connector 25 of the inspection device via the coaxial cable 18, and these signals are connected to the electrodes 15 of the substrate on which the chip 2 is mounted.
FIG. 21 is a partial cross-sectional view of the tip portion of the probe. A tube and a spring probe 1 configured to be slidably fitted in the tube and project outward by a spring.
4 is penetrated through the through hole in the conductive substrate 16 for shielding, and both ends thereof are held by the insulating substrate 17.
The through hole is formed at the position of the electrode 15 to be inspected. The lower movable pin of the spring probe 14 contacts the electrode 15, and the upper movable pin is connected to the core wire of the coaxial cable 18 via the flanged electrode 21. The flanged electrode 21 and the coaxial cable 18 are held by the insulating substrate 20, and the shield 23 of the coaxial cable 18 is soldered to the conductive substrate 22. Since the above-described inspection apparatus connects a large number of movable pins to corresponding electrodes at the same time and can also cope with electrodes having steps, it is characterized in that stress applied to the semiconductor element is small and high-speed inspection can be performed.

[0005]

With the increase in the density of semiconductor elements, the density of probes for inspection has increased and the number of pins has increased.
It is desired to develop a simple technique for increasing the pitch of the wiring pattern for connecting the probe terminal to the inspection circuit. Figure 1
4, the probe card inspection device shown in FIG. 15 has a problem in that the probes 5 are long and are densely packed, so that the concentrated inductance is large and the inspection speed is limited. Further, there is a problem that it is difficult to apply to a semiconductor element having a large number of electrodes because the spatial arrangement of the probe is restricted. For example, when the concentrated inductance L of the probe 5 is 50 nH and the characteristic impedance R of the signal line on the probe card is 50Ω, the time constant L / R is 1
Since it is nS, when a higher speed signal than this is handled, the waveform becomes blunt and an accurate inspection cannot be performed. For this reason, probe card inspection devices have typically been limited to direct current or relatively low frequency inspection.

On the other hand, in the apparatus shown in FIGS. 18 and 19,
Although it is possible to set the characteristic impedance of each signal line of the probe card to a predetermined value, it takes time to design and manufacture such a probe card, and it is expensive. However, there is a problem in that it is difficult to take countermeasures and corrections, and the responsiveness to pattern changes is poor. Further, since it is necessary to melt the solder at the time of inspection, there is a problem that the inspection time is required and the semiconductor element is subjected to thermal stress. Further, in the device shown in FIGS. 20 and 21, since the characteristic impedance of the coaxial cable can be maintained at a predetermined value, high-speed electrical characteristics can be inspected. Since skill is required for delicate assembly work such as insertion of the cable 18 and fixing of the flanged electrode 21 to the core wire of the coaxial cable, there is a problem that it takes time and work efficiency is poor. The object of the present invention is to improve the drawbacks of the above-mentioned conventional device, to simplify the structure, to easily assemble, and to cope with pattern changes, and to expand the extremely narrow wiring pitch of the probe tip without impairing the electrical characteristics. It is to provide a semiconductor element inspection device that can be taken out as a product.

[0007]

In order to solve the above-mentioned problems, a probe unit for holding the tips of a plurality of probes, and a probe unit for holding the probe unit and electrically connecting between the probe unit and the tester are provided. The probe unit further includes: a probe header section that holds the tip portions of the plurality of probes; and a wiring section that connects the probe header section and the wiring board with a wire rod. At least a part of the plurality of wire rods in the wiring portion is used as a wire rod with an insulating coating so that a gap between the wire rods is filled with a conductive material. Further, the conductive material is connected to the ground potential of the tester, a part of the wire material with an insulating coating of the wiring portion is connected to the power supply potential of the tester, and the other is connected to the test signal transmitting / receiving terminal. To do. In addition, the wire material with an insulating coating to be connected to the test signal transmitting / receiving terminal is inserted into the insulating tube as needed.

Further, at least a part of the wire material with an insulating film connected to the test signal transmitting / receiving terminal is a coaxial cable. Further, a plurality of wires of the wiring portion is formed of copper, tungsten, stainless steel, copper-tin alloy, beryllium-copper alloy, and the insulating film is polytetrafluoroethylene, or polyparaxylene, or polyimide, or The insulating tube is made of enamel or the like, and the insulating tube is made of polyimide or polytetrafluoroethylene. Also, each of the wires is individually held in the through hole of an insulating substrate formed of any of free-cutting ceramics, acrylic, polyimide, engineering plastic, and photosensitive glass of the wiring portion of the probe unit. To do.

Further, the wire rods of the plurality of probes and the wiring portion are integrally formed. In addition, the probe header section is composed of a plurality of spring probes and an insulating substrate that holds each of them, and one of the movable pins of each spring probe is individually connected to the wire end held by the wiring section of the probe unit. Try to connect.

Further, the tip of each probe of the probe header section is constituted by an insulating substrate for holding each probe individually, and the end of each probe is soldered to the end of the wiring section of the probe unit. .. In addition, a conductor portion in which each probe tip portion held by the insulating substrate of the probe header portion is filled in a through hole of the insulating substrate, and plating, vapor deposition, CVD, sputtering, etc. on the tip of the conductor portion. The film is formed by the above method to form a projection. Further, a conductive tube is attached to each wire of the wiring portion of the probe unit, and these are provided with a plurality of stepped through holes provided in the insulating substrate of the wiring portion of the probe unit.
Each wire is inserted into the cable to position the wire. Further, a recess is provided in the stepped through-hole end so that the wire rod end to which the conductive tube is attached fits inside the stepped through-hole, and the spring probe is movable. Try to guide you through the pins.

[0011]

The probe header section of the probe unit holds a plurality of probe tips, and the wiring section of the probe unit is connected to the wiring board by expanding the pitch of the probe tips using a wire material. , The wiring board is professional
Connect the unit between testers. Further, a part of the wire material with an insulating coating of the wiring portion is used as a power supply line, and the other part is inserted into an insulating tube as needed and used as a test signal line. Further, since the conductive material filled in the gap portion of the wire is connected to the ground potential, the wire without the insulating coating becomes the ground wire, and the power supply line is shielded by the conductive material. The test signal line is equivalent to a coaxial cable using the conductive material as a shield. Further, the characteristic impedance of the coaxial cable is set by the dielectric constant and thickness of the insulating coating or the insulating tube. If necessary, a ready-made coaxial cable is used for the test signal line.

Further, the above-mentioned wire material copper, tungsten,
Stainless steel, copper-tin alloy, beryllium-copper alloy, etc. impart appropriate rigidity to the wire material, and insulation film materials such as the above polytetrafluoroethylene, polyparaxylene, polyimide, and enamel, and insulation properties such as polyimide and polytetrafluoroethylene The tube material is selected according to the characteristics of the coaxial cable and the insulation of the power supply line. Further, the insulating substrate material of the wiring portion such as the above-mentioned free-cutting ceramics, acrylic, polyimide, engineering plastic, and photosensitive glass enables the through hole fitted with the above-mentioned wire to be processed accurately and efficiently. To do. In addition, the device of the present invention in which the tip portions of the plurality of probes and the wire material of the wiring portion are integrated, the spring probe is omitted to simplify the structure, and the measuring function dedicated to the semiconductor chip equipped with the solder ball is provided. provide.

Further, the structure in which the spring probe of the probe header section is separately held on the insulating substrate allows the probe header to be separated and replaced from the wiring section of the probe unit. Further, a thick film conductor is filled in the through hole of the insulating substrate, and a projecting tip portion is formed thereon by a film forming technique to collectively form the probe header portion (batch process). Further, a conductive tube is attached to the tip of each wire in the wiring part of the probe unit, and the insulating substrate through-hole in the wiring part is formed with a step to position and fix each wire. To facilitate.

[0014]

1 is a cross-sectional view of a probe portion of a semiconductor device inspection apparatus according to the present invention. In FIG. 1, a plurality of solder balls 6 provided on the surface of each electrode 3 of a chip 2 to be inspected are pressed by the respective conductive probes 28 fixed at the positions of the insulating substrate 29 corresponding to these balls. .. The plurality of conductive probes 28 are polished so that all of their tip positions are aligned on one plane and then electropolished, or they are processed into needles by electropolishing and then the tip portions are pressed against a flat plate for insulation. Since it is fixed to the substrate 29, the variation in the tip position is kept within 10 μm.

The tip of the probe 28 has a solder ball 6
Since it is pressed against and bites into, it is possible to always obtain good electrical contact even if there is a variation in the tip position or the height of the solder ball.
It is possible to omit all of the spring probe 14 of the conventional device shown in FIG. Further, since the conductor of the conductive probe 28 is directly soldered to the wiring board 30, the conductor shown in FIGS.
By omitting the coaxial cable 18 of the conventional device shown in FIG. 1, processing of the end portion of the coaxial cable and insertion work can be omitted, and the flanged electrode 21 is attached to the core wire of the coaxial cable.
It is also possible to omit the troublesome assembling work such as fixing. In addition, since the interval (pitch) of the conductive probe 28 can be reduced from 0.45 mm of the related art to 0.2 mm or less, it is possible to inspect the electrical characteristics of the semiconductor device corresponding to this. Further, the pitch between the conductors of the conductive probe 28 can be easily expanded to a proper pitch up to the electrode 31 portion of the wiring board 30.

Each conductive probe 28 is fixed by penetrating the insulating substrate 29 and further fixed by an insulating adhesive 51. The conductive probe 28 is formed of any material having an appropriate hardness such as copper, tungsten, stainless steel, copper-tin alloy, beryllium-copper alloy, and the insulating substrate 29 is made of free-cutting ceramics, acrylic, polyimide. , Engineering plastic, or photosensitive glass. The upper end of each probe 28 is soldered to the electrode 31 of the wiring board 30, and the coaxial connector 25
Is connected to the inspection circuit via.

If the conventional coaxial cable is omitted as described above, the impedance matching obtained by the coaxial cable may be destroyed. However, the problem is that the conductor of each probe 28 is connected to the insulating substrate 29 as shown in FIG.
To the electrode 31 of the wiring board 30 by insulating coating with a coating material 34, covering with an insulating tube 35 if necessary, covering the conductive material 36, and grounding it. Can be resolved. In this way, each probe 28 uses its conductor as a core wire and the covering material 3
Since the coaxial cable 4 and the tube 35 are used as insulating coatings and the conductive material 36 is used as a grounding sheath, the required characteristic impedance can be obtained by appropriately setting the material (dielectric constant) and thickness of the insulating coatings. Is obtained.

That is, with the configuration shown in FIG. 1, the conductor portion of each probe 28 can be matched with the impedance level of the inspection device, the chip 2, etc. to meet the conditions for high-speed measurement. By omitting the cable, workability, economy, reliability and the like can be improved. In FIG. 1, the covering material 34 is an insulating material such as polytetrafluoroethylene, polyparaxylene, polyimide, or enamel, and the tube 35 is an insulating tube such as polyimide or polytetrafluoroethylene.

FIG. 2 is a cross-sectional view of an embodiment of the probe portion according to the present invention for the case where the electrode 3 of the chip 2 which is the subject is not provided with the solder ball 6. In this case, in order to absorb the variation in the position of the tip of the probe, the spring probe 14 is provided so that the tip 39 of the probe is pressed against the electrode 3 by its spring force. However, the impedance matching of the conductor portion of each probe is the same as in the case of FIG. The probe provided with the spring probe 14 has a solder ball 6 on the surface of the electrode 3 shown in FIG.
The present invention can also be applied to a semiconductor element having a structure.

In FIG. 2, a plurality of spring probes 14 are arranged facing the electrodes 3 of the chip 2.
The spring probe 14 includes a probe tube and two movable pins 39 and 44 which are slidable in the probe tube and whose tips always project outward from the probe tube by the elastic force of the spring. It consists of The spring probe 14 penetrates a pair of upper and lower insulating substrates 38, and a movable pin 39 having a diameter smaller than the tube outer shape of the spring probe 14 penetrates the insulating substrate 40 for probe tip positioning in a slidable state. There is. The spring probe 1 is provided between the pair of upper and lower insulating substrates 38.
The spacers 41 are provided according to the length of 4.

The insulating substrates 38 and 40 are made of free-cutting ceramics, acrylic, polyimide, engineering plastic, or photosensitive glass. Each spring probe 14 is connected to the inspection apparatus body via the corresponding conductive wire 43 and wiring board 30. The upper movable pin 44 of each spring probe 14 is an insulating substrate 29.
Of the conductive wire 43 that is penetrated through the through hole and fixed by the insulating adhesive 51. For this reason,
The through holes of the insulating substrate 38 and the through holes of 29 are opposed to each other.

The conductive wire 43 is made of any one of copper, tungsten, stainless steel, copper-tin alloy, and beryllium-copper alloy. Cover with an insulating coating material 34 such as tetrafluoroethylene, polyparaxylene, polyimide, or enamel, and further insert an insulating tube 35 such as polyimide or polytetrafluoroethylene into the coating material 34 if necessary. To do. In addition, the conductive wire 43, the insulating covering material 34, the insulating tube 35, and the like are covered with a conductive material 36 such as a conductive resin or a conductive adhesive. With the configuration of FIG. 2 described above, the coaxial cable 18 in the conventional device of FIGS. 20 and 21 can be replaced with a simple conductive wire 43, so that processing of the end portion of the coaxial cable can be omitted, and the core wire of the coaxial cable can be flanged. The troublesome assembling work for fixing the electrode 21 with electrodes can be omitted.

FIG. 3 is a sectional view of another embodiment of the probe portion of the semiconductor device inspection apparatus according to the present invention. As in the case of FIG. 1, the tip of the probe 45 is pressed against and brought into contact with the plurality of solder balls 6 provided on the surface of each electrode 3 of the chip 2 to be inspected. The plurality of probes 45 are nickel, nickel-copper alloy, beryllium-copper alloy, tungsten, molybdenum, titanium, chromium, tantalum or niobium on the surface of the thick film conductor 47 in the through hole of the ceramic substrate 46 such as alumina or mullite. And the like are formed by a film forming method such as plating, vapor deposition, CVD, or sputtering. If necessary, the film is etched to form on the protrusions. Since the plurality of conductive probes 45 are processed by etching after being polished so that all the tip positions thereof are aligned on one plane, variations in the tip positions are kept within 10 μm.

The exposed surface of the upper portion of the through-hole thick film 47 is nickel-plated, and gold, tin, solder or the like is further plated thereon to form a plated portion 48 having good solderability. The plated portion 48 of each probe is soldered to the end of the conductive wire 43 that penetrates the insulating substrate 29 by a solder ball 49. The insulating substrate 29 and the ceramic substrate 46 are connected via the spacer 41.

Next, various methods according to the present invention for inserting and fixing the end portion of each probe wire 43 into the insulating substrate 29 will be described with reference to FIGS. In large-scale computer LSIs and the like, the number of wire rods 43 may exceed 1,000. According to the present invention, the number of wire rods is 200.
It is thought that it will reach the range of 0 to 3000 lines. Practically, such a large number of wires can be correctly and quickly insulated substrate 2
9. It is not normal to insert and fix it in others. 4 to 6 are partial sectional views of the method of the present invention for inserting and fixing the end portion of the probe wire 43 into the insulating substrate 29.

In FIG. 4, each conductive wire 43 made of a material such as copper, tungsten, stainless steel, copper-tin alloy, beryllium-copper alloy is inserted into the through hole of the insulating substrate 29, and then the insulating adhesive 51 is used. Stick with. FIG. 5 shows a case where a taper is provided at the end of the through hole of the insulating substrate 29, which has the effect of guiding each conductive wire 43 to facilitate insertion. FIG. 6 shows a case where the tip end of each conductive wire 43 is recessed inside the through hole of the insulating substrate 29, whereby the tip end of the movable pin 44 of the spring probe 14 in FIG. 2 is guided and inserted. The effect of making it easier is obtained.

In FIGS. 4 to 6 described above, three conductive wires 43 are drawn. The conductive wire 43 on the left side is for the signal line already described. The conductive wire 43 in the center is for power supply wiring, and is covered with an insulating covering material 34 to have a low impedance. The conductive wire 43 on the right side is for grounding and is in contact with the conductive material 36.

7 to 11 are partial sectional views of another method of the present invention for inserting and fixing the end portion of the conductive wire 43 into the insulating substrate 29. 7 to 11, as a preparatory work, a conductive tube 56 is previously inserted into the end portion of the conductive wire 43 by caulking, or is fixed by laser welding, spot welding, solder connection, or the like. In FIG. 7, the through hole of the insulating substrate 29 is fitted with the conductive tube 56, and an insulating substrate 55 for preventing the conductive tube 56 from slipping off is provided above the insulating substrate 29. Therefore, the conductive wire 4 with the conductive tube 56 attached
When 3 is inserted from below, the insulating substrate 55 serves as a stopper to easily fix the conductive wire 43 at a predetermined position.

Further, as shown in FIG. 8, if a taper is provided at the end of the through hole of the insulating substrate 55, the conductive wire 43 can be easily inserted into the through hole. The three conductive wires 43 shown in the figure are for signals, power, and ground sequentially from the left as in the case of FIGS. The wire on the left side of FIG. 9 is the coaxial cable 18, and the conductive tube 56 is attached to the core wire of the coaxial cable.

Similar to FIG. 6, FIG. 10 shows a case where the tip of each conductive wire 43 is recessed inside the through hole of the insulating substrate 29, and the conductive tube 56 is shortened accordingly. FIG. 11 shows a case where a conductive tube 56 having a metal electrode 58 attached thereto is fixed to the tip of the conductive wire 43, and the metal electrode 58 is previously plated with gold to ensure good contact characteristics. You can

FIG. 12 is a diagram showing an example in which the semiconductor device inspection apparatus of the present invention is configured as a wafer prober. In FIG. 12, a wafer 1 which is an object to be inspected is placed on a sample table 63 and driven by an elevating drive section 65 via an elevating shaft 64, and each of the probe sections already described in FIG. The spring probe 14 is pressed against the corresponding plurality of electrodes 3 on the surface of the semiconductor wafer 1. The wiring board 30 of the probe section is attached to the base 66.

The elevation drive unit 65 is a microprocessor 72.
Is controlled by a signal sent from the control bus 71 to the fine movement of the sample table 63 in the vertical direction in cooperation with the tester 69. Further, the elevating / lowering drive unit 65 is installed on the XY stage 67 to position the semiconductor wafer 1 in a horizontal plane, and the orientation is controlled by a rotating mechanism (not shown). Each electrode of the semiconductor wafer 1 is connected to the tester 69 from the coaxial connector 25 of the wiring board 30 via the cable 68, and various inspection signals are transmitted and received between the electrodes of each of the plurality of semiconductor elements formed on the semiconductor wafer 1. Operating characteristics are tested sequentially.

[0033]

According to the present invention, the end portions of the wire material connected to the respective electrodes of the semiconductor chip are fixed by the insulating substrate in accordance with the above electrode pitch, and are expanded to the wiring pitch of the wiring substrate connected to the tester. As a result, the wiring pitch of the probe section can be narrowed, whereby the number of tests can be expanded from the level of 1000 lines in a conventional large-scale computer LSI or the like to the level of 2000 to 3000 lines.
In addition, the through hole of the insulating substrate holding the end of the wire is
If the probe is processed by NC, the number of probes, the same pitch, etc. can be set / changed quickly and easily according to the electrode arrangement of each semiconductor chip, which can shorten the design and manufacturing period.

Furthermore, since the conductor of the above wire is covered with an insulating material and covered with a conductive material to be used as a coaxial cable, the work of attaching the end of the coaxial cable to the insulating substrate through hole in the conventional device and the flange are performed. It is possible to omit the troublesome assembly work of fixing the attached electrode to the core wire.

Further, by integrating the tip portions of the plurality of probes with the wire material, it is possible to omit all of the spring probe of the conventional device and test the semiconductor chip having the solder balls on the electrodes. In addition, the probe pitch can be reduced from 0.45 mm of the related art to 0.2 mm or less, so that it is possible to inspect a semiconductor element having a narrow electrode pitch corresponding to this.

Further, by providing the spring probe in the probe header portion, it is possible to test both the semiconductor chip having the solder ball and the semiconductor chip not having the solder ball.

In addition, each probe tip is filled with a thick film conductor in the through-hole of the insulating substrate, and then a protruding tip is formed on the thick film conductor by a film forming technique, whereby a large number of probes can be obtained. It can be made in a batch with high precision, and each
The variation in the tip position of the protrusion can be kept within 10 μm.

Further, a conductive tube is attached to each end of each wire of the wiring portion of the probe unit, and these are fitted into the stepped through holes of the insulating substrate of the wiring portion, whereby each wire is attached. Since it is easy to position, the man-hours for assembly and adjustment can be shortened and the device can be made economical.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a probe portion of a semiconductor device inspection apparatus according to the present invention.

FIG. 2 is another cross-sectional view of the probe portion of the semiconductor device inspection apparatus according to the present invention.

FIG. 3 is another cross-sectional view of the probe portion of the semiconductor device inspection apparatus according to the present invention.

FIG. 4 is a partial cross-sectional view of an insulating substrate for inserting and fixing an end portion of a probe wire according to the present invention.

FIG. 5 is another partial cross-sectional view of the insulating substrate for inserting and fixing the end portion of the probe wire according to the present invention.

FIG. 6 is another partial cross-sectional view of the insulating substrate for inserting and fixing the end portion of the probe wire according to the present invention.

FIG. 7 is another partial cross-sectional view of the insulating substrate for inserting and fixing the end portion of the probe wire according to the present invention.

FIG. 8 is another partial cross-sectional view of the insulating substrate for inserting and fixing the end portion of the probe wire according to the present invention.

FIG. 9 is another partial cross-sectional view of the insulating substrate for inserting and fixing the end portion of the probe wire according to the present invention.

FIG. 10 is another partial cross-sectional view of the insulating substrate for inserting and fixing the end portion of the probe wire according to the present invention.

FIG. 11 is another partial cross-sectional view of the insulating substrate for inserting and fixing the end portion of the probe wire according to the present invention.

FIG. 12 is a diagram in which the semiconductor device inspection apparatus of the present invention is configured as a wafer prober.

FIG. 13 is a perspective view of a wafer and chips.

FIG. 14 is a cross-sectional view of a conventional inspection probe.

FIG. 15 is a plan view of FIG.

FIG. 16 is a perspective view of a semiconductor device having solder balls on electrodes.

FIG. 17 is a perspective view showing a mounted state of the semiconductor element of FIG.

FIG. 18 is a partial cross-sectional view of a conventional inspection device.

19 is a partial cross-sectional view of the inspection apparatus multilayer wiring board of FIG.

FIG. 20 is a partial cross-sectional view of a probe unit portion of a conventional semiconductor device inspection apparatus.

21 is a cross-sectional view of the probe tip portion of FIG. 20. FIG.

[Explanation of symbols]

 1 Wafer 2 Semiconductor Element (Chip) 3 Electrode 4 Probe Card 5 Probe 6 Solder Ball 7 Wiring Board 8 Electrode 9 Signal Conductor Wiring 10 Power Conductor Layer 11 Multilayer Wiring Board 12 Projection Electrode 13 Heat Source 14 Spring Probe 15 Electrode 16 For Shielding Conductive board 17 Insulating board 18 Coaxial cable 20 Insulating board for holding core wire 21 Electrode with flange 22 Conductive board 23 Shield 24 Solder 25 Coaxial connector 28 Conductive probe 29 Insulating board 30 Wiring board 31 Electrode 34 Insulating coating 35 Insulating tube 36 Conductive material 38 Insulating substrate 39 Movable pin 40 Insulating substrate 41 Spacer 43 Conductive wire 44 Movable pin 45 Probe 46 Ceramic substrate 47 Thick film conductor 48 Plating part 49 Solder ball 51 Insulating adhesive 55 Insulation Plate 56 conductive tube 58 metal electrodes 63 sample table 64 elevating shaft 65 elevation drive unit 66 units 67 X-Y stage 68 cable 69 tester 71 control bus 72 microprocessor

Claims (16)

[Claims] 1. A semiconductor element inspecting apparatus for transmitting and receiving an inspection signal between the semiconductor element and the tester by respectively contacting the tips of a plurality of probes with a plurality of electrodes of the semiconductor element, and the tips of the plurality of probes. And a wiring board that holds the probe unit and electrically connects between the probe unit and the tester, and the probe unit holds the tip portions of the plurality of probes. A probe header portion, and a wiring portion for wiring between the probe header portion and the wiring board with a wire material, further, at least a part of the plurality of wire material of the wiring portion is a wire material with an insulating coating, further, of the wiring portion A semiconductor element inspection apparatus characterized in that a gap between a plurality of wires is filled with a conductive material. 2. The semiconductor device inspection apparatus according to claim 1, wherein the conductive material is connected to the ground potential of the tester. 3. The method according to claim 1 or 2, wherein a part of the insulating coated wire material of the wiring part is connected to a power supply potential of the tester and the other is connected to a test signal transmitting / receiving terminal. Semiconductor device inspection device. 4. The semiconductor element inspection apparatus according to claim 3, wherein at least the wire material with an insulating film connected to the test signal transmitting / receiving terminal is inserted into an insulating tube. 5. The method according to any one of claims 1 to 4,
A semiconductor element inspecting device, characterized in that at least a part of the wire material with an insulating coating connected to the test signal transmitting / receiving terminal is a coaxial cable. 6. The method according to any one of claims 1 to 5,
A semiconductor element inspection apparatus, wherein the plurality of wires of the wiring portion are formed of any one of copper, tungsten, stainless steel, a copper-tin alloy, and a beryllium-copper alloy. 7. The method according to any one of claims 1 to 6,
A semiconductor element inspection apparatus, wherein the insulating coating material of the wire with an insulating coating of the wiring portion is polytetrafluoroethylene, polyparaxylene, polyimide, or enamel. 8. The semiconductor device inspection apparatus according to claim 4, wherein the insulating tube is formed of polyimide or polytetrafluoroethylene. 9. The method according to claim 1, wherein
The semiconductor device inspecting device according to claim 1, wherein the wiring portion of the probe unit holds each of the wires in a plurality of through holes of an insulating substrate. 10. The insulating substrate according to claim 9, which holds the wire material of the wiring portion of the probe unit, is formed of any of free-cutting ceramics, acrylic, polyimide, engineering plastic, and photosensitive glass. Semiconductor device inspection device. 11. The semiconductor element inspection device according to claim 1, wherein the wire rods of the plurality of probes and the wiring portion are integrally formed. 12. The two movable pins according to claim 1, wherein the probe header portion is slidably pushed outward from at least both ends of the probe tube by a spring force. A plurality of spring probes and an insulating substrate holding the plurality of spring probes, and one of the movable pins of the spring probe is connected to each end of the wire rod held by the wiring portion of the probe unit. The semiconductor device inspection apparatus characterized by the above. 13. The probe header section according to claim 1, wherein the probe header section is composed of an insulating substrate for holding each tip of the probe, and the end section of each probe held by the insulating substrate is for the probe. -A semiconductor element inspection device characterized in that it is adapted to be soldered to the end of the wiring portion of the sub unit. 14. The conductor section according to claim 13, wherein each of the probe tips held by the insulating substrate of the probe header section is filled in a through hole of the insulating substrate, and on the tip of the conductor section. A semiconductor element inspection apparatus, wherein a film is formed by a method such as plating, vapor deposition, CVD, and sputtering, and the projection is formed by etching the film as necessary. 15. A conductive tube attached to each wire of a wiring portion of the probe unit, and a plurality of steps provided on an insulating substrate of the wiring portion of the probe unit according to any one of claims 1 to 14. And a through hole, wherein the conductive tube portion of the wire is inserted into each of the stepped through holes to position the wire. apparatus. 16. The conductive tube according to claim 12, which is attached to an end of each wire rod of a wiring portion of the probe unit.
And a plurality of stepped through holes provided on the insulating substrate of the wiring portion of the probe unit, and the conductive tube of the wire is inserted into each of the stepped through holes. The wire rod is positioned by the above-mentioned method, and the end of each wire rod and the end of the conductive tube are housed inside the stepped through-hole so that the stepped through-hole end is formed. A semiconductor element inspecting device, characterized in that a recess is provided in the portion, and one of the movable pins of the spring probe is guided into the recess.