JP2012127869A - Insulation-coated probe pin and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily adjust a shape of an end part of an insulation coat to a shape without variations throughout its entire perimeter by a simple method without performing peeling operation.SOLUTION: An electrode 22 is soaked in electrodeposition liquid L containing an electrodeposition material for forming an insulation coat 12, a probe pin 11 is vertically inserted thereinto such that a detection end side 11a of the probe pin 11 is directed upward, and a voltage to be energized to the electrode 22 and the probe pin 11 is adjusted. Therefore, a detection end side 12a of the insulation coat 12 is made into a desired shape such as a tapered shape tapered upward, a shape in which a cross section of an end part is right-angle, and a shape in which the end part is expanded relative to another region, throughout its entire perimeter.

Description

  The present invention relates to an insulating coating probe pin including a probe pin made of a conductor and an insulating coating that coats the outer periphery of the probe pin so that a portion on the detection end side of the probe pin is exposed, and a manufacturing method thereof.

  When inspecting a circuit board, a semiconductor element or the like, normally, energization is performed by bringing the probe pin tip of the prober detection end side of the prober into contact with the electrode or electrode pad provided thereon. The insulating coating probe pin includes a metal probe pin, and generally has a configuration in which a portion on the detection end side is exposed, while the outer periphery of the other portion is coated with an insulating coating.

  Patent Document 1 discloses that a predetermined length is immersed in an electrodeposition liquid from the detection end side of a metal probe pin and then energized, thereby forming an insulating film by electrodeposition coating.

  Patent Document 2 discloses that a suspension containing a block copolymerized polyimide is used as an electrodeposition liquid for electrodepositing a metal probe pin to form an insulating film.

Registered Utility Model No. 3038114 JP 2010-107420 A

  By the way, in the insulating coating probe pin used for semiconductor inspection, the insulating coating layer is not provided with the insulating coating on the end portion on the detection end side, and the cross-sectional shape of the interface (corner portion) does not vary over the entire circumference. Is required. This is because if there is variation in shape, the force to push the inspection object becomes stronger or weaker, and the inspection result is not stable. In order to peel the insulating coating, there are mechanical peeling methods such as cutting, optical peeling methods using lasers, etc., and chemical peeling methods using solvents, etc., all of which are highly difficult, Furthermore, there is a problem that the manufacturing cost becomes high due to complicated work.

  An object of the present invention is to easily adjust the shape of an end portion of an insulating coating without performing a peeling operation by a simple method.

  In order to achieve the above object, in the present invention, the voltage applied to the probe pin is adjusted so that the shape of the end portion on the detection end side of the insulating coating is adjusted so as not to be biased over the entire circumference. .

Specifically, in the first invention,
An object of the present invention is to provide an insulating film probe pin manufacturing method comprising: a probe pin made of a conductor; and an insulating film that covers an outer periphery of the probe pin so that a detection end side portion of the probe pin is exposed;
In the manufacturing method, first, an electrode is immersed in an electrodeposition liquid containing an electrodeposition material for forming the insulating coating, and the probe pin is inserted vertically so that the detection end side of the probe pin faces upward.
By adjusting the voltage applied to the electrode and the probe pin,
The shape on the detection end side of the probe pin in the insulating coating is desired from a taper shape that tapers upward over the entire circumference to a shape in which the cross section of the end portion is a right angle or a shape in which the end portion swells more than other regions. The structure is formed into a shape.

  According to the above configuration, in the vicinity of the surface of the electrodeposition liquid during electrodeposition, the ease of forming an insulating film varies depending on the voltage applied to the conductor, and the shape becomes gentle if the voltage is too low, and the shape that swells greatly if the voltage is too high. Become. By utilizing this fact, a desired shape can be easily obtained without adjusting the voltage by adjusting the voltage.

In the second invention, in the first invention,
The clone efficiency is 120 μm / C or more and 220 μm / C or less,
The insulating coating is formed so that the cross section of the end portion on the detection end side is substantially perpendicular.

  Here, the coulomb efficiency is an index indicating how much a film can be formed at 1 C (coulomb). In the above configuration, the clone efficiency is maintained at 120 μm / C or more and 220 μm / C or less, so that the voltage is moderate. It is possible to adjust the end shape of the insulating coating so that the cross section is substantially perpendicular, and the end shape of the insulating coating is too low and the end shape of the insulating coating is too high. Thus, the inspection result of the semiconductor inspection does not vary. Note that “substantially right angle” means that a blur of about 2 to 3 ° is allowed even if it is not completely 90 °.

In the third invention, in the second invention,
The viscosity of the electrodeposition liquid is 5 mPa · s or more and 8 mPa · s or less.

  That is, if the viscosity of the electrodeposition liquid is less than 5 mPa · s, it is difficult to form the end portion at a substantially right angle or the like, even if the clone efficiency is adjusted appropriately, and it tends to be gentle. Conversely, if it is less than 8 mPa · s, it becomes difficult to maintain the uniformity of the insulating coating. However, according to the above configuration, since the viscosity of the electrodeposition liquid is appropriately maintained at 5 mPa · s or more and 8 mPa · s or less, the shape of the end portion of the insulating coating can be easily adjusted by adjusting the voltage. .

In the fourth invention, in the third invention,
The temperature of the electrodeposition liquid is 15 ° C. or higher and 30 ° C. or lower.

  That is, when the temperature is lower than 15 ° C., it is difficult to apply a voltage to the electrodeposition liquid, and the shape of the end portion is hardly formed at a substantially right angle or the like, which tends to be gentle. Moreover, when it exceeds 30 degreeC, an electrodeposition liquid will deteriorate easily, a viscosity will fall and the shape of an edge part will become easy. However, according to the above configuration, since the temperature of the electrodeposition liquid is maintained moderately, the shape of the end portion of the insulating coating can be easily adjusted by adjusting the voltage of the shape of the end portion.

The fifth invention is directed to an insulating coating probe pin comprising a probe pin made of a conductor and an insulating coating covering the outer periphery of the probe pin so that a portion on the detection end side of the probe pin is exposed,
The insulating coating is formed by performing an electrodeposition treatment with an electrodeposition liquid containing an electrodeposition material without a peeling treatment, so that the end portion on the detection end side is formed substantially at right angles across the entire circumference. Yes.

  According to the above configuration, the end of the insulating coating on the detection end side has a substantially right-angled cross section over the entire circumference, so there is no variation in the amount of protrusion from the probe hole, and accurate electrical Measurement of characteristics can be performed.

In the sixth invention, the same insulating coating probe pin as the fifth invention is targeted,
The insulating film is subjected to an electrodeposition treatment with an electrodeposition liquid containing an electrodeposition material without being subjected to a peeling treatment, so that the end on the detection end side is more than the end on the connection end side over the entire circumference. It is formed thick.

  According to the above configuration, since the end on the detection end side of the probe pin in the insulating coating is formed thicker than the end on the connection end side over the entire circumference, for example, a number of insulating coating probe pins on the prober However, even if they are provided in parallel at short intervals, the thick end portions of the insulating coating interfere with each other, so that the exposed portions on the detection end side of the insulating coating probe pin are difficult to contact.

  According to the present invention, the probe and pin are inserted into the electrodeposition liquid containing the electrodeposition material for forming the insulating film, and the voltage applied to the electrode and the probe pin is adjusted to detect the probe pin in the insulating film. Since the shape on the end side is adjusted, the shape of the end portion of the insulating coating can be easily adjusted to a shape having no variation over the entire circumference without performing a peeling operation by a simple method.

It is sectional drawing which shows an example of the electrodeposition coating apparatus for manufacturing the insulating film probe pin which concerns on this embodiment. It is a front view which shows an insulation coating probe pin. It is a longitudinal cross-sectional view of an insulation coating probe pin. It is explanatory drawing which shows the use condition of the insulating film probe pin which concerns on this embodiment. FIG. 2 is a view corresponding to FIG. 1 showing a state in which an insulating film is formed. It is a flowchart which shows an example of the manufacturing method of the insulation coating probe pin which concerns on this embodiment. FIG. 3 is a view corresponding to FIG. 2 and showing an insulating coating probe pin when the voltage is lowered. FIG. 3 is a view corresponding to FIG. 2 showing an insulating coating probe pin when the voltage is increased. FIG. 5 is a view corresponding to FIG. 4 corresponding to the insulating coating probe pin when the voltage is lowered.

  Hereinafter, embodiments will be described with reference to the drawings.

-Composition of insulating coating probe pin-
2 and 3 show an insulating coating probe pin 10 according to the present embodiment. The insulating coating probe pin 10 is a component attached to a prober used when, for example, a circuit board, a semiconductor element, or the like is inspected.

  The insulating coating probe pin 10 according to the present embodiment includes a metal probe pin 11, and the detection end side 11a of the probe pin 11 is exposed. The outer periphery of the intermediate portion is covered with the insulating coating 12, and the connection end side 11b opposite to the detection end side 11a is also exposed. The insulating coating probe pin 10 according to the present embodiment may be formed in a straight line shape or may have a bent portion depending on the application. The insulating coating probe pin 10 according to the present embodiment has, for example, a length of 10 to 150 mm, an outer diameter of 20 to 400 μm, and an exposed length of the probe pin 11 on the detection end side of 0.5 to 30 mm.

  The probe pin 11 is composed of a metal wire. The probe pin 11 preferably has high conductivity and high elastic modulus, and the metal material forming the probe pin 11 is not particularly limited, and examples thereof include copper, tungsten, rhenium tungsten, and steel. The probe pin 11 may be formed of a single metal material or may be formed of an alloy of a plurality of metal materials. An example of such an alloy is beryllium copper having high hardness and high elasticity. For example, the surface of the probe pin 11 may be plated with gold. The cross section of the probe pin 11 may be formed in a circular shape, or may be formed in a non-circular shape such as a polygon such as a rectangle. The tip on the detection end side of the probe pin 11 may be processed into a shape such as a flat shape, a round shape (spherical surface), a pointed tip, or a triangular pyramid according to the type of the electrode or electrode pad that is the test object. The probe pin 11 is not limited to being made of metal, and may be made of, for example, a conductive resin as long as it is a conductor. This conductive resin should just have electroconductivity and the elasticity requested | required as the probe pin 11. FIG.

  The insulating coating 12 is made of an insulating resin. Although it does not specifically limit as a resin material which forms the insulating film 12, For example, a polyimide resin, an acrylic resin, a urethane resin, and an epoxy resin are mentioned. The resin material for forming the insulating coating 12 is preferably a polyimide resin containing a siloxane bond in the molecular skeleton. The probe pin 11 may be formed of a single resin material, or may be formed by mixing a plurality of resin materials.

  The insulating coating 12 is adhered to the outer periphery of the probe pin 11 with a uniform thickness without any uneven thickness over the entire circumference in any part in the length direction. The insulating coating 12 has a uniform thickness of, for example, 1 to 50 μm along the length direction. The end portion 12a on the detection end side of the probe pin 11 has a substantially right-angle cross section over the entire circumference.

  In addition, since the dimension system is not required so much, the connection end side 11b may be peeled off by the simplest possible method by optical peeling using a laser or the like or chemical peeling using a solvent or the like.

-Use of insulation coating probe pin-
Next, the use of the insulating coating probe pin 10 according to the present embodiment will be described. Although not shown in detail, for example, as shown in FIG. 4, the exposed portion where the insulating coating 12 on the detection end side of the insulating coating probe pin 10 is not provided is a substrate on which a wiring pattern for measuring electrical characteristics is formed. The end portion 12a of the insulating coating 12 is locked to the periphery of the probe hole H when protruding and immersing from the probe hole H of S and protruding. The connection end side 11b of the probe pin 11 is connected to the wiring pattern and further connected to a tester. The electrical characteristics are measured by bringing the detection end side 11a of the probe pin 11 into contact with the pad P of the semiconductor integrated circuit B formed on the inspection target wafer or the like placed on the movable table.

  In such an application, when conducting an energization test with the insulating coating probe pin 10, variation in the amount of protrusion of the insulating coating probe pin 10 from the probe hole H becomes a problem.

  However, according to the insulating coating probe pin 10 according to the present embodiment, the end portion 12a on the detection end side of the insulating coating 12 is formed at a substantially right angle in cross section over the entire circumference. There is no variation in the amount of protrusion from the device, and accurate electrical characteristics can be measured.

-Manufacturing method of insulating coating probe pin-
Next, an example of a method for manufacturing the insulating coating probe pin 10 according to the present embodiment will be described with reference to the drawings.

  As shown in FIG. 6, first, in step S01, the probe pin 11 is prepared. In the present embodiment, tip processing on the detection end side of the probe pin 11 is performed in advance, but this processing may be performed after electrodeposition.

  Next, in the first cleaning process in step S02, the probe pin is immersed in the cleaning tank and cleaned before electrodeposition coating. This cleaning includes degreasing of the probe pin 11 and washing operation thereof.

  Next, in the electrodeposition coating process of step S03, electrodeposition coating is performed on the probe pin 11. As shown in FIG. 1, the electrodeposition coating apparatus 20 includes an electrodeposition bus 21, an electrode 22, and a power supply unit 23.

  The electrodeposition bath 21 is a tank opened upward, and an electrodeposition liquid L made of an electrodeposition paint is placed therein. Specifically, as long as the electrodeposition liquid L is a conductive liquid containing a resin component, the resin component may be dissolved in the liquid, emulsified, or present in a suspended state. However, a suspension having an average particle size of the resin component of 0.1 μm or more is preferable from the viewpoint of good electrodeposition efficiency, and an average particle size of 10 μm or less from the uniformity of the thickness of the insulating coating 12. The suspension is more preferable. Here, the average particle diameter can be measured from the particle size distribution of the dispersed particles in the electrodeposition liquid L using a flow type particle image analyzer FPIA-3000S (manufactured by Sysmex Corporation). The resin component may be a polymer or a polymer precursor. The resin component may have an anionic group such as a carboxyl group, a sulfonic acid group, or a phosphoric acid group, or may have a cationic group such as an organic ammonium group or a pyridium group. When the resin component has an anionic group, the power supply unit 23 on the probe pin 11 side is a positive electrode and the electrode 22 is a negative electrode. On the other hand, when the resin component has a cationic group, the power supply unit 23 on the probe pin 11 side. Is the negative electrode and the electrode 22 is the positive electrode. Specific examples of the resin component include acrylic resin, polyimide resin, urethane resin, and epoxy resin. Polyimide resins have the advantages of high heat resistance, good electrical insulation, and high mechanical strength. Acrylic resins and epoxy resins have low heat resistance but high mechanical strength. Urethane resins and polyester resins have low heat resistance, but are easy to peel off because they are easily decomposed by heat. In addition to the resin component, the electrodeposition liquid L may contain water, an aqueous or oily organic solvent, a pigment, a leveling agent, a dispersant, an antifoaming agent, and the like. The electric conductivity of the electrodeposition liquid L is, for example, 1.5 to 15 mS / m, and preferably 2.5 to 5 mS / m. The pH of the electrodeposition liquid L is, for example, 6-9, and preferably 6.5-7.5. The surface tension of the electrodeposition liquid L is, for example, 10 to 70 mN / m, and preferably 20 to 40 mN / m. The solid content concentration of the electrodeposition liquid L is, for example, 1 to 20% by mass, and preferably 3 to 10% by mass.

  The viscosity of the electrodeposition liquid is preferably 5 mPa · s or more and 8 mPa · s or less. That is, if the viscosity of the electrodeposition liquid L is less than 5 mPa · s, the shape of the end portion 12a is hardly formed at a substantially right angle or the like, even if the clone efficiency is appropriately adjusted, and tends to be gentle. Conversely, if it is less than 8 mPa · s, it becomes difficult to maintain the uniformity of the insulating coating 12. However, since the viscosity of the electrodeposition liquid L is appropriately maintained at 5 mPa · s or more and 8 mPa · s or less, the shape of the end portion 12a of the insulating coating 12 can be easily adjusted by adjusting the clone efficiency.

  Moreover, it is preferable that the temperature of the electrodeposition liquid L shall be 15 degreeC or more and 30 degrees C or less. That is, when the temperature is lower than 15 ° C., it is difficult to apply a voltage to the electrodeposition liquid, and it is difficult to form the shape of the end portion at a substantially right angle or the like, which tends to be smooth as shown in FIG. Moreover, when it exceeds 30 degreeC, an electrodeposition liquid will deteriorate easily, a viscosity will fall and the shape of an edge part will become easy. However, the temperature of the electrodeposition liquid is kept moderate by setting the above range, and the shape of the end portion of the insulating coating can be easily adjusted by adjusting the voltage of the shape of the end portion.

  The electrode 22 is installed in the electrodeposition bath 21 so that the upper part protrudes from the liquid surface A of the electrodeposition liquid L and the bottom surface does not contact the tank bottom. An example of the metal material forming the electrode 22 is copper. The electrode 22 is connected to the power supply unit 23. On the other hand, the detection end side 11 a of the probe pin 11 is also connected to the power supply unit 23. Instead of a single probe pin 11 as shown, a plurality of probe pins 11 may be connected to the power supply unit 23 at a time.

  Next, as shown in FIG. 1, the probe pin 11 with the detection end side 11 a facing upward is vertically immersed in the electrodeposition liquid L in the electrodeposition bath 21, and the electrode 22 is also electrodeposited in the electrodeposition bus 21. Soak in.

  After the surface of the electrodeposition liquid L is not disturbed, a voltage is applied between the electrode 22 and the power supply unit 23 for a certain period of time. The applied voltage is, for example, 1 to 200V, preferably 5 to 50V. The voltage application time is, for example, 1 to 180 seconds, and preferably 1 to 30 seconds.

  At this time, a potential difference was generated via the electrodeposition liquid L between the electrode 22 and the probe pin 11 held by the power supply unit 23, and the electrode 22 was immersed in the electrodeposition liquid L of the probe pin 11 as shown in FIG. An insulating coating 12 made of a resin component is deposited on the portion. The clone efficiency at this time is set to 120 μm / C or more and 220 μm / C or less.

  In the vicinity of the liquid surface A of the electrodeposition liquid L during electrodeposition, the ease with which the insulating coating 12 can be formed varies depending on the voltage applied to the probe pin 11. For this reason, when the voltage is reduced (about 1 to 20 V), as shown in FIG. 7, the shape of the end 12a on the detection end side becomes gentle and larger (60 to 200 V), as shown in FIG. As described above, the end 12a on the detection end side has a shape that swells greatly.

  By making use of this fact, by adjusting the voltage to about 25 to 55 V, the shape of the end portion 12a on the detection end side is substantially perpendicular as shown in FIG. 3 without peeling off the insulating coating 12. Can be formed. For this reason, there is no variation in the amount of protrusion from the probe hole H of the insulating coating probe pin 10 at the time of measuring the electrical characteristics, and the measurement accuracy is improved.

  Then, energization to the power supply unit 23 is stopped, and the electrode 22 and the insulating coating 12 are formed, and the probe pin 11 is taken out from the electrodeposition bus 21. Here, from the viewpoint of suppressing the downward sag of the insulating coating 12, the pulling speed is preferably 0.5 to 300 mm / s, and more preferably 1 to 10 mm / s.

  Next, in step S04, a second cleaning process is performed. In this second cleaning step, cleaning is performed by immersing in a cleaning tank in order to remove excess electrodeposition liquid on the insulating coating probe pin 10 after electrodeposition coating.

  Next, in step S05, a third cleaning process is performed. In the third cleaning step, cleaning is performed by dipping in a cleaning tank containing a solvent for surface adjustment. In addition, what is necessary is just to perform these 1st-3rd washing | cleaning processes as needed, and is not an essential process.

  Next, in step S06, the probe pin 11 is dried in a drying furnace to evaporate moisture and organic solvent.

  Finally, in step S07, baking is performed in a baking furnace.

  By manufacturing in this way, the insulating coating probe pin 10 having high dimensional accuracy and high quality without variation in shape can be obtained by a very simple and low-cost method without complicated peeling work of the insulating coating 12.

  On the other hand, for example, when the range of the applied voltage is 60 V to 200 V, the end 12a on the detection end side as shown in FIG. 8 is formed thicker than the end 12a on the connection end side over the entire circumference. Then, for example, even when a large number of insulating coating probe pins 10 are provided in parallel at a short interval on the prober, the thick end portions 12a of the insulating coating 12 interfere with each other. There is an advantage that the exposed portions of 11a are less likely to contact each other. Further, even if the insulating coating 12 is reinforced and a large stress is applied by contacting the peripheral edge of the probe hole H, the scraping or peeling of the end 12a of the insulating coating 12 is restricted. As a result, the insulating coating probe pin 10 is controlled. Variation in the amount of protrusion from the probe hole H can be suppressed. Moreover, the product life of the probe pin 10 can be extended. From the viewpoint of reinforcing the insulating coating 12, the insulating coating 12 gradually becomes thinner from the end portion 12a on the detection end side toward the connection end side of the probe pin 11, as shown in FIG. It is preferable to have the part formed in this. The length from the thickest portion of the end portion 12a on the detection end side of the probe pin 11 in the insulating coating 12 to the start point of the uniform thickness portion on the connection end side is the length on the detection end side of the insulating coating probe pin 10. From the viewpoint that it is easy to prevent contact between exposed portions, it is preferably 0.02 to 1.5 mm.

  For example, when the range of applied voltage is 1 to 20 V, the end 12a on the detection end side has a gentle shape as shown in FIG. In this case, for example, as shown in FIG. 9, if the shape of the probe hole H is intentionally tapered at the same angle as the end 12 a of the insulating coating 12, the interface of the end 12 a of the insulating coating 12 in the case of a right angle However, the load applied to the end portion 12a of the insulating coating 12 can be reduced. In addition, when it is desired to intentionally manipulate the force applied to the pad P using the same probe pin 11, if the inner diameter of the probe hole H is changed slightly, the pressing pressure is increased when the probe hole H is larger, and the probe hole H When H is small, the pressing pressure can be reduced.

  The present invention relates to an insulating coating probe pin insulating coating probe pin comprising: a probe pin made of a conductor; and an insulating coating that coats the outer periphery of the probe pin so that a portion on the detection end side of the probe pin is exposed. It relates to the manufacturing method.

DESCRIPTION OF SYMBOLS 10 Insulation coating probe pin 11 Probe pin 11a Detection end side 11b Connection end side 12 Insulation coating 12a End part 12b End part 20 Electrodeposition coating apparatus 21 Electrodeposition bus 22 Electrode 23 Power supply part L Electrodeposition liquid

Claims (6)

A method of manufacturing an insulating film probe pin comprising: a probe pin made of a conductor; and an insulating film covering an outer periphery of the probe pin so that a portion on the detection end side of the probe pin is exposed,
The electrode is immersed in an electrodeposition solution containing an electrodeposition material for forming the insulating coating, and the probe pin is inserted vertically so that the detection end side of the probe pin faces upward,
By adjusting the voltage applied to the electrode and the probe pin,
The shape on the detection end side of the probe pin in the insulating coating is desired from a taper shape that tapers upward over the entire circumference to a shape in which the cross section of the end portion is a right angle or a shape in which the end portion swells more than other regions. A method of manufacturing an insulating coating probe pin, wherein the probe is formed into a shape. In the manufacturing method of the insulation coating probe pin described in Claim 1,
The clone efficiency is 120 μm / C or more and 220 μm / C or less,
The method of manufacturing an insulating coating probe pin, wherein the insulating coating is formed so that a cross section of the end portion on the detection end side is substantially perpendicular. In the manufacturing method of the insulation coating probe pin described in Claim 2,
A method for producing an insulating coating probe pin, wherein the viscosity of the electrodeposition liquid is 5 mPa · s or more and 8 mPa · s or less. In the manufacturing method of the insulation coating probe pin described in Claim 3,
The method of manufacturing an insulating coating probe pin, wherein the temperature of the electrodeposition liquid is 15 ° C. or higher and 30 ° C. or lower. An insulating film probe pin comprising: a probe pin made of a conductor; and an insulating film covering an outer periphery of the probe pin so that a portion on the detection end side of the probe pin is exposed,
The insulating coating is formed by performing an electrodeposition treatment with an electrodeposition liquid containing an electrodeposition material without a peeling treatment, so that the end portion on the detection end side is formed substantially at right angles across the entire circumference. An insulating coating probe pin characterized by comprising: An insulating film probe pin comprising: a probe pin made of a conductor; and an insulating film covering an outer periphery of the probe pin so that a portion on the detection end side of the probe pin is exposed,
The insulating film is subjected to an electrodeposition treatment with an electrodeposition liquid containing an electrodeposition material without being subjected to a peeling treatment, so that the end on the detection end side is more than the end on the connection end side over the entire circumference. An insulating coating probe pin characterized by being formed thick.

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