TW201530829A - 含有量子點磷光體的發光二極體蓋 - Google Patents
含有量子點磷光體的發光二極體蓋 Download PDFInfo
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- TW201530829A TW201530829A TW103139458A TW103139458A TW201530829A TW 201530829 A TW201530829 A TW 201530829A TW 103139458 A TW103139458 A TW 103139458A TW 103139458 A TW103139458 A TW 103139458A TW 201530829 A TW201530829 A TW 201530829A
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Abstract
本發明係關於一種發光二極體(LED)裝置,其具有含有一或多個量子點(QD)磷光體之一蓋。該蓋可經定大小且經組態以與標準LED封裝整合。該QD磷光體可固持於該LED封裝之井內以吸收由該LED發射之最大光量,但以與LED晶片間隔開之關係配置以避免可導致該(等)QD磷光體降解之過熱。該等封裝可經製造及儲存以用於至一LED裝置上之後續組裝。
Description
本申請案主張2013年11月13日申請之美國臨時申請案第61/903,503號之權益。
關於聯邦政府發起之研究及開發之陳述:不適用
本發明大體上係關於發光裝置。更特定而言,本發明係關於併入有用於修改其等光譜輸出之磷光體之發光二極體(LED)。
已實質上關注利用由尺寸為大約2奈米到50奈米之粒子(通常稱為量子點(QD)或奈米晶體)組成之化合物半導體之性質。此等材料由於可用於諸多商業應用(諸如光學裝置及電子裝置)及諸多新的且新興應用當中之其他應用(範圍為生物標記、光伏打、觸媒作用、生物成像、LED、一般空間照明及電致發光顯示器)中之其等大小可調諧之電子性質而受商業關注。
研究最多的半導體材料一直係硫屬化物Ⅱ-Ⅵ材料,即ZnS、ZnSe、CdS、CdSe、CdTe;最著名的係CdSe,此係由於其在光譜之可視區域內之可調諧性。用於此等材料之大規模生產之可再生方法已自「顛倒」技术发展,其中使用「濕化學」程序逐原子地(即,自分子到團簇到粒子)製備粒子。然而,用於習知QD中之鎘及其他受限制的重金屬係劇毒元素且在商業應用中係一重大隱患。含有鎘之QD之
固有毒性阻止其等用於涉及動物或人類之任何應用中。例如,最近之研究表明,由硫屬化鎘半導體材料製成之QD在一生物環境中可係細胞毒的,除非受保護。具體而言,通過各種路經之氧化或化學侵蝕可導致在QD之表面上形成可被釋放至周圍環境中之鎘離子。
此毒性不僅影響生物應用之進步而且影響包含光電子及通信之其他應用之進步,此係由於基於重金屬之材料廣泛運用於包含家用電器(諸如IT及電信設備、照明設備、電氣及電子工具、玩具、休閒及運動設備)之諸多商業產品中。世界諸多地區已實施了限制或禁止商業產品中之特定重金屬之法律。例如,歐盟方針2002/95/EC,被稱為「限制在電子設備中使用有害物質」(或RoHS)禁止出售含有超標之鉛、鎘、汞、六價鉻及多溴化聯苯(PBB)及多溴聯苯醚(PBDE)阻燃劑之新電氣及電子設備。此法要求製造商找出替代材料且開發用於形成常見電子設備之新工程設計過程。另外,關於化學物質及其安全使用之歐洲共同體法規(EC 1907/2006)在2007年6月1日生效。該法規處理化學物質之登記、評估、批准及限制且被稱為「REACH」。該REACH法規賦予企業極大之責任來管理來自化學物質之風險且提供關於物質之安全資訊。預料到在包含中國、韓國、日本及美國之其他國家亦將頒佈類似法規。因此,存在開發Ⅱ-Ⅵ QD材料之替代物之重大經濟動機。
已受極大關注之其他半導體奈米粒子包含併入有Ⅲ-V及Ⅳ-Ⅵ材料(諸如GaN、GaP、GaA、InP及InA)之奈米粒子。由於其等增加之共價性質,Ⅲ-V及Ⅳ-Ⅵ高晶型半導體粒子更難製備且通常需要更長之退火時間。然而,現在已有報道稱Ⅲ-Ⅵ及Ⅳ-Ⅵ材料以類似於用於Ⅱ-Ⅵ材料之方式製備。例如在美國專利第6,379,635、7,803,423、7,588,828、7,867,556及7,867,557號中揭示合成核心及核心-殼奈米粒子之方法。此等專利之各者之內容特此以全文引用之方式併入。
兩個基本因素(兩者皆與個別半導體奈米粒子之大小有關)造成了其等獨特之性質。第一個係大表面積-體積比;當一粒子變小時,表面原子數目與內部原子數目比增加。此導致表面性質在材料之總體性質中發揮一重要作用。第二個因素係在諸多材料包含半導體奈米粒子之情況下存在材料之電子性質隨大小之一改變;再者,由於量子侷限效應,帶隙隨著粒子大小減小而逐漸變大。此效應係一「盒中電子」之侷限引起類似於在原子及分子中觀察到之彼等之離散能階而非如在對應塊體半導體材料中觀察到之一連續帶之一結果。因此,對於一半導體奈米粒子而言,由吸收電磁輻射(能量比第一激子過渡更大之一光子)產生之電子及電洞由於物理參數而比其等在對應粗晶質材料中靠的更近,再者不可忽略庫侖相互作用。此導致依賴於奈米粒子材料之粒子大小及組成之一窄帶寬發射。因此,量子點具有比對應粗晶質材料更高之動能且因此該第一激子過渡(帶隙)之能量隨著粒子直徑之減少而增加。
由一單一半導體材料以及一外有機鈍化層組成之核心半導體奈米粒子由於位於可導致非輻射電子電洞重組之奈米粒子表面上之缺陷及懸鍵處發生之電子電洞重組而趨於具有相對較低之量子效率。一種消除該量子點之無機表面上之缺陷及懸鍵之方法係在該核心粒子之表面上磊晶生長一第二無機材料以產生一「核心-殼」粒子,該第二無機材料具有一更寬的帶隙及對該核材料之小的晶格不匹配。核心-殼粒子將經侷限於該核心中之任何載子自原本用作非輻射重組中心之表面狀態分離。一項實例係生長於一CdSe核心之表面上之一ZnS殼。另一方法係製備其中電子電洞對完全侷限於由一特定材料之幾個單層組成之一單一殼層之多核心殼結構,諸如一量子點-量子井結構。此處,該核心係一寬帶隙材料,後續接著一較窄帶隙材料之一薄殼,且用又一寬帶隙層覆蓋,諸如在核奈米晶體之表面上使用Hg取代Cd以
僅沈積幾個HgS單層後續接著於其上生長一CdS單層而生長之CdS/HgS/CdS。所得結構展現在HgS層中之光激發之載子之清晰侷限。給量子點添加進一步穩定性且幫助侷限電子電洞對之最常見方法中之一者係在該核心上磊晶生長一複合梯度合金層。此可幫助減輕原本導致缺陷之應變。再者,對於一CdSe核心,為了改良結構穩定性及量子產率,可使用Cd1-xZnxSe1-ySy之一梯度合金層而非在該核心上直接生長ZnS之一殼。此法大幅增強量子點之光致發光發射。
用原子雜質摻雜量子點亦係操縱奈米粒子之發射及吸收性質之一有效方式。已開發摻雜寬帶隙材料(諸如硒化鋅及硫化鋅)與錳及銅(ZnSe:Mn或ZnS:Cu)之步驟。在一半導體奈米晶體中摻雜有不同光致發光活化劑可以甚至低於塊體材料之帶隙之能量調諧光致發光及電致發光,然而量子大小效應可隨量子點之大小調諧激子能量而活化劑相關之發射之能量無顯著改變。
量子點奈米粒子之普遍利用已受限於其物理/化學不穩性及與充分地利用該等量子點(諸如併入至溶劑、墨水、聚合物、玻璃、金屬、電子材料、電子裝置、生物分子及細胞中)所需要之諸多材料及/或過程之不相容性。因此,已採用一系列量子點表面修改程序以使量子點更穩定且與一所要應用之材料及/或過程要求相容。
量子點之應用之一尤其有吸引力之潛力領域係下一代發光二極體(LED)之開發。LED在現代生活中變得越發重要且想像其等具有成為量子點之主要應用(例如在汽車照明、交通信號、普通照明、液晶顯示(LCD)背光及顯示螢幕中)之一者之潛力。
當前,LED裝置係由無機固態化合物半導體製成,諸如AlGaAs(紅)、AlGalnP(橘-黃-綠)及AlGalnN(綠-藍);然而,發白光之固態LED不可使用當前可得之固態化合物半導體之一混合物來產生。再者,藉由混合不同頻率之固態LED難以產生「純」色彩。因此,當前
較佳之用以產生一所要色彩(包含白色)之色彩混合方法係使用磷光材料之組合,該等磷光材料置於固態LED之頂部上藉此來自LED之光(「一次光」)由該磷光材料吸收且接著以一不同頻率再發射(「二次光」),即,該等磷光材料將該一次光降頻轉換為該二次光。再者,使用由磷光體降頻轉換產生之白色LED比使用固態紅-綠-藍LED之組合花費更少且裝置製作更簡單。
用於降頻轉換應用中之當前磷光材料吸收UV或主要藍光且將其轉換為更長之波長,其中大多數磷光體當前使用三價稀土摻雜之氧化物或鹵化磷酸鹽。可藉由混合在藍、綠及紅區域中發射之磷光體與一發藍光或UV固態裝置之磷光體而獲得白色輻射,即,一發射藍光之LED加上諸如SrGa2S4:Eu2+之一綠色磷光體及諸如SrSiEu2+之一紅色磷光體,或一發射UV光之LED加上諸如Sr2P2O7:Eu2+;Mn2+之一黃色磷光體及一藍-綠色磷光體。亦可藉由組合一藍色LED與一黃色磷光體來製成白色LED;然而,當使用此方法時色彩控制及演色性較差,此係由於LED及磷光體缺少可調諧性。再者,習知LED磷光體技術使用具有較差演色性(即,演色性指數(CRI)小於75)之降頻轉換材料。
已藉由將膠狀生產的量子點嵌入通常為一聚矽氧或一丙烯酸鹽之一光學清透(或足夠透明)LED囊封介質中,接著將LED囊封介質置於一固態LED之頂部上而製成基本基於量子點之發光裝置。使用量子點優於使用更多習知磷光體潛在地具有一些顯著優點,諸如調諧發射波長之能力、強吸收性質及在量子點係單分散之情況下之低散射。
對於量子點在下一代發光裝置中之商業應用,該等量子點較佳地併入至LED囊封材料中同時保持盡可能完全單分散的且量子效率無重大損失。先前技術之方法係有問題的,絕大部分歸因于當前LED囊封物之性質。當配製至當前LED囊封物中時,量子點凝聚,藉此減小該等量子點之光學效能。再者,甚至在該等量子點已併入至該LED囊
封物中之後,氧氣仍可透過囊封物遷移到該等量子點之表面,此可導致光氧化及因此量子產率(QY)之下降。
就量子點跨越此寬廣範圍之應用(包含但不限於基於量子點之發光裝置)之巨大應用潛力而言,各種團體已承擔工作以努力開發增加量子點之穩定性以使其變得更亮更持久及/或對各種類型之處理條件更不敏感之方法。例如,合理高效的基於量子點之發光裝置可在基於當前發佈之方法構建之實驗室條件下製作;然而,開發基於量子點之材料及用於製作基於量子點之裝置(諸如經濟上切實可行且將提供足夠高的效能位準以滿足消費者需求之發光裝置)之方法仍是重大挑戰。
根據本發明之一LED裝置具有含有一或多個QD磷光體之一蓋。該蓋可經定大小及經組態以與標準LED封裝整合。該QD磷光體固持於該LED封裝之井內以吸收由該LED發射之最大光量,但以與LED晶片間隔開之關係配置以避免可導致併發癥之過熱。該等封裝可經製造及儲存且隨後組裝至一LED裝置上。
100‧‧‧發光二級體裝置
101‧‧‧固態發光二級體
102‧‧‧藍一次光
103‧‧‧發光二級體囊封
104‧‧‧二氧化矽珠
105‧‧‧二氧化矽珠
106‧‧‧紅二次光
107‧‧‧綠二次光
200‧‧‧發光二級體裝置
201‧‧‧發光二級體封裝
202‧‧‧發光二級體晶片
203‧‧‧井
204‧‧‧蓋
205‧‧‧蓋井
206‧‧‧量子井
207‧‧‧封蓋
300‧‧‧發光二級體裝置
301‧‧‧發光二級體封裝
302‧‧‧發光二級體晶片
303‧‧‧井
304‧‧‧蓋
305‧‧‧蓋井部分
306‧‧‧蓋部分
307‧‧‧腔
308‧‧‧量子井
309‧‧‧基底壁
600‧‧‧發光二級體
602‧‧‧封裝
604‧‧‧壁
606‧‧‧射線
608‧‧‧蓋井
610‧‧‧射線
612‧‧‧射線
614‧‧‧射線
616‧‧‧凹部蓋井
圖1圖解說明此項技術中已知之一含有QD之LED裝置。
圖2圖解說明配備有一預先組裝之含有QD之蓋之一LED裝置。
圖3A及圖3B圖解說明配備有一預先組裝之含有QD之蓋之一LED裝置之一替代實施例。
圖4係具有嵌入至基座中之默克Isophor磷光體(藍線)之空蓋及具有含有懸浮於丙烯酸酯樹脂中之紅QD(紅線)之相同蓋之光譜功率分佈。
圖5係一預先組裝之含有QD之蓋之一示意性圖解說明,其展示尺寸。
圖6係展示關於自一LED封裝射出之光線之各種實施例之效應之一示意性圖解說明。
圖1圖解說明一LED裝置100,其中固態LED 101經配置以在施加電流時發射藍色一次光102。固態LED浸沒於一市售LED囊封物103中,多個含有量子點之二氧化矽珠104及105嵌入於LED囊封物103中。一些珠104含有在被來自LED 101之藍色一次光激發時發射紅色二次光106之量子點,且剩下的珠105含有在被來自LED 101之藍色一次光激發時發射綠色二次光107之量子點。在2010年9月23日申請之共同擁有之美國專利申請案第12/888,982號(發佈為U.S.2011/0068322)中更詳細地闡述如圖1中所圖解說明之LED裝置,該美國專利申請案之全部內容特此以引用之方式併入。
關於調適作為基於LED之發光解決方案中之光轉換材料之量子點的挑戰源於其等空氣敏感度、熱不穩定性及在較高溫度下之光轉換效率之降低。降低空氣敏感度之一種方法係將QD併入至珠(諸如珠104及105)中。然而,圖1中所圖解說明之實施例仍可遭受熱相關之問題,此係由於QD接近通常為一LED裝置之最熱部分之LED接面。
圖2圖解說明對圖1中所圖解說明之實施例之一改良。圖2之LED裝置200包含具有安置於一井203內之一LED晶片202之一標準LED封裝201。井203可填充有一LED囊封物,如此項技術中已知。LED裝置200亦包含具有一蓋井205(本文使用術語蓋井來區分帽之井205與LED封裝201之井203)之一帽204。QD 206安置於蓋井205內。井205可配備有一封蓋207。
帽204可基本上由諸如聚合物、陶瓷、玻璃或類似者之任何透明材料製成,且可使用模製、鑄造等構造。帽204視情況可經塑形以提供一透鏡、一透鏡陣列、漫射器元件及/或此項技術中已知之其他光
學元件。同樣地,封蓋207可由玻璃、聚合物、陶瓷或類似者製成,且可藉由使用一適合UV固化環氧樹脂(例如,如此項技術中已知之Optocast 3553或其他樹脂)之黏合密封至帽204。有利地,封蓋207與帽204之間的密封可形成一不透氧障壁,藉此保護QD 206不受氧化。
QD 206通常係半導體材料,其可併入有來自週期表之族2至族16中之任何一或多者之離子,且可包含二元、三元及四元材料,亦即分別併入有兩種、三種或四種不同離子之材料。例如,奈米粒子可併入有一半導體材料,諸如(但不限於)CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、InP、InAs、InSb、AlP、AIS、AIAs、AISb、GaN、GaP、GaAs、GaSb、PbS、PbSe、Si、Ge及其等之組合。根據各種實施例,奈米粒子可具有小於約100奈米、小於約50奈米、小於約20奈米、小於約15奈米之直徑及/或其直徑可在約2至10奈米之範圍內。
包含例如CdS、CdSe、ZnS、ZnSe、InP、GaN等之一單一半導體材料之奈米粒子可具有相對較低之量子效率,此係由於發生於奈米粒子之表面處之缺陷及懸鍵處之非輻射電子電洞重組。為了至少部分地解決此等問題,奈米粒子核心可至少部分地塗佈有不同於該核心之材料之一材料(例如不同於該「核心」之半導體材料之一半導體材料)之一或多個層(本文亦稱為「殼」)。包含於該殼或每一殼中之材料可併入有來自週期表之族2至族16中之任何一或多者之離子。當一奈米粒子具有兩個或兩個以上殼時,每一殼可由一不同材料形成。在一例示性核心/殼材料中,該核心係由上文指定之材料中之一者形成且該殼包含具有較大帶隙能量及類似於該核心材料之晶格尺寸之一半導體材料。例示性殼材料包含但不限於ZnS、ZnO、MgS、MgSe、MgTe及GaN。一例示性多殼奈米粒子係InP/ZnS/ZnO。將電荷載子侷限於該核心內且遠離表面狀態可提供具有較大穩定性及較高量子產率之奈米粒子。
儘管所揭示之方法不限於任何特定奈米粒子材料,但包括不含有鎘之材料之奈米粒子係尤其較佳的。不含鎘之奈米粒子之實例包含包括半導體材料(例如ZnS、ZnSe、ZnTe、InP、InAs、InSb、AlP、AIS、AIAs、AISb、GaN、GaP、GaAs、GaSb、PbS、PbSe、Si、Ge,包含合金及其經摻雜衍生物)之奈米粒子,及尤其係包括此等材料中之一者之核心及此等材料中之另一者之一或多個殼之奈米粒子。尤其適合之QD係CFQD®不含重金屬之量子點(英國曼徹斯特之Nanoco科技公司)。
QD 206可懸浮於諸如一聚合物(諸如一丙烯酸鹽或環氧聚合物或其等之組合)之一基質材料中。裸QD可懸浮於該基質中,或替代地,該等QD可首先併入至珠中,如美國公開案第2011/0068322及2010/0123155號中所闡述,該等美國公開案之全部內容特此以引用之方式併入。
LED裝置200之一優點係含有QD 206之帽204可在併入至LED裝置上之前具有一可評估擱置壽命。因此,該LED裝置緊隨帽204之構造而製成並非關鍵的。此係相對於具有直接沈積至該LED封裝之井中之QD之裝置,此係由於在彼等裝置中,QD通常不被覆蓋且與大氣隔離直至整個封裝被組裝。因此,LED裝置200提供製造工作流程之更大靈活性。再者,在操作期間,LED裝置200之QD 206遠離LED晶片202且因此其等不由於加熱而易於發生併發症,不像其等在接近於該LED晶片的情況下會發生的那樣,如在圖1之裝置中。
圖3A圖解說明一LED裝置300之一替代實施例,其具有帶有一LED晶片302及一井303之一LED封裝301。裝置300具備具有經設計以裝配至井303中之一蓋井部分305之一蓋304。蓋304亦具有一蓋帽部分306及在其內含有QD 308之一腔307。上文參考圖2中所圖解說明之實施例所論述之材料亦適合於圖3中所圖解說明之實施例。
圖3B圖解說明蓋304之一放大圖。根據一項實施例,一額外無機磷光體可併入至蓋304之基底壁309中。例示性磷光體包含Ce:YAG、Ce:LuAG及其他寬廣發射黃-綠光磷光體。寬廣發射黃-綠光磷光體與紅色CFQD®不含重金屬之量子點連同一藍色LED之組合可產生一極高品質光源。因此,一項實施例係組合QD磷光體及習知塊體磷光體兩者之一單一光學元件。
正如圖2中所圖解說明之實施例一樣,可藉由模製、鑄造等來構造蓋304。在併入有磷光體之蓋之情形中,一個多步驟鑄造過程可係必需的。此外,當將一透明無色樹脂用於基座以允許來自LED之光進入該蓋時,使用填充有白色反射材料之一樹脂之一多階段鑄造過程可用於該蓋之壁及頂部。
圖3中所圖解說明之實施例優於圖2中所圖解說明之實施例之一潛在優點係在圖3實施例中,QD磷光體位於更靠近於LED晶片處,且因此吸收更多光。因此,可使用更少QD磷光體。仍由該蓋之基底壁保護該QD磷光體免受熱導致之劣化。
表1比較用於一空蓋(如圖3B中所圖解說明,該空蓋之基底灌注有默克Isophor磷光體)及含有懸浮於丙烯酸酯樹脂中之紅CFQD®不含重金屬之量子點(英國曼徹斯特Nanoco科技有限公司)之相同蓋之經測量之光學效能資料。
圖4圖解說明具有嵌入至基底中之默克Isophor磷光體(藍[或實]線)之空蓋及含有懸浮於丙烯酸酯樹脂中之紅QD(紅[或虛]線)之相同
蓋之光譜功率分佈。
如下闡述來準備蓋以符合標準3528及5050 LED封裝。
使用利用成對(陽/陰)的聚矽氧模具之一鑄造方法來製備如圖3中所圖解說明之蓋。將6微升Optocast 3553環氧樹脂分配至一陰模中。接著仔細地將陽模放入適當位置處以確保定位器點係對準的。在此階段期間,任何過量之樹脂皆自蓋模具貯存器排出且滲入模具對之間的空間。接著用UV光輻照該模具以固化該環氧樹脂。用於固化之條件如下:360奈米、170mW/cm2、72秒。固化之後,該等蓋經脫模且在室溫下儲存24小時,之後使用一外科手術刀移除過度閃光。該等蓋係透明的且可與QD磷光體一起使用。
使用一个兩阶段過程製備具有一灌注磷光體之基座之蓋。首先,藉由將適量磷光體混合至未固化之Optocast 3553環氧樹脂中而製備基座。將分配3微升至模具中,該模具具有與蓋之基座相同之寬度尺寸但比基座薄50微米。該環氧樹脂藉由用UV光輻照而固化。用於固化之條件如下:360奈米、170mW/cm2、72秒。為了製作成品蓋,該磷光體基座如下併入至最終蓋中:將15微升未固化Optocast 3553環氧樹脂沈積至陰5050聚矽氧模具中。接著引入該磷光體基座且將其推動至模具之底部,注意不捕獲任何空氣。接著小心地引入陽5050聚矽氧模具以確保定位器點係對準的。過量環氧樹脂一旦固化便自該模具排出且形成閃光。所使用之固化條件係如上所闡述。由LED封裝判定大部分尺寸。用於該5050蓋之此等實例中之該等蓋之壁厚度係350微米,如圖5中所展示。
如上所闡述製備用於具有灌注磷光體基座之5050封裝之蓋。在
一惰性大氣手套箱中用7微升含有CFQD之丙烯酸酯樹脂填充此等蓋且固化其(360奈米、170mW/cm2、180秒)。藉由將5微升Optocast 3553環氧樹脂沈積至丙烯酸酯樹脂上且接著向下推動該蓋穩固在適當位置而應用由150微米厚的硼矽酸鹽玻璃製備之一帽。由UV光(360奈米、170mW/cm2、72秒)固化該環氧樹脂。此等蓋用於產生以上圖4及表1中之資料。
本發明之一重要態樣係根據本發明之一蓋設計允許色彩轉換材料置於該LED之封裝內且利用封裝反射器以用於改良之光輸出及光束塑形。
圖6A圖解說明先前技術之一封裝602中之一發射藍光之LED 600。由該LED發射之一些光線反射離開在其內安置LED 600之封裝井602之壁604。若需要朗伯(Lambertian)反射則可使用白色壁材料。在需要鏡面反射之應用中,可將該等壁鍍銀。由於由LED封裝602塑形之光束,因此在廣角處只有少許藍光強度。
圖6B展示根據圖2中所圖解說明之實施例之配備一含有QD蓋之一習知LED封裝(如圖6A中之602)。蓋井608含有發射綠光及紅光之量子點,該等量子點藉助於被發射藍光之LED 600激發而發螢光。由於由該LED封裝塑形之光束,因此在廣角處具有少許藍光強度。如射線610所指示,可在廣角處直接觀察到來自蓋井608內之量子點之沿一橫向方向發射之光致發光。然而,射線610中缺少藍光(來自LED 600)導致觀察到一不同色彩且藉此損害色彩隨角度之一致性。
圖6C展示根據圖3A及圖3B中所圖解說明之本發明之實施例之一蓋係如何克服圖6B中所圖解說明且上文所論述之色彩隨角度之一致性問題。來自凹入蓋井616內之量子點之光致發光可在自該裝置發出之前反射離開該LED封裝之壁。此導致在廣角處觀察到更少僅QD之光致發光(射線614),藉此導致改良之色彩隨角度之一致性(射線612包
括紅光、綠光及藍光)。
儘管已展示及闡述本發明之特定實施例,但其等不意欲限制本專利所涵蓋之內容。熟習此項技術者將理解在不背離如隨附申請專利範圍字面上且等效地涵蓋的本發明之範疇之情況下可作出各種改變及修改。
200‧‧‧發光二級體裝置
201‧‧‧發光二級體封裝
202‧‧‧發光二級體晶片
203‧‧‧井
204‧‧‧蓋
205‧‧‧蓋井
206‧‧‧量子井
207‧‧‧封蓋
Claims (50)
- 一種用於具有含有一LED之一中心井、一上表面及至少一個側表面之一LED封裝之一蓋,該蓋包括:一上部分,其具有一頂表面及經定大小且經組態以附接至該LED封裝之該上表面之一底表面;一井,其在該頂部分之該底表面中;複數個量子點,其在該井中。
- 如請求項1之蓋,其進一步包括:一側部分,其附接至該上部分,該側部分經定大小且經組態以附接至該LED封裝之該至少一側表面。
- 如請求項2之蓋,其中該側部分鄰接該上部分。
- 如請求項1之蓋,其中該上部分係透明的。
- 如請求項1之蓋,其中該上部分係半透明的。
- 如請求項1之蓋,其中當該蓋附接至該LED封裝時,該井與該LED間隔開。
- 如請求項1之蓋,其中該複數個量子點包括發射具有一第一波長之二次光之一第一類型之量子點及發射具有一第二波長之二次光之一第二類型之量子點。
- 如請求項7之蓋,其中該第一類型之量子點在被藍光激發時發射綠光,且該第二類型之量子點在被藍光激發時發射紅光。
- 如請求項1之蓋,其中該蓋之該上部分經塑形以提供一透鏡。
- 如請求項1之蓋,其中該蓋之該上部分經塑形以提供一透鏡陣列。
- 如請求項1之蓋,其中該蓋之該上部分包括一光漫射器。
- 如請求項1之蓋,其中該等量子點包括被至少一個殼環繞之一中 心核心。
- 如請求項12之蓋,其中該殼材料不同於該核心材料。
- 如請求項1之蓋,其中該等量子點包括一核心,該核心包括被包括ZnS之一第一殼環繞之銦及磷光體,該第一殼被包括ZnO之一第二殼環繞。
- 如請求項1之蓋,其中該等量子點係無鎘量子點。
- 如請求項1之蓋,其中該等量子點懸浮於一基質中。
- 如請求項16之蓋,其中該基質包括一丙烯酸鹽聚合物。
- 如請求項16之蓋,其中該基質包括一環氧樹脂聚合物。
- 如請求項1之蓋,其中該等量子點併入至珠中。
- 一種發光裝置,其包括:一封裝,其具有一中心井、一上表面及至少一個側表面;一LED,其在該中心井內;一蓋,其包括具有一頂表面及附接至該封裝之該上表面之一底表面之一上部分;一井,其在該頂部分之該底表面中;複數個量子點,其在該井中。
- 如請求項20之發光裝置,其中該蓋之該底表面藉助實質上不受氧影響之黏合劑附接至該封裝之該上表面。
- 一種用於具有含有一LED之一中心井及一上表面之一LED封裝之蓋,該蓋包括:一周邊部分,其經定大小且經組態以附接至該LED封裝之該上表面;一中心部分,其自該周邊部分凹陷從而形成一蓋井;複數個量子點,其在該蓋井中。
- 如請求項1之蓋,其進一步包括: 一帽,其附接至該周邊部分且覆蓋該蓋井。
- 如請求項23之蓋,其中該帽係透明的。
- 如請求項23之蓋,其中該帽係半透明的。
- 如請求項22之蓋,其中當該蓋附接至該LED封裝時,該蓋井與該LED間隔開。
- 如請求項22之蓋,其中該複數個量子點包括發射具有一第一波長之二次光之一第一類型之量子點及發射具有一第二波長之二次光之一第二類型之量子點。
- 如請求項7之蓋,其中該第一類型之量子點在被藍光激發時發射綠光,且該第二類型之量子點在被藍光激發時發射紅光。
- 如請求項22之蓋,其中該帽蓋經塑形以提供一透鏡。
- 如請求項22之蓋,其中該帽經塑形以提供一透鏡陣列。
- 如請求項22之蓋,其中該帽包括一光漫射器。
- 如請求項22之蓋,其中該等量子點包括被至少一個殼環繞之一中心核心。
- 如請求項32之蓋,其中該殼材料不同於該核心材料。
- 如請求項22之蓋,其中該等量子點包括一核心,該核心包括被包括ZnS之一第一殼環繞之銦及磷光體,該第一殼被包括ZnO之一第二殼環繞。
- 如請求項22之蓋,其中該等量子點係無鎘量子點。
- 如請求項22之蓋,其中該等量子點懸浮於一基質中。
- 如請求項16之蓋,其中該基質包括一丙烯酸鹽聚合物。
- 如請求項16之蓋,其中該基質包括一環氧樹脂聚合物。
- 如請求項22之蓋,其中該等量子點併入至珠中。
- 一種發光裝置,其包括:一封裝,其具有一中心井及一上表面; 一LED,其在該中心井內;一蓋,其具有附接至該封裝之該上表面之一周邊部分;一中心部分,其自該周邊部分凹陷從而形成一蓋井;複數個量子點,其在該蓋井中。
- 如請求項40之發光裝置,其中該蓋之該周邊部分藉助實質上不受氧影響之黏合劑附接至該封裝之該上表面。
- 如請求項40之發光裝置,其中該蓋之該凹陷中心部分至少部分地在該封裝之該中心井內。
- 如請求項40之發光裝置,其中該蓋之該凹陷中心部分實質上在該封裝之該中心井內。
- 如請求項22之蓋,其中該蓋井包括具有併入於其中之一磷光體之一基底壁。
- 如請求項44之蓋,其中該磷光體係一無機磷光體。
- 如請求項44之蓋,其中該磷光體係一廣泛發黃-綠光磷光體。
- 如請求項44之蓋,其中該磷光體包括Ce:YAG。
- 如請求項44之蓋,其中該磷光體包括Ce:LuAG。
- 一種發光裝置,其包括:一封裝,其具有一中心井及一上表面;一LED,其在該中心井內;一蓋,其具有附接至該封裝之該上表面之一周邊部分;一中心部分,其自該周邊部分凹陷從而形成一蓋井;該蓋之一基底壁,其具有併入於其中之一磷光體;複數個量子點,其在該蓋井中。
- 如請求項49之發光裝置,其中該LED係一藍LED,該磷光體係一廣泛發黃-綠光磷光體,且該等量子點係發紅色螢光之量子點。
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EP (1) | EP3068845B1 (zh) |
JP (1) | JP6340422B2 (zh) |
KR (1) | KR101937241B1 (zh) |
CN (1) | CN105900251A (zh) |
HK (1) | HK1222879A1 (zh) |
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2016
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Also Published As
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US20150137163A1 (en) | 2015-05-21 |
TWI563692B (en) | 2016-12-21 |
CN105900251A (zh) | 2016-08-24 |
US10128418B2 (en) | 2018-11-13 |
WO2015071768A3 (en) | 2015-07-23 |
JP2016538723A (ja) | 2016-12-08 |
US20160268486A1 (en) | 2016-09-15 |
EP3068845A2 (en) | 2016-09-21 |
WO2015071768A2 (en) | 2015-05-21 |
JP6340422B2 (ja) | 2018-06-06 |
KR101937241B1 (ko) | 2019-01-11 |
EP3068845B1 (en) | 2020-09-30 |
KR20160085315A (ko) | 2016-07-15 |
HK1222879A1 (zh) | 2017-07-14 |
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