TW201507797A - 放電輔助式雷射孔加工裝置及放電輔助式雷射孔加工方法 - Google Patents

放電輔助式雷射孔加工裝置及放電輔助式雷射孔加工方法 Download PDF

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Publication number
TW201507797A
TW201507797A TW103120096A TW103120096A TW201507797A TW 201507797 A TW201507797 A TW 201507797A TW 103120096 A TW103120096 A TW 103120096A TW 103120096 A TW103120096 A TW 103120096A TW 201507797 A TW201507797 A TW 201507797A
Authority
TW
Taiwan
Prior art keywords
hole
insulating substrate
discharge
laser light
laser
Prior art date
Application number
TW103120096A
Other languages
English (en)
Chinese (zh)
Inventor
Motoshi Ono
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201507797A publication Critical patent/TW201507797A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
TW103120096A 2013-06-14 2014-06-10 放電輔助式雷射孔加工裝置及放電輔助式雷射孔加工方法 TW201507797A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013126063A JP2016147266A (ja) 2013-06-14 2013-06-14 放電補助式レーザ孔加工装置および放電補助式レーザ孔加工方法

Publications (1)

Publication Number Publication Date
TW201507797A true TW201507797A (zh) 2015-03-01

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ID=52022076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103120096A TW201507797A (zh) 2013-06-14 2014-06-10 放電輔助式雷射孔加工裝置及放電輔助式雷射孔加工方法

Country Status (3)

Country Link
JP (1) JP2016147266A (ja)
TW (1) TW201507797A (ja)
WO (1) WO2014199775A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI725155B (zh) * 2016-03-31 2021-04-21 日商Ａｇｃ股份有限公司 玻璃基板之製造方法、於玻璃基板形成孔之方法、及於玻璃基板形成孔之裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100571960C (zh) * 2005-06-03 2009-12-23 三菱电机株式会社 激光加工方法以及激光加工装置
JP4470827B2 (ja) * 2005-07-20 2010-06-02 株式会社デンソー 複合加工装置およびそれを用いた加工方法
KR20110135947A (ko) * 2009-02-27 2011-12-20 피코드릴 에스 아 기판 내에 구멍 또는 리세스 또는 웰을 생성하는 방법, 방법을 수행하기 위한 장치, 및 그러한 장치 내에서 사용하기 위한 고주파 고전압 공급원
EP2770806A4 (en) * 2011-10-20 2015-10-21 Asahi Glass Co Ltd METHOD FOR FORMING DECLOUCHANT HOLES IN AN INSULATING SUBSTRATE, AND METHOD FOR PRODUCING AN INSULATING SUBSTRATE FOR AN INTERCALAR

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI725155B (zh) * 2016-03-31 2021-04-21 日商Ａｇｃ股份有限公司 玻璃基板之製造方法、於玻璃基板形成孔之方法、及於玻璃基板形成孔之裝置

Also Published As

Publication number Publication date
WO2014199775A1 (ja) 2014-12-18
JP2016147266A (ja) 2016-08-18

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