TW201500425A - Resin composition for high dielectric constant materials, molded article containing same, and master batch for coloring - Google Patents

Resin composition for high dielectric constant materials, molded article containing same, and master batch for coloring Download PDF

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TW201500425A
TW201500425A TW103104727A TW103104727A TW201500425A TW 201500425 A TW201500425 A TW 201500425A TW 103104727 A TW103104727 A TW 103104727A TW 103104727 A TW103104727 A TW 103104727A TW 201500425 A TW201500425 A TW 201500425A
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resin
carbon black
high dielectric
resin composition
molded article
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TW103104727A
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TWI609906B (en
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Ken Shimomai
Hirotaka Tsuruya
Masahide Sugiyama
Yutaka Nishibayashi
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Mitsubishi Gas Chemical Co
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307Other macromolecular compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/20Compounding polymers with additives, e.g. colouring
    • C08J3/22Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C08J3/226Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/022 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/24All layers being polymeric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/106Carbon fibres, e.g. graphite fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00Resin or rubber layer containing a blend of at least two different polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204Di-electric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/724Permeability to gases, adsorption
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment

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  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Laminated Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

This resin composition for high dielectric constant materials contains 40-80% by mass of (A) a resin material and 20-60% by mass of (B) a carbon black. The carbon black (B) has a DBP absorption of 10-50 mL/100 g and an iodine adsorption of 5-40 mg/g. This resin composition for high dielectric constant materials has a dielectric constant of 4 or more and a dielectric loss tangent of 0.05 or less.

Description

高介電率材料用之樹脂組成物、包含其之成形品以及著色用母料 Resin composition for high dielectric constant materials, molded articles including the same, and masterbatch for coloring

本發明關於一種高介電率材料用的樹脂組成物,其係適合於需要具有高介電率的材料,包含其之成形品、及著色用母料。 The present invention relates to a resin composition for a high dielectric constant material which is suitable for a material having a high dielectric constant, a molded article thereof, and a masterbatch for coloring.

<先前技術1> <Prior Art 1>

過去,關於使用於行動電話等的行動式通訊機器等,表面配置電極而成的表面實裝天線用材料,有文獻提出由含陶瓷的樹脂組成物所構成的材料。例如有文獻揭示了一種樹脂組成物,其係在樹脂材料中以相對於組成物佔40vol%~70vol%(體積%)的比例來混合球狀介電體陶瓷粉末(例如專利文獻1)等。 In the past, a material for surface mounting antennas in which an electrode is disposed on a surface of a mobile communication device or the like, which is used in a mobile phone or the like, has been proposed as a material composed of a ceramic-containing resin composition. For example, there is a resin composition in which a spherical dielectric ceramic powder (for example, Patent Document 1) is mixed in a ratio of 40 vol% to 70 vol% (% by volume) based on the composition of the resin material.

然而,由陶瓷粉末與樹脂所構成的樹脂組成物必須增加陶瓷粉末的添加量才能得到高介電率,結果比重變高,而會有無法因應天線輕量化的問題。另外,在使這種樹脂組成物成形時,所得到的成形品的質地脆,在耐衝撃性方面會有問題。在適用於行動電話所代表的通訊機器時,非 常需要能夠承受落下衝撃的耐衝撃性。 However, the resin composition composed of the ceramic powder and the resin must increase the amount of the ceramic powder to obtain a high dielectric constant, and as a result, the specific gravity becomes high, and there is a problem that the antenna cannot be reduced in weight. Further, when the resin composition is molded, the obtained molded article is brittle in texture and has a problem in terms of impact resistance. When applied to a communication machine represented by a mobile phone, It is often necessary to withstand the impact resistance of falling down.

為了使樹脂材料具有導電性,一般是混合石墨或碳黑等的碳材料系粒子。特別是關於碳黑,在摻合量低於滲濾閾值的情況,在保持絕緣性的狀態下可達成高介電率化,也有文獻針對介電率的頻率依賴性及其溫度依賴性進行檢討(例如非專利文獻1)。 In order to make the resin material conductive, it is generally a carbon material-based particle such as graphite or carbon black. In particular, in the case of carbon black, when the blending amount is lower than the percolation threshold, high dielectric constant can be achieved while maintaining the insulating property, and the literature reviews the frequency dependence of the dielectric constant and its temperature dependence. (for example, Non-Patent Document 1).

但是碳黑極不易混練,因此在為了達到高介電率化而增加添加量的情況,因為碳黑的分散不良,會導致樹脂組成物難以熔融、或成形品的外觀產生流痕等的問題。另外,在使用這種樹脂組成物作為天線用材料的情況,必須利用金屬來收發電波訊號,因此要求成形品具有良好的鍍敷特性。然而,為了達到高介電率化,在增加碳黑的添加量的情況,分散不良會導致碳黑浮出成形品表面,會有鍍膜的剝離強度不足的問題。 However, since carbon black is extremely difficult to knead, when the amount of addition is increased in order to achieve high dielectric constant, the dispersion of carbon black is poor, which causes a problem that the resin composition is hard to be melted, or flow marks are formed in the appearance of the molded article. Further, when such a resin composition is used as a material for an antenna, it is necessary to transmit and receive a radio wave signal by using a metal, and therefore it is required that the molded article has good plating characteristics. However, in order to achieve a high dielectric constant, in the case where the amount of addition of carbon black is increased, the dispersion failure causes the carbon black to float on the surface of the molded article, and there is a problem that the peel strength of the plating film is insufficient.

另一方面還已知幾個提升樹脂組成物成形品的耐衝撃性的手段。其中一個方法是在樹脂中摻合烯烴系共聚物(參照例如專利文獻2)。然而,在要求具有高介電率的樹脂組成物之中,一般的基材樹脂是聚苯硫醚(PPS)樹脂或液晶聚合物,並無法得到足夠的耐衝撃性改善效果。另外,如果基材樹脂欲採用耐衝撃性優異的聚碳酸酯樹脂,則代表性的高介電率陶瓷的氧化鈦或鈦酸鹼土類金屬鹽會具有使聚碳酸酯樹脂水解的觸媒的機能,故無法採用。這是因為在擠出成形等的施加高熱的加工步驟會發生樹脂黏度大幅降低的問題。 On the other hand, several means for improving the impact resistance of the molded article of the resin composition are also known. One of the methods is to blend an olefin-based copolymer into a resin (see, for example, Patent Document 2). However, among resin compositions having a high dielectric constant, a general substrate resin is a polyphenylene sulfide (PPS) resin or a liquid crystal polymer, and a sufficient impact resistance improvement effect cannot be obtained. Further, if the base resin is intended to use a polycarbonate resin excellent in impact resistance, a representative high dielectric ceramic titanium oxide or an alkaline earth metal salt of a titanate may have a catalyst for hydrolyzing the polycarbonate resin. Function, it can not be used. This is because the problem that the resin viscosity is largely lowered occurs in a processing step in which high heat is applied, such as extrusion molding.

其他提升耐衝撃性的手段,還已知有將基材樹脂與耐衝撃性高的樹脂複合而製成雙色成形品(參照例如專利文獻3)。但是,PPS或液晶聚合物與耐衝撃性高的聚碳酸酯樹脂複合而成的雙色成形品,其界面接著力弱,無法得到足夠的耐衝撃性。像這樣,對於介電率高的樹脂組成物的成形品賦予足夠耐衝撃性的嘗試仍然未成功。 In addition, it is known that a base resin and a resin having high impact resistance are combined to form a two-color molded article (see, for example, Patent Document 3). However, the two-color molded article in which PPS or a liquid crystal polymer is compounded with a polycarbonate resin having high impact resistance has a weak interfacial adhesion and cannot obtain sufficient impact resistance. As such, attempts to impart sufficient impact resistance to molded articles of a resin composition having a high dielectric constant have not been successful.

<先前技術2> <Prior Art 2>

以往將熱塑性樹脂著色成黑色時,是廣泛採用在樹脂或樹脂組成物的粉末、顆粒或顆粒與粉末的混合物中摻合粉末或粒狀的碳黑,以擠出機將其熔融混練,擠出並使其斷裂而製成粒狀的方法。然而在這種方法中,直接將碳黑粉末摻合至樹脂或樹脂組成物時,會有微粉造成作業環境污染、操作性的問題,甚至分級或凝集等造成碳黑顆粒的發生,在後續的生產批量中會有殘色、混色等的問題。 In the past, when the thermoplastic resin was colored black, it was widely used to mix powder or granular carbon black in a powder, granule or mixture of powder and powder of the resin or resin composition, and melt-kneaded and extruded by an extruder. And it is broken and made into a granular form. However, in this method, when the carbon black powder is directly blended into the resin or the resin composition, there is a problem that the fine powder causes work environment pollution, workability, and even classification or agglomeration causes carbon black particles to occur, in the subsequent There are problems with residual colors, color mixing, etc. in the production lot.

因此有一種預先使碳黑以高濃度分散在樹脂中而製造出母料,使用此母料將樹脂著色之方法。這種著色方法不會發生碳黑飛散,操作性優異,現在正成為樹脂著色方法的主流。 Therefore, there is a method in which carbon black is dispersed in a resin at a high concentration to produce a master batch, and the masterbatch is used to color the resin. This coloring method does not cause carbon black scattering, and is excellent in handleability, and is now becoming the mainstream of resin coloring methods.

然而在如上述般的方法之中,碳黑粒子的分散並不充分,而難以大量摻合。另外,藉由母料來著色的樹脂組成物,其所產生的成形品的表面可觀察到碳黑粒子凝集物「顆粒」,外觀並不良好(參照例如專利文獻4)。 However, in the method as described above, the dispersion of the carbon black particles is not sufficient, and it is difficult to blend in a large amount. In the resin composition colored by the master batch, the carbon black particle aggregate "particles" are observed on the surface of the molded article produced, and the appearance is not good (see, for example, Patent Document 4).

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

[專利文獻1]日本特許第3930814號公報 [Patent Document 1] Japanese Patent No. 3930814

[專利文獻2]日本特開2012-177015號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-177015

[專利文獻3]日本特開2009-026646號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2009-026646

[專利文獻4]日本特開昭61-236854號公報 [Patent Document 4] Japanese Laid-Open Patent Publication No. 61-236854

〔非專利文獻〕 [Non-patent literature]

[非專利文獻1]中村,「滲濾閾值以下的碳黑.聚乙烯複合體的介電特性的解釋」,電氣學會論文誌A,電氣學會,平成11年,第119卷,11號,p.1355~1361 [Non-Patent Document 1] Nakamura, "Interpretation of Dielectric Properties of Carbon Black and Polyethylene Composites Below the Percolation Threshold", Electrical Society Paper A, Electrical Society, Heisei 11, Vol. 119, No. 11, p .1355~1361

本發明之課題在於提供一種高介電率材料用之樹脂組成物,其係介電率、介電損耗角正切、外觀等優異;及包含其之成形品。另外,本發明目的還在於提供一種著色用母料,其係容易量產,著色樹脂成形品不易發生外觀不良。 An object of the present invention is to provide a resin composition for a high dielectric constant material which is excellent in dielectric constant, dielectric loss tangent, appearance, and the like, and a molded article including the same. Further, another object of the present invention is to provide a masterbatch for coloring which is easily mass-produced, and which is less likely to cause appearance defects in a colored resin molded article.

本發明人等檢討的結果,發現藉由以特定量將特定碳黑摻合在樹脂材料中,可得到介電率高、介電損耗角正切低的樹脂組成物。 As a result of review by the present inventors, it has been found that a resin composition having a high dielectric constant and a low dielectric loss tangent can be obtained by blending a specific carbon black in a resin material in a specific amount.

本發明的一個態樣為含有(A)樹脂材料與(B)碳黑的樹脂組成物,其特徵為:(B)碳黑的特性為特定 DBP(鄰苯二甲酸二丁酯)吸收量以及特定碘吸附量。藉此可輕易得到適合於高介電率材料的用途,尤其是天線構件用途的樹脂組成物。 One aspect of the present invention is a resin composition containing (A) a resin material and (B) carbon black, characterized in that: (B) the characteristics of carbon black are specific DBP (dibutyl phthalate) absorption and specific iodine adsorption capacity. Thereby, it is possible to easily obtain a resin composition suitable for use in a high dielectric constant material, particularly an antenna member.

本發明,係例如如以下所述。 The present invention is as follows, for example.

[1]一種高介電率材料用的樹脂組成物,其係含有(A)樹脂材料40~80質量%及(B)碳黑20~60質量%之高介電率材料用的樹脂組成物,並且前述(B)碳黑的DBP吸收量為10~50(mL/100g)且碘吸附量為5~40(mg/g),前述高介電率材料用的樹脂組成物的介電率為4以上,介電損耗角正切為0.05以下。 [1] A resin composition for a high dielectric constant material, which comprises a resin composition for a high dielectric constant material containing (A) a resin material of 40 to 80% by mass and (B) a carbon black of 20 to 60% by mass. And the DBP absorption amount of the (B) carbon black is 10 to 50 (mL/100 g) and the iodine adsorption amount is 5 to 40 (mg/g), and the dielectric ratio of the resin composition for the high dielectric material is used. When it is 4 or more, the dielectric loss tangent is 0.05 or less.

[2]如[1]所記載之高介電率材料用的樹脂組成物,其中含有前述(A)樹脂材料50~60質量%及前述(B)碳黑40~50質量%,前述(B)碳黑的DBP吸收量為25~35(mL/100g)且碘吸附量為10~30(mg/g)。 [2] The resin composition for a high dielectric constant material according to [1], wherein the (A) resin material is 50 to 60% by mass and the (B) carbon black is 40 to 50% by mass, and the above (B) The DBP absorption of carbon black is 25~35 (mL/100g) and the iodine adsorption amount is 10~30 (mg/g).

[3]如[1]或[2]所記載之高介電率材料用的樹脂組成物,其中前述(B)碳黑的氮吸附比表面積為5~40m2/g。 [3] The resin composition for a high dielectric constant material according to [1] or [2], wherein the (B) carbon black has a nitrogen adsorption specific surface area of 5 to 40 m 2 /g.

[4]如[1]~[3]之任一者所記載之高介電率材料用的樹脂組成物,其中前述(B)碳黑為氮吸附比表面積與碘吸附量的比未滿1.3。 [4] The resin composition for a high dielectric constant material according to any one of [1] to [3], wherein the (B) carbon black has a ratio of a nitrogen adsorption specific surface area to an iodine adsorption amount of less than 1.3. .

[5]如[1]~[4]之任一者所記載之高介電率材料用的樹脂組成物,其中前述(A)樹脂材料為聚碳酸酯樹脂、變性聚苯醚樹脂、聚苯硫醚樹脂或聚碳酸酯/ABS合金。 [5] The resin composition for a high dielectric constant material according to any one of [1] to [4] wherein the (A) resin material is a polycarbonate resin, a denatured polyphenylene ether resin, or a polyphenylene. Thioether resin or polycarbonate/ABS alloy.

[6]如[5]所記載之高介電率材料用的樹脂組成物,其中前述(A)樹脂材料為聚碳酸酯樹脂。 [6] The resin composition for a high dielectric constant material according to [5], wherein the (A) resin material is a polycarbonate resin.

[6-1]如[1]~[6]之任一項所記載之高介電率材料用的樹脂組成物,其中前述(B)碳黑的表面pH為3~8。 [6] The resin composition for a high dielectric constant material according to any one of [1] to [6] wherein the surface pH of the (B) carbon black is 3 to 8.

[7]一種成形品,其係含有如[1]~[6-1]之任一者所記載之高介電率材料用的樹脂組成物。 [7] A molded article comprising the resin composition for a high dielectric constant material according to any one of [1] to [6-1].

另外,本發明人等檢討的結果,發現藉由將特定量的特定碳黑摻合至聚碳酸酯樹脂,可得到介電率高、介電損耗角正切低、具有熱安定性的高介電率材料用的樹脂組成物,以及使其與聚碳酸酯樹脂雙色成形而成的成形品,解決了上述課題,而使本發明達到完成。 Further, as a result of review by the present inventors, it has been found that by blending a specific amount of specific carbon black into a polycarbonate resin, a high dielectric having a high dielectric constant, a low dielectric loss tangent, and thermal stability can be obtained. The resin composition for a material and a molded article obtained by molding a two-color resin with a polycarbonate resin solve the above problems and complete the present invention.

本發明例如以下所述。 The present invention is as follows, for example.

[8]一種成形品,其係使含有聚碳酸酯樹脂(a)及DBP吸收量為10~50(mL/100g)且碘吸附量為5~40(mg/g)的碳黑(b),前述聚碳酸酯樹脂(a)含量為40~80質量%,且前述碳黑(b)含量為20~60質量%的高介電率材料用的樹脂組成物(C)與聚碳酸酯樹脂(D)雙色成形所得到。 [8] A molded article comprising carbon black (b) containing a polycarbonate resin (a) and a DBP absorption amount of 10 to 50 (mL/100 g) and an iodine adsorption amount of 5 to 40 (mg/g). A resin composition (C) and a polycarbonate resin for a high dielectric material having a carbon black (b) content of 20 to 60% by mass, and a carbon black (b) content of 40 to 80% by mass. (D) obtained by two-color molding.

[8-1]如[8]所記載之成形品,其中前述高介電率材料用的樹脂組成物(C)中的前述聚碳酸酯樹脂(a)的含量為50~60質量%、前述碳黑(b)的含量為40~50質量%,前述碳黑(b)的DBP吸收量為25~35(mL/100g)且碘吸附量為10~30(mg/g)。 [8] The molded article according to the above [8], wherein the content of the polycarbonate resin (a) in the resin composition (C) for a high dielectric constant material is 50 to 60% by mass, the aforementioned The content of the carbon black (b) is 40 to 50% by mass, the DBP absorption amount of the carbon black (b) is 25 to 35 (mL/100 g), and the iodine adsorption amount is 10 to 30 (mg/g).

[8-2]如[8]或[8-1]所記載之成形品在,其中前述高 介電率材料用的樹脂組成物(C)的介電率為4以上,介電損耗角正切為0.05以下。 [8-2] The molded article according to [8] or [8-1], wherein the aforementioned high The resin composition (C) for a dielectric material has a dielectric constant of 4 or more and a dielectric loss tangent of 0.05 or less.

[8-3]一種成形品,其係使如上述[6]所記載之高介電率材料用的樹脂組成物(C)及聚碳酸酯樹脂(D)雙色成形所得到。 [8-3] A molded article obtained by two-color molding of a resin composition (C) and a polycarbonate resin (D) for a high dielectric constant material according to the above [6].

[8-4]如[8]~[8-3]之任一者所記載之成形品,其中前述碳黑(b)的氮吸附比表面積為5~40m2/g。 [8] The molded article according to any one of [8] to [8-3] wherein the carbon black (b) has a nitrogen adsorption specific surface area of 5 to 40 m 2 /g.

[8-5]如[8]~[8-4]之任一者所記載之成形品,其中前述碳黑(b)的氮吸附比表面積與碘吸附量的比未滿1.3。 [8] The molded article according to any one of [8] to [8-4] wherein the ratio of the nitrogen adsorption specific surface area to the iodine adsorption amount of the carbon black (b) is less than 1.3.

[8-6]如[8]~[8-5]之任一者所記載之成形品,其中前述聚碳酸酯樹脂(a)的黏度平均分子量為15,000~25,000。 [8] The molded article according to any one of [8], wherein the polycarbonate resin (a) has a viscosity average molecular weight of 15,000 to 25,000.

[9]如[8]~[8-6]之任一者所記載之成形品,其中前述成形品係由前述高介電率材料用的樹脂組成物(C)層及前述聚碳酸酯樹脂(D)層所構成,該聚碳酸酯樹脂(D)層的厚度為0.1mm~5mm。 [9] The molded article according to any one of [8], wherein the molded article is a resin composition (C) layer for the high dielectric constant material and the polycarbonate resin. The layer (D) is composed of a polycarbonate resin (D) layer having a thickness of 0.1 mm to 5 mm.

[10]如[8]~[9]之任一項所記載之成形品,其中前述高介電率材料用的樹脂組成物(C)及/或前述聚碳酸酯樹脂(D)含有無機填充材。 [10] The molded article according to any one of [8], wherein the resin composition (C) for the high dielectric constant material and/or the polycarbonate resin (D) contains an inorganic filler. material.

本發明人等進一步檢討的結果,發現藉由使用特定DBP(鄰苯二甲酸二丁酯)吸收量的碳黑,可得到能夠解決上述課題的著色用母料,而完成了本發明。 As a result of further examination by the inventors of the present invention, it has been found that a masterbatch for coloring which can solve the above problems can be obtained by using a carbon black having a specific DBP (dibutyl phthalate) absorption amount, and the present invention has been completed.

本發明如以下所述。 The invention is as follows.

[11]一種著色用母料,其係含有(E)碳黑及(F)樹脂材料之著色用母料,並且前述(E)碳黑的DBP吸收量為10~50(mL/100g),前述(E)碳黑的碘吸附量為10~30(mg/g)。 [11] A masterbatch for coloring comprising a masterbatch for coloring of (E) carbon black and (F) a resin material, and the DBP absorption amount of the (E) carbon black is 10 to 50 (mL/100 g), The (E) carbon black has an iodine adsorption amount of 10 to 30 (mg/g).

[12]如[11]所記載之著色用母料,其中前述DBP吸收量為25~35(mL/100g)。 [12] The masterbatch for coloring according to [11], wherein the DBP absorption amount is 25 to 35 (mL/100 g).

[13]如[11]或[12]所記載之著色用母料,其中前述(E)碳黑的含有比例為10~90質量%、前述(F)樹脂材料的含有比例為10~90質量%。 [13] The masterbatch for coloring according to [11] or [12], wherein the content of the (E) carbon black is 10 to 90% by mass, and the content of the (F) resin material is 10 to 90% by mass. %.

[14]如[13]所記載之著色用母料,其中前述(E)碳黑的含有比例為40~90質量%、前述(F)樹脂材料的含有比例為10~60質量%。 [14] The masterbatch for coloring according to [13], wherein the content of the (E) carbon black is 40 to 90% by mass, and the content of the (F) resin material is 10 to 60% by mass.

[15]如[11]~[14]之任一項所記載之著色用母料,其中前述(F)樹脂材料係選自聚碳酸酯樹脂、聚苯乙烯系樹脂、聚醯胺系樹脂、聚酯系樹脂、聚縮醛系樹脂所構成之群中之1種以上。 [15] The masterbatch for coloring according to any one of [11], wherein the (F) resin material is selected from the group consisting of a polycarbonate resin, a polystyrene resin, and a polyamide resin. One or more of the group consisting of a polyester resin and a polyacetal resin.

[16]如[15]所記載之著色用母料,其中前述樹脂材料為聚碳酸酯樹脂。 [16] The masterbatch for coloring according to [15], wherein the resin material is a polycarbonate resin.

[16-1]如[11]~[16]之任一項所記載之著色用母料,其中前述(E)碳黑的表面pH為3~8。 [16] The masterbatch for coloring according to any one of [11] to [16] wherein the surface pH of the (E) carbon black is from 3 to 8.

[17]如[11]~[16-1]之任一項所記載之著色用母料,其中進一步含有熱安定劑。 [17] The masterbatch for coloring according to any one of [11] to [16-1], which further contains a thermal stabilizer.

[18]一種成形材料,其係含有如[11]~[17]之任一者所記載之著色用母料與被著色樹脂。 [18] A molding material comprising the coloring master batch described in any one of [11] to [17], and a colored resin.

依據本發明可提供一種介電率、介電損耗角正切、外觀等優異的高介電率材料用的樹脂組成物,及包含其之成形品。另外還可提供一種著色用母料,其係容易量產,而且著色樹脂成形品不易發生外觀不良。 According to the present invention, it is possible to provide a resin composition for a high dielectric constant material having excellent dielectric constant, dielectric loss tangent, appearance, and the like, and a molded article comprising the same. Further, a masterbatch for coloring can be provided, which is easy to mass-produce, and the colored resin molded article is less likely to cause poor appearance.

<第1態樣> <1st aspect>

本發明的第1態樣所關連的高介電率材料用脂組成物係含有(A)樹脂材料及具有特定物性的(B)碳黑。(B)碳黑的特徵為DBP吸收量低、碘吸附量小。 The fat composition for a high dielectric constant material according to the first aspect of the present invention contains (A) a resin material and (B) carbon black having specific physical properties. (B) Carbon black is characterized by a low DBP absorption amount and a small amount of iodine adsorption.

(A)樹脂材料 (A) Resin material

作為高介電率材料用的樹脂組成物基材的樹脂材料,係以介電損耗角正切低者為佳。樹脂可為熱塑性樹脂或熱硬化性樹脂之任一者,而以可射出成形的熱塑性樹脂為佳。可列舉例如低密度聚乙烯、超低密度聚乙烯、超超低密度聚乙烯、高密度聚乙烯、低分子量聚乙烯、超高分子量聚乙烯、乙烯-丙烯共聚物、聚丙烯、丙烯腈/丁二烯/苯乙烯共聚物(ABS樹脂)等的聚烯烴系樹脂、或聚苯醚樹脂與聚苯乙烯系樹脂的合金、聚苯醚樹脂與聚醯胺系樹脂的合金、聚苯醚樹脂與聚烯烴系樹脂的合金等的變性聚苯醚樹脂、聚碳酸酯樹脂等。其他還可列舉聚對苯二甲酸丁 二酯樹脂、聚對苯二甲酸乙二酯樹脂等所代表的聚酯樹脂、聚醯胺6、聚醯胺66、聚醯胺MXD6等所代表的聚醯胺樹脂、聚縮醛樹脂等的工程塑膠或含有該等的合金。另外還可依照希望使用液晶高分子、聚苯硫醚樹脂、聚醯亞胺樹脂這些高耐熱性的超級工程塑膠或含有該等的合金。 The resin material of the resin composition substrate for a high dielectric constant material is preferably a dielectric loss tangent lower. The resin may be either a thermoplastic resin or a thermosetting resin, and a thermoplastic resin which can be injection molded is preferred. For example, low density polyethylene, ultra low density polyethylene, ultra ultra low density polyethylene, high density polyethylene, low molecular weight polyethylene, ultra high molecular weight polyethylene, ethylene-propylene copolymer, polypropylene, acrylonitrile/butyl a polyolefin-based resin such as a diene/styrene copolymer (ABS resin), an alloy of a polyphenylene ether resin and a polystyrene resin, an alloy of a polyphenylene ether resin and a polyamide resin, and a polyphenylene ether resin. A denatured polyphenylene ether resin such as an alloy of a polyolefin resin or a polycarbonate resin. Polybutylene terephthalate a polyester resin represented by a diester resin or a polyethylene terephthalate resin, a polyamide resin represented by a polydecylamine 6, a polyamide amine 66, a polyamide amine MXD6, or the like, or a polyacetal resin. Engineering plastics or alloys containing these. Further, it is also possible to use a super-engineered plastic having high heat resistance such as a liquid crystal polymer, a polyphenylene sulfide resin or a polyimide resin, or an alloy containing the same.

其中合適者可列舉聚碳酸酯樹脂、變性聚苯醚樹脂、聚苯硫醚樹脂或聚碳酸酯/ABS合金,從成形加工性與耐熱特性優異的觀點看來,以聚碳酸酯樹脂、聚苯醚樹脂與聚苯乙烯系樹脂合金化而成的變性聚苯醚為特佳。 Among them, a polycarbonate resin, a denatured polyphenylene ether resin, a polyphenylene sulfide resin, or a polycarbonate/ABS alloy is preferable, and polycarbonate resin and polyphenylene are used from the viewpoint of excellent moldability and heat resistance. Denatured polyphenylene ether obtained by alloying an ether resin and a polystyrene resin is particularly preferable.

(B)碳黑 (B) carbon black

本發明所使用的碳黑的DBP吸收量為10~50(mL/100g),且碘吸附量為5~40(mg/g)。理想的情況,DBP吸收量為25~35(mL/100g),且碘吸附量為10~30(mg/g)。在JIS K6217-4:2001中記載了DBP吸收量的測定方法,是以每100g所吸收的DBP的容積(mL/100g)來表示。另外,在JIS K6217-1:2008中記載了碘吸附量的測定方法,以每單位重量的碳黑所吸附的碘量(mg/g)來表示。皆為慣用的碳黑特性指標。 The carbon black used in the present invention has a DBP absorption of 10 to 50 (mL/100 g) and an iodine adsorption amount of 5 to 40 (mg/g). Ideally, the DBP absorption is 25 to 35 (mL/100 g), and the iodine adsorption amount is 10 to 30 (mg/g). The method for measuring the amount of DBP absorption is described in JIS K6217-4:2001, and is expressed by the volume (mL/100 g) of DBP absorbed per 100 g. Further, a method for measuring the amount of iodine adsorption is described in JIS K6217-1:2008, and is expressed by the amount of iodine (mg/g) adsorbed per unit weight of carbon black. They are all customary carbon black characteristics.

一般而言,碳黑是以粒子彼此熔接而成而被稱為聚集體的狀態存在,概念上可舉葡萄串為例。將此聚集體的發達程度稱為組織,表示組織發達程度的指標是採用DBP吸收量。碘吸附量是測定包括碳黑粒子細孔的總比表面積,而為最具代表性的指標。 In general, carbon black exists in a state in which particles are welded to each other and is called an aggregate. Conceptually, a grape bunch is exemplified. The degree of development of this aggregate is called organization, and the indicator indicating the degree of development of the organization is the amount of DBP absorption. The iodine adsorption amount is the most representative index for determining the total specific surface area including the pores of the carbon black particles.

碘吸附量愈小,碳黑粒子的比表面積愈小,而認為樹脂組成物中的顆粒子彼此接觸的可能性愈低。在DBP吸收量小的情況,組織的發達程度低,表示粒子彼此熔接產生的連結不發達。亦即具有這些特徵的碳黑,即使大量添加至樹脂中,粒子之間也容易藉由樹脂而絕緣。此外,由於滲濾閾值高,因此可保持絕緣性,被認為可對樹脂組成物賦予,高介電率與低介電損耗角正切這些介電特性。 The smaller the amount of iodine adsorption, the smaller the specific surface area of the carbon black particles, and the lower the possibility that the particles in the resin composition are in contact with each other. When the DBP absorption amount is small, the degree of development of the tissue is low, and the connection resulting from the fusion of the particles is not developed. That is, carbon black having these characteristics, even if added in a large amount to the resin, is easily insulated by the resin between the particles. Further, since the percolation threshold is high, insulation can be maintained, and it is considered that the dielectric properties can be imparted to the resin composition, and the dielectric properties are high dielectric constant and low dielectric loss tangent.

在碳黑的DBP吸收量高於50(mL/100g)的情況或碘吸附量高於為40(mg/g)的情況,樹脂組成物中的碳黑粒子彼此接觸,電連結的頻率上昇,介電損耗角正切增加。這同時意指在樹脂組成物中碳黑粒子容易分散不良,因此在熔融混練時分散不良,分離的碳黑容易附著在模具附近。其結果,難以安定製造出顆粒,射出成形品會有流痕等的外觀不良發生,而難以得到外觀優異的成形品。 In the case where the DBP absorption amount of carbon black is higher than 50 (mL/100 g) or the iodine adsorption amount is higher than 40 (mg/g), the carbon black particles in the resin composition are in contact with each other, and the frequency of electrical connection increases. The dielectric loss tangent increases. This also means that the carbon black particles are easily dispersed poorly in the resin composition, so that the dispersion is poor during melt kneading, and the separated carbon black tends to adhere to the vicinity of the mold. As a result, it is difficult to produce pellets in a stable manner, and an appearance defect such as a flow mark may occur in the injection molded article, and it is difficult to obtain a molded article having an excellent appearance.

組織發達的碳黑雖然容易得到介電率高的樹脂組成物,然而會有聚集體的方向性造成介電率的異方性的問題,或發生滲濾而造成介電損耗角正切增加的問題,尤其不適合作為天線構件用。 Although the developed carbon black is easy to obtain a resin composition having a high dielectric constant, there is a problem that the directionality of the aggregate causes an anisotropy of the dielectric property, or the percolation causes a problem that the dielectric loss tangent increases. In particular, it is not suitable for use as an antenna member.

DBP吸收量低於10(mL/100g)的碳黑,在生產碳黑時,附著於碳黑粒子的製造裝置的附著性會增加,難以連續操作(日本特開2011-98995)。因此難以穩定地取得這種碳黑。另外,碘吸附量低於5(mg/g)的碳黑在國內外皆沒有販賣,難以穩定地購入。 When the carbon black having a DBP absorption of less than 10 (mL/100 g) is produced, the adhesion of the apparatus for adhering to the carbon black particles is increased in the production of carbon black, and it is difficult to continuously operate (JP-A-2011-98995). Therefore, it is difficult to stably obtain such carbon black. In addition, carbon black having an iodine adsorption amount of less than 5 (mg/g) is not sold at home and abroad, and it is difficult to purchase it stably.

本發明所使用的(B)碳黑只要具備特定DBP吸收量 與碘吸附量,則種類並無限制,可因應目的適當地選擇。可列舉例如藉由油爐法使原料油不完全燃燒所製造出的油爐黑,藉由特殊爐法所製造出的科琴黑、以乙炔氣體為原料所製造出的乙炔黑、在密閉空間內使原料直接燃燒所製造出的燈黑、藉由天然氣的熱分解所製造出的熱碳黑、使擴散火焰接觸槽鋼的底面所累積的槽黑等。市售品已知有爐黑法的「旭#8」或「Asahi thermal」(旭碳股份有限公司)。 The (B) carbon black used in the present invention is only required to have a specific DBP absorption amount. There is no limitation on the type of iodine adsorption, and it can be appropriately selected depending on the purpose. For example, the oil furnace black produced by incomplete combustion of the feedstock oil by the oil furnace method, the acetylene black produced by the special furnace method, and the acetylene black produced by using acetylene gas as a raw material can be used in a sealed space. The lamp black produced by direct combustion of the raw material, the hot carbon black produced by thermal decomposition of natural gas, and the groove black accumulated by the diffusion flame contacting the bottom surface of the channel steel. Commercially available products are known as "Asahi #8" or "Asahi thermal" (Asahi Carbon Co., Ltd.).

另外,碳黑的表面pH會稍微呈現鹼性或呈現中性至酸性,而在(A)樹脂材料採用聚碳酸酯或聚酯的情形,這些樹脂會有因為鹼而水解的傾向。所以,(B)碳黑宜為中性至酸性,表面pH宜為3~8。 Further, the surface pH of the carbon black may be slightly alkaline or neutral to acidic, and in the case where the (A) resin material is polycarbonate or polyester, these resins tend to be hydrolyzed by a base. Therefore, (B) carbon black should be neutral to acidic, and the surface pH should be 3-8.

一個實施形態中,(B)碳黑的氮吸附比表面積(N2SA)係以5~40m2/g為佳,以10~30m2/g為較佳。氮吸附比表面積與碘吸附量同樣地,是表示碳黑的總比表面積,是有用的碳黑特性指標。氮吸附比表面積可依據JIS K6217-2作測定。碳黑的氮吸附比表面積在上述範圍的優點,與碘吸附量同樣地,在介電率、介電損耗角正切等方面為合適。 In one embodiment, the nitrogen adsorption specific surface area (N 2 SA) of the (B) carbon black is preferably 5 to 40 m 2 /g, more preferably 10 to 30 m 2 /g. Similarly to the iodine adsorption amount, the nitrogen adsorption specific surface area is a total specific surface area of the carbon black, and is a useful carbon black characteristic index. The nitrogen adsorption specific surface area can be measured in accordance with JIS K6217-2. The nitrogen adsorption specific surface area of carbon black is in the above range, and is similar to the iodine adsorption amount in terms of dielectric constant, dielectric loss tangent, and the like.

另外,氮吸附比表面積與碘吸附量的比(N2SA/IA)係以未滿1.3為佳,未滿1.1為較佳。藉由以後述添加量添加N2SA/IA在上述範圍的碳黑,可得到具有較優異的介電率及介電損耗角正切的樹脂組成物。這種樹脂組成物可表現出安定的介電性能。 Further, the ratio of the nitrogen adsorption specific surface area to the iodine adsorption amount (N 2 SA/IA) is preferably less than 1.3, and preferably less than 1.1. By adding carbon black having a N 2 SA/IA in the above range by the amount of addition described later, a resin composition having a relatively excellent dielectric constant and dielectric loss tangent can be obtained. This resin composition can exhibit stable dielectric properties.

在高介電率材料用的樹脂組成物之中,(A)樹脂材料與(B)碳黑的含量分別為(A)40~80質量%及(B)20~60質量%。理想的情況是含有(A)樹脂材料50~60質量%及(B)碳黑40~50質量%。只要是具備上述特定DBP吸收量與碘吸附量的碳黑,則在此範圍內碳黑粒子不會發生滲濾,可得到高介電率且低介電損耗角正切的樹脂組成物。此外,介電特性或滲濾閾值等的特性,理論上會依賴於體積分率。在(B)碳黑含量為20~60質量%的情況,以體積分率而計大致相當於15~55體積%。 In the resin composition for a high dielectric constant material, the content of the (A) resin material and the (B) carbon black are (A) 40 to 80% by mass and (B) 20 to 60% by mass, respectively. It is desirable to contain (A) a resin material in an amount of 50 to 60% by mass and (B) a carbon black in an amount of 40 to 50% by mass. As long as it is carbon black having the specific DBP absorption amount and iodine adsorption amount, the carbon black particles do not percolate in this range, and a resin composition having a high dielectric constant and a low dielectric loss tangent can be obtained. In addition, characteristics such as dielectric characteristics or percolation thresholds are theoretically dependent on the volume fraction. When the (B) carbon black content is 20 to 60% by mass, it is approximately 15 to 55% by volume based on the volume fraction.

為了提升樹脂組成物的製造及成形步驟中的熔融混練時、或製品使用時在高溫氣體環境下的熱安定性,宜在高介電率材料用的樹脂組成物中摻合熱安定劑。熱安定劑係以受阻酚系化合物、亞磷酸酯系化合物或亞膦酸鹽系化合物及氧化鋅等為佳。 In order to improve the thermal stability of the resin composition during the production and molding steps, or the thermal stability in the high-temperature gas atmosphere when the product is used, it is preferred to incorporate a thermal stabilizer into the resin composition for the high dielectric material. The thermal stabilizer is preferably a hindered phenol compound, a phosphite compound, a phosphinate compound, or zinc oxide.

在高介電率材料用的樹脂組成物中可因應必要進一步添加其他成分。這種添加劑可列舉填充劑、補強材、耐侯性改良劑、發泡劑、潤滑劑、流動性改良劑、耐衝撃性改良劑、染料、顏料、分散劑等。 Further, other components may be added as necessary in the resin composition for a high dielectric constant material. Examples of such an additive include a filler, a reinforcing material, a weather resistance improver, a foaming agent, a lubricant, a fluidity improver, a wash resistance improver, a dye, a pigment, a dispersant, and the like.

例如填充劑或補強劑可採用有機或無機之任一者,而通常以使用玻璃纖維、雲母(白雲母、黑雲母、金雲母等)、氧化鋁、滑石、鈣矽石、鈦酸鉀、碳酸鈣、二氧化矽等的無機物為佳。這些物質相對於(A)樹脂材料與特定(B)碳黑的合計100質量份宜摻合1~100質量份,較佳為5~80質量份、更佳為5~60質量份。若摻合這種物 質,則一般來說可提升剛性、耐熱性、尺寸精密度等。這些物質之中,尤其白雲母或氧化鋁由於具有降低介電損耗角正切的效果,故為較佳。白雲母或氧化鋁的摻合量,相對於(A)樹脂材料與特定(B)碳黑的合計100質量份係以5~100質量份為佳,10~50質量份為較佳。 For example, the filler or the reinforcing agent may be any of organic or inorganic, and usually uses glass fiber, mica (mica, biotite, phlogopite, etc.), alumina, talc, ettringite, potassium titanate, carbonic acid. An inorganic substance such as calcium or cerium oxide is preferred. These materials are preferably blended in an amount of from 1 to 100 parts by mass, preferably from 5 to 80 parts by mass, more preferably from 5 to 60 parts by mass, per 100 parts by mass of the total of the (A) resin material and the specific (B) carbon black. If this kind of thing is blended Quality, in general, can improve rigidity, heat resistance, dimensional precision and the like. Among these, in particular, muscovite or alumina is preferred because it has an effect of lowering the dielectric loss tangent. The blending amount of the muscovite or the alumina is preferably 5 to 100 parts by mass, and preferably 10 to 50 parts by mass, based on 100 parts by mass of the total of the (A) resin material and the specific (B) carbon black.

例如耐衝撃改良劑只要是一般摻合至樹脂組成物而能夠改良其耐衝撃性的物質,則不受特別限定,而具體而言,可列舉SBS(苯乙烯-丁二烯-苯乙烯)、SEBS(苯乙烯-乙烯-丁烯-苯乙烯)等的苯乙烯-丁二烯系嵌段聚合物與其氫化物、SIS(苯乙烯-異戊二烯-苯乙烯)、SEPS(苯乙烯-乙烯-丙烯-苯乙烯)等的苯乙烯-異戊二烯系嵌段聚合物與其氫化物、烯烴系彈性體、聚酯系彈性體、聚矽氧系橡膠、丙烯酸酯系橡膠、含有(甲基)丙烯酸烷酯系聚合物的多層構造聚合物、使由聚矽氧系橡膠與丙烯酸酯系橡膠成分所構成的複合橡膠與乙烯基系單體接枝聚合而成的複合橡膠系接枝共聚物等。這種物質的摻合量,係以相對於(A)樹脂材料與特定(B)碳黑的合計100質量份含3~20質量份為佳,5~10質量份為較佳。 For example, the anti-crushing agent is not particularly limited as long as it is generally blended with a resin composition and can improve the punching resistance, and specifically, SBS (styrene-butadiene-styrene), Styrene-butadiene block polymer such as SEBS (styrene-ethylene-butylene-styrene) and its hydride, SIS (styrene-isoprene-styrene), SEPS (styrene-ethylene) a styrene-isoprene block polymer such as propylene-styrene, a hydride, an olefin elastomer, a polyester elastomer, a polyoxyn rubber, an acrylate rubber, or a methyl group a multilayer structure polymer of an alkyl acrylate polymer, a composite rubber-based graft copolymer obtained by graft-polymerizing a composite rubber composed of a polyoxymethylene rubber and an acrylate rubber component with a vinyl monomer. Wait. The amount of the substance to be blended is preferably 3 to 20 parts by mass, and preferably 5 to 10 parts by mass, based on 100 parts by mass of the total of the (A) resin material and the specific (B) carbon black.

本發明之高介電率材料用的樹脂組成物含有(A)樹脂材料與特定(B)碳黑,可經過例如將(A)樹脂材料與特定(B)碳黑熔融混練之步驟而製造。另外還可藉由在用以使樹脂材料溶解的溶劑中均勻分散而形成的清漆中將溶劑除去之方法而得到。 The resin composition for a high dielectric constant material of the present invention contains (A) a resin material and a specific (B) carbon black, and can be produced, for example, by a step of melt-kneading (A) a resin material and a specific (B) carbon black. Further, it can also be obtained by a method of removing a solvent from a varnish which is formed by uniformly dispersing a solvent for dissolving a resin material.

本申請案所使用的(B)碳黑的DBP吸收量為10~ 50(mL/100g),且碘吸附量為5~40(mg/g),而超過該數值範圍上限的普通碳黑相比,在熔融樹脂中的分散性良好。因此本發明之高介電率材料用的樹脂組成物適合於藉由擠出機進行熔融混練來製造。 The DBP absorption of (B) carbon black used in this application is 10~ 50 (mL/100 g), and the iodine adsorption amount is 5 to 40 (mg/g), and the dispersibility in the molten resin is good as compared with the ordinary carbon black exceeding the upper limit of the numerical range. Therefore, the resin composition for a high dielectric constant material of the present invention is suitably produced by melt-kneading by an extruder.

熔融混練可藉由例如在(A)樹脂材料中摻合(B)碳黑,以及因應必要摻合如上述般的熱安定劑或添加劑,藉由亨舍爾混合機、螺帶式摻合機、V型摻合機等均勻混合之後,以單軸或多軸混練擠出機、輥機、班布里混合機、Labo Plastomill混合機(Brabender混合機)等進行加熱,在熔融狀態下進行混練來進行。此外還可預先將幾個成分混合、或可不預先混合而在混練過程中供給,以代替將全部的成分一起混合及混練。 The melt-kneading can be performed by, for example, blending (B) carbon black in the (A) resin material, and if necessary, blending the heat stabilizer or additive as described above, by a Henschel mixer, a ribbon blender After uniformly mixing the V-type blender, the uniaxial or multi-axis mixing extruder, the roll mill, the Banbury mixer, the Labo Plastomill mixer (Brabender mixer), etc. are heated, and the mixture is kneaded in a molten state. Come on. In addition, several components may be mixed in advance or may be supplied during the kneading process without premixing, instead of mixing and kneading all the components together.

混練溫度與混練時間會依照目標的高介電率材料用的樹脂組成物或混練機的種類等而有所不同,而通常混練溫度為200~350℃,宜為220~320℃、混練時間係以20分鐘以下為佳。若超過350℃或20分鐘,則樹脂材料的熱劣化會成為問題,會有發生成形品物性降低或外觀不良的情形。以這種方式得到的高介電率材料用的樹脂組成物粒可採用熱塑性樹脂一般所使用的成形法,例如射出成形法、擠出成形法、中空成形法、熱成形法、壓延成形法等製成成形品。從生產性、製品性能的觀點看來,其中以射出成形法為佳。 The kneading temperature and the kneading time will vary according to the type of the resin composition or the kneading machine used for the high dielectric constant material, and the usual kneading temperature is 200 to 350 ° C, preferably 220 to 320 ° C, and the kneading time system. It is better to use less than 20 minutes. When it exceeds 350 ° C or 20 minutes, thermal deterioration of the resin material may become a problem, and there may be a case where the physical properties of the molded article are lowered or the appearance is poor. The resin composition pellet for a high dielectric constant material obtained in this manner may be a molding method generally used for a thermoplastic resin, for example, an injection molding method, an extrusion molding method, a hollow molding method, a thermoforming method, a calender molding method, or the like. It is made into a molded article. From the viewpoint of productivity and product performance, an injection molding method is preferred.

本發明之高介電率材料用的樹脂組成物可輕易製造。另外,射出成形品的外觀也沒有流痕等,而為良好的,因 此適合於天線零件。為了使天線零件小型化,樹脂組成物的介電率係以4以上為佳,6以上為較佳,8以上為更佳,9以上為特佳。這是因為若介電率小,則無法使天線零件夠小。小型化的觀點看來,介電率的上限不受特別限定,然而若介電率過大,則天線尺寸變得過小,因此實用上係以30以下為佳,14以下為較佳,12以下為更佳,11以下為特佳。介電損耗角正切愈小、由天線發出電波發射效率愈高,電池愈耐久,因此0.05以下為佳,0.03以下為較佳,0.01以下為特佳。 The resin composition for a high dielectric material of the present invention can be easily produced. In addition, there is no flow mark or the like in the appearance of the injection molded article, and it is good because This is suitable for antenna parts. In order to reduce the size of the antenna component, the dielectric composition of the resin composition is preferably 4 or more, preferably 6 or more, more preferably 8 or more, and particularly preferably 9 or more. This is because if the dielectric constant is small, the antenna component cannot be made small enough. From the viewpoint of miniaturization, the upper limit of the dielectric constant is not particularly limited. However, if the dielectric constant is too large, the antenna size is too small. Therefore, it is preferably 30 or less in practical use, preferably 14 or less, and 12 or less. Better, 11 or less is especially good. The smaller the dielectric loss tangent is, the higher the efficiency of the radio wave emitted by the antenna is, and the longer the battery is, the better the temperature is 0.05 or less, preferably 0.03 or less, and particularly preferably 0.01 or less.

在將使用樹脂組成物的成形品製成天線零件的情況,是在成形品表面形成導體的天線圖型,然而在使用上述高介電率材料用的樹脂組成物的情況,能夠以標準的ABS用無電解鍍銅處理等輕易地形成圖型。無電解鍍銅處理通常包括前處理、化學蝕刻、觸媒添加、活性化、化學鍍敷的步驟,在化學蝕刻步驟中,利用表面粗化進行的微細凹凸形狀形成,會大幅影響鍍敷金屬與樹脂的密著性。上述特定DBP吸收量的碳黑在樹脂中的分散性良好,因此即使摻合量高也不會溢流,即使表面粗化,碳黑粒子在成形品表面也不易游離。因此樹脂組成物與無電解鍍銅之間的密著性良好。 In the case where the molded article using the resin composition is an antenna component, the antenna pattern is formed on the surface of the molded article. However, in the case of using the resin composition for the high dielectric material, the standard ABS can be used. The pattern is easily formed by electroless copper plating or the like. The electroless copper plating treatment generally includes a pretreatment, a chemical etching, a catalyst addition, an activation, and an electroless plating step. In the chemical etching step, the formation of fine concavo-convex shapes by surface roughening greatly affects the plating metal and The adhesion of the resin. Since the carbon black of the specific DBP absorption amount is excellent in dispersibility in the resin, it does not overflow even if the amount of the carbon black is high, and even if the surface is roughened, the carbon black particles are not easily released on the surface of the molded article. Therefore, the adhesion between the resin composition and electroless copper plating is good.

〔實施例A〕 [Example A]

藉由實施例對於上述第1態樣進一步作詳細說明,然而本發明並不受該等所限定。此外在以下的實施例之中, 各成分採用以下揭示的物品。 The above first aspect will be further described in detail by way of examples, but the invention is not limited thereto. Further in the following embodiments, Each component uses the items disclosed below.

(A)樹脂材料 (A) Resin material

(a1)聚碳酸酯樹脂 (a1) polycarbonate resin

三菱工程塑膠股份有限公司製品、「商品名:S-3000FN」 Mitsubishi Engineering Plastics Co., Ltd., "Product Name: S-3000FN"

(a2)聚苯醚樹脂 (a2) polyphenylene ether resin

聚2,6-二甲基-1,4-苯醚(以下簡記為「PPE」);三菱工程塑膠股份有限公司製品、「商品名;PX100L」、在氯仿中測得的30℃的極限黏度0.47dl/g。 Poly 2,6-dimethyl-1,4-phenylene ether (hereinafter abbreviated as "PPE"); Mitsubishi Engineering Plastics Co., Ltd. product, "trade name; PX100L", 30 ° C ultimate viscosity measured in chloroform 0.47dl/g.

(a3)耐衝擊聚苯乙烯樹脂(以下簡記為「HIPS」) (a3) Impact-resistant polystyrene resin (hereinafter abbreviated as "HIPS")

日本聚苯乙烯股份有限公司製,「商品名:HT478」、重量平均分子量200,000、MFR3.0g/10分鐘(然而是在200℃×5kg的條件下作測定)。 "Polymer name: HT478", manufactured by Japan Polystyrene Co., Ltd., weight average molecular weight of 200,000, MFR of 3.0 g/10 minutes (however, measured under conditions of 200 ° C × 5 kg).

(B)碳黑 (B) carbon black

(b1)旭碳股份有限公司製,「商品名:旭#8」 (b1) Asahi Carbon Co., Ltd., "Product Name: Asahi #8"

(b2)旭碳股份有限公司製,「商品名:Asahi thermal」 (b2) Asahi Carbon Co., Ltd., "Product name: Asahi thermal"

(b3)旭碳股份有限公司製,「商品名:旭#15」 (b3) Asahi Carbon Co., Ltd., "Product Name: Asahi #15"

(b4)旭碳股份有限公司製,「商品名:旭#35」 (b4) Asahi Carbon Co., Ltd., "Product Name: Asahi #35"

(b5)東海碳股份有限公司製,「商品名:Seast TA」 (b5) Donghai Carbon Co., Ltd., "Product Name: Seast TA"

(b6)東海碳股份有限公司製,「商品名:Seast S」 (b6) Donghai Carbon Co., Ltd., "Product Name: Seast S"

(b7)東海碳股份有限公司製,「商品名:TOKA BLACK#7270SB」 (b7) Donghai Carbon Co., Ltd., "Product Name: TOKA BLACK #7270SB"

(b8)東海碳股份有限公司製,「商品名:TOKA BLACK#7100F」 (b8) manufactured by Tokai Carbon Co., Ltd., "Product Name: TOKA BLACK #7100F"

將所使用的碳黑的物性彙整於下表A。 The physical properties of the carbon black used were summarized in Table A below.

(C)熱安定劑 (C) Thermal stabilizer

(c1)肆(2,4-二第三丁基苯基)[1,1-聯苯基]-4,4'-二基雙亞膦酸鹽;Ciba Specialty Chemicals公司製,「商品名:IRGAFAS P-EPQ」 (c1) 肆(2,4-di-t-butylphenyl)[1,1-biphenyl]-4,4'-diylbisphosphonite; manufactured by Ciba Specialty Chemicals, Inc., "Product Name: IRGAFAS P-EPQ"

(c2)參(2,4-二第三丁基苯基)亞磷酸酯;Adeka Argus股份有限公司製,「商品名:ADK STAB 2112」 (c2) ginseng (2,4-di-t-butylphenyl) phosphite; manufactured by Adeka Argus Co., Ltd., "trade name: ADK STAB 2112"

實施例A1~A10及比較例A1~A7 Examples A1 to A10 and Comparative Examples A1 to A7

以表1與表2所示的比例摻合聚碳酸酯樹脂、聚苯醚樹脂、聚苯乙烯系樹脂、碳黑及熱安定劑,藉由滾筒攪拌機均勻混合。將其投入雙軸擠出機(日本製鋼所製,「TEX30 α」、螺桿直徑30mm、L/D=63)的上游部分,在料缸溫度265℃、螺桿轉速400rpm的條件下熔融混練,而製造出樹脂組成物的顆粒。使所得到的顆粒在100℃乾燥4小時之後,進行以下(1)及(2)的評估。將評估結果揭示於表1與表2。 The polycarbonate resin, the polyphenylene ether resin, the polystyrene resin, the carbon black, and the heat stabilizer were blended at a ratio shown in Table 1 and Table 2, and uniformly mixed by a roller mixer. This was put into an upstream part of a twin-screw extruder ("Steel 30 α", screw diameter 30 mm, L/D=63) manufactured by Nippon Steel Co., Ltd., and melt-kneaded at a cylinder temperature of 265 ° C and a screw rotation speed of 400 rpm. A pellet of the resin composition is produced. After the obtained pellets were dried at 100 ° C for 4 hours, the evaluations of the following (1) and (2) were carried out. The evaluation results are disclosed in Tables 1 and 2.

(評估方法) (evaluation method) (1)介電特性 (1) Dielectric properties

使用上述方法所得到的樹脂組成物粒,並使用射出成形機(東芝機械股份有限公司製,IS100F、鎖模力100t)在料缸溫度290℃~310℃、金屬模具溫度100℃的條件下製造出100mm×100mm×厚度3mm的板狀成形品,使用物質分析器(Agilent公司製,4291A),在室溫下以1GHz測定介電率及介電損耗角正切。 The resin composition pellet obtained by the above method was produced by using an injection molding machine (IS100F, manufactured by Toshiba Machine Co., Ltd., clamping force 100t) at a cylinder temperature of 290 ° C to 310 ° C and a mold temperature of 100 ° C. A plate-shaped molded article of 100 mm × 100 mm × 3 mm in thickness was used, and a dielectric constant and a dielectric loss tangent were measured at 1 GHz at room temperature using a material analyzer (manufactured by Agilent, 4291 A).

此外,以不含碳黑的聚碳酸酯單獨、及變性聚苯醚單獨的介電特性作為參考例A1、A2,並揭示於表2。 Further, the dielectric properties of the polycarbonate free of carbon black alone and the modified polyphenylene ether were used as reference examples A1 and A2, and are disclosed in Table 2.

(2)外觀 (2) Appearance

使用上述方法所得到的樹脂組成物粒,使用射出成形機(東芝機械股份有限公司製,IS100F,鎖模力100t)在料缸溫度290℃~310℃、金屬模具溫度100℃的條件下製造出100mm×100mm×厚度3mm的板狀成形品。所得到的成形品上所產生的流痕以目視進行外觀評估。目視評估是由滿分5分的分數(5分:極良好、4分:良好、3分:稍微良好、2分;稍微不良、1分:不良)來進行。 The resin composition pellet obtained by the above method was produced under the conditions of a cylinder temperature of 290 ° C to 310 ° C and a mold temperature of 100 ° C using an injection molding machine (IS100F, manufactured by Toshiba Machine Co., Ltd., clamping force 100 t). A plate-shaped molded article of 100 mm × 100 mm × 3 mm in thickness. The flow marks generated on the obtained molded article were visually evaluated for appearance. The visual evaluation was performed by a score of 5 points (5 points: very good, 4 points: good, 3 points: slightly good, 2 points; slightly bad, 1 point: bad).

(3)鍍敷特性 (3) Plating characteristics

使用實施例A4及比較例A4的外觀評估所使用的板狀成形品,利用標準ABS用無電解鍍銅條件進行前處理、化學蝕刻、觸媒添加、活性化及化學鍍敷的步驟,形成厚度2μm的銅被膜,製作出鍍敷被覆體。鍍膜的密著性的評估是藉由JIS-H8504-15(剝離測試)來進行。在前述鍍敷被覆體的鍍膜上,以2mm間隔往縱橫方向在整個被鍍敷體,刻劃出刻痕,形成格子狀棋盤格25個。然後將滿足JIS Z1522規定的Nichiban股份有限公司製玻璃紙膠帶CT-18貼在此格子狀棋盤格上,並且用力剝離。藉由統計殘存於鍍膜表面的前述棋盤格個數,來評估膠帶剝離後的被膜殘存率。 Using the plate-shaped molded article used for the evaluation of the appearance of Example A4 and Comparative Example A4, the steps of pretreatment, chemical etching, catalyst addition, activation, and electroless plating were performed by standard ABS using electroless copper plating conditions to form a thickness. A 2 μm copper film was used to produce a plating coating. The adhesion of the coating was evaluated by JIS-H8504-15 (peeling test). On the plating film of the plating-coated body, the entire object to be plated was scored in the longitudinal and lateral directions at intervals of 2 mm, and scores were scored to form 25 lattice-shaped checkerboards. Then, a cellophane tape CT-18 made of Nichiban Co., Ltd., which satisfies the provisions of JIS Z1522, is attached to the lattice checkerboard and peeled off forcefully. The residual rate of the film after peeling off the tape was evaluated by counting the number of the aforementioned checkerboards remaining on the surface of the coating.

在實施例A4所使用的板狀成形品並未觀察到鍍膜的剝離,且被膜的殘存率為100%。另一方面,比較例A4所使用的成形品的被膜殘存率為0%。另外,比較例A4所使用的成形品,在剝離後的鍍膜上有碳黑附著。比較例A4的樹脂組成物含有DBP吸收量大的(110mL/100g)#7100F,因此觀察到在成形品的表面有碳黑散布。 In the plate-shaped molded article used in Example A4, peeling of the plating film was not observed, and the residual ratio of the film was 100%. On the other hand, the film remaining ratio of the molded article used in Comparative Example A4 was 0%. Further, in the molded article used in Comparative Example A4, carbon black adhered to the plating film after peeling. The resin composition of Comparative Example A4 contained (110 mL/100 g) #7100F having a large DBP absorption amount, and therefore it was observed that carbon black was scattered on the surface of the molded article.

由表可知實施例A1~A10的高介電率用的樹脂成形品,不僅具有優異的介電體特性,而且容易製造,成形品外觀優異。另一方面還可知含有並非本發明所規定的碳黑的比較例A2~A7的成形品的介電體特性不良,尤其介電損耗角正切增加。另外,成形品的外觀不良。此外還可知即使使用了本發明所規定的碳黑,若含量少,則介電率的提升不足。 It is understood from the table that the resin molded article for high dielectric constant of Examples A1 to A10 has excellent dielectric properties and is easy to manufacture, and the molded article is excellent in appearance. On the other hand, it is also known that the molded articles containing Comparative Examples A2 to A7 which are not carbon black specified in the present invention have poor dielectric properties, and in particular, dielectric loss tangent increases. In addition, the appearance of the molded article is poor. Further, it is also known that even if the carbon black specified in the present invention is used, if the content is small, the improvement in dielectric constant is insufficient.

上述第1態樣所關連的樹脂組成物具有優異的介電體的特性,尤其適合作為需要具有高介電率及低介電損耗角正切的天線構件中所使用高介電率材料。另外還具有優異的機械強度,能夠輕易量產,成形品的外觀或鍍敷密著性亦良好。由於碳黑的比重小於陶瓷粉末,因此可達成天線的小型化及輕量化。所以,上述第1態樣所關連的樹脂組成物適合於行動電話等的天線零件用的材料。 The resin composition associated with the first aspect described above has excellent dielectric properties, and is particularly suitable as a high dielectric material used in an antenna member which requires a high dielectric constant and a low dielectric loss tangent. In addition, it has excellent mechanical strength and can be easily mass-produced, and the appearance or plating adhesion of the molded article is also good. Since the specific gravity of carbon black is smaller than that of ceramic powder, it is possible to achieve miniaturization and weight reduction of the antenna. Therefore, the resin composition associated with the first aspect described above is suitable for materials for antenna parts such as mobile phones.

<第2態樣> <Second aspect>

本發明的第2態樣所關連的成形品,係高介電率材料用的樹脂組成物(C)與聚碳酸酯樹脂(D)的雙色成形品,該高介電率材料用的樹脂組成物係含有聚碳酸酯樹脂(a)以及特徵為DBP吸收量低,碘吸附量小的碳黑(b)。 The molded article associated with the second aspect of the present invention is a two-color molded article of a resin composition (C) for a high dielectric constant material and a polycarbonate resin (D), and a resin composition for the high dielectric material. The system contains a polycarbonate resin (a) and a carbon black (b) characterized by a low DBP absorption amount and a small iodine adsorption amount.

(1)聚碳酸酯樹脂 (1) Polycarbonate resin

本發明的成形品中,具有作為高介電率材料用的樹脂 組成物(C)的基材樹脂的聚碳酸酯樹脂(a);以及雙色成形時作為複合對象材料的聚碳酸酯樹脂(D)。任一者皆沒有特別限制而可採用周知的聚碳酸酯樹脂。周知的聚碳酸酯樹脂可列舉熱塑性的芳香族聚碳酸酯樹脂、脂肪族聚碳酸酯樹脂、芳香族-脂肪族聚碳酸酯樹脂,而其中以芳香族聚碳酸酯樹脂為佳。該芳香族聚碳酸酯樹脂,一般是藉由使芳香族二羥基化合物與光氣或碳酸的二酯發生反應所得到。 The molded article of the present invention has a resin as a high dielectric material. The polycarbonate resin (a) of the base resin of the composition (C); and the polycarbonate resin (D) which is a composite target material in the two-color molding. Any of them is not particularly limited and a well-known polycarbonate resin can be used. A well-known polycarbonate resin may, for example, be a thermoplastic aromatic polycarbonate resin, an aliphatic polycarbonate resin or an aromatic-aliphatic polycarbonate resin, and among them, an aromatic polycarbonate resin is preferred. The aromatic polycarbonate resin is generally obtained by reacting an aromatic dihydroxy compound with phosgene or a diester of carbonic acid.

該芳香族二羥基化合物可列舉2,2-雙(4-羥苯基)丙烷(=雙酚A)、四甲基雙酚A、雙(4-羥苯基)-對二異丙基苯、氫醌、間苯二酚、4,4-二羥基聯苯基等,宜為雙酚A。此外為了進一步提高難燃性,可採用在上述芳香族二羥基化合物結合1個以上磺酸四烷基鏻而成的化合物、或具有矽氧烷構造,兩末端含有酚性OH基的聚合物或寡聚物。 The aromatic dihydroxy compound may, for example, be 2,2-bis(4-hydroxyphenyl)propane (=bisphenol A), tetramethylbisphenol A, bis(4-hydroxyphenyl)-p-diisopropylbenzene. Hydroquinone, resorcinol, 4,4-dihydroxybiphenyl, etc., preferably bisphenol A. Further, in order to further improve the flame retardancy, a compound obtained by combining one or more of the above-mentioned aromatic dihydroxy compounds with a tetraalkylphosphonium sulfonate or a polymer having a decyloxy group structure and having a phenolic OH group at both ends may be used. Oligomer.

本發明所使用的芳香族聚碳酸酯樹脂,合適者可列舉由2,2-雙(4-羥苯基)丙烷衍生的聚碳酸酯樹脂、或由2,2-雙(4-羥苯基)丙烷與其他芳香族二羥基化合物衍生的聚碳酸酯共聚物。此外還可併用兩種以上的聚碳酸酯樹脂。 The aromatic polycarbonate resin to be used in the invention may, for example, be a polycarbonate resin derived from 2,2-bis(4-hydroxyphenyl)propane or 2,2-bis(4-hydroxyphenyl). a polycarbonate copolymer derived from propane and other aromatic dihydroxy compounds. Further, two or more kinds of polycarbonate resins may be used in combination.

高介電率材料用的樹脂組成物(C)需要含有20~60質量%的大量碳黑,也需要具有薄片成形性。所以,作為基材樹脂的聚碳酸酯樹脂(a)係以較低黏度的聚碳酸酯樹脂為佳。具體而言,溶劑採用亞甲基氯,由溫度25℃ 下所測得的溶液黏度換算而得的黏度平均分子量適合為15,000~25,000。高介電率材料用的樹脂組成物(C)與複合對象材料的聚碳酸酯樹脂(D),只要具有可發揮出聚碳酸酯樹脂原本的耐衝撃性的分子量,則可無特別限制地使用,上述黏度平均分子量係以20,000~30,000為佳。從機械強度及成形性的觀點看來,宜使用黏度平均分子量在上述範圍的聚碳酸酯。 The resin composition (C) for a high dielectric constant material needs to contain a large amount of carbon black of 20 to 60% by mass, and also needs to have sheet formability. Therefore, the polycarbonate resin (a) as the base resin is preferably a polycarbonate resin having a lower viscosity. Specifically, the solvent is methylene chloride, and the temperature is 25 ° C. The viscosity average molecular weight converted from the measured solution viscosity is preferably 15,000 to 25,000. The resin composition (C) for a high dielectric constant material and the polycarbonate resin (D) of the composite target material can be used without particular limitation as long as it has a molecular weight which exhibits the original impact resistance of the polycarbonate resin. The viscosity average molecular weight is preferably 20,000 to 30,000. From the viewpoint of mechanical strength and formability, it is preferred to use a polycarbonate having a viscosity average molecular weight within the above range.

(2)碳黑(b) (2) carbon black (b)

本發明所使用的碳黑的DBP吸收量為10~50(mL/100g),且碘吸附量為5~40(mg/g)。理想的情況,DBP吸收量為25~35(mL/100g),且碘吸附量為10~30(mg/g)。DBP吸收量在JIS K6217-4:2001中記載了測定方法,是以每100g所吸收的DBP的容積(mL/100g)來表示。另外,碘吸附量在JIS K6217-1:2008記載了測定方法,是以每單位重量的碳黑所吸附的碘量(mg/g)來表示。皆為慣用的碳黑特性指標。 The carbon black used in the present invention has a DBP absorption of 10 to 50 (mL/100 g) and an iodine adsorption amount of 5 to 40 (mg/g). Ideally, the DBP absorption is 25 to 35 (mL/100 g), and the iodine adsorption amount is 10 to 30 (mg/g). The DBP absorption amount is described in JIS K6217-4:2001, and is expressed by the volume (mL/100 g) of DBP absorbed per 100 g. Further, the iodine adsorption amount is described in JIS K6217-1:2008, and is expressed by the amount of iodine (mg/g) adsorbed per unit weight of carbon black. They are all customary carbon black characteristics.

一般而言,碳黑是以粒子彼此熔接而成而被稱為聚集體的狀態存在,概念上可舉葡萄串為例。將此聚集體的發達程度稱為組織,表示組織發達程度的指標是採用DBP吸收量。碘吸附量是測定包括碳黑粒子細孔的總比表面積,而為最具代表性的指標。 In general, carbon black exists in a state in which particles are welded to each other and is called an aggregate. Conceptually, a grape bunch is exemplified. The degree of development of this aggregate is called organization, and the indicator indicating the degree of development of the organization is the amount of DBP absorption. The iodine adsorption amount is the most representative index for determining the total specific surface area including the pores of the carbon black particles.

碘吸附量愈小,碳黑粒子的比表面積愈小,樹脂組成物中的顆粒子彼此接觸的可能性算是愈低。DBP吸收量小 的情況,組織的發達程度低,表示粒子彼此熔接產生的連結不發達。亦即具有這些特徵的碳黑即使大量添加至樹脂中,粒子之間也容易藉由樹脂而絕緣。此外,由於滲濾閾值高,因此可保持絕緣性,認為能夠使樹脂組成物具有高介電率與低介電損耗角正切這些介電特性。 The smaller the amount of iodine adsorption, the smaller the specific surface area of the carbon black particles, and the lower the possibility that the particles in the resin composition contact each other. DBP absorption is small In the case, the degree of development of the organization is low, indicating that the connection between the particles is not developed. That is, even if carbon black having these characteristics is added to the resin in a large amount, the particles are easily insulated by the resin. Further, since the percolation threshold is high, the insulating property can be maintained, and it is considered that the resin composition can have dielectric properties such as a high dielectric constant and a low dielectric loss tangent.

在碳黑的DBP吸收量高於50(mL/100g)的情況或碘吸附量高於40(mg/g)的情況,樹脂組成物中的碳黑粒子彼此接觸,電連結的頻率上昇,介電損耗角正切增加。這同時意指碳黑粒子在樹脂組成物中容易分散不良,因此熔融混練時分散不良,分離的碳黑容易附著在模具附近。其結果,難以安定地製造出顆粒、射出成形品發生流痕等的外觀不良,難以得到外觀優異的成形品。 In the case where the DBP absorption amount of carbon black is higher than 50 (mL/100 g) or the iodine adsorption amount is higher than 40 (mg/g), the carbon black particles in the resin composition are in contact with each other, and the frequency of electrical connection rises. The electrical loss tangent increases. This also means that the carbon black particles are easily dispersed poorly in the resin composition, so that the dispersion is poor during melt kneading, and the separated carbon black tends to adhere to the vicinity of the mold. As a result, it is difficult to stably produce the particles, and the appearance defects such as flow marks appearing in the injection molded article are difficult to obtain, and it is difficult to obtain a molded article excellent in appearance.

組織發達的碳黑容易得到介電率高的樹脂組成物,然而會有聚集體的方向性造成介電率的異方性的問題,或發生滲濾而造成介電損耗角正切增加的問題,特別不適合作為天線構件用。 A well-developed carbon black is easy to obtain a resin composition having a high dielectric constant. However, there is a problem that the directionality of the aggregate causes an anisotropy of the dielectric constant, or a percolation causes a problem that the dielectric loss tangent increases. It is particularly unsuitable for use as an antenna member.

DBP吸收量低於10(mL/100g)的碳黑,在生產碳黑時,碳黑粒子附著於製造裝置的附著性會增加,難以連續操作(日本特開2011-98995)。因此這種碳黑難以穩定地取得。另外,碘吸附量低於5(mg/g)的碳黑在國內外皆沒有販賣,難以穩定地購入。 In the carbon black in which the DBP absorption amount is less than 10 (mL/100 g), when carbon black is produced, the adhesion of the carbon black particles to the manufacturing apparatus increases, and it is difficult to continuously operate (JP-A-2011-98995). Therefore, such carbon black is difficult to obtain stably. In addition, carbon black having an iodine adsorption amount of less than 5 (mg/g) is not sold at home and abroad, and it is difficult to purchase it stably.

本發明所使用的碳黑(b)只要具備特定DBP吸收量與碘吸附量,則種類並無限制,可因應目的適當地選擇。可列舉例如藉由油爐法使原料油不完全燃燒所製造出的油 爐黑,藉由特殊爐法所製造出的科琴黑、以乙炔氣體為原料所製造出的乙炔黑、在密閉空間內使原料直接燃燒所製造出的燈黑、藉由天然氣的熱分解所製造出的熱碳黑、使擴散火焰接觸槽鋼的底面所累積的槽黑等。市售品有爐黑法所得到的「旭#8」或「Asahi thermal」(旭碳股份有限公司)。 The carbon black (b) used in the present invention is not limited as long as it has a specific DBP absorption amount and an iodine adsorption amount, and can be appropriately selected depending on the purpose. For example, an oil produced by incomplete combustion of a feedstock oil by an oil furnace method may be mentioned. Furnace black, acetylene black produced by a special furnace method, acetylene black produced by using acetylene gas as a raw material, lamp black produced by directly burning raw materials in a sealed space, and thermally decomposed by natural gas The hot carbon black is generated, and the diffusion flame is brought into contact with the groove black accumulated on the bottom surface of the channel steel. Commercially available products are "Asahi #8" or "Asahi thermal" (Xu Carbon Co., Ltd.) obtained by the furnace black method.

一個實施形態中,(b)碳黑的氮吸附比表面積(N2SA)係以5~40m2/g為佳,以10~30m2/g為較佳。氮吸附比表面積與碘吸附量同樣地,是表示碳黑的總比表面積,是有用的碳黑特性指標。氮吸附比表面積可依照JIS K6217-2來測定。碳黑的氮吸附比表面積在上述範圍的優點,與碘吸附量同樣地,在介電率、介電損耗角正切等方面為合適的。 In one embodiment, the nitrogen adsorption specific surface area (N 2 SA) of the (b) carbon black is preferably 5 to 40 m 2 /g, more preferably 10 to 30 m 2 /g. Similarly to the iodine adsorption amount, the nitrogen adsorption specific surface area is a total specific surface area of the carbon black, and is a useful carbon black characteristic index. The nitrogen adsorption specific surface area can be measured in accordance with JIS K6217-2. The nitrogen adsorption specific surface area of carbon black is in the above range, and is similar to the iodine adsorption amount in terms of dielectric constant, dielectric loss tangent, and the like.

另外,氮吸附比表面積與碘吸附量的比(N2SA/IA)係以未滿1.3為佳,未滿1.1為較佳。藉由以後述的量添加N2SA/IA在上述範圍的碳黑,可得到具有較優異的介電率、介電損耗角正切的樹脂組成物。這種樹脂組成物可表現出安定的介電性能。 Further, the ratio of the nitrogen adsorption specific surface area to the iodine adsorption amount (N 2 SA/IA) is preferably less than 1.3, and preferably less than 1.1. By adding carbon black having a N 2 SA/IA in the above range in an amount described later, a resin composition having a relatively excellent dielectric constant and dielectric loss tangent can be obtained. This resin composition can exhibit stable dielectric properties.

構成本發明之成形品的高介電率材料用的樹脂組成物(C)係含有聚碳酸酯樹脂(a)40~80質量%及碳黑(b)20~60質量%。理想的情況含有聚碳酸酯樹脂(a)50~60質量%及碳黑(b)40~50質量%。只要是具備上述特定DBP吸收量與碘吸附量的碳黑,則在此範圍內碳黑粒子不會發生滲濾,可得到高介電率且低介電損耗 角正切的樹脂組成物。此外,介電特性或滲濾閾值等的特性理論上會依賴於體積分率。在碳黑(b)含量為20~60質量%的情況,體積分率大致相當於15~55體積%。 The resin composition (C) for a high dielectric constant material constituting the molded article of the present invention contains 40 to 80% by mass of the polycarbonate resin (a) and 20 to 60% by mass of the carbon black (b). The polycarbonate resin (a) is preferably 50 to 60% by mass and carbon black (b) is 40 to 50% by mass. As long as it is carbon black having the above specific DBP absorption amount and iodine adsorption amount, carbon black particles do not percolate in this range, and high dielectric constant and low dielectric loss can be obtained. Tangented resin composition. In addition, characteristics such as dielectric characteristics or percolation thresholds theoretically depend on the volume fraction. When the carbon black (b) content is 20 to 60% by mass, the volume fraction is approximately equivalent to 15 to 55% by volume.

為了提升樹脂組成物在製造及成形步驟中的熔融混練時、或製品使用時在高溫氣體環境下的熱安定性,構成本發明之成形品的高介電率材料用的樹脂組成物(C)中宜摻合熱安定劑。熱安定劑係以受阻酚系化合物、亞磷酸酯系化合物或亞膦酸鹽系化合物及氧化鋅等為佳。 A resin composition for a high dielectric material material constituting the molded article of the present invention (C) for improving the thermal stability of the resin composition during melt-kneading in the production and molding steps or in a high-temperature gas atmosphere when the product is used. Medium heat blending agent should be blended. The thermal stabilizer is preferably a hindered phenol compound, a phosphite compound, a phosphinate compound, or zinc oxide.

在構成本發明之成形品的高介電率材料用的樹脂組成物(C)中還可因應必要進一步添加其他成分。這種添加劑可列舉填充劑、補強材、耐侯性改良劑、發泡劑、潤滑劑、流動性改良劑、耐衝撃性改良劑、染料、顏料、分散劑等。例如填充劑或補強劑可採用有機、無機任一者,而通常宜採用玻璃纖維、雲母(白雲母、黑雲母、金雲母等)、氧化鋁、滑石、鈣矽石、碳酸鈣、二氧化矽等的無機物。這些物質相對於聚碳酸酯樹脂(a)與特定碳黑(b)的合計100質量份,宜摻合1~100質量份,較佳為5~80質量份、更佳為5~60質量份。若摻合這樣的物質,則一般而言可提升剛性、耐熱性、尺寸精密度等。尤其該等之中的白雲母或氧化鋁由於具有降低介電損耗角正切的效果,故為較佳。白雲母或氧化鋁之摻合量係以5~100質量份為佳,以10~50質量份為較佳。 Further, other components may be further added as necessary in the resin composition (C) for a high dielectric material constituting the molded article of the present invention. Examples of such an additive include a filler, a reinforcing material, a weather resistance improver, a foaming agent, a lubricant, a fluidity improver, a wash resistance improver, a dye, a pigment, a dispersant, and the like. For example, fillers or reinforcing agents may be organic or inorganic, and glass fiber, mica (mica, biotite, phlogopite, etc.), alumina, talc, ettringite, calcium carbonate, and cerium oxide are usually used. Inorganic substances. These materials are preferably blended in an amount of from 1 to 100 parts by mass, preferably from 5 to 80 parts by mass, more preferably from 5 to 60 parts by mass, per 100 parts by mass of the total of the polycarbonate resin (a) and the specific carbon black (b). . When such a substance is blended, rigidity, heat resistance, dimensional precision, and the like are generally improved. In particular, muscovite or alumina among these is preferred because it has an effect of lowering the dielectric loss tangent. The blending amount of muscovite or alumina is preferably 5 to 100 parts by mass, more preferably 10 to 50 parts by mass.

在與高介電率材料用的樹脂組成物(C)複合的對象材之聚碳酸酯樹脂(D)中,亦可為了提高衝撃強度而含 有作為耐衝撃性改良劑的彈性體。該彈性體並未受到特別限定,而以多層構造聚合物為佳。多層構造聚合物可列舉例如含有(甲基)丙烯酸烷酯系聚合物的物品。這些多層構造聚合物是藉由例如在前階段的聚合物依序被覆後階段的聚合物,連續進行多階段種子聚合所製造出的聚合物。 基本的聚合物構造,是具有玻璃轉移溫度低的交聯成分的內核層,與由用來改善與組成物母體之間的接著性的高分子化合物所構成的最外核層的聚合物。形成該多層構造聚合物的最內核層的成分,是選擇玻璃轉移溫度為0℃以下的橡膠成分。這種橡膠成分可列舉丁二烯等的橡膠成分、苯乙烯/丁二烯等的橡膠成分、(甲基)丙烯酸烷酯系聚合物之橡膠成分、聚有機矽氧烷系聚合物與(甲基)丙烯酸烷酯系聚合物絡合而成的橡膠成分、或併用該等而成的橡膠成分。此外,形成最外核層的成分可列舉芳香族乙烯基單體或非芳香族系單體或該等的兩種以上的共聚物。芳香族乙烯基單體可列舉苯乙烯、乙烯基甲苯、α-甲基苯乙烯、單氯苯乙烯、二氯苯乙烯、溴苯乙烯等。這些物質之中特別適合使用苯乙烯。非芳香族系單體可列舉(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯等的(甲基)丙烯酸烷酯、丙烯腈、甲基丙烯腈等的氰化乙烯基或氰化亞乙烯等。 In the polycarbonate resin (D) of the target material which is compounded with the resin composition (C) for a high dielectric constant material, it may be contained in order to improve the punching strength. There is an elastomer as a washability improving agent. The elastomer is not particularly limited, and a multilayer structure polymer is preferred. The multilayer structure polymer may, for example, be an article containing a (meth)acrylic acid alkylate polymer. These multilayer structure polymers are polymers produced by continuously performing multistage seed polymerization by, for example, sequentially coating a polymer in a subsequent stage of the polymer. The basic polymer structure is a polymer having an inner core layer having a crosslinking component having a low glass transition temperature and an outermost core layer composed of a polymer compound for improving the adhesion to the matrix of the composition. The component forming the innermost layer of the multilayer structure polymer is a rubber component having a glass transition temperature of 0 ° C or lower. Examples of the rubber component include a rubber component such as butadiene, a rubber component such as styrene/butadiene, a rubber component of an alkyl (meth)acrylate polymer, and a polyorganosiloxane polymer. A rubber component obtained by complexing an alkyl acrylate polymer or a rubber component obtained by using the same. Further, examples of the component forming the outermost core layer include an aromatic vinyl monomer or a non-aromatic monomer or a copolymer of two or more of these. Examples of the aromatic vinyl monomer include styrene, vinyl toluene, α-methylstyrene, monochlorostyrene, dichlorostyrene, and bromostyrene. Among these, styrene is particularly suitable. Examples of the non-aromatic monomer include alkyl (meth)acrylate such as ethyl (meth)acrylate and butyl (meth)acrylate, vinyl cyanide or cyanide such as acrylonitrile or methacrylonitrile. Ethylene and the like.

高介電率材料用的樹脂組成物(C)含有大量碳黑,因此與對象材的收縮率差異會有導致雙色成形品彎曲的情形。為了減少收縮率的差異,亦可在對象材的聚碳酸酯樹 脂(D)中摻合無機填充材。 Since the resin composition (C) for a high dielectric constant material contains a large amount of carbon black, the difference in shrinkage ratio with the target material may cause the two-color molded article to bend. In order to reduce the difference in shrinkage, it can also be used in the polycarbonate material of the target material. The inorganic filler is blended in the fat (D).

構成本發明之成形品的高介電率材料用的樹脂組成物(C)係含有聚碳酸酯樹脂(a)與特定碳黑(b),可經過例如將聚碳酸酯樹脂(a)與特定碳黑(b)熔融混練之步驟來製造。另外還可藉由用以使聚碳酸酯樹脂(a)溶解的溶劑中均勻分散而形成的清漆將溶劑除去之方法得到。 The resin composition (C) for a high dielectric material constituting the molded article of the present invention contains a polycarbonate resin (a) and a specific carbon black (b), and can be, for example, a polycarbonate resin (a) and a specific Carbon black (b) is produced by the steps of melt kneading. Further, it can also be obtained by a method of removing a solvent by a varnish formed by uniformly dispersing a solvent for dissolving the polycarbonate resin (a).

本發明所使用的碳黑(b)的DBP吸收量為10~50(mL/100g),且碘吸附量為5~40(mg/g),然而與超過該數值範圍上限的普通碳黑相比,在熔融樹脂中的分散性較為良好。因此適合於利用擠出機進行熔融混練來製造。碳黑並沒有作為聚碳酸酯樹脂水解觸媒的機能,因此在熔融時,即使在高溫下聚碳酸酯樹脂也不會分解,熱安定性良好。 The carbon black (b) used in the present invention has a DBP absorption of 10 to 50 (mL/100 g) and an iodine adsorption amount of 5 to 40 (mg/g), but with ordinary carbon black exceeding the upper limit of the numerical range. The dispersibility in the molten resin is relatively good. Therefore, it is suitable for manufacture by melt-kneading by an extruder. Since carbon black does not function as a hydrolysis catalyst for a polycarbonate resin, the polycarbonate resin does not decompose even at a high temperature during melting, and the heat stability is good.

熔融混練可藉由例如在聚碳酸酯樹脂(a)中摻合碳黑(b),以及因應必要摻合如上述般的熱安定劑或添加劑,藉由亨舍爾混合機、螺帶式摻合機、V型摻合機等均勻混合之後,以單軸或多軸混練擠出機、輥機、班布里混合機、Labo Plastomill混合機(Brabender混合機)等進行加熱,在熔融狀態下進行混練來進行。此外還可預先將幾個成分混合,或可不進行預先混合,在混練過程中供給,以代替將全部的成分一起混合及混練。 Melt kneading can be carried out by, for example, blending carbon black (b) in a polycarbonate resin (a), and if necessary, blending a heat stabilizer or an additive as described above, by a Henschel mixer, ribbon blending After uniformly mixing the machine, the V-type blender, etc., the uniaxial or multi-axis mixing extruder, the roll machine, the Banbury mixer, the Labo Plastomill mixer (Brabender mixer), etc. are heated, in a molten state. Perform a kneading process. In addition, several components may be mixed in advance, or may be supplied in a kneading process without pre-mixing, instead of mixing and kneading all the components together.

混練溫度與混練時間會依照目標的高介電率材料用的樹脂組成物(C)或混練機的種類等而有所不同,通常混 練溫度為200~350℃,宜為220~320℃,混練時間係以20分鐘以下為佳。若超過350℃或20分鐘,則樹脂材料的熱劣化會成為問題,會有成形品的物性降低或發生外觀不良的情形。以這種方式可得到高介電率材料用的樹脂組成物(C)的顆粒。 The kneading temperature and the kneading time vary depending on the resin composition (C) or the type of the kneading machine for the high dielectric constant material of the target, and are usually mixed. The training temperature is 200~350°C, preferably 220~320°C, and the mixing time is preferably less than 20 minutes. When the temperature exceeds 350 ° C or 20 minutes, thermal deterioration of the resin material may become a problem, and the physical properties of the molded article may be lowered or the appearance may be poor. In this way, particles of the resin composition (C) for a high dielectric material can be obtained.

本發明之成形品可藉由使前述高介電率材料用的樹脂組成物(C)與聚碳酸酯樹脂(D)雙色成形而得到。雙色成形是在由高介電率材料用的樹脂組成物(C)或聚碳酸酯樹脂(D)的其中一者所構成的一次材料的成形品的表層,以另一種材料作為二次材料射出成形來進行。例如使用空腔長度100mm、寬度100mm、厚度1.5mmt的金屬模具,將作為一次材料的高介電率材料用的樹脂組成物(C)射出成形。進一步使用空腔長度100mm、寬度100mm、厚度3mmt的金屬模具,將藉由上述方法所得到的成形體嵌入金屬模具之後,將作為2次材料的聚碳酸酯樹脂(D)射出成形。亦可改成一次材料採用聚碳酸酯樹脂(D),二次材料採用高介電率材料用的樹脂組成物(C)。另外,一次材料可為擠出成形而成的物品、或可為進一步使其熱成形而塑形而成的物品。這些成形品的成形條件只要是不會使樹脂劣化的條件,則不受特別限定。 The molded article of the present invention can be obtained by molding the resin composition (C) for the high dielectric constant material and the polycarbonate resin (D) in two colors. The two-color molding is a surface layer of a molded article of a primary material composed of one of a resin composition (C) or a polycarbonate resin (D) for a high dielectric constant material, and another material is used as a secondary material. Forming is carried out. For example, a resin composition (C) for a high dielectric material as a primary material is injection molded using a metal mold having a cavity length of 100 mm, a width of 100 mm, and a thickness of 1.5 mm. Further, a metal mold having a cavity length of 100 mm, a width of 100 mm, and a thickness of 3 mmt was used, and the molded body obtained by the above method was inserted into a metal mold, and then the polycarbonate resin (D) as a secondary material was injection molded. It is also possible to change the primary material to a polycarbonate resin (D) and the secondary material to a resin composition (C) for a high dielectric material. Further, the primary material may be an article formed by extrusion molding or an article which can be shaped by further thermoforming. The molding conditions of these molded articles are not particularly limited as long as they do not deteriorate the resin.

雙色成形品係含有高介電率材料用的樹脂組成物(C)的層與聚碳酸酯樹脂(D)的層積層體。聚碳酸酯樹脂(D)的層具有發揮耐衝撃性的功用,因此在成形品上宜具有0.1mm以上的層厚度。另外,如果過厚,則會 有夏比衝撃值降低的情形。所以層的厚度宜為0.1~5mm。 The two-color molded article contains a layered layer of a layer of a resin composition (C) for a high dielectric constant material and a polycarbonate resin (D). Since the layer of the polycarbonate resin (D) has a function of exhibiting impact resistance, it is preferable to have a layer thickness of 0.1 mm or more on the molded article. In addition, if it is too thick, it will There is a case where the Charpy is reduced. Therefore, the thickness of the layer should be 0.1 to 5 mm.

本發明之成形品容易製造。射出成形品的外觀也沒有流痕等,而為良好,因此適合於天線零件。天線電路是形成於雙色成形品的高介電率材料用的樹脂組成物(C)側。作為天線用的樹脂材料,只須在天線電路附近的部分具有所要求的介電特性即可,因此即使在高介電率材料用的樹脂組成物(C)層的相反側具有介電率不高的聚碳酸酯樹脂(C)層,對於天線的性能也沒有影響。 The molded article of the present invention is easy to manufacture. The appearance of the injection molded article is not good for flow marks or the like, and is suitable for the antenna component. The antenna circuit is formed on the resin composition (C) side for a high dielectric material of a two-color molded article. The resin material for the antenna only needs to have a desired dielectric property in a portion near the antenna circuit, and therefore has a dielectric constant even on the opposite side of the resin composition (C) layer for a high dielectric material. The high polycarbonate resin (C) layer has no effect on the performance of the antenna.

為了使天線零件小型化,高介電率材料用的樹脂組成物(C)的介電率係以4以上為佳,6以上為較佳,8以上為更佳,9以上為特佳。這是因為若介電率小,則無法使天線零件夠小。從小型化的觀點看來,介電率的上限不受特別限定,然而若介電率過大,則天線尺寸變得過小,因此實用上係以30以下為佳,14以下為較佳,12以下為更佳,11以下為特佳。介電損耗角正切愈小,則由天線發出電波發射效率愈高,電池愈耐久,因此0.05以下為佳,0.03以下為較佳,0.01以下為特佳。 In order to reduce the size of the antenna component, the dielectric composition (C) for a high dielectric constant material has a dielectric constant of 4 or more, preferably 6 or more, more preferably 8 or more, and particularly preferably 9 or more. This is because if the dielectric constant is small, the antenna component cannot be made small enough. From the viewpoint of miniaturization, the upper limit of the dielectric constant is not particularly limited. However, if the dielectric constant is too large, the antenna size is too small. Therefore, it is preferably 30 or less in practical use, and preferably 14 or less, and 12 or less. For better, 11 or less is especially good. The smaller the dielectric loss tangent is, the higher the radio wave emission efficiency is emitted by the antenna, and the longer the battery is, the better the temperature is 0.05 or less, preferably 0.03 or less, and preferably 0.01 or less.

〔實施例B〕 [Example B]

藉由實施例對於上述第2態樣作進一步詳細說明,而本發明並不受該等所限定。此外在以下的實施例之中,各成分採用以下所示的物質。 The second aspect will be further described in detail by way of examples, but the invention is not limited thereto. Further, in the following examples, the following components were used for the respective components.

聚碳酸酯樹脂;三菱工程塑膠股份有限公司製品、 「商品名:S-3000FN、黏度平均分子量22,000」 Polycarbonate resin; products of Mitsubishi Engineering Plastics Co., Ltd. "Product Name: S-3000FN, viscosity average molecular weight 22,000"

碳黑;旭碳股份有限公司製,「商品名:旭#8」、DBP吸收量30(mL/100g)、碘吸附量(AI)12(mg/g)、氮吸附比表面積(N2SA)12(m2/g)、N2SA/AI 1.0 Carbon black; manufactured by Asahi Carbon Co., Ltd., "product name: Asahi #8", DBP absorption amount 30 (mL/100g), iodine adsorption amount (AI) 12 (mg/g), nitrogen adsorption specific surface area (N 2 SA ) 12 (m 2 /g), N 2 SA/AI 1.0

熱安定劑;參(2,4-二第三丁基苯基)亞磷酸酯;Adeka Argus股份有限公司製,「商品名:ADK STAB 2112」 Thermal stabilizer; ginseng (2,4-di-t-butylphenyl) phosphite; Adeka Argus Co., Ltd., "trade name: ADK STAB 2112"

〔高介電率材料用的樹脂組成物(C)的製造〕 [Manufacture of Resin Composition (C) for High Dielectric Materials]

將聚碳酸酯樹脂(S-3000FN)6kg、碳黑(旭#8)4kg及熱安定劑(ADK STAB 2112)3g摻合,並以滾筒攪拌機均勻混合。將其投入雙軸擠出機(日本製鋼所製,「TEX30 α」、螺桿直徑30mm、L/D=63)的上游部分,以料缸溫度265℃、螺桿轉速400rpm進行熔融混練,而製造出高介電率材料用的樹脂組成物(C)的顆粒。在原料供給口並沒有材料架橋等,而為安定,運轉條件和樹脂壓力皆沒有變動而為安定。擠出的樹脂股線可利用通常的水冷槽來造粒,並不需要使用特別的網帶等的設備。使用所得到的顆粒進行以下的評估。 6 kg of polycarbonate resin (S-3000FN), 4 kg of carbon black (Xu #8), and 3 g of thermal stabilizer (ADK STAB 2112) were blended and uniformly mixed by a roller mixer. This was put into the upstream part of a twin-screw extruder ("KK30", manufactured by Nippon Steel Co., Ltd., screw diameter: 30 mm, L/D = 63), and was melt-kneaded at a cylinder temperature of 265 ° C and a screw rotation speed of 400 rpm to produce a mixture. A pellet of a resin composition (C) for a high dielectric constant material. There is no material bridge or the like at the raw material supply port, and it is stable, and the operating conditions and the resin pressure are not changed and are stable. The extruded resin strands can be granulated by a usual water-cooling tank, and it is not necessary to use a special mesh belt or the like. The following evaluation was carried out using the obtained pellets.

(1)介電特性 (1) Dielectric properties

將高介電率材料用的樹脂組成物(C)的顆粒投入射出成形機(東芝機械股份有限公司製,IS100F,鎖模力 100t),以料缸溫度290℃~310℃、金屬模具溫度100℃的條件製造出100mm×100mm×厚度3mm的板狀成形品。使用物質分析器(Agilent公司製,4291A),在室溫下以1GHz測定介電率及介電損耗角正切。介電率為9.4、介電損耗角正切為0.0081。 The pellet of the resin composition (C) for a high dielectric material is put into an injection molding machine (made by Toshiba Machine Co., Ltd., IS100F, clamping force) 100 t) A plate-shaped molded article of 100 mm × 100 mm × 3 mm in thickness was produced under the conditions of a cylinder temperature of 290 ° C to 310 ° C and a mold temperature of 100 ° C. The dielectric constant and the dielectric loss tangent were measured at 1 GHz at room temperature using a substance analyzer (manufactured by Agilent, 4291A). The dielectric constant was 9.4 and the dielectric loss tangent was 0.0081.

(2)外觀 (2) Appearance

將高介電率材料用的樹脂組成物(C)的顆粒投入射出成形機(東芝機械股份有限公司製,IS100F,鎖模力100t),以料缸溫度290℃~310℃、金屬模具溫度100℃的條件製造出100mm×100mm×厚度3mm的板狀成形品。對於所得到的成形品上所產生的流痕以目視進行外觀評估。評估是以5分滿分(5分:極良好、4分:良好、3分:稍微良好、2分:稍微不良,1分:不良)來進行,為5分。 The pellet of the resin composition (C) for a high dielectric constant material was placed in an injection molding machine (IS100F, manufactured by Toshiba Machine Co., Ltd., clamping force 100 t), and the cylinder temperature was 290 ° C to 310 ° C, and the mold temperature was 100. A plate-shaped molded article of 100 mm × 100 mm × 3 mm in thickness was produced under the conditions of °C. The appearance of the flow marks generated on the obtained molded article was visually evaluated. The evaluation is based on 5 points (5 points: very good, 4 points: good, 3 points: slightly good, 2 points: slightly bad, 1 point: bad), which is 5 points.

實施例B1~B4及比較例B1 Examples B1 to B4 and Comparative Example B1

一次材料採用聚碳酸酯樹脂(S3000-FN),以射出成形製造出厚度1mmt、1.5mmt及2mmt的方形板(100×100mm)。使用相同的聚碳酸酯樹脂,藉由擠出成形製造出厚度1mmt的薄片,並切割成100×100mm的大小。這4種厚度的一次材料嵌入空腔長度100mm、寬度100mm、厚度3mmt的金屬模具。二次材料採用上述高介電率材料用的樹脂組成物(C),藉由射出成形得到厚度3mmt的 雙色成形品(實施例B1~B4)。另外,在相同金屬模具並未嵌入一次材料,將高介電率材料用的樹脂組成物(C)射出成形而得到厚度3mmt的成形品(比較例B1)。對於各成形品進行下述落球衝撃測試評估。 A primary material was polycarbonate resin (S3000-FN), and a square plate (100 × 100 mm) having a thickness of 1 mmt, 1.5 mmt, and 2 mmt was produced by injection molding. Using the same polycarbonate resin, a sheet having a thickness of 1 mmt was produced by extrusion molding and cut into a size of 100 × 100 mm. These four thickness primary materials were embedded in a metal mold having a cavity length of 100 mm, a width of 100 mm, and a thickness of 3 mmt. The secondary material is a resin composition (C) for the above high dielectric material, and is formed by injection molding to have a thickness of 3 mmt. Two-color molded article (Examples B1 to B4). In addition, a resin material (C) for a high dielectric constant material was injection-molded in the same metal mold, and a molded article having a thickness of 3 mm was obtained (Comparative Example B1). The following ball drop test evaluations were performed for each molded article.

(3)落球衝撃測試 (3) Falling ball test

以JIS K7211為基準來進行測試。以雙色成形品的高介電率材料用的樹脂組成物(C)側的表面作為鐵球衝撞的表面來實施測試,使用階梯法的計算,計算出50%衝撃破壞能量E50,評估雙色成形品的衝撃特性。將結果揭示於表3。 The test was conducted based on JIS K7211. The surface of the resin composition (C) side for the high dielectric material of the two-color molded article was tested as the surface of the iron ball collision, and the calculation of the step method was used to calculate the 50% crushing energy E50, and the two-color molded article was evaluated. The characteristics of the rush. The results are disclosed in Table 3.

由此表可知實施例B1~B4之高介電率材料用的樹脂成形品,不僅介電體的特性優異,而且容易製造,成形品的外觀優異、耐衝撃性優異。另一方面,並未雙色成形的比較例B1的介電特性優異,然而衝撃特性非常低,在行動電話機器等的用途方面,不能算是具有充足的特性。 From the above, it is understood that the resin molded article for a high dielectric constant material of Examples B1 to B4 is excellent in not only the characteristics of the dielectric material but also easy to manufacture, and the molded article is excellent in appearance and excellent in punching resistance. On the other hand, Comparative Example B1 which was not formed by two-color molding was excellent in dielectric properties, but the punching property was extremely low, and it was not sufficient in terms of use of a mobile phone device or the like.

上述第2態樣所關連的成形品具有優異的介電體特性,尤其適合作為需要高介電率及低介電損耗角正切的天線構件所使用的高介電率材料。另外,由於能夠與衝撃特性優異的聚碳酸酯雙色成形而製成成形品,因此在單一高 介電率材料用的樹脂組成物之中會成為問題的衝撃特性得以改善。 The molded article associated with the second aspect described above has excellent dielectric properties, and is particularly suitable as a high dielectric material for use in an antenna member requiring high dielectric constant and low dielectric loss tangent. In addition, since it can be molded into a molded product by two-color molding of polycarbonate having excellent punching characteristics, it is high in single height. Among the resin compositions for dielectric materials, the impact characteristics which are problematic are improved.

<第3態樣> <3rd aspect>

本發明的第3態樣所關連的著色用母料含有具有特定物性的(E)碳黑及(F)樹脂材料。(E)碳黑的特徵為DBP吸收量低。 The masterbatch for coloring associated with the third aspect of the present invention contains (E) carbon black and (F) resin material having specific physical properties. (E) Carbon black is characterized by a low DBP absorption.

(E)碳黑 (E) carbon black

本發明所使用的碳黑的DBP吸收量為10~50(mL/100g),理想的情況DBP吸收量為25~35(mL/100g)。DBP吸收量在JIS K6217-4:2001記載了測定方法,是以每100g吸收的DBP(鄰苯二甲酸二丁酯)的容積(mL/100g)來表示,而為慣用的碳黑特性指標。 The DBP absorption amount of the carbon black used in the present invention is 10 to 50 (mL/100 g), and ideally, the DBP absorption amount is 25 to 35 (mL/100 g). The DBP absorption amount is described in JIS K6217-4:2001. The measurement method is expressed by the volume (mL/100 g) of DBP (dibutyl phthalate) absorbed per 100 g, and is a conventional carbon black characteristic index.

一般而言,碳黑是以粒子彼此熔接且被稱為聚集體的狀態存在,概念上可舉葡萄串為例。將此聚集體的發達程度稱為組織,表示組織發達程度的指標是採用DBP吸收量。在碳黑的DBP吸收量高於50(mL/100g)的情況,難以使碳黑粒子以高濃度分散。另外,DBP吸收量低於10(mL/100g)的碳黑,在生產碳黑時,碳黑粒子附著在製造裝置的附著性增加,而難以連續操作(日本特開2011-98995)。 In general, carbon black exists in a state in which particles are welded to each other and is called an aggregate, and a grape bunch is conceptually exemplified. The degree of development of this aggregate is called organization, and the indicator indicating the degree of development of the organization is the amount of DBP absorption. In the case where the DBP absorption amount of carbon black is higher than 50 (mL/100 g), it is difficult to disperse the carbon black particles at a high concentration. In addition, in the carbon black having a DBP absorption amount of less than 10 (mL/100 g), when carbon black is produced, the adhesion of the carbon black particles to the manufacturing apparatus increases, and it is difficult to continuously operate (JP-A-2011-98995).

本發明所使用的(E)碳黑只要具備特定DBP吸收 量,則種類並無限制,可因應目的適當地選擇。可列舉例如藉由油爐法使原料油不完全燃燒所製造出的油爐黑,藉由特殊爐法所製造出的科琴黑、以乙炔氣體為原料所製造出的乙炔黑、在密閉空間內使原料直接燃燒所製造出的燈黑、藉由天然氣的熱分解所製造出的熱碳黑、使擴散火焰接觸槽鋼的底面所累積的槽黑等。市售品有爐黑法所得到的「旭#8」或「Asahi thermal」(旭碳股份有限公司)。 (E) carbon black used in the present invention as long as it has specific DBP absorption The quantity is not limited and can be appropriately selected according to the purpose. For example, the oil furnace black produced by incomplete combustion of the feedstock oil by the oil furnace method, the acetylene black produced by the special furnace method, and the acetylene black produced by using acetylene gas as a raw material can be used in a sealed space. The lamp black produced by direct combustion of the raw material, the hot carbon black produced by thermal decomposition of natural gas, and the groove black accumulated by the diffusion flame contacting the bottom surface of the channel steel. Commercially available products are "Asahi #8" or "Asahi thermal" (Xu Carbon Co., Ltd.) obtained by the furnace black method.

碳黑的形狀另一個指標已知還有碘吸附量。其測定方法如JIS K6217-1:2008所記載,以每單位重量吸附的碘量(mg/g)來表示。碘吸附量最具代表性的指標,是以包括碳黑粒子細孔的總比表面積來表示,與DBP吸收量會有某程度的相關性。本發明所使用的(E)碳黑的碘吸附量為10~30(mg/g)為佳。 Another indicator of the shape of carbon black is known to have an amount of iodine adsorption. The measurement method is expressed by the amount of iodine (mg/g) adsorbed per unit weight as described in JIS K6217-1:2008. The most representative index of iodine adsorption is expressed by the total specific surface area including the pores of carbon black particles, and has a certain degree of correlation with the amount of DBP absorption. The (E) carbon black used in the present invention preferably has an iodine adsorption amount of 10 to 30 (mg/g).

通常為了對樹脂組成物賦予導電性所廣泛使用的碳黑,是以DBP吸收量或碘吸附量大者為適合,相對於此,本發明所使用的碳黑,特徵點是將DBP吸收量限定在低的範圍。 In general, carbon black which is widely used for imparting conductivity to a resin composition is suitable for a DBP absorption amount or an iodine adsorption amount. In contrast, the carbon black used in the present invention is characterized in that DBP absorption amount is limited. In the low range.

另外,碳黑的表面pH會稍微呈現鹼性或呈現中性至酸性,而在(F)樹脂材料採用聚碳酸酯或聚酯的情形,這些樹脂會有因為鹼而水解的傾向。因此,(E)碳黑宜為中性至酸性,表面pH宜為3~8。 Further, the surface pH of the carbon black may be slightly alkaline or neutral to acidic, and in the case where the (F) resin material is polycarbonate or polyester, these resins tend to be hydrolyzed by a base. Therefore, (E) carbon black should be neutral to acidic, and the surface pH should be 3-8.

(F)樹脂材料 (F) resin material

本發明之樹脂材料希望為熱塑性樹脂。可列舉例如低 密度聚乙烯、超低密度聚乙烯、超超低密度聚乙烯、高密度聚乙烯、低分子量聚乙烯、超高分子量聚乙烯、乙烯-丙烯共聚物、聚丙烯等的聚烯烴系樹脂、或聚苯乙烯、耐衝撃性聚苯乙烯、丙烯腈/苯乙烯共聚物(AS樹脂)、丙烯腈/丁二烯/苯乙烯共聚物(ABS樹脂)等的苯乙烯系樹脂、聚苯醚樹脂與聚苯乙烯系樹脂的合金、聚苯醚樹脂與聚醯胺系樹脂的合金、聚苯醚樹脂與聚烯烴系樹脂的合金等的變性聚苯醚樹脂、聚碳酸酯樹脂等。其他還可列舉聚對苯二甲酸丁二酯樹脂、聚對苯二甲酸乙二酯樹脂等所代表的聚酯樹脂、聚醯胺6、聚醯胺66、聚醯胺MXD6等所代表的聚醯胺樹脂、聚縮醛樹脂等的工程塑膠或含有該等的合金。另外還可依照希望使用液晶高分子、聚苯硫醚樹脂、聚醯亞胺樹脂這些高耐熱性的超級工程塑膠或含有該等的合金。 The resin material of the present invention is desirably a thermoplastic resin. Can be listed, for example, low Density polyethylene, ultra low density polyethylene, ultra ultra low density polyethylene, high density polyethylene, low molecular weight polyethylene, ultra high molecular weight polyethylene, ethylene-propylene copolymer, polyolefin resin such as polypropylene, or poly Styrene resin, polyphenylene ether resin and polystyrene such as styrene, impact-resistant polystyrene, acrylonitrile/styrene copolymer (AS resin), acrylonitrile/butadiene/styrene copolymer (ABS resin) An alloy of a styrene resin, an alloy of a polyphenylene ether resin and a polyamide resin, a denatured polyphenylene ether resin such as an alloy of a polyphenylene ether resin and a polyolefin resin, or a polycarbonate resin. Other examples include a polyester resin represented by a polybutylene terephthalate resin or a polyethylene terephthalate resin, a polyamide represented by polyamine 6, a polyamine 66, and a polyamide MXD6. An engineering plastic such as a guanamine resin or a polyacetal resin or an alloy containing the same. Further, it is also possible to use a super-engineered plastic having high heat resistance such as a liquid crystal polymer, a polyphenylene sulfide resin or a polyimide resin, or an alloy containing the same.

通常作為母料用的基材樹脂的樹脂材料如後述般,只採用如聚苯乙烯、AS樹脂般的樹脂。另一方面,在本發明之著色用母料中,藉由組合特定的(E)碳黑,能夠實質上無限制地使用樹脂材料。上述中,合適者為聚碳酸酯樹脂、聚苯乙烯系樹脂、聚醯胺系樹脂、聚酯系樹脂、聚縮醛系樹脂。從可添加較高濃度的碳黑的觀點看來,以聚碳酸酯樹脂為特佳。 As the resin material of the base resin for the master batch, as described later, only a resin such as polystyrene or AS resin is used. On the other hand, in the masterbatch for coloring of the present invention, the resin material can be used substantially without limitation by combining specific (E) carbon black. Among the above, a polycarbonate resin, a polystyrene resin, a polyamide resin, a polyester resin, or a polyacetal resin is suitable. From the viewpoint of adding a higher concentration of carbon black, polycarbonate resin is particularly preferred.

碳黑的凝集性高,聚集體彼此容易藉由凡德瓦力(Van Der Waals Force)或藉由單純的集合、附著、絡合等而形成2次凝集體(黏聚物,agglomerate)。在摻合至 樹脂的情況也會維持凝集構造,因此認為這是成形品產生「顆粒」的原因。含有高濃度(E)碳黑的母料,其黏度與作為基材的(F)樹脂材料相比更大幅上昇,因此難以實施破壞該凝集構造的強力混練,(F)樹脂材料一直以來是採用聚苯乙烯、AS樹脂、寡聚物體等的低黏度材料。然而在利用這種母料將工程塑膠著色的情況,由於(F)樹脂材料的黏度低,或與被著色樹脂相異種類,因此混合後會有降低樹脂組成物機械物性等的情形。所以,(F)樹脂材料希望與被著色樹脂相同種類而且具有相同程度的分子量。 Carbon black has high agglutination, and aggregates are easily formed into two secondary aggregates (agglomerate) by Van Der Waals Force or by simple assembly, adhesion, complexation, and the like. In blending to In the case of the resin, the agglomerated structure is also maintained, and this is considered to be the cause of the "particles" in the molded article. The masterbatch containing a high concentration of (E) carbon black has a higher viscosity than the (F) resin material as a substrate, so that it is difficult to carry out strong kneading to destroy the agglomerated structure, and (F) resin material has been used for a long time. A low-viscosity material such as polystyrene, AS resin, or oligomer. However, in the case where the engineering plastic is colored by the master batch, since the viscosity of the (F) resin material is low or different from that of the colored resin, the mechanical properties of the resin composition may be lowered after mixing. Therefore, the (F) resin material is desirably of the same kind as the colored resin and has the same molecular weight.

另外,本發明所使用的(F)樹脂材料的熔融黏度不受特別限定。宜為100~2000Pa.s(280℃、100/sec)。 Further, the melt viscosity of the (F) resin material used in the present invention is not particularly limited. Should be 100~2000Pa. s (280 ° C, 100 / sec).

在本發明之著色用母料之中,(E)碳黑與(F)樹脂材料的含有比例並無特別限制,而通常(E)碳黑佔10~90質量%,(F)樹脂材料佔10~90質量%。著色用碳母料需要能夠含有高濃度的碳黑,而且碳黑粒子需要以不發生凝集而呈分散的狀態存在。 In the masterbatch for coloring of the present invention, the content ratio of (E) carbon black to (F) resin material is not particularly limited, and usually (E) carbon black accounts for 10 to 90% by mass, and (F) resin material accounts for 10~90% by mass. The carbonaceous masterbatch for coloring needs to be able to contain a high concentration of carbon black, and the carbon black particles need to be dispersed in a state where they do not aggregate.

依據JIS K6217-4:2008,碳黑的最小構成單元為微粒子熔接而成的1次凝集體(聚集體)。每個聚集體的微粒子個數愈多,代表組織愈發達。聚集體具有分枝的複雜構造,因此具有空隙部分,其容積在組織愈發達的碳黑中會愈大。DBP油會被聚集體中所存在的空隙吸收,因此碳黑的DBP吸收量是為了填滿聚集體的空隙所必要的DBP量。所以說明了DBP吸收量是評估碳黑的組織發達程度 的方法。亦即,在混合至碳黑的DBP油在DBP吸收量以下的情況,所添加的DBP油會全部吸收在空隙,因此變得乾硬而無法匯集。亦即粒子彼此凝集,分散狀態不良。 另外,所添加的DBP油在DBP吸收量以上的情況,DBP油會填滿空隙,過剩的DBP油存在於聚集體間,因此可成為良好的分散狀態。即使在分散於樹脂中的情況也可同樣地考慮,愈低DBP吸收量的碳黑,分散狀態愈良好,而且能夠大量添加。愈高濃度的母料,愈能夠降低母料中所含有的(F)樹脂材料的比例,不會對被著色樹脂所具有的特性造成影響,故為適合。 According to JIS K6217-4:2008, the smallest constituent unit of carbon black is a primary aggregate (aggregate) in which fine particles are welded. The more the number of particles per aggregate, the more developed the tissue. Aggregates have a complex structure of branches and therefore have a void portion whose volume is greater in the carbon black in which the tissue is more developed. The DBP oil is absorbed by the voids present in the aggregate, so the DBP absorption of the carbon black is the amount of DBP necessary to fill the voids of the aggregate. Therefore, the DBP absorption is an assessment of the degree of tissue development of carbon black. Methods. That is, in the case where the DBP oil mixed to the carbon black is less than the DBP absorption amount, the added DBP oil is absorbed in the voids, and thus becomes dry and hard to be collected. That is, the particles are agglomerated with each other, and the dispersed state is poor. Further, when the DBP oil to be added is equal to or higher than the DBP absorption amount, the DBP oil fills the voids, and the excess DBP oil exists between the aggregates, so that it can be in a good dispersed state. Even in the case of being dispersed in the resin, it is considered that the carbon black having a lower DBP absorption amount has a better dispersion state and can be added in a large amount. The higher the concentration of the master batch, the more the ratio of the (F) resin material contained in the master batch can be reduced, and it does not affect the properties of the colored resin, so it is suitable.

本發明之著色用母料所使用的特定DBP吸收量的(E)碳黑能夠以高濃度摻合至樹脂。因此,本發明之著色用母料中的(E)碳黑的含有比例係以40~90質量%為佳,60~90質量%為較佳。此情況下,著色用母料中的(F)樹脂材料的含有比例係以10~60質量%為佳,10~40質量%為較佳。 The (E) carbon black of a specific DBP absorption amount used for the coloring master batch of the present invention can be blended to the resin at a high concentration. Therefore, the content ratio of the (E) carbon black in the masterbatch for coloring of the present invention is preferably 40 to 90% by mass, and preferably 60 to 90% by mass. In this case, the content ratio of the (F) resin material in the coloring master batch is preferably 10 to 60% by mass, and preferably 10 to 40% by mass.

為了提升在樹脂組成物之製造及成形步驟的熔融混練時、或製品使用時在高溫環境下的熱安定性,本發明之著色用母料中亦可摻合熱安定劑。熱安定劑係以受阻酚系化合物、亞磷酸酯系化合物或亞膦酸鹽系化合物及氧化鋅等為佳。 In order to enhance the thermal stability in the high-temperature environment during the production and molding steps of the resin composition or in the high-temperature environment, the thermal masterbatch of the coloring masterbatch of the present invention may be blended. The thermal stabilizer is preferably a hindered phenol compound, a phosphite compound, a phosphinate compound, or zinc oxide.

另外還可因應必要摻合樹脂組成物中所添加的周知紫外線吸收劑、其他染顏料、抗靜電劑、阻燃劑、離形劑或衝撃改良用彈性體等。 Further, a known ultraviolet absorber, other dyes, an antistatic agent, a flame retardant, a release agent, or an elastomer for improving the press, which are added to the resin composition, may be blended as necessary.

本發明之著色用母料含有特定(E)碳黑與(F)樹脂材料,可經過例如將特定(E)碳黑與(F)樹脂材料熔融混練之步驟而製造。 The masterbatch for coloring of the present invention contains a specific (E) carbon black and (F) resin material, and can be produced, for example, by a step of melt-kneading a specific (E) carbon black and (F) resin material.

本申請案所使用的(E)碳黑的DBP吸收量為10~50(mL/100g),與超過此數值範圍上限的普通碳黑相比、在熔融樹脂中的分散性較良好。因此適合於利用擠出機進行熔融混練來製造。 The DBP absorption amount of the (E) carbon black used in the present application is 10 to 50 (mL/100 g), and the dispersibility in the molten resin is better than that of the ordinary carbon black exceeding the upper limit of the numerical range. Therefore, it is suitable for manufacture by melt-kneading by an extruder.

熔融混練可藉由例如摻合(E)碳黑、(F)樹脂材料,進一步因應必要摻合如上述般的熱安定劑或添加劑,藉由亨舍爾混合機、螺帶式摻合機、V型摻合機等均勻混合之後,以單軸或多軸混練擠出機、輥機、班布里混合機、Labo Plastomill混合機(Brabender混合機)、加壓型捏合機等進行加熱,在熔融狀態下混練來進行。此外還可預先將幾個成分混合、或可不預先混合,而在混練過程中供給,以代替將全部的成分一起混合及混練。 Melt kneading can be carried out by, for example, blending (E) carbon black, (F) resin material, further blending the heat stabilizer or additive as described above, by Henschel mixer, ribbon blender, After uniformly mixing the V-type blender, etc., heating is performed by a uniaxial or multiaxial mixing extruder, a roll mill, a Banbury mixer, a Labo Plastomill mixer (Brabender mixer), a pressurizing kneader, and the like. The mixing is carried out in a molten state. In addition, several components may be mixed in advance or may be supplied in a kneading process without mixing in advance, instead of mixing and kneading all the components together.

關於混練溫度與混練時間,通常混練溫度為200~350℃,宜為220~320℃、混練時間係以20分鐘以下為佳。若超過350℃或20分鐘,則樹脂材料的熱劣化會成為問題,會有成形品的物性降低或發生外觀不良的情形。 Regarding the mixing temperature and the mixing time, the mixing temperature is usually 200 to 350 ° C, preferably 220 to 320 ° C, and the mixing time is preferably 20 minutes or less. When the temperature exceeds 350 ° C or 20 minutes, thermal deterioration of the resin material may become a problem, and the physical properties of the molded article may be lowered or the appearance may be poor.

所得到的顆粒狀母料可直接與被著色樹脂熔融混練而製造出著色的成形材料,或可依照被著色樹脂的性狀藉由粉碎機等使其粗粒子化之後使用。利用班布里混合機或加壓捏合機所得到的塊狀母料,亦可依照被著色樹脂的性狀,藉由粉碎機等粗粒子化而成為合適的顆粒徑之後使 用。 The obtained particulate master batch can be directly melted and kneaded with the colored resin to produce a colored molding material, or can be used by coarsely pulverizing it according to the properties of the colored resin by a pulverizer or the like. The bulk masterbatch obtained by the Banbury mixer or the pressure kneader can be made into a suitable particle diameter by coarse particle formation by a pulverizer or the like according to the properties of the resin to be colored. use.

使用上述母料來著色,作為著色對象的被著色樹脂可採用與作為母料基材樹脂的上述(F)樹脂材料所說明的樹脂同樣的樹脂。如上述般,被著色樹脂係以與母料中的樹脂材料相同為佳。 The coloring resin to be colored is used as the coloring resin to be colored, and the same resin as the resin described in the above (F) resin material as the masterbatch base resin can be used. As described above, the colored resin is preferably the same as the resin material in the master batch.

依據本發明的一個實施形態,可提供含有上述著色用母料與被著色樹脂的成形材料。使用此成形材料,可製造出與用途相應的成形品。 According to an embodiment of the present invention, a molding material containing the above-mentioned coloring master batch and a colored resin can be provided. By using this molding material, a molded article corresponding to the use can be produced.

〔實施例C〕 [Example C]

藉由實施例對上述第3態樣進一步詳細地說明,而本發明並不受該等所限定。此外在以下的實施例、比較例之中,各成分採用以下所示的物品。 The above third aspect will be described in further detail by way of examples, but the invention is not limited thereto. Further, in the following examples and comparative examples, the following items were used for the respective components.

(E)碳黑 (E) carbon black

(e1)旭碳股份有限公司製,「商品名:旭#8」、DBP吸收量30(mL/100g)、PH=7.5、碘吸附量12(mg/g) (e1) manufactured by Asahi Carbon Co., Ltd., "product name: Asahi #8", DBP absorption amount 30 (mL/100g), pH = 7.5, iodine adsorption amount 12 (mg/g)

(e2)三菱化學股份有限公司製,「商品名:MA600」、DBP吸收量115(mL/100g)、PH=7、碘吸附量40(mg/g) (e2) manufactured by Mitsubishi Chemical Corporation, "product name: MA600", DBP absorption amount 115 (mL/100g), pH=7, iodine adsorption amount 40 (mg/g)

(F)樹脂材料 (F) resin material

(f1)聚碳酸酯樹脂 (f1) polycarbonate resin

三菱工程塑膠股份有限公司製品、「商品名:H-4000FN」 Mitsubishi Engineering Plastics Co., Ltd., "Product Name: H-4000FN"

黏度平均分子量16000、熔融黏度250Pa.s(280℃,100/sec) Viscosity average molecular weight 16000, melt viscosity 250Pa. s (280 ° C, 100 / sec)

(f2)聚碳酸酯樹脂 (f2) polycarbonate resin

三菱工程塑膠股份有限公司製品、「商品名:S-3000FN」 Mitsubishi Engineering Plastics Co., Ltd., "Product Name: S-3000FN"

黏度平均分子量22000、熔融黏度850Pa.s(280℃,100/sec) Viscosity average molecular weight 22000, melt viscosity 850Pa. s (280 ° C, 100 / sec)

(f3)芳香族聚醯胺樹脂 (f3) Aromatic polyamide resin

三菱工程塑膠股份有限公司製品、「商品名:RENY 6001」、黏度平均分子量17000、熔融黏度100Pa.s(280℃,100/sec) Mitsubishi Engineering Plastics Co., Ltd. product, "trade name: RENY 6001", viscosity average molecular weight 17000, melt viscosity 100Pa. s (280 ° C, 100 / sec)

(G)熱安定劑 (G) heat stabilizer

(g1)亞磷酸酯系抗氧化劑;Adeka Argus股份有限公司製,「商品名:ADK STAB 2112」 (g1) phosphite antioxidant; manufactured by Adeka Argus Co., Ltd., "Product name: ADK STAB 2112"

(g2)受阻酚系抗氧化劑;BASF Japan股份有限公司,「商品名:IRGANOX 1098」 (g2) hindered phenolic antioxidant; BASF Japan, Inc., "Product Name: IRGANOX 1098"

(H)被著色樹脂 (H) colored resin

(h1)聚碳酸酯樹脂 (h1) polycarbonate resin

三菱工程塑膠股份有限公司製品,「商品名:S-3000FN」,黏度平均分子量22000 Mitsubishi Engineering Plastics Co., Ltd. product, "trade name: S-3000FN", viscosity average molecular weight 22000

(h2)玻璃纖維強化芳香族聚醯胺樹脂 (h2) glass fiber reinforced aromatic polyamide resin

三菱工程塑膠股份有限公司製品,「商品名:RENY 1002H」,(在RENY 6001中摻合玻璃纖維30%而成) Mitsubishi Engineering Plastics Co., Ltd., "Product Name: RENY 1002H", (30% blended with glass fiber in RENY 6001)

實施例C1~C7及比較例C1~C3 Examples C1 to C7 and Comparative Examples C1 to C3

以表4所示的比例摻合碳黑、聚碳酸酯樹脂、聚醯胺樹脂及熱安定劑,藉由滾筒攪拌機均勻混合。將其投入雙軸擠出機(日本製鋼所製,「TEX30 α」、螺桿直徑30mm、L/D=63)的最上游部分,藉由熔融混練,製造出著色用母料。擠出混練條件如以下所述。 Carbon black, a polycarbonate resin, a polyamide resin, and a heat stabilizer were blended in a ratio shown in Table 4, and uniformly mixed by a roller mixer. This was put into the most upstream portion of a twin-screw extruder ("KK30", manufactured by Nippon Steel Co., Ltd., screw diameter: 30 mm, L/D = 63), and a masterbatch for coloring was produced by melt kneading. The extrusion kneading conditions are as follows.

(實施例C1~C6):料缸溫度265℃、螺桿轉速400rpm、吐出量20Kg/h。 (Examples C1 to C6): the cylinder temperature was 265 ° C, the screw rotation speed was 400 rpm, and the discharge amount was 20 kg/h.

(實施例C7):料缸溫度270℃、螺桿轉速300rpm、吐出量20Kg/h。 (Example C7): The cylinder temperature was 270 ° C, the screw rotation speed was 300 rpm, and the discharge amount was 20 kg/h.

(比較例C2):由於吐出不安定,因此變更為料缸溫度260℃、螺桿轉速300rpm、吐出量2Kg/h來進行製造。 (Comparative Example C2): Since the discharge was unstable, it was changed to a cylinder temperature of 260 ° C, a screw rotation speed of 300 rpm, and a discharge amount of 2 kg/h.

(比較例C1、C3):碳由真空排氣孔噴出,因此製造無法母料。 (Comparative Examples C1 and C3): Since carbon was ejected from the vacuum vent hole, the production of the master batch was impossible.

著色用母料的評估是藉由擠出混練時的製造難易度來進行。 The evaluation of the masterbatch for coloring is carried out by the ease of manufacture at the time of extrusion kneading.

(1)母料製造難易度 (1) Masterbatch manufacturing difficulty

將(E)碳黑及(F)樹脂材料混合,以雙軸擠出機熔融混練時,由擠出機的狀況,依據下述規則評估母料的製 造難易度。將結果揭示於表4。 When (E) carbon black and (F) resin materials are mixed and melt-kneaded in a twin-screw extruder, the master batch is evaluated according to the following conditions according to the conditions of the extruder. Create difficulty. The results are disclosed in Table 4.

(容易)馬達電流為一定值,吐出量也沒有變動,股線也沒有斷裂。在真空排氣孔有若干揮發物,然而吐出口的殘垢幾乎沒有發生,股線也沒有斷裂。幾乎沒有必要保養,而為能夠安定製造的狀態。 (Easy) The motor current is constant, the discharge amount does not change, and the strands are not broken. There were some volatiles in the vacuum vent, but the residue at the spout was hardly produced and the strands were not broken. There is almost no need for maintenance, but a state of stability.

(困難)吐出不安定,股線頻繁斷裂,難以連續製造的狀況。或殘垢大量蓄積在吐出口,必須頻繁保養的狀況。斷續地製造、或吐出量降低,只能少量製造的狀態。 (Difficulty) The situation that the spit is not stable, the strands are frequently broken, and it is difficult to manufacture continuously. In the case where a large amount of residual dirt is accumulated in the spout, it must be maintained frequently. It is manufactured intermittently, or the amount of discharge is reduced, and it can be manufactured in a small amount.

(無法製造)(E)碳黑與(F)樹脂材料無法在擠出機內部熔融混練,碳黑由真空排氣孔噴出。少量或無法製造的狀態。 (Cannot be manufactured) (E) Carbon black and (F) resin materials cannot be melted and kneaded in the extruder, and carbon black is ejected from the vacuum vent holes. A small or unmanufacturable state.

實施例C1~C7:(容易)擠出特性良好,能夠以20Kg/h吐出而安定地製造出母料。 Examples C1 to C7: (Easy) The extrusion characteristics were good, and the master batch was stably produced by discharging at 20 kg/h.

比較例C2:(困難)在吐出20Kg/h的情況,碳黑與樹脂的混練不安定,樹脂股線頻繁斷裂。因此,將吐出量降低至2Kg/h來製造母料。 Comparative Example C2: (Difficult) When 20 Kg/h was discharged, the mixing of carbon black and the resin was unstable, and the resin strands were frequently broken. Therefore, the amount of the discharge was reduced to 2 kg/h to produce a master batch.

比較例C1、C3;(無法製造)碳由擠出機的真空排氣孔噴出。即使調整擠出條件,也無法連續使股線吐出。 Comparative Examples C1, C3; (Unable to manufacture) Carbon was ejected from the vacuum vent of the extruder. Even if the extrusion conditions are adjusted, the strands cannot be continuously discharged.

實施例C8~C14及比較例C4 Examples C8 to C14 and Comparative Example C4

將實施例C1~C7所得到的母料M1~M7及比較例C2所得到的M8與被著色樹脂以擠出機熔融混練,使碳黑摻合量成為1.0質量%,而製造出成形材料。使用雙軸擠出機(日本製鋼所製,「TEX30 α」、螺桿直徑30mm、L/D=63)在料缸溫度265℃、螺桿轉速400rpm、吐出量20Kg/h的條件下以著色粒的形式得到成形材料。將所得到的著色粒射出成形,並且進行(2)成形品外觀的評估。將結果揭示於表5。另外,對於被著色樹脂為聚碳酸酯S-3000FN的實施例C8~C13及比較例C4進行(3)利用夏比衝撃強度的耐衝撃性評估。將結果揭示於表5。 The masterbatch M1 to M7 obtained in the examples C1 to C7 and the M8 obtained in the comparative example C2 were melt-kneaded with the colored resin in an extruder to form a molding material by blending the carbon black in an amount of 1.0% by mass. Using a twin-screw extruder ("TEX30 α" manufactured by Nippon Steel Co., Ltd., screw diameter 30 mm, L/D = 63), colored pellets were used at a cylinder temperature of 265 ° C, a screw rotation speed of 400 rpm, and a discharge amount of 20 kg/h. The form gives the shaped material. The obtained colored particles were injection molded, and (2) evaluation of the appearance of the molded article was performed. The results are disclosed in Table 5. Further, in Examples C8 to C13 and Comparative Example C4 in which the colored resin was polycarbonate S-3000FN, (3) evaluation of the punching resistance by Charpy impact strength was performed. The results are disclosed in Table 5.

(2)成形品外觀 (2) Appearance of molded article

使著色粒在100℃乾燥4小時。然後使用射出成形機(東芝機械股份有限公司製,IS100F、鎖模力100t)在料缸溫度290℃~310℃、金屬模具溫度100℃的條件下製造出100mm×100mm×厚度3mm的板狀成形品。對於所得到 的成形品產生的「顆粒」以目視進行外觀評估。 The colored particles were dried at 100 ° C for 4 hours. Then, using a injection molding machine (made by Toshiba Machine Co., Ltd., IS100F, clamping force 100t), a plate shape of 100 mm × 100 mm × thickness 3 mm was produced under the conditions of a cylinder temperature of 290 ° C to 310 ° C and a mold temperature of 100 ° C. Product. For what is obtained The "particles" produced by the molded articles were visually evaluated for appearance.

外觀評估是對成形品的表面斜向照光,針對碳黑凝集粒子的顯眼程度作判定。目視評估是滿分為以5分的分數(5分;極良好、4分:良好、3分:稍微良好、2分:稍微不良,1分:不良)來進行。 The appearance evaluation is to obliquely illuminate the surface of the molded article, and to judge the degree of conspicuousness of the carbon black aggregated particles. The visual evaluation is performed with a score of 5 points (5 points; very good, 4 points: good, 3 points: slightly good, 2 points: slightly bad, 1 point: bad).

(3)耐衝撃性(夏比衝撃強度) (3) Punching resistance (Charpy impact strength)

依據ISO179-1及179-2來進行。使上述方法所得到的著色粒在100℃乾燥4小時。然後使用射出成形機(東芝機械股份有限公司製,IS100F、鎖模力100t)在料缸溫度290℃~310℃、金屬模具溫度100℃的條件下使10mm×80mm×厚度4mm的測試片成形。對測試片加工而形成刻口,在23℃的溫度下測定夏比衝撃強度(kJ/m2)。 According to ISO179-1 and 179-2. The colored particles obtained by the above method were dried at 100 ° C for 4 hours. Then, a test piece of 10 mm × 80 mm × 4 mm in thickness was molded under the conditions of a cylinder temperature of 290 ° C to 310 ° C and a mold temperature of 100 ° C using an injection molding machine (IS100F, mold clamping force 100 t, manufactured by Toshiba Machine Co., Ltd.). The test piece was processed to form a notch, and the Charpy impact strength (kJ/m 2 ) was measured at a temperature of 23 °C.

(成形品外觀) (formation appearance)

實施例C8~C14:觀察成形品的表面狀態的結果,並未觀察到顆粒。 Examples C8 to C14: As a result of observing the surface state of the molded article, no particles were observed.

比較例C4:在成形品的表面觀察到許多的顆粒(凝集的碳黑粒子)。 Comparative Example C4: Many particles (aggregated carbon black particles) were observed on the surface of the molded article.

(衝撃強度) (rushing strength)

夏比衝撃強度測試後的成形品之中,存在有延性破壞(測試後的樣品並未分離,是在一部分連結的狀況下被破壞)的情形,以及脆性破壞(測試後的樣品完全斷裂而被破壞)的情形。實施例C8~C10、C13之中,測試的5根全部為延性破壞,而實施例C11~C12、比較例C4之中, 測試的5根之中有1根為脆性破壞。 Among the molded articles after Charpy's strength test, there was ductile damage (the sample after the test was not separated, and it was destroyed in a part of the connected state), and the brittle fracture (the sample after the test was completely broken and was Destruction). Among the examples C8 to C10 and C13, all of the five tested were ductile failure, and among the examples C11 to C12 and the comparative example C4, One of the five tested was fragile destruction.

上述第3態樣所關連的著色用母料容易量產,可大量摻合碳黑。而且在混合此著色用母料與被著色樹脂所得到的成形材料之中,碳黑可均勻地分散。所以,由這種成形材料所得到的成形品不易發生「顆粒」等的外觀不良。進一步將上述著色用母料混合至被著色樹脂所得到的成形品,其衝撃強度亦良好。 The masterbatch for coloring which is related to the third aspect described above is easily mass-produced, and carbon black can be blended in a large amount. Further, among the molding materials obtained by mixing the masterbatch for coloring and the resin to be colored, the carbon black can be uniformly dispersed. Therefore, the molded article obtained from such a molding material is less likely to cause appearance defects such as "particles". Further, the molded article obtained by mixing the above-mentioned coloring master batch to the colored resin has a good punching strength.

Claims (18)

一種高介電率材料用之樹脂組成物,其係含有(A)樹脂材料40~80質量%及(B)碳黑20~60質量%之高介電率材料用之樹脂組成物,並且前述(B)碳黑的DBP吸收量為10~50(mL/100g)且碘吸附量為5~40(mg/g),前述高介電率材料用之樹脂組成物的介電率為4以上,介電損耗角正切為0.05以下。 A resin composition for a high dielectric constant material, which is a resin composition for a high dielectric material containing (A) a resin material of 40 to 80% by mass and (B) a carbon black of 20 to 60% by mass, and the foregoing (B) The DBP absorption of carbon black is 10 to 50 (mL/100 g) and the iodine adsorption amount is 5 to 40 (mg/g), and the dielectric composition of the high dielectric constant material has a dielectric constant of 4 or more. The dielectric loss tangent is 0.05 or less. 如申請專利範圍第1項之高介電率材料用之樹脂組成物,其中含有前述(A)樹脂材料50~60質量%及前述(B)碳黑40~50質量%,前述(B)碳黑的DBP吸收量為25~35(mL/100g)且碘吸附量為10~30(mg/g)。 The resin composition for a high dielectric material according to the first aspect of the invention, which comprises the above (A) resin material in an amount of 50 to 60% by mass and the (B) carbon black in an amount of 40 to 50% by mass, the (B) carbon The black DBP absorption is 25 to 35 (mL/100 g) and the iodine adsorption amount is 10 to 30 (mg/g). 如申請專利範圍第1項之高介電率材料用之樹脂組成物,其中前述(B)碳黑的氮吸附比表面積為5~40m2/g。 The resin composition for a high dielectric material according to the first aspect of the invention, wherein the (B) carbon black has a nitrogen adsorption specific surface area of 5 to 40 m 2 /g. 如申請專利範圍第1項之高介電率材料用之樹脂組成物,其中前述(B)碳黑的氮吸附比表面積與碘吸附量的比未滿1.3。 The resin composition for a high dielectric material according to the first aspect of the invention, wherein the ratio of the nitrogen adsorption specific surface area of the (B) carbon black to the iodine adsorption amount is less than 1.3. 如申請專利範圍第1項之高介電率材料用之樹脂組成物,其中前述(A)樹脂材料為聚碳酸酯樹脂、變性聚苯醚樹脂、聚苯硫醚樹脂或聚碳酸酯/ABS合金。 A resin composition for a high dielectric material according to the first aspect of the invention, wherein the (A) resin material is a polycarbonate resin, a denatured polyphenylene ether resin, a polyphenylene sulfide resin or a polycarbonate/ABS alloy. . 如申請專利範圍第5項之高介電率材料用之樹脂組成物,其中前述(A)樹脂材料為聚碳酸酯樹脂。 A resin composition for a high dielectric material according to claim 5, wherein the (A) resin material is a polycarbonate resin. 一種成形品,其係含有如申請專利範圍第1~6項 中任一項之高介電率材料用之樹脂組成物。 A molded article containing items 1 to 6 as claimed in the patent application A resin composition for a high dielectric material according to any one of them. 一種成形品,其係使如申請專利範圍第6項之高介電率材料用之樹脂組成物(C)及聚碳酸酯樹脂(D)雙色成形所得到者。 A molded article obtained by two-color molding of a resin composition (C) and a polycarbonate resin (D) for a high dielectric material according to claim 6 of the patent application. 如申請專利範圍第8項之成形品,其中前述成形品係由前述高介電率材料用之樹脂組成物(C)層及前述聚碳酸酯樹脂(D)層所構成者,該聚碳酸酯樹脂(D)層的厚度為0.1mm~5mm。 The molded article of the eighth aspect of the invention, wherein the molded article is composed of the resin composition (C) layer for the high dielectric constant material and the polycarbonate resin (D) layer, the polycarbonate The thickness of the resin (D) layer is from 0.1 mm to 5 mm. 如申請專利範圍第8或9項之成形品,其中前述高介電率材料用之樹脂組成物(C)及/或前述聚碳酸酯樹脂(D)含有無機填充材。 The molded article according to claim 8 or 9, wherein the resin composition (C) for the high dielectric constant material and/or the polycarbonate resin (D) contains an inorganic filler. 一種著色用母料,其係含有(E)碳黑及(F)樹脂材料之著色用母料,並且前述(E)碳黑的DBP吸收量為10~50(mL/100g),前述(E)碳黑的碘吸附量為10~30(mg/g)。 A masterbatch for coloring, which comprises a masterbatch for coloring of (E) carbon black and (F) a resin material, and the DBP absorption amount of the (E) carbon black is 10 to 50 (mL/100 g), the aforementioned (E) The carbon black has an iodine adsorption amount of 10 to 30 (mg/g). 如申請專利範圍第11項之著色用母料,其中前述DBP吸收量為25~35(mL/100g)。 For example, in the coloring masterbatch of claim 11, wherein the aforementioned DBP absorption amount is 25 to 35 (mL/100 g). 如申請專利範圍第11項之著色用母料,其中前述(E)碳黑的含有比例為10~90質量%,前述(F)樹脂材料的含有比例為10~90質量%。 The masterbatch for coloring according to the eleventh aspect of the invention, wherein the content of the (E) carbon black is from 10 to 90% by mass, and the content of the (F) resin material is from 10 to 90% by mass. 如申請專利範圍第13項之著色用母料,其中前述(E)碳黑的含有比例為40~90質量%,前述(F)樹脂材料的含有比例為10~60質量%。 The masterbatch for coloring according to Item 13 of the patent application, wherein the content of the (E) carbon black is 40 to 90% by mass, and the content of the (F) resin material is 10 to 60% by mass. 如申請專利範圍第11項之著色用母料,其中前 述(F)樹脂材料係選自聚碳酸酯樹脂、聚苯乙烯系樹脂、聚醯胺系樹脂、聚酯系樹脂、聚縮醛系樹脂所構成之群中之1種以上。 For example, the masterbatch for coloring in the 11th article of the patent application, the former The resin material (F) is one or more selected from the group consisting of a polycarbonate resin, a polystyrene resin, a polyamine resin, a polyester resin, and a polyacetal resin. 如申請專利範圍第15項之著色用母料,其中前述樹脂材料為聚碳酸酯樹脂。 The masterbatch for coloring according to item 15 of the patent application, wherein the resin material is a polycarbonate resin. 如申請專利範圍第11項之著色用母料,其中進一步含有熱安定劑。 For example, the coloring masterbatch of claim 11 further contains a heat stabilizer. 一種成形材料,其係含有如申請專利範圍第11~17項中任一項之著色用母料與被著色樹脂。 A molding material comprising the coloring masterbatch and the colored resin according to any one of claims 11 to 17.
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