TW201428060A - 可硬化性聚矽氧組合物、其硬化製品及光半導體裝置 - Google Patents

可硬化性聚矽氧組合物、其硬化製品及光半導體裝置 Download PDF

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Publication number
TW201428060A
TW201428060A TW102148881A TW102148881A TW201428060A TW 201428060 A TW201428060 A TW 201428060A TW 102148881 A TW102148881 A TW 102148881A TW 102148881 A TW102148881 A TW 102148881A TW 201428060 A TW201428060 A TW 201428060A
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Taiwan
Prior art keywords
group
carbons
composition
mass
examples
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TW102148881A
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English (en)
Chinese (zh)
Inventor
飯村智浩
西島一裕
須藤通孝
古川晴彥
森田好次
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道康寧東麗股份有限公司
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Publication of TW201428060A publication Critical patent/TW201428060A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Silicon Polymers (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
TW102148881A 2012-12-28 2013-12-27 可硬化性聚矽氧組合物、其硬化製品及光半導體裝置 TW201428060A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012288120A JP6059010B2 (ja) 2012-12-28 2012-12-28 硬化性シリコーン組成物、その硬化物、および光半導体装置

Publications (1)

Publication Number Publication Date
TW201428060A true TW201428060A (zh) 2014-07-16

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ID=49998635

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102148881A TW201428060A (zh) 2012-12-28 2013-12-27 可硬化性聚矽氧組合物、其硬化製品及光半導體裝置

Country Status (5)

Country Link
US (1) US20150344636A1 (https=)
JP (1) JP6059010B2 (https=)
KR (1) KR20150100930A (https=)
TW (1) TW201428060A (https=)
WO (1) WO2014104390A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106831849A (zh) * 2017-01-24 2017-06-13 广东信翼科技有限公司 一种含烯丙基聚硅氧烷的制备方法
TWI729134B (zh) * 2016-05-30 2021-06-01 日商日產化學工業股份有限公司 聚合物矽烷化合物

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5985981B2 (ja) 2012-12-28 2016-09-06 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
US10899891B2 (en) * 2016-05-30 2021-01-26 Nissan Chemical Corporation Reactive polysiloxane and polymerizable composition comprising same
CN112135861A (zh) 2018-05-17 2020-12-25 赢创运营有限公司 Aba结构类型的线性聚二甲基硅氧烷-聚氧化烯嵌段共聚物
EP3611217B1 (de) * 2018-08-15 2024-07-24 Evonik Operations GmbH Lineare polydimethylsiloxan-polyoxyalkylen-blockcopolymere des strukturtyps aba
EP3794060A1 (de) 2018-05-17 2021-03-24 Evonik Operations GmbH Lineare polydimethylsiloxan-polyoxyalkylen-blockcopolymere des strukturtyps aba
EP3611216A1 (de) * 2018-08-15 2020-02-19 Evonik Operations GmbH Lineare polydimethylsiloxan-polyoxyalkylen-blockcopolymere des strukturtyps aba
EP3611215A1 (de) 2018-08-15 2020-02-19 Evonik Operations GmbH Verfahren zur herstellung acetoxygruppen-tragender siloxane
EP3611214A1 (de) 2018-08-15 2020-02-19 Evonik Operations GmbH Sioc-verknüpfte, lineare polydimethylsiloxan-polyoxyalkylen-blockcopolymere
JP7220686B2 (ja) * 2020-05-15 2023-02-10 信越化学工業株式会社 有機ケイ素化合物
DE102020118247A1 (de) 2020-07-10 2022-01-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Precursor zur Herstellung eines Polysiloxans, Polysiloxan, Polysiloxanharz, Verfahren zur Herstellung eines Polysiloxans, Verfahren zur Herstellung eines Polysiloxanharzes und optoelektronisches Bauelement

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101152869B1 (ko) * 2010-01-25 2012-06-12 주식회사 엘지화학 경화성 조성물
JP5170471B2 (ja) * 2010-09-02 2013-03-27 信越化学工業株式会社 低ガス透過性シリコーン樹脂組成物及び光半導体装置
JP2012097225A (ja) * 2010-11-04 2012-05-24 Daicel Corp 硬化性樹脂組成物及び硬化物
JP2012111875A (ja) * 2010-11-25 2012-06-14 Daicel Corp 硬化性樹脂組成物及び硬化物
JP5652387B2 (ja) * 2011-12-22 2015-01-14 信越化学工業株式会社 高信頼性硬化性シリコーン樹脂組成物及びそれを使用した光半導体装置
KR101560042B1 (ko) * 2012-07-27 2015-10-15 주식회사 엘지화학 경화성 조성물

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI729134B (zh) * 2016-05-30 2021-06-01 日商日產化學工業股份有限公司 聚合物矽烷化合物
CN106831849A (zh) * 2017-01-24 2017-06-13 广东信翼科技有限公司 一种含烯丙基聚硅氧烷的制备方法

Also Published As

Publication number Publication date
KR20150100930A (ko) 2015-09-02
US20150344636A1 (en) 2015-12-03
WO2014104390A2 (en) 2014-07-03
WO2014104390A3 (en) 2014-08-21
JP2014129477A (ja) 2014-07-10
JP6059010B2 (ja) 2017-01-11

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