TW201427775A - Electronic component rinsing device and operational equipment applying the same - Google Patents

Abstract

An electronic component rinsing device configured with a steering mechanism, a loading mechanism and a spraying mechanism in a rinsing tank. The steering mechanism has at least a base and is disposed with a first driving source capable of driving the base to reverse and change directions. The loading mechanism is disposed with at least a loading platform for loading electronic components. The loading platform is also configured on the base of the steering mechanism. In addition, the loading platform is connected to a second driving source driven to rotate. The spraying mechanism is located below the loading mechanism and disposed with at least a sprayer capable of spraying fluid to spray fluid over the electronic components on the loading platform. Accordingly, during rising operation, the steering mechanism can be utilized to drive the loading platform reversing to show a non-upward direction so that the spraying mechanism could spray rinsing fluid over the electronic components on the loading platform. Not only can centrifugal force generated by self-rotation of the loading platform outwardly fling fluid and impurities attached on the electronic components, but also can the placing angle of the loading platform be used to allow fluid and impurities dropping to achieve practical benefits of improving rising efficiency and reducing operation time.

Description

Electronic component cleaning device and application equipment thereof

The invention provides a mounting table for placing an electronic component in a non-upward direction, so that when the spraying mechanism sprays the cleaning fluid on the electronic component, the fluid and the impurities can be directly dropped downward, thereby improving the cleaning performance. And an electronic component cleaning device that reduces the operating time.

In today's electronic components (such as wafers), impurities, dirt, etc. are attached to the surface of electronic components during the manufacturing process, which affects the cleanliness and quality of electronic components. To avoid affecting the yield and quality of electronic components, The cleaning device cleans the impurities attached to the surface of the electronic component. For example, in the case of a wafer, it is necessary to carry out a plurality of processes, which may cause impurities, particles or compounds to adhere to the surface of the wafer. Therefore, the wafer is processed in different processes. Before and after the cleaning surface must be performed, for example, after cutting the entire wafer into a plurality of wafers, or before the wafer enters the hot furnace tube for diffusion or oxidation, the wafer needs to be cleaned by a cleaning device to remove the crystal. The surface of the wafer, such as impurities, particles or compounds, is dehumidified and dried to make the surface of the wafer highly clean to improve the quality of wafer fabrication.

Please refer to FIG. 1 , which is a wafer cleaning device, which is provided with a cleaning tank 12 with an opening 121 on the machine table 11 , and a discharge pipe 13 is arranged on the bottom surface of the cleaning tank 12 for discharging and cleaning. The fluid, a mounting mechanism 14 fixed to the machine table 11, is provided with a rotating shaft 142 driven by a motor 141. One end of the rotating shaft 142 extends through the cleaning tank 12 and is assembled to be mounted. The mounting table 143 of the cleaning wafer 15 and a nozzle 16 above the carrying mechanism 14 are used for spraying a cleaning fluid (such as ionized water or gas). When the cleaning of the wafer 15 is performed, the crystal to be cleaned can be used. Round 15 placed on the mounting table 143, the mounting table 143 is vacuum-adsorbed to the wafer 15 to be cleaned, and the motor 141 of the carrier mechanism 14 drives the rotating shaft 142 to rotate, so that the rotating shaft 142 drives the mounting table 143 and the wafer 15 to be cleaned to rotate synchronously. The nozzle 16 sprays the cleaning fluid on the wafer 15 to be cleaned on the mounting table 143 to clean the impurities, particles or compounds attached to the surface of the wafer 15, and then cleans the surface of the wafer 15 by the centrifugal force of the rotation of the mounting table 143. The fluid and the impurities are discharged outward, and the cleaning fluid is discharged through the discharge pipe 13; however, since the mounting table 143 carrying the wafer 15 to be cleaned is oriented upward, the cleaning fluid sprayed by the nozzle 16 is easily retained in the wafer to be cleaned. In the 15th, the cleaning device only uses the centrifugal force of the rotation of the mounting table 143 to extract the fluid and impurities adhering to the wafer 15, the spin-drying efficiency is limited, and the working time is increased. Moreover, the mounting table 143 drives the wafer 15 to rotate. At this time, the cleaning fluid that has been rotated from the wafer 15 hits the inner wall surface of the cleaning tank 12 and is splashed back onto the surface of the wafer 15, so that the wafer 15 cannot be quickly dried and dried, which is not only poor in drying efficiency. Also increased Adding drying time, resulting in a lack of production efficiency.

An object of the present invention is to provide an electronic component cleaning device which is provided with a steering mechanism, a bearing mechanism and a spraying mechanism in a cleaning tank. The steering mechanism has at least one base and is provided with a drive base to reverse the direction of rotation. The first driving source is provided with at least one mounting platform for receiving electronic components, the mounting platform is mounted on the base of the steering mechanism, and the mounting platform is coupled with a second driving source for driving rotation. The spraying mechanism is located below the carrying mechanism, and is provided with at least one sprayable fluid sprayer for spraying fluid on the electronic components on the mounting table; thereby, the steering mechanism can be used to drive the mounting table to be turned over during the cleaning operation. In the non-upward direction, the spraying mechanism sprays the cleaning fluid on the electronic components on the mounting table, and not only can the centrifugal force of the rotating body of the table be used to pull out the fluid and impurities attached to the electronic components, and the pendulum of the mounting platform can be utilized. Set the angle so that the fluid and impurities fall directly downwards, which improves the cleaning performance and Reduce the practical benefits of working hours.

An object of the present invention is to provide an electronic component cleaning device, which is provided with a steering mechanism, a bearing mechanism and a spraying mechanism in a cleaning tank, wherein the first driving source of the steering mechanism drives the mounting platform for mounting electronic components to be inverted. In the upward direction, when the mounting unit drives the electronic component to rotate, the cleaning fluid that is rotated from the electronic component hits the inner wall surface of the cleaning tank, and does not splash back to the surface of the electronic component, but falls directly to the cleaning. The inner surface of the groove enables the electronic component to quickly spin dry the surface to reduce the drying time and achieve the practical benefit of improving the drying performance.

The third object of the present invention is to provide an electronic component cleaning device, which is provided with a steering mechanism, a bearing mechanism and a spraying mechanism in the cleaning tank. When the first driving source of the steering mechanism drives the mounting platform for mounting the electronic component, the mounting platform is reversed. In the upper direction, some of the dust impurities attached to the electronic components can be directly dropped downward to reduce impurities on the electronic components, thereby reducing the cleaning operation time and achieving the practical benefit of improving the cleaning performance.

A fourth object of the present invention is to provide a working device for applying an electronic component cleaning device, comprising a machine table, at least one loading device, a working device, a cleaning device, a material moving device, and an automation operation for controlling the integration of each device operation. a central control device mounted on the machine table for accommodating electronic components, the working device being mounted on the machine table for performing preset operations on the electronic components, the loading device being assembled The machine is used for transferring electronic components. The cleaning device is provided with a steering mechanism, a supporting mechanism and a spraying mechanism in the cleaning tank for cleaning the electronic components, thereby achieving the practical benefit of improving the cleaning performance and reducing the working time.

[study]

11‧‧‧ machine

12‧‧‧cleaning tank

121‧‧‧ openings

13‧‧‧Drainage tube

14‧‧‧Loading mechanism

141‧‧ ‧motor

142‧‧‧Rotary axis

143‧‧‧Holding table

15‧‧‧ wafer

16‧‧‧ nozzle

〔this invention〕

20‧‧‧cleaning device

21‧‧‧cleaning tank

211‧‧‧Drainage

22‧‧‧ steering mechanism

221‧‧‧Support frame

222‧‧‧ motor

223‧‧‧ bearing housing

224‧‧‧Rotary axis

225‧‧‧Base

23‧‧‧Loading mechanism

231‧‧‧Motor

232‧‧‧ Pulley set

233‧‧‧ shaft

234‧‧‧Holding table

235‧‧‧Adsorbed parts

236‧‧‧ buckle

24‧‧‧Spray mechanism

241‧‧‧First sprinkler

242‧‧‧Second sprinkler

30‧‧‧ Wafer

40‧‧‧ machine

50‧‧‧Working device

60‧‧‧First loading device

70‧‧‧Second loading device

80‧‧‧Transfer device

Figure 1: Schematic diagram of a conventional wafer cleaning device.

Fig. 2 is a schematic view of the electronic component cleaning apparatus of the present invention.

Fig. 3 is a schematic view showing the use of the electronic component cleaning device of the present invention (1).

Fig. 4 is a schematic view showing the use of the electronic component cleaning device of the present invention (2).

Fig. 5 is a schematic view showing the use of the electronic component cleaning device of the present invention (3).

Figure 6 is a schematic view showing the use of the electronic component cleaning device of the present invention (4).

Figure 7 is a schematic view showing the use of the electronic component cleaning device of the present invention (4).

Fig. 8 is a schematic view showing the application of the electronic component cleaning device of the present invention to a working device.

In order to make the present invention further understand the present invention, a preferred embodiment will be described in conjunction with the drawings, which will be described in detail later. Referring to FIG. 2, the electronic component cleaning device 20 of the present invention includes a cleaning tank 21 and a steering mechanism. 22, the carrying mechanism 23 and the spraying mechanism 24, the cleaning tank 21 is a container with an internal accommodating space, and at least one discharge port is provided on the side plate or the bottom plate for discharging the fluid for cleaning, in this embodiment The cleaning tank 21 is an open-ended hollow container, and is provided with a discharge port 211 for discharging the cleaning fluid; the steering mechanism 22 has at least one base and is provided with a driveable base flipping conversion In the embodiment, the first driving source is external to the cleaning tank 21, and the supporting frame 221 is provided with a motor 222. The motor 222 drives at least one base located inside the cleaning tank 21 with a transmission structure. Rotating, in the embodiment, the transmission structure is disposed on the inner side of the cleaning tank 21, and the bearing shaft 223 is provided with a rotating shaft 224, and the rotating shaft 224 is provided with at least one base 225, and the rotating shaft 224 is further disposed. One end link horse 222, the motor 222 can drive the base 225 to rotate via the rotating shaft 224; the supporting mechanism 23 is provided with at least one mounting platform for receiving electronic components, and the mounting platform is mounted on the base 225 of the steering mechanism 22, In the cleaning operation, the base 225 of the steering mechanism 22 drives the reversal in a non-upward direction, and the mounting table is coupled to a second driving source that drives the rotation. In this embodiment, the second driving source is coupled to the steering. The bottom of the base 225 of the mechanism 22 is provided with a motor 231. The motor 231 is coupled to drive the rotating shaft 233 of the extending base 225 by a transmission group of the pulley set 232. One end of the rotating shaft 233 is equipped with a mounting base 234. The positioning platform 234 is provided with a positioning structure for positioning the electronic components to be cleaned. Further, the positioning structure can be provided with an adsorption member on the mounting base 234, and the electronic components to be cleaned can be positioned by vacuum adsorption, or on the mounting platform. The 234 is provided with a clamping member for clamping and positioning the electronic component to be cleaned. In this embodiment, the positioning structure is disposed on the mounting base 234 and is provided with an adsorption member 235 for vacuumly adsorbing the electronic component to be cleaned. Positioning, and a plurality of clips for the clips 236 are disposed on the peripheral side of the top surface for clamping the positioning of the electronic components to be cleaned; the spray mechanism 24 is located below the support mechanism 23 and is provided with at least one a fluid sprayer for spraying fluid on the electronic components on the mounting table 234. In this embodiment, the first sprinkler 241 is disposed inside the cleaning tank 21 and below the load-bearing mechanism 23. Two sprayers 242 The first sprinkler 241 sprays a cleaning fluid (such as ionized water) on the electronic components to be cleaned on the mounting table 234 for cleaning the electronic components, and the second sprinkler 242 sprays the electronic components to be cleaned on the mounting table 234. A fluid (such as a gas for drying) to dry electronic components.

Referring to FIG. 3, the cleaning device 20 is applied to the cleaning wafer 30. Since the mounting table 234 of the carrying mechanism 23 is oriented upward, the loading device (not shown) places the wafer 30 to be cleaned. The 234 is placed on the absorbing member 235 of the mounting table 234. The 234 is vacuum-adsorbed to the wafer 30 to be cleaned by the absorbing member 235, and the wafer 30 to be cleaned is clipped by a plurality of fasteners 236; After the wafer 30 to be cleaned is positioned on the mounting table 234, the steering mechanism 22 rotates the rotating shaft 224 by the motor 222, and the rotating shaft 224 drives the base 225 and the mounting table 234 to be reversed to actuate the crystal to be cleaned. The mounting table 234 of the circle 30 is turned downward, so that the wafer 30 to be cleaned faces the spraying mechanism 24, and the wafer 30 to be cleaned is directed downward, and can be attached to the wafer. Part of the dust impurities on the 30 drops into the cleaning tank 21 by gravity to reduce the impurities on the wafer 30 to be cleaned; referring to FIG. 5, the motor 231 of the carrier mechanism 23 drives the rotating shaft 233 via the pulley set 232. Rotating, the rotating shaft 233 drives the mounting table 234 and the wafer 30 to be cleaned to rotate synchronously. The spraying mechanism 24 sprays the cleaning fluid on the rotating wafer 30 to be cleaned by the first sprayer 241 to clean and attach to the wafer 30. Impurities, particles or compounds on the surface, and the wafer 30 uses a centrifugal force to rotate the fluid and impurities outward. Since the wafer 30 to be cleaned faces downward, when a portion of the cleaning fluid is struck by the cleaning fluid When the inner wall surface of the tank 21 is cleaned, it does not splash back onto the wafer 30, but flows directly downward into the inner bottom surface of the cleaning tank 21, and is discharged from the discharge port 211 of the cleaning tank 21; see Fig. 6, After the wafer 30 is cleaned, the first sprinkler 241 of the spray mechanism 24 stops spraying the cleaning fluid, and sprays the drying fluid on the wafer 30 with the second sprinkler 242 for drying the wafer 30, due to the carrier mechanism 23 The rotating shaft 233 still drives the mounting table 234 and the crystal The circle 30 rotates, and the centrifugal cleaning force can continuously pull out the cleaning fluid on the surface, thereby rapidly drying the cleaning fluid on the wafer 30, thereby shortening the drying operation time and achieving the practical benefit of improving the drying efficiency; After the wafer 30 is dried, the motor 222 of the steering mechanism 22 drives the susceptor 225 and the mounting table 234 to reverse the operation via the rotating shaft 224, so that the mounting table 234 is turned upward, and the cleaned wafer 30 faces upward. For reclaiming.

Referring to FIG. 8 , the cleaning device 20 of the present invention is applied to a working device. Taking a cutting device as an example, the machine 40 is equipped with a working device 50 , a first loading device 60 , a second loading device 70 , and cleaning. The device 20, the material transfer device 80, and a central control device for controlling the operation of integrating the devices to perform an automated operation, the material transfer device 80 is taken out at the first loading device 60 to take out electronic components (such as wafers) to be cut. And transferred to the working device 50, the working device 50 performs a cutting operation on the electronic component. After the cutting is completed, the loading device 80 transfers the cut electronic component to the cleaning device 20, and the cleaning device 20 cleans the electricity. After the sub-components are completed, the loading device 80 transfers the cleaned electronic components to the second loading device 70 for centralization, and the central control device is used to control and integrate the devices to perform automated operations to achieve lifting operations. Practical benefits of performance.

20‧‧‧cleaning device

21‧‧‧cleaning tank

211‧‧‧Drainage

22‧‧‧ steering mechanism

221‧‧‧Support frame

222‧‧‧ motor

223‧‧‧ bearing housing

224‧‧‧Rotary axis

225‧‧‧Base

23‧‧‧Loading mechanism

231‧‧‧Motor

232‧‧‧ Pulley set

233‧‧‧ shaft

234‧‧‧Holding table

235‧‧‧Adsorbed parts

236‧‧‧ buckle

24‧‧‧Spray mechanism

241‧‧‧First sprinkler

242‧‧‧Second sprinkler

Claims (10)

An electronic component cleaning device comprising: a cleaning tank; the steering mechanism is mounted on the cleaning tank, and has at least one base, and is provided with a first driving source capable of driving the base to reverse the direction of transformation; At least one mounting platform for receiving the electronic component, the mounting platform is mounted on the base of the steering mechanism, so that when the cleaning operation is performed, the base of the steering mechanism is turned upside down in a non-upward direction, and the mounting platform is connected There is a second driving source for driving rotation; the spraying mechanism is mounted on the cleaning tank and is provided with at least one sprinkler capable of spraying fluid, and spraying the fluid on the electronic components on the mounting platform of the supporting mechanism. The electronic component cleaning device of claim 1, wherein the cleaning tank is provided with at least one discharge port for discharging the cleaning fluid. The electronic component cleaning device according to claim 1, wherein the first driving source of the steering mechanism is external to the cleaning tank to support the frame and the motor is driven by the transmission structure to drive at least one of the cleaning tanks. The inner base is flipped. The electronic component cleaning device according to the third aspect of the invention, wherein the transmission structure of the steering mechanism is disposed on both sides of the cleaning tank, the bearing frame is provided with a rotating shaft, and the rotating shaft is provided with at least one base. Seat, while the rotating shaft is connected to the motor. The electronic component cleaning device of claim 1, wherein the second driving source of the carrier mechanism is mounted on the bottom of the base of the steering mechanism, and the motor is coupled to at least one transmission group, the transmission group The connecting drive is rotated by a rotating shaft extending out of the base, and one end of the rotating shaft is equipped with a mounting base. The electronic component cleaning device according to claim 5, wherein the carrier mechanism The drive train is a pulley set. The electronic component cleaning device of claim 1, wherein the mounting platform of the carrier mechanism is provided with a positioning structure for positioning electronic components. The electronic component cleaning device of claim 7, wherein the positioning structure of the bearing mechanism is provided with at least one adsorbing member or clip member on the mounting platform. The electronic component cleaning device of claim 1, wherein the spray mechanism is provided with a first sprayer and a second sprayer for spraying fluid to the electronic component. An operation device for applying an electronic component cleaning device, comprising: a machine table; at least one feeding device: being mounted on the machine table for accommodating electronic components; and the working device: being mounted on the machine table for using the electronic component Performing a preset operation; the electronic component cleaning device according to item 1 of the patent application scope is used for cleaning electronic components; and the material transfer device is mounted on the machine platform for transferring electronic components; the central control device: Used to control and integrate the various devices to perform automated operations.