CN112547603A - Semiconductor wafer surface cleaning device - Google Patents
Semiconductor wafer surface cleaning device Download PDFInfo
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- CN112547603A CN112547603A CN202011269928.1A CN202011269928A CN112547603A CN 112547603 A CN112547603 A CN 112547603A CN 202011269928 A CN202011269928 A CN 202011269928A CN 112547603 A CN112547603 A CN 112547603A
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- fixedly connected
- semiconductor wafer
- cleaning
- storage tank
- liquid storage
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- 238000004140 cleaning Methods 0.000 title claims abstract description 75
- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 239000007788 liquid Substances 0.000 claims abstract description 58
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 45
- 238000003860 storage Methods 0.000 claims abstract description 31
- 238000001179 sorption measurement Methods 0.000 claims abstract description 15
- 238000001914 filtration Methods 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000000741 silica gel Substances 0.000 claims description 18
- 229910002027 silica gel Inorganic materials 0.000 claims description 18
- 238000005096 rolling process Methods 0.000 claims description 12
- 229920000742 Cotton Polymers 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 7
- 210000003437 trachea Anatomy 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a semiconductor wafer surface cleaning device which comprises a liquid storage tank, wherein the top of the liquid storage tank is fixedly connected with a cleaning table, a semiconductor wafer is placed on the top of the cleaning table through a mechanical arm and is attached to the top of the cleaning table, a backflow filtering mechanism is arranged on the left side of the liquid storage tank, an adsorption mechanism is arranged on the top of the cleaning table, a case is fixedly connected to the right side of the cleaning table, the top of the case is fixedly connected with a shell, a pushing mechanism is arranged in the inner cavity of the shell, a driving mechanism is arranged in the inner cavity of the case, and a water supply mechanism is arranged on the right side of the liquid storage tank. In the semiconductor wafer surface cleaning device, the water supply mechanism and the backflow filtering mechanism are used in a matched mode, cleaning liquid is supplied to a cleaning connection of the semiconductor wafer, the used cleaning liquid is recycled, the semiconductor wafer is adsorbed and fixed through the adsorption mechanism, and the driving mechanism drives the semiconductor wafer to rotate, so that the semiconductor wafer is comprehensively and effectively cleaned.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer processing, in particular to a semiconductor wafer surface cleaning device.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; the silicon wafer can be processed into various circuit element structures to become IC products with specific electrical functions, a layer of Al2O3 and glycerin mixed protective liquid with the thickness of about 2um is adhered to the surface of the wafer, and a cleaning device is required to be adopted for chemical etching and surface cleaning before the manufacturing.
The existing cleaning device has the following defects:
(1) the mechanical structure clamps the semiconductor wafer, and the mechanical equipment is hard in texture, so that scratches and even cracks are easily caused on the surface of the semiconductor wafer, the semiconductor wafer is damaged, and the processing cost is increased;
(2) the cleaning effect is poor, and the surface of the semiconductor wafer cannot be cleaned comprehensively by single washing, so that impurities are easy to remain on the surface of the semiconductor wafer, the later processing of the semiconductor wafer is influenced, and the production and processing efficiency is influenced;
(3) a large amount of water sources are needed, and a common cleaning device does not have the function of water recycling treatment, so that a large amount of cleaning water needs to be consumed in the processing process, the cost required by production and processing is improved on the one hand, and the environment is not saved on the other hand.
Disclosure of Invention
The invention aims to provide a semiconductor wafer surface cleaning device which has good cleaning effect, effectively saves water resources and can prevent the semiconductor wafer from generating scratches during cleaning.
In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor wafer surface cleaning device comprises a liquid storage tank, wherein a cleaning table is fixedly connected to the top of the liquid storage tank, a semiconductor wafer is placed on the top of the cleaning table through a mechanical arm and is attached to the top of the cleaning table, a backflow filtering mechanism is arranged on the left side of the liquid storage tank, an adsorption mechanism is arranged on the top of the cleaning table, a case is fixedly connected to the right side of the cleaning table, a shell is fixedly connected to the top of the case, a pushing mechanism is arranged in the inner cavity of the shell, a driving mechanism is arranged in the inner cavity of the case, a water supply mechanism is arranged on the right side of the liquid storage tank and comprises a water pump arranged on the right side of the liquid storage tank, the water inlet end of the water pump penetrates through the inner cavity of the liquid storage tank, the water outlet end of the water pump is communicated with a water supply pipe, one end, away from the, the cleaning device is characterized in that one end, far away from a water supply pipe, of the connecting hose is communicated with the L-shaped hollow rotating frame, a rectangular notch matched with one end of the L-shaped hollow rotating frame is formed in the top of the shell, two nozzle installation pipes communicated with inner cavities of the L-shaped hollow rotating frame are symmetrically and fixedly connected to the other end of the L-shaped hollow rotating frame, a plurality of nozzles are uniformly and fixedly connected to the bottoms of the nozzle installation pipes, the nozzles are arranged below the nozzle installation pipes and parallel to the nozzle installation pipes and penetrate into a wiping cotton sliver, the bottoms of the nozzles are slightly higher than the bottoms of the wiping cotton sliver, a water pump extracts cleaning liquid in the inner cavity of the liquid storage tank and conveys the cleaning liquid into the L-shaped hollow rotating frame through the water supply pipe and the connecting hose, and the cleaning liquid.
Preferably, the backflow filtering mechanism comprises an upper backflow pipe fixedly connected to the left side of the cleaning table, the upper backflow pipe is communicated with the cleaning table, a lower backflow pipe fixedly connected to the left side of the liquid storage tank is communicated with the liquid storage tank, a filter element is arranged between the upper backflow pipe and the lower backflow pipe, a fixed disc is fixedly connected to the top of the lower backflow pipe and the bottom of the filter element, and a spring is arranged between the two fixed discs.
Preferably, adsorption apparatus constructs including the rolling disc that is located the clean bench top, the bottom fixedly connected with rotating tube of rolling disc, the rotating tube runs through to the inner chamber of clean bench and rotates with the clean bench through the bearing and is connected, the inner chamber of rotating tube runs through and is fixed with the trachea, tracheal top is run through to the top of rolling disc and communicates there is the silica gel sucking disc, tracheal bottom intercommunication has vacuum generator, and when robotic arm placed the semiconductor wafer at the top of clean bench, semiconductor wafer extrusion silica gel sucking disc, vacuum generator vacuumized the silica gel sucking disc, made the silica gel sucking disc adsorb in the bottom of semiconductor wafer.
Preferably, the driving mechanism comprises a motor arranged in the inner cavity of the case, the bottom of the surface of the rotating tube is fixedly connected with a large turntable, an output shaft of the motor is fixedly connected with a small turntable, and the small turntable and the large turntable are in transmission connection through a belt.
Preferably, pushing mechanism includes fixed connection at the mount of quick-witted case top front side and rear side, rotates between two mounts and is connected with two gears, gear and the hollow rotating turret fixed connection of L shape, the top sliding connection of quick-witted case has the pinion rack, the pinion rack meshes with the gear mutually, the U-shaped cavity has been seted up at the top of pinion rack, the cylinder with quick-witted case fixed connection is installed to the inner chamber of U-shaped cavity, the piston rod tip of cylinder and the inner chamber bottom fixed connection of U-shaped cavity, the cylinder drives the pinion rack and slides to the right side, makes two gears drive the hollow rotating turret of L shape upset to the left side for clean the silver upset to the top of semiconductor wafer and laminate mutually with the top of semiconductor wafer.
Preferably, an annular groove is formed in the top of the cleaning table, the inner diameter of the annular groove is larger than the outer diameter of the rotating disc, a plurality of backflow holes are uniformly formed in the bottom of the annular groove along the circumferential direction, cleaning liquid after cleaning converges into the annular groove and flows into the inner cavity of the cleaning table through the backflow holes, and then flows back to the inner cavity of the liquid storage tank through the upper backflow pipe, the filter element and the lower backflow pipe, and is filtered at the filter element.
Preferably, the bottom of the inner cavity of the rotating disc is provided with a silica gel adsorption pad.
Compared with the prior art, the invention has the following beneficial effects: in the semiconductor wafer surface cleaning device, the water supply mechanism and the backflow filtering mechanism are used in a matched manner, cleaning liquid is supplied to the cleaning connection of the semiconductor wafer, the used cleaning liquid is recycled, the semiconductor wafer is adsorbed and fixed through the adsorption mechanism, and the semiconductor wafer is driven to rotate through the driving mechanism, so that the semiconductor wafer is comprehensively and effectively cleaned.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is an enlarged view of point A in FIG. 1;
FIG. 3 is a schematic front view of the present invention;
FIG. 4 is a partial schematic view of the cleaning station;
FIG. 5 is a schematic view of an assembled structure of the pushing mechanism;
FIG. 6 is an exploded view of the return flow filter mechanism;
fig. 7 is an enlarged view of point B in fig. 6.
In the figure: 1. a liquid storage tank; 2. a cleaning table; 3. a reflux filtration mechanism; 31. an upper return pipe; 32. a lower return pipe; 33. a filter element; 34. fixing the disc; 35. a spring; 4. an adsorption mechanism; 41. rotating the disc; 42. Rotating the tube; 43. an air tube; 44. a silica gel sucker; 45. a vacuum generator; 5. a drive mechanism; 51. a motor; 52. a large turntable; 53. a small turntable; 6. a chassis; 7. a water supply mechanism; 71. a water pump; 72. a water supply pipe; 73. a connecting hose; 74. an L-shaped hollow rotating frame; 75. a rectangular notch; 76. a nozzle; 8. a pushing mechanism; 81. a fixed mount; 82. a gear; 83. a toothed plate; 84. a U-shaped cavity; 85. a cylinder; 9. an annular groove; 10. a return orifice; 11. a silica gel adsorption pad; 12. wiping the cotton sliver; 13. a housing.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A semiconductor wafer surface cleaning device comprises a liquid storage tank 1, a cleaning table 2 is fixedly connected to the top of the liquid storage tank 1, a semiconductor wafer is placed on the top of the cleaning table 2 through a mechanical arm and is attached to the top of the cleaning table 2, a backflow filtering mechanism 3 is arranged on the left side of the liquid storage tank 1, the backflow filtering mechanism 3 comprises an upper backflow pipe 31 fixedly connected to the left side of the cleaning table 2, the upper backflow pipe 31 is communicated with the cleaning table 2, a lower backflow pipe 32 is fixedly connected to the left side of the liquid storage tank 1, the lower backflow pipe 32 is communicated with the liquid storage tank 1, a filter element 33 is arranged between the upper backflow pipe 31 and the lower backflow pipe 32, the filter element 33 can filter recovered cleaning liquid, impurities in the cleaning liquid are filtered out, the recovered cleaning liquid can flow back to the liquid storage tank 1 for recycling after being filtered, and a fixed disc 34 is fixedly connected to the top of the lower backflow, be provided with spring 35 between two fixed disks 34, fixed disk 34 and spring 35 cooperation have played spacing and the effect that promotes to filter core 33, make the both ends of filter core 33 closely laminate with last back flow 31 and lower back flow 32 on the one hand, prevent the infiltration, and on the other hand, the convenience is dismantled filter core 33 to wash or change filter core 33.
The top of clean bench 2 is provided with adsorption apparatus 4, adsorption apparatus 4 is including the rolling disc 41 that is located 2 tops of clean bench, the inner chamber bottom of rolling disc 41 is provided with silica gel adsorption pad 11, and silica gel adsorption pad 11 makes semiconductor wafer and clean bench 2's top contact position comparatively soft, has avoided the top of clean bench 2 to cause the scratch to semiconductor wafer's surface. The bottom fixedly connected with rotating tube 42 of rolling disc 41, rotating tube 42 runs through to the inner chamber of clean bench 2 and is connected with clean bench 2 through the bearing rotation, the inner chamber of rotating tube 42 runs through and is fixed with trachea 43, the top of trachea 43 runs through to the top of rolling disc 41 and is communicated with silica gel sucking disc 44, the bottom intercommunication of trachea 43 has vacuum generator 45, when robotic arm places the semiconductor wafer at the top of clean bench 2, the semiconductor wafer extrudes silica gel sucking disc 44, vacuum generator 45 takes out the vacuum to silica gel sucking disc 44, make silica gel sucking disc 44 adsorb the bottom at the semiconductor wafer, adsorb spacing to the semiconductor wafer, make the semiconductor wafer keep stable when rotatory washing.
The right side of the cleaning table 2 is fixedly connected with a case 6, the top of the case 6 is fixedly connected with a shell 13, an inner cavity of the shell 13 is provided with a pushing mechanism 8, the pushing mechanism 8 comprises fixed frames 81 fixedly connected to the front side and the rear side of the top of the case 6, two gears 82 are rotatably connected between the two fixed frames 81, the gears 82 are fixedly connected with the L-shaped hollow rotating frame 74, the top of the case 6 is slidably connected with a toothed plate 83, the toothed plate 83 is meshed with the gears 82, a U-shaped cavity 84 is arranged at the top of the toothed plate 83, an air cylinder 85 fixedly connected with the case 6 is arranged in the inner cavity of the U-shaped cavity 84, the end of a piston rod of the air cylinder 85 is fixedly connected with the bottom of the inner cavity of the U-shaped cavity 84, the air cylinder 85 drives the toothed plate 83 to slide towards the right side, so that the two gears 82 drive the L-shaped hollow rotating frame 74 to turn, after adopting this kind of structural style, the hollow rotating turret 74 of L shape and clean silver 12 can overturn, both conveniently place the semiconductor wafer at the top of clean bench 2, can guarantee again to clean silver 12 and clean the semiconductor wafer, and pinion rack 83 can guarantee with the structure of gear 82 meshing mutually that L shape hollow rotating turret 74 can not take place the skew when overturning, and the upset stability is good.
The inner cavity of the case 6 is provided with a driving mechanism 5, the driving mechanism 5 comprises a motor 51 installed in the inner cavity of the case 6, the bottom of the surface of the rotating tube 42 is fixedly connected with a large turntable 52, an output shaft of the motor 51 is fixedly connected with a small turntable 53, and the small turntable 53 is connected with the large turntable 52 through a belt in a transmission way. The motor 51 drives the rotating disc 41 to rotate through the small rotating disc 53, the belt and the large rotating disc 52, so that the rotating disc 41 drives the semiconductor wafer to rotate, and the semiconductor wafer is comprehensively and effectively cleaned.
The right side of the liquid storage tank 1 is provided with a water supply mechanism 7, the water supply mechanism 7 comprises a water pump 71 arranged on the right side of the liquid storage tank 1, the water inlet end of the water pump 71 penetrates through the inner cavity of the liquid storage tank 1, the water outlet end of the water pump 71 is communicated with a water supply pipe 72, one end of the water supply pipe 72, which is far away from the water pump 71, is communicated with a connecting hose 73, the top of the cleaning table 2 is provided with an L-shaped hollow rotating frame 74, one end of the connecting hose 73, which is far away from the water supply pipe 72, is communicated with the L-shaped hollow rotating frame 74, the top of the shell 13 is provided with a rectangular notch 75 matched with one end of the L-shaped hollow rotating frame 74, the other end of the L-shaped hollow rotating frame 74 is symmetrically and fixedly connected with two nozzle mounting pipes communicated with the inner cavity thereof, the bottoms of the nozzle mounting pipes are, the nozzle 76 penetrates into the wiping cotton sliver 12, the bottom of the nozzle 76 is slightly higher than the bottom of the wiping cotton sliver 12, the water pump 71 extracts cleaning liquid in the inner cavity of the liquid storage tank 1 and conveys the cleaning liquid into the L-shaped hollow rotating frame 74 through the water supply pipe 72 and the connecting hose 73, the cleaning liquid in the L-shaped hollow rotating frame 74 is continuously supplied to the nozzle 76 through the nozzle mounting pipe, the nozzle 76 sprays the cleaning liquid onto the wiping cotton sliver 12, and the wet wiping cotton sliver 12 is used for effectively wiping and cleaning the semiconductor wafer, so that the semiconductor wafer can be wiped and cleaned, and the semiconductor wafer cannot be damaged.
The left, right, front, back, top and bottom of the invention are based on the orientation of the view shown in fig. 1.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A semiconductor wafer surface cleaning device comprises a liquid storage tank (1), and is characterized in that: the cleaning device is characterized in that the top of the liquid storage tank (1) is fixedly connected with a cleaning table (2), a semiconductor wafer is placed on the top of the cleaning table (2) through a mechanical arm and is attached to the top of the cleaning table (2), a backflow filtering mechanism (3) is arranged on the left side of the liquid storage tank (1), an adsorption mechanism (4) is arranged on the top of the cleaning table (2), a case (6) is fixedly connected on the right side of the cleaning table (2), a shell (13) is fixedly connected on the top of the case (6), a pushing mechanism (8) is arranged in the inner cavity of the shell (13), a driving mechanism (5) is arranged in the inner cavity of the case (6), a water supply mechanism (7) is arranged on the right side of the liquid storage tank (1), the water supply mechanism (7) comprises a water pump (71) arranged on the right side of the liquid storage tank (1), and the water inlet end of, the water outlet end of the water pump (71) is communicated with a water supply pipe (72), one end of the water supply pipe (72), which is far away from the water pump (71), is communicated with a connecting hose (73), the top of the cleaning table (2) is provided with an L-shaped hollow rotating frame (74), one end of the connecting hose (73), which is far away from the water supply pipe (72), is communicated with the L-shaped hollow rotating frame (74), the top of the shell (13) is provided with a rectangular notch (75) which is matched with one end of the L-shaped hollow rotating frame (74), the other end of the L-shaped hollow rotating frame (74) is symmetrically and fixedly connected with two nozzle mounting pipes which are communicated with the inner cavities of the L-shaped hollow rotating frame, the bottom of each nozzle mounting pipe is uniformly and fixedly connected with a plurality of nozzles (76), a wiping cotton sliver (12) which is parallel to the nozzle mounting pipes is arranged below the nozzle mounting pipes, the nozzles (76) penetrate into the wiping cotton sliver (12), and, the water pump (71) pumps the cleaning liquid in the inner cavity of the liquid storage tank (1) and conveys the cleaning liquid into the L-shaped hollow rotating frame (74) through the water supply pipe (72) and the connecting hose (73), and the cleaning liquid in the L-shaped hollow rotating frame (74) is continuously supplied to the nozzle (76) through the nozzle mounting pipe.
2. A semiconductor wafer surface cleaning apparatus according to claim 1, wherein: adsorption apparatus constructs (4) including rolling disc (41) that are located clean bench (2) top, the bottom fixedly connected with rotating tube (42) of rolling disc (41), rotating tube (42) run through to the inner chamber of clean bench (2) and rotate with clean bench (2) through the bearing and are connected, the inner chamber of rotating tube (42) runs through and is fixed with trachea (43), the top of trachea (43) runs through to the top of rolling disc (41) and communicates there is silica gel sucking disc (44), the bottom intercommunication of trachea (43) has vacuum generator (45), and robotic arm places semiconductor wafer when the top of clean bench (2), and semiconductor wafer extrusion silica gel sucking disc (44), vacuum generator (45) are to silica gel sucking disc (44) evacuation, make silica gel sucking disc (44) adsorb in the bottom of semiconductor wafer.
3. A semiconductor wafer surface cleaning apparatus according to claim 2, wherein: the driving mechanism (5) comprises a motor (51) installed in an inner cavity of the case (6), a large turntable (52) is fixedly connected to the bottom of the surface of the rotating pipe (42), a small turntable (53) is fixedly connected to an output shaft of the motor (51), and the small turntable (53) and the large turntable (52) are connected through a belt in a transmission mode.
4. A semiconductor wafer surface cleaning apparatus according to claim 3, wherein: the pushing mechanism (8) comprises fixed frames (81) fixedly connected to the front side and the rear side of the top of the case (6), an installation shaft is rotatably connected between the two fixed frames (81), the end part of the L-shaped hollow rotating frame (74) is fixedly connected with the middle part of the installation shaft, gears (82) are fixedly connected to two sides of the installation shaft, which are positioned on the L-shaped hollow rotating frame (74), respectively, a toothed plate (83) is slidably connected to the top of the case (6), the toothed plate (83) is meshed with the gears (82), a U-shaped cavity (84) is formed in the top of the toothed plate (83), an air cylinder (85) fixedly connected with the case (6) is installed in an inner cavity of the U-shaped cavity (84), the end part of a piston rod of the air cylinder (85) is fixedly connected with the bottom of the inner cavity of the U-shaped cavity (84), the air cylinder (85) drives the toothed plate (83) to slide towards the right side, so that the two gears (82), so that the wiping sliver (12) is inverted to and conforms to the top of the semiconductor wafer.
5. The apparatus of claim 4, wherein: return flow filter mechanism (3) are including fixed connection at left last back flow (31) of clean bench (2), it is linked together with clean bench (2) to go up back flow (31), back flow (32) under the left side fixedly connected with of liquid reserve tank (1), back flow (32) are linked together with liquid reserve tank (1) down, it is provided with filter core (33) to go up back flow (31) and down between back flow (32), the equal fixedly connected with fixed disk (34) in top and the bottom of filter core (33) of back flow (32) down is provided with spring (35) between two fixed disk (34).
6. The apparatus of claim 5, wherein: annular groove (9) have been seted up at the top of clean bench (2), and the internal diameter of annular groove (9) is greater than the external diameter of rolling disc (41), a plurality of backward flow holes (10) have evenly been seted up along circumference to the tank bottom of annular groove (9), and washing liquid after the washing converges to annular groove (9) in to flow into the inner chamber of clean bench (2) through backward flow hole (10), flow back to the inner chamber of liquid reserve tank (1) by last back flow (31), filter core (33) and lower back flow (32) again, and filter in filter core (33) department.
7. The apparatus of claim 6, wherein: and a silica gel adsorption pad (11) is arranged at the bottom of the inner cavity of the rotating disc (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011269928.1A CN112547603B (en) | 2020-11-13 | 2020-11-13 | Semiconductor wafer surface cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011269928.1A CN112547603B (en) | 2020-11-13 | 2020-11-13 | Semiconductor wafer surface cleaning device |
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| Publication Number | Publication Date |
|---|---|
| CN112547603A true CN112547603A (en) | 2021-03-26 |
| CN112547603B CN112547603B (en) | 2024-08-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011269928.1A Active CN112547603B (en) | 2020-11-13 | 2020-11-13 | Semiconductor wafer surface cleaning device |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN114038939A (en) * | 2021-10-13 | 2022-02-11 | 泰州君之华新能源科技有限公司 | High-efficient etching machine of new forms of energy photovoltaic wafer |
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| CN114792642A (en) * | 2022-04-27 | 2022-07-26 | 安徽双迈新能源科技有限公司 | Semiconductor wafer processing belt cleaning device |
| CN115716065A (en) * | 2022-12-03 | 2023-02-28 | 深圳市超快激光科技有限公司 | Polycrystalline silicon surface cleaning device |
| CN116344412A (en) * | 2023-05-29 | 2023-06-27 | 盛奕半导体科技(无锡)有限公司 | Static electricity removing device for wafer cleaning process |
| CN116825614A (en) * | 2023-08-25 | 2023-09-29 | 江苏京创先进电子科技有限公司 | Wafer cleaning method and device and wafer processing equipment |
| CN117019715A (en) * | 2023-10-10 | 2023-11-10 | 泰州市胤鸿机械设备有限公司 | Cleaning device for waste silicon wafer recovery |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113289995A (en) * | 2021-05-14 | 2021-08-24 | 无锡亚电智能装备有限公司 | Wafer containing box cleaning equipment and wafer containing box cleaning method |
| CN114038939A (en) * | 2021-10-13 | 2022-02-11 | 泰州君之华新能源科技有限公司 | High-efficient etching machine of new forms of energy photovoltaic wafer |
| CN114038939B (en) * | 2021-10-13 | 2022-11-25 | 泰州君之华新能源科技有限公司 | High-efficient etching machine of new forms of energy photovoltaic wafer |
| CN114392978A (en) * | 2022-03-24 | 2022-04-26 | 智程半导体设备科技(昆山)有限公司 | Megasonic cleaning machine for wafer processing |
| CN114792642A (en) * | 2022-04-27 | 2022-07-26 | 安徽双迈新能源科技有限公司 | Semiconductor wafer processing belt cleaning device |
| CN114792642B (en) * | 2022-04-27 | 2022-12-06 | 苏州桔云科技有限公司 | Semiconductor wafer processing belt cleaning device |
| CN115716065A (en) * | 2022-12-03 | 2023-02-28 | 深圳市超快激光科技有限公司 | Polycrystalline silicon surface cleaning device |
| CN116344412A (en) * | 2023-05-29 | 2023-06-27 | 盛奕半导体科技(无锡)有限公司 | Static electricity removing device for wafer cleaning process |
| CN116344412B (en) * | 2023-05-29 | 2023-08-11 | 盛奕半导体科技(无锡)有限公司 | Static electricity removing device for wafer cleaning process |
| CN116825614A (en) * | 2023-08-25 | 2023-09-29 | 江苏京创先进电子科技有限公司 | Wafer cleaning method and device and wafer processing equipment |
| CN116825614B (en) * | 2023-08-25 | 2023-11-10 | 江苏京创先进电子科技有限公司 | Wafer cleaning method and device and wafer processing equipment |
| CN117019715A (en) * | 2023-10-10 | 2023-11-10 | 泰州市胤鸿机械设备有限公司 | Cleaning device for waste silicon wafer recovery |
| CN117019715B (en) * | 2023-10-10 | 2023-12-22 | 泰州市胤鸿机械设备有限公司 | Cleaning device for waste silicon wafer recovery |
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