CN215613584U - Wafer cleaning table and wafer cleaning device - Google Patents
Wafer cleaning table and wafer cleaning device Download PDFInfo
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- CN215613584U CN215613584U CN202122255106.4U CN202122255106U CN215613584U CN 215613584 U CN215613584 U CN 215613584U CN 202122255106 U CN202122255106 U CN 202122255106U CN 215613584 U CN215613584 U CN 215613584U
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Abstract
The utility model relates to a wafer cleaning table and a wafer cleaning device. Comprises a wafer disc; the first driving assembly is used for driving the wafer disc to rotate; and the second driving assembly is used for driving the wafer disc to swing. In the scheme, the wafer can rotate and swing under the action of the first driving assembly and the second driving assembly in the cleaning process, so that the cleaning liquid in the wafer can be fully contacted with the wafer, the flowability of the cleaning liquid in the wafer is increased, a good cleaning effect is formed, and the wafer cleaning efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning table and a wafer cleaning device.
Background
In a semiconductor device, taking a photolithography process as an example, the photolithography process mainly includes the steps of: firstly, spin-coating a photoresist layer on a semiconductor wafer, then, carrying out a soft baking process to remove a solvent in the photoresist layer and increase the adhesiveness of the photoresist on the surface of the semiconductor wafer, after the soft baking is finished, carrying out a developing process on the photoresist on the wafer to finish the photoetching, then, carrying out etching, and carrying out photoresist removing operation on the wafer after the etching operation is finished.
At present, a wet etching machine (a photoresist remover) of the existing photoresist removing equipment places a wafer in a corresponding wafer disc for photoresist removing by spraying, cleaning liquid which is sprayed in the spraying process enters the wafer disc, and the cleaning liquid in the wafer disc has poor liquidity, so that the wafer is difficult to clean and the cleaning effect is poor.
Therefore, how to reduce the difficulty of cleaning the wafer and improve the cleaning effect is a problem that needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
In view of the above deficiencies of the prior art, an object of the present application is to provide a wafer cleaning table and a wafer cleaning apparatus, which are used to solve the technical problems of the prior art, such as high difficulty in cleaning wafers and poor cleaning effect.
A wafer cleaning station, comprising: a wafer disc; the first driving assembly is used for driving the wafer disc to rotate; and the second driving assembly is used for driving the wafer disc to swing.
According to the wafer cleaning table, in the wafer cleaning process, the wafer disc can rotate and swing under the action of the first driving assembly and the second driving assembly, so that cleaning liquid in the wafer disc can be fully contacted with a wafer, the flowability of the cleaning liquid in the wafer disc is increased, a good cleaning effect is formed, and the wafer cleaning efficiency is improved.
Optionally, the first driving assembly includes: the first end of the first rotating rod is rotatably connected with the first motor, and the second end of the first rotating rod is connected with the wafer disc;
the second drive assembly includes: the first end of second dwang with the second motor rotates and connects, the second end of second dwang is connected the brilliant disc.
Optionally, the wafer tray includes:
the wafer disc comprises a wafer disc body, wherein an annular slot is formed in the wafer disc body;
the connecting rod, the first end of connecting rod with this body of wafer dish deviates from slotted one side of annular is connected, the second end of connecting rod with first dwang the second dwang is connected.
Because the second end of connecting rod with first dwang, the second dwang homogeneous phase is connected, consequently, also can realize the swing of wafer dish when the wafer dish rotates, further increased the mobility of the interior washing liquid of annular fluting, increased the time of washing liquid on the wafer, improve wafer cleaning performance.
Optionally, a second end of the first rotating rod is provided with a slot, and a second end of the connecting rod is provided with the slot.
Optionally, a through hole is formed at the second end of the connecting rod, and the second end of the second rotating rod is arranged in the through hole.
Optionally, the wafer disc is made of a polytetrafluoroethylene material.
Based on same utility model design, this application still provides a wafer belt cleaning device, include: a spray assembly; and the wafer cleaning table according to any one of the above technical schemes;
wherein, the spraying component is arranged above the wafer cleaning platform.
The wafer cleaning device comprises the wafer cleaning table, so that any beneficial effect of the technical scheme can be achieved, namely the cleaning liquid in the wafer disc can be in full contact with the wafer, the flowability of the cleaning liquid in the wafer disc is increased, a good cleaning effect is formed, and the wafer cleaning efficiency is improved.
Optionally, the spray assembly includes:
a rinsing pan;
the spray head assembly is fixed on the washing disc;
the cleaning solution liquid inlet pipe is communicated with the spray head assembly through the washing disc;
wherein, the spray head assembly comprises a plurality of mist spray heads.
Owing to set up vaporific shower nozzle, vaporific shower nozzle can spray the spun washing liquid evenly for washing liquid and wafer surface homoenergetic fully contact, increased the abluent homogeneity of wafer, promote the cleanliness factor of wafer, reduce the wafer and scrap.
Optionally, the plurality of mist nozzles are annularly distributed.
Optionally, an annular liquid conveying channel is arranged in the flushing disc, the plurality of mist-shaped spray heads are arranged on the annular liquid conveying channel at equal intervals, and each mist-shaped spray head is communicated with the annular liquid conveying channel.
Because the mist spray heads are arranged on the annular liquid conveying channel at equal intervals, the cleaning liquid sprayed by the mist spray heads can be uniformly contacted with the surface of the wafer, the stress area of the cleaning liquid sprayed by the spray heads is increased, and a good cleaning effect is formed.
Drawings
FIG. 1 is a schematic view of a first structure of a wafer cleaning apparatus according to the present invention;
FIG. 2 is a schematic diagram of a second structure of a wafer cleaning apparatus according to the present invention;
FIG. 3 is a cross-sectional view taken along line A-A' of FIG. 1;
FIG. 4 is a cross-sectional view taken along line B-B' of FIG. 1;
FIG. 5 is a schematic structural view of the spray assembly of the present invention;
fig. 6 is a schematic structural diagram of the first rotating rod according to the embodiment of the present invention.
Description of reference numerals:
100-wafer cleaning station; 110-wafer disks; 111-wafer disk body; 112-a connecting rod; 113-a via; 120-a first motor; 130-a first turning lever; 131-slotting; 140-a second motor; 150-a second rotating shaft; 200-a spray assembly; 210-a cleaning liquid inlet pipe; 220-a rinsing tray; 221-annular transfusion channel; 230-a showerhead assembly; 231-mist spray head.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
At present, the existing wet etching machine of the photoresist removing equipment places the wafer in the corresponding wafer disc for spraying and removing photoresist, and the following defects exist in the cleaning and photoresist removing process: on one hand, after the cleaning liquid sprayed by the spraying nozzle enters the wafer disc, the wafer disc is fixedly arranged, so that the cleaning liquid in the wafer disc is poor in liquidity, the wafer cleaning difficulty is high, and the cleaning effect is poor. On the other hand, the cleaning solution is sprayed linearly in the spraying process, and the cleaning solution rotates in the manufacturing process to form a semi-arc photoresist removing state, so that the spraying effect is poor, the photoresist removing time is long, the photoresist removing is not uniform, and the like.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
The wafer cleaning table and the wafer cleaning apparatus provided in the embodiments of the present application will be described in detail with reference to fig. 1 to 6 through specific embodiments and application scenarios thereof.
The embodiment of the present application provides a wafer cleaning station 100, including: a wafer disk 110; the first driving assembly is used for driving the wafer disc 110 to rotate; and the second driving assembly is used for driving the wafer disc 110 to swing.
As shown in fig. 1 and 2, the wafer cleaning station 110 is required to work with the shower assembly 200 above the wafer 110, and it is understood that the wafer cleaning station 100 can be manufactured and sold separately or together with the shower assembly 200.
The wafer tray 110 is used for placing a wafer to be cleaned (photoresist removed), and the wafer tray 110 is made of teflon material to avoid corrosion during operation. The wafer plate 110 typically has a recess therein for receiving a wafer to be cleaned, and preferably the recess is an annular recess.
The first driving assembly and the second driving assembly can respectively drive the wafer disc 110 to rotate and the wafer disc 110 to swing, and specifically, the wafer disc 110 rotates around a horizontal plane in the rotation of the wafer disc 110; the wafer disk 110 oscillates such that the wafer disk 110 can rotate up and down in a vertical direction.
After the etching operation of the wafer is completed, the wafer is fixedly placed in the annular groove, then the cleaning liquid sprayed by the spraying assembly 200 above the wafer disc 110 is sprayed on the wafer for photoresist removing and cleaning, in the photoresist removing and cleaning process, the first driving assembly can be controlled to drive the wafer disc 110 to rotate and the second driving assembly to drive the wafer disc 110 to swing according to actual conditions, so that the cleaning liquid in the wafer disc 110 can be fully contacted with the wafer, the flowability of the cleaning liquid in the wafer disc 110 is increased, a good cleaning effect is formed, and the wafer cleaning efficiency and cleaning cleanliness are improved.
On the basis of the above embodiments, there are various ways to drive the wafer plate 110 to rotate and swing by the first driving assembly and the second driving assembly, and in a preferred implementation, the first driving assembly includes: a first motor 120 and a first rotating rod 130, wherein a first end of the first rotating rod 130 is rotatably connected with the first motor 120, and a second end of the first rotating rod 130 is connected with the wafer disk 110; the second drive assembly includes: a second motor 140 and a second rotating rod 150, wherein a first end of the second rotating rod 150 is rotatably connected to the second motor 140, and a second end of the second rotating rod 150 is connected to the wafer disk 110. A connecting rod 112, a first end of the connecting rod 112 is connected to a surface of the wafer disc body 111 deviating from the annular slot 131, and a second end of the connecting rod 112 is connected to the first rotating rod 130 and the second rotating rod 150.
As shown in fig. 3 and 4, the rotating shaft of the first motor 120 is connected to the first rotating rod 130 for driving the first rotating rod 130 to rotate, and the first rotating rod 130 is disposed along the vertical direction and connected to the wafer disk body 111 through the connecting rod 112, so that when the first rotating rod 130 rotates, the wafer disk body 111 can be driven to rotate along the horizontal plane.
The rotating shaft of the second motor 140 is connected to the second rotating rod 150 for driving the second rotating rod 150 to rotate, the second rotating rod 150 is disposed along the horizontal direction and is also connected to the wafer disk body 111 through the connecting rod 112, so that when the second rotating rod 150 rotates, the wafer disk body 111 can be driven to swing up and down along the vertical direction.
It should be noted that, since the second end of the connecting rod 112 is connected to both the first rotating rod 130 and the second rotating rod 150, the wafer 110 can swing while the wafer 110 rotates, so as to further increase the fluidity of the cleaning solution in the annular groove 131, increase the time of the cleaning solution on the wafer, and improve the cleaning efficiency and cleaning cleanliness of the wafer.
In addition to the above-mentioned embodiment, as shown in fig. 6, the second end of the first rotating rod 130 is provided with a slot 131, the slot 131 is used for installing the second end of the connecting rod 112, and preferably, the second end of the connecting rod 112 can be fixed in the slot 131 by a screw. A through hole 113 is further provided at the second end of the connecting rod 112, and the second rotating lever 150 is mounted in the through hole 113.
Based on same utility model design, this application embodiment still provides a wafer belt cleaning device, include:
a spray assembly 200; and a wafer cleaning station 100 according to any of the above-mentioned embodiments; wherein the spray assembly 200 is disposed above the wafer cleaning station 100.
Specifically, in the wafer cleaning apparatus, during the process of cleaning the wafer, the wafer is placed in the wafer tray 110, and the spray assembly 200 is used for spraying the cleaning solution, so that the cleaning solution flows into the surface of the wafer, and the cleaning solution may be deionized water.
The wafer cleaning device comprises the wafer cleaning table 100, so that any beneficial effect of the technical scheme can be achieved, namely, the cleaning liquid in the wafer disc 110 can be in full contact with the wafer, and the flowability of the cleaning liquid in the wafer disc 110 is increased, so that a good cleaning effect is formed, and the wafer cleaning efficiency is improved.
On the basis of the above embodiment, as shown in fig. 2 and 5, the shower assembly 200 includes: a rinsing pan 220; a spray head assembly 230, said spray head assembly 230 being fixed to said rinsing plate 220; a cleaning solution inlet pipe 210, wherein the cleaning solution inlet pipe 210 is communicated with the spray head assembly 230 through the washing plate 220;
specifically, the rinse plate 220 is disposed between the cleaning solution inlet pipe 210 and the showerhead assembly 230, and preferably, the rinse plate 220 is disposed opposite to the wafer plate 110 in a vertical direction. The cleaning solution flows in through the cleaning solution inlet pipe 210, and after passing through the cleaning plate 220, the cleaning solution can uniformly flow into the plurality of mist nozzles 231, and then is sprayed out through the plurality of mist nozzles 231, so as to uniformly fall on the surface of the wafer on the wafer disk 110.
Owing to set up vaporific shower nozzle 231, vaporific shower nozzle 231 can spray the spun washing liquid evenly for washing liquid and wafer surface homoenergetic fully contact, increased the abluent homogeneity of wafer, promote the cleanliness factor of wafer, reduce the wafer and scrap.
In addition to the above embodiment, as shown in fig. 2, an annular liquid delivery channel 221 is provided in the washing tray 220, a plurality of mist nozzles 231 are provided on the annular liquid delivery channel 221 at equal intervals, and each mist nozzle 231 is communicated with the annular liquid delivery channel 221.
Because the mist nozzles 231 are arranged on the annular liquid conveying channel 221 at equal intervals, the cleaning liquid sprayed by the mist nozzles 231 can be uniformly contacted with the surface of the wafer, the stress area of the cleaning liquid sprayed by the nozzles is increased, and a good cleaning effect is formed.
In summary, the utility model provides a wafer cleaning table and a wafer cleaning apparatus. Comprises a wafer disc; the first driving assembly is used for driving the wafer disc to rotate; and the second driving assembly is used for driving the wafer disc to swing. In the scheme, the wafer can rotate and swing under the action of the first driving assembly and the second driving assembly in the cleaning process, so that the cleaning liquid in the wafer disc can be fully contacted with the wafer, the flowability of the cleaning liquid in the wafer disc is increased, a good cleaning effect is formed, and the wafer cleaning efficiency is improved.
It is to be understood that the utility model is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the utility model as defined by the appended claims.
Claims (10)
1. A wafer cleaning station, comprising:
a wafer disc;
the first driving assembly is used for driving the wafer disc to rotate;
and the second driving assembly is used for driving the wafer disc to swing.
2. The wafer cleaning station of claim 1,
the first drive assembly includes: the first end of the first rotating rod is rotatably connected with the first motor, and the second end of the first rotating rod is connected with the wafer disc;
the second drive assembly includes: the first end of second dwang with the second motor rotates and connects, the second end of second dwang is connected the brilliant disc.
3. The wafer cleaning station of claim 2, wherein the wafer disk comprises:
the wafer disc comprises a wafer disc body, wherein an annular slot is formed in the wafer disc body;
the connecting rod, the first end of connecting rod with this body of wafer dish deviates from slotted one side of annular is connected, the second end of connecting rod with first dwang the second dwang is connected.
4. The wafer cleaning station of claim 3,
the second end of the first rotating rod is provided with a slot, and the second end of the connecting rod is arranged in the slot.
5. The wafer cleaning station of claim 4,
the second end of connecting rod is equipped with the through-hole, the second end of second dwang is located the through-hole.
6. The wafer cleaning station of any of claims 1-5,
the wafer disc is made of polytetrafluoroethylene materials.
7. A wafer cleaning apparatus, comprising:
a spray assembly; and a wafer cleaning station as claimed in any one of claims 1 to 6;
wherein, the spraying component is arranged above the wafer cleaning platform.
8. The wafer cleaning apparatus of claim 7, wherein the spray assembly comprises:
a rinsing pan;
the spray head assembly is fixed on the washing disc;
the cleaning solution liquid inlet pipe is communicated with the spray head assembly through the washing disc;
wherein, the spray head assembly comprises a plurality of mist spray heads.
9. The wafer cleaning apparatus of claim 8,
the plurality of mist spray heads are distributed annularly.
10. The wafer cleaning apparatus of claim 9,
the washing plate is internally provided with an annular transfusion channel, the plurality of mist-shaped spray heads are arranged on the annular transfusion channel at equal intervals, and each mist-shaped spray head is communicated with the annular transfusion channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122255106.4U CN215613584U (en) | 2021-09-17 | 2021-09-17 | Wafer cleaning table and wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122255106.4U CN215613584U (en) | 2021-09-17 | 2021-09-17 | Wafer cleaning table and wafer cleaning device |
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| Publication Number | Publication Date |
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| CN215613584U true CN215613584U (en) | 2022-01-25 |
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| CN202122255106.4U Active CN215613584U (en) | 2021-09-17 | 2021-09-17 | Wafer cleaning table and wafer cleaning device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115121550A (en) * | 2022-06-27 | 2022-09-30 | 江苏大学 | Wafer cleaning device and method thereof |
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- 2021-09-17 CN CN202122255106.4U patent/CN215613584U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115121550A (en) * | 2022-06-27 | 2022-09-30 | 江苏大学 | Wafer cleaning device and method thereof |
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