TW201417195A - 圓形式晶粒置放方法 - Google Patents
圓形式晶粒置放方法 Download PDFInfo
- Publication number
- TW201417195A TW201417195A TW101139048A TW101139048A TW201417195A TW 201417195 A TW201417195 A TW 201417195A TW 101139048 A TW101139048 A TW 101139048A TW 101139048 A TW101139048 A TW 101139048A TW 201417195 A TW201417195 A TW 201417195A
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- Taiwan
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 239000013078 crystal Substances 0.000 claims description 65
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 description 10
- 230000008901 benefit Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000000969 carrier Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 210000004400 mucous membrane Anatomy 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000011176 pooling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101139048A TW201417195A (zh) | 2012-10-23 | 2012-10-23 | 圓形式晶粒置放方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101139048A TW201417195A (zh) | 2012-10-23 | 2012-10-23 | 圓形式晶粒置放方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201417195A true TW201417195A (zh) | 2014-05-01 |
| TWI484570B TWI484570B (https=) | 2015-05-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101139048A TW201417195A (zh) | 2012-10-23 | 2012-10-23 | 圓形式晶粒置放方法 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201417195A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114972317A (zh) * | 2022-06-22 | 2022-08-30 | 合肥工业大学 | 一种方形晶粒放置规划方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6979248B2 (en) * | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| KR100781149B1 (ko) * | 2001-12-21 | 2007-11-30 | 삼성테크윈 주식회사 | 리드프레임 스트립 및 이를 이용한 반도체 패키지 제조 방법 |
| US6889427B2 (en) * | 2002-02-15 | 2005-05-10 | Freescale Semiconductor, Inc. | Process for disengaging semiconductor die from an adhesive film |
| US20040144760A1 (en) * | 2002-05-17 | 2004-07-29 | Cahill Steven P. | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
| DE102006032073B4 (de) * | 2006-07-11 | 2016-07-07 | Intel Deutschland Gmbh | Elektrisch leitfähiger Verbund aus einem Bauelement und einer Trägerplatte |
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2012
- 2012-10-23 TW TW101139048A patent/TW201417195A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114972317A (zh) * | 2022-06-22 | 2022-08-30 | 合肥工业大学 | 一种方形晶粒放置规划方法 |
| CN114972317B (zh) * | 2022-06-22 | 2024-04-05 | 合肥工业大学 | 一种方形晶粒放置规划方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI484570B (https=) | 2015-05-11 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |