TW201409047A - Insert for test handler - Google Patents

Abstract

The present invention relates to an insert for test handler. The present invention discloses a technology for fixing a support member onto the body of an insert via over-extending insertion or welding, so as to achieve the purpose of minimizing the thickness of an extrusion portion of a fixed member beside a side of the insert body which the support member is extruded to.

Description

Test sorter plugin

The present invention relates to an insert for a test disc that can carry semiconductor components in a test sorter.

The test sorter is a type of semiconductor component that is manufactured by a predetermined manufacturing process after being moved from a customer disk (CUSTOMER TRAY) to a test disk (TEST TRAY), and the semiconductor component carried on the test disk is provided to be simultaneously tested by the TESTER (TESTER). The support of the test (TEST), and the device for moving the semiconductor component to the client disk according to the test result by the level, has been disclosed in many public documents.

As described in Korean Patent No. 10-0801927, the test sorter has a plurality of inserts (INSERTs) formed with a seating space in which the semiconductor elements can be placed in an inserted state. Also, the semiconductor component disposed in the seating space of the insert is supported by a support portion integrally molded with the main body of the insert.

In addition, due to the development of integration technology and the like, the size of the semiconductor element is reduced and the number of terminals is increased. Moreover, the ball (BALL) terminal is proposed The spacing between the terminals and the size of the terminals are also reduced, and the electrical connection between the terminals of the semiconductor component and the tester is more precise and stable.

Therefore, Korean Patent Publication No. 10-1999-0082895 (invention name: "integrated circuit test device", hereinafter referred to as prior art 1) and 10-2010-0081131 (invention name: "for sorting machine" is proposed. A plug-in, hereinafter referred to as a technique of the prior art 2).

The integrated circuit (IC) housing portion (corresponding to the supporting member in the prior art 1) for supporting a semiconductor element in the prior art 1 is composed of a thick plastic injection molded article of the prior art. Further, a lead hole for inserting a terminal of the semiconductor element (corresponding to the connection hole of the prior art 1) is formed in the integrated circuit (IC) housing portion. According to the prior art 1, the thickness of the integrated circuit (IC) housing portion is larger than the protruding height of the terminal of the semiconductor element, so that the lower end of the terminal of the semiconductor element cannot protrude through the guide hole and further protrude toward the tester side. Thus, on the tester side, a contact pin in the form of a pogo pin (POGO PIN) that can be inserted into the guide hole is provided.

However, according to the prior art 1, the contact pin or the terminal of the semiconductor element may be damaged due to erroneous contact between the contact pin of the metal material and the terminal of the semiconductor element.

Therefore, recently, a test machine disclosed in Japanese Laid-Open Patent Publication No. 10-2002-0079350 (the title of the invention: "Integrated tantalum contact member and its manufacturing apparatus and manufacturing method", hereinafter referred to as prior art 3) is considered. The tantalum contact having the conductive tantalum portion and the insulating tantalum portion on the side uses a technique of being an electrical contact between the terminal of the semiconductor element and the tester. That is, the 矽 contact member is formed on the test machine side, and the conductive 矽 portion of the 矽 contact member is partially electrically Contact with the terminals of the semiconductor component. At this time, the conductive germanium portion can perform the electrical connection function only when the terminal of the semiconductor element is sufficiently squeezed to about 0.10 to 0.11 mm. This prior art 3 is difficult to apply to the prior art 1 because the amount of protrusion of the conductive 矽 portion of the 矽 contact member is small.

Therefore, a support member (corresponding to the symbol 120 corresponding to the symbol 120 and corresponding to the integrated circuit (IC) housing portion in the prior art 1) for supporting the semiconductor element as disclosed in the prior art 2 is proposed as being independent of the main body of the plug-in. And the technology of making films. Of course, the support member is formed with a connection hole (corresponding to the guide hole of the prior art 1) for setting the precise position of the semiconductor element while opening the terminal of the semiconductor element toward the tester side. In this prior art 2, the lower end of the terminal of the semiconductor element is further protruded toward the tester side through the connection hole. Thereby, the lower end of the terminal of the semiconductor element can apply force to the conductive 矽 portion (named as the contact piece in the prior art 2) of the 矽 contact member (known as the elastic piece in the prior art 2), thereby realizing the terminal of the semiconductor element. Electrically connected to the tester side.

However, since the thickness of the elastic sheet of the prior art 2 is thin, it is possible to cause the frame for fixing the elastic sheet to contact the insert to cause damage of the insert when the semiconductor element is electrically connected to the tester.

Moreover, according to the prior art 2, a threaded bolt is used in order to fix the support member to the insert body, however, in order to fix the support member to the insert body with bolts, the bolt head can only have a lower limit thickness for use in rotating the bolt. Tools (screwdrivers or wrenches, etc.). Moreover, the more prominent the bolt head, the more limited the contact or design between the frame for fixing the elastic sheet.

In order to solve the problems of the prior art 2, the present invention provides a technique for minimizing the thickness of a head portion of a fixing member for fixing a support member to an insert.

In order to achieve the object of solving the above technical problems, an insert for a test sorter according to a first aspect of the present invention includes: a main body formed with an insertion hole for inserting a semiconductor element; and a support member that is inserted and inserted from one side of the insertion hole a semiconductor element in the insertion hole; a fixing member having a pressing portion for fixing the supporting member to the main body by pressing the supporting member toward the main body side; wherein the supporting member is formed There is an opening for opening the terminal of the semiconductor element to the tester side such that the terminal of the semiconductor element supported by the support member is electrically connected to the tester side, and the pressing portion of the fixed member has a tester The thickness of the side protrusion is greater than 0.00 mm and less than 0.25 mm.

The main body is formed with a fixing hole, and the fixing member further includes an insertion portion that is inserted into the fixing hole, so that the pressing portion presses the supporting member toward the main body side.

The support member has a thickness greater than 0.00 mm and less than 0.16 mm.

The thickness of the support member is greater than 0.00 mm and less than 0.05 mm.

The fixing member may be injection molded integrally on the main body, and the pressing portion may be formed by welding.

A predetermined area of the support member at least in one side direction may have a width smaller than a width of the insertion hole to open a part of the terminals of the semiconductor element together to the tester side.

Further, the plug for a test sorter according to the first aspect of the present invention includes: a main body formed with a fixing hole and an insertion hole for inserting the semiconductor element; and a support member inserted from one side of the insertion hole into the a semiconductor element inserted into the hole; a fixing member having a pressing portion for fixing the supporting member to the main body by pressing the supporting member toward the main body side and for inserting an interference hole into the fixing hole The pressing portion is pressed toward the main body side to the insertion portion of the support member.

The fixing hole is open to the outside in at least one other direction in addition to the direction for inserting the insertion portion.

The insertion portion includes: an interference insertion section extending from the pressing portion toward the fixing hole side and being inserted into the fixing hole by interference; a position setting section extending further from the interference insertion section and used And setting a position of the support member; wherein a width of the position setting segment is smaller than a width of the interference insertion segment.

The support member has a thickness greater than 0.00 mm and less than 0.16 mm.

The thickness of the support member is greater than 0.00 mm and less than 0.05 mm.

The fixing member may be injection molded integrally on the main body, and the pressing portion may be formed by welding.

A predetermined area of the support member at least in one side direction has a width smaller than a width of the insertion hole to open a part of the terminals of the semiconductor element to the tester side.

The present invention has the following effects.

First, since the thickness of the extruded portion of the fixed member can be minimized, contact between the insert and the test machine can be prevented and accompanying Damage.

Second, since the fixing holes are also opened to the outside during the semiconductor element test, the phenomenon of the falling off of the fixing member caused by the thermal expansion of the air does not occur.

Third, since the smallest open hole is formed only on the support member, it is possible to achieve an improvement in production efficiency and a decrease in the defective rate.

100, 400‧‧‧ plugin

110‧‧‧ Subject

111‧‧‧Insert control

112‧‧‧Fixed holes

120‧‧‧Support parts

121‧‧‧Open hole

122‧‧‧ Position setting hole

130‧‧‧Fixed parts

131‧‧‧Extrusion section

132‧‧‧ Insertion section

132a‧‧‧ interference insert

132b‧‧‧Location setting section

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view of an insert for a test sorter according to a first embodiment of the present invention.

Figure 2 is a perspective view of a fixing member applied to the insert for the test sorter shown in Figure 1.

Fig. 3 is a view for explaining the plug-in for the test sorter shown in Fig. 1.

Fig. 4 is a schematic perspective view of an insert for a test sorter according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments of the present invention will be described with reference to the accompanying drawings, and the repeated description will be omitted or reduced as much as possible for the sake of brevity.

<First Embodiment>

1 is a schematic perspective view of a plug for a test sorter (hereinafter simply referred to as an insert) 100 according to a first embodiment of the present invention as seen from the lower side.

As shown in FIG. 1, the insert 100 according to the present embodiment includes a main body 110, a support member 120, a fixing member 130, and the like.

The main body 110 is formed with an insertion hole 111 and four fixing holes 112.

The insertion hole 111 is for inserting and mounting a semiconductor element (not shown), and is formed to be open in the vertical direction.

Four fixing holes 112 are used to fix the support member 120, and as shown by a broken line, the four fixing holes 112 form an open structure not only under the insertion for the fixing member 130 but also an open structure above. Since the fixing hole 112 is opened not only to the outside of the fixing member 130 but also to the outside, the fixing member 130 for preventing the interference insertion can be prevented from falling off when the air expands due to the high heat generated in the test. In various embodiments, the fixing hole may be opened to the outside as long as it is at least one side other than the lower side for inserting the fixing member. Here, the fact that the fixing hole is opened to the outside in one direction means that even if the fixing hole is closed by the fixing member below the fixing hole, it can be opened to the outside in the other side direction without causing the fixing hole to be closed. Of course, as described in the illustrated embodiment, when the fixing hole 112 is opened in the up and down direction, the fixing member 130 can be easily removed by using a special pin or the like when the support member 120 is replaced later.

The support member 120 is for supporting the semiconductor element from the lower side of the insertion hole 111 to prevent the semiconductor element mounted in the insertion hole 111 from being detached downward. An opening hole 121 for opening the terminals of the semiconductor element to the tester side on the left and right sides is formed on the support member 120 so that the terminal of the supported semiconductor element is electrically connected to the tester (not shown) side. Here, the support member 120 has a thickness T1 of more than 0.00 mm and less than 0.16 mm so that the terminal lower end of the semiconductor element having the protrusion height of about 0.16 mm can protrude toward the tester side through the open hole 121. Of course, applying the technology of the prior art 3 In the case of the tester, the support member 120 preferably has a thickness T1 of less than 0.05 mm because the lower end of the terminal of the semiconductor element passing through the open hole 121 is pressed into the conductive ridge portion by about 0.10 to 0.11 mm. Of course, although in the present description, the terminal protruding height of the semiconductor element (the height of the solder ball in the case of the ball grid array structure (BGA) type) is taken as an example of 0.16 mm, the protruding height of the semiconductor element may be based on the semiconductor element. Increase or decrease in type.

Further, the support member 120 is formed with four position setting holes 122 for guiding the support member 120 to be coupled to the main body 110 through the fixing member 130 while setting the installation position of the support member 120. Of course, if four or more fixing members 130 are used, the number of position setting holes 122 of the supporting members can be increased in proportion to the number of the fixing members.

Moreover, by making the width W2 of the predetermined region in the front-rear direction of the support member 120 smaller than the width W1 of the insertion hole 111, the terminals located at the front and rear portions of the supported semiconductor element are opened to the tester side together. According to this, it is possible to omit the process of laser processing each of the open holes one by one at the front and rear sides, thereby improving production efficiency, saving cost, and reducing the failure rate. Of course, the position of the semiconductor element can be precisely determined by the open holes 121 formed on the left and right sides.

As shown in FIG. 2, the fixing member 130 is composed of a pressing portion 131 and an insertion portion 132.

The pressing portion 131 is formed in a thin plate shape in order to press the support member 120 toward the main body 110 side. The thickness T2 of such a pressing portion 131 should be greater than 0.00 mm and less than 0.25 mm. This will be described with reference to FIG. 3. As shown in the enlarged view of FIG. 3, in the case where the prior art 3 is applied to the test machine according to the present embodiment When the terminal e of the semiconductor element D is electrically connected to the tester side, the distance between the semiconductor element D and the frame F of the test socket on which the PCR socket is mounted on the test machine becomes 0.30 mm, at this time due to the thickness of the support member 120. T1 is about 0.05 mm, so the thickness T2 of the pressing portion 131 should be less than 0.25 mm. Here, the thickness T2 of the pressing portion 131 can be formed to be less than 0.25 mm because the insertion portion 132 is inserted and fixed by pressing the fixing member 130 without using a tool such as a screwdriver or a wrench in the present embodiment. Since the hole 112 is in a manner, it is not necessary to consider the groove depth of the screwdriver and the rigidity when the wrench is rotated.

When the thickness of the extruded portion is greater than 0.25 mm, the frame of the test socket will collide with the extruded portion, thereby not only damaging the test socket, but also making the contact of the terminal of the semiconductor element and the terminal of the PCR socket unstable, resulting in poor test. .

Here, the thickness of the support member 120 is taken as 0.05 mm, and if the thickness of the support member is further thinned, the thickness of the extruded portion can be further thickened proportionally.

The insertion portion 132 is a portion for insertion into the fixing hole 112, and is divided into an interference insertion portion 132a and a position setting portion 132b.

The interference insertion section 132a extends from the pressing portion 131 toward the fixing hole 112 side, and is inserted into the fixing hole 112 by interference, so that the pressing portion 131 can press the supporting member 120. Therefore, for the interference insertion, it is preferable that the diameter of the fixing hole 112 is smaller than the diameter of the interference insertion portion 132a. Also, the position setting hole 122 of the support member 120 has the same diameter as the fixing hole 112 or substantially the same diameter as the interference insertion portion 132a.

The position setting section 132b sets the position of the support member 120, and the width W4 is smaller than the width W3 of the interference insertion section 132a. Moreover, since the connection portion of the interference insertion portion 132a and the position setting portion 132b is inclined, the accurate position of the support member 120 can be correctly guided when the work of coupling the support member 120 to the main body 110 is performed.

Here, the reason why the insertion portion 132 of the fixing member 130 is divided into the interference insertion portion 132a and the position setting portion 132b at the time of constitution is as follows. If the insertion portion 132 is constituted only by the interference insertion portion 132a, when the position setting hole 122 and the fixing hole 112 of the support member 120 are aligned on the main body 110 to be inserted into the fixing member 130, since the interference insertion alignment is performed, there is It is possible that the fixing member 130 cannot smoothly enter the fixing hole 112, causing a problem in assembly. Therefore, after the support member 120 is placed in the main body 110 in the first step, the fixing member 130 is inserted into the position setting section 132a to determine the position, and then the pressing portion 131 of the fixing member 130 is pressed to fix the support member 120 to the main body 110. At this time, it is more preferable to press and press the pressing portions 131 of the four fixing members 130 at the same time. This is because if the fixing members 130 are separately provided one by one, it is likely that the positions of the supporting members 120 are staggered in the front, rear, left and right directions. That is, the reason is that since the distance between the semiconductor elements is 0.4 mm or less (the distance between the centers of the open holes 121), the terminals of the semiconductor element cannot be accurately placed at the positions of the open holes as long as they are slightly staggered. .

<Second embodiment>

4 is a conceptual side view of an insert 400 in accordance with a second embodiment of the present invention.

In the embodiment, the fixing member 430 and the main body 410 are injection molded into One. Therefore, when the support member 420 is fixed to the main body 410, as shown in FIG. 4(a), after the fixing member 430 is inserted into the position setting hole (not shown) of the support member 420, as shown in FIG. 4(b). The pressing portion 430 is welded to the ground to form the pressing portion 431. Since the rigidity of the screwdriver groove depth or the wrench rotation is not considered at all in this case, it is possible to form a minimum thickness (thickness larger than 0.00 mm and less than 0.25 mm) which satisfies the rigidity condition required for fixing the support member 420. The portion 431 is extruded.

The present invention has been specifically described by the above-described embodiments and with reference to the accompanying drawings. However, the above-described embodiments have been described by merely exemplifying the preferred embodiments of the present invention, and thus the present invention is not limited to the above embodiments. The scope of the invention should be determined by the scope of the invention and its equivalent.

100‧‧‧ plugin

110‧‧‧ Subject

111‧‧‧Insert control

112‧‧‧Fixed holes

121‧‧‧Open hole

122‧‧‧ Position setting hole

130‧‧‧Fixed parts

W1, W2‧‧‧ width

Claims (9)

An insert for a test sorter, comprising: a body formed with an insertion hole for inserting a semiconductor element; a support member from which a semiconductor element inserted in the insertion hole is supported; a fixing member, a pressing portion having the support member fixed to the main body by pressing the support member to the main body side; wherein the support member is formed with an open hole for opening the terminal of the semiconductor element toward the tester side, so that The terminal of the semiconductor element supported by the supporting member is electrically connected to the tester side, and the pressing portion of the fixing member has a thin plate shape which protrudes toward the tester side by a thickness of more than 0.00 mm and less than 0.25 mm. The insert for a test sorter according to claim 1, wherein the main body is formed with a fixing hole, and the fixing member further includes an insertion portion that is inserted into the fixing hole, so that the pressing portion is oriented The main body side presses the support member. An insert for testing a sorting machine, comprising: a body formed with a fixing hole and an insertion hole for inserting a semiconductor element; and a supporting member for supporting a semiconductor element inserted in the insertion hole from a side of the insertion hole a fixing member having a pressing portion for fixing the supporting member to the main body by pressing the supporting member to the main body side and for inserting an interference portion into the fixing hole to press the pressing portion toward the main body side The inserted part of the part. The insert for a test sorter according to claim 2 or 3, wherein the fixing hole is in addition to the direction for inserting the insertion portion, and at least one of He is open to the outside in the direction. The insert for a test sorter according to claim 2 or 3, wherein the insert portion includes: an interference insertion portion extending from the pressing portion toward the fixing hole side, and inserted into the fixing hole by interference a position setting segment extending further from the interference insertion section and configured to set a position of the support member; wherein the width of the position setting segment is smaller than the width of the interference insertion segment. The insert for a test sorter according to claim 1 or 3, wherein the support member has a thickness greater than 0.00 mm and less than 0.16 mm. The insert for a test sorter according to claim 6, wherein the support member has a thickness greater than 0.00 mm and less than 0.05 mm. The insert for a test sorter according to claim 1 or 3, wherein the fixing member is injection-molded integrally with the main body on the main body, and the pressing portion is formed by welding. The insert for a test sorter according to claim 1 or 3, wherein a width in a predetermined region in at least one direction of the support member is smaller than a width of the insertion hole to share a part of the terminals of the semiconductor element Open to the test machine side.