TW201408983A - High-efficiency heat exchanger and high-efficiency heat exchange method - Google Patents

High-efficiency heat exchanger and high-efficiency heat exchange method Download PDF

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Publication number
TW201408983A
TW201408983A TW102118747A TW102118747A TW201408983A TW 201408983 A TW201408983 A TW 201408983A TW 102118747 A TW102118747 A TW 102118747A TW 102118747 A TW102118747 A TW 102118747A TW 201408983 A TW201408983 A TW 201408983A
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Taiwan
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heat
heat exchange
heat exchanger
exchange fluid
flow path
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TW102118747A
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Chinese (zh)
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Yoichi Kimura
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Shikoku Instrumentation Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24VCOLLECTION, PRODUCTION OR USE OF HEAT NOT OTHERWISE PROVIDED FOR
    • F24V30/00Apparatus or devices using heat produced by exothermal chemical reactions other than combustion
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D5/00Devices using endothermic chemical reactions, e.g. using frigorific mixtures
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/40Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/02Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
    • F28F19/04Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of rubber; of plastics material; of varnish
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/02Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
    • F28F19/06Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of metal
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0022Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for chemical reactors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0042Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for foodstuffs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/005Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for medical applications
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/089Coatings, claddings or bonding layers made from metals or metal alloys

Abstract

To provide a high-efficiency heat exchanger which can be applied to a high-purity fluid to be subjected to heat exchange. A heat exchanger is provided with a flow passage through which fluid to be subjected to heat exchange flows and a heat transmission structure which is in contact with the fluid to be subjected to heat exchange flowing through the flow passage. The heat exchanger performs heat exchange by heat transfer effected through the contact surface where the fluid to be subjected to heat exchange and the heat transmission structure are in contact with each other. The heat exchanger is characterized in that: (1) the surface of the heat transmission structure, which is in contact with the fluid to be subjected to heat exchange, consists of a material stable against the fluid to be subjected to heat exchange; (2) the heat transmission structure is provided with a heat conduction body, and the heat conduction body consists of a material having a good coefficient of heat conductivity; and (3) the heat conduction body is mounted near the contact surface, which is in contact with the fluid to be subjected to heat exchange, at a position not in contact with the fluid. In the heat exchanger, the efficiency of heat conduction through the surface where the heat transmission structure and the fluid to be subjected to heat exchange are in contact with each other is high.

Description

高效率熱交換器及高效率熱交換方法 High efficiency heat exchanger and high efficiency heat exchange method

本發明係關於一種不限定應用領域之熱交換技術。尤其,於酸或鹼等腐蝕性物質之氣體或液體之熱交換、或對高純度水、製造半導體時之高純度矽化合物等進行溫度控制時較為有用,可實現熱交換時所產生之裝置類之腐蝕或高純度物質之污染之問題之解決及熱交換率之提高。即,本發明可提供一種於必需將物質冷卻、加熱或溫度調節之技術領域整體中裝置之腐蝕、因雜質而引起之污染較少且高效率之熱交換器及熱交換方法。再者,本說明書中,有將不僅加熱源亦包括吸熱源在內稱作「熱源」之情況。又,本說明書中之「流體」中亦包括因加熱或急熱而伴隨相變(例如,自液體向氣體之相變)者。 The present invention relates to a heat exchange technique that does not limit the field of application. In particular, it is useful for heat exchange of a gas or a liquid of a corrosive substance such as an acid or a base, or for high-purity water, a high-purity ruthenium compound for producing a semiconductor, etc., and a device for heat exchange can be realized. The problem of corrosion of corrosive or high-purity substances and the improvement of heat exchange rate. That is, the present invention can provide a heat exchanger and a heat exchange method in which corrosion of a device, contamination due to impurities, and high efficiency are required in the entire technical field where cooling, heating or temperature adjustment of a substance is necessary. Further, in the present specification, there is a case where not only a heat source but also a heat source is referred to as a "heat source". Further, the term "fluid" in the present specification also includes a phase change (for example, a phase change from a liquid to a gas) due to heating or rapid heat.

熱交換器係使溫度不同之2個物體直接或間接地接觸而傳遞熱從而對一方之物體進行加熱或冷卻之裝置,作為鍋爐、蒸氣產生器、食品製造或化學藥品製造、冷藏保管等產業用,使用於冷卻步驟、加熱步驟、冷藏。熱交換器通常係具備對應於被熱交換物質之特性之構造者,例如,作為對氫氟酸、硝酸、硫酸等腐蝕性較大之藥液進行熱交換之藥液用熱交換器,必需使用具有耐化學品性之熱交換器對腐蝕性較高之強酸、強鹼等流體進行加熱及冷卻,於此情形時,具有代表性的是將包含難以被酸或鹼侵蝕之樹脂材料之接觸部材料浸於熱介質中進行熱交換之間接加熱。 The heat exchanger is a device that heats or cools one object by directly or indirectly contacting two objects having different temperatures, and is used as a boiler, a steam generator, a food manufacturing, a chemical manufacturing, a refrigeration storage, and the like. Used in a cooling step, a heating step, and refrigeration. The heat exchanger usually has a structure corresponding to the characteristics of the substance to be exchanged, for example, a heat exchanger for a liquid medicine that exchanges heat with a highly corrosive chemical liquid such as hydrofluoric acid, nitric acid or sulfuric acid, and must be used. The heat exchanger having chemical resistance heats and cools a fluid such as a strong acid or a strong alkali which is highly corrosive, and in this case, a contact portion containing a resin material which is hard to be attacked by an acid or an alkali is representative. The material is immersed in a heat medium for heat exchange between the joints.

圖1係表示代表性之間接熱交換之示意圖,於經樹脂製管1內將被熱交換流體(酸、鹼、水等)自入口2向出口3搬送之期間,藉由利用熱源5調整溫度後之熱介質4,經由樹脂製管1進行熱交換。該方法可藉由增加接觸側之樹脂製管1之表面積,例如加長熱介質4中之管1而增加與熱介質4之接觸面積而提高熱交換效率,但因此,有包含以熱源對流體進行溫度調節之裝置或容器類成為於成本上亦高價之裝置之情況。又,將不經由熱介質而直接進行與熱源之熱交換之直接加熱方式之代表性之例示於圖2中,熱源5與包含相對於被熱交換流體耐蝕性良好之材質且包含溫度特性優異之材料之管1接觸而直接進行熱交換。於任一種方式中,均必需:搬送管等裝置不因被熱交換流體或熱交換介質而腐蝕、於熱交換步驟中不污染被熱交換流體、及熱交換效率良好地進行。 Fig. 1 is a schematic view showing a representative heat exchange between the two, and the temperature is adjusted by the heat source 5 while the heat exchange fluid (acid, alkali, water, etc.) is transferred from the inlet 2 to the outlet 3 through the resin pipe 1. The subsequent heat medium 4 is heat-exchanged via the resin pipe 1. The method can increase the heat exchange efficiency by increasing the surface area of the resin tube 1 on the contact side, for example, lengthening the contact area of the heat medium 4, thereby increasing the heat exchange efficiency, but therefore, including the heat source Temperature-regulating devices or containers are the case for devices that are costly and expensive. Further, a typical example of a direct heating method in which heat exchange with a heat source is directly performed without passing through a heat medium is shown in Fig. 2, and the heat source 5 and the material having good corrosion resistance with respect to the heat exchange fluid are excellent in temperature characteristics. The tube 1 of the material is in direct contact with the heat exchange. In either case, it is necessary that the apparatus such as the transfer pipe is not corroded by the heat exchange fluid or the heat exchange medium, does not contaminate the heat exchange fluid in the heat exchange step, and performs heat exchange efficiently.

因此,為了不使搬送管因熱交換介質或被熱交換流體受到腐蝕等影響,進行有以樹脂或陶瓷類將搬送管被覆保護之措施。例如,提出有一種熱交換用傳熱管(專利文獻1),其係設置於高溫氣體環境中且自上述高溫氣體向傳熱管內之被加熱流體進行熱交換者,被加熱流體流經之管包含耐熱合金,包括介隔熱膨脹緩衝材以包含陶瓷合金複合材料之罩材覆蓋該耐熱合金管之外側之三層構造,構成上述罩材之陶瓷合金複合材料包含Al與AlN,將AlN設為1wt%以上且90wt%以下,(Al+AlN+AlON)之合計比率為50wt%以上且100wt%以下。 Therefore, in order to prevent the transfer tube from being affected by corrosion of the heat exchange medium or the heat exchange fluid, the transfer tube is protected by a resin or a ceramic. For example, there is proposed a heat transfer tube for heat exchange (Patent Document 1) which is disposed in a high-temperature gas environment and exchanges heat from the high-temperature gas to the heated fluid in the heat transfer tube, and the heated fluid flows therethrough. The tube comprises a heat resistant alloy, comprising a heat insulating expansion buffer material, and a cover material comprising the ceramic alloy composite material covers the outer layer of the heat resistant alloy tube. The ceramic alloy composite material constituting the cover material comprises Al and AlN, and the AlN is provided. The total ratio of (Al + AlN + AlON) is 1 wt% or more and 90 wt% or less, and is 50 wt% or more and 100 wt% or less.

已知氟樹脂相對於各種藥劑耐蝕性及耐熱性優異,但若例如僅由氟樹脂構成搬送管,則由於氟樹脂本身原本為熱之不良導體,因此熱交換效率較低,為了達到特定溫度需要較長時間,又,特 定溫度下之溫度控制之精度亦較差,為了改善該等缺點,大量提出有將氟樹脂被膜形成於熱傳導性良好之金屬等之表面之提案。例如,提出有一種氣體使用設備用構件(專利文獻2),其係於基體上具有含有氟樹脂之至少2層之塗膜者,其用作具有塗膜之熱交換器等,該塗膜係隨著自塗裝於基材上之最下層膜至最上層膜,使各層中氟樹脂之含量依次增大且使無機填充劑之含量依次減少;或提出有如下者(專利文獻3):提供一種耐蝕性優異之鋁合金材、及於以具有腐蝕性之流體作為介質之傳熱部使用上述鋁合金材之板狀翼片式熱交換器(plate-fin heat exchanger)、平板式熱交換器,於使用以具有腐蝕性之流體作為介質之傳熱部之板狀翼片式熱交換器、平板式熱交換器等中所使用之鋁合金材表面,具有有機膦酸底層皮膜,進而於其上具有以乾燥後之膜厚計平均厚度為1~100μm之氟樹脂塗料皮膜,使塗膜密接之耐久性提高,製成相對於海水等具有腐蝕性之流體之耐蝕性優異者。如此,通常存在於熱傳導較佳之金屬上進行樹脂塗覆之方法,但由於2種材料之熱膨脹不同,因此有難以應對膨脹收縮而塗覆層剝離之情況,有產生導致金屬部之腐蝕及因金屬類而引起之污染之問題之情況。進而,該方法中,對象流體自樹脂塗覆部之針孔浸透而無法避免相同之問題。 It is known that the fluororesin is excellent in corrosion resistance and heat resistance with respect to various chemicals. However, if the transfer tube is composed of only a fluororesin, the fluororesin itself is originally a poor conductor of heat, so heat exchange efficiency is low, and it is necessary to achieve a specific temperature. For a long time, again, special The accuracy of the temperature control at a constant temperature is also inferior. In order to improve these disadvantages, a proposal has been made to form a fluororesin film on the surface of a metal having good thermal conductivity. For example, there is proposed a member for a gas-using device (Patent Document 2), which is a coating film having at least two layers containing a fluororesin on a substrate, and is used as a heat exchanger having a coating film or the like. With the self-coating of the lowermost film to the uppermost film on the substrate, the content of the fluororesin in each layer is sequentially increased and the content of the inorganic filler is sequentially decreased; or the following is proposed (Patent Document 3): Provided An aluminum alloy material excellent in corrosion resistance and a plate-fin heat exchanger or a flat plate heat exchanger using the aluminum alloy material in a heat transfer portion using a corrosive fluid as a medium An organic phosphonic acid underlayer film on the surface of an aluminum alloy material used in a plate-like fin heat exchanger or a plate heat exchanger using a heat transfer portion having a corrosive fluid as a medium, and further The fluororesin coating film having an average thickness of 1 to 100 μm in terms of the film thickness after drying is used to improve the durability of the coating film in close contact with each other, and is excellent in corrosion resistance against a corrosive fluid such as seawater. Thus, the method of resin coating is usually carried out on a metal having better heat conduction. However, since the thermal expansion of the two materials is different, it is difficult to cope with the expansion and contraction and the coating layer is peeled off, which causes corrosion of the metal portion and metal. The problem of pollution caused by the class. Further, in this method, the target fluid is saturated from the pinhole of the resin coating portion, and the same problem cannot be avoided.

又,有採用熱傳導性及耐蝕性優異之碳之情形。例如,於可使用熱交換器在不使傳熱面變質之情況下將大量含氯之氯化氫水溶液加熱或冷卻之方法中,特徵在於熱交換器之傳熱面包含含浸氟樹脂之碳,且關於該熱交換器,提出有一種塊體式熱交換器,該塊體式熱交換器係於外罩內配置塊體而成,該塊體係包含含浸氟樹脂之碳而成,且設置有供氯化氫水溶液流通之氯化氫水溶液流路、及供熱介質 流通之熱介質流路(專利文獻4)。又,對於接液部能夠以金屬應對之被熱交換物質可使用包含不鏽鋼之熱交換器。然而,存在如下問題:不鏽鋼即便在金屬中熱傳導率亦較低,為了獲得固定之熱交換能力,必需使用容量較大之熱源,從而要求本體之大型化及電力消耗之增大。如此,為了獲得較高之耐蝕性並且使熱交換效率增大,進行有將各種材料用於熱交換器之嘗試,尤其期待開發可應對腐蝕性較高之被熱交換物質之熱交換效率較高之熱交換技術。 Further, there is a case where carbon having excellent thermal conductivity and corrosion resistance is used. For example, in a method in which a heat exchanger can be used to heat or cool a large amount of a chlorine-containing aqueous hydrogen chloride solution without deteriorating a heat transfer surface, characterized in that the heat transfer surface of the heat exchanger contains carbon impregnated with a fluororesin, and In the heat exchanger, there is proposed a block type heat exchanger in which a block body is disposed in a casing, the block system comprising carbon impregnated with a fluororesin and provided with a hydrogen chloride aqueous solution. Hydrogen chloride aqueous solution flow path and heating medium A heat medium flow path that flows (Patent Document 4). Further, a heat exchanger including stainless steel can be used as the heat exchange material that can be treated by the metal in the liquid contact portion. However, there is a problem in that stainless steel has a low thermal conductivity even in a metal, and in order to obtain a fixed heat exchange capacity, it is necessary to use a heat source having a large capacity, thereby requiring an increase in size of the main body and an increase in power consumption. Thus, in order to obtain high corrosion resistance and increase heat exchange efficiency, attempts have been made to use various materials for heat exchangers, and it is particularly desired to develop heat exchange efficiency which is high in corrosion resistance to heat exchange materials. Heat exchange technology.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利第3674401號公報 [Patent Document 1] Japanese Patent No. 3674401

[專利文獻2]日本專利特開2004-283699號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2004-283699

[專利文獻3]日本專利特開2008-156748號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2008-156748

[專利文獻4]日本專利特開2006-289799號公報 [Patent Document 4] Japanese Patent Laid-Open Publication No. 2006-289799

[專利文獻5]日本專利特開平9-280786號公報 [Patent Document 5] Japanese Patent Laid-Open No. Hei 9-280786

本發明係鑒於上述習知技術而提供一種相對於被熱交換流體之熱交換性能及耐蝕性均較高之熱交換器。習知之熱交換器中,於對被熱交換流體進行熱交換時,通常方法係使流體所接觸之構件與熱源、冷媒等熱介質接觸而進行熱交換,但接觸構件之材質係根據流體之特性而選擇。然而,所選擇之接觸構件之材質未必熱傳導優異,於此情形時,例如,有必需藉由使用多數個作為熱源之電熱加熱器或使用容量較大之電熱加熱器以彌補熱傳導較低之構件之缺點之情 況。如此,屢次遇到熱交換中之能源效率較低且機器亦變得大型之情況。 The present invention provides a heat exchanger having high heat exchange performance and corrosion resistance with respect to a heat exchange fluid in view of the above-described conventional techniques. In a conventional heat exchanger, when heat exchange is performed on a heat exchange fluid, a method is generally used to contact a member in contact with a heat medium such as a heat source or a refrigerant to exchange heat, but the material of the contact member is based on the characteristics of the fluid. And choose. However, the material of the selected contact member is not necessarily excellent in heat conduction. In this case, for example, it is necessary to compensate for the component having a lower heat conduction by using a plurality of electric heaters as a heat source or using an electric heater having a large capacity. Disadvantage condition. As a result, the energy efficiency in the heat exchange has been repeatedly encountered and the machine has become large.

本發明之特徵在於:即便於僅注目於被熱交換流體之特性而選擇接觸部之材質之情形時,亦可進行高效率之熱交換;進而,可使裝置不變得大規模,可以低成本製成小型化之製品。本發明之目的在於提供一種可不選擇熱交換對象流體而於廣泛之領域中應用之高效率熱交換器。又,本發明之目的在於提供一種不存在因被熱交換流體而引起之機器之腐蝕,又,不存在經熱交換之流體被污染之情況之熱交換器。進而,本發明提供一種於腐蝕性較強之氟酸或氯化氫等之水溶液或氣體、氫氧化鈉等之鹼水溶液之加熱或冷卻中熱傳導特性優異之熱交換器。又,本發明提供一種可一面維持被熱交換流體之高純度一面進行高效率之熱交換之熱交換技術。 The present invention is characterized in that high-efficiency heat exchange can be performed even when attention is paid to the material of the contact portion by the characteristics of the heat exchange fluid. Further, the device can be made large-scale and low-cost. Made into miniaturized products. SUMMARY OF THE INVENTION An object of the present invention is to provide a high efficiency heat exchanger which can be applied to a wide range of fields without selecting a fluid for heat exchange. Further, it is an object of the present invention to provide a heat exchanger which does not have corrosion of a machine caused by a heat exchange fluid and which is free from contamination by a heat exchange fluid. Further, the present invention provides a heat exchanger which is excellent in heat conduction characteristics in heating or cooling of an aqueous solution or gas such as fluoric acid or hydrogen chloride which is highly corrosive, or an aqueous alkali solution such as sodium hydroxide. Further, the present invention provides a heat exchange technique capable of performing high-efficiency heat exchange while maintaining high purity of a heat exchange fluid.

本發明包括以下所記載之技術性事項。 The present invention includes the technical matters described below.

[1]一種熱交換器,其係具備熱源、與被熱交換流體接觸之熱傳遞構造體、及將來自熱源之熱傳熱至熱傳遞構造體之傳熱構件,且通過被熱交換流體與熱傳遞構造體之接觸面而形成傳熱型熱交換者;其特徵在於:熱傳遞構造體係包括具有流入口、流出口及被熱交換流體流路之本體、以及裝設於本體之多數個熱傳導體,構成與被熱交換流體之接觸面之被熱交換流體流路之內壁面係由相對於被熱交換流體而穩定之材質所形成,熱傳導體係由熱傳導率較本體之材料為佳之材料所形成,熱傳導體係裝設於被熱交換流體流路之附近且不與被熱交換流體產生接觸之位置。 [1] A heat exchanger comprising a heat source, a heat transfer structure in contact with the heat exchange fluid, and a heat transfer member that transfers heat from the heat source to the heat transfer structure, and is exchanged by the heat exchange fluid a heat transfer type heat exchanger formed by a contact surface of the heat transfer structure; wherein the heat transfer structure system includes a body having an inflow port, an outflow port, and a heat exchange fluid flow path, and a plurality of heat conduction devices mounted on the body The inner wall surface of the heat exchange fluid flow path constituting the contact surface with the heat exchange fluid is formed of a material stable with respect to the heat exchange fluid, and the heat conduction system is formed of a material having a thermal conductivity higher than that of the body material. The heat transfer system is installed in the vicinity of the flow path of the heat exchange fluid and is not in contact with the heat exchange fluid.

[2]如[1]之熱交換器,其中,多數個熱傳導體包括夾持被熱交換流 體流路而對向配置之複數個熱傳導體。 [2] The heat exchanger according to [1], wherein the plurality of heat conductors comprise a clamped heat exchange stream A plurality of thermal conductors disposed opposite each other in the body flow path.

[3]如[1]或[2]之熱交換器,其中,傳熱構件係由夾持本體之2個傳熱構件所形成,且自2個傳熱構件各者伸出1個以上之熱傳導體。此處,伸出熱傳導體之態樣中不僅包括傳熱構件與熱傳導體一體地成形之態樣,亦包括於傳熱構件裝設有獨立個體之熱傳導體之態樣。 [3] The heat exchanger according to [1] or [2] wherein the heat transfer member is formed by two heat transfer members that sandwich the body, and one or more of the two heat transfer members extend from each of the two heat transfer members. Thermal conductor. Here, the aspect in which the heat conductor is extended includes not only the aspect in which the heat transfer member and the heat conductor are integrally formed, but also the aspect in which the heat transfer member is provided with a heat conductor of a separate individual.

[4]如[1]或[2]之熱交換器,其中,熱傳導體為具有銷狀之構造者。 [4] The heat exchanger according to [1] or [2] wherein the heat conductor is a pin-shaped structure.

[5]如[4]之熱交換器,其中,多數個熱傳導體之至少一部分係與板狀之傳熱構件一體地形成。 [5] The heat exchanger according to [4], wherein at least a part of the plurality of heat conductors are integrally formed with the plate-shaped heat transfer member.

[6]如[4]之熱交換器,其中,多數個熱傳導體之至少一部分係為具有鋸齒構造之外側面者。較佳為使多數個熱傳導體之過半數為具有鋸齒構造之外側面者。 [6] The heat exchanger according to [4], wherein at least a part of the plurality of heat conductors has a side surface having a sawtooth configuration. Preferably, a majority of the plurality of thermal conductors have a side surface having a sawtooth configuration.

[7]如[6]之熱交換器,其為外側面之表面積係成為當不存在凸部之外側面之情形時之1.5~3倍之鋸齒構造。 [7] The heat exchanger according to [6], wherein the surface area of the outer side surface is 1.5 to 3 times the sawtooth structure when there is no side surface other than the convex portion.

[8]如[6]之熱交換器,其中,具有鋸齒構造之外側面之熱傳導體為螺絲。 [8] The heat exchanger according to [6], wherein the heat conductor having the outer side of the sawtooth structure is a screw.

[9]如[8]之熱交換器,其中,具有鋸齒構造之外側面之熱傳導體為頭部平坦之螺絲。 [9] The heat exchanger according to [8], wherein the heat conductor having the outer side of the sawtooth structure is a screw having a flat head.

[10]如[1]或[2]之熱交換器,其中,被熱交換流體流路具有複數個彎曲部。 [10] The heat exchanger according to [1] or [2] wherein the heat exchange fluid flow path has a plurality of curved portions.

[11]如[10]之熱交換器,其中,被熱交換流體流路具有向流入口側進行方向轉換之折回彎曲部。 [11] The heat exchanger according to [10], wherein the heat exchange fluid flow path has a folded back portion that is directionally shifted toward the inlet side.

[12]如[1]或[2]之熱交換器,其中,配置於距流入口較近之側之熱傳導體之至少一部分係為與配置於距流入口較遠之側之熱傳導體相比 由熱傳導率較高之材料所形成之熱傳導體。此處,所謂距流入口較近之側係指例如流路之全長中距流入口1/2、1/3或1/4,距流入口較遠之側亦相同。 [12] The heat exchanger according to [1] or [2] wherein at least a part of the heat conductor disposed on a side closer to the inlet is compared with a heat conductor disposed on a side farther from the inlet. A heat conductor formed of a material having a high thermal conductivity. Here, the side closer to the inlet means that, for example, the entire length of the flow path is 1/2, 1/3 or 1/4 of the inlet, and the side farther from the inlet is also the same.

[13]如[1]或[2]之熱交換器,其中,與距流入口較遠之側相比,距流入口較近之側熱傳導體之數量較多,且以高密度來加以配置。 [13] The heat exchanger according to [1] or [2], wherein the number of the heat conductors closer to the inlet is larger and is arranged at a higher density than the side farther from the inlet. .

[14]如[12]之熱交換器,其中,流出口係為與外界連通之吐出口。 [14] The heat exchanger according to [12], wherein the outflow port is a discharge port that communicates with the outside.

[15]一種熱交換器,其係由積層複數個如[1]至[13]中任一項之熱交換器而成。 [15] A heat exchanger comprising a plurality of heat exchangers according to any one of [1] to [13].

[16]如[1]或[2]之熱交換器,其中,被熱交換流體流路之內壁面為樹脂。 [16] The heat exchanger according to [1] or [2] wherein the inner wall surface of the heat exchange fluid flow path is a resin.

[17]如[1]或[2]之熱交換器,其中,被熱交換流體流路之內壁面為金屬或碳。 [17] The heat exchanger according to [1] or [2] wherein the inner wall surface of the heat exchange fluid flow path is metal or carbon.

[18]如[1]或[2]之熱交換器,其中,多數個熱傳導體包括由銅所形成之熱傳導體及由鋁所形成之熱傳導體。 [18] The heat exchanger according to [1] or [2], wherein the plurality of heat conductors include a heat conductor formed of copper and a heat conductor formed of aluminum.

[19]如[1]或[2]之熱交換器,其中,熱源為加熱源。 [19] The heat exchanger according to [1] or [2] wherein the heat source is a heat source.

[20]如[1]或[2]之熱交換器,其中,熱源為吸熱源。 [20] The heat exchanger according to [1] or [2] wherein the heat source is a heat absorbing source.

[21]一種熱交換方法,其係為使用如[1]或[2]之熱交換器而與流體來進行傳熱型熱交換。 [21] A heat exchange method for performing heat transfer type heat exchange with a fluid using a heat exchanger such as [1] or [2].

[22]一種熱交換方法,其係為使用如[12]之熱交換器而與流體來進行傳熱型熱交換者,於距流入口較近之側來配置與距流入口較遠之側相比由熱傳導率相對較高之材料所形成之熱傳導體,於距流入口較遠之側來配置與距流入口較近之側相比由熱傳導率相對較低之材料所形成之熱傳導體,藉此抑制於被熱交換流體流路之上游側與下游側所產 生之溫度分佈之不均。 [22] A heat exchange method for heat transfer type heat exchange with a fluid using a heat exchanger according to [12], disposed on a side closer to the flow inlet than on the side farther from the inlet Compared with a heat conductor formed of a material having a relatively high thermal conductivity, a heat conductor formed of a material having a relatively low thermal conductivity is disposed on a side farther from the inlet than a side closer to the inlet. Thereby suppressing the production on the upstream side and the downstream side of the flow path of the heat exchange fluid The temperature distribution of the birth is uneven.

[23]一種熱交換方法,其係為使用如[13]之熱交換器而與流體來進行傳熱型熱交換者,於距流入口較近之側來配置與距流入口較遠之側相比由熱傳導率相對較高之材料所形成之熱傳導體,於距流入口較遠之側來配置與距流入口較近之側相比由熱傳導率相對較低之材料所形成之熱傳導體,藉此抑制於被熱交換流體流路之上游側與下游側所產生之溫度分佈之不均。 [23] A heat exchange method for heat transfer type heat exchange with a fluid using a heat exchanger according to [13], disposed on a side closer to the flow inlet than on the side farther from the flow inlet Compared with a heat conductor formed of a material having a relatively high thermal conductivity, a heat conductor formed of a material having a relatively low thermal conductivity is disposed on a side farther from the inlet than a side closer to the inlet. Thereby, the unevenness of the temperature distribution generated on the upstream side and the downstream side of the heat exchange fluid flow path is suppressed.

[24]一種熱交換方法,其係為使用如[16]之熱交換器而與具有腐蝕性之流體來進行傳熱型熱交換。 [24] A heat exchange method which uses a heat exchanger such as [16] to perform heat transfer type heat exchange with a corrosive fluid.

就其他觀點而言,本發明包括以下所記載之技術性事項。 From other points of view, the present invention includes the technical matters described below.

(1)一種熱傳遞構造體與被熱交換流體接觸之面中之熱傳導效率得以提高之熱交換器,其係具備被熱交換流體之流路、及與流經該流路之被熱交換流體接觸之熱傳遞構造體,且通過被熱交換流體與熱傳遞構造體之接觸面而形成傳熱型熱交換者;其特徵在於:(a)熱傳遞構造體之構成與被熱交換流體之接觸面之表面包含相對於被熱交換流體穩定之材質;(b)於熱傳遞構造體裝設熱傳導體,該熱傳導體包含熱傳導率較熱傳遞構造體之材料良好之材料;(c)熱傳導體係裝設於與被熱交換流體之接觸面之附近且不與被熱交換流體接觸之位置。 (1) A heat exchanger in which a heat transfer structure is improved in heat transfer efficiency in a surface in contact with a heat exchange fluid, which is provided with a flow path of a heat exchange fluid, and a heat exchange fluid flowing through the flow path a heat transfer structure that is in contact with the heat exchange type heat exchanger by a contact surface of the heat exchange fluid and the heat transfer structure; characterized in that: (a) the heat transfer structure is in contact with the heat exchange fluid The surface of the surface includes a material that is stable with respect to the heat exchange fluid; (b) the heat transfer body is provided with a heat conductor comprising a material having a thermal conductivity better than that of the heat transfer structure; (c) a heat transfer system It is disposed near the contact surface with the heat exchange fluid and is not in contact with the heat exchange fluid.

(2)如上述(1)之熱交換器,其中,熱傳導體為具有銷狀之構造者。此處,作為銷狀之構造,例如可列舉圓柱形狀、多角柱形狀,亦包括外側面為鋸齒構造者。 (2) The heat exchanger according to (1) above, wherein the heat conductor is a structure having a pin shape. Here, examples of the pin-shaped structure include a cylindrical shape and a polygonal column shape, and the outer surface is also a sawtooth structure.

(3)如上述(1)或(2)之熱交換器,其中,熱傳導體為具有鋸齒構造之表面者。 (3) The heat exchanger according to (1) or (2) above, wherein the heat conductor is a surface having a sawtooth structure.

(4)如上述(1)至(3)中任一項之熱交換器,其中,熱傳遞構造體之與被熱交換流體之接觸面成為鋸齒構造。 (4) The heat exchanger according to any one of (1) to (3) above, wherein the contact surface of the heat transfer structure with the heat exchange fluid has a sawtooth structure.

(5)如上述(1)至(4)中任一項之熱交換器,其中,被熱交換流體之流路成為使被熱交換流體亂流化而實現熱傳遞率之效率化之折回構造。 (5) The heat exchanger according to any one of (1) to (4), wherein the flow path of the heat exchange fluid is a folded structure that causes the heat exchange fluid to be fluidized to achieve heat transfer efficiency. .

(6)如上述(1)至(5)中任一項之熱交換器,其中,流路構成為可變更口徑及/或全長。 (6) The heat exchanger according to any one of (1) to (5), wherein the flow path is configured to be variable in caliber and/or full length.

(7)如上述(1)至(6)中任一項之熱交換器,其中,被熱交換流體為氣體或液體。 (7) The heat exchanger according to any one of (1) to (6) above wherein the heat exchange fluid is a gas or a liquid.

(8)如上述(1)至(7)中任一項之熱交換器,其中,熱傳遞構造體之材料為樹脂或金屬。 (8) The heat exchanger according to any one of (1) to (7) above, wherein the material of the heat transfer structure is a resin or a metal.

(9)如上述(1)至(8)中任一項之熱交換器,其中,熱傳導體為熱傳導率較熱傳遞構造體之材料良好之金屬。 (9) The heat exchanger according to any one of the above (1) to (8) wherein the heat conductor is a metal having a thermal conductivity higher than that of the heat transfer structure.

(10)一種熱交換方法,其係使熱傳遞構造體與被熱交換流體接觸而通過被熱交換流體與熱傳遞構造體之接觸面進行傳熱型熱交換者,其特徵在於藉由如下操作而提高熱傳遞構造體與被熱交換流體接觸之面中之熱傳導效率:(a)熱傳遞構造體之構成與被熱交換流體之接觸面之表面包含相對於被熱交換流體穩定之材質;(b)於熱傳遞構造體裝設熱傳導體,該熱傳導體包含熱傳導率較熱傳遞構造體之材料良好之材料;(c)熱傳導體係裝設於與被熱交換流體之接觸面之附近且不與被熱 交換流體接觸之位置。 (10) A heat exchange method in which a heat transfer structure is brought into contact with a heat exchange fluid and heat exchange type heat exchange is performed by a contact surface of a heat exchange fluid and a heat transfer structure, which is characterized by the following operation And improving the heat transfer efficiency of the heat transfer structure in contact with the heat exchange fluid: (a) the surface of the heat transfer structure and the surface of the contact surface of the heat exchange fluid contain a material that is stable with respect to the heat exchange fluid; b) mounting a heat conductor on the heat transfer structure, the heat conductor comprising a material having a thermal conductivity better than that of the heat transfer structure; (c) the heat transfer system being disposed adjacent to the contact surface with the heat exchange fluid and not Being heated Exchange the location of the fluid contact.

(11)如上述(10)之熱交換方法,其中,熱傳導體為具有銷狀之構造者。 (11) The heat exchange method according to (10) above, wherein the heat conductor is a structure having a pin shape.

(12)如上述(10)或(11)之熱交換方法,其中,熱傳導體為具有鋸齒構造之表面者。 (12) The heat exchange method according to (10) or (11) above, wherein the heat conductor is a surface having a sawtooth structure.

(13)如上述(10)至(12)中任一項之熱交換方法,其中,熱傳遞構造體之與被熱交換流體之接觸面成為鋸齒構造。 (13) The heat exchange method according to any one of (10) to (12) above, wherein the contact surface of the heat transfer structure with the heat exchange fluid has a sawtooth structure.

(14)如上述(10)至(13)中任一項之熱交換方法,其中,被熱交換流體之流路成為使被熱交換流體亂流化而實現熱傳遞率之效率化之折回構造。 (14) The heat exchange method according to any one of the above (10) to (13), wherein the flow path of the heat exchange fluid is a folded structure that causes the heat exchange fluid to be fluidized to achieve heat transfer rate efficiency .

(15)如上述(10)至(14)中任一項之熱交換方法,其中,流路構成為可變更口徑及/或全長。 (15) The heat exchange method according to any one of (10) to (14) above, wherein the flow path is configured to be variable in caliber and/or full length.

(16)如上述(10)至(15)中任一項之熱交換方法,其中,被熱交換流體為氣體或液體。 (16) The heat exchange method according to any one of (10) to (15) above, wherein the heat exchange fluid is a gas or a liquid.

(17)如上述(10)至(16)中任一項之熱交換方法,其中,熱傳遞構造體之材料為樹脂或金屬。 (17) The heat exchange method according to any one of (10) to (16) above, wherein the material of the heat transfer structure is a resin or a metal.

(18)如上述(10)至(17)中任一項之熱交換方法,其中,熱傳導體為熱傳導率較熱傳遞構造體之材料良好之金屬。 (18) The heat exchange method according to any one of the above (10) to (17) wherein the heat conductor is a metal having a thermal conductivity higher than that of the heat transfer structure.

根據本發明可發揮以下所記載之效果。由於酸、鹼類相對於金屬會激烈地反應,因此於其接觸部無法使用金屬。因此,習知係使用於接觸部使用樹脂之熱交換器,但由於熱傳導率較低,因此熱效率較差,作為裝置之構成亦大幅地變得複雜。根據本發明,可提供一種熱交換效率較高且小型化之構造之熱交換器,又,由於避免了熱 交換器與酸或鹼等被熱交換流體之反應,因此高純度之酸、鹼等之溫度調整可不因微量成分而被污染地進行。又,即便對於高純度水等酸、鹼以外之物質,亦可無關於液狀、氣體狀等其形態而應用。進而,本發明可提供一種藉由運用流體力學與熱力學並採用直接加熱方式,即便於使與被熱交換流體之接觸部全部為樹脂製之情形時,亦省電力且省空間,且轉換效率較佳之熱交換技術。又,即便為使與被加熱流體之接觸部為無金屬而直接進行熱交換之構成,亦可實現80%以上之熱交換能力,由此亦可認為本發明可提供一種具有自習知之技術突出之性能之熱交換器。 According to the present invention, the effects described below can be exhibited. Since acids and bases react violently with respect to metals, metals cannot be used at the contact portions. Therefore, it is conventionally used for a heat exchanger using a resin in a contact portion, but since the thermal conductivity is low, the thermal efficiency is inferior, and the configuration as a device is also greatly complicated. According to the present invention, it is possible to provide a heat exchanger having a high heat exchange efficiency and a miniaturized structure, and further, since heat is avoided Since the exchanger reacts with a heat exchange fluid such as an acid or an alkali, the temperature adjustment of a high-purity acid, alkali, or the like can be carried out without being contaminated by a trace component. Further, even a substance other than an acid or a base such as high-purity water may be applied regardless of the form such as a liquid or a gas. Furthermore, the present invention can provide a power saving and space saving by using fluid mechanics and thermodynamics and using direct heating, even when the contact portions with the heat exchange fluid are all made of resin, and the conversion efficiency is higher. Good heat exchange technology. Further, even if the contact portion with the fluid to be heated is made to be metal-free and directly exchanges heat, 80% or more of heat exchange capacity can be achieved, and it is considered that the present invention can provide a technique which is self-study. Performance heat exchanger.

1‧‧‧樹脂製之管 1‧‧‧Resin tube

2‧‧‧加熱對象物入口 2‧‧‧ heating object entrance

3‧‧‧加熱對象物出口 3‧‧‧ Heating object outlet

4‧‧‧熱介質 4‧‧‧Heat media

5‧‧‧熱源 5‧‧‧heat source

6‧‧‧熱傳遞構造體 6‧‧‧Heat transfer structure

7‧‧‧被熱交換流體流路 7‧‧‧Heat exchange fluid flow path

8‧‧‧連接器 8‧‧‧Connector

9‧‧‧空氣 9‧‧‧ Air

10‧‧‧流量控制機器 10‧‧‧Flow Control Machine

11‧‧‧空氣於水中之起泡裝置 11‧‧‧Foaming device for air in water

12‧‧‧熱交換器 12‧‧‧ heat exchanger

13‧‧‧電熱面板溫度控制.測量裝置 13‧‧‧Electrical panel temperature control. Measuring device

14‧‧‧內部溫度測量裝置 14‧‧‧Internal temperature measuring device

15‧‧‧出口氣體溫度測量裝置 15‧‧‧Export gas temperature measuring device

51、51a、51b‧‧‧加熱板 51, 51a, 51b‧‧‧ heating plate

52、52a、52b‧‧‧傳熱板(傳熱構件) 52, 52a, 52b‧‧‧ heat transfer plates (heat transfer members)

53、53a、53b‧‧‧隔熱材料 53, 53a, 53b‧‧‧Insulation materials

54、54a、54b‧‧‧冷卻板 54, 54a, 54b‧‧‧ Cooling plate

61‧‧‧本體 61‧‧‧Ontology

62、62a、62b‧‧‧熱傳導體 62, 62a, 62b‧‧‧ heat conductor

63‧‧‧接觸面 63‧‧‧Contact surface

71‧‧‧被熱交換流體流路之彎曲部 71‧‧‧Bending of the heat exchange fluid flow path

72‧‧‧被熱交換流體流路之折回彎曲部 72‧‧‧Returned bend of the heat exchange fluid flow path

73‧‧‧被熱交換流體 73‧‧‧Heat exchange fluid

74‧‧‧空隙 74‧‧‧ gap

75‧‧‧吐出口 75‧‧‧Export

81‧‧‧入口連接器(流入口) 81‧‧‧inlet connector (inflow port)

82‧‧‧出口連接器(流出口) 82‧‧‧Export connector (outlet)

83、83a、83b、83c‧‧‧配管 83, 83a, 83b, 83c‧‧‧ piping

101~104‧‧‧熱交換器 101~104‧‧‧ heat exchanger

105‧‧‧附有簇射頭之熱交換器 105‧‧‧ Heat exchanger with showerhead

106‧‧‧冷卻用熱交換器 106‧‧‧Cooling heat exchanger

110‧‧‧調溫供給裝置 110‧‧‧Temperature supply device

111‧‧‧冷卻裝置 111‧‧‧Cooling device

112、112a、112b、113、113a、113b‧‧‧配管 112, 112a, 112b, 113, 113a, 113b‧‧‧ piping

A、B‧‧‧流路系統 A, B‧‧‧ flow system

圖1係表示習知之代表性之藉由間接加熱進行之熱交換之概略圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a conventional heat exchange by indirect heating.

圖2係表示習知之代表性之藉由直接加熱進行之熱交換之概略圖。 Fig. 2 is a schematic view showing a conventional heat exchange by direct heating.

圖3係表示使用複數個獨立之熱傳導體之傳熱型熱交換器之一例之概略剖面圖。 Fig. 3 is a schematic cross-sectional view showing an example of a heat transfer type heat exchanger using a plurality of independent heat conductors.

圖4係表示使複數個熱傳導體與傳熱板為一體之傳熱型熱交換器之一例之概略剖面圖。 Fig. 4 is a schematic cross-sectional view showing an example of a heat transfer type heat exchanger in which a plurality of heat conductors and a heat transfer plate are integrated.

圖5係表示使用具有鋸齒之表面構造之熱傳導體之傳熱型熱交換器之一例之概略剖面圖。 Fig. 5 is a schematic cross-sectional view showing an example of a heat transfer type heat exchanger using a heat conductor having a sawtooth surface structure.

圖6係表示被熱交換流體之流路形成鋸齒之形狀之傳熱型熱交換器之一例之概略剖面圖。 Fig. 6 is a schematic cross-sectional view showing an example of a heat transfer type heat exchanger in which a shape of a sawtooth is formed by a flow path of a heat exchange fluid.

圖7係表示本發明之具體例1之熱交換器之剖面構造之圖,圖7-1表示縱面(垂直方向)之剖面,圖7-2表示平面(水平方向)之剖面。 Fig. 7 is a view showing a cross-sectional structure of a heat exchanger according to a specific example 1 of the present invention, Fig. 7-1 showing a cross section in a vertical plane (vertical direction), and Fig. 7-2 showing a cross section in a plane (horizontal direction).

圖8係表示對熱交換能力進行試驗之裝置之配置之圖。 Fig. 8 is a view showing the configuration of a device for testing the heat exchange capacity.

圖9係進行藉由溫度記錄器之溫度分佈之確認之圖式,於較濃之部分表示設置有熱傳導體而溫度與周圍相比上升。 Fig. 9 is a diagram for confirming the temperature distribution by the temperature recorder, and the thicker portion indicates that the heat conductor is provided and the temperature rises compared with the surroundings.

圖10係表示試驗結果之出口氣體溫度與設定溫度之測定值之關係之圖。 Fig. 10 is a graph showing the relationship between the outlet gas temperature and the measured value of the set temperature in the test results.

圖11係將經由本發明之樹脂之熱交換與經由金屬面之熱交換之熱交換能力進行對比之圖。 Figure 11 is a graph comparing the heat exchange capability of the resin of the present invention with the heat exchange capability via heat exchange through the metal face.

圖12係對被熱交換流體之流路之鋸齒構造進行說明之示意剖面圖,(a)係對使表面積為2倍之情形進行說明之圖,(b)係對間距深度之調節進行說明之圖。 Fig. 12 is a schematic cross-sectional view for explaining a sawtooth structure of a flow path of a heat exchange fluid, wherein (a) is a view for explaining a case where the surface area is twice, and (b) is a description for adjusting the pitch depth. Figure.

圖13係表示熱傳導體之配置變化之概略剖面圖。(a)係自上方伸出夾持被熱交換流體流路之2根熱傳導體之配置例。(b)係自上方及下方伸出夾持被熱交換流體流路之2根熱傳導體之配置例。(c)係自上方及下方伸出夾持被熱交換流體流路之4根熱傳導體之配置例。(d)係於(a)之熱傳導體之配置例中將熱傳導體之外側面設為鋸齒構造之構成例。(e)係於(b)之熱傳導體之配置例中將熱傳導體之外側面設為鋸齒構造之構成例。(f)係於(c)之熱傳導體之配置例中將熱傳導體之外側面設為鋸齒構造之構成例。 Fig. 13 is a schematic cross-sectional view showing a change in arrangement of a heat conductor. (a) An arrangement example in which two heat conductors sandwiching a heat exchange fluid flow path are protruded from above. (b) An arrangement example in which two heat conductors sandwiching the heat exchange fluid flow path are protruded from above and below. (c) An arrangement example in which four heat conductors sandwiching the heat exchange fluid flow path are protruded from above and below. (d) In the arrangement example of the heat conductor of (a), a configuration example in which the outer surface of the heat conductor is a sawtooth structure is used. (e) In the arrangement example of the heat conductor of (b), a configuration example in which the outer surface of the heat conductor is a sawtooth structure is used. (f) In the arrangement example of the heat conductor of (c), a configuration example in which the outer surface of the heat conductor is a sawtooth structure is used.

圖14係於圖13中將傳熱板與複數個熱傳導體一體地成形之構成例。(a)係自上方伸出夾持被熱交換流體流路之2根熱傳導體之配置例。(b)係自上方及下方伸出夾持被熱交換流體流路之2根熱傳導體之配置例。(c)係自上方及下方伸出夾持被熱交換流體流路之4根熱傳導體之配置例。(d)係於(a)之熱傳導體之配置例中將熱傳導體之外側面設為鋸齒構造之構成例。(e)係於(b)之熱傳導體之配置例中將熱傳導體之外側面設為鋸齒構造之構成例。(f)係於(c)之熱傳導體之配置例中將熱 傳導體之外側面設為鋸齒構造之構成例。 Fig. 14 is a view showing an example of a configuration in which a heat transfer plate and a plurality of heat conductors are integrally formed in Fig. 13; (a) An arrangement example in which two heat conductors sandwiching a heat exchange fluid flow path are protruded from above. (b) An arrangement example in which two heat conductors sandwiching the heat exchange fluid flow path are protruded from above and below. (c) An arrangement example in which four heat conductors sandwiching the heat exchange fluid flow path are protruded from above and below. (d) In the arrangement example of the heat conductor of (a), a configuration example in which the outer surface of the heat conductor is a sawtooth structure is used. (e) In the arrangement example of the heat conductor of (b), a configuration example in which the outer surface of the heat conductor is a sawtooth structure is used. (f) heat is applied to the arrangement of the heat conductor of (c) The outer surface of the conductor is a configuration example of a sawtooth structure.

圖15係對配置不同材質之熱傳導體之情形時之溫度分佈進行說明之圖,(a)係配置相同種類之熱傳導體之情形時之俯視圖與溫度分佈圖,(b)係裝設不同材質之熱傳導體之情形時之俯視圖與溫度分佈圖。 Fig. 15 is a view for explaining a temperature distribution in a case where heat conductors of different materials are arranged, (a) a plan view and a temperature profile when the same type of heat conductor is disposed, and (b) a different material. Top view and temperature profile for the case of a thermal conductor.

圖16係於上游側與下游側以不同密度配置有熱傳導體之熱交換器之俯視圖。 Fig. 16 is a plan view showing a heat exchanger in which heat conductors are disposed at different densities on the upstream side and the downstream side.

圖17係表示本發明之附有簇射頭之熱交換器之剖面構造之圖,(a)表示平面(水平方向)之剖面,(b)表示縱面(垂直方向)之剖面。 Fig. 17 is a view showing a cross-sectional structure of a heat exchanger with a shower head according to the present invention, wherein (a) shows a cross section in a plane (horizontal direction), and (b) shows a cross section in a vertical plane (vertical direction).

圖18係積層圖7所示之熱交換器而製成多段構成之熱交換器之情形時之側視圖。 Fig. 18 is a side view showing a state in which a heat exchanger shown in Fig. 7 is laminated to form a heat exchanger having a plurality of stages.

圖19係本發明之具體例2之調溫供給裝置之構成圖。 Fig. 19 is a view showing the configuration of a temperature adjustment supply device according to a second specific example of the present invention.

本發明係關於一種熱傳遞構造體與被熱交換流體接觸之面中之熱傳導效率得以提高之熱交換器及熱交換方法,該熱交換器係具備被熱交換流體通過之通路、及與通過該通路之被熱交換流體接觸之熱傳遞構造體,且通過被熱交換流體與熱傳遞構造體之接觸面而形成傳熱型熱交換者;其特徵在於:(1)熱傳遞構造體之構成與被熱交換流體之接觸面之表面包含相對於被熱交換流體穩定之材質;(2)於熱傳遞構造體裝設熱傳導體,該熱傳導體包含熱傳導率較熱傳遞構造體之材料良好之材料;(3)熱傳導體係裝設於與被熱交換流體之接觸面之附近且不與被熱交換流體接觸之位置。 The present invention relates to a heat exchanger and a heat exchange method in which heat transfer efficiency in a surface in contact with a heat exchange fluid is improved, the heat exchanger having a passage through which a heat exchange fluid passes, and passing through the passage a heat transfer structure in contact with the heat exchange fluid, and a heat transfer type heat exchanger formed by a contact surface of the heat exchange fluid and the heat transfer structure; wherein: (1) the heat transfer structure is configured The surface of the contact surface of the heat exchange fluid includes a material that is stable with respect to the heat exchange fluid; (2) the heat transfer body is provided with a heat conductor, and the heat conductor includes a material having a thermal conductivity better than that of the heat transfer structure; (3) The heat transfer system is installed in the vicinity of the contact surface with the heat exchange fluid and is not in contact with the heat exchange fluid.

本發明可實現:於包含不與被熱交換流體互相影響之材質(材料) 之熱傳遞構造體,將包含熱傳導率較熱傳遞構造體(尤其是與被熱交換流體接觸之部分)之材料良好之材料之熱傳導體裝設於不與流體接觸之位置,藉由對熱傳遞用構造體進行加熱或冷卻,使來自熱源之熱傳遞至被熱交換流體,藉此效率良好地對流體進行加熱、冷卻。 The invention can realize: comprising materials (materials) which do not interact with the heat exchange fluid a heat transfer structure in which a heat conductor including a material having a thermal conductivity higher than that of a heat transfer structure (particularly a portion in contact with a heat exchange fluid) is placed at a position not in contact with a fluid, by heat transfer The structure is heated or cooled to transfer heat from the heat source to the heat exchange fluid, thereby efficiently heating and cooling the fluid.

通常,對於利用熱交換器進行加熱或冷卻之被熱交換流體將具有各種特性之液體或氣體作為對象。例如,酸或鹼之水溶液被用於化學反應或蝕刻處理等,但由於該等相對於金屬會激烈地反應,因此多數情況下於與酸或鹼之接觸部無法使用金屬。具有此種反應性之被熱交換流體之熱交換中所使用之熱交換器中有使用樹脂之製品,但由於樹脂之熱傳導率較低,因此多數情況下熱交換之效率較差,必需之電力亦變大且其形狀構造亦大幅地變得複雜。本發明之熱交換器係採用直接加熱方式,構成與被熱交換流體之接觸面之表面若為包含相對於被熱交換流體穩定之材質者則無限制,例如雖然接觸部全部為樹脂,但亦可提供省電力且省空間、熱效率為80%以上之效率較佳之熱交換。 Generally, a liquid or gas having various characteristics is targeted to a heat exchange fluid that is heated or cooled by a heat exchanger. For example, an aqueous solution of an acid or a base is used for a chemical reaction or an etching treatment, etc., but since these react violently with respect to a metal, in many cases, a metal cannot be used in contact with an acid or a base. The heat exchanger used in the heat exchange of the heat exchange fluid having such reactivity has a resin-based product, but since the thermal conductivity of the resin is low, the heat exchange efficiency is inferior in many cases, and the necessary electric power is also It becomes large and its shape configuration is greatly complicated. The heat exchanger of the present invention adopts a direct heating method, and the surface constituting the contact surface with the heat exchange fluid is not limited as long as it contains a material which is stable with respect to the heat exchange fluid. For example, although the contact portion is entirely resin, It can provide energy-saving and space-saving, heat efficiency of 80% or more with better heat exchange.

[被熱交換流體] [heat exchange fluid]

作為本發明中之被熱交換流體,並無特別限定,例如可列舉鹽酸、硫酸、硝酸、鉻酸、磷酸、氟酸、乙酸、過氯酸、氫溴酸、氟化矽酸、硼酸等具有腐蝕性之酸類、氨、氫氧化鉀、氫氧化鈉等鹼類、及氯化矽等金屬鹽類等之溶液或氣體,進而可列舉高純度水。該等被熱交換流體係用作與其他物質之反應原料或蝕刻液等反應步驟中所使用之藥液者,利用熱交換器調整為適度之溫度而有目的地使用。本發明之熱交換器可以高效率且於不存在微量雜質之污染之狀態下對該等被熱交 換流體進行加熱、冷卻或溫度控制。 The heat exchange fluid in the present invention is not particularly limited, and examples thereof include hydrochloric acid, sulfuric acid, nitric acid, chromic acid, phosphoric acid, hydrofluoric acid, acetic acid, perchloric acid, hydrobromic acid, fluorinated acid, and boric acid. Examples of the solution or gas such as a corrosive acid, an alkali such as ammonia, potassium hydroxide or sodium hydroxide, and a metal salt such as cerium chloride include high purity water. These heat exchange fluid systems are used as a chemical liquid used in a reaction step with other materials, such as a reaction material or an etching solution, and are used purposefully by a heat exchanger to adjust to a moderate temperature. The heat exchanger of the present invention can be heat-treated in a state of high efficiency and in the absence of contamination of trace impurities. Change fluid for heating, cooling or temperature control.

[熱傳遞構造體] [heat transfer structure]

本發明之熱傳遞構造體具有成為與被熱交換流體之接觸面之表面、及熱傳導體。與被熱交換流體接觸之熱傳遞構造體之接觸面包含相對於被熱交換流體穩定之材質。即,選擇於進行熱交換之溫度區域中熱傳遞構造體之表面與被熱交換流體不產生反應之材質或熱傳遞構造體之成分不會自表面溶出之材質。被熱交換流體之反應性(腐蝕性)根據熱傳遞構造體之表面之材質及接觸溫度等而不同,又,根據被熱交換流體之用途、性狀,熱交換後之純度之容許範圍亦不同,因此不可一概而定。例如,由於半導體裝置之製造中所使用之金屬鹵化物或蝕刻劑中要使用高純度之物質,因此不允許因熱交換處理而引起之純度之降低。然而,若為渦輪機用之熱交換器,則多數情況下因熱交換處理而引起之被熱交換流體之純度之變化不成問題。 The heat transfer structure of the present invention has a surface to be in contact with the heat exchange fluid and a heat conductor. The contact surface of the heat transfer structure in contact with the heat exchange fluid contains a material that is stable with respect to the heat exchange fluid. That is, it is selected that the surface of the heat transfer structure in the temperature region where heat exchange is performed does not react with the material to be exchanged by the heat exchange fluid or the material of the heat transfer structure does not elute from the surface. The reactivity (corrosiveness) of the heat exchange fluid varies depending on the material of the surface of the heat transfer structure, the contact temperature, and the like, and the allowable range of purity after heat exchange varies depending on the use and properties of the heat exchange fluid. Therefore, it cannot be determined by all. For example, since a high-purity substance is used in a metal halide or an etchant used in the manufacture of a semiconductor device, a decrease in purity due to heat exchange treatment is not allowed. However, in the case of a heat exchanger for a turbine, the change in the purity of the heat exchange fluid caused by the heat exchange treatment is not a problem in many cases.

作為成為與被熱交換流體接觸之熱傳遞構造體之表面之構件之材質(材料),可自鐵、碳鋼、不鏽鋼、鋁、鈦等金屬類、氟樹脂、聚酯等合成樹脂類、陶瓷類等中適當選擇而使用,但於對腐蝕性較強之酸類進行熱交換之情形時,較佳為氟樹脂。作為氟樹脂,例如可例示聚四氟乙烯(PTFE)、四氟乙烯-全氟烷基乙烯基醚共聚合體(PFA)、四氟乙烯-六氟丙烯共聚合體(FEP)、聚氯三氟乙烯(PCTFE)、乙烯-氯三氟乙烯共聚合體(ECTFE)、四氟乙烯-乙烯共聚合體(ETFE)、聚氟乙烯(PVF)、氟化聚丙烯(FLPP)、聚偏二氟乙烯(PVDF)等。 The material (material) which is a member of the surface of the heat transfer structure that is in contact with the heat exchange fluid can be made of a metal such as iron, carbon steel, stainless steel, aluminum or titanium, a synthetic resin such as a fluororesin or a polyester, or a ceramic. It is preferably used in the class or the like, but in the case of heat exchange with a highly corrosive acid, a fluororesin is preferred. Examples of the fluororesin include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), and polychlorotrifluoroethylene. (PCTFE), ethylene-chlorotrifluoroethylene copolymer (ECTFE), tetrafluoroethylene-ethylene copolymer (ETFE), polyvinyl fluoride (PVF), fluorinated polypropylene (FLPP), polyvinylidene fluoride (PVDF) Wait.

本發明之熱交換器之熱傳遞構造體於內部具備熱傳導體,熱傳導體包含熱傳導率較熱傳遞構造體(尤其是與被熱交換流體接 觸之部分)之材料良好之材料,並且裝設於與被熱交換流體之接觸面(被熱交換流體流路)之附近且不與被熱交換流體接觸之位置。對於熱傳遞構造體,一面參照圖3一面對其一例說明其構造。圖3之熱交換器101具備具有本體61之熱傳遞構造體6、熱傳導體62、成為熱源之加熱板51、傳熱板52a、52b、及被熱交換流體流路7,來自加熱板51之熱經由傳熱板52a、52b擴散至熱傳遞構造體6(本體61及熱傳導體62)。藉由所擴散之熱,本體61及熱傳導體62被加熱,同時,熱通過接觸面63對通過流路7之被熱交換流體進行加熱。圖3中之虛線箭頭表示熱自本體61傳遞之情況。由於熱傳導體62之熱傳導率較本體61之材料良好,因此與本體61相比溫度可更快地上升而效率良好地進行向被熱交換流體之熱交換。熱傳導體62係埋入本體61而與傳熱板52a或加熱板51接觸。對於進行高效之熱交換而言,較佳為熱傳導體62與流路7儘可能地接近。就保養性之觀點而言,流路7之內壁面較佳為設為不存在凹凸之平面或曲面,但就提高熱交換能力之觀點而言,較佳為設為鋸齒構造。 The heat transfer structure of the heat exchanger of the present invention has a heat conductor inside, and the heat conductor includes a heat transfer structure (especially with a heat exchange fluid) The material of the touch is a good material and is installed in the vicinity of the contact surface with the heat exchange fluid (by the heat exchange fluid flow path) and not in contact with the heat exchange fluid. The structure of the heat transfer structure will be described with reference to Fig. 3 as an example. The heat exchanger 101 of Fig. 3 includes a heat transfer structure 6 having a body 61, a heat conductor 62, a heating plate 51 serving as a heat source, heat transfer plates 52a and 52b, and a heat exchange fluid flow path 7 from the heating plate 51. Heat is diffused to the heat transfer structure 6 (the body 61 and the heat conductor 62) via the heat transfer plates 52a and 52b. The body 61 and the heat conductor 62 are heated by the heat of diffusion, and heat is heated by the heat exchange fluid passing through the flow path 7 through the contact surface 63. The dotted arrow in Fig. 3 indicates the case where heat is transferred from the body 61. Since the thermal conductivity of the heat conductor 62 is better than that of the body 61, the temperature can be raised faster than the body 61, and heat exchange to the heat exchange fluid can be performed efficiently. The heat conductor 62 is embedded in the body 61 and is in contact with the heat transfer plate 52a or the heating plate 51. For efficient heat exchange, it is preferred that the heat conductor 62 and the flow path 7 are as close as possible. From the viewpoint of the maintenance property, the inner wall surface of the flow path 7 is preferably a flat surface or a curved surface where no unevenness is present, but from the viewpoint of improving heat exchange capability, it is preferably a sawtooth structure.

如圖3所示,圓柱狀之熱傳導體62可藉由單個地插入至設於本體61之孔而設置。又,如圖4所示,藉由使傳熱板52與複數個熱傳導體62一體地成形且將熱傳導體62插入至設置於本體61之孔而設置。熱傳導體62之設置位置及設置數量係考慮熱交換之效率等而決定。又,可藉由增大熱傳導體62之表面積而使來自熱傳導體62之熱之擴散均勻地且高效率地進行。對於擴大表面積,較佳為如圖5所示般使熱傳導體62之外側面為鋸齒構造。換言之,較佳為設為於熱傳導體62之外表面之長度方向上環狀之山連續之構造(即,山與谷交替地連續之構造)。此處所言之環狀之山連續之構造亦包括如螺紋齒及 槽般螺旋狀地形成齒及槽之情形。更佳為以熱傳導體62之外側面之表面積成為不存在山(凸部)之同徑之圓柱體之外側面之表面積之例如1.5~3倍之方式形成鋸齒構造。鋸齒構造之熱傳導體62之設置於本體61為樹脂製時可藉由於樹脂之硬化前之柔軟狀態時進行設置之後硬化、或於樹脂之硬化後利用鑽孔器等打孔而將鋸齒構造之熱傳導體用力擰入等進行。將本體61設為金屬之情形時係以打孔加工為主。 As shown in FIG. 3, the cylindrical heat conductor 62 can be disposed by being individually inserted into a hole provided in the body 61. Further, as shown in FIG. 4, the heat transfer plate 52 is integrally formed with a plurality of heat conductors 62, and the heat conductor 62 is inserted into a hole provided in the body 61. The installation position and the number of the heat conductors 62 are determined in consideration of the efficiency of heat exchange and the like. Further, the diffusion of heat from the heat conductor 62 can be uniformly and efficiently performed by increasing the surface area of the heat conductor 62. For the enlarged surface area, it is preferable that the outer surface of the heat conductor 62 has a sawtooth structure as shown in FIG. In other words, it is preferable to adopt a structure in which a mountain having a ring shape in the longitudinal direction of the outer surface of the heat conductor 62 is continuous (that is, a structure in which mountains and valleys are alternately continuous). The continuous structure of the Ring Mountain here also includes such as threaded teeth and The case where the teeth and the grooves are formed in a spiral shape like a groove. More preferably, the sawtooth structure is formed such that the surface area of the outer surface of the heat conductor 62 becomes, for example, 1.5 to 3 times the surface area of the outer surface of the cylinder having the same diameter as the mountain (protrusion). The heat conductor 62 having a sawtooth structure is provided when the body 61 is made of a resin, and can be hardened by being placed in a soft state before curing of the resin, or hardened by a drill or the like after the resin is hardened, and the heat conduction of the sawtooth structure is performed. The body is screwed in and the like. When the body 61 is made of metal, the punching process is mainly used.

圖13係表示熱傳導體62之配置變化之概略剖面圖。(a)係自上方伸出夾持被熱交換流體流路7之2根熱傳導體62之配置例。(b)係自上方及下方伸出夾持被熱交換流體流路7之2根熱傳導體62之配置例。(c)係自上方及下方伸出夾持被熱交換流體流路7之4根熱傳導體62之配置例。(d)係於(a)之熱傳導體62之配置例中將熱傳導體62之外側面設為鋸齒構造之構成例。(e)係於(b)之熱傳導體62之配置例中將熱傳導體62之外側面設為鋸齒構造之構成例。(f)係於(c)之熱傳導體62之配置例中將熱傳導體62之外側面設為鋸齒構造之構成例。於圖13(a)至(f)之任一構成中,均為數根熱傳導體62夾持被熱交換流體流路7而對向配置。 Fig. 13 is a schematic cross-sectional view showing a change in arrangement of the heat conductor 62. (a) is an arrangement example in which two heat conductors 62 sandwiching the heat exchange fluid flow path 7 are protruded from above. (b) An arrangement example in which two heat conductors 62 sandwiching the heat exchange fluid flow path 7 are protruded from above and below. (c) An arrangement example in which four heat conductors 62 sandwiching the heat exchange fluid flow path 7 are protruded from above and below. (d) In the arrangement example of the heat conductor 62 of (a), a configuration example in which the outer surface of the heat conductor 62 is a sawtooth structure is used. (e) In the arrangement example of the heat conductor 62 of (b), a configuration example in which the outer surface of the heat conductor 62 is a sawtooth structure is used. (f) In the arrangement example of the heat conductor 62 of (c), a configuration example in which the outer surface of the heat conductor 62 is a sawtooth structure is used. In any of the configurations of FIGS. 13(a) to (f), a plurality of heat conductors 62 are sandwiched by the heat exchange fluid flow path 7 and disposed opposite to each other.

於圖13(a)至(f)之任一構成中,均具備有加熱板51a及51b、傳熱板52a及52b、本體61、及被熱交換流體流路7。該等要素除加熱板為2片之方面以外,為與圖3及圖5之熱交換器101相同之構成,因此省略說明。再者,於圖13(a)及(d)中,亦可不設置下方之加熱板51b。 In any of the configurations of FIGS. 13(a) to (f), the heating plates 51a and 51b, the heat transfer plates 52a and 52b, the main body 61, and the heat exchange fluid flow path 7 are provided. These elements have the same configuration as the heat exchanger 101 of FIGS. 3 and 5 except that the heating plate has two sheets, and thus the description thereof is omitted. Further, in FIGS. 13(a) and (d), the lower heating plate 51b may not be provided.

圖14係於圖13中將傳熱板52與複數個熱傳導體62一體地成形之構成例。於圖14(a)至(f)之任一構成中,均為複數根熱傳導體62夾持被熱交換流體流路7而對向配置。除將傳熱板52與複數個 熱傳導體62一體地成形之方面以外,為與圖4及圖13相同之構成,因此省略說明。 Fig. 14 is a view showing an example of a configuration in which the heat transfer plate 52 and the plurality of heat conductors 62 are integrally formed in Fig. 13 . In any of the configurations of FIGS. 14(a) to (f), the plurality of heat conductors 62 are sandwiched by the heat exchange fluid flow path 7 and disposed opposite to each other. In addition to the heat transfer plate 52 and a plurality of The heat conductors 62 are formed in the same manner as those of FIGS. 4 and 13 except that they are integrally formed, and thus the description thereof is omitted.

圖15係對配置不同材質之熱傳導體之情形時之溫度分佈進行說明之圖,(a)係配置相同種類之熱傳導體62之情形時之俯視圖與溫度分佈圖,(b)係裝設不同材質之熱傳導體62之情形時之俯視圖與溫度分佈圖。於圖15(a)及圖15(b)之任一熱交換器104中,均於傳熱板52及本體61(未圖示)以大致相等間隔設置有用以插入熱傳導體62之135個安裝孔。各熱傳導體62裝卸自由地裝設於傳熱板52及本體61之安裝孔。例如,既可藉由頭部平坦之螺絲構成各熱傳導體62,螺合於安裝孔而裝設。亦可組合包含數種材質之熱傳導體62而構成多數個熱傳導體62。藉由組合包含數種材質之熱傳導體62,可消除流路7之上游側與下游側所產生之溫度分佈不均。又,藉由將包含高價之材質之熱傳導體62僅配置於必需之位置且於其他位置配置包含廉價之材質之熱傳導體62,可降低製造成本。 Fig. 15 is a view for explaining a temperature distribution in a case where heat conductors of different materials are arranged, (a) a plan view and a temperature profile when the same type of heat conductor 62 is disposed, and (b) a different material. The top view and temperature profile of the case of the thermal conductor 62. In any of the heat exchangers 104 of FIGS. 15(a) and 15(b), 135 mountings for inserting the heat conductor 62 are provided at substantially equal intervals between the heat transfer plate 52 and the body 61 (not shown). hole. Each of the heat conductors 62 is detachably attached to the mounting holes of the heat transfer plates 52 and the main body 61. For example, each of the heat conductors 62 may be formed by a flat head screw and screwed into the mounting hole. A plurality of heat conductors 62 including a plurality of materials may be combined to form a plurality of heat conductors 62. By combining the heat conductors 62 including a plurality of materials, the temperature distribution unevenness generated on the upstream side and the downstream side of the flow path 7 can be eliminated. Further, by disposing the heat conductor 62 including the expensive material only at a necessary position and arranging the heat conductor 62 including an inexpensive material at other positions, the manufacturing cost can be reduced.

圖15(a)中,由鋁製銷構成全部之熱傳導體62,圖15(b)中,由鋁製之銷構成自左起至第5行之熱傳導體62,由銅製銷構成自左數第6行以後之熱傳導體62。即,相對於圖15(a)中裝設135根鋁製銷作為熱傳導體62,圖15(b)中於熱傳導體62之上游側裝設45根銅製銷,於下游側裝設鋁製銷。圖15(a)及圖15(b)之右圖係表示溫度分佈圖像之圖。圖15(a)中,左側半部分為相對低溫,右側半部分為相對高溫,相對於此,圖15(b)中,溫度分佈不均被大致消除。如此,藉由將包含熱傳導率較高之材料之熱傳導體62配置於上游側,且將包含熱傳導率相對較低之材料之熱傳導體62配置於下游側,可降低上游側與下游側之溫度分佈不均。並且,藉由降低溫度分佈不均,可抑制本體、 傳熱板等之變形,又,可防止加熱器壽命之短命化。進而,習知,於為若通過流入口時之溫度與通過流出口時之溫度差(△T)變大則會產生熱變性之流體時,必需降低輸出而進行加熱以使△T不變大,但根據使溫度分佈不均降低之本發明之熱交換器,可進行高效率之熱交換。 In Fig. 15(a), all of the heat conductors 62 are made of aluminum pins, and in Fig. 15(b), the heat conductors 62 from the left to the fifth row are formed of pins made of aluminum, and the number of copper pins is from the left. The heat conductor 62 after the sixth row. That is, 135 aluminum pins are provided as the heat conductor 62 in Fig. 15(a), and 45 copper pins are mounted on the upstream side of the heat conductor 62 in Fig. 15(b), and aluminum pins are mounted on the downstream side. . The right diagrams of Figs. 15(a) and 15(b) are diagrams showing temperature distribution images. In Fig. 15 (a), the left half portion is relatively low temperature, and the right half portion is relatively high temperature. In contrast, in Fig. 15 (b), temperature distribution unevenness is substantially eliminated. By disposing the heat conductor 62 including the material having a high thermal conductivity on the upstream side and the heat conductor 62 including the material having a relatively low thermal conductivity on the downstream side, the temperature distribution on the upstream side and the downstream side can be reduced. Uneven. Moreover, by reducing the uneven temperature distribution, the body can be suppressed, The deformation of the heat transfer plate and the like can prevent the short life of the heater. Further, it is conventionally known that when a temperature difference (ΔT) when passing through an inflow port and a temperature difference (ΔT) passing through the outflow port become large, a heat-denatured fluid is generated, and it is necessary to reduce the output and heat so that ΔT does not become large. However, according to the heat exchanger of the present invention which lowers the temperature distribution unevenness, high-efficiency heat exchange can be performed.

圖16係於上游側與下游側以不同密度配置有熱傳導體62之熱交換器104之俯視圖。該熱交換器104係由鋁製銷構成全部之熱傳導體62,傳熱板52、本體61等之構成與圖15之熱交換器104相同。圖16中,自左起至第5行係於上下方向上配置9個熱傳導體62,自左數第6~15行係於上下方向上配置4個或5個熱傳導體62。如此,上游側係高密度地配置熱傳導體62,下游側係低密度地配置熱傳導體62,藉此亦可降低上游側與下游側之溫度分佈不均。再者,於圖16之熱交換器104中,亦可將包含熱傳導率不同之材料之熱傳導體62配置於上游側與下游側而更加精細地調節上游側與下游側之溫度分佈不均。 Fig. 16 is a plan view showing the heat exchanger 104 in which the heat conductors 62 are disposed at different densities on the upstream side and the downstream side. The heat exchanger 104 is composed of an aluminum pin and constitutes all of the heat conductors 62. The heat transfer plate 52, the body 61 and the like have the same configuration as the heat exchanger 104 of Fig. 15 . In Fig. 16, nine heat conductors 62 are arranged in the vertical direction from the left to the fifth row, and four or five heat conductors 62 are arranged in the vertical direction from the sixth to fifteenth rows from the left. In this manner, the heat conductor 62 is disposed at a high density on the upstream side, and the heat conductor 62 is disposed at a low density on the downstream side, whereby the temperature distribution unevenness on the upstream side and the downstream side can be reduced. Further, in the heat exchanger 104 of Fig. 16, the heat conductors 62 including materials having different thermal conductivities may be disposed on the upstream side and the downstream side to more precisely adjust the temperature distribution unevenness on the upstream side and the downstream side.

圖17係表示附有簇射頭之熱交換器105之剖面構造之圖,(a)表示平面(水平方向)之剖面,(b)表示縱面(垂直方向)之剖面。附有簇射頭之熱交換器105係具備加熱板51、傳熱板52、多數個熱傳導體62、及具有被熱交換流體流路7之本體61而成,於本體61形成有與流路7連通之多數個吐出口75。附有簇射頭之熱交換器105具有2個流入口83a、83b,被熱交換流體73自流入口於流路7中被加熱並自吐出口75被吐出。即,附有簇射頭之熱交換器105中,與外界連通之吐出口75成為流出口。多數個熱傳導體62與圖15(b)同樣地包括配置於靠近流入口83a、83b之上游側之銅製之銷狀構件與配置於下游側之鋁製之銷狀構件,且以使遍及流路7之全長之溫度分佈不均成為最低 限度之方式構成。換言之,靠近左右兩邊之側主要配置銅製之銷狀構件,中央部分主要配置鋁製之銷狀構件。又,於流路7設置有多數個彎曲部71,於該彎曲部71中,被熱交換流體碰撞於流路壁而產生亂流,藉此消除加熱之不均勻。因此,自多數個吐出口75各者吐出實質上相同溫度之流體。再者,附有簇射頭之熱交換器105雖然主要用於吐出氣體之氣體簇射,但亦有吐出液體之情形。附有簇射頭之熱交換器105亦可藉由於其上段配置一個或複數個無簇射頭之熱交換器且利用分支配管將熱交換器105之2個流入口與上段之熱交換器之流出口連接而設為多段構成(參照下述圖18)。 Fig. 17 is a view showing a cross-sectional structure of a heat exchanger 105 with a shower head, wherein (a) shows a cross section in a plane (horizontal direction), and (b) shows a cross section in a vertical plane (vertical direction). The heat exchanger 105 with a shower head includes a heating plate 51, a heat transfer plate 52, a plurality of heat conductors 62, and a body 61 having a heat exchange fluid flow path 7, and the body 61 is formed with a flow path. A large number of 7 connected outlets 75. The heat exchanger 105 with the shower head has two inflow ports 83a and 83b, and is heated by the heat exchange fluid 73 from the inflow port 7 and is discharged from the discharge port 75. In other words, in the heat exchanger 105 with the shower head, the discharge port 75 that communicates with the outside becomes an outflow port. Similarly to FIG. 15(b), the plurality of heat conductors 62 include a pin member made of copper disposed on the upstream side of the inflow ports 83a and 83b, and a pin member made of aluminum disposed on the downstream side so as to extend over the flow path. The temperature distribution of 7 is the lowest The way of the limit. In other words, a pin member made of copper is mainly disposed on the side closer to the left and right sides, and a pin member made of aluminum is mainly disposed at the center portion. Further, a plurality of curved portions 71 are provided in the flow path 7, and in the curved portion 71, the heat exchange fluid collides with the flow path walls to cause turbulent flow, thereby eliminating uneven heating. Therefore, each of the plurality of discharge ports 75 discharges a fluid having substantially the same temperature. Further, although the heat exchanger 105 with the shower head is mainly used for the gas shower of the gas to be discharged, there is also a case where the liquid is discharged. The heat exchanger 105 with the shower head may also be provided with one or a plurality of non-clustered head heat exchangers in the upper stage and the two flow inlets of the heat exchanger 105 and the upper heat exchanger by the branch piping. The outflow port is connected to each other and has a multi-stage configuration (see FIG. 18 below).

圖6係實現本發明之圓筒狀熱交換器102之主要部分剖面圖。於圓筒型之熱源5之內面設置有包括熱傳導體62及本體61之熱傳遞構造體6,熱傳導體62係使呈鋸齒形狀之面與流路側接觸,使平坦之面與熱源5接觸,本體61覆蓋熱傳導體62之表面並且形成流路7而與被熱交換流體接觸。此處,本體61較佳為設為形成於熱傳導體62之表面之薄膜,又,與被熱交換流體接觸之面較佳為成為與熱傳導體62相同之鋸齒形狀。藉由設為增大接觸表面積之鋸齒形狀而使表面之熱交換效率提高。 Fig. 6 is a cross-sectional view showing the main part of a cylindrical heat exchanger 102 embodying the present invention. The heat transfer structure 6 including the heat conductor 62 and the body 61 is provided on the inner surface of the cylindrical heat source 5. The heat conductor 62 is in contact with the flow path side on the surface having the zigzag shape, and the flat surface is in contact with the heat source 5. The body 61 covers the surface of the heat conductor 62 and forms a flow path 7 to be in contact with the heat exchange fluid. Here, the body 61 is preferably a film formed on the surface of the heat conductor 62, and the surface in contact with the heat exchange fluid is preferably in the same zigzag shape as the heat conductor 62. The heat exchange efficiency of the surface is improved by setting the zigzag shape of the contact surface area.

圖12係對被熱交換流體之流路之鋸齒構造進行說明之示意剖面圖,(a)係對使表面積成為2倍之情形進行說明之圖,(b)係對間距深度之調節進行說明之圖。圖12(a)係將與被熱交換流體73接觸之熱傳遞構造體6之內側面設為如其剖面為1邊2mm之等邊三角形連續之鋸齒構造之例。即,熱傳遞構造體6之內側面成為於其長度方向上環狀之山連續之構造。根據該鋸齒構造,熱傳遞構造體6之內側面之表面積成為無鋸齒構造之平坦之內側面之2倍,因此可使熱交換效 率倍增。熱傳遞構造體6之鋸齒構造不限定於圖12所示者,揭示有以熱傳遞構造體6之內側面之表面積成為例如1.5~3倍之方式形成鋸齒構造之情形。 Fig. 12 is a schematic cross-sectional view for explaining a sawtooth structure of a flow path of a heat exchange fluid, wherein (a) is a view for making a surface area twice, and (b) is for adjusting a pitch depth. Figure. Fig. 12 (a) shows an example in which the inner side surface of the heat transfer structure 6 which is in contact with the heat exchange fluid 73 is a zigzag structure in which the equilateral triangle is one side and 2 mm in cross section. In other words, the inner side surface of the heat transfer structure 6 has a structure in which the mountain in the longitudinal direction is continuous. According to the sawtooth structure, the surface area of the inner side surface of the heat transfer structure 6 is twice as large as the flat inner side surface of the non-serrated structure, so that heat exchange efficiency can be achieved. The rate doubled. The sawtooth structure of the heat transfer structure 6 is not limited to that shown in FIG. 12, and it is disclosed that the surface area of the inner side surface of the heat transfer structure 6 is formed to have a sawtooth structure, for example, 1.5 to 3 times.

雖然越增加熱傳遞構造體6之內側面之表面積,則熱交換效率越提高,但根據被熱交換流體73之流量、黏性等性質,亦存在隨意增加表面積欠佳之情況。圖12(b)之左圖表示於熱傳遞構造體6之內側面與流體73之間產生空隙74之狀態。於此狀態下,由於熱傳遞構造體6之內側面與流體73產生非接觸部分,因此熱交換效率降低。因此,於預見到因此種空隙74而引起之非接觸部分之產生之情形時,必需藉由增大鋸齒構造之間距(溝)而以不產生非接觸部分之方式進行調節。亦可裝卸自由地構成圓筒狀熱交換器102,準備間距不同之複數個圓筒狀熱交換器102。 Although the surface area of the inner side surface of the heat transfer structure 6 is increased, the heat exchange efficiency is improved. However, depending on the flow rate and viscosity of the heat exchange fluid 73, the surface area may be arbitrarily increased. The left diagram of Fig. 12(b) shows a state in which a gap 74 is formed between the inner side surface of the heat transfer structure 6 and the fluid 73. In this state, since the inner side surface of the heat transfer structure 6 generates a non-contact portion with the fluid 73, the heat exchange efficiency is lowered. Therefore, in the case where the occurrence of the non-contact portion caused by the void 74 is foreseen, it is necessary to adjust in such a manner that the non-contact portion is not generated by increasing the distance (groove) between the sawtooth structures. The cylindrical heat exchanger 102 can also be detachably constructed, and a plurality of cylindrical heat exchangers 102 having different pitches can be prepared.

[熱傳導體之材質與被熱交換流體之距離] [The distance between the material of the heat conductor and the heat exchange fluid]

熱傳導體62係使用熱傳導率較本體61良好之材質物質,但所謂熱傳導率良好係指兩者之材質之值之相對性之對比,並非特定為絕對之值。例如,熱傳導率於塑膠中為約0.2W/m.K,通常顯示氟樹脂為約0.25、碳鋼為約47、不鏽鋼為約15、鋁為237、純銅為386、PYREX玻璃(PYREX:註冊商標)為約1之值。考慮相對之熱傳導率自該等中選擇材質即可,由於氟樹脂於該等之中為較低之值,因此於以氟樹脂作為本體61之情形時,以任一種材質者作為熱傳導體均會使熱效率提高。又,於熱傳遞構造體6(本體61)之材料為金屬之情形時,例如以不鏽鋼作為本體之情形時,熱傳導體可選擇熱傳導率較熱傳遞構造體6(本體61)之材料良好之金屬、例如碳鋼、鋁、純銅作為熱傳導體。但 是,熱傳導體之材質(材料)係熱傳導率越高越佳。 The thermal conductor 62 is made of a material having a thermal conductivity higher than that of the main body 61. However, the term "good thermal conductivity" refers to the comparison of the relative values of the materials of the two materials, and is not specific to an absolute value. For example, the thermal conductivity is about 0.2 W/m in plastic. K generally shows a value of about 0.25 for fluororesin, about 47 for carbon steel, about 15, for stainless steel, 237 for aluminum, 386 for pure copper, and PYREX glass (PYREX: registered trademark). It is only necessary to select a material from these in consideration of the relative thermal conductivity. Since the fluororesin has a low value among these, when a fluororesin is used as the body 61, any one of the materials is used as the heat conductor. Improve thermal efficiency. Further, when the material of the heat transfer structure 6 (body 61) is made of metal, for example, when stainless steel is used as the body, the heat conductor may select a metal having a better thermal conductivity than the heat transfer structure 6 (body 61). For example, carbon steel, aluminum, and pure copper are used as heat conductors. but Therefore, the material (material) of the heat conductor is preferably the higher the thermal conductivity.

例如,已知使被熱交換流體與熱傳遞構造體6之接觸面63成為氟樹脂之塗覆且使本體61為不鏽鋼之熱交換器,於對施加有8mm厚之不鏽鋼與藉由氟樹脂之耐蝕被覆之板之總傳熱係數進行測定之例中,於僅不鏽鋼時為1070W/m2.K,相對於此,若設置500μm之耐蝕被覆,則獲得該係數成為291且傳熱量成為1/3之結果。又,報告有:於設置50μm之耐蝕被覆之情形時,成為845之傳熱係數。因此,熱傳導體與被熱交換流體之距離以儘可能近為佳。 For example, a heat exchanger in which the contact surface 63 of the heat exchange fluid and the heat transfer structure 6 is coated with a fluororesin and the body 61 is made of stainless steel is known, and a stainless steel of 8 mm thick is applied and a fluororesin is used. In the example in which the total heat transfer coefficient of the corrosion-resistant coated sheet was measured, it was 1070 W/m 2 in the case of only stainless steel. On the other hand, when a corrosion-resistant coating of 500 μm is provided, the coefficient is 291 and the amount of heat transfer is 1/3. Further, the report has a heat transfer coefficient of 845 when a 50 μm corrosion resistant coating is provided. Therefore, the distance between the heat conductor and the heat exchange fluid is preferably as close as possible.

[熱交換器之具體例1] [Specific example 1 of heat exchanger]

具體地表示本發明之具體例1之熱交換器之構造。圖7所示之熱交換器103包括150mm×195mm×高度34mm之長方體,被熱交換流體係藉由通過被熱交換流體之流路7而進行熱交換,該被熱交換流體之流路7於自入口連接器(流入口)81進入至自出口連接器(流出口)82流出之間具有大量彎曲點(彎曲部)71、72。流路7係藉由於包括包含氟樹脂之塊體之本體61形成溝狀之空間而設置。於流路7之兩側,隔開600μm之間隔設置有172根熱傳導體62。熱傳導體62包括直徑3mm、長度18mm銅製之附有十字型孔之沉頭螺絲(頭部平坦之螺絲)並通過傳熱板52a而螺絲固定於設置於熱傳遞構造體之本體61之孔。由於該螺絲係上表面為平坦,因此可使傳熱板52a之上表面為同一平面。形成有溝之螺絲之主體部較佳為非前端較細之同徑之圓柱狀。藉由於熱傳導體62使用標準螺絲,可顯著地降低熱交換器之製造成本。例如,揭示有使用作為JIS標準之螺絲之M3×20mm間距0.5mm(銅)、M4×12mm間距0.7mm(鋁)之情況。 Specifically, the structure of the heat exchanger of Specific Example 1 of the present invention is shown. The heat exchanger 103 shown in Fig. 7 includes a rectangular parallelepiped of 150 mm × 195 mm × 34 mm in height, and is exchanged by a heat exchange fluid system by a flow path 7 through a heat exchange fluid, and the flow path 7 of the heat exchange fluid is There are a large number of bending points (bending portions) 71, 72 between the inlet connector (inflow port) 81 and the outlet from the outlet connector (flow port) 82. The flow path 7 is provided by forming a groove-like space by the body 61 including the block containing the fluororesin. 172 heat conductors 62 are provided on both sides of the flow path 7 at intervals of 600 μm. The heat conductor 62 includes a countersunk head screw (head flat screw) made of copper having a diameter of 3 mm and a length of 18 mm and fixed to the hole of the body 61 provided in the heat transfer structure by the heat transfer plate 52a. Since the upper surface of the screw is flat, the upper surface of the heat transfer plate 52a can be made the same plane. The main body portion of the screw forming the groove is preferably a cylindrical shape having the same diameter as the non-front end. By using standard screws for the heat conductor 62, the manufacturing cost of the heat exchanger can be significantly reduced. For example, a case where a screw having an M3 × 20 mm pitch of 0.5 mm (copper) and a pitch of M4 × 12 mm of 0.7 mm (aluminum) using a screw as a JIS standard is disclosed.

未圖示之熱源係以與傳熱板52a之至少設置有熱傳導體62之區域接觸之方式設置。熱源較佳為以與傳熱板52a及52b之兩面接觸之方式設置。作為該熱源,例如,可例示加熱器容量1600W之以鎳鉻合金線作為熱源之不鏽鋼製板、加熱器容量4000W之以鎳合金作為熱源之雲母製板。熱源之露出之面較佳為由隔熱材料覆蓋,更佳為以隔熱材料覆蓋熱交換器103之最外側之面之整個面。傳熱板52b與傳熱板52a物理性地連結,來自熱源之熱經由傳熱板52a、52b傳遞至熱傳導體62及本體61。圖7之構成例中,設為將傳熱板52a設為上表面,將傳熱板52b設為底面,且包括連結該等之殼體之中空之長方體構造。傳熱板52a、52b(及殼體)既可由與熱傳導體62相同之材料構成,亦可由熱傳導率較熱傳導體62良好之材料構成。 The heat source (not shown) is provided in contact with the region of the heat transfer plate 52a where at least the heat conductor 62 is provided. The heat source is preferably provided in contact with both surfaces of the heat transfer plates 52a and 52b. As the heat source, for example, a stainless steel plate having a heater capacity of 1600 W and a nichrome wire as a heat source, and a mica plate having a heater capacity of 4000 W and a nickel alloy as a heat source can be exemplified. The exposed surface of the heat source is preferably covered with a heat insulating material, and more preferably covers the entire outer surface of the heat exchanger 103 with a heat insulating material. The heat transfer plate 52b is physically coupled to the heat transfer plate 52a, and heat from the heat source is transmitted to the heat conductor 62 and the body 61 via the heat transfer plates 52a and 52b. In the configuration example of Fig. 7, the heat transfer plate 52a is an upper surface, and the heat transfer plate 52b is a bottom surface, and includes a hollow rectangular parallelepiped structure that connects the casings. The heat transfer plates 52a and 52b (and the casing) may be made of the same material as the heat conductor 62, or may be made of a material having a thermal conductivity higher than that of the heat conductor 62.

由於熱傳導體62與流路7(被熱交換流體)之間隔接近於600μm,因此熱傳導良好。被熱交換流體通過之流路7係寬度6mm、深度20mm、長度1795mm,於途中具有數次彎曲點(彎曲部)。為了增加該彎曲部,較佳為不僅設置使流路之前進方向旋轉180度之彎曲部,亦設置使流路之前進方向折回旋轉之彎曲部。即,於圖7之構成例中,藉由設置使流路之前進方向朝流入口側(IN方向)旋轉90度之折回彎曲部72而構成A及B之2個流路系統,而使彎曲部增加。該流路系統不限定於圖7之2個,亦可設為3個以上。於該彎曲點(彎曲部)中,流經流路之被熱交換流體碰撞於流路壁而形成亂流,因此流路壁(接觸面)中之熱交換變得高效。又,較佳為於平行而配置之2條流路7之間,設置數根熱傳導體。此處,所謂2條平行之流路係指例如存在如圖7中標附有符號7、7之2條流路般之配置關係者。就其他觀點而言,較佳為以流路7以曲折穿過大致相等間隔地配置之熱傳導體62之間隙之 方式蜿蜒之方式設置。 Since the interval between the heat conductor 62 and the flow path 7 (by the heat exchange fluid) is close to 600 μm, heat conduction is good. The flow path 7 through which the heat exchange fluid passes is a width of 6 mm, a depth of 20 mm, and a length of 1795 mm, and has several bending points (bending portions) in the middle. In order to increase the bending portion, it is preferable to provide not only a curved portion that rotates the flow path in the forward direction by 180 degrees, but also a curved portion that turns the flow path forward in the forward direction. In other words, in the configuration example of FIG. 7, the two curved flow systems of A and B are formed by bending the curved portion 72 which is rotated by 90 degrees toward the inlet side (IN direction) in the flow path forward direction, thereby bending The ministry has increased. The flow path system is not limited to two in Fig. 7, and may be three or more. In the bending point (bending portion), the heat exchange fluid flowing through the flow path collides with the flow path wall to form a turbulent flow, so that heat exchange in the flow path wall (contact surface) becomes efficient. Further, it is preferable to provide a plurality of heat conductors between the two flow paths 7 arranged in parallel. Here, the two parallel flow paths mean, for example, a configuration in which two flow paths are attached as shown in FIG. 7 with symbols 7 and 7. In other respects, it is preferable that the flow path 7 is bent to pass through the gap of the heat conductor 62 disposed at substantially equal intervals. The way to set it.

可藉由利用連接器81、82將圖7所示之本發明之熱交換器103複數個結合而提高熱交換效率。又,關於熱傳導體62之設置位置、設置層數,可一面實際地對熱交換之效率進行研究一面進行設置,於被熱交換流體之溫度較規定過低之位置,能夠以可於相應之本體61重新設置熱傳導體62之設置用孔而設置熱傳導體62之方式進行加工。 The heat exchange efficiency can be improved by combining the plurality of heat exchangers 103 of the present invention shown in Fig. 7 by means of connectors 81, 82. Further, the position of the heat conductor 62 and the number of layers to be placed can be set while actually studying the efficiency of heat exchange, and the temperature of the heat exchange fluid can be made lower than the predetermined temperature. The machining is performed in such a manner that the heat conduction body 62 is provided by repositioning the installation hole of the heat conductor 62.

圖18係積層圖7所示之熱交換器103而製成多段構成之熱交換器之情形之側視圖。藉由利用配管83a~83c將成為上段之熱交換器103之入口連接器81與成為下段之出口連接器82連接,可製成多段構成。雖然圖18之例中係製成4段構成,但不限定於該構成,只要為2段以上,則可製成任意之段數。於以此方式使熱交換器為多段構成之情形時,最下層以外之熱交換器中,流路7不僅自位於上方之熱源被加熱,亦自位於下方之熱源被加熱。即,圖18之例中,傳熱板52b亦自位於其下方之熱源(加熱板)被加熱。於設為多段構成之情形時,成為積層面之面不由隔熱材料覆蓋,位於下段之熱源與位於上段之傳熱板直接接觸。如此,本發明之熱交換器中,藉由設為多段構成而可容易地延長流路之長度。又,本發明之熱交換器中,內部構造不根據被熱交換流體之流量變更,可藉由變更流路之口徑尺寸及全長而進行自大流量至小流量之應對。例如,於對以氮氣換算為10L/分鐘以下之流量進行熱轉換之情形時,即便使本體尺寸成為1/2之尺寸,亦可獲得80%以上之熱交換性能。於對50L/分鐘以上之流量進行熱交換之情形時,可藉由增大本體尺寸而進行應對。 Fig. 18 is a side view showing a state in which a heat exchanger 103 shown in Fig. 7 is laminated to form a heat exchanger having a plurality of stages. The inlet connector 81 of the upper heat exchanger 103 and the outlet connector 82 which is the lower stage are connected by the pipes 83a to 83c, thereby forming a multi-stage configuration. Although the configuration of Fig. 18 is a four-stage configuration, the configuration is not limited thereto, and any number of stages can be obtained as long as it is two or more. In the case where the heat exchanger is configured in a plurality of stages in this manner, in the heat exchanger other than the lowermost layer, the flow path 7 is heated not only from the heat source located above but also from the heat source located below. That is, in the example of Fig. 18, the heat transfer plate 52b is also heated from a heat source (heating plate) located below it. In the case of a multi-stage configuration, the surface which becomes the layer is not covered by the heat insulating material, and the heat source located in the lower stage is in direct contact with the heat transfer plate located in the upper stage. As described above, in the heat exchanger of the present invention, the length of the flow path can be easily extended by the multi-stage configuration. Further, in the heat exchanger of the present invention, the internal structure is not changed according to the flow rate of the heat exchange fluid, and the flow rate from the large flow rate to the small flow rate can be handled by changing the size and total length of the flow path. For example, when heat conversion is performed at a flow rate of 10 L/min or less in terms of nitrogen gas, even if the body size is 1/2, a heat exchange performance of 80% or more can be obtained. When heat exchange is performed for a flow rate of 50 L/min or more, it can be handled by increasing the size of the body.

[熱交換器之具體例2] [Specific example 2 of heat exchanger]

圖19係本發明之具體例2之調溫供給裝置110之構成圖。該調溫供給裝置110構成為具備冷卻用熱交換器106、冷卻裝置111、及配管112a、112b及113a、113b。冷卻用熱交換器106構成為具備熱傳遞構造體6、及冷卻板54a、54b。熱傳遞構造體6可使用與熱交換器101~104相同者。冷卻板54a、54b之內部均佈滿供冷媒循環之流路。冷媒例如使用防凍液、氣體冷媒。利用冷卻裝置111經冷卻之冷媒通過配管112a被供給至冷卻用熱交換器106,於通過冷卻用熱交換器106時吸收熱,通過配管112b返回至冷卻裝置111,再次通過配管112a被供給至冷卻用熱交換器106。被熱交換流體73(例如,純水)自配管113a被供給至冷卻用熱交換器106,於通過冷卻用熱交換器106時被冷卻,且自配管113b被排出。 Fig. 19 is a view showing the configuration of a temperature adjustment supply device 110 according to a second specific example of the present invention. The temperature adjustment supply device 110 is configured to include a cooling heat exchanger 106, a cooling device 111, and pipes 112a, 112b and 113a and 113b. The cooling heat exchanger 106 is configured to include a heat transfer structure 6 and cooling plates 54a and 54b. The heat transfer structure 6 can be the same as the heat exchangers 101 to 104. The inside of the cooling plates 54a, 54b is filled with a flow path for circulating refrigerant. The refrigerant is, for example, an antifreeze or a gas refrigerant. The refrigerant that has been cooled by the cooling device 111 is supplied to the cooling heat exchanger 106 through the pipe 112a, absorbs heat when passing through the cooling heat exchanger 106, returns to the cooling device 111 through the pipe 112b, and is again supplied to the cooling through the pipe 112a. A heat exchanger 106 is used. The heat exchange fluid 73 (for example, pure water) is supplied from the piping 113a to the cooling heat exchanger 106, is cooled when passing through the cooling heat exchanger 106, and is discharged from the piping 113b.

以下,記載本發明之具體例作為實施例,但該等實施例為表示具體例者,故而本發明不受該等實施例限定。 Hereinafter, specific examples of the present invention are described as examples, but the examples are specific examples, and thus the present invention is not limited by the examples.

[實施例1] [Example 1]

使用與上述熱交換器之具體例中所記載之圖7之熱交換器103相同之構成之熱交換器12,證實根據本發明熱交換效率得以提高。試驗係利用圖8所示之裝置之配置進行。使利用流量控制器10控制其流量之空氣9於起泡裝置11中含有水,繼而使其通過熱交換器12。於熱交換器12配置電熱面板溫度控制裝置13、PFA(四氟乙烯-全氟烷基乙烯基醚共聚合體,Tetrafluoroetylene-Perfluoroalkylvinylether Copolymer)內部溫度測量器14、出口氣體溫度測量器15而監視熱交換。進而,利用溫度記錄器測量本體61表面之溫度分佈。將藉由溫度記錄器之測量結果示於圖9中。圖式中,顏色較濃之部分為溫度較高 之部分,已確認溫度較高之部分與熱傳導體62之設置位置一致。又,可知,熱交換器整體之溫度分佈可無偏差地進行均勻之加熱。 The heat exchanger 12 having the same configuration as the heat exchanger 103 of Fig. 7 described in the specific example of the heat exchanger described above was used to confirm that the heat exchange efficiency was improved according to the present invention. The test was carried out using the configuration of the apparatus shown in FIG. The air 9 that controls the flow rate thereof by the flow controller 10 contains water in the bubbling device 11 and then passes through the heat exchanger 12. The heat exchanger 12 is provided with an electric panel temperature control device 13, a PFA (Tetrafluoroetylene-Perfluoroalkylvinylether Copolymer) internal temperature measuring device 14, and an outlet gas temperature measuring device 15 to monitor heat exchange. . Further, the temperature distribution of the surface of the body 61 was measured using a temperature recorder. The measurement results by the temperature recorder are shown in Fig. 9. In the figure, the part with a stronger color is higher in temperature. In the portion, it has been confirmed that the portion where the temperature is higher coincides with the position at which the heat conductor 62 is disposed. Further, it is understood that the temperature distribution of the entire heat exchanger can be uniformly heated without deviation.

[實施例2] [Embodiment 2]

本實施例中,使用與實施例1相同之裝置,於設定溫度40~160℃、流量10~50L/分鐘之較廣之範圍內進行試驗而測定出口溫度。將其結果示於圖10中。已明確於設定溫度、流量較廣之範圍內熱轉換率為80%以上。已明確本發明之熱交換器能夠以相同之裝置靈活地應對廣範圍之流量。 In this example, the same apparatus as in Example 1 was used, and the outlet temperature was measured by conducting a test in a wide range of a set temperature of 40 to 160 ° C and a flow rate of 10 to 50 L/min. The results are shown in Fig. 10. It has been clarified that the heat conversion rate is 80% or more in the range of the set temperature and the flow rate. It has been clarified that the heat exchanger of the present invention is capable of flexibly coping with a wide range of flows with the same apparatus.

[實施例3] [Example 3]

本實施例中,使用實施例1中所使用之電熱面板,將經由樹脂與被熱交換流體進行熱傳遞之本發明熱交換器與經由不鏽鋼之習知之熱交換器之性能進行對比。本發明中,與實施例1相同地對加濕空氣進行熱交換。另一方面,習知之熱交換器中係對乾燥氮氣進行熱交換。將其結果示於圖11中。金屬30L係使用不鏽鋼之熱交換器之測定結果,樹脂30L係本發明之熱交換器之測定結果。由圖11可確認,雖然本發明之熱交換器中接觸部分係樹脂製,但顯示與習知之不鏽鋼製之製品同等之性能。又,本發明之熱交換器中係對H2O之霧進行試驗者,習知品中係以乾燥氮氣為對象者。由於含有水之霧之空氣必需應對水之潛熱之熱,因此可知本發明為高於圖式11所表示之高性能。 In the present embodiment, the electrothermal panel used in Example 1 was used to compare the performance of the heat exchanger of the present invention via heat transfer of a resin with a heat exchange fluid with a conventional heat exchanger via stainless steel. In the present invention, heat exchange is performed on the humidified air in the same manner as in the first embodiment. On the other hand, conventional heat exchangers exchange heat with dry nitrogen. The result is shown in FIG. The metal 30L is a measurement result of a heat exchanger using stainless steel, and the resin 30L is a measurement result of the heat exchanger of the present invention. As can be seen from Fig. 11, although the contact portion of the heat exchanger of the present invention is made of a resin, it exhibits performance equivalent to that of a conventional stainless steel product. Further, in the heat exchanger of the present invention, the test for the mist of H 2 O is carried out, and the conventional product is made of dry nitrogen. Since the air containing the mist of water must cope with the heat of latent heat of water, it is understood that the present invention is higher than the high performance represented by the following formula 11.

(產業上之可利用性) (industrial availability)

本發明之熱交換器係熱交換性優異並且可防止因被熱交換流體而引起之熱交換器之腐蝕及伴隨腐蝕之被熱交換流體之污染者,可不使腐蝕性之藥劑及高純度物質之純度降低而效率良好地藉由 熱交換執行加熱、冷卻及溫度控制。例如,對於對高純度之物質進行處理之半導體製造之製程中所使用之藥品類之加熱、冷卻較為有用。本發明之熱交換器及熱交換方法可廣泛地用作化學、醫藥品、食品、纖維、電力、核能產業等、要求製品之純度與耐蝕性之加熱.蒸發裝置、冷卻.冷凝裝置等高效率之熱交換器。 The heat exchanger of the present invention is excellent in heat exchange property and can prevent corrosion of a heat exchanger caused by a heat exchange fluid and contamination by a heat exchange fluid accompanying corrosion, and can prevent corrosive chemicals and high-purity substances. Reduced purity and efficient Heat exchange performs heating, cooling, and temperature control. For example, it is useful for heating and cooling a drug used in a process for manufacturing a semiconductor material that processes a high-purity substance. The heat exchanger and the heat exchange method of the invention can be widely used as heating for chemical, pharmaceutical, food, fiber, electric power, nuclear energy industries, etc., requiring purity and corrosion resistance of the product. Evaporation device, cooling. High efficiency heat exchanger such as condensing unit.

6‧‧‧熱傳遞構造體 6‧‧‧Heat transfer structure

7‧‧‧被熱交換流體流路 7‧‧‧Heat exchange fluid flow path

51‧‧‧加熱板 51‧‧‧heating plate

52a‧‧‧傳熱板(傳熱構件) 52a‧‧‧ Heat transfer plate (heat transfer member)

52b‧‧‧傳熱板(傳熱構件) 52b‧‧‧heat transfer plate (heat transfer member)

61‧‧‧本體 61‧‧‧Ontology

62‧‧‧熱傳導體 62‧‧‧heat conductor

63‧‧‧接觸面 63‧‧‧Contact surface

101‧‧‧熱交換器 101‧‧‧ heat exchanger

Claims (24)

一種熱交換器,其係具備熱源、與被熱交換流體接觸之熱傳遞構造體、及將來自熱源之熱傳熱至熱傳遞構造體之傳熱構件,且通過被熱交換流體與熱傳遞構造體之接觸面而形成傳熱型熱交換者;其特徵在於:熱傳遞構造體係包括具有流入口、流出口及被熱交換流體流路之本體、以及裝設於本體之多數個熱傳導體;構成與被熱交換流體之接觸面之被熱交換流體流路之內壁面係由相對於被熱交換流體而穩定之材質所形成;熱傳導體係由熱傳導率較本體之材料良為佳之材料所形成;熱傳導體係裝設於被熱交換流體流路之附近且不與被熱交換流體產生接觸之位置。 A heat exchanger comprising a heat source, a heat transfer structure in contact with the heat exchange fluid, and a heat transfer member that transfers heat from the heat source to the heat transfer structure, and is configured by the heat exchange fluid and the heat transfer structure a heat transfer type heat exchanger formed by the contact surface of the body; the heat transfer structure system includes a body having an inflow port, an outflow port, and a heat exchange fluid flow path, and a plurality of heat conductors mounted on the body; The inner wall surface of the heat exchange fluid flow path with the contact surface of the heat exchange fluid is formed by a material which is stable with respect to the heat exchange fluid; the heat conduction system is formed of a material having a thermal conductivity better than that of the body material; heat conduction The system is installed in the vicinity of the flow path of the heat exchange fluid and is not in contact with the heat exchange fluid. 如申請專利範圍第1項之熱交換器,其中,多數個熱傳導體包括夾持被熱交換流體流路而對向配置之複數個熱傳導體。 A heat exchanger according to claim 1, wherein the plurality of heat conductors comprise a plurality of heat conductors disposed opposite to each other by the heat exchange fluid flow path. 如申請專利範圍第1或2項之熱交換器,其中,傳熱構件係由夾持本體之2個傳熱構件所形成,且自2個傳熱構件各者伸出1個以上之熱傳導體。 The heat exchanger according to claim 1 or 2, wherein the heat transfer member is formed by two heat transfer members that sandwich the body, and one or more heat conductors extend from each of the two heat transfer members. . 如申請專利範圍第1或2項之熱交換器,其中,熱傳導體為具有銷狀之構造者。 A heat exchanger according to claim 1 or 2, wherein the heat conductor is a pin-shaped structure. 如申請專利範圍第4項之熱交換器,其中,多數個熱傳導體之至少一部分係與板狀之傳熱構件一體地形成。 A heat exchanger according to claim 4, wherein at least a part of the plurality of heat conductors are integrally formed with the plate-shaped heat transfer member. 如申請專利範圍第4項之熱交換器,其中,多數個熱傳導體之至少一部分係為具有鋸齒構造之外側面者。 A heat exchanger according to claim 4, wherein at least a part of the plurality of heat conductors has a side surface having a sawtooth configuration. 如申請專利範圍第6項之熱交換器,其為外側面之表面積係成為當 不存在凸部之外側面之情形時之1.5~3倍之鋸齒構造。 For example, in the heat exchanger of claim 6 of the patent scope, the surface area of the outer side is 1.5 to 3 times the sawtooth structure in the case where there is no outer side of the convex portion. 如申請專利範圍第6項之熱交換器,其中,具有鋸齒構造之外側面之熱傳導體為螺絲。 A heat exchanger according to claim 6 wherein the heat conductor having the outer side of the sawtooth structure is a screw. 如申請專利範圍第8項之熱交換器,其中,具有鋸齒構造之外側面之熱傳導體為頭部平坦之螺絲。 A heat exchanger according to claim 8 wherein the heat conductor having the outer side of the sawtooth structure is a flat head screw. 如申請專利範圍第1或2項之熱交換器,其中,被熱交換流體流路具有複數個彎曲部。 A heat exchanger according to claim 1 or 2, wherein the heat exchange fluid flow path has a plurality of curved portions. 如申請專利範圍第10項之熱交換器,其中,被熱交換流體流路具有向流入口側進行方向轉換之折回彎曲部。 The heat exchanger according to claim 10, wherein the heat exchange fluid flow path has a folded back portion that is directionally shifted toward the inlet side. 如申請專利範圍第1或2項之熱交換器,其中,配置於距流入口較近之側之熱傳導體之至少一部分係為與配置於距流入口較遠之側之熱傳導體相比由熱傳導率較高之材料所形成之熱傳導體。 The heat exchanger according to claim 1 or 2, wherein at least a part of the heat conductor disposed on a side closer to the inlet is thermally conductive than a heat conductor disposed on a side farther from the inlet. A heat conductor formed by a higher rate material. 如申請專利範圍第1或2項之熱交換器,其中,與距流入口較遠之側相比,於距流入口較近之側熱傳導體之數量較多,且以高密度來加以配置。 The heat exchanger according to claim 1 or 2, wherein the number of the heat conductors on the side closer to the inlet is larger than that on the side farther from the inlet, and is disposed at a high density. 如申請專利範圍第12項之熱交換器,其中,流出口係為與外界連通之吐出口。 The heat exchanger of claim 12, wherein the outflow port is a spout outlet that communicates with the outside. 一種熱交換器,其係由積層複數個申請專利範圍第1或2項之熱交換器而成。 A heat exchanger formed by laminating a plurality of heat exchangers of claim 1 or 2. 如申請專利範圍第1或2項之熱交換器,其中,被熱交換流體流路之內壁面為樹脂。 The heat exchanger according to claim 1 or 2, wherein the inner wall surface of the heat exchange fluid flow path is a resin. 如申請專利範圍第1或2項之熱交換器,其中,被熱交換流體流路之內壁面為金屬或碳。 The heat exchanger according to claim 1 or 2, wherein the inner wall surface of the heat exchange fluid flow path is metal or carbon. 如申請專利範圍第1或2項之熱交換器,其中,多數個熱傳導體包 括由銅所形成之熱傳導體及由鋁所形成之熱傳導體。 A heat exchanger according to claim 1 or 2, wherein a plurality of heat exchanger packages A heat conductor formed of copper and a heat conductor formed of aluminum are included. 如申請專利範圍第1或2項之熱交換器,其中,熱源為加熱源。 A heat exchanger according to claim 1 or 2, wherein the heat source is a heat source. 如申請專利範圍第1或2項之熱交換器,其中,熱源為吸熱源。 A heat exchanger according to claim 1 or 2, wherein the heat source is a heat absorbing source. 一種熱交換方法,其係為使用申請專利範圍第1或2項之熱交換器而與流體來進行傳熱型熱交換。 A heat exchange method for performing heat transfer type heat exchange with a fluid using the heat exchanger of claim 1 or 2. 一種熱交換方法,其係為使用申請專利範圍第12項之熱交換器而與流體來進行傳熱型熱交換者;且於距流入口較近之側來配置與距流入口較遠之側相比由熱傳導率相對較高之材料所形成之熱傳導體,於距流入口較遠之側來配置與距流入口較近之側相比由熱傳導率相對較低之材料所形成之熱傳導體,藉此抑制於被熱交換流體流路之上游側與下游側所產生之溫度分佈之不均。 A heat exchange method for heat transfer type heat exchange with a fluid using the heat exchanger of claim 12; and disposed on a side closer to the flow inlet than to the side of the flow inlet Compared with a heat conductor formed of a material having a relatively high thermal conductivity, a heat conductor formed of a material having a relatively low thermal conductivity is disposed on a side farther from the inlet than a side closer to the inlet. Thereby, the unevenness of the temperature distribution generated on the upstream side and the downstream side of the heat exchange fluid flow path is suppressed. 一種熱交換方法,其係為使用申請專利範圍第13項之熱交換器而與流體來進行傳熱型熱交換者;且於距流入口較近之側來配置與距流入口較遠之側相比由熱傳導率相對較高之材料所形成之熱傳導體,於距流入口較遠之側來配置與距流入口較近之側相比由熱傳導率相對較低之材料所形成之熱傳導體,藉此抑制於被熱交換流體流路之上游側與下游側所產生之溫度分佈之不均。 A heat exchange method for heat transfer type heat exchange with a fluid using the heat exchanger of claim 13; and disposed on a side closer to the flow inlet than to the side of the flow inlet Compared with a heat conductor formed of a material having a relatively high thermal conductivity, a heat conductor formed of a material having a relatively low thermal conductivity is disposed on a side farther from the inlet than a side closer to the inlet. Thereby, the unevenness of the temperature distribution generated on the upstream side and the downstream side of the heat exchange fluid flow path is suppressed. 一種熱交換方法,其係為使用申請專利範圍第16項之熱交換器而與具有腐蝕性之流體來進行傳熱型熱交換。 A heat exchange method for performing heat transfer type heat exchange with a corrosive fluid using the heat exchanger of claim 16 of the patent application.
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