TW201402835A - Alloy for soft magnetic film layer having low saturation magnetic flux density to be used for magnetic recording medium, and sputtering target material - Google Patents

Alloy for soft magnetic film layer having low saturation magnetic flux density to be used for magnetic recording medium, and sputtering target material Download PDF

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TW201402835A
TW201402835A TW102103965A TW102103965A TW201402835A TW 201402835 A TW201402835 A TW 201402835A TW 102103965 A TW102103965 A TW 102103965A TW 102103965 A TW102103965 A TW 102103965A TW 201402835 A TW201402835 A TW 201402835A
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alloy
tam
magnetization
tnm
hbias
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TWI547567B (en
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Toshiyuki Sawada
Noriaki Matsubara
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Sanyo Special Steel Co Ltd
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62Record carriers characterised by the selection of the material
    • G11B5/64Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent
    • G11B5/66Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent the record carriers consisting of several layers
    • G11B5/667Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent the record carriers consisting of several layers including a soft magnetic layer
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C19/00Alloys based on nickel or cobalt
    • C22C19/07Alloys based on nickel or cobalt based on cobalt
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • C22C38/10Ferrous alloys, e.g. steel alloys containing cobalt
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • C22C38/12Ferrous alloys, e.g. steel alloys containing tungsten, tantalum, molybdenum, vanadium, or niobium
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • C22C38/14Ferrous alloys, e.g. steel alloys containing titanium or zirconium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851Coating a support with a magnetic layer by sputtering

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Magnetic Record Carriers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Thin Magnetic Films (AREA)

Abstract

Provided are: an alloy for soft magnetic film layers, which has low saturation magnetic flux density and is to be used in a magnetic recording medium; and a sputtering target material. This alloy contains one or more elements selected from the group consisting of Y, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Ni, Cu, Al, B, C, Si, P, Zn, Ga, Ge and Sn, with the balance made up of Co and Fe, while satisfying, in at%, the following formulae (1)-(3). (1) 0.50 <= Fe%/(Fe% + Co%) <= 0.90 (2) 5 <= TAM <= 25 (3) 15 <= TAM + TNM <= 25 In this connection, the above-mentioned TAM and TNM are respectively defined as TAM = Y% + Ti% + Zr% + Hf% + V% + Nb% + Ta% + B%/2 and TNM = Cr% + Mo% + W% + Mn% + Ni%/3 + Cu%/3 + Al% + C% + Si% + P% + Zn% + Ga% + Ge% + Sn%.

Description

用於磁性記錄媒體之具有低飽和磁通密度的軟磁性膜層用合金及濺鍍靶材 Alloy for soft magnetic film layer with low saturation magnetic flux density for magnetic recording media and sputtering target

本申請案係基於2012年2月3日提出申請之日本國專利申請第2012-22096號主張優先全者,其全文揭示內容藉由參考併入本說明書中。 The present application is based on Japanese Patent Application No. 2012-22096, filed on Feb. 3, 2012, the entire disclosure of which is hereby incorporated by reference.

本發明係有關用於磁性記錄媒體之具有低飽和磁通密度的軟磁性膜層用合金及濺鍍靶材者。 The present invention relates to an alloy for a soft magnetic film layer having a low saturation magnetic flux density for a magnetic recording medium and a sputtering target.

近幾年來,由於磁性記錄技術之顯著進步,為使驅動器大容量化,磁性記錄媒體已朝高記錄密度化進展,可實現比以往普及之面內磁性記錄媒體更高之記錄密度的垂直磁性記錄方式已被實用化。再者,亦已對於應用垂直磁性記錄媒體方式,利用熱或微波輔助記錄之方法進行檢討。 In recent years, due to significant advances in magnetic recording technology, magnetic recording media have advanced toward higher recording densities in order to increase the capacity of the magnetic recording medium, and it is possible to realize a higher magnetic recording density than the conventional in-plane magnetic recording medium. The way has been put into practical use. Furthermore, the method of applying a perpendicular magnetic recording medium using thermal or microwave-assisted recording has also been reviewed.

上述所謂垂直磁性記錄方式為使易磁化軸對於垂直磁性記錄媒體之磁性膜中之媒體面於垂直方向配置之方式形成者,係適用於高記錄密度之方法。而且,關於垂直磁性記錄方式,已開發具有提高記錄感度之磁性記錄 膜層與軟磁性膜層之2層記錄媒體。該磁性記錄媒體一般係使用CoCrPt-SiO2系合金。 The above-described perpendicular magnetic recording method is a method in which the easy magnetization axis is formed in such a manner that the medium surface of the magnetic film of the perpendicular magnetic recording medium is disposed in the vertical direction, and is suitable for a method of high recording density. Further, regarding the perpendicular magnetic recording method, a two-layer recording medium having a magnetic recording film layer and a soft magnetic film layer for improving recording sensitivity has been developed. This magnetic recording medium generally uses a CoCrPt-SiO 2 -based alloy.

且,一般於軟磁性膜層間插入Ru膜,藉由使軟磁性膜與Ru膜之反鐵磁性(antiferromagnetic)結合(以下稱為AFC結合),而具有對於外部磁場之不感區域(以下稱為Hbias)。例如如特開2011-86356號公報(專利文獻1)所揭示般,係用以提高磁性記錄媒體在使用環境下對於外部雜訊磁場之耐性。本發明之軟磁性膜層用合金可使用於該等垂直磁性記錄方式之媒體中。 Further, a Ru film is generally interposed between the soft magnetic film layers, and the soft magnetic film and the Ru film are combined with an antiferromagnetic (hereinafter referred to as AFC bonding) to have a region insensitive to an external magnetic field (hereinafter referred to as Hbias). ). For example, as disclosed in Japanese Laid-Open Patent Publication No. 2011-86356 (Patent Document 1), it is intended to improve the resistance of a magnetic recording medium to an external noise magnetic field in a use environment. The alloy for a soft magnetic film layer of the present invention can be used in a medium for such perpendicular magnetic recording methods.

且,以往之軟磁性膜層中,必須係高飽和磁通密度(以下稱為Bs)及高非晶形形成能(以下稱為非晶質性),再者依據垂直磁性記錄媒體之用途及使用環境而定,附加要求高耐蝕性、高硬度等之各種特性。上述之要求特性中,尤其重要的是高Bs,例如專利文獻1或特開2011-181140號公報(專利文獻2)及特開2008-299905號公報(專利文獻3)中,均係以高Bs為目標。要求如此高Bs的理由係因為為使記錄膜之磁化安定化必須要一定值以上之Bs,且具有大的Hbias。 Further, in the conventional soft magnetic film layer, it is necessary to have a high saturation magnetic flux density (hereinafter referred to as Bs) and a high amorphous formation energy (hereinafter referred to as amorphous property), and further, according to the use and use of the perpendicular magnetic recording medium. Depending on the environment, various characteristics such as high corrosion resistance and high hardness are required. Among the above-mentioned required characteristics, it is particularly important that high Bs is used, for example, in Patent Document 1 or JP-A-2011-181140 (Patent Document 2) and JP-A-2008-299905 (Patent Document 3). For the goal. The reason why such a high Bs is required is that Bs having a certain value or more is required to stabilize the magnetization of the recording film, and has a large Hbias.

然而,使用高Bs之軟磁性膜亦會產生弊害。使用顯示高Bs之軟磁性膜時,有Hbias變大之傾向,雖獲得高的外部雜訊磁場耐性,但同時在記錄磁性經磁化時,該軟磁性膜所具有之過度大的磁通對周圍造成較大影響,結果寫入所必須之空間變大,導致記錄密度降低。再者,使用高Hbias膜時,亦見到磁化對於Hbias以上之施 加磁場之反應(以下稱為磁化啟動)變鈍之傾向。 However, the use of a soft magnetic film of high Bs also causes disadvantages. When a soft magnetic film exhibiting a high Bs is used, there is a tendency that Hbias becomes large, and although a high external noise magnetic field resistance is obtained, at the same time, when the magnetic magnetization is recorded, the soft magnetic film has an excessively large magnetic flux to the periphery. A large influence is caused, and the space necessary for writing is increased, resulting in a decrease in recording density. Furthermore, when using a high Hbias film, it is also seen that the magnetization is applied to Hbias or higher. The reaction of applying a magnetic field (hereinafter referred to as magnetization initiation) tends to become dull.

磁化對於Hbias及其以上之磁場之啟動模式性示於圖1。利用一般寫入用磁頭對記錄膜磁化時,係施加僅使軟磁性膜磁化飽和之磁場。因此,磁化之啟動變鈍時,施加僅磁化之大小的磁場會變得必要。如此,磁化磁場變大時,無法避免會過度對周圍造成影響,結果難以限定在較小區域進行記錄,依舊成為記錄密度降低之原因。上述兩種記錄密度降低之現象亦稱為所謂之「寫入不清晰」,抑制其一現象雖有改善寫入不清晰之效果,但若抑制兩者,則更有改善寫入不清晰之效果。 The mode of activation of the magnetization for Hbias and above is shown in Figure 1. When the recording film is magnetized by the general write head, a magnetic field that saturates only the soft magnetic film is applied. Therefore, when the activation of the magnetization becomes dull, it is necessary to apply a magnetic field of a magnitude other than magnetization. As described above, when the magnetization magnetic field becomes large, it is unavoidable that the surrounding area is excessively affected, and as a result, it is difficult to limit the recording to a small area, and the recording density is still lowered. The phenomenon that the above two kinds of recording densities are reduced is also called so-called "unclear writing". Although suppressing one phenomenon has an effect of improving the unclear writing, if the two are suppressed, the effect of writing unclearness is further improved. .

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]特開2011-86353號公報 [Patent Document 1] JP-A-2011-86353

[專利文獻2]特開2011-181140號公報 [Patent Document 2] JP-A-2011-181140

[專利文獻3]特開2008-299905號公報 [Patent Document 3] JP-A-2008-299905

為解決如上述之問題,本發明人等進行積極開發之結果,發現認為若具有超過係使記錄膜磁化安定化之最低限度之Bs的0.5T之Bs,同時即使在較低之Bs亦具有高Hbias,進而以高Hbias亦具有敏銳磁化啟動之軟磁性合金,則認為係可兼具對於外部磁場之高耐性以及因抑制了「寫入不清晰」所致之高記錄密度者。 In order to solve the problem as described above, the inventors of the present invention have actively developed the results, and found that if there is a Bs of 0.5T exceeding the minimum Bs which stabilizes the magnetization of the recording film, it is high even at a lower Bs. Hbias, in addition, a soft magnetic alloy which is also activated by a sharp magnetization with high Hbias, is considered to have high resistance to external magnetic fields and high recording density due to suppression of "unclear writing".

依據本發明之一樣態,提供一種合金,其為磁性記錄媒體中之軟磁性薄膜層用合金,其中前述合金包含由Y、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo、W、Mn、Ni、Cu、Al、B、C、Si、P、Zn、Ga、Ge、Sn所組成群組中選出之一種以上,以及其餘部分之Co及Fe而成,且以at%計滿足下述式(1)~(3): According to the same aspect of the present invention, there is provided an alloy which is an alloy for a soft magnetic film layer in a magnetic recording medium, wherein the alloy comprises Y, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, One or more selected from the group consisting of Mn, Ni, Cu, Al, B, C, Si, P, Zn, Ga, Ge, and Sn, and the remainder of Co and Fe, and satisfying at at% Equation (1)~(3):

(1)0.50≦Fe%/(Fe%+Co%)≦0.90 (1) 0.50≦Fe%/(Fe%+Co%)≦0.90

(2)5≦TAM≦25 (2) 5≦TAM≦25

(3)15≦TAM+TNM≦25 (3) 15≦TAM+TNM≦25

惟,前述TAM及TNM分別為TAM=Y%+Ti%+Zr%+Hf%+V%+Nb%+Ta%+B%/2 However, the aforementioned TAM and TNM are TAM=Y%+Ti%+Zr%+Hf%+V%+Nb%+Ta%+B%/2, respectively.

TNM=Cr%+Mo%+W%+Mn%+Ni%/3+Cu%/3+Al%+C%+Si%+P%+Zn%+Ga%+Ge%+Sn%。 TNM=Cr%+Mo%+W%+Mn%+Ni%/3+Cu%/3+Al%+C%+Si%+P%+Zn%+Ga%+Ge%+Sn%.

又,依據本發明之樣態,上述合金較好滿足下述式(4): Further, according to the aspect of the invention, the above alloy preferably satisfies the following formula (4):

(4)0.25≦(Nb%+Ta%)/(TAM+TNM)≦1.00。 (4) 0.25 ≦ (Nb% + Ta%) / (TAM + TNM) ≦ 1.00.

依據本發明另一樣態,上述合金較好滿足下述式(5)及/或(6): According to another aspect of the invention, the above alloy preferably satisfies the following formula (5) and/or (6):

(5)0≦Ti%+Zr%+Hf%+B%/2≦5 (5)0≦Ti%+Zr%+Hf%+B%/2≦5

(6)0<Cu%+Sn%+Zn%+Ga%≦10。 (6) 0 < Cu% + Sn% + Zn% + Ga% ≦ 10.

依據本發明另一樣態,上述合金較好係僅由:由Y、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo、W、Mn、 Ni、Cu、Al、B、C、Si、P、Zn、Ga、Ge、Sn所組成群組中選出之一種以上,以及其餘部分之Co及Fe所構成,且以at%計滿足下述式(1)~(3): According to another aspect of the invention, the above alloy is preferably composed only of: Y, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, One or more selected from the group consisting of Ni, Cu, Al, B, C, Si, P, Zn, Ga, Ge, and Sn, and the remainder of Co and Fe, and satisfying the following formula in at% (1)~(3):

(1)0.50≦Fe%/(Fe%+Co%)≦0.90 (1) 0.50≦Fe%/(Fe%+Co%)≦0.90

(2)5≦TAM≦25 (2) 5≦TAM≦25

(3)15≦TAM+TNM≦25 (3) 15≦TAM+TNM≦25

惟,前述TAM及TNM分別為TAM=Y%+Ti%+Zr%+Hf%+V%+Nb%+Ta%+B%/2 However, the aforementioned TAM and TNM are TAM=Y%+Ti%+Zr%+Hf%+V%+Nb%+Ta%+B%/2, respectively.

TNM=Cr%+Mo%+W%+Mn%+Ni%/3+Cu%/3+Al%+C%+Si%+P%+Zn%+Ga%+Ge%+Sn%。 TNM=Cr%+Mo%+W%+Mn%+Ni%/3+Cu%/3+Al%+C%+Si%+P%+Zn%+Ga%+Ge%+Sn%.

依據本發明另一樣態,上述合金之飽和磁通密度較好超過0.5T且未達1.1T。 According to another aspect of the invention, the saturation magnetic flux density of the above alloy preferably exceeds 0.5 T and does not reach 1.1 T.

依據本發明另一樣態,提供一種濺鍍靶材,其係由上述任一樣態之合金所成。 According to another aspect of the present invention, there is provided a sputtering target which is formed from an alloy of any of the above states.

如以上所述,本發明係提供磁性記錄媒體用之軟磁性合金及用以製作該合金薄膜之濺鍍靶材,該軟磁性合金係具有低飽和磁通密度之軟磁性非晶形合金,且係在本合金薄膜之間插入Ru等之非磁性薄膜之經反鐵磁性結合之多層膜中,為對於外部磁場不感區域較大之合金,進而對於不感區域以上之外部磁場的磁化啟動良好。如此,本用途之軟磁性合金中,積極地以低Bs為目標之思想在過去從未有過。該想法為本發明中最具特徵之思想。 As described above, the present invention provides a soft magnetic alloy for a magnetic recording medium and a sputtering target for forming the alloy thin film, the soft magnetic alloy having a soft magnetic amorphous alloy having a low saturation magnetic flux density, and In the antiferromagnetically bonded multilayer film in which a non-magnetic thin film such as Ru is interposed between the alloy films, the alloy having a large area for the external magnetic field is not well oscillated, and the magnetization of the external magnetic field of the non-inductive region or higher is preferably started. Thus, in the soft magnetic alloys of the present application, the idea of actively targeting low Bs has never been seen before. This idea is the most characteristic idea of the invention.

圖1為多層膜之磁化曲線之模式圖。 Figure 1 is a schematic view of a magnetization curve of a multilayer film.

圖2為顯示多層膜之Bs與多層膜之Hbias相關性之圖。 Figure 2 is a graph showing the Hbias correlation of Bs of a multilayer film with a multilayer film.

圖3為顯示單層膜之Ra與多層膜之Hbias對Hbias後之磁化啟動的敏銳性造成之影響的圖。 Figure 3 is a graph showing the effect of Ra of a single layer film and Hbias of a multilayer film on the sharpness of magnetization initiation after Hbias.

以下具體說明本發明。若無特別指明,則本說明書中之「%」意指at%。 The invention is specifically described below. Unless otherwise specified, "%" in this specification means at%.

本發明係關於磁性記錄媒體中之軟磁性薄膜層用合金者,該合金包含(comprising)由Y、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo、W、Mn、Ni、Cu、Al、B、C、Si、P、Zn、Ga、Ge、Sn所組成群組中選出之一種以上,以及其餘部分之Co及Fe而成,較好實質上僅由該等元素組成(consisting essentially of),更好僅由該等元素組成(consisting of)。以上,本發明中之合金,以at%表示,滿足下述式(1)~(3): The present invention relates to an alloy for a soft magnetic film layer in a magnetic recording medium, the alloy comprising: Y, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Ni, Cu, One or more selected from the group consisting of Al, B, C, Si, P, Zn, Ga, Ge, and Sn, and the remainder of Co and Fe are preferably substantially composed only of the elements (consisting essentially Of), better consisting only of these elements. As described above, the alloy in the present invention is expressed by at% and satisfies the following formulas (1) to (3):

(1)0.50≦Fe%/(Fe%+Co%)≦0.90 (1) 0.50≦Fe%/(Fe%+Co%)≦0.90

(2)5≦TAM≦25 (2) 5≦TAM≦25

(3)15≦TAM+TNM≦25 (3) 15≦TAM+TNM≦25

惟,前述TAM及TNM分別為TAM=Y%+Ti%+Zr%+Hf%+V%+Nb%+Ta%+B%/2 However, the aforementioned TAM and TNM are TAM=Y%+Ti%+Zr%+Hf%+V%+Nb%+Ta%+B%/2, respectively.

TNM=Cr%+Mo%+W%+Mn%+Ni%/3+Cu%/3+Al%+C%+ Si%+P%+Zn%+Ga%+Ge%+Sn%。 TNM=Cr%+Mo%+W%+Mn%+Ni%/3+Cu%/3+Al%+C%+ Si%+P%+Zn%+Ga%+Ge%+Sn%.

以下,針對本發明詳細加以說明。 Hereinafter, the present invention will be described in detail.

首先,為了探討軟磁性膜組成對Hbias造成之影響,針對各種組成之軟磁性膜評價Hbias後,了解到Hbias之大小不僅隨Bs之大小而變化,亦隨Fe%/(Fe%+Co%)而變化。亦即,了解到超過0.5T且未達1.1T時,即使為具有比過去例更低之Bs之軟磁性膜,藉由處於特定之Fe%/(Fe%+Co%)之範圍,亦可獲得高Hbias。 First, in order to investigate the effect of soft magnetic film composition on Hbias, after evaluating Hbias for soft magnetic films of various compositions, it is understood that the size of Hbias varies not only with the size of Bs, but also with Fe%/(Fe%+Co%). And change. That is, when it is found that more than 0.5T and less than 1.1T, even a soft magnetic film having a lower Bs than the conventional example can be in a specific Fe%/(Fe%+Co%) range. Get high Hbias.

接著,針對由Hbias以上之施加磁場所致之磁化啟動亦進行檢討後,可知Fe、Co以外之添加元素中,Nb、Ta較多,Ti、Zr、Hf、B較少,且Cu、Sn、Zn、Ga係少量添加,則有影響。因此,可知藉由將該等元素設為特定添加量,而具有高的Hbias,同時亦附加地獲得顯示敏銳之磁化啟動效果。 Next, after reviewing the magnetization initiation by the applied magnetic field of Hbias or more, it is known that there are many Nb and Ta among the additive elements other than Fe and Co, and there are few Ti, Zr, Hf, and B, and Cu, Sn, and When Zn or Ga is added in a small amount, it has an effect. Therefore, it is understood that the elements have a high Hbias by setting the elements to a specific addition amount, and additionally, a display magnetization start effect is additionally obtained.

基於如此之新的見解,與過去之垂直磁性記錄媒體用之軟磁性膜用合金之要求特性全然不同,發現具有較低之Bs同時亦顯示大的Hbias,進而具有高的Hbias同時藉由Hbias以上之施加磁場所致之磁化啟動敏銳之軟磁性合金,可兼具在過去係困難的對於外部雜訊磁場之高耐性及因寫入不清晰受抑制所致之高記錄密度化,因而完成本發明。以下,說明本發明合金之限定理由。 Based on such new insights, it is completely different from the required characteristics of alloys for soft magnetic films used in perpendicular magnetic recording media in the past, and it has been found that Hs has a lower Bs and also shows a large Hbias, and thus has a high Hbias and a higher Hbias. The magnetization-induced soft magnetic alloy caused by the application of the magnetic field can have high resistance to external noise magnetic fields and high recording density due to suppression of unclear writing in the past, thus completing the present invention. . Hereinafter, the reasons for limitation of the alloy of the present invention will be described.

(a)關於0.50≦Fe%/(Fe%+Co%)≦0.90 (a) About 0.50≦Fe%/(Fe%+Co%)≦0.90

Fe及Co係用以具有為使記錄膜之磁化安定之最低限 度所需磁化之元素,Bs與Fe%/(Fe%+Co%)之行為顯示為所謂之史雷特-包立曲線(Slater-Pauling Curve)等。再者,在較低之Bs中,Fe%/(Fe%+Co%)亦係用以具有高Hbias之重要因子。Fe%/(Fe%+Co%)未達0.50時,與具有相同程度之Bs、0.50以上之軟磁性膜相較,Hbias會變小。關於此現象之詳細理由雖尚不明確,但認為AFC結合與軟磁性膜之Bs一起參與因磁性元素中之3d電子軌道所致之層間相互作用,推測此會隨Fe與Co之比率而變化而產生影響。且,Fe%/(Fe%+Co%)超過0.90時,Bs顯著降低,無法獲得充分之Hbias。又,較佳之Fe%/(Fe%+Co%)範圍為0.55以上、0.85以下,更好為0.60以上、0.80以下。 Fe and Co are used to have a minimum of the magnetization stability of the recording film. The element of the desired magnetization, the behavior of Bs and Fe%/(Fe%+Co%) is shown as a so-called Slater-Pauling Curve. Furthermore, in the lower Bs, Fe%/(Fe%+Co%) is also used as an important factor with high Hbias. When Fe%/(Fe%+Co%) is less than 0.50, Hbias becomes smaller than a soft magnetic film having the same degree of Bs and 0.50 or more. Although the detailed reason for this phenomenon is not clear, it is considered that the AFC bond participates in the interlayer interaction due to the 3d electron orbital in the magnetic element together with the Bs of the soft magnetic film, and it is presumed that this will vary with the ratio of Fe to Co. Have an impact. Further, when Fe%/(Fe%+Co%) exceeds 0.90, Bs is remarkably lowered, and sufficient Hbias cannot be obtained. Further, the preferred Fe%/(Fe%+Co%) range is 0.55 or more and 0.85 or less, more preferably 0.60 or more and 0.80 or less.

(b)關於5≦TAM≦25及15≦TAM+TNM≦25 (b) About 5≦TAM≦25 and 15≦TAM+TNM≦25

關於Fe、Co以外之元素的效果如下述。Ti、Zr、Hf、B為造成非晶質化促進與Bs降低之元素,同時亦為會使磁化啟動大幅鈍化之元素。又,關於B,由於B使Bs降低及非晶質性增加之效果與Ti、Zr、Hf相比約為1/2,故在TAM中以B%/2進行處理。惟,濺鍍靶材中,由於B會生成特別硬質之化合物(例如硼化物),而產生必須使機械加工時之加工速度降低之情況,故B作為TAM中分類之元素以複合地添加比單獨添加更佳。根據該點時,(B/2)/TAM較好為0.8以下,更好為0.5以下。 The effects on elements other than Fe and Co are as follows. Ti, Zr, Hf, and B are elements that cause amorphization promotion and Bs reduction, and are also elements that greatly inactivate the magnetization initiation. Further, in B, since B has a effect of lowering Bs and increasing amorphousness by about 1/2 compared with Ti, Zr, and Hf, it is treated at B%/2 in TAM. However, in the sputtering target, since B generates a particularly hard compound (for example, boride), the processing speed at the time of machining must be lowered. Therefore, B is added as a composite element in the TAM. Add better. From this point, (B/2)/TAM is preferably 0.8 or less, more preferably 0.5 or less.

Y、V、Cr、Mo、W亦為造成Bs降低同時使 磁化啟動稍鈍化之元素。且,Y、V亦有助於非晶質化之促進。Nb、Ta為造成非晶質化促進與Bs降低同時具有使磁化啟動敏銳之效果的重要元素。Mn、Al、Si、Ge、P亦為造成Bs降低同時具有使磁化啟動稍鈍化之元素。Ni、Cu為Bs降低幅度小的元素,關於Cu,係少量添加時具有使磁化啟動敏銳之效果,但大量添加時會使磁化啟動稍降低之元素。 Y, V, Cr, Mo, W also cause Bs to decrease while making Magnetization initiates a slightly passivated element. Moreover, Y and V also contribute to the promotion of amorphization. Nb and Ta are important elements which contribute to the effect of making the magnetization start sensitive while causing the increase in the amorphization and the decrease in the Bs. Mn, Al, Si, Ge, and P are also elements which cause a decrease in Bs and a slight passivation of the magnetization initiation. Ni and Cu are elements having a small decrease in Bs, and when Cu is added in a small amount, it has an effect of making the magnetization start sensitive, but when a large amount is added, the magnetization start-up is slightly lowered.

又,Ni、Cu與其他TAM或TNM中分類之元素相較,Bs之降低幅度約為1/3,故在TNM中,可以Ni%/3、Cu%/3進行處理。Ga、Sn、Zn為使Bs降低,同時少量添加時有使磁化啟動敏銳之效果,但大量添加時會使磁化啟動稍鈍化之元素。因此,所有元素均具有使Bs降低之效果,同時亦為對非晶質性改善效果或磁化啟動造成影響之元素。藉由使該等添加量最適化,而獲得本發明之合金。 Further, compared with the elements classified in other TAM or TNM, Ni and Cu have a reduction in Bs of about 1/3, so in TNM, Ni%/3 and Cu%/3 can be treated. Ga, Sn, and Zn are used to lower the Bs, and at the same time, a small amount of addition has the effect of making the magnetization start sensitive, but when added in a large amount, the magnetization initiates a slightly passivated element. Therefore, all of the elements have an effect of lowering Bs, and are also elements which affect the improvement of the amorphous property or the start of magnetization. The alloy of the present invention is obtained by optimizing the amount of addition.

TAM未達5時,無法獲得充分之非晶質性,超過25時,Bs變低,無法獲得充分之Hbias。因此TAM為5以上、25以下,較好為7以上、23以下,更好為9以上、未達20。又,Nb與Ta在濺鍍靶材中,由於會與Fe或Co生成脆性之金屬間化合物,故作為TAM僅添加Nb或/及Ta之情況,有必要以使機械加工時不會發生龜裂或缺陷之方式減低加工速度。考慮該點時,作為TAM僅添加Nb或/及Ta之情況下,TAM較好設為未達20。 When TAM is less than 5, sufficient amorphousness cannot be obtained. When it exceeds 25, Bs becomes low and sufficient Hbias cannot be obtained. Therefore, the TAM is 5 or more and 25 or less, preferably 7 or more and 23 or less, more preferably 9 or more, and less than 20. Further, since Nb and Ta are brittle intermetallic compounds with Fe or Co in the sputtering target, it is necessary to add only Nb or/and Ta as TAM, so that cracking does not occur during machining. Or the way the defect reduces the processing speed. When this point is considered, in the case where only Nb or/and Ta is added as the TAM, the TAM is preferably set to less than 20.

TAM+TNM未達15時由於Bs變大故Hbias增 加,但磁化啟動會變鈍。TAM+TNM超過25時,Bs減小且Hbias會變小。因此,TAM+TNM為15以上、25以下,較好為17以上、23以下,更好為18以上、21以下。 TAM+TNM is less than 15 when Hs is increased due to Bs becoming larger Plus, but the magnetization starts to become dull. When TAM+TNM exceeds 25, Bs decreases and Hbias becomes smaller. Therefore, the TAM+TNM is 15 or more and 25 or less, preferably 17 or more and 23 or less, more preferably 18 or more and 21 or less.

(c)關於0.25≦(Nb%+Ta%)/(TAM+TNM)≦1.00 (c) About 0.25 ≦ (Nb% + Ta%) / (TAM + TNM) ≦ 1.00

如上述,Nb、Ta於本合金中,雖為具有使磁化啟動敏銳之附加效果的重要元素,但(Nb%+Ta%)/(TAM+TNM)未達0.25時,無法獲得該效果。且TAM中由於均包含Nb及Ta之添加量,故必然(Nb%+Ta%)/(TAM+TNM)之上限成為1.00。因此,(Nb%+Ta%)/(TAM+TNM)為0.25以上、1.00以下,較好為0.40以上、未達1.00,更好為0.60以上、未達1.00。 As described above, Nb and Ta are important elements having an additional effect of sharpening the magnetization in the present alloy, but when (Nb%+Ta%)/(TAM+TNM) is less than 0.25, this effect cannot be obtained. Further, since the amount of addition of Nb and Ta is included in the TAM, the upper limit of (Nb%+Ta%)/(TAM+TNM) is inevitably 1.00. Therefore, (Nb%+Ta%)/(TAM+TNM) is 0.25 or more and 1.00 or less, preferably 0.40 or more, less than 1.00, more preferably 0.60 or more, and less than 1.00.

(d)關於0≦Ti%+Zr%+Hf%+B%/2≦5及0<Cu%+Sn%+Zn%+Ga%≦10 (d) About 0≦Ti%+Zr%+Hf%+B%/2≦5 and 0<Cu%+Sn%+Zn%+Ga%≦10

如上述,Ti、Zr、Hf、B在本合金中,為會使磁化啟動大幅鈍化之元素,故藉由對其合計量之上限嚴格規定,可以附加效果獲得更敏銳之磁化啟動。Ti%+Zr%+Hf%+B%/2超過5時,無法獲得使磁化啟動敏銳之效果。因此,Ti%+Zr%+Hf%+B%/2為0以上、5以下,較好為3以下,更好為0。 As described above, in the present alloy, Ti, Zr, Hf, and B are elements which greatly inactivate the magnetization start. Therefore, by strictly defining the upper limit of the total amount of the alloy, it is possible to obtain a more sensitive magnetization start by an additional effect. When Ti%+Zr%+Hf%+B%/2 exceeds 5, the effect of making the magnetization start sensitive is not obtained. Therefore, Ti%+Zr%+Hf%+B%/2 is 0 or more and 5 or less, preferably 3 or less, more preferably 0.

如上述,Cu、Sn、Zn、Ga在本合金中,由於係少量添加時有使磁化啟動敏銳之附加效果的元素,故藉 由以少量範圍積極添加,而獲得更敏銳之磁化啟動。因此,Cu%+Sn%+Zn%+Ga%超過10時,無法獲得該效果。因此,Cu%+Sn%+Zn%+Ga%係多於0、且10以下,較好為1以上、8以下,更好為2以上、6以下。又,該兩式中,僅滿足任一者之情況,均可獲得使磁化啟動敏銳之附加效果。 As described above, in the present alloy, Cu, Sn, Zn, and Ga are elements which have an additional effect of sharpening the magnetization when added in a small amount. A more sensitive magnetization start is obtained by actively adding in a small amount range. Therefore, when Cu%+Sn%+Zn%+Ga% exceeds 10, this effect cannot be obtained. Therefore, Cu%+Sn%+Zn%+Ga% is more than 0 and 10 or less, preferably 1 or more and 8 or less, more preferably 2 or more and 6 or less. Further, in both of the two equations, the effect of making the magnetization activation sharp can be obtained only if either one is satisfied.

如上述之各種元素對Bs之影響以外之磁化啟動之影響,其詳細理由並不明確,但推測如下。磁化啟動對於Hbias以上之施加磁場之敏銳性,觀察到軟磁性合金之濺鍍膜表面粗糙度有影響之傾向。藉由Hbias以上之外部磁場啟動磁化之現象認為係因軟磁性膜與Ru膜之界面之AFC結合無法耐受大的施加磁場而引起磁化反轉,但軟磁性膜之表面較粗糙,於兩膜之界面存在有凹凸時,有混合存在較快引起局部磁化反轉之部位及較慢引起磁化反轉之部位之可能性。 The detailed reason for the influence of the magnetization start other than the influence of various elements described above on Bs is not clear, but it is presumed as follows. The magnetization initiation is sensitive to the applied magnetic field above Hbias, and the surface roughness of the sputter film of the soft magnetic alloy is observed to have an influence. The phenomenon of magnetization initiated by an external magnetic field above Hbias is considered to be due to the fact that the AFC bond at the interface between the soft magnetic film and the Ru film cannot withstand a large applied magnetic field, causing magnetization reversal, but the surface of the soft magnetic film is rough, on both films. When there is unevenness at the interface, there is a possibility that a portion where the local magnetization reversal occurs relatively quickly and a portion where the magnetization reversal is caused to be slow is mixed.

如此,若依據部位而發生磁化反轉行為不一致時,以膜全體而言,磁化啟動會變緩慢。因此,考慮是否能見到濺鍍膜表面粗糙度與磁化啟動之敏銳性之相關性。再者,針對添加元素對濺鍍膜表面粗糙度之影響,則推測作為非晶質合金之自由體積與過量自由體積有影響之可能性。該等兩體積為相當於非晶質合金中原子與原子間間隙之體積,該體積較大時,合金中原子未密集堆積,因此,認為濺鍍膜中以原子尺寸等級之表面粗糙度變大。 As described above, when the magnetization reversal behavior does not coincide depending on the portion, the magnetization start becomes slow as a whole of the film. Therefore, consider whether the correlation between the surface roughness of the sputter film and the acuity of magnetization initiation can be seen. Furthermore, the influence of the additive element on the surface roughness of the sputtered film is presumed to be an influence of the free volume of the amorphous alloy and the excess free volume. These two volumes correspond to the volume of the interatomic gap between the atoms in the amorphous alloy. When the volume is large, the atoms in the alloy are not densely packed. Therefore, it is considered that the surface roughness of the sputtering film is increased in atomic size.

雖暗示兩體積與非晶質之安定性有相關之可 能性,但本發明中,使磁化啟動大幅鈍化之Ti、Zr、Hf、B為特別使非晶質安定化之元素,而少量添加之使磁化啟動敏銳之Cu、Ga、Sn、Zn為使非晶質性降低之元素。再者,使磁化啟動敏銳之重要元素的Nb、Ta與Ti、Zr、Hf、B相較,為促進非晶質化效果較低之元素。 Although suggesting that the two volumes are related to the stability of the amorphous However, in the present invention, Ti, Zr, Hf, and B which greatly inactivate the magnetization start are elements which are particularly stable to amorphous, and a small amount of Cu, Ga, Sn, and Zn which are sensitive to magnetization activation are used. An element of reduced amorphousness. Further, Nb and Ta which are important elements for magnetization activation are compared with Ti, Zr, Hf, and B, and are elements which promote a low amorphous effect.

[實施例] [Examples]

以下,針對本發明以實施例具體加以說明。 Hereinafter, the present invention will be specifically described by way of examples.

以氣體霧化法製作表1所示組成之軟磁性合金粉末。將熔解母材以25kg在減壓Ar中進行感應熔解,自直徑8mm之噴嘴使合金熔液流出,立即噴霧高壓Ar氣體而霧化。將該粉末分級為500μm以下,使用作為HIP成形(熱均壓壓製)之原料粉末。HIP成形用鋼環坯(billet)係於直徑200mm、長度10mm之碳鋼製罐中填充原料粉末後,經真空脫氣並封入而製作。該粉末填充鋼環坯係在溫度1100℃、壓力120MPa、保持溫度2小時之條件下進行HIP成形。隨後,自成形體製作直徑95mm、厚度2mm之軟磁性合金濺鍍靶材。使用該軟磁性合金製之濺鍍靶材製作軟磁性薄膜。且,Ru薄膜之製作係使用市售之Ru金屬製之濺鍍靶材。 A soft magnetic alloy powder having the composition shown in Table 1 was produced by a gas atomization method. The molten base material was inductively melted in a reduced pressure Ar at 25 kg, and the molten alloy was allowed to flow out from a nozzle having a diameter of 8 mm, and immediately sprayed with a high-pressure Ar gas to be atomized. This powder was classified into 500 μm or less, and used as a raw material powder for HIP molding (hot pressure pressing). A billet for HIP forming is produced by filling a raw material powder into a carbon steel can having a diameter of 200 mm and a length of 10 mm, and then degassing it by vacuum and sealing it. The powder-filled steel ring blank was subjected to HIP molding under the conditions of a temperature of 1,100 ° C, a pressure of 120 MPa, and a holding temperature of 2 hours. Subsequently, a soft magnetic alloy sputtering target having a diameter of 95 mm and a thickness of 2 mm was produced from the molded body. A soft magnetic film was produced using the sputtering target made of the soft magnetic alloy. Further, in the production of the Ru film, a commercially available sputtering target made of Ru metal was used.

將腔室內真空排氣至1×10-4Pa以下,投入0.6Pa純度99.99%之Ar氣體進行濺鍍。首先,於洗淨之玻璃基板上成膜20nm之軟磁性合金薄膜(下軟磁性層),於其上,成膜0.8nm之Ru膜,進而於其上與上述 膜同樣成膜20nm軟磁性合金薄膜(上軟磁性層),製作多層膜。又,全部之實施例及比較例中之多層膜之上下軟磁性膜均使用相同合金。且,亦製作僅成膜下軟磁性膜之單層膜作為軟磁性膜之Bs、結晶構造、表面粗糙度評價用。 The chamber was evacuated to a pressure of 1 × 10 -4 Pa or less, and an Ar gas of 0.6 Pa purity and 99.99% was thrown and sputtered. First, a 20 nm soft magnetic alloy film (lower soft magnetic layer) was formed on a cleaned glass substrate, and a 0.8 nm Ru film was formed thereon, and a 20 nm soft magnetic alloy was formed thereon as well as the above film. A film (upper soft magnetic layer) was used to produce a multilayer film. Further, in the entire examples and the comparative examples, the same alloy was used for the upper soft magnetic film of the multilayer film. Further, a single layer film of only the soft magnetic film under film formation was also used as the Bs of the soft magnetic film, the crystal structure, and the surface roughness evaluation.

將如此製作之單層膜作為試料,分別對Bs使用VSM(試料振動型磁束計),結晶構造使用X射線繞射,算術平均粗糙度Ra(表面粗糙度)使用AFM(原子力顯微鏡)進行評價。關於結晶構造,非晶質時記為○,非晶質中見到一部份微結晶者記為△,結晶時記為×。再者,自多層膜評價Hbias及磁化啟動之敏銳性。該等結果如表2所示。 The monolayer film thus produced was used as a sample, and VSM (sample vibration type magnetic flux meter) was used for Bs, X-ray diffraction was used for crystal structure, and arithmetic mean roughness Ra (surface roughness) was evaluated by AFM (atomic force microscope). Regarding the crystal structure, ○ is amorphous, and Δ is a part of microcrystals in the amorphous, and × is crystallization. Furthermore, the sensitivity of Hbias and magnetization initiation was evaluated from the multilayer film. These results are shown in Table 2.

圖1為多層膜之磁化曲線之模式圖。如該圖所示,Hbias係以啟動多層膜之磁化時之施加磁場進行評價,磁化啟動之敏銳性係以多層膜之磁化飽和之施加磁場(Hsat)與Hbias之比,即Hsat/Hbias進行評價。圖1(a)顯示Hbias較大,磁化啟動敏銳之例,圖1(b)顯示Hbias較小、磁化啟動較鈍之例。亦即,該值較小越接近1則顯示磁化啟動越敏銳。該值未達1.2時記為◎,為1.2以上、未達1.4時記為○,1.4以上、未達1.8時記為△,1.8以上時記為×。 Figure 1 is a schematic view of a magnetization curve of a multilayer film. As shown in the figure, Hbias is evaluated by the applied magnetic field when the magnetization of the multilayer film is initiated, and the sensitivity of the magnetization initiation is evaluated by the ratio of the applied magnetic field (Hsat) of the multilayer film to Hbias, that is, Hsat/Hbias. . Fig. 1(a) shows an example in which Hbias is large and magnetization is sharp, and Fig. 1(b) shows an example in which Hbias is small and magnetization is relatively blunt. That is, the closer the value is to 1, the more sensitive the magnetization start is. When the value is less than 1.2, it is ◎, and it is 1.2 or more. When it is less than 1.4, it is ○, 1.4 or more, when it is less than 1.8, it is △, and when it is 1.8 or more, it is represented by ×.

[表1] [Table 1]

[表2] [Table 2]

如表1及表2所示,編號1~28為本發明例,編號29~39為比較例。 As shown in Tables 1 and 2, numbers 1 to 28 are examples of the invention, and numbers 29 to 39 are comparative examples.

圖2為表2之結果中,以多層膜之Hbias為縱軸,以單層膜之Bs為橫軸作圖所得之圖。如該圖中之實線之橢圓可知,為了獲得高的Hbias,高Bs為必要。又,該實線之橢圓中之數據均係Fe%/(Fe%+Co%)在0.5~0.9之範圍者。相對於此,圖2中比該實線橢圓更下方位置之比較例編號29~31由於Fe%/(Fe%+Co%)未達0.5,故具有與實線橢圓內之數據同等之Bs,同時Hbias限於較低之值。亦即,藉由使Fe%/(Fe%+Co%)成為0.50~0.90,即使為比較低之Bs亦可獲得高Hbias。 2 is a graph obtained by plotting Hbias of a multilayer film as a vertical axis and Bs of a single layer film as a horizontal axis in the results of Table 2. As shown by the ellipse of the solid line in the figure, in order to obtain high Hbias, high Bs is necessary. Further, the data in the ellipse of the solid line is in the range of Fe%/(Fe%+Co%) in the range of 0.5 to 0.9. On the other hand, in Comparative Example Nos. 29 to 31 in FIG. 2 which is lower than the solid ellipse, since Fe%/(Fe%+Co%) is less than 0.5, Bs having the same data as in the solid ellipse is obtained. At the same time Hbias is limited to lower values. That is, by making Fe%/(Fe%+Co%) 0.50 to 0.90, high Hbias can be obtained even for a relatively low Bs.

另一方面,圖2中位於左下虛線之橢圓內之比較例編號32~36由於Bs顯著低,故Hbias亦限於較低。且,比較例編號39係Fe%/(Fe%+Co%)為較低之0.4,TAM+TNM較小而未達15之組成,為以往技術常見之高Bs組成。該組成係在圖2中位於實線橢圓右方之作圖,與實線之橢圓中組成相較,由於獲得同樣高的Hbias,故有必要為顯著較大之Bs,此種組成會引起所謂之「寫入不清晰」。 On the other hand, in Comparative Example Nos. 32 to 36 in the ellipse of the lower left dotted line in Fig. 2, since Bs is remarkably low, Hbias is also limited to be low. Further, Comparative Example No. 39 is a composition in which Fe%/(Fe%+Co%) is 0.4, and TAM+TNM is small and does not reach 15, which is a high Bs composition which is common in the prior art. This composition is plotted on the right side of the solid ellipse in Figure 2. Compared to the composition of the ellipse in the solid line, it is necessary to obtain a significantly larger Hbia, which is a significantly larger Bs. "The writing is not clear."

圖3係表2之結果中,以多層膜之Hbias為縱軸,以單層膜之Ra為橫軸予以作圖,圖表之記號係隨施加Hbias以上之外部磁場時之多層膜磁化啟動敏銳度而變化者。由該圖可知,即使為具有同等Hbias之多層膜,於單層膜之表面粗糙度(Ra)較大時,磁化啟動亦劣化。 Figure 3 is a graph showing the results of Table 2, with the Hbias of the multilayer film as the vertical axis and the Ra of the single layer film as the horizontal axis. The symbol of the graph is the magnetization initiation acuity of the multilayer film with the external magnetic field above Hbias applied. And the change. As is clear from the figure, even in the case of a multilayer film having the same Hbias, when the surface roughness (Ra) of the single layer film is large, the magnetization start is deteriorated.

接著,針對表2所示之各比較例數據進行說明。比較例編號29~31由於Fe%/(Fe%+Co%)值均較低,儘管具有0.80~0.86T之Bs,亦無法獲得高Hbias。比較例編號32及33由於Fe%/(Fe%+Co%)過高,比較例編號34及35係TAM+TNM較高,比較例編號36係TAM及TAM+TNM較高,故Bs均顯著較低,無法獲得高Hbias。 Next, the data of each comparative example shown in Table 2 will be described. Comparative Examples Nos. 29 to 31 have low Fe%/(Fe%+Co%) values, and although they have a Bs of 0.80 to 0.86 T, high Hbias cannot be obtained. In Comparative Examples Nos. 32 and 33, since Fe%/(Fe%+Co%) was too high, Comparative Examples Nos. 34 and 35 were higher in TAM+TNM, and Comparative Example No. 36 was higher in TAM and TAM+TNM, so Bs was remarkable. Lower, unable to get high Hbias.

比較例編號37由於TAM+TNM較低,故雖Bs高且獲得高Hbias,但對於超過Hbias之外部磁場之磁化啟動較鈍。比較例編號38之TAM低,為結晶質,因結晶粒引起之單層膜表面之凹凸導致Ra較高,對於超過Hbias之外部磁場之磁化啟動較鈍。比較例編號39由於Fe%/(Fe%+Co%)值較低,TAM+TNM較低,儘管具有顯著高的Bs,僅能獲得與實施例同等程度之Hbias,如此顯著高Bs之組成會引起所謂之「寫入不清晰」。 In Comparative Example No. 37, since TAM+TNM is low, although Bs is high and high Hbias is obtained, the magnetization start for the external magnetic field exceeding Hbias is blunt. Comparative Example No. 38 had a low TAM and was crystalline, and the irregularities on the surface of the single layer film caused by the crystal grains caused Ra to be high, and the magnetization for the external magnetic field exceeding Hbias was blunt. Comparative Example No. 39 because the Fe%/(Fe%+Co%) value is low, TAM+TNM is low, and although it has a significantly high Bs, only Hbias can be obtained to the same extent as the embodiment, so that the composition of Bs is significantly higher. Caused the so-called "writing is not clear."

與該等相較可知,實施例編號1~28均在本發明範圍內,故係未達1.1T的比以往技術更低之Bs,同時具有高Hbias,進而對於超過Hbias之施加磁場顯示敏銳之磁化啟動。由該種組成,可兼具對於高外部雜訊磁場之耐性及抑制了因Bs過高引起之寫入不清晰。又,實施例編號8~12之(Nb%+Ta%)/(TAM+TNM)在0.5~1.0之範圍,故由實施例編號1~7,均可獲得單層膜之粗糙度(Ra)小且磁化啟動敏銳之附加效果。 Comparing with these, it can be seen that the embodiment numbers 1 to 28 are all within the scope of the present invention, so that the Bs which is less than 1.1 T is lower than the prior art, and has high Hbias, and thus is sharply sensitive to the applied magnetic field exceeding Hbias. Magnetization starts. According to this kind of composition, it is possible to have resistance to high external noise magnetic fields and to suppress unclear writing due to excessive Bs. Further, in the examples Nos. 8 to 12 (Nb% + Ta%) / (TAM + TNM) are in the range of 0.5 to 1.0, the roughness of the single layer film (Ra) can be obtained from the embodiment numbers 1 to 7. Small and magnetized to activate the sharp additional effect.

再者,實施例編號13~28之Ti%+Zr%+Hf%+B%/2為5以下及/或Cu%+Sn%+Zn%-+Ga%超過0且1以下 ,故由實施例編號1~7,均可獲得單層膜之粗糙度(Ra)小且磁化啟動敏銳之附加效果。又,實施例編號23為實施例中具有最高Hbias,且Ti%+Zr%+Hf%+B%/2為5以下,故可知具有與實施例編號1~7同等程度之磁化啟動。 Further, Ti%+Zr%+Hf%+B%/2 of Example Nos. 13 to 28 are 5 or less and/or Cu%+Sn%+Zn%-+Ga% exceeds 0 and 1 or less. Therefore, from the embodiment numbers 1 to 7, the additional effect of the roughness (Ra) of the single layer film and the sharpness of the magnetization start can be obtained. Further, Example No. 23 has the highest Hbias in the examples, and Ti%+Zr%+Hf%+B%/2 is 5 or less. Therefore, it is understood that magnetization starting is equivalent to that of the embodiment numbers 1 to 7.

如上述,本發明之軟磁性合金由於係具有使記錄膜磁化安定之最低限度之Bs,同時即使在較低Bs亦具有高Hbias,進而具有敏銳之磁化啟動之附加效果之軟磁性合金,故可發揮可提供可兼具對於外部磁場之高耐性及因抑制了「寫入不清晰」所致之高記錄密度兩者,且具有低飽和磁通密度之軟磁性膜層用合金及濺鍍靶材之極優異效果者。 As described above, the soft magnetic alloy of the present invention has a soft magnetic alloy which has a minimum Bs for magnetizing the recording film and has a high Hbias even at a lower Bs, and has an additional effect of a sharp magnetization start. An alloy for soft magnetic film layers and a sputtering target that can provide both high resistance to external magnetic fields and high recording density due to "unclear writing" and low saturation magnetic flux density Very good effect.

Claims (6)

一種合金,其為磁性記錄媒體中之軟磁性薄膜層用合金,其中前述合金包含由Y、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo、W、Mn、Ni、Cu、Al、B、C、Si、P、Zn、Ga、Ge、Sn所組成群組中選出之一種以上,以及其餘部分之Co及Fe而成,且以at%計滿足下述式(1)~(3):(1)0.50≦Fe%/(Fe%+Co%)≦0.90 (2)5≦TAM≦25 (3)15≦TAM+TNM≦25惟,前述TAM及TNM分別為TAM=Y%+Ti%+Zr%+Hf%+V%+Nb%+Ta%+B%/2 TNM=Cr%+Mo%+W%+Mn%+Ni%/3+Cu%/3+Al%+C%+Si%+P%+Zn%+Ga%+Ge%+Sn%。 An alloy which is an alloy for a soft magnetic film layer in a magnetic recording medium, wherein the alloy comprises Y, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Ni, Cu, Al, One or more selected from the group consisting of B, C, Si, P, Zn, Ga, Ge, and Sn, and the remainder of Co and Fe, and satisfying the following formula (1) to (3) in at% ): (1) 0.50 ≦ Fe% / (Fe% + Co%) ≦ 0.90 (2) 5 ≦ TAM ≦ 25 (3) 15 ≦ TAM + TNM ≦ 25 However, the aforementioned TAM and TNM are TAM = Y% + Ti%+Zr%+Hf%+V%+Nb%+Ta%+B%/2 TNM=Cr%+Mo%+W%+Mn%+Ni%/3+Cu%/3+Al%+C %+Si%+P%+Zn%+Ga%+Ge%+Sn%. 如請求項1之合金,其滿足下述式(4):(4)0.25≦(Nb%+Ta%)/(TAM+TNM)≦1.00。 The alloy of claim 1, which satisfies the following formula (4): (4) 0.25 ≦ (Nb% + Ta%) / (TAM + TNM) ≦ 1.00. 如請求項1或2之合金,其滿足下述式(5)及/或(6)(5)0≦Ti%+Zr%+Hf%+B%/2≦5 (6)0<Cu%+Sn%+Zn%+Ga%≦10。 The alloy of claim 1 or 2, which satisfies the following formula (5) and/or (6) (5) 0 ≦ Ti% + Zr% + Hf% + B% / 2 ≦ 5 (6) 0 < Cu% +Sn%+Zn%+Ga%≦10. 如請求項1或2之合金,其中前述合金係僅由:由Y、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo、W、Mn、Ni、Cu、Al、B、C、Si、P、Zn、Ga、Ge、Sn所組成群組中選出之一種以上,以及其餘部分之Co及Fe所構成, 且以at%計滿足下述式(1)~(3):(1)0.50≦Fe%/(Fe%+Co%)≦0.90 (2)5≦TAM≦25 (3)15≦TAM+TNM≦25惟,前述TAM及TNM分別為TAM=Y%+Ti%+Zr%+Hf%+V%+Nb%+Ta%+B%/2 TNM=Cr%+Mo%+W%+Mn%+Ni%/3+Cu%/3+Al%+C%+Si%+P%+Zn%+Ga%+Ge%+Sn%。 The alloy of claim 1 or 2, wherein the alloy is only composed of: Y, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Ni, Cu, Al, B, C, Si One or more selected from the group consisting of P, Zn, Ga, Ge, and Sn, and the remainder of Co and Fe, And satisfying the following formula (1) to (3) in at%: (1) 0.50 ≦ Fe% / (Fe% + Co%) ≦ 0.90 (2) 5 ≦ TAM ≦ 25 (3) 15 ≦ TAM + TNM ≦25, except for the above TAM and TNM are TAM=Y%+Ti%+Zr%+Hf%+V%+Nb%+Ta%+B%/2 TNM=Cr%+Mo%+W%+Mn% +Ni%/3+Cu%/3+Al%+C%+Si%+P%+Zn%+Ga%+Ge%+Sn%. 如請求項1或2之合金,其中飽和磁通密度超過0.5T且未達1.1T。 An alloy according to claim 1 or 2, wherein the saturation magnetic flux density exceeds 0.5 T and does not reach 1.1 T. 一種濺鍍靶材,其係用於製造由如請求項1~5中任一項之合金所組成之軟磁性薄膜。 A sputtering target for use in the manufacture of a soft magnetic film composed of the alloy of any one of claims 1 to 5.
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