TW201339587A - Connector for semiconductor device testing equipment and test board for burn-in tester - Google Patents

Abstract

A connector for semiconductor device testing equipment and a test board for a burn-in tester are provided to prevent damage to connection pins by guiding the stable insertion of the connection pins using a ground plate. A connector(120) for semiconductor device testing equipment comprises multiple connection pins(121), one or more ground plates(122), and a receiving frame(123). The ground plates improve the properties of electrical signals transferred through the connection pins. The receiving frame receives and supports the connection pins and the ground plates.

Description

Connector for semiconductor component inspection device and test board for aging test equipment

The present invention relates to a connector for a semiconductor element inspection device.

After the semiconductor component is produced, various electrical tests are performed, and by this test, it is confirmed whether the pattern is correctly formed, and whether the electrical action is normal in a high temperature or low temperature environment.

Generally, a semiconductor element operates in accordance with application of an electrical signal, and therefore it is necessary to perform testing in the case where an electrical connection is made between an inspection device (for example, a test device) and a semiconductor element. Therefore, in the semiconductor element inspection apparatus, a plurality of connectors (outlets for electrical connection) are used in order to form an electrical connection between the semiconductor element side and the test side.

For example, in order to test a semiconductor component packaged in a high temperature environment, a burn-in tester is used, and the burn-in test device is required to have a test substrate for testing a plurality of semiconductor components mounted on the test board. A plurality of semiconductor components are electrically connected to the test substrate through a connector of the test board. In this case, the test board may be provided with a male connector, and the test board side may be provided with a female connector capable of inserting the male connector. And when the public connection When the device is inserted into the female connector such that the plurality of semiconductor elements loaded on the test board are electrically connected to the test substrate, the test substrate determines the failure of the semiconductor element by applying a test signal to the feedback result signal after the plurality of semiconductor elements are applied Whether or not.

A technical document for electrically connecting a semiconductor element and a test substrate in an aging test apparatus is disclosed in Korean Laid-Open Patent Publication No. 10-2008-0051762 (invention name: aging board connecting device, aging test device having the device, and aging board connecting method) Korean authorized utility model No. 20-0370634 (name of utility model: mounting structure for a feed through board for inspecting semiconductor ageing test equipment) and the like has been disclosed.

In addition, in order to increase the processing capacity, it is a subject that has been studied to increase the number of semiconductor elements that can be tested each time. In order to increase the number of semiconductor elements that can be tested each time, it is necessary to increase the number of semiconductor elements mounted on the test board.

However, since a slit type connector in which a terminal is formed on a surface of a thin plate has been conventionally used, there is a structural limitation in increasing the number of semiconductor elements that can be mounted on a test board.

An object of the present invention is to provide a technique relating to a connector for a semiconductor element inspection device using a pin-shaped connection pin.

In order to achieve the above object, a connector for a semiconductor element inspection apparatus according to the present invention includes: a plurality of connection pins arranged in an A×B matrix, wherein A is a natural number greater than 1, and B is a natural number greater than 2; at least one a plate-shaped ground plate for improving characteristics of electrical signals transmitted through the plurality of connecting pins; and a receiving frame for receiving and supporting the plurality of connecting pins and at least one of the ground plates.

Preferably, the grounding plate is provided in plurality, and it is further preferred that at least one of the plurality of grounding plates is disposed between the columns and columns of the plurality of connecting pins.

Preferably, the grounding plates are provided with B, and one grounding plate is responsible for the improvement of the electrical signal characteristics of the connecting pins for one column.

Preferably, the end of the grounding plate protrudes further toward the female connector side than the end of the plurality of connecting pins.

In order to achieve the above object, a test board for an aging test apparatus provided by the present invention includes: a loading board for loading a semiconductor element; and a connector for electrically connecting a semiconductor element mounted on the loading board to a test substrate, The connector is the aforementioned connector for a semiconductor element inspection device.

According to the invention as described above, the plate-shaped grounding plate which is resistant to contact impact is used instead of the pin-shaped plurality of connecting pins which are not resistant to contact impact, thereby increasing the processing capacity, thereby ensuring transmission to a plurality of connecting pins located in one row. The characteristics of the electrical signal enable the grounding plate to guide the stable insertion of the plurality of connecting pins, thereby also having the effect of preventing damage of the plurality of connecting pins.

100‧‧‧ test board

110‧‧‧Loading board

120‧‧‧Connector

121‧‧‧Connecting pin

122‧‧‧ Grounding plate

123‧‧‧ Containment frame

Fig. 1 is a schematic perspective view of a connector for a semiconductor element inspection device according to an embodiment of the present invention.

2 is an exaggerated view showing the connecting pin and the connection of the connector of FIG. 1. An exaggerated picture of the degree of protrusion of the floor.

Fig. 3 is a schematic perspective view of a connector for a semiconductor element inspection device according to another embodiment.

4 is a schematic view of a test board for an aging test apparatus according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments of the present invention as described above will be described in detail with reference to the accompanying drawings, and the repeated description will be omitted or shortened as much as possible for the sake of brevity of description.

<About the connector>

1 is a schematic perspective view of a connector 120 for a semiconductor element inspection device (hereinafter simply referred to as a "connector") according to an embodiment of the present invention.

As shown in FIG. 1 , the connector 120 provided in this embodiment includes a plurality of connecting pins 121 , a plurality of grounding plates 122 , a receiving frame 123 , and the like.

The plurality of connecting pins 121 are for insertion into a plurality of insertion slots of a female connector (not shown) to be electrically connected to the wire-side object-side electrical contact terminals (for example, the female connector-side terminals), and are arranged in a 9×29 row. (9 rows and 29 columns) are arranged in a shape. Here, depending on the implementation, it is also possible to satisfy the present invention by providing one or more connection pins 121 in one row and two or more connection pins 121 in one row. However, since the plate-like surface is formed with a terminal. The slit method can also form terminals on both faces of the board. Therefore, in order to increase the processing capacity by increasing the number of contact terminals, it is preferable to provide three or more connection pins 121 in one row and one row.

A plurality of ground plates 122 (29 in this embodiment) are disposed between the columns and columns of the plurality of connection pins 121 (except for one ground plate at one end) for improving passage of the plurality of connection pins 121 The characteristics of the transmitted electrical signal, which is formed in a plate shape, satisfies the present invention. Of course, depending on the implementation, as referenced in FIG. 3, it can be realized that the grounding plate 122 is formed on each column portion of the outer sides of the plurality of connecting pins 121, but in order to improve the passing of the plurality of connecting pins 121 More preferably, the characteristics of all the electrical signals transmitted are, as in the embodiment of Fig. 1, the number of ground plates 122 corresponds to the number of columns of the plurality of connecting pins 121, so that one ground plate is responsible for the electricity of the connecting pins 121 for one column. Improvement in signal characteristics.

Further, as referred to in FIG. 2, the plurality of ground plates 122 are configured such that the ends of the plurality of ground plates 122 are further directed toward the side of the female connector (not shown) than the ends of the plurality of connecting pins 121 (FIG. 1). The arrow in the direction D is highlighted. The reason for this design is that the plate-shaped plurality of ground plates 122 that are resistant to contact impact are first inserted into the corresponding insertion grooves on the connector side, compared to the thin pin-shaped connecting pins 121 that are not resistant to contact impact, thereby It is possible to grasp the contact position of the appropriate connector, thereby enabling the plurality of connection pins 121 to be accurately inserted into the corresponding insertion grooves on the female connector side.

The housing frame 123 is provided to accommodate and support the plurality of connection pins 121 and the plurality of ground plates 122.

According to the connector 120 as described above, when contacting the female connector, the plurality of ground plates 122 whose ends are further protruded are first inserted into the corresponding insertion slots of the female connector, and the plurality of connectors 121 having no further protruding ends Then inserted into the corresponding insertion slot of the female connector, thus enabling multiple connections Accurate electrical contact (insertion) of the pin 121. Therefore, it is possible to prevent damage to the plurality of pin-shaped connecting pins 121 which are less resistant to interference.

<About the description of the test board>

4 is a schematic view of a test board 100 for aging test equipment (hereinafter simply referred to as "test board") using the connector 120 of FIG.

The test board 100 provided in this embodiment includes a loading board 110 and the connector 120 of FIG.

The loading board 110 is provided to load a semiconductor element.

Further, the connector 120 is provided to electrically connect the semiconductor element mounted on the mounting board 110 to a test substrate (not shown).

As described above, the present invention has been specifically described with reference to the embodiments of the drawings, but the above-described embodiments are merely described as preferred embodiments of the present invention, and thus the present invention is not limited to the above. The scope of the invention should be understood as the scope of the claims and the equivalents thereof.

121‧‧‧Connecting pin

122‧‧‧ Grounding plate 1-29

123‧‧‧ Containment frame

Claims (5)

A connector for a semiconductor component inspection device, comprising: a plurality of connection pins arranged in an A×B matrix, wherein A is a natural number greater than 1, and B is a natural number greater than 2; at least one plate shape a ground plate for improving characteristics of electrical signals transmitted through the plurality of connecting pins; and a receiving frame for receiving and supporting the plurality of connecting pins and at least one of the ground plates. The connector for a semiconductor element inspection device according to claim 1, wherein the grounding plate is provided in plurality, and at least one of the plurality of grounding plates is disposed in a column and a column of the plurality of connecting pins. between. The connector for a semiconductor element inspection device according to claim 1, wherein the ground plates are provided in B pieces, and one ground plate is responsible for improvement in electrical signal characteristics of the connection pins for one column. The connector for a semiconductor element inspection device according to any one of claims 1 to 3, wherein the end of the ground plate protrudes further toward the female connector side than the end of the plurality of connection pins. A test board for a semiconductor component inspection apparatus, comprising: a loading board for loading a semiconductor component; and a connector for electrically connecting the semiconductor component mounted on the loading board to the test substrate, the connector is The connector for a semiconductor element inspection device according to any one of claims 1 to 4.