CN103293347A - Connector for semiconductor device testing equipment and test board for burn-in tester - Google Patents
Connector for semiconductor device testing equipment and test board for burn-in tester Download PDFInfo
- Publication number
- CN103293347A CN103293347A CN201310061462XA CN201310061462A CN103293347A CN 103293347 A CN103293347 A CN 103293347A CN 201310061462X A CN201310061462X A CN 201310061462XA CN 201310061462 A CN201310061462 A CN 201310061462A CN 103293347 A CN103293347 A CN 103293347A
- Authority
- CN
- China
- Prior art keywords
- connector
- semiconductor element
- ground plate
- connecting pins
- testing fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The invention relates to a connector for semiconductor device testing equipment. According to the present invention, disclosed is a flat ground plate. further, a tail end of the ground plate projects further toward a female connector than tail ends of multiple connecting pins, thereby guiding contacts of the multiple connecting pins in the shape of relatively thin pins, and preventing the multiple connecting pins from getting damaged.
Description
Technical field
The present invention relates to semiconductor element testing fixture connector.
Background technology
After producing semiconductor element, will carry out various electrical testings, and can confirm whether correctly to have formed pattern by this test, and whether electrical action is normal etc. under high temperature or low temperature environment.
Therefore usually, semiconductor element is worked according to applying of electric signal, must form under the situation about being electrically connected between testing fixture (for example, testing apparatus) and semiconductor element and test.Therefore, in the semiconductor element testing fixture, using a plurality of connectors (be electrically connected and use socket) in order to make formation electrical connection between semiconductor element side and the test side.
For example,, uses the semiconductor element that encapsulates aging testing apparatus (burn-in tester) for being tested under hot environment, and aging testing apparatus need possess the test base of testing for to a plurality of semiconductor elements that are loaded into test board, and a plurality of semiconductor elements are electrically connected to test base by the connector of test board.In this case, test board can possess public connector, and the test base side can possess the female connectors that public connector is inserted.And, when public connector is inserted into female connectors, when thereby a plurality of semiconductor elements that are loaded into test board were electrically connected to test base, the fault that test base is judged semiconductor element by (feedback) consequential signal that test signal is applied to feedback after a plurality of semiconductor elements whether.
Be used in the technological project of aging testing apparatus electrical connection semiconductor element and test base revealed at Korea S publication 10-2008-0051762 (denomination of invention: the burn-in board coupling arrangement possesses ageing tester and the burn-in board method of attachment of this device) and Korean granted utility model 20-0370634 (utility model title: for web joint (the Feed through board) mounting structure that checks semi-conductive aging testing apparatus) etc.
In addition, in order to improve the processing capacity, increase each time the quantity of the semiconductor element that can test be the problem of always studying.For increase each time the quantity of the semiconductor element that can test, need to increase the quantity that is loaded into the semiconductor element on the test board.
But, used the connector that forms the slit mode of terminal at the face of thin plate in the past, therefore there is structural restriction at the quantitative aspects that increases the semiconductor element that can be loaded into test board.
Summary of the invention
The object of the present invention is to provide a kind of technology that the semiconductor element testing fixture that uses pin-shaped connecting pin is used connector that relates to.
To achieve these goals, semiconductor element testing fixture provided by the present invention comprises with connector: with a plurality of connecting pins that A * B ranks form is arranged, wherein, A is the natural number greater than 1, and B is the natural number greater than 2; The ground plate that at least one is tabular is used for improving the characteristic by the electric signal of described a plurality of connecting pins transmission; Hold and support the framework of accommodating of described a plurality of connecting pin and at least one described ground plate.
Preferably, described ground plate possesses for a plurality of, and more preferably at least one ground plate is arranged between the row and row of a plurality of connecting pins in described a plurality of ground plate.
Preferably, described ground plate possesses and is B, and ground plate is responsible for the improvement at the electric signal characteristic of the connecting pin of row.
Preferably, it is further side-prominent towards female connectors that the end of described ground plate is compared the end of described a plurality of connecting pins.
To achieve these goals, aging testing apparatus provided by the present invention comprises with test board: load plate, be used for loading semiconductor element; Connector is electrically connected to test base for the semiconductor element that will be loaded into described loading plate, and described connector is aforesaid semiconductor element testing fixture connector.
According to aforesaid the present invention, the tabular ground plate that uses contact resistance to impact replaces pin-shaped a plurality of connecting pins of not contact resistance impact and improves the processing capacity, guarantee to be sent to the characteristic of the electric signal of a plurality of connecting pins that are positioned at row thus, make ground plate can guide the stable insertion of a plurality of connecting pins simultaneously, thereby also have the effect of the damage that can prevent a plurality of connecting pins
Description of drawings
Fig. 1 is provided for the semiconductor element testing fixture that provides about one embodiment of the invention by the approximate three-dimensional map of connector.
The exaggeration figure of the connecting pin that Fig. 2 possesses for the connector that Fig. 1 is shown turgidly and the projecting degree of ground plate.
Fig. 3 is provided for the semiconductor element testing fixture that provides about another embodiment by the approximate three-dimensional map of connector.
The aging testing apparatus that Fig. 4 provides for one embodiment of the invention skeleton diagram of test board.
Symbol description: 100 is test board, and 110 for loading plate, and 120 is connector, and 121 is connecting pin, and 122 is ground plate, and 123 for accommodating framework.
Embodiment
Below, describe aforesaid preferred embodiment provided by the present invention in detail with reference to accompanying drawing, at this, for the terseness that illustrates, will omit or shorten the explanation of repetition as far as possible.
＜about the explanation of connector 〉
The semiconductor element testing fixture that provides about one embodiment of the invention approximate three-dimensional map with connector 120 (being designated hereinafter simply as " connector ") is provided Fig. 1.
As shown in Figure 1, the connector 120 that provides of present embodiment comprises a plurality of connecting pins 121, a plurality of ground plate 122 and accommodates framework 123 etc.
A plurality of connecting pins 121 are used for being inserted into a plurality of insertion grooves of female connectors (not shown) and are electrically connected with connecting object side electric contact terminal (for example, the female connectors side terminal), and arrange with 9 * 29 ranks (9 row, 29 row) form.At this, according to the difference of implementing, in a row, possess more than one connecting pin 121 and in row, possess plural connecting pin 121 and also can satisfy the present invention, but, also can form terminal at two faces of plate owing to be formed with the slit mode of terminal on the tabular face, therefore in order to improve the processing capacity by the quantity that increases contact terminal, be preferably a row and one and list the connecting pin 121 that possesses more than three.
A plurality of ground plates 122 (possessing 29 in the present embodiment) be arranged in a plurality of connecting pins 121 row and row between (except a ground plate of a side end), be used for improving the characteristic by the electric signal of a plurality of connecting pins 121 transmission, this ground plate 122 forms and tabularly just can satisfy the present invention.Certainly, according to the difference of implementing, as the reference of Fig. 3 institute, can be embodied as ground plate 122 and form one in each row part of the both sides of a plurality of connecting pins 121 gabarit, but in order to improve the characteristic of all electric signal that transmit by a plurality of connecting pins 121, be more preferably as the embodiment of Fig. 1, the quantity of ground plate 122 is equivalent to the quantity of the row of a plurality of connecting pins 121, thereby ground plate is responsible for the improvement at the electric signal characteristic of the connecting pin 121 of row.
In addition, as the reference of Fig. 2 institute, the end that this a plurality of ground plates 122 constitute a plurality of ground plates 122 is compared the end of a plurality of connecting pins 121 and is further given prominence to towards female connectors (not shown) side direction (the arrow D direction among Fig. 1).She Ji reason is like this, compare the thin pin-shaped connecting pin 121 that impacts for contact resistance not, tabular a plurality of ground plates 122 that contact resistance is impacted are inserted into earlier in the insertion groove of correspondence of connector side, thereby can hold the contact position of appropriate connector, a plurality of connecting pins 121 can be properly inserted in the insertion groove of correspondence of female connectors side.
Accommodate framework 123 in order to hold and to support a plurality of connecting pins 121 and a plurality of ground plate 122 and arrange.
According to aforesaid connector 120, when contacting with female connectors, terminal further outstanding a plurality of ground plates 122 are inserted into earlier after the insertion groove of correspondence of female connectors, terminal not further outstanding a plurality of connectors 121 be inserted into subsequently in the insertion groove of correspondence of female connectors, therefore can realize the electrically contacting accurately of a plurality of connecting pins 121 (insertion).Therefore, can prevent from sustaining damage for not anti-impact of interference pin-shaped a plurality of connecting pins 121.
＜about the explanation of test board 〉
Fig. 4 is for about the aging testing apparatus of the connector 120 that the uses Fig. 1 skeleton diagram with test board 100 (being designated hereinafter simply as " test board ").
The test board 100 that present embodiment provides comprises the connector 120 that loads plate 110 and Fig. 1.
Loading plate 110 arranges in order to load semiconductor element.
And connector 120 is electrically connected to test base (not shown) for the semiconductor element that will be loaded into loading plate 110 and arranges.
As mentioned above; though the embodiment according to the reference accompanying drawing has carried out specifying of the present invention; but the above embodiments are only enumerated the preferred embodiments of the present invention and are illustrated; therefore the present invention can not be interpreted as and only be confined to the above embodiments, and interest field of the present invention should be understood to protection domain and the equivalent concepts thereof that claims are asked.
Claims (5)
1. a semiconductor element testing fixture connector is characterized in that, comprising:
With a plurality of connecting pins that A * B ranks form is arranged, wherein, A is the natural number greater than 1, and B is the natural number greater than 2;
The ground plate that at least one is tabular is used for improving the characteristic by the electric signal of described a plurality of connecting pins transmission;
Hold and support the framework of accommodating of described a plurality of connecting pin and at least one described ground plate.
2. semiconductor element testing fixture connector as claimed in claim 1 is characterized in that, described ground plate possesses for a plurality of,
At least one ground plate is arranged between the row and row of a plurality of connecting pins in described a plurality of ground plate.
3. semiconductor element testing fixture connector as claimed in claim 1 is characterized in that, described ground plate possesses and is B, and ground plate is responsible for the improvement at the electric signal characteristic of the connecting pin of row.
4. as any described semiconductor element testing fixture connector in the claim 1 to 3, it is characterized in that it is further side-prominent towards female connectors that the end of described ground plate is compared the end of described a plurality of connecting pins.
5. a semiconductor element testing fixture test board is characterized in that, comprising:
Load plate, be used for loading semiconductor element;
Connector is electrically connected to test base for the semiconductor element that will be loaded into described loading plate,
Described connector is any described semiconductor element testing fixture connector in the claim 1 to 4.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0020851 | 2012-02-29 | ||
| KR1020120020851A KR101164114B1 (en) | 2012-02-29 | 2012-02-29 | Connector for semiconductor device testing equipment and test board for burn-in tester |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103293347A true CN103293347A (en) | 2013-09-11 |
| CN103293347B CN103293347B (en) | 2016-03-09 |
Family
ID=46716519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310061462.XA Active CN103293347B (en) | 2012-02-29 | 2013-02-27 | Semiconductor element testing fixture connector and aging testing apparatus test board |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101164114B1 (en) |
| CN (1) | CN103293347B (en) |
| TW (1) | TWI485406B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102115378B1 (en) * | 2019-05-31 | 2020-05-27 | (주)대성이앤티 | Card type edge connector and burn-in board test apparatus |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1097540A (en) * | 1993-06-04 | 1995-01-18 | 法玛通国际联络公司 | The connector assembly that is used for printed circuit board (PCB) |
| JP2002033162A (en) * | 2000-07-14 | 2002-01-31 | Japan Aviation Electronics Industry Ltd | Connector device |
| CN1379249A (en) * | 2001-03-19 | 2002-11-13 | 重机公司 | Automatic inspecting device for semiconductor equipment |
| CN1398446A (en) * | 2000-02-03 | 2003-02-19 | 泰拉丁公司 | Connector with shielding |
| CN2571020Y (en) * | 2002-05-30 | 2003-09-03 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN1877342A (en) * | 2005-06-10 | 2006-12-13 | 日本航空电子工业株式会社 | Test apparatus capable of accurately connecting a test object to a substrate |
| CN101315405A (en) * | 2007-06-01 | 2008-12-03 | 致茂电子股份有限公司 | Semiconductor component test station with detachable electric property detecting system |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9205087D0 (en) * | 1992-03-09 | 1992-04-22 | Amp Holland | Sheilded back plane connector |
| JP2008146834A (en) * | 2006-12-05 | 2008-06-26 | Furukawa Electric Co Ltd:The | Joint connector |
| KR100853402B1 (en) * | 2006-12-27 | 2008-08-21 | 주식회사 아이티엔티 | connecting apparatus for semiconductor device test system |
| KR101126710B1 (en) * | 2009-06-19 | 2012-06-05 | (주)테스티안 | The PCB structure for connecter of hi-speed |
-
2012
- 2012-02-29 KR KR1020120020851A patent/KR101164114B1/en active IP Right Grant
-
2013
- 2013-02-27 CN CN201310061462.XA patent/CN103293347B/en active Active
- 2013-02-27 TW TW102106997A patent/TWI485406B/en active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1097540A (en) * | 1993-06-04 | 1995-01-18 | 法玛通国际联络公司 | The connector assembly that is used for printed circuit board (PCB) |
| CN1398446A (en) * | 2000-02-03 | 2003-02-19 | 泰拉丁公司 | Connector with shielding |
| JP2002033162A (en) * | 2000-07-14 | 2002-01-31 | Japan Aviation Electronics Industry Ltd | Connector device |
| CN1379249A (en) * | 2001-03-19 | 2002-11-13 | 重机公司 | Automatic inspecting device for semiconductor equipment |
| CN2571020Y (en) * | 2002-05-30 | 2003-09-03 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN1877342A (en) * | 2005-06-10 | 2006-12-13 | 日本航空电子工业株式会社 | Test apparatus capable of accurately connecting a test object to a substrate |
| CN101315405A (en) * | 2007-06-01 | 2008-12-03 | 致茂电子股份有限公司 | Semiconductor component test station with detachable electric property detecting system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103293347B (en) | 2016-03-09 |
| KR101164114B1 (en) | 2012-07-12 |
| TWI485406B (en) | 2015-05-21 |
| TW201339587A (en) | 2013-10-01 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |