TW201333411A - 沖壓結合散熱鰭片的散熱器改良 - Google Patents

沖壓結合散熱鰭片的散熱器改良 Download PDF

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TW201333411A
TW201333411A TW101119702A TW101119702A TW201333411A TW 201333411 A TW201333411 A TW 201333411A TW 101119702 A TW101119702 A TW 101119702A TW 101119702 A TW101119702 A TW 101119702A TW 201333411 A TW201333411 A TW 201333411A
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4878Mechanical treatment, e.g. deforming
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making

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Abstract

一種沖壓結合散熱鰭片的散熱器改良設計,其至少係包括一底座及複數個散熱鰭片,底座表面係開設複數個相鄰的溝槽,以供對應插植各散熱鰭片,且散熱鰭片的插植端係設有一反折部,或進一步可於反折部的選定間距分別沖設複數個呈外翻狀的沖壓凸片,於散熱鰭片插入底座溝槽後,再利用一沖壓沖頭對準插植的反折部位進行沖壓,以該沖壓沖頭具有一同時局部涵蓋反折部及一溝槽側壁的沖壓斜面,於沖壓後使反折部於溝槽內下壓產生變形而迫緊結合於溝槽,且沖壓斜面因同時沖壓推擠溝槽側壁而產生移動變形,使移動變形的溝槽側壁可壓住反折部,確保結合更為穩固。

Description

沖壓結合散熱鰭片的散熱器改良
本發明係關於一種散熱器設計,尤指一種沖壓結合散熱鰭片的散熱器改良設計。
習知散熱器的散熱鰭片與底座的結合,除了傳統的焊接結合技術外,亦有利用沖壓方式,將散熱鰭片先插植於底座的預設溝槽或夾持凸座,再以沖壓沖頭進行沖壓,而使散熱鰭片被夾持結合於底座的溝槽(或夾持凸座),例如美國發明專利第5014776號案,就是使兩側的溝槽側壁產生沖壓推擠變形,進而可夾持散熱鰭片,以達到散熱鰭片與底座的結合目的。
上述先前專利技術,只是利用溝槽兩側的擠壓變形而達到夾持散熱片根部的目的,但夾持作用力都集中在溝槽開口兩側的變形位置,僅具有兩個點狀的夾持力,因此,夾持效果不佳,不易確保其穩定結合,不僅各散熱片可能發生參差不齊的不等高現象,而且散熱片容易發生搖動或脫落情形。
本發明之主要目的,乃在於提供一種沖壓結合散熱鰭片的散熱器改良設計,其至少包括一底座及複數個散熱鰭片,底座表面係開設複數個相鄰的溝槽,以供對應插植各散熱鰭片,且各散熱鰭片的插植端均設有一反折部,於散熱鰭片插入底座溝槽後,再利用一沖壓沖頭對準插植的反 折部位進行沖壓,因該沖壓沖頭具有一可同時局部涵蓋反折部及一溝槽側壁的沖壓斜面,於沖壓後可使該反折部於溝槽內下壓產生變形增大而迫緊結合於溝槽,且以沖壓斜面同時沖壓推擠其中一溝槽的側壁而產生移動變形,使該移動變形的溝槽側壁可壓住反折部,故散熱鰭片與底座的結合會更為穩固,能確保各散熱片不會發生搖動或脫落情形。
本發明之次要目的,乃在於提供一種沖壓結合散熱鰭片的散熱器改良設計,其中,各散熱鰭片係可於反折部的選定間距分別沖設複數個沖壓凸片,各沖壓凸片可呈朝上側傾的外翻形狀,並於通過沖壓沖頭的沖壓後,使移動變形的溝槽側壁可形成向外延伸而壓住沖壓凸片,並卡住溝槽內壁,以形成穩固卡住,且反折部的其餘部份則受到擠壓變形,並填滿於底座的溝槽,因此使散熱鰭片與底座的結合更為穩固。
本發明之又一目的,乃在於提供一種沖壓結合散熱鰭片的散熱器改良設計,其中,該散熱器的底座係可與一個以上的熱導管形成緊配嵌合,為在底座的另一端面開設嵌槽,並適配嵌入熱導管,使熱導管可貼底外露於底座端面,或進一步使熱導管適當彎折並貫穿複數散熱片以完成緊配組成。
本發明之另一目的,乃在於提供一種沖壓結合散熱鰭片的散熱器改良設計,其中,該散熱器的底座係可實施為圓形座體,並於該圓形的底座的周壁面開設複數軸向相鄰的溝槽,以供對應插植各散熱鰭片,使各散熱片可呈輻射 方向的穩固插植結合。
茲依附圖實施例將本發明結構特徵及其他作用、目的詳細說明如下:如第一圖所示,係本發明所為「沖壓結合散熱鰭片的散熱器改良」的較佳實施例,其係至少包括一底座1及複數個散熱鰭片2,而其中:底座1,其係在表面開設複數個相鄰的溝槽11,以供分別對應插植各散熱鰭片2;複數個散熱鰭片2,如第二圖至第四圖所示,其形狀或大小不拘,但於插植端係設有一反折部21,並可於該反折部21的選定間距分別沖設複數個呈外翻狀的沖壓凸片211,該反折部21係可匹配植入底座1的溝槽11;利用上述的底座1及複數個散熱鰭片2,於散熱鰭片2將反折部21插入底座1的溝槽11後,係再利用一沖壓沖頭3對準插植的反折部位進行沖壓(如第五圖),以該沖壓沖頭3具有一同時局部涵蓋反折部21及一溝槽11側壁的沖壓斜面31,於沖壓後(如第六圖)使該反折部21於溝槽11內下壓產生變形增大而迫緊結合於溝槽11(如第七圖),且該沖壓斜面31因同時沖壓推擠溝槽11側壁而產生移動變形,使移動變形後的溝槽側壁111可壓住反折部21的沖壓凸片211,並卡住溝槽11的內壁,以確保散熱鰭片2與底座1的結合更為穩固,達到散熱片2不會發生搖動或脫落的目的。
如上述實施例圖顯示,該散熱鰭片2的沖壓凸片211,其係可呈朝上側傾的外翻形狀,於通過沖壓沖頭3的沖 壓後,係使移動變形的溝槽側壁111形成向外延伸,並可壓住反折部21沖壓凸片211,反折部21的其餘部份則發生擠壓變形,並填滿於底座1的溝槽11,故散熱鰭片2與底座1的溝槽11結合將更為穩固。
如第八圖所示,所述底座1溝槽11的寬度A係略大於散熱鰭片2反折部21的厚度B,但反折部21的厚度B再加上沖壓凸片211C外翻邊壁的寬度C,則相同於溝槽11的寬度A,亦即:A=B+C。
如第九、十圖所示的另一種實施例,本發明係可與一個以上的熱導管4形成緊配嵌合,以組成一附有熱導管的散熱器,其係可於本發明底座1a的另一端面開設一個以上的嵌槽12a,用以適配嵌入熱導管4,使熱導管4具有平整貼底面41,並外露結合於底座1a的底端面,或所述的熱導管4亦可適當彎折,並貫穿複數散熱片2,以完成一附有熱導管的散熱器緊配組合。
如第十一、十二圖所示的再一種實施例,本發明的底座1b,係亦可實施為圓形座體,並於該圓形底座1b的周壁面開設複數軸向相鄰的溝槽11b,以供對應插植各散熱鰭片2b,依同理實施,使各散熱片2b可呈輻射方向而穩固插植結合於圓形底座1b的周壁面。
依本發明設計,所述的散熱片2,關於其形狀、大小或堆疊排列形態,係可視不同需要而做任意變化,且其中的沖壓凸片211係可省略不設,如第十三圖的另一實施例所示,各散熱片2亦可直接利用反折部21對應插植於底座1的溝槽11,再以沖壓沖頭3對準插植的反折部位進行沖壓 (如第十四圖至第十六圖所示),該沖壓沖頭3的沖壓斜面31亦同時局部涵蓋反折部21及一溝槽側壁111,故沖壓後可使反折部21於溝槽11內下壓產生變形增大而迫緊結合於溝槽11,且以移動變形的溝槽側壁111亦壓住反折部21,仍可完成散熱鰭片2與底座1的穩固結合。是以,附圖的實施例僅係揭露本發明的主要技術特徵,但並非用以限定本案的技術範圍,如有涉及等效應用或簡易的增減變更,自仍應視為屬於本案的技術範圍。
綜上所述,本發明所為沖壓結合散熱鰭片的散熱器改良設計,關於散熱片與底座的插入結合,其使用手段與習知散熱器顯有不同,特別是利用移動變形的溝槽側壁可延伸壓住反折部及沖壓凸片的頂端,確保各散熱片均能完全插入底座溝槽,獲得更為穩固的結合,故具有功效進步性,為此提出申請,敬請 依法審查賜准專利,實感德便。
1‧‧‧底座
2‧‧‧散熱鰭片
11‧‧‧溝槽
21‧‧‧反折部
211‧‧‧沖壓凸片
3‧‧‧沖壓沖頭
31‧‧‧沖壓斜面
111‧‧‧溝槽側壁
A‧‧‧溝槽寬度
B‧‧‧反折部厚度
C‧‧‧沖壓凸片外翻寬度
4‧‧‧熱導管
41‧‧‧平整貼底面
1a‧‧‧底座
12a‧‧‧嵌槽
1b‧‧‧圓形底座
11b‧‧‧溝槽
2b‧‧‧散熱鰭片
第一圖為本發明於沖壓結合前的立體示意圖。
第二圖為本發明散熱鰭片的立體圖。
第三圖為本發明散熱鰭片的局部放大圖。
第四圖為本發明散熱鰭片的另一角度局部放大圖。
第五圖為本發明進行沖壓時的狀態示意圖。
第六圖為本發明完成沖壓時的狀態示意圖。
第七圖為本發明沖壓沖頭退出後的完成狀態示意圖。
第八圖為本發明散熱鰭片於插入底座前的示意圖。
第九圖係本發明實施為一附有熱導管散熱器的組合正視圖。
第十圖為第九圖實施例的組合立體圖。
第十一圖為本發明底座實施為圓形座體的組合上視圖。
第十二圖為第十一圖實施例的組合立體圖。
第十三圖為本發明另一實施例於沖壓結合前的立體示意圖。
第十四圖為第十三圖實施例進行沖壓時的狀態示意圖。
第十五圖為第十三圖實施例完成沖壓時的狀態示意圖。
第十六圖為第十三圖實施例沖壓沖頭退出後的完成狀態示意圖。
1‧‧‧底座
2‧‧‧散熱鰭片
11‧‧‧溝槽
21‧‧‧反折部
211‧‧‧沖壓凸片
A‧‧‧溝槽寬度
B‧‧‧反折部厚度
C‧‧‧沖壓凸片外翻寬度

Claims (7)

  1. 一種沖壓結合散熱鰭片的散熱器改良,其至少包括一底座及複數個散熱鰭片,其特徵在於:底座,係在表面開設複數個相鄰的溝槽,以供分別對應插植各散熱鰭片;複數個散熱鰭片,係於插植端設有一反折部,該反折部係供匹配植入底座的溝槽;利用上述的底座及複數個散熱鰭片,於散熱鰭片將反折部插入底座的溝槽後,再利用一沖壓沖頭對準插植的反折部位進行沖壓,該沖壓沖頭並具有一同時局部涵蓋反折部及一溝槽側壁的沖壓斜面,經沖壓後使反折部於溝槽內下壓產生變形增大而迫緊結合於溝槽內,且沖壓斜面同時沖壓推擠溝槽側壁而產生移動變形,使移動變形後的溝槽側壁係壓住反折部,以完成散熱鰭片與底座的結合。
  2. 如申請專利範圍第1項所述沖壓結合散熱鰭片的散熱器改良,所述散熱鰭片的反折部,係於選定間距分別沖設複數個呈外翻狀的沖壓凸片,且移動變形後的溝槽側壁係壓住沖壓凸片而卡住溝槽內壁。
  3. 如申請專利範圍第2項所述沖壓結合散熱鰭片的散熱器改良,該散熱鰭片反折部的厚度再加上沖壓凸片外翻邊壁的寬度,係相同於底座溝槽的寬度
  4. 如申請專利範圍第2項所述沖壓結合散熱鰭片的散熱器改良,該散熱鰭片的沖壓凸片係呈朝上側傾的外翻形狀。
  5. 如申請專利範圍第1項所述沖壓結合散熱鰭片的散熱器改良,該底座的另一端面係開設一個以上的嵌槽,以供適配嵌入熱導管,並使熱導管具有平整貼底面,且外露結合於底座的底端面。
  6. 如申請專利範圍第5項所述沖壓結合散熱鰭片的散熱器改良,該熱導管係彎折貫穿複數散熱片,形成緊配組合。
  7. 如申請專利範圍第1項所述沖壓結合散熱鰭片的散熱器改良,該底座係圓形座體,並於周壁面開設複數軸向相鄰的溝槽,以供對應插植複數個散熱鰭片。
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Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102873217B (zh) * 2012-10-11 2014-09-03 东莞汉旭五金塑胶科技有限公司 附热管散热器的自动化组装方法及其设备
CN103234378B (zh) * 2013-04-23 2015-09-30 东莞汉旭五金塑胶科技有限公司 波浪形散热鳍片及其散热器
CN103673730B (zh) * 2013-11-18 2016-05-18 东莞汉旭五金塑胶科技有限公司 散热板片与散热座的组合改良结构
JP6564274B2 (ja) * 2015-08-20 2019-08-21 昭和電工株式会社 ヒートシンク
CN105258539B (zh) * 2015-10-09 2018-07-31 东莞汉旭五金塑胶科技有限公司 散热器
CN106885141B (zh) * 2015-12-15 2023-06-23 四川新力光源股份有限公司 用于模块灯箱的led光源条
CN106890886B (zh) * 2017-02-16 2019-06-25 惠州智科实业有限公司 一种导热底座的制作方法
CN109883236B (zh) * 2019-03-15 2020-08-14 惠州汉旭五金塑胶科技有限公司 冲压结合散热鳍片的高效型散热器
CN110149786A (zh) * 2019-06-17 2019-08-20 鑫佰图科技(惠州)有限公司 一种散热器的散热鳍片的组装方法
CN110388845A (zh) * 2019-08-13 2019-10-29 惠州汉旭五金塑胶科技有限公司 散热鳍片的冲压铆合结构
CN110553532A (zh) * 2019-09-27 2019-12-10 惠州汉旭五金塑胶科技有限公司 双面吹胀板铆接结构及方法
CN110538941A (zh) * 2019-10-16 2019-12-06 苏州宇之能五金有限公司 一种插片式散热器的压齿方法及装置
US11786959B2 (en) * 2019-10-21 2023-10-17 Huizhou Hanxu Hardware & Plastic Technology Co., Ltd. Double-sided expanded plate riveting structure and method
CN112916744B (zh) * 2019-12-05 2024-03-08 中兴通讯股份有限公司 散热器的制造方法
CN111589917B (zh) * 2020-05-25 2021-03-26 深圳市维鼎精密五金有限公司 一种散热片结构及其冲压加工设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5932213B2 (ja) * 1981-06-22 1984-08-07 岩井金属工業株式会社 放熱板におけるフィンの固定方法
DE3814145C2 (de) * 1988-04-27 1998-07-23 Hess Joachim Vorrichtung zum Zuführen oder Abführen von Wärme
US5038858A (en) * 1990-03-13 1991-08-13 Thermalloy Incorporated Finned heat sink and method of manufacture
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
TW376171U (en) * 1998-11-24 1999-12-01 Foxconn Prec Components Co Ltd Radiating device
JP3552047B2 (ja) * 2000-10-25 2004-08-11 古河電気工業株式会社 ヒートシンク、その製造方法、および、押圧治具
US6742581B2 (en) * 2001-11-21 2004-06-01 Fujikura Ltd. Heat sink and fin module
KR100508206B1 (ko) * 2003-01-30 2005-08-17 주식회사 쏠리테크 방열핀형 냉각장치 제조방법
CN2651939Y (zh) * 2003-04-17 2004-10-27 陈世明 超导型电子元件散热器
US6995981B2 (en) * 2003-04-18 2006-02-07 Hon Hai Precision Inc. Co., Ltd. Heat sink assembly with combined parallel fins
US6776224B1 (en) * 2003-05-30 2004-08-17 Shin Ming Chen Heating dissipating device for electronic elements
US20050211416A1 (en) * 2003-10-17 2005-09-29 Kenya Kawabata Heat sink with fins and a method for manufacturing the same
US7726385B2 (en) * 2004-02-23 2010-06-01 International Business Machines Corporation Heat dissipation interface for semiconductor chip structures
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US7304851B2 (en) * 2005-06-21 2007-12-04 Yuh-Cheng Chemical Ltd. Heat sink and its fabrication method
TWM283222U (en) * 2005-06-24 2005-12-11 Amulaire Thermal Technology In Heat dissipating device having thinner heat fins
CN2857218Y (zh) * 2005-07-05 2007-01-10 美商旭扬热传股份有限公司 具有较薄鳍片的散热装置
US7721790B2 (en) * 2006-10-31 2010-05-25 Foxconn Technology Co., Ltd. Heat sink
JP3140755U (ja) * 2008-01-21 2008-04-10 水谷電機工業株式会社 コルゲートフィン型放熱器
KR200447710Y1 (ko) * 2008-02-04 2010-02-11 충-시엔 후앙 열파이프를 구비한 개선된 방열기
TW200825356A (en) * 2008-02-04 2008-06-16 chong-xian Huang Improvement on heat exchanger having a heat pipe
TWM363192U (en) * 2009-04-17 2009-08-11 chong-xian Huang Heat dissipating device
KR200454183Y1 (ko) * 2009-04-23 2011-06-20 충-시엔 후앙 방사형핀을 구비한 히트싱크
TWM419386U (en) * 2011-09-01 2011-12-21 Huang-Lung Yang Heat sink fin and base Pressing assembly structure
CN202547471U (zh) * 2012-02-10 2012-11-21 东莞汉旭五金塑胶科技有限公司 冲压结合散热鳍片的散热器

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US20130206381A1 (en) 2013-08-15
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