TW201330717A - 配線基板、用於配線基板之導電糊及配線基板之製造方法 - Google Patents

配線基板、用於配線基板之導電糊及配線基板之製造方法 Download PDF

Info

Publication number
TW201330717A
TW201330717A TW101141274A TW101141274A TW201330717A TW 201330717 A TW201330717 A TW 201330717A TW 101141274 A TW101141274 A TW 101141274A TW 101141274 A TW101141274 A TW 101141274A TW 201330717 A TW201330717 A TW 201330717A
Authority
TW
Taiwan
Prior art keywords
conductive paste
less
prepreg
resin
curing agent
Prior art date
Application number
TW101141274A
Other languages
English (en)
Chinese (zh)
Inventor
Tsuyoshi Himori
Tetsuro Kubo
Takashi Kitae
Tadashi Nakamura
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW201330717A publication Critical patent/TW201330717A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW101141274A 2011-11-08 2012-11-07 配線基板、用於配線基板之導電糊及配線基板之製造方法 TW201330717A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011244235 2011-11-08
JP2012184733 2012-08-24

Publications (1)

Publication Number Publication Date
TW201330717A true TW201330717A (zh) 2013-07-16

Family

ID=48289232

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101141274A TW201330717A (zh) 2011-11-08 2012-11-07 配線基板、用於配線基板之導電糊及配線基板之製造方法

Country Status (2)

Country Link
TW (1) TW201330717A (ja)
WO (1) WO2013069237A1 (ja)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3928560B2 (ja) * 2003-01-14 2007-06-13 松下電器産業株式会社 回路基板
JP4748279B2 (ja) * 2006-04-13 2011-08-17 日立化成工業株式会社 導電性ペースト、並びにこれを用いたプリプレグ、金属箔張積層板、及びプリント配線板
JP2011086397A (ja) * 2009-10-13 2011-04-28 Asahi Kasei E-Materials Corp 導電性ペースト及び半導体装置

Also Published As

Publication number Publication date
WO2013069237A1 (ja) 2013-05-16

Similar Documents

Publication Publication Date Title
JP5333701B1 (ja) 配線基板とその製造方法
JP5333702B1 (ja) フレキシブル配線基板とその製造方法と、これを用いた実装製品と、フレキシブル多層配線基板
JP4279893B2 (ja) 回路部品内蔵モジュールの製造方法
TWI432103B (zh) A wiring substrate, a method for manufacturing a wiring substrate, and a through-hole paste
JP4859999B1 (ja) 多層配線基板、多層配線基板の製造方法、及びビアペースト
TWI393496B (zh) 配線基板、配線基板的製造方法及通孔糊
JP5874343B2 (ja) 積層回路基板の製造方法、積層回路基板、および電子機器
EP1816653B1 (en) Conductive paste and method for manufacturing multilayer printed wiring board using same
JP5955300B2 (ja) 貫通電極を用いた多層基板の製造方法
WO2010103805A1 (ja) 多層配線基板の製造方法及びそれにより得られる多層配線基板
JP2008004514A (ja) 導電性ペーストおよびそれを用いたセラミック多層基板の製造方法
JP2020053524A (ja) 回路基板及び部品実装基板、並びに、それらの製造方法
TW201330717A (zh) 配線基板、用於配線基板之導電糊及配線基板之製造方法
JP5350085B2 (ja) ビア充填装置及びビア充填方法
JP2001217548A (ja) 配線基板の製造方法
JP2015032806A (ja) 合金ビアペーストと合金ビアペーストを用いた配線基板の製造方法
JP2013004762A (ja) 配線基板と、配線基板の製造方法
JP4905338B2 (ja) 部品内蔵プリント配線基板の製造方法
WO2013099204A1 (ja) 配線基板とその製造方法
JP2008294380A (ja) 部品内蔵モジュール及びその製造方法
JP2006179833A (ja) 配線基板およびその製造方法
JP2007142147A (ja) 導電性ペースト組成物並びにそれを用いたプリント配線基板とその製造方法
JP2013004763A (ja) ビアペースト、ビアペーストを用いた配線基板と、配線基板の製造方法
JP6017921B2 (ja) 多層配線基板の製造方法
JP5696852B2 (ja) ハンダ接続シートおよびそれを用いた電子部品の実装方法