TW201324877A - Light emitting diode packaging structure and fluorescent lens device thereof - Google Patents
Light emitting diode packaging structure and fluorescent lens device thereof Download PDFInfo
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本發明係有關於一種發光二極體封裝結構，特別是指一種具有螢光透鏡裝置之發光二極體封裝結構。
The present invention relates to a light emitting diode package structure, and more particularly to a light emitting diode package structure having a fluorescent lens device.
近年來，傳統能源短缺，於環境惡化之狀態下，全球各國家極力推動以白光發光二極體(Light-Emitting Diodes)取代對環境有害的傳統白幟燈。而發光二極體 (Light Emitting Diodes, LED) 是一種半導體固體發光元件， 其係利用固體半導體晶片作為發光材料。當發光二極體之兩端加上正向電壓時，半導體中的少數載子和多數載子發生複合，放出過剩的能量而引起光子發射，其可直接發出紅、橙、黃、綠、青、藍、紫、白色等色光。有別於在真空或充填少量特殊氣體下操作的熱熾燈或各種氣體放電燈等傳統光源。白光發光二極體之光源與傳統光源相比較之下，其具有諸多優點，例如：耗電量低、體積小、反應速度快、高效率、環保及可平面封裝等優勢；此外，在節能方面，其使用壽命長達60年，是傳統光源的100倍；而就消耗的能量而言，白光發光二極體只有傳統光源的10%。因此，自高功率與高亮度發光二極體 成功發展以來，白光發光二極體已被公認為21 世紀中最具潛力之環保照明光源。
近年來發光二極體之 發光效率呈現大幅度成長，以照明所需白光發光二極體為例，商品化規格已達 120 lm/W，超越目前常用的白熾燈泡與鹵素燈。且依據理論來推算，白光發光二極體之發光效率極大值為 200 lm/W，未來仍有相當大進步空間。截至目前為止，發光二極體的發展有兩大方向，一為是提供高均勻度的白光，另一為是對高亮度的要求。然而，由於單顆發光二極體亮度低於一般照明需求，因此期望藉由磊晶成長、晶粒製作及封裝技術的改良來提高光電轉換效率及外部光取出率，使發光二極體的應用範圍更加廣泛。
目前白光發光二極體係由發光二極體搭配螢光粉混光而來。現行發光二極體封裝上常用的點膠、封灌、模壓等方式，因封裝時所採用的封膠體（環氧樹脂）易在使用過程中變稠，導致較難控制氣泡、缺料、黑點等缺陷，以及與封膠體混合之螢光粉產生沉澱，進而使得白光發光二極體之發光均勻度無法保持一致，且易造成其發光色差。
另外，封裝體係由螢光粉混合於環氧樹脂中，然後直接覆蓋於發光二極體之上，例如：中華民國專利第I323042號之白光發光二極體封裝結構及中華民國專利第M361724號之發光二極體封裝結構，當發光二極體發光時，其所產生之光源容易被封裝體內之螢光粉遮蔽，導致發光二極體之出光效率降低；另外，發光二極體於發光時所產生的熱亦直接影響螢光粉之發光效率及使用壽命。因此，在發展高功率以及大面積發光二極體照明模組時，其散熱問題將嚴重影響到發光二極體之發光效率及使用壽命。為了解決上述問題，有需要提供一種高效率發光二極體封裝結構，以克服先前技術的缺點。
為了解決上述之問題，本發明提供一種發光二極體封裝結構及其螢光透鏡裝置，本發明之發光二極體封裝置結構中含有一螢光粉之螢光透鏡裝置與發光二極體間無直接接觸，發光二極體所產生之熱能部會直接影響螢光透鏡裝置之螢光粉，使螢光粉不易發生老化及碳化發黑，進而不會影響螢光粉之發光效率及使用壽命，以提升發光二極體封裝結構之發光效率，並具有穩定的色溫，且具有較長的使用壽命。
In recent years, traditional energy shortages have occurred. In the state of environmental degradation, countries around the world have pushed for the replacement of environmentally harmful traditional white lights with Light-Emitting Diodes. Light Emitting Diodes (LEDs) are semiconductor solid-state light-emitting elements that utilize solid semiconductor wafers as luminescent materials. When a forward voltage is applied to both ends of the light-emitting diode, a minority carrier and a majority carrier in the semiconductor are combined to emit excess energy to cause photon emission, which can directly emit red, orange, yellow, green, and blue. , blue, purple, white, etc. It is different from traditional light sources such as heat lamps or various gas discharge lamps that operate under vacuum or with a small amount of special gas. The light source of the white light emitting diode has many advantages compared with the conventional light source, such as low power consumption, small volume, fast response speed, high efficiency, environmental protection and planar packaging; in addition, in terms of energy saving Its service life is up to 60 years, which is 100 times that of traditional light sources. In terms of energy consumption, white light-emitting diodes only have 10% of traditional light sources. Therefore, since the successful development of high-power and high-brightness light-emitting diodes, white light-emitting diodes have been recognized as the most promising environmentally-friendly lighting source in the 21st century.
In recent years, the luminous efficiency of the light-emitting diode has been greatly increased. For example, the white light-emitting diode required for illumination has been commercialized to 120 lm/W, surpassing the commonly used incandescent bulbs and halogen lamps. According to the theory, the luminous efficiency of the white light emitting diode is 200 lm/W, and there is still considerable room for improvement in the future. Up to now, the development of light-emitting diodes has two major directions, one is to provide high uniformity of white light, and the other is to require high brightness. However, since the brightness of a single light-emitting diode is lower than that of general illumination, it is desirable to improve the photoelectric conversion efficiency and the external light extraction rate by the improvement of epitaxial growth, die fabrication, and packaging technology, so that the application of the light-emitting diode is achieved. The scope is more extensive.
At present, the white light emitting diode system is obtained by mixing light emitting diodes with fluorescent powder. The commonly used methods of dispensing, sealing, molding, etc. on the current LED package, because the encapsulant (epoxy resin) used in the packaging is easy to thicken during use, resulting in difficulty in controlling bubbles, lack of material, black The defects such as dots and the phosphor powder mixed with the sealant are precipitated, so that the uniformity of illumination of the white light-emitting diode cannot be kept consistent, and the chromatic aberration of the light is easily caused.
In addition, the encapsulation system is mixed with the phosphor powder in the epoxy resin, and then directly covers the LED, for example, the white light emitting diode package structure of the Republic of China Patent No. I323042 and the Republic of China Patent No. M361724 In the light-emitting diode package structure, when the light-emitting diode emits light, the light source generated by the light-emitting diode is easily shielded by the phosphor powder in the package, thereby reducing the light-emitting efficiency of the light-emitting diode; in addition, when the light-emitting diode is illuminated The heat generated also directly affects the luminous efficiency and service life of the phosphor powder. Therefore, in the development of high-power and large-area light-emitting diode lighting modules, the heat dissipation problem will seriously affect the luminous efficiency and service life of the light-emitting diode. In order to solve the above problems, it is desirable to provide a high efficiency light emitting diode package structure to overcome the disadvantages of the prior art.
In order to solve the above problems, the present invention provides a light emitting diode package structure and a fluorescent lens device thereof. The structure of the light emitting diode device of the present invention includes a phosphor powder fluorescent lens device and a light emitting diode. Without direct contact, the thermal energy generated by the light-emitting diode directly affects the fluorescent powder of the fluorescent lens device, so that the fluorescent powder is less prone to aging and carbonization, thereby not affecting the luminous efficiency and service life of the fluorescent powder. In order to improve the luminous efficiency of the LED package structure, and have a stable color temperature, and have a long service life.
本發明之目的，在於提供一種發光二極體封裝結構及其螢光透鏡裝置，發光二極體封裝結構透過螢光透鏡裝置之設置，含有螢光材料之螢光透鏡裝置與被封裝之發光二極體間無直接接觸，所以螢光材料不會受發光二極體所產生之熱影響而降低其發光效率及使用壽命，進而提升發光二極體封裝結構之發光效率，而其更具有穩定之色溫及較長的使用壽命。
本發明之目的，在於提供一種發光二極體封裝結構及其螢光透鏡裝置，螢光透鏡裝置具有複數填充孔，該些填充孔係供含有螢光材料之複數螢光膠體設置，並呈陣列排列，如此可避免螢光材料遮蔽發光二極體所發出之光源，進而提升發光二極體封裝結構之出光效率。
本發明之目的，在於提供一種發光二極體封裝結構及其螢光透鏡裝置，發光二極體封裝結構可使用於表面黏著製程、人工及機械組裝製程，以與現有之封裝技術銜接。
為了達到上述及其他目的，本發明提供一種發光二極體封裝結構及螢光透鏡裝置，該發光二極體封裝結構係包含：一基座；一發光二極體，其設置於該基座；以及一螢光透鏡裝置，設置於該裝配槽，並相間隔地罩設於該發光二極體之上方，其中該螢光透鏡裝置係包含：一透鏡，具有複數填充孔；以及複數螢光膠體，填充於該些填充孔。
An object of the present invention is to provide a light emitting diode package structure and a fluorescent lens device thereof. The light emitting diode package structure is disposed through a fluorescent lens device, and the fluorescent lens device containing the fluorescent material and the packaged light emitting device are provided. There is no direct contact between the polar bodies, so the fluorescent material is not affected by the heat generated by the light-emitting diodes, thereby reducing the luminous efficiency and the service life, thereby improving the luminous efficiency of the light-emitting diode package structure, and it is more stable. Color temperature and long service life.
An object of the present invention is to provide a light emitting diode package structure and a fluorescent lens device thereof. The fluorescent lens device has a plurality of filling holes, and the filling holes are provided by a plurality of fluorescent colloids containing a fluorescent material, and are arranged in an array. The arrangement can prevent the fluorescent material from shielding the light source emitted by the LED, thereby improving the light-emitting efficiency of the LED package structure.
It is an object of the present invention to provide a light emitting diode package structure and a fluorescent lens device thereof. The light emitting diode package structure can be used for surface adhesion process, manual and mechanical assembly processes to interface with existing packaging technologies.
In order to achieve the above and other objects, the present invention provides a light emitting diode package structure and a fluorescent lens device, the light emitting diode package structure comprising: a base; a light emitting diode disposed on the base; And a fluorescent lens device disposed in the mounting groove and spaced over the LED body, wherein the fluorescent lens device comprises: a lens having a plurality of filling holes; and a plurality of phosphor colloids Filled in the filled holes.
茲為使對本發明之結構特徵及所達成之功效有更進一步之瞭解與認識，謹佐以較佳之實施例及配合詳細之說明，說明如後：
習知發光二極體封裝結構之封裝體係由螢光粉混合於環氧樹脂中，然後封裝體並直接覆蓋於發光二極體上，如此發光二極體發光時所產生之熱影響螢光粉周圍的環境溫度，如此螢光粉容易發生老化及碳化發黑，影響螢光粉之發光效率及使用壽命，進而影響發光二極體封裝結構之發光效率及使用壽命。然後，封裝體內之螢光粉可能遮蔽發光二極體所發出之光源，而降低發光二極體封裝結構之出光效率。因此本發明之提出一種高效率發光二極體封裝結構，以克服上述問題。
請參閱第一圖，其係為本發明之第一實施例之封裝結構之剖面圖；如圖所示，本實施例提供一種發光二極體封裝結構1，發光二極體封裝結構1係包含一基座10、一第一導電支架12、一第二導電支架14及一螢光透鏡裝置16。基座10具有一裝配槽101，其中基座10之材料係使用導熱性佳之金屬，例如鋁、銅或銀。然後第一導電支架12及第二導電支架14分別設置於基座10之兩端。螢光透鏡裝置16設置於裝配槽101。其中第一導電支架12及第二導電支架14係分別選自金、銀、銅、鐵、鋁及其合金所組成之群組。然後於第一導電支架12及第二導電支架14與基座10間更分別設置一絕緣層13，以使第一導電支架12及第二導電支架14分別與基座10絕緣。
當一發光二極體2進行封裝時，發光二極體2利用表面黏著技術設置於發光二極體封裝置1之裝配槽101內，其主要於裝配槽101之底部印上錫膏，然後將發光二極體2設置於錫膏上，接著於錫爐進行回流的動作，以使發光二極體2穩固地設置於裝配槽101內之底部。然後發光二極體2之正、負電極分別與第一導電支架12及第二導電支架16電性連接。
本實施例之發光二極體2為垂直式發光二極體，發光二極體2之底部具有一正電極21，所以發光二極體2直接設置於第一導電支架12，使正電極21與第一導電支架12電性連接，然後發光二極體2之頂部具有一負電極22，負電極22利用一導線3（第一圖沒有標示）與第二導電支架14電性連接。當然發光二極體2可為其他形式之發光二極體，只要讓發光二極體2之正、負電極分別與第一導電支架12及第二導電支架14電性連接即可。最後將螢光透鏡裝置16設置於裝配槽101，並位於發光二極體2之上方，且與發光二極體2間有一間隔。其中螢光透鏡裝置16係包含一透鏡161及複數螢光膠體162，透鏡161具有複數填充孔1611，該些螢光膠體162填充於該些填充孔1611內。
上述該些螢光膠體162包含一螢光材料1621及一封膠體1622，其中螢光材料1621之吸收及放射波譜係介於254奈米與550微奈米之間，封膠體1622係一高透光性樹脂。本實施例之螢光材料1621係使用黃色釔鋁石榴石，其為一螢光粉，其螢光粉之粒徑係介於3微米與5微米之間，而封膠體1622係使用環氧樹脂。然後螢光材料1621除了黃色釔鋁石榴石，亦可選自一黃色鋱鋁石榴石(TAG)、一黃色矽酸鹽(Silicate)、一硫化物(Sulfate)及一氮化物(Nitrate)所組成之群組。而封膠體1622除了環氧樹脂，其可選自聚苯乙烯、丙烯晴-丁二烯-苯乙烯聚合物、聚甲基丙烯酸甲酯、壓克力及矽膠所組成之群組。
螢光膠體162係由螢光材料1621與封膠體1622混合而成，於螢光材料1621與封膠體1622混合前，螢光材料1621先以矽烷偶合劑處理，然後螢光材料1621再與封膠體1622混合。待螢光膠體162製備完成後，螢光膠體162係以封灌法、注射法、點膠法等方式形成於透鏡161之填充孔1611。本實施例之螢光膠體162係以點膠法形成於透鏡161之填充孔1611內。當螢光膠體162填充至填充孔1611時，接著對螢光透鏡裝置16加熱，使螢光膠體162能夠與透鏡161充分結合，本實施例之加熱溫度控制於攝氏80度，加熱時間控制於30分鐘內，此僅為一實施例，應不以此為限。
由上述可知，因發光二極體2與螢光透鏡裝置16間有間隔，所以發光二極體2與螢光透鏡裝置16無直接接觸，發光二極體2發光時所產生之熱能不會影響螢光透鏡裝置16周圍之環境溫度，使該些螢光膠體162之螢光材料1621不易老化及碳化發黑，以提升螢光膠體162之發光效率及延長螢光膠體162之使用壽命，進而提升發光二極體封裝結構1之發光效率，並穩定使發光二極體封裝結構1之色溫，且延長發光二極體封裝結構1之使用壽命。
上述螢光透鏡裝置16係由該些螢光膠體162填充至透鏡161之該些填充孔1611內而構成，其中該些填充孔1611係利用壓印法或直接成型法形成於透鏡161，該些填充孔1611之半徑介於100微米與1000微米之間，相鄰之二填充孔1611間之間距係介於250奈米與900奈米之間，較佳間距係介於300奈米與600奈米之間。本實施例之透鏡161為平面型，透鏡161亦可為半球型(請參閱第二圖)。請一併參閱第三圖，本實施例之該些填充孔1611係於透鏡161呈矩陣排列。然後該些填充孔1611亦可呈放射狀(請參閱第四圖)、同心圓狀(請參閱第五圖)、螺旋狀(請參閱第六圖)等陣列排列方式排列於透鏡161，於此不再贅述。
復參閱第一圖，透鏡161係具有一第一表面1610及一第二表面1612，第一表面1610係朝向基座10之裝配槽101外部，第二表面1612係對應第一表面1610。本實施例之填充孔1611可為凹槽，該些填充孔1611設置於第一表面1610，當然該些填充孔1611可設置於第二表面1612(請參閱第七圖)，或者同時設置於第一表面1610及第二表面1612，設置於第一表面1610之該些填充孔1611與設置於第二表面1610之該些填充孔1611交錯設置(請參閱第八圖)，上述填充孔1611之截面為半圓形(如第一圖及第七圖所示)，其截面亦可為矩形(如第八圖所示)，當然填充孔1611之截面可為其他形狀，於此不再贅述。
另參閱第九圖，本實施例之填充孔1611可為穿孔，該些填充孔1611可貫穿透鏡161之第一表面1610及其第二表面1612。由上述可知，本實施例之該些填充孔1611係呈陣列排列，然後該些螢光膠體162填充於該些填充孔1611內。當發光二極體2發出一第一光源，該些螢光膠體162隨著該些填充孔1611呈陣列排列，該些螢光膠體162之螢光材料1621不會對第一光源產生遮蔽，以提升發光二極體封裝結構1之出光效率。然後發光二極體2所發出之第一光源激發該些螢光膠體162之該些螢光材料1621，產生一第二光源，第一光源與第二光源可均勻混合為一第三光源，以提高混光均勻性。復參閱第一圖，本實施例更可於裝配槽101內填充一惰性氣體，惰性氣體可為氮氣、氬氣或氖氣，惰性氣體填充於螢光透鏡裝置16與發光二極體2之間，如此可提升發光二極體封裝結構1之熱傳導性。
請參閱第十圖，係本發明之第十實施例之封裝結構之剖面圖。如圖所示，第一實施例與第二實施例之封裝結構1的基座10皆具有一裝配槽101(請參閱第一圖及第二圖)，而本實施例之封裝結構1的基座10未設有裝配槽101，所以發光二極體2直接設置於基座10，並與第一導電支架12及第二導電支架14電性連接。然本實施例之螢光透鏡裝置16為一半球型罩體，可罩設於發光二極體2之上方，並與發光二極體2間有間隔，以避免發光二極體2所發出之熱能影響螢光透鏡裝置16周圍之環境溫度，使螢光膠體162內之螢光材料不易老化及碳化發黑，可保持發光二極體封裝結構1之色溫不發生變化，進而提升發光二極體封裝結構1之發光強度，且延長發光二極體2之使用壽命。然後第三至九實施例所載之螢光透鏡裝置16的結構變化及於螢光透鏡裝置16與基座10間填充惰性氣體皆可應用於於本實施例中，於此不再贅述。
綜上所述，本發明提供一種發光二極體封裝結構及其螢光透鏡裝置，螢光透鏡裝置設置於被封裝之發光二極體上方，並與發光二極體間有間隔，且與發光二極體無直接接觸，如此發光二極體所發出之熱能不會影響螢光透鏡裝置周圍之環境溫度，使螢光膠體內之螢光材料不易老化及碳化發黑，可保持發光二極體封裝結構之色溫不發生變化，並提升發光二極體封裝結構之發光強度，且延長發光二極體之使用壽命。然後螢光透鏡裝置之該些螢光膠體係隨透鏡之該些填充孔呈陣列排列，所以螢光膠體不會遮蔽發光二極體所發出之光源，進而提升發光二極體封裝結構之出光效率及混光均勻性。而本發明之發光二極體封裝結構可使用於表面黏著製程、人工及機械組裝製程，以與現有之封裝技術銜接。
In order to provide a better understanding and understanding of the structural features and the efficiencies of the present invention, the preferred embodiments and the detailed description are described as follows:
The package system of the conventional light-emitting diode package structure is mixed with the phosphor powder in the epoxy resin, and then the package body is directly covered on the light-emitting diode, so that the heat generated by the light-emitting diode emits fluorescent powder. The surrounding ambient temperature, such that the phosphor powder is prone to aging and carbonization and blackening, affecting the luminous efficiency and service life of the phosphor powder, thereby affecting the luminous efficiency and service life of the LED package structure. Then, the phosphor in the package may shield the light source emitted by the LED, and reduce the light extraction efficiency of the LED package structure. Therefore, the present invention proposes a high efficiency light emitting diode package structure to overcome the above problems.
Referring to the first drawing, which is a cross-sectional view of a package structure according to a first embodiment of the present invention; as shown in the figure, the embodiment provides a light emitting diode package structure 1 and a light emitting diode package structure 1 includes A susceptor 10, a first conductive support 12, a second conductive support 14 and a fluorescent lens device 16. The base 10 has a mounting groove 101 in which the material of the base 10 is made of a metal having good thermal conductivity such as aluminum, copper or silver. Then, the first conductive bracket 12 and the second conductive bracket 14 are respectively disposed at two ends of the base 10. The fluorescent lens device 16 is disposed in the mounting groove 101. The first conductive support 12 and the second conductive support 14 are respectively selected from the group consisting of gold, silver, copper, iron, aluminum and alloys thereof. An insulating layer 13 is further disposed between the first conductive bracket 12 and the second conductive bracket 14 and the base 10 to insulate the first conductive bracket 12 and the second conductive bracket 14 from the base 10 respectively.
When a light-emitting diode 2 is packaged, the light-emitting diode 2 is disposed in the mounting groove 101 of the light-emitting diode sealing device 1 by surface adhesion technology, and is mainly printed with solder paste on the bottom of the mounting groove 101, and then The light-emitting diode 2 is placed on the solder paste, and then reflowed in the solder pot so that the light-emitting diode 2 is firmly disposed at the bottom of the mounting groove 101. Then, the positive and negative electrodes of the LED 2 are electrically connected to the first conductive bracket 12 and the second conductive bracket 16 respectively.
The light-emitting diode 2 of the present embodiment is a vertical light-emitting diode, and the bottom of the light-emitting diode 2 has a positive electrode 21, so that the light-emitting diode 2 is directly disposed on the first conductive support 12, so that the positive electrode 21 and the positive electrode 21 The first conductive support 12 is electrically connected, and then the top of the light-emitting diode 2 has a negative electrode 22, and the negative electrode 22 is electrically connected to the second conductive support 14 by a wire 3 (not shown in the first figure). The light-emitting diodes 2 can be electrically connected to the first conductive support 12 and the second conductive support 14 respectively. Finally, the fluorescent lens device 16 is disposed in the mounting groove 101 and above the light emitting diode 2 and spaced apart from the light emitting diode 2. The fluorescent lens device 16 includes a lens 161 and a plurality of fluorescent colloids 162. The lens 161 has a plurality of filling holes 1611. The fluorescent colloids 162 are filled in the filling holes 1611.
The phosphor colloid 162 comprises a fluorescent material 1621 and a colloid 1622, wherein the absorption and emission spectrum of the fluorescent material 1621 is between 254 nm and 550 micronm, and the encapsulant 1622 is highly transparent. Light resin. The phosphor material 1621 of the present embodiment uses yellow yttrium aluminum garnet, which is a phosphor powder, the phosphor powder has a particle size of between 3 micrometers and 5 micrometers, and the sealant 1622 is epoxy resin. . The phosphor material 1621 is then composed of a yellow yttrium aluminum garnet (TAG), a yellow yttrium aluminum garnet (TAG), a yellow silicate (Silicate), a monosulfide (Sulfate) and a nitride (Nitrate). Group of. The encapsulant 1622, in addition to the epoxy resin, may be selected from the group consisting of polystyrene, acrylonitrile-butadiene-styrene polymer, polymethyl methacrylate, acrylic, and silicone.
The fluorescent colloid 162 is formed by mixing the fluorescent material 1621 and the sealing body 1622. Before the fluorescent material 1621 is mixed with the sealing body 1622, the fluorescent material 1621 is first treated with a decane coupling agent, and then the fluorescent material 1621 is further combined with the sealing body. 1622 mixed. After the preparation of the fluorescent colloid 162 is completed, the fluorescent colloid 162 is formed in the filling hole 1611 of the lens 161 by a sealing method, an injection method, a dispensing method or the like. The phosphor colloid 162 of the present embodiment is formed in the filling hole 1611 of the lens 161 by a dispensing method. When the phosphor colloid 162 is filled into the filling hole 1611, the fluorescent lens device 16 is heated to enable the fluorescent colloid 162 to be fully combined with the lens 161. The heating temperature of the embodiment is controlled at 80 degrees Celsius, and the heating time is controlled at 30. In the minute, this is only an embodiment and should not be limited to this.
As can be seen from the above, since the light-emitting diode 2 and the fluorescent lens device 16 are spaced apart from each other, the light-emitting diode 2 does not directly contact the fluorescent lens device 16, and the heat generated when the light-emitting diode 2 emits light does not affect. The ambient temperature around the fluorescent lens device 16 makes the fluorescent material 1621 of the phosphor colloid 162 less susceptible to aging and carbonization, thereby improving the luminous efficiency of the fluorescent colloid 162 and prolonging the service life of the fluorescent colloid 162. The luminous efficiency of the LED package structure 1 stabilizes the color temperature of the LED package structure 1 and prolongs the service life of the LED package structure 1.
The fluorescent lens device 16 is formed by filling the fluorescent colloids 162 into the filling holes 1611 of the lens 161. The filling holes 1611 are formed on the lens 161 by imprinting or direct molding. The radius of the filling hole 1611 is between 100 micrometers and 1000 micrometers, and the distance between the adjacent two filling holes 1611 is between 250 nanometers and 900 nanometers, and the preferred spacing is between 300 nanometers and 600 nanometers. Between meters. The lens 161 of this embodiment is of a flat type, and the lens 161 may also be of a hemispherical type (refer to the second figure). Referring to the third figure, the filling holes 1611 of the embodiment are arranged in a matrix of the lens 161. Then, the filling holes 1611 can also be arranged in the lens 161 in a radial arrangement (see the fourth figure), a concentric shape (see the fifth figure), and a spiral shape (see the sixth figure). No longer.
Referring to the first figure, the lens 161 has a first surface 1610 and a second surface 1612. The first surface 1610 faces the outside of the mounting groove 101 of the base 10, and the second surface 1612 corresponds to the first surface 1610. The filling holes 1611 of the embodiment may be grooves, and the filling holes 1611 are disposed on the first surface 1610. Of course, the filling holes 1611 may be disposed on the second surface 1612 (refer to the seventh figure), or at the same time A surface 1610 and a second surface 1612, the filling holes 1611 disposed on the first surface 1610 are staggered with the filling holes 1611 disposed on the second surface 1610 (refer to FIG. 8), and the cross section of the filling hole 1611 is The semi-circular shape (as shown in the first and seventh figures) may also be rectangular (as shown in the eighth figure). Of course, the cross-section of the filling hole 1611 may be other shapes, and details are not described herein.
Referring to the ninth figure, the filling holes 1611 of the embodiment may be perforations, and the filling holes 1611 may penetrate the first surface 1610 of the lens 161 and the second surface 1612 thereof. It can be seen from the above that the filling holes 1611 of the embodiment are arranged in an array, and then the fluorescent colloids 162 are filled in the filling holes 1611. When the light emitting diodes 2 emit a first light source, the fluorescent colloids 162 are arranged in an array along the filling holes 1611, and the fluorescent materials 1621 of the fluorescent colloids 162 do not block the first light source. The light extraction efficiency of the light emitting diode package structure 1 is improved. Then, the first light source emitted by the LED 2 excites the phosphor materials 1621 of the phosphor colloids 162 to generate a second light source. The first light source and the second light source can be uniformly mixed into a third light source. Improve the uniformity of light mixing. Referring to the first figure, in this embodiment, an inert gas can be filled in the mounting groove 101. The inert gas can be nitrogen, argon or helium. The inert gas is filled between the fluorescent lens device 16 and the light emitting diode 2. Thus, the thermal conductivity of the light emitting diode package structure 1 can be improved.
Referring to the tenth drawing, there is shown a cross-sectional view of a package structure of a tenth embodiment of the present invention. As shown in the figure, the pedestal 10 of the package structure 1 of the first embodiment and the second embodiment has a mounting groove 101 (refer to the first figure and the second figure), and the base of the package structure 1 of the embodiment The socket 10 is not provided with the mounting slot 101. Therefore, the LED 2 is directly disposed on the base 10 and electrically connected to the first conductive bracket 12 and the second conductive bracket 14. The fluorescent lens device 16 of the present embodiment is a half-spherical cover, which can be disposed above the light-emitting diode 2 and spaced apart from the light-emitting diode 2 to prevent the light-emitting diode 2 from being emitted. The thermal energy affects the ambient temperature around the fluorescent lens device 16, so that the fluorescent material in the fluorescent colloid 162 is not easily aged and carbonized, and the color temperature of the LED package structure 1 is not changed, thereby improving the light emitting diode. The luminous intensity of the package structure 1 is extended, and the service life of the light-emitting diode 2 is extended. The structural changes of the fluorescent lens device 16 and the filling of the inert gas between the fluorescent lens device 16 and the susceptor 10 in the third to ninth embodiments can be applied to the present embodiment, and details are not described herein.
In summary, the present invention provides a light emitting diode package structure and a fluorescent lens device thereof. The fluorescent lens device is disposed above the packaged light emitting diode and spaced apart from the light emitting diode, and is illuminated. The diode has no direct contact, so the thermal energy emitted by the LED does not affect the ambient temperature around the fluorescent lens device, so that the fluorescent material in the fluorescent gel is not easily aged and carbonized, and the LED can be kept. The color temperature of the package structure does not change, and the luminous intensity of the LED package structure is improved, and the service life of the LED is prolonged. Then, the phosphor paste system of the fluorescent lens device is arranged in an array with the filling holes of the lens, so that the phosphor colloid does not block the light source emitted by the LED, thereby improving the light-emitting efficiency of the LED package structure. And light mixing uniformity. The LED package structure of the present invention can be used for surface adhesion process, manual and mechanical assembly processes to interface with existing packaging technologies.
1．．．發光二極體封裝結構1. . . Light emitting diode package structure
10．．．基座10. . . Pedestal
101．．．裝配槽101. . . Assembly slot
12．．．第一導電支架12. . . First conductive bracket
13．．．絕緣層13. . . Insulation
14．．．第二導電支架14. . . Second conductive bracket
16．．．螢光透鏡裝置16. . . Fluorescent lens device
161．．．透鏡161. . . lens
1610．．．第一表面1610. . . First surface
1611．．．填充孔1611. . . Fill hole
1612．．．第二表面1612. . . Second surface
162．．．螢光膠體162. . . Fluorescent colloid
1621．．．螢光材料1621. . . Fluorescent material
1622．．．封膠體1622. . . Sealant
2．．．發光二極體2. . . Light-emitting diode
21．．．正電極twenty one. . . Positive electrode
22．．．負電極twenty two. . . Negative electrode
3．．．導線3. . . wire
第一圖係為本發明之第一實施例之封裝結構之剖面圖；
第二圖係為本發明之第二實施例之封裝結構之剖面圖；
第三圖係為本發明之第三實施例之螢光透鏡裝置之俯視圖；
第四圖係為本發明之第四實施例之螢光透鏡裝置之俯視圖；
第五圖係為本發明之第五實施例之螢光透鏡裝置之俯視圖；
第六圖係為本發明之第六實施例之螢光透鏡裝置之俯視圖；
第七圖係為本發明之第七實施例之螢光透鏡裝置之剖面圖；
第八圖係為本發明之第八實施例之螢光透鏡裝置之剖面圖；
第九圖係為本發明之第九實施例之螢光透鏡裝置之剖面圖；以及
第十圖係為本發明之第九實施例之封裝結構之剖面圖。
The first figure is a cross-sectional view of a package structure of a first embodiment of the present invention;
2 is a cross-sectional view showing a package structure of a second embodiment of the present invention;
The third drawing is a plan view of a fluorescent lens device according to a third embodiment of the present invention;
Figure 4 is a plan view of a fluorescent lens device according to a fourth embodiment of the present invention;
Figure 5 is a plan view of a fluorescent lens device according to a fifth embodiment of the present invention;
Figure 6 is a plan view of a fluorescent lens device according to a sixth embodiment of the present invention;
Figure 7 is a cross-sectional view showing a fluorescent lens device of a seventh embodiment of the present invention;
Figure 8 is a cross-sectional view showing a fluorescent lens device of an eighth embodiment of the present invention;
Figure 9 is a cross-sectional view showing a fluorescent lens device according to a ninth embodiment of the present invention; and a tenth view showing a package structure of a ninth embodiment of the present invention.
1．．．發光二極體封裝結構1. . . Light emitting diode package structure
10．．．基座10. . . Pedestal
101．．．裝配槽101. . . Assembly slot
12．．．第一導電支架12. . . First conductive bracket
13．．．絕緣層13. . . Insulation
14．．．第二導電支架14. . . Second conductive bracket
16．．．螢光透鏡裝置16. . . Fluorescent lens device
161．．．透鏡161. . . lens
1610．．．第一表面1610. . . First surface
1611．．．填充孔1611. . . Fill hole
1612．．．第二表面1612. . . Second surface
162．．．螢光膠體162. . . Fluorescent colloid
1621．．．螢光材料1621. . . Fluorescent material
1622．．．封膠體1622. . . Sealant
2．．．發光二極體2. . . Light-emitting diode
21．．．正電極twenty one. . . Positive electrode
22．．．負電極twenty two. . . Negative electrode
3．．．導線3. . . wire
Claims (17)
一基座；
一發光二極體，設置於該基座；以及
一螢光透鏡裝置，設置於該基座，並相間隔地罩設於該發光二極體之上方，該螢光透鏡裝置係包含：
一透鏡，具有複數填充孔；以及
複數螢光膠體，填充於該些填充孔。A light emitting diode package structure comprising:
a pedestal
a light-emitting diode device is disposed on the pedestal; and a fluorescent lens device is disposed on the pedestal and is disposed above the light-emitting diode at intervals. The fluorescent lens device comprises:
a lens having a plurality of filled holes; and a plurality of phosphor colloids filled in the filled holes.
一透鏡，具有複數填充孔；以及
複數螢光膠體，填充於該些填充孔。A fluorescent lens device for arranging over a light-emitting diode at intervals, comprising:
a lens having a plurality of filled holes; and a plurality of phosphor colloids filled in the filled holes.
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| TW100144998A TW201324877A (en) | 2011-12-07 | 2011-12-07 | Light emitting diode packaging structure and fluorescent lens device thereof |
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| TW100144998A TW201324877A (en) | 2011-12-07 | 2011-12-07 | Light emitting diode packaging structure and fluorescent lens device thereof |
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| CN105070809A (en) * | 2015-07-21 | 2015-11-18 | 株式会社惠南电机 | Light-emitting structure body |
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| JP4338768B1 (en) * | 2008-08-12 | 2009-10-07 | 兵治 新山 | Light emitting device |
| KR101565988B1 (en) * | 2009-10-23 | 2015-11-05 | 삼성전자주식회사 | Red phosphor Method for preparing the same Light emitting device package and Lighting apparatus using the Red Phosphor |
| TW201133948A (en) * | 2010-03-16 | 2011-10-01 | Wang Xiang Yun | LED packaging structure |
| TWM401204U (en) * | 2010-05-03 | 2011-04-01 | Ru-Yuan Yang | The structure of white light-emitting diode contained fluorescent lens |
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| CN105070809A (en) * | 2015-07-21 | 2015-11-18 | 株式会社惠南电机 | Light-emitting structure body |
| CN105070809B (en) * | 2015-07-21 | 2018-06-26 | 株式会社惠南电机 | Light emitting structure body |
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