TW201324597A - 圖案形成方法 - Google Patents
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- TW201324597A TW201324597A TW101141020A TW101141020A TW201324597A TW 201324597 A TW201324597 A TW 201324597A TW 101141020 A TW101141020 A TW 101141020A TW 101141020 A TW101141020 A TW 101141020A TW 201324597 A TW201324597 A TW 201324597A
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1292—Multistep manufacturing methods using liquid deposition, e.g. printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/02—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a matt or rough surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thin Film Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011247100A JP2013105797A (ja) | 2011-11-11 | 2011-11-11 | パターン形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201324597A true TW201324597A (zh) | 2013-06-16 |
Family
ID=48289848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101141020A TW201324597A (zh) | 2011-11-11 | 2012-11-05 | 圖案形成方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2013105797A (ja) |
| TW (1) | TW201324597A (ja) |
| WO (1) | WO2013069466A1 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6067605B2 (ja) * | 2014-02-26 | 2017-01-25 | 富士フイルム株式会社 | パターン形成方法 |
| TWI664066B (zh) | 2014-09-30 | 2019-07-01 | 日商富士軟片股份有限公司 | 多孔質體的製造方法、元件的製造方法、配線結構的製造方法 |
| CN112517355A (zh) * | 2020-11-20 | 2021-03-19 | 榆林学院 | 一种换热管表面超双疏涂层及其制备工艺和在甲醇制烯烃装置中的应用 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003059940A (ja) * | 2001-08-08 | 2003-02-28 | Fuji Photo Film Co Ltd | ミクロファブリケーション用基板、その製造方法および像状薄膜形成方法 |
| JP2003222972A (ja) * | 2001-11-21 | 2003-08-08 | Fuji Photo Film Co Ltd | パターン形成材料及び画像形成材料 |
| JP4557755B2 (ja) * | 2004-03-11 | 2010-10-06 | キヤノン株式会社 | 基板、導電性基板および有機電界効果型トランジスタの各々の製造方法 |
| JP4700484B2 (ja) * | 2004-12-17 | 2011-06-15 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5332145B2 (ja) * | 2007-07-18 | 2013-11-06 | 株式会社リコー | 積層構造体、電子素子、電子素子アレイ及び表示装置 |
| JP2009075252A (ja) * | 2007-09-19 | 2009-04-09 | Ricoh Co Ltd | 積層構造体およびその形成方法、配線基板、マトリクス基板、電子表示装置 |
| JP5095650B2 (ja) * | 2008-09-30 | 2012-12-12 | シャープ株式会社 | 膜パターンとその膜パターン形成方法、及び導電膜配線、並びに電気光学装置 |
-
2011
- 2011-11-11 JP JP2011247100A patent/JP2013105797A/ja active Pending
-
2012
- 2012-10-25 WO PCT/JP2012/077560 patent/WO2013069466A1/ja active Application Filing
- 2012-11-05 TW TW101141020A patent/TW201324597A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013069466A1 (ja) | 2013-05-16 |
| JP2013105797A (ja) | 2013-05-30 |
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