TW201321770A - Circuit pattern inspection device and method thereof - Google Patents

Abstract

There are provided a circuit pattern inspection device and method thereof capable of detecting open/shortcircuit of a conductive pattern by a single sensor unit. For performing a non-contact inspection of conductive patterns (2) arranged in a string shape on a glass substrate (3), a power supply unit (12) for supplying an inspection signal and a sensor (13) for detecting the signal are arranged in the vicinity from each other. With this configuration, a remarkable difference is generated in the detection level of the inspection current by the sensor (13) when the sensor (13) is on a normal conductive pattern having no open state and when the sensor (13) is positioned on a conductive pattern having an open position. Thus, it is possible to surely detect the open state.

Description

Circuit pattern inspection device and method thereof

The present invention relates to a circuit pattern inspection apparatus and a method thereof, and, for example, to a pattern inspection apparatus and a method thereof capable of inspecting whether a comb-shaped conductive pattern formed on a glass substrate is good.

A method for inspecting a circuit pattern formed on a substrate, wherein in the prior art, an inspection signal is supplied from one end of the conductive pattern, and when an inspection signal is detected from the other end of the conductive pattern, it is ensured to be turned on. The circuit pattern to be inspected is in a normal state. Conversely, if the inspection signal is not detected, it is determined that the conductive pattern is in a disconnected state, and this method can be used in actual circuit board inspection.

In addition, the method may be applied to the inspection signal of the conductive pattern to be inspected, not only to confirm that it passes normally through the conductive pattern, but also to arrange the inspection probe in a pattern adjacent to the conductive pattern to be inspected, and determine whether or not the adjacent pattern is The other end also detects a signal for determining whether the inspected conductive pattern and the adjacent pattern have a short state.

Specifically, the method includes (1) at both ends of the conductive pattern of the inspection object, for example, a person who directly contacts the tip probe (referred to as a tip contact method, and a detailed portion thereof is described, for example, in Patent Document 1), (2) The tip probe is directly contacted only on the supply side of the inspection signal, and the inspection signal is detected in a non-contact state via the capacitive coupling between the conductive pattern and the sensor at the other end (non-contact-contact combination), (3) supplying an inspection signal via capacitive coupling between the inspected conductive pattern and the signal supply probe, and detecting the inspection signal via the capacitive coupling between the conductive pattern and the sensor at the other end, on the supply side and the sensing side of the signal Both sides conduct conduction inspection (non-contact method) in a non-contact state.

[Patent Document 1] Japanese Patent Laid-Open No. 62-269075

However, in the tip contact method of the above (1), all the terminals of the substrate to be inspected are in contact with the metallic tip probe, and an electrical signal is sent to the conductive pattern via the probes. Therefore, it is an advantage that a good S/N ratio (signal noise ratio) can be obtained for the inspection signal, but there is a problem that the article to be inspected itself or its pattern is damaged, and it cannot be used in a high-density pattern.

Further, in the circuit pattern inspection device or the inspection method of the prior art described above, the configuration is separately provided with an open circuit sensor as a detecting means for detecting whether or not the conductive pattern to be inspected is in an open state (pattern disconnection state) And a short-circuit sensor for checking the short-circuit state (short state) with the adjacent pattern. In this case, it is necessary to separately analyze the detection signals from the sensors, complicate the configuration of the analysis program and the inspection device, and thus it takes a long time, so that the inspection performance or the inspection efficiency is increased. limit.

On the other hand, it is difficult to perform an inspection with high accuracy in the detection level of the methods (2) and (3) above. Further, in the inspection apparatus of the prior art, as shown in FIG. 9, the power supply unit 101 that supplies the inspection signal and the sensor 103 for signal detection are disposed away from one end of the conductive pattern to be inspected and The other end is a certain distance. Therefore, it is difficult to miniaturize the unit constituted by the power supply unit and the sensor. In particular, since the length of the conductive pattern is different depending on the object to be inspected (for example, a liquid crystal display panel or a touch panel) or the model of the product, it is necessary to have a configuration of the power supply portion and the sensor corresponding thereto. Set the unit to match each inspection object.

In addition, as shown in FIG. 9, in the comb-tooth pattern of one of the connection patterns, the detection signal level when the conductive pattern is not opened, the detection signal is transferred to the other conductive pattern, and the open portion of the conductive pattern is opened. At the time of detecting the signal level, since the open circuit detection of the conductive pattern is performed based on the slight level difference, it is impossible to surely and sufficiently check the problem.

That is, as shown in FIG. 9, the comb-shaped conductive patterns 120, 121, etc., which are open at one end and short-circuited by the shorting bar 104 at one end, assume that one of the conductive patterns 121 is in a broken state (the broken portion is symbolized) 110 shows). When the inspection signal is supplied from the power supply unit 101, the signal current flowing in the conductive pattern is detected by the open-circuit detecting sensor 103 (A of FIG. 10) without disconnection, and since the disconnection 110 becomes no. When the current flow level (B of Fig. 10) is compared, it can be understood from Fig. 10 that the difference is small (for example, the level of 10% which is normal is lowered). Therefore, it is difficult to distinguish between the detection signal and the noise, and there is a problem in the reliability of the detection result.

The present invention is directed to the above problems, and its object is to provide high precision detection A circuit pattern inspection device and a method thereof for an open state/short circuit state of a conductive pattern.

Further, another object of the present invention is to provide a circuit pattern inspection apparatus and a method thereof capable of detecting an open state/short circuit state of a conductive pattern with a simple device configuration.

One of the means for achieving the above object and solving the above problems is, for example, the following structure. That is, the present invention is a circuit pattern inspection device for inspecting a state of a conductive pattern disposed on a substrate, characterized by comprising: a signal supply means for supplying an inspection signal to one end portion of the conductive pattern In the vicinity of the front end, the detecting means is disposed close to the signal supply means, and the detection signal can be detected by the conductive pattern to which the inspection signal is supplied, and the identification means can be used according to the change of the detection signal detected by the detection means. To identify whether the above conductive pattern is good.

For example, the present invention is characterized in that a means for moving the signal supply means and the detecting means in a fixed position is provided for maintaining the proximity of the signal supply means and the detecting means, and sequentially scanning the conductive pattern to be inspected. .

For example, it is characterized in that the inspection signal is supplied to the conductive pattern near the front end of all the patterns of one end portion of the conductive pattern by the scanning, and the inspection signal is detected by the conductive pattern.

Further, for example, the signal supply means includes a plate member facing the conductive pattern at a certain interval, via the plate member and the guide The capacitive coupling between the electrical patterns supplies the above-described inspection signal in a non-contact manner.

For example, the detecting means includes a plate member facing the conductive pattern at a predetermined interval, and the inspection signal is detected in a non-contact manner via capacitive coupling between the plate member and the conductive pattern. Further, for example, the identification means is for identifying a disconnection state of the conductive pattern and a short-circuit state in which the conductive patterns are short-circuited to each other.

For example, the conductive pattern is arranged in a comb shape, and the signal supply means and the detecting means are positioned close to each other in the vicinity of the front end portion of the comb-tooth pattern to be inspected. Further, for example, the conductive patterns are arranged in a separate row shape, and the signal supply means and the detecting means are positioned close to each other in the vicinity of the end portion before the line pattern to be inspected.

Another means for solving the above problem is, for example, the following configuration. That is, the present invention is a circuit pattern inspection method for detecting a state of a conductive pattern disposed on a substrate by using a circuit pattern inspection device, characterized in that the step of including the signal supply means for one side of the conductive pattern An inspection signal is supplied in the vicinity of the front end of the portion, and the inspection signal is detected by the detection means disposed adjacent to the signal supply means, and the inspection signal is detected by the conductive pattern supplied with the inspection signal; and whether the conductive pattern is recognized based on the detected detection signal good.

For example, the circuit pattern inspection method of the present invention is characterized in that the step further comprises the step of causing the signal supply means and the detecting means to be positioned The signal supply means and the detecting means are maintained in a close state, and the conductive pattern to be inspected is sequentially scanned.

Further, for example, it is characterized in that the inspection signal is supplied to the conductive pattern near the front end of all the patterns of one end portion of the conductive pattern by the scanning, and the inspection signal is detected by the conductive pattern.

For example, the signal supply means includes a plate member facing the conductive pattern at a predetermined interval, and the inspection signal is supplied in a non-contact manner via capacitive coupling between the plate member and the conductive pattern.

For example, the detecting means includes a plate member facing the conductive pattern at a predetermined interval, and the inspection signal is detected in a non-contact manner via capacitive coupling between the plate member and the conductive pattern. Further, for example, the identification step is for identifying a disconnection state of the conductive pattern and a short-circuit state in which the conductive patterns are short-circuited to each other.

For example, the conductive pattern is arranged in a comb shape, and the signal supply means and the detecting means are positioned close to each other in the vicinity of the front end portion of the comb-tooth pattern to be inspected. Further, for example, the conductive patterns are arranged in an independent row, and the signal supply means and the detecting means are positioned close to each other in the vicinity of the front end portion of the line pattern to be inspected.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Figure 1 is a block diagram showing the overall structure of a substrate inspection apparatus of this embodiment. Made. In the inspection object 1 of the substrate inspection apparatus shown in Fig. 1, for example, a liquid crystal display panel or a touch panel is used, and here, it is checked whether or not the comb-shaped conductive pattern 2 provided on the glass substrate 3 is good (conductive pattern) The disconnected state, and the short circuit state of the conductive pattern). Further, the comb-shaped conductive pattern 2 is, for example, a conductive pattern before the bonding of the panels, and as the conductive material, for example, chromium, silver, aluminum, ITO or the like is used.

In Fig. 1, the control unit 15 is, for example, a microprocessor for performing overall control of the substrate inspecting apparatus of the present embodiment, thereby integrally controlling the inspection program. The ROM 18 stores control steps for becoming a computer program including the substrate inspection step described later. Further, the RAM 17 is a memory used as a work area for temporarily storing control data, checking data, and the like.

The unit 5 includes a power supply unit 12 that can supply an alternating current signal of a predetermined frequency to the comb-shaped conductive pattern 2 in a non-contact manner, and the sensor 13 detects whether the conductive pattern 2 of the inspection object is in an open state in a non-contact manner. (pattern disconnection state), etc.; and an amplifier (Amplifier) 20 for amplifying the weak signal detected by the sensor 13. In addition, the unit 5 is positioned at a predetermined distance from the comb-shaped conductive pattern 2 for inspection in a non-contact manner.

The drive unit 16 receives a control signal from the control unit 15 to move the entire loading table 14 on which the inspection object 1 is mounted, at a predetermined speed in a predetermined direction, and allows the unit 5 to sequentially scan the inspection object 1 in a non-contact state. The conductive patterns 2a to 2e of the comb-shaped conductive pattern 2 (see FIG. 2 and the like). therefore The drive unit 16 moves the loading table 14 in a predetermined direction by about μm.

Further, in the present embodiment, the movement of the loading table 14 on which the inspection object 1 is mounted will be described. However, instead of the movement of the loading table 14, the unit 5 may be moved in a predetermined direction for sequential use. Scan the conductive pattern of the inspection object, etc.

In the power supply unit 12, a signal generating unit 10 that is an oscillator that is an inspection signal is connected. In the present embodiment, for example, a high frequency signal of 200 kHz is output to the power supply unit 12. Further, the power supply unit 12 is provided with a flat plate for supplying an alternating current signal to the comb-shaped conductive pattern 2 in the non-contact manner described above. Therefore, the inspection signal is supplied to the conductive pattern via capacitive coupling between the power supply portion 12 and the conductive pattern. Likewise, the inspection signal supplied to the conductive pattern is coupled to the sensor 13 from the conductive pattern via capacitive coupling between the conductive pattern and the sensor 13.

The power supply unit 12 and the sensor 13 are disposed in the unit 5 in a state of being close to each other, and the unit 5 is disposed at one end portion of the conductive pattern of the inspection object while moving, for example, in a direction indicated by an arrow in FIG. Drive control of the loading station 14. In this manner, the open state of the comb-shaped conductive patterns 2a to 2e disposed on the substrate 3 can be individually inspected.

Further, the length of the power supply portion 12 is, for example, 40 mm, and the length of the sensor 13 is, for example, 2 mm. Further, the power supply unit 12 and the sensor 13 disposed close to each other are spaced apart by, for example, an interval of 10 mm so that the sensor 13 is not directly affected by the inspection output signal from the power supply unit 12.

The amplifier 20 is measurable to the sensor 13 at a predetermined amplification rate. Since the small signal is amplified, it is composed of, for example, an operational amplifier (OP Amp). In the present embodiment, the amplifier 20 is disposed after the sensor 13 in the unit 5 to eliminate the influence of external noise or the like on the detection signal.

The output signal from the amplifier 20 is sent to the signal processing section 21. The signal processing unit 21 performs a waveform process of converting a signal obtained by converting an amplified AC signal into a DC level, or a conversion process of converting an analog signal into a digital signal or the like. Then, the control unit 15 compares the result obtained by the processing of the signal processing unit 21 with a preset reference value, and determines whether or not the processing result is equal to or higher than the reference value. The determination result is transmitted from the control unit 15 to the display unit 25.

The display unit 25 is configured by, for example, a CRT or a liquid crystal display, and visually displays whether or not the inspection target (conductive pattern) of the determination result sent from the control unit 15 is good, in a form that can be understood by the inspector. If the conductive patterns 2a to 2e of the comb-shaped conductive pattern 2 have defective positions, the position on the substrate of the conductive pattern is also displayed by, for example, a pattern number or a coordinate. In addition, the display of the inspection result is not limited to the visual display, and may be output in the form of sound or the like. In addition, visual display and sound can also be mixed.

Next, the inspection principle of the substrate inspection apparatus of the embodiment will be described. Fig. 2 is a plan view showing the positional relationship between the unit 5 in which the above-described power supply portion 12 and the sensor 13 are housed, and the inspection object (conductive pattern). Fig. 3 shows an example of the measurement results of the unit of the normal conductive pattern and the inspection signal flowing in the conductive pattern. On the other hand, FIG. 4 shows the unit when the conductive pattern has an open portion, and the measurement result of the inspection signal flowing in the conductive pattern. An example.

As shown in FIG. 2, a comb-shaped conductive pattern 2 to be inspected is disposed on a substrate (see FIG. 1), and the conductive patterns 2a to 2e corresponding to the comb-tooth portions have a structure in which one end is open. The base is shorted by the shorting bar 4. Further, the unit 5 in which the power supply unit 12 and the sensor 13 are housed is disposed near the open end of the conductive patterns 2a to 2e at the time of inspection, and is moved in the direction of the arrow to determine the conductive pattern. Whether each of 2a~2e has an open state.

In the substrate inspection apparatus of the present embodiment, the entire inspection object 1 in which the comb-shaped conductive pattern 2 is placed on the glass substrate 3 is mounted on the loading table 14 during the substrate inspection, and the loading table 14 is electrically Ground. Therefore, the respective conductive patterns 2a to 2e of the comb-shaped conductive pattern 2 are equivalently connected to the capacitor (capacitor) including the glass 3 and the loading stage 14, and the signal current from the power supply portion 12 flows into the current through the respective conductive patterns. Wait for the capacitor.

Fig. 7 is a circuit diagram for schematically showing the flow of an inspection signal of the substrate inspecting apparatus of the embodiment. In FIG. 7, the impedances of the resistors R1 and R2 correspond to the coupling capacitance between the power supply portion and the conductive pattern in the non-contact state, and the coupling capacitance between the conductive pattern and the sensor, respectively. In addition, R3 is the input impedance of the amplifier 20, and R4 is the impedance equivalent to the capacitance between the loading stage and the ground (ground).

R1 and R2 have high impedance values equivalent to air gaps, and R3 of the input impedance of the amplifier is also high impedance. In addition, since R4 is the ground impedance of the conductive pattern including the shorting bar, its impedance value is much smaller than R1, R2, and the like. For example, The frequency of the inspection signal of the substrate inspection device is R1, R2 is 500KΩ, R3 is 100KΩ, and R4 is 500Ω~1KΩ.

Therefore, when the conductive pattern is normal (when there is no open portion), the AC signal supplied from the power supply unit 10 flows into the small impedance via R1 and the conductive pattern 2 in accordance with the above-described partial voltage ratio of the resistor. R4 (in Figure 7, the current is represented by i). However, when the conductive pattern has an open portion, most of the inspection signal flows into the amplifier 20 via R2.

In the substrate inspection apparatus of the present embodiment, the value of the voltage drop at the input resistor R3 is obtained by the current i' flowing into the amplifier 20, and it is judged whether or not the voltage is lower than the reference value, and it is used to determine whether or not the conductive pattern is unbroken. line.

When there is no open portion in the conductive patterns 2a to 2e of the comb-shaped conductive pattern 2 of the inspection object, as shown in FIG. 3(a), when the unit 5 is moved by a predetermined distance in the direction of the arrow, an alternating current signal is supplied to each of them. The conductive pattern under the position (positions III, V, VII, IX) is moved, and the current flows to R4 shown in FIG.

Fig. 3(b) shows the signal detection level of the sensor 13 in the normal case where there is no open portion in any of the conductive patterns. In Fig. 3(b), the horizontal axis represents the moving distance (μm) of the unit 5, and the vertical axis represents the voltage level (mVpp) detected by the sensor 13 (more specifically, detected by the sensor 13) The voltage value at the input impedance R3 of the amplifier 20).

The sensor 13 of the unit 5 detects the signal flowing in each conductive pattern via the capacitive coupling between the sensor 13 and the conductive pattern in the manner described above. When the conductive pattern is normal, since there is mostly no current flowing into R3, the detection level is very small. However, even if the level of the detection voltage becomes small, the level becomes maximum when the unit 5 is moved to the conductive pattern on the inspection object, and when the unit 5 is not on the conductive pattern, the voltage level is lowered, and this state is repeated.

That is, as shown in FIG. 3(a), when the unit 5 moves in the direction of the arrow and is located on the conductive pattern (corresponding to the positions I, III, V, VII, IX in the figure), as shown in FIG. 3(b) It is shown that the detection voltage level of the sensor 13 becomes the maximum. In addition, when the unit 5 is located between the adjacent conductive patterns (that is, there is no conductive pattern directly under it), the voltage level detected by the sensor 13 is lowered (corresponding to the positions II, IV, VI in the figure, VIII, X).

On the other hand, when the conductive pattern of the inspection object has an open portion, for example, the conductive pattern 2b shown in Fig. 4(a) has a position indicated by the reference numeral 41, and this will be described below. In this case, when the unit 5 is positioned on the conductive pattern 2a (position I), most of the alternating current signal from the power supply unit 12 flows into the small impedance R4 via the conductive pattern 2a (refer to FIG. 7). At this time, the detection voltage level of the sensor 13 becomes a level corresponding to the "position I" in Fig. 4(b).

However, when a portion of the unit 5 is located on the conductive pattern 2b of the open portion 41 (the unit position at this time is at the position III" as shown in Fig. 4(a)), the AC signal from the power supply portion 12 is open. The portion 41 is blocked, so it does not flow into R4.

In this case, as shown in FIG. 6, the AC signal i supplied from the power supply unit 12 is mostly via the power supply unit 12 → the power supply unit 12 - the coupling capacitance C1 between the conductive patterns 2 b → the conductive pattern 2 b → the conductive pattern 2 b - The path of the coupling capacitor C2 between the detectors 13 reaches the sensor 13. That is, when the conductive pattern of the inspection object has an open portion, most of the current (i') of the AC signal from the power supply portion 12 passes through the sensor 13 disposed close to the power supply portion 12, It flows into the input impedance R3 of the amplifier 20.

As a result, the sensor 13 detects the voltage level at the "position III" of the resistor R3 of the amplifier 20, as shown in FIG. 4(b), when it is in the normal state (the normal state in which the conductive pattern has no open portion). When comparing, it rises remarkably. For example, when the detection level in the normal state is 1, the detection level of the sensor 13 of the unit 5 of the substrate inspection apparatus according to the present embodiment is 7 to 8.

Then, the unit 5 continues to move in a predetermined direction. When reaching the conductive pattern 2c from the conductive pattern 2b (position V), the alternating current signal from the power supply portion 12 flows into the small impedance R4 because the pattern 2c is normal. Refer to Figure 7). Then, as shown in FIG. 4(a), any of the conductive patterns scanned by the unit 5 has no open portion. Therefore, as in the case shown in FIG. 3(b), the sensing is performed in accordance with the position of the unit 5. The detection voltage level of the device 13 is repeatedly increased and decreased to obtain such an inspection result (refer to FIG. 4(b)).

Further, in the above example, the configuration is such that one end of the conductive pattern of the inspection object is opened, and the base is short-circuited by the shorting bar, but is electrically conductive. The structure of the pattern is not limited to this. For example, as shown in FIG. 5, even if the pattern of the shorting bar is not provided, the conductive patterns 2a to 2e are sequentially scanned by the unit 5, and the same principle as described above can be used to determine whether the pattern is good. Especially in the case where the pattern length is long, the equivalent circuit can be regarded as the same as in the case of a shorting bar.

In addition, the arrangement of the conductive patterns of the inspection object on the substrate is not limited to the example in which only the pattern shown in FIG. 2 is disposed on the substrate, and the inspection pattern in which the plurality of groups are arranged in the vertical and horizontal directions on the same substrate can also be applied to the present invention. Inspection Method.

Further, in the substrate inspection apparatus of the present embodiment, the short-circuit state of the conductive pattern can be detected in the same manner as the determination of the open state of the conductive pattern described above. For example, when there is a short circuit between the adjacent conductive patterns, the detection signal is supplied from the supply circuit 12, and the detection signal flows into the inspection target substantially simultaneously through the capacitive coupling between the power supply portion and the conductive pattern. Both the conductive pattern and the conductive pattern short-circuited therewith. Therefore, the signal strength will differ when compared to the case without a short circuit. As a result, the voltage level sensed by the sensor 13 also changes.

Therefore, in the case where the conductive pattern is short-circuited, the current above the inspection current when there is no short-circuit normal flows instantaneously to the sensor 13 disposed close to the power supply portion 12. Therefore, the voltage detection level of the sensor 13 at this time rises. By measuring the voltage detection value at normal time (that is, how the continuous signal changes), in the inspection step, when it is detected differently When the voltage value (signal change), it can be determined that the conductive pattern has a short circuit state.

According to this manner, the degree of rise in the voltage detection level when the conductive pattern is short-circuited with the adjacent pattern is significantly different from the significant rise in the voltage level detected in the determination of the open state described above, because it is slightly different. The change, so it is easy to distinguish between the open state and the short circuit state of the conductive pattern.

In addition, when a part of the unit 5 is located on the conductive pattern of the open circuit portion, the voltage level rises remarkably, and the voltage level changes due to the difference between the strengths of the detection signals when there is a short circuit between the adjacent conductive patterns, such as As shown in FIG. 3(b) or FIG. 4(b), the voltage level of the unit 5 is increased when the conductive pattern of the object is inspected, and the voltage level is lowered when the unit 5 is not on the conductive pattern, for example, a software such as a differential circuit is used. By systematically removing the signal detection level from the sensor 13, the open state itself and the short-circuit state itself can be more easily detected, and the open state and the short-circuit state can be more easily distinguished.

Next, the inspection procedure and the like of the substrate inspecting apparatus of the embodiment will be described. Fig. 8 is a flow chart showing the inspection procedure of the substrate inspecting apparatus of the embodiment. In step S1 of Fig. 8, a glass substrate (inspection substrate) on which a conductive pattern to be inspected is formed on the surface is transported to a predetermined position of the substrate inspecting device in accordance with a conveyance path not shown. Then, in step S2, the inspection substrate is held and positioned by the substrate loading table 14 described above.

The substrate loading table 14 is constructed to perform three-dimensional position control using 4-axis control of XYZθ angle, and is positioned to cause the inspection target substrate to be separated from the sensing The position of the device at a certain distance becomes the position of the reference before the measurement. For example, the unit 5 is positioned at the central portion on the open end side of the leftmost conductive pattern 2a among the conductive patterns shown in FIG. 2.

After positioning to the measurement position of the inspection substrate in this manner, in step S3, for example, the control unit 15 controls the signal generation unit 10 to supply the high frequency signal (inspection signal) of 200 kHz described above to the power supply unit 12. In step S5, the signal processing unit 21 performs the above-described waveform processing, signal conversion processing, and the like, and then in step S6, the control unit 15 stores the processing results in the memory (RAM 17).

In step S7, it is determined whether all of the conductive patterns that are to be inspected have been processed. an examination. This determination is made based on, for example, checking whether the moving distance of the substrate matches the total of the widths of all the conductive patterns and the sum of the sum of the pattern intervals. Therefore, as a result of the determination in step S7, when the processing of all the conductive patterns is not completed, the control portion 15 controls in step S8 that the next conductive pattern to be inspected is located immediately below the unit 5. The driving unit 16 moves the inspection substrate by a predetermined distance (substantially controlled by the distance between the centers of the row-shaped conductive patterns in which the unit 5 is relatively moved in the direction of the arrow in FIG. 2).

Then, the control unit 15 returns the processing to step S5 and performs the same processing as the above. As a result, the above-described waveform processing or the like is continuously performed on the conductive pattern to be inspected, and the processing results corresponding to the respective patterns are sequentially stored in the RAM 17.

In this way, in the inspection step of FIG. 8, step S5 to step The step S8 is to maintain the state in which the inspection signal is supplied to the power supply unit (the state of step S3) while moving the inspection substrate (that is, the unit 5 sequentially scans on the conductive pattern of the inspection object). In addition, the movement of the inspection substrate can move the inspection substrate by a predetermined distance (step S8), and during the processing of the sensor output signal (step S5) and the storage processing result (step S6), the inspection substrate can be moved. The predetermined distance (step S8) simultaneously performs processing of the sensor output signal (step S5) and storage processing result (step S6), and continuously moves without stopping. In particular, when the inspection time is to be shortened, it is an effective method to check that the substrate is continuously moved without stopping in the steps from step S5 to step S8.

On the other hand, when all the conductive patterns to be inspected have been inspected, that is, when the total distance between the moving distance of the substrate and the total width of all the conductor patterns and the total of the pattern intervals are the same ( Step S7 is YES. In step S9, the processing result stored in the RAM 17 is analyzed, and based on the analysis result, it is determined whether or not the inspection object is good. In essence, the result obtained by processing the sensor output signal is compared with the reference value, and if it is equal to or greater than the reference value, it is determined that the conductive pattern is not in an open state.

In step S10, if it is determined that the detection signal levels of the respective conductive pattern positions are all within the predetermined range, all the conductive patterns are normal, and in step S12, the control unit 15 controls the display unit 25 to display information indicating that the inspection object is good.

According to this aspect, when the inspection object is a good product, the inspection substrate is lowered to the conveyance position, loaded on the conveyance path, and transported to the next loading station. In addition, in the case of performing continuous inspection, returning to step S1, The next substrate to be inspected is transported to a predetermined position of the substrate inspection device.

However, if the position of the detection signal of the position of the conductive pattern is not within the predetermined range, the conductive pattern is regarded as defective, and the control unit 15 controls the display unit 25 to display the object to be inspected as defective in step S13. information. Then, the inspection substrate is lowered to the conveyance position, loaded on the conveyance path, conveyed to the next loading station, or processed to remove the defective substrate from the conveyance path.

As described above, when the conductive pattern provided in the row shape on the substrate is inspected in a non-contact manner, the sensor is configured to be close to each other via the power supply unit that supplies the inspection signal and the sensor. The detector is located on the normal conductive pattern without the open circuit state, and when the sensor is located on the conductive pattern with the open circuit portion, the detection level of the test current detected by the sensor will be significantly different, so The detection accuracy of the open state of the conductive pattern can be exceptionally improved.

That is, when the conductive pattern has an open portion, the AC signal from the power supply portion does not flow into other conductive patterns, so most of the signals flow into the configured via the coupling capacitance between the conductive pattern and the sensor. Approaching the sensor of the power supply unit. As a result, the detection voltage level of the sensor is significantly increased when it is compared with the normal case where the conductive pattern has no open portion, so that the discrimination of the open state becomes easy.

In addition, when the conductive pattern is shorted to other adjacent conductive patterns, the voltage detection level of the sensor rises slightly, and the degree of change and the guide Significant voltage level rises detected when the electrical pattern has an open state are significantly different. Therefore, by using a single unit in which the power supply unit and the sensor are built, both the open state and the short-circuit state of the conductive pattern can be discriminated, so that the inspection efficiency can be improved when compared with the case of the prior art for checking the open/short circuit. The inspection time can be greatly reduced. In addition, the substrate inspection program (check logic) can also be simplified.

Further, since the power supply portion and the sensor are disposed close to each other in the same unit, the unit can be miniaturized, and the manufacturing cost of the substrate inspection device can be reduced. In addition, since the configuration in which the power supply portion and the sensor are respectively at one end of the pattern and the other end portion is not required in the prior art, one type of inspection unit can be disposed in a liquid crystal display panel or a touch panel or the like. It is an advantage to check whether the pattern of all lengths is good.

(industrial availability)

According to the present invention, it is possible to easily detect an open state or the like of a conductive pattern on a substrate to be inspected with good precision.

Further, according to the present invention, the detection unit can be downsized, and the manufacturing cost of the substrate inspection apparatus can be reduced.

1‧‧‧Check objects

2, 2a~2e‧‧‧ conductive pattern

3‧‧‧ glass substrate

5‧‧‧ unit

10‧‧‧Power Supply Department

12‧‧‧Power Supply Department

13‧‧‧ sensor

14‧‧‧Loading station

15‧‧‧Control Department

16‧‧‧ Drive Department

17‧‧‧RAM

18‧‧‧ROM

20‧‧‧Amplifier

21‧‧‧Signal Processing Department

25‧‧‧Display Department

41‧‧‧Opening site

101‧‧‧Power Supply Department

103‧‧‧Open circuit detection sensor

104‧‧‧Short bar

110‧‧‧Disconnection

12‧‧‧ conductive pattern

121‧‧‧ conductive pattern

R1~R4‧‧‧ resistor

Fig. 1 is a block diagram showing the entire structure of a substrate inspecting apparatus according to an embodiment of the present invention.

Fig. 2 is a plan view showing the positional relationship between the unit in which the power supply portion and the sensor are housed, and the inspection object.

Fig. 3 (a) and (b) show an example of the measurement results of the inspection signals flowing in the cell and the conductive pattern in the normal conductive pattern.

4(a) and 4(b) show an example of the measurement result of the inspection signal flowing in the cell and the conductive pattern when the conductive pattern has an open portion.

Figure 5 is a plan view showing the positional relationship between the unit and the inspection object in the conductive pattern without the shorting bar.

Fig. 6 shows a path for inspecting an AC signal supplied from a power supply unit in the case where the conductive pattern has an open portion.

Fig. 7 is a circuit diagram for schematically showing the flow of an inspection signal of the substrate inspecting apparatus of the embodiment.

Fig. 8 is a flow chart showing the inspection procedure of the substrate inspecting apparatus of the embodiment.

Fig. 9 is a view showing an arrangement example of a power supply unit and a signal detecting sensor of an inspection signal of the circuit pattern inspection device of the prior art.

Fig. 10 is a view showing the detection level of the signal current detected by the open-circuit detecting sensor corresponding to the presence or absence of the disconnection of the conductive pattern in the circuit pattern inspection device of the prior art.

1‧‧‧Check objects

2‧‧‧ conductive pattern

3‧‧‧ glass substrate

5‧‧‧ unit

10‧‧‧Power Supply Department

12‧‧‧Power Supply Department

13‧‧‧ sensor

14‧‧‧Loading station

15‧‧‧Control Department

16‧‧‧ Drive Department

17‧‧‧RAM

18‧‧‧ROM

20‧‧‧Amplifier

21‧‧‧Signal Processing Department

25‧‧‧Display Department

Claims (5)

A circuit pattern inspection device characterized by comprising: a unit for separating a plurality of conductive patterns extending in a line shape formed on a substrate to be inspected by being separated from the same conductive pattern in a non-contact state a signal supply unit that capacitively couples an inspection signal composed of an alternating current signal to the conductive pattern; a signal detecting unit that detects the applied inspection signal from the conductive pattern; and an amplifier that amplifies the detection signal; The signal detecting unit is disposed at a position close to the signal supply unit at an interval at which the inspection signal output from the signal supply unit does not directly enter, and the amplifier is disposed in close proximity to the signal. The moving unit stores the unit to be inspected in a non-contact state with respect to the extending direction of the conductive pattern in a direction intersecting the extending direction of the conductive pattern, and sequentially moves the inspection target substrate; a portion detected by the detecting unit that moves as described above Now the detection signal amplified with the predetermined reference value, whether the break through the electrically conductive pattern of the detection signal is above the reference value, is identified. The circuit pattern inspection device according to claim 1, wherein the conductive pattern has one end portion side formed to be connected to one of the comb teeth; and the unit is moved to the other side by the moving portion. Applying the above-mentioned inspection signal to the vicinity of the front end portion of the open end side of the pattern Detection of detection signals. The circuit pattern inspection device according to claim 1, wherein in the unit, the signal detecting unit is disposed at an interval of 10 mm apart from an approach position where the inspection signal from the signal supply unit is not directly received. on. A circuit pattern inspection method comprising the steps of: linearly extending a plurality of conductive lines arranged in a line on a surface of a substrate to be inspected in a non-contact state with a signal supply unit housed in one unit; The patterns are moved apart and intersected, and when passing over the conductive patterns, the signal supply portion is capacitively coupled to one of the conductive patterns in a non-contact manner, and an inspection signal composed of an alternating current signal is applied to the conductive signals. The signal detecting unit is disposed in the unit so as to be received in the unit so as not to directly receive the interval between the inspection signals outputted by the signal supply unit and close to the signal supply unit. Non-contact capacitive coupling detects the detection signal on the conductive pattern to which the inspection signal is applied, and amplifies the detected detection signal by an amplifier disposed in the unit adjacent to the signal detecting portion And outputting; and the above detection signals and pre-outputs to be output by the above unit Setting the reference value, according to whether or not the detection signal is greater than the reference value for, the electrically conductive pattern to identify the presence of the break. The circuit pattern inspection method according to claim 4, wherein the conductive pattern has one end portion side formed to be connected to one of the comb teeth; and the unit unit is moved to the open end side of the other conductive pattern. The application of the above-described inspection signal and the detection of the detection signal are performed in the vicinity of the front end portion.