TW201316425A - 晶圓劈裂檢知方法 - Google Patents

晶圓劈裂檢知方法 Download PDF

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Publication number
TW201316425A
TW201316425A TW100136855A TW100136855A TW201316425A TW 201316425 A TW201316425 A TW 201316425A TW 100136855 A TW100136855 A TW 100136855A TW 100136855 A TW100136855 A TW 100136855A TW 201316425 A TW201316425 A TW 201316425A
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TW
Taiwan
Prior art keywords
wafer
splitting
image
computer
cleavage
Prior art date
Application number
TW100136855A
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English (en)
Chinese (zh)
Other versions
TWI447829B (enExample
Inventor
Zhen-Chang Zhang
You-Cheng Zhao
Original Assignee
Horng Terng Automation Co Ltd
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Priority to TW100136855A priority Critical patent/TW201316425A/zh
Priority to CN201210196421.7A priority patent/CN103050422B/zh
Publication of TW201316425A publication Critical patent/TW201316425A/zh
Application granted granted Critical
Publication of TWI447829B publication Critical patent/TWI447829B/zh

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW100136855A 2011-10-12 2011-10-12 晶圓劈裂檢知方法 TW201316425A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100136855A TW201316425A (zh) 2011-10-12 2011-10-12 晶圓劈裂檢知方法
CN201210196421.7A CN103050422B (zh) 2011-10-12 2012-06-14 晶圆劈裂检知方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100136855A TW201316425A (zh) 2011-10-12 2011-10-12 晶圓劈裂檢知方法

Publications (2)

Publication Number Publication Date
TW201316425A true TW201316425A (zh) 2013-04-16
TWI447829B TWI447829B (enExample) 2014-08-01

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TW100136855A TW201316425A (zh) 2011-10-12 2011-10-12 晶圓劈裂檢知方法

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CN (1) CN103050422B (enExample)
TW (1) TW201316425A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI727860B (zh) * 2020-07-22 2021-05-11 環球晶圓股份有限公司 晶圓橫向撞擊測試裝置及晶圓強度測試方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104332421B (zh) * 2014-09-01 2017-05-03 上海华力微电子有限公司 一种检测扫描机台的性能方法
CN105047576A (zh) * 2015-07-09 2015-11-11 深圳市华腾半导体设备有限公司 图像检测芯片未断方法
CN109425315B (zh) * 2017-08-31 2021-01-15 长鑫存储技术有限公司 半导体结构的测试载具及测试方法
CN112446887B (zh) * 2019-09-05 2022-04-08 长鑫存储技术有限公司 晶圆切割晶片数计算方法及计算设备
CN120300072B (zh) * 2025-06-11 2025-09-05 深圳平湖实验室 一种晶圆的加工方法、晶圆加工设备及晶粒

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IL120656A (en) * 1997-04-13 2001-04-30 Inspectech Ltd Apparatus for analyzing cuts
TW490351B (en) * 2000-10-03 2002-06-11 Chuan-Huei Tsai Laser cutting system of controlled fracture and the method of optimizing the laser path
GB0115259D0 (en) * 2001-06-21 2001-08-15 Esm Ltd Method of monitoring and controlling a photoresist edge bead
JP2003168655A (ja) * 2001-12-03 2003-06-13 Tokyo Seimitsu Co Ltd ダイシング装置
CN100407215C (zh) * 2002-09-30 2008-07-30 东京毅力科创株式会社 用于监视和控制半导体生产过程的方法和装置
JP2005028423A (ja) * 2003-07-09 2005-02-03 Disco Abrasive Syst Ltd レーザー加工方法およびレーザー加工装置
US20050148203A1 (en) * 2003-12-29 2005-07-07 Shirley Paul D. Method, apparatus, system and computer-readable medium for in situ photoresist thickness characterization
US7098077B2 (en) * 2004-01-20 2006-08-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor chip singulation method
JP4455469B2 (ja) * 2004-09-14 2010-04-21 エーエスエムエル マスクツールズ ビー．ブイ． フルチップ製造信頼性チェックおよび補正を行うための方法
US7262115B2 (en) * 2005-08-26 2007-08-28 Dynatex International Method and apparatus for breaking semiconductor wafers
TWM322058U (en) * 2007-04-27 2007-11-11 Uni Via Technology Inc All lighting device for LED wafer cutting process
TW200931553A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Image-capturing device of the optical detection equipment for cleaving wafer
TW200931510A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Wafer cleaver with high-precision cutting
TW200931552A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Optical detection method of cleaving wafer
CN101685271B (zh) * 2008-09-23 2012-01-11 和舰科技(苏州)有限公司 一种晶圆片晶边清洗宽度的检测方法
TWM377691U (en) * 2009-10-09 2010-04-01 Horng Terng Automation Co Ltd Wafer cleavage detection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI727860B (zh) * 2020-07-22 2021-05-11 環球晶圓股份有限公司 晶圓橫向撞擊測試裝置及晶圓強度測試方法

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Publication number Publication date
CN103050422B (zh) 2015-03-04
TWI447829B (enExample) 2014-08-01
CN103050422A (zh) 2013-04-17

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