TWI447829B - - Google Patents

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Publication number
TWI447829B
TWI447829B TW100136855A TW100136855A TWI447829B TW I447829 B TWI447829 B TW I447829B TW 100136855 A TW100136855 A TW 100136855A TW 100136855 A TW100136855 A TW 100136855A TW I447829 B TWI447829 B TW I447829B
Authority
TW
Taiwan
Application number
TW100136855A
Other languages
Chinese (zh)
Other versions
TW201316425A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100136855A priority Critical patent/TW201316425A/zh
Priority to CN201210196421.7A priority patent/CN103050422B/zh
Publication of TW201316425A publication Critical patent/TW201316425A/zh
Application granted granted Critical
Publication of TWI447829B publication Critical patent/TWI447829B/zh

Links

TW100136855A 2011-10-12 2011-10-12 晶圓劈裂檢知方法 TW201316425A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100136855A TW201316425A (zh) 2011-10-12 2011-10-12 晶圓劈裂檢知方法
CN201210196421.7A CN103050422B (zh) 2011-10-12 2012-06-14 晶圆劈裂检知方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100136855A TW201316425A (zh) 2011-10-12 2011-10-12 晶圓劈裂檢知方法

Publications (2)

Publication Number Publication Date
TW201316425A TW201316425A (zh) 2013-04-16
TWI447829B true TWI447829B (enExample) 2014-08-01

Family

ID=48063021

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100136855A TW201316425A (zh) 2011-10-12 2011-10-12 晶圓劈裂檢知方法

Country Status (2)

Country Link
CN (1) CN103050422B (enExample)
TW (1) TW201316425A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104332421B (zh) * 2014-09-01 2017-05-03 上海华力微电子有限公司 一种检测扫描机台的性能方法
CN105047576A (zh) * 2015-07-09 2015-11-11 深圳市华腾半导体设备有限公司 图像检测芯片未断方法
CN109425315B (zh) * 2017-08-31 2021-01-15 长鑫存储技术有限公司 半导体结构的测试载具及测试方法
CN112446887B (zh) * 2019-09-05 2022-04-08 长鑫存储技术有限公司 晶圆切割晶片数计算方法及计算设备
TWI727860B (zh) * 2020-07-22 2021-05-11 環球晶圓股份有限公司 晶圓橫向撞擊測試裝置及晶圓強度測試方法
CN120300072B (zh) * 2025-06-11 2025-09-05 深圳平湖实验室 一种晶圆的加工方法、晶圆加工设备及晶粒

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6192289B1 (en) * 1997-04-13 2001-02-20 Inspectech Ltd. Method and apparatus for analyzing cuts
TW490351B (en) * 2000-10-03 2002-06-11 Chuan-Huei Tsai Laser cutting system of controlled fracture and the method of optimizing the laser path
TW200415453A (en) * 2002-09-30 2004-08-16 Tokyo Electron Ltd Method and apparatus for the monitoring and control of a semiconductor manufacturing process
US20050158967A1 (en) * 2004-01-20 2005-07-21 Taiwan Semiconductor Manufacturing Co. Semiconductor chip singulation method
TW200622509A (en) * 2004-09-14 2006-07-01 Asml Masktools Bv A method for performing full-chip manufacturing reliability checking and correction
TW200741973A (en) * 2005-08-26 2007-11-01 Dynatex Internat Method and apparatus for breaking semiconductor wafers
TWM322058U (en) * 2007-04-27 2007-11-11 Uni Via Technology Inc All lighting device for LED wafer cutting process
TW200931553A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Image-capturing device of the optical detection equipment for cleaving wafer
TW200931552A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Optical detection method of cleaving wafer
TWM377691U (en) * 2009-10-09 2010-04-01 Horng Terng Automation Co Ltd Wafer cleavage detection device
TWI349305B (enExample) * 2008-01-11 2011-09-21

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0115259D0 (en) * 2001-06-21 2001-08-15 Esm Ltd Method of monitoring and controlling a photoresist edge bead
JP2003168655A (ja) * 2001-12-03 2003-06-13 Tokyo Seimitsu Co Ltd ダイシング装置
JP2005028423A (ja) * 2003-07-09 2005-02-03 Disco Abrasive Syst Ltd レーザー加工方法およびレーザー加工装置
US20050148203A1 (en) * 2003-12-29 2005-07-07 Shirley Paul D. Method, apparatus, system and computer-readable medium for in situ photoresist thickness characterization
CN101685271B (zh) * 2008-09-23 2012-01-11 和舰科技(苏州)有限公司 一种晶圆片晶边清洗宽度的检测方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6192289B1 (en) * 1997-04-13 2001-02-20 Inspectech Ltd. Method and apparatus for analyzing cuts
TW490351B (en) * 2000-10-03 2002-06-11 Chuan-Huei Tsai Laser cutting system of controlled fracture and the method of optimizing the laser path
TW200415453A (en) * 2002-09-30 2004-08-16 Tokyo Electron Ltd Method and apparatus for the monitoring and control of a semiconductor manufacturing process
US20050158967A1 (en) * 2004-01-20 2005-07-21 Taiwan Semiconductor Manufacturing Co. Semiconductor chip singulation method
TW200622509A (en) * 2004-09-14 2006-07-01 Asml Masktools Bv A method for performing full-chip manufacturing reliability checking and correction
TW200741973A (en) * 2005-08-26 2007-11-01 Dynatex Internat Method and apparatus for breaking semiconductor wafers
TWM322058U (en) * 2007-04-27 2007-11-11 Uni Via Technology Inc All lighting device for LED wafer cutting process
TW200931553A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Image-capturing device of the optical detection equipment for cleaving wafer
TW200931552A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Optical detection method of cleaving wafer
TWI349305B (enExample) * 2008-01-11 2011-09-21
TWM377691U (en) * 2009-10-09 2010-04-01 Horng Terng Automation Co Ltd Wafer cleavage detection device

Also Published As

Publication number Publication date
CN103050422B (zh) 2015-03-04
TW201316425A (zh) 2013-04-16
CN103050422A (zh) 2013-04-17

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees