CN103050422B - 晶圆劈裂检知方法 - Google Patents

晶圆劈裂检知方法 Download PDF

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Publication number
CN103050422B
CN103050422B CN201210196421.7A CN201210196421A CN103050422B CN 103050422 B CN103050422 B CN 103050422B CN 201210196421 A CN201210196421 A CN 201210196421A CN 103050422 B CN103050422 B CN 103050422B
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China
Prior art keywords
wafer
splitting
image
split
computer
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Expired - Fee Related
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CN201210196421.7A
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English (en)
Chinese (zh)
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CN103050422A (zh
Inventor
张振昌
赵祐成
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Horng Terng Automation Co Ltd
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Horng Terng Automation Co Ltd
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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN201210196421.7A 2011-10-12 2012-06-14 晶圆劈裂检知方法 Expired - Fee Related CN103050422B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100136855A TW201316425A (zh) 2011-10-12 2011-10-12 晶圓劈裂檢知方法
TW100136855 2011-10-12

Publications (2)

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CN103050422A CN103050422A (zh) 2013-04-17
CN103050422B true CN103050422B (zh) 2015-03-04

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CN201210196421.7A Expired - Fee Related CN103050422B (zh) 2011-10-12 2012-06-14 晶圆劈裂检知方法

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CN (1) CN103050422B (enExample)
TW (1) TW201316425A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104332421B (zh) * 2014-09-01 2017-05-03 上海华力微电子有限公司 一种检测扫描机台的性能方法
CN105047576A (zh) * 2015-07-09 2015-11-11 深圳市华腾半导体设备有限公司 图像检测芯片未断方法
CN109425315B (zh) * 2017-08-31 2021-01-15 长鑫存储技术有限公司 半导体结构的测试载具及测试方法
CN112446887B (zh) * 2019-09-05 2022-04-08 长鑫存储技术有限公司 晶圆切割晶片数计算方法及计算设备
TWI727860B (zh) * 2020-07-22 2021-05-11 環球晶圓股份有限公司 晶圓橫向撞擊測試裝置及晶圓強度測試方法
CN120300072B (zh) * 2025-06-11 2025-09-05 深圳平湖实验室 一种晶圆的加工方法、晶圆加工设备及晶粒

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2003168655A (ja) * 2001-12-03 2003-06-13 Tokyo Seimitsu Co Ltd ダイシング装置
CN1575908A (zh) * 2003-07-09 2005-02-09 株式会社迪斯科 激光束处理方法和激光束处理装置
CN101685271A (zh) * 2008-09-23 2010-03-31 和舰科技(苏州)有限公司 一种晶圆片晶边清洗宽度的检测方法

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IL120656A (en) * 1997-04-13 2001-04-30 Inspectech Ltd Apparatus for analyzing cuts
TW490351B (en) * 2000-10-03 2002-06-11 Chuan-Huei Tsai Laser cutting system of controlled fracture and the method of optimizing the laser path
GB0115259D0 (en) * 2001-06-21 2001-08-15 Esm Ltd Method of monitoring and controlling a photoresist edge bead
CN100407215C (zh) * 2002-09-30 2008-07-30 东京毅力科创株式会社 用于监视和控制半导体生产过程的方法和装置
US20050148203A1 (en) * 2003-12-29 2005-07-07 Shirley Paul D. Method, apparatus, system and computer-readable medium for in situ photoresist thickness characterization
US7098077B2 (en) * 2004-01-20 2006-08-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor chip singulation method
JP4455469B2 (ja) * 2004-09-14 2010-04-21 エーエスエムエル マスクツールズ ビー．ブイ． フルチップ製造信頼性チェックおよび補正を行うための方法
US7262115B2 (en) * 2005-08-26 2007-08-28 Dynatex International Method and apparatus for breaking semiconductor wafers
TWM322058U (en) * 2007-04-27 2007-11-11 Uni Via Technology Inc All lighting device for LED wafer cutting process
TW200931553A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Image-capturing device of the optical detection equipment for cleaving wafer
TW200931510A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Wafer cleaver with high-precision cutting
TW200931552A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Optical detection method of cleaving wafer
TWM377691U (en) * 2009-10-09 2010-04-01 Horng Terng Automation Co Ltd Wafer cleavage detection device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168655A (ja) * 2001-12-03 2003-06-13 Tokyo Seimitsu Co Ltd ダイシング装置
CN1575908A (zh) * 2003-07-09 2005-02-09 株式会社迪斯科 激光束处理方法和激光束处理装置
CN101685271A (zh) * 2008-09-23 2010-03-31 和舰科技(苏州)有限公司 一种晶圆片晶边清洗宽度的检测方法

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TWI447829B (enExample) 2014-08-01
TW201316425A (zh) 2013-04-16
CN103050422A (zh) 2013-04-17

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